KR930000293Y1 - Apparatus for cleaning low pressure vacuum evaporator - Google Patents
Apparatus for cleaning low pressure vacuum evaporator Download PDFInfo
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- KR930000293Y1 KR930000293Y1 KR2019900020216U KR900020216U KR930000293Y1 KR 930000293 Y1 KR930000293 Y1 KR 930000293Y1 KR 2019900020216 U KR2019900020216 U KR 2019900020216U KR 900020216 U KR900020216 U KR 900020216U KR 930000293 Y1 KR930000293 Y1 KR 930000293Y1
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- valve
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- gas supply
- mfc
- deposition
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Abstract
내용 없음.No content.
Description
제1도는 종래 개스 공급장치의 계통도.1 is a system diagram of a conventional gas supply device.
제2도는 본 고안에 의한 저압 증착로 세정장치의 계통도.2 is a schematic diagram of a cleaning apparatus with low pressure deposition according to the present invention.
본 고안은 폴리실리콘 저압 증착로 세정장치에 관한 것으로, 특히 개스 공급조절기(MFC)및 개스공급로를 자동 N2퍼지(Purge)함에 적당하도록 한 저압 증착로 세정장치에 관한 것이다.The present invention relates to a polysilicon low pressure deposition cleaning apparatus, and more particularly, to a low pressure deposition cleaning apparatus suitable for automatic N 2 purge of a gas supply regulator (MFC) and a gas supply passage.
종래에는 제1도에 도시한 바와 같이, 개스공급조절기(MFC)를 N2퍼지하기 위하여 수동으로 메터링 밸브(Metering Valve)를 닫은 후 밸브(V11, 1,4)를 열어 공급로에 잔존하는 싸이렌(SiN4)개스를 증착로를 통해 진공화한 후 N2퍼지밸브를 수동으로 열 때 N2가 공급되어 증착로를 통해서 배기되도록 구성되어 있다.Conventionally, as shown in FIG. 1, in order to purge the gas feed regulator (MFC) N 2 , the metering valve is manually closed and the valves V11, 1, 4 are opened to remain in the supply passage. After the siren (SiN 4 ) gas is evacuated through the deposition furnace, N 2 is supplied and exhausted through the deposition furnace when the N 2 purge valve is manually opened.
이와 같은 종래 기술의 작동관계를 보면, 먼저 메터링밸브를 수동으로 닫은 후, 프로그램(Recipe)구성에 의하여 밸브V1, V4를 열고, 몇초 후 밸브V11를 열어 증착로 진공이 Om Torr될 때까지 기다린 후 N2퍼지밸브를 수동으로 열어 N2를 공급한다.According to the related art operating relationship, first, the metering valve is manually closed, and then the valves V 1 and V 4 are opened by the program configuration, and after a few seconds, the valve V 11 is opened to allow the vacuum to be Om Torr. Wait until the N 2 purge valve is manually opened to supply N 2 .
N2퍼지가 끝나면 N2퍼지밸브를 수동으로 닫은 후 프로그램구성에 의하여 증착로의 진공이 Om Torr로 될 때까지 기다린 후 V11를 닫은 후 메터링밸브를 수동으로 연다.After the N 2 purge is completed, manually close the N 2 purge valve, wait for the vacuum to deposition to Om Torr by the program configuration, close V 11 and open the metering valve manually.
그러나 이러한 종래의 장치에서는 개스공급조절기(MFC) N2퍼지할때 자동으로 할 수 있도록 프로그램을 구성할 수 없으며, 수동으로 하고 있기 때문에 퍼지 N2가 증착로를 통해서 배기되면서 증착로가 퍼지 N2에 함유된 오염물질에 의하여 오염된다.However, in such a conventional apparatus, the program cannot be configured to automatically perform when the gas supply regulator (MFC) N 2 is purged, and since the purge N 2 is exhausted through the deposition furnace, the deposition furnace is purged with N 2. It is contaminated by contaminants contained in.
또한 한번 공정을 진행한 후 매번 실시할 수 없기 때문에 개스공급조절기(MFC)의 공급량을 측정하는 센서(Senser)가 오염되어 공정에 필요로 하는 양만큼 개스가 공급되지 못하여 공정상 많은 문제점이 있었다.In addition, since the process can not be performed every time after the process once, the sensor (Senser) for measuring the supply amount of the gas supply regulator (MFC) is contaminated, there was a lot of problems in the process because the gas is not supplied as required for the process.
본 고안은 상술한 종래의 문제점을 해결하기 위하여 안출된 것으로, 완전 자동으로 개스공급조절기를 N2퍼지 할 수 있도록 한 것이다.The present invention has been made to solve the above-described problems, it is to be able to purge the gas feed regulator N 2 completely automatically.
이하 본 고안에 의한 저압 증착로 세정장치를 첨부도면에 도시한 실시예에 따라서 상세히 설명한다.Hereinafter, a low pressure deposition according to the present invention will be described in detail according to the embodiment shown in the accompanying drawings.
제2도는 본 고안에 의한 저압 증착로 세정장치의 계통도로서, N2개스가 주입되는 밸브(V11)에 연결되는 밸브(V3)는 가스공급조절기(MFC)에 연결되고, 상기 개스공급조절기(MFC)는 증착로 주입밸브(V1)와 배기밸브(V2)에 연결되며, 상기 증착로 주입밸브(V1)는 증착로에 연결되고, 상기 증착로와 배기밸브(V2)는 배기구에 연결되어 있다.2 is a schematic diagram of a cleaning apparatus with low pressure deposition according to the present invention, wherein a valve V 3 connected to a valve V 11 into which N 2 gas is injected is connected to a gas supply regulator (MFC), and the gas supply regulator (MFC) is connected to the inlet valve (V 1 ) and the exhaust valve (V 2 ) by the deposition, the inlet valve (V 1 ) is connected to the deposition furnace, the deposition furnace and the exhaust valve (V 2 ) It is connected to the exhaust port.
상기 주입밸브(V3)에서 증착로까지의 연결관로가 양방향으로 형성되어 양방향으로 연결된다.Connection pipes from the injection valve (V 3 ) to the deposition furnace are formed in both directions and are connected in both directions.
상기 밸브(V1, V2, V3)로서는 압축밸브가 사용된다.Compression valves are used as the valves V 1 , V 2 , V 3 .
상기 개스공급조절기(MFC)의 양단에는 바이패스밸브가 연결된다.Bypass valves are connected to both ends of the gas supply regulator (MFC).
상기 밸브(V3)는 공정을 진행하지 않을 때 항상 개스공급조절기(MFC)를 N2퍼지할 수 있도록 하는 것이다.The valve (V 3 ) is to always purge the gas feed regulator (MFC) N 2 when the process is not in progress.
퍼지 N2가 증착로를 통하지 않고 직접 배기될 수 있도록 개스공급조절기(MFC)와 증착로사이에 자동으로 동작되는 밸브(V2, V5)가 설치되어 프로그램에 의하여 밸브가 동작될 수 있도록 되어 있다.A valve (V 2 , V 5 ) operated automatically between the gas supply controller (MFC) and the deposition furnace is installed so that the purge N 2 can be directly exhausted without passing through the deposition furnace so that the valve can be operated by a program. have.
이하 본 고안에 의한 저압 증착로 세정장치의 동작을 설명한다.Hereinafter, the operation of the cleaning apparatus by low pressure deposition according to the present invention.
먼저 프로그램 구성에 의하여 웨이퍼에 필름 증착이 끝난 후 개스공급조절기(MFC)를 N2퍼지하기 위하여 밸브(V11)를 닫고, 일정시간(잔존개스배기시간)이 경과한 후 밸브(V1, V4)를 닫고, 일정 시간 경과한 후 밸브(V3)를 열고 일정 시간 후 밸브(V2, V5)를 열어 퍼지 N2가 증착로를 거치지 않고 직접 배기도록 하여 1차 퍼지 공정을 완료한다.First, after the film is deposited on the wafer by the program configuration, the valve V 11 is closed to purge the gas feed regulator (MFC) N 2 , and after the predetermined time (remaining gas exhaust time) elapses, the valve V 1 , V 4 ) Close the valve, open the valve (V 3 ) after a certain period of time, and open the valve (V 2 , V 5 ) after a period of time to complete the first purge process by allowing the purge N 2 to exhaust directly without passing through the deposition furnace. .
다음 밸브(V2, V5)를 닫고 밸브(V1, V4)를 열어 2차 퍼지공정을 거친다.Then close the valves (V 2 , V 5 ) and open the valves (V 1 , V 4 ) for a second purge process.
이상과 같이 본 고안에 의하여 개스공급조절기를 N2퍼지하는 공정을 자동을 조절가능하게 하였으므로 공정을 진행하지 않을 때 개스공급조절기가 개스 공급로를 항상 N2퍼지시켜 개스량 측정센서의 오염도를 없애 항상 일정한 양의 개스를 공급할 수 있도록 센서의 정확도를 향상시켜 공정의 안정을 기할 수 있으며. 개스공급조절기의 수명 연장 및 보수 기간을 연장(6개월에서 1년으로)시킬 수 있고, 또한 개스공급로의 오염도를 없애 미립자의 발생을 줄임으로써 제품 수율을 향상시킬 수 있는 것이다.As described above, the process of purging the gas supply regulator N 2 can be automatically controlled. Thus, when the process is not in progress, the gas supply controller always purges the gas supply path N 2 to eliminate the contamination of the gas quantity measuring sensor. Improve the accuracy of the sensor so that you can always supply a certain amount of gas, you can stabilize the process. It is possible to extend the life span and maintenance period of the gas supply regulator (from 6 months to 1 year) and to improve the product yield by reducing the generation of particulates by eliminating contamination of the gas supply passage.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019900020216U KR930000293Y1 (en) | 1990-12-19 | 1990-12-19 | Apparatus for cleaning low pressure vacuum evaporator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019900020216U KR930000293Y1 (en) | 1990-12-19 | 1990-12-19 | Apparatus for cleaning low pressure vacuum evaporator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR930000293Y1 true KR930000293Y1 (en) | 1993-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019900020216U KR930000293Y1 (en) | 1990-12-19 | 1990-12-19 | Apparatus for cleaning low pressure vacuum evaporator |
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|---|---|
| KR (1) | KR930000293Y1 (en) |
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1990
- 1990-12-19 KR KR2019900020216U patent/KR930000293Y1/en not_active IP Right Cessation
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