KR920018119A - 높은 종횡비를 갖는 마이크로 성형물의 제조방법 - Google Patents
높은 종횡비를 갖는 마이크로 성형물의 제조방법 Download PDFInfo
- Publication number
- KR920018119A KR920018119A KR1019920003830A KR920003830A KR920018119A KR 920018119 A KR920018119 A KR 920018119A KR 1019920003830 A KR1019920003830 A KR 1019920003830A KR 920003830 A KR920003830 A KR 920003830A KR 920018119 A KR920018119 A KR 920018119A
- Authority
- KR
- South Korea
- Prior art keywords
- polymer
- copolyoxymethylene
- aspect ratio
- radiation
- high aspect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 238000001053 micromoulding Methods 0.000 title claims 2
- 238000000034 method Methods 0.000 claims 4
- 229920000642 polymer Polymers 0.000 claims 4
- 230000005855 radiation Effects 0.000 claims 3
- 229930040373 Paraformaldehyde Natural products 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 238000003384 imaging method Methods 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 150000007522 mineralic acids Chemical class 0.000 claims 1
- -1 polyoxymethylene Polymers 0.000 claims 1
- 229920006324 polyoxymethylene Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000005469 synchrotron radiation Effects 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
- G03F7/2039—X-ray radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0844—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using X-ray
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
- B29C2035/0877—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2059/00—Use of polyacetals, e.g. POM, i.e. polyoxymethylene or derivatives thereof, as moulding material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/167—X-ray
- Y10S430/168—X-ray exposure process
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Physics & Mathematics (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Micromachines (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP4107851.9 | 1991-03-12 | ||
| DE4107851A DE4107851A1 (de) | 1991-03-12 | 1991-03-12 | Verfahren zur herstellung von mikroformkoerpern mit hohem aspektverhaeltnis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR920018119A true KR920018119A (ko) | 1992-10-21 |
Family
ID=6427031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920003830A Withdrawn KR920018119A (ko) | 1991-03-12 | 1992-03-09 | 높은 종횡비를 갖는 마이크로 성형물의 제조방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5415977A (enExample) |
| EP (1) | EP0503377A1 (enExample) |
| JP (1) | JPH05148369A (enExample) |
| KR (1) | KR920018119A (enExample) |
| DE (1) | DE4107851A1 (enExample) |
| TW (1) | TW241343B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4223888A1 (de) * | 1992-07-21 | 1994-01-27 | Basf Ag | Verfahren zur Herstellung von Mikrostrukturkörpern |
| DE4229244A1 (de) * | 1992-09-02 | 1994-03-03 | Basf Ag | Verfahren zur Herstellung von Mikrostrukturkörpern |
| DE4307869C2 (de) * | 1993-03-12 | 1996-04-04 | Microparts Gmbh | Mikrostrukturkörper und Verfahren zu deren Herstellung |
| DE4329728A1 (de) * | 1993-09-03 | 1995-03-09 | Microparts Gmbh | Düsenplatte für Fluidstrahl-Druckkopf und Verfahren zu deren Herstellung |
| US5730924A (en) * | 1994-12-28 | 1998-03-24 | Sumitomo Heavy Industries, Ltd. | Micromachining of polytetrafluoroethylene using radiation |
| DE19741492A1 (de) | 1997-09-19 | 1999-03-25 | Microparts Gmbh | Verfahren zur Herstellung von Mikrostrukturkörpern |
| DE19815130A1 (de) * | 1998-04-03 | 1999-10-14 | Bosch Gmbh Robert | Herstellung eines metallischen Stempels zur Definition von Nanostrukturen |
| US20030186405A1 (en) * | 2002-04-01 | 2003-10-02 | The Ohio State University Research Foundation | Micro/nano-embossing process and useful applications thereof |
| JP4296062B2 (ja) * | 2002-08-30 | 2009-07-15 | 服部 正 | パターン成形用型の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2892712A (en) * | 1954-04-23 | 1959-06-30 | Du Pont | Process for preparing relief images |
| US3549733A (en) * | 1968-12-04 | 1970-12-22 | Du Pont | Method of producing polymeric printing plates |
| US3991033A (en) * | 1975-01-30 | 1976-11-09 | E. I. Du Pont De Nemours & Company | Photosensitive and degradable polyoxymethylene polymers and their application in imaging |
| JPS5817093B2 (ja) * | 1976-10-26 | 1983-04-05 | コオメイ工業株式会社 | 瓦直立コンベア |
| US4108839A (en) * | 1977-01-21 | 1978-08-22 | E. I. Du Pont De Nemours And Company | Photosensitive polyaldehydes and use in photoimaging |
| DE3039110A1 (de) * | 1980-10-16 | 1982-05-13 | Siemens AG, 1000 Berlin und 8000 München | Verfahren fuer die spannungsfreie entwicklung von bestrahlten polymethylmetacrylatschichten |
| JPS6064777A (ja) * | 1983-09-16 | 1985-04-13 | Daihatsu Motor Co Ltd | アルミダイカスト製部材にアルミ展伸材製部材を溶接する方法 |
| US5112707A (en) * | 1983-09-26 | 1992-05-12 | Canon Kabushiki Kaisha | Mask structure for lithography |
-
1991
- 1991-03-12 DE DE4107851A patent/DE4107851A1/de not_active Withdrawn
-
1992
- 1992-02-24 JP JP4036310A patent/JPH05148369A/ja not_active Withdrawn
- 1992-02-25 TW TW081101384A patent/TW241343B/zh active
- 1992-02-27 EP EP92103314A patent/EP0503377A1/de not_active Withdrawn
- 1992-03-09 KR KR1019920003830A patent/KR920018119A/ko not_active Withdrawn
-
1993
- 1993-08-05 US US08/102,519 patent/US5415977A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE4107851A1 (de) | 1992-09-17 |
| TW241343B (enExample) | 1995-02-21 |
| EP0503377A1 (de) | 1992-09-16 |
| US5415977A (en) | 1995-05-16 |
| JPH05148369A (ja) | 1993-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR920018119A (ko) | 높은 종횡비를 갖는 마이크로 성형물의 제조방법 | |
| KR930002382A (ko) | 배향된 광중합체 및 이의 제조방법 | |
| MX167928B (es) | Metodo no fotografico para fabricar diseños en peliculas polimericas | |
| ATE228939T1 (de) | Die herstellung von mikrostrukturen zur verwendung in tests | |
| ES2119362T3 (es) | Fabricacion de particulas que presentan una dimension uniforme de puntos cuanticos. | |
| BG101838A (en) | Superabsorbing structure with a flat form | |
| DE3484532D1 (de) | Verfahren zur durchfuehrung von chemischen reaktionen, insbesondere zur herstellung von kunststoffen mit hilfe von extrudern und anlage hierzu. | |
| BR8805740A (pt) | Processo para solidificacao ou encapsulacao de composicoes | |
| DE3882981D1 (de) | Vorrichtung und verfahren zur herstellung dreidimensionaler gegenstaende durch photoverfestigung. | |
| KR880011622A (ko) | 감광성 내식막 조성물 | |
| PT92541A (pt) | Processo para fabrico de placas condutoras ou camadas interiores de placas condutoras com zonas rigidas e zonas flexiveis | |
| KR930012919A (ko) | 마이크로 구조 소자의 제조방법 | |
| BR0007926A (pt) | Filme para uso médico, consistindo em polìmeros em bloco lineares de poliuretano e processo para a produção de tal filme | |
| Fink et al. | Latent Ion Tracks in Polymers for Future Use in Nanoelectronics: an Overview of t he Present State-of-the-Art | |
| DE3472370D1 (en) | Method of forming an antithrombogenic layer on medical devices | |
| BR8003556A (pt) | Processo para a polimerizacao estereospecifica de uma alfa-olefine, polimero produzido pelo processo e sistema catalisador de polimerizacao olefinica | |
| KR920018118A (ko) | 높은 종횡비를 갖는 마이크로 성형물의 제조방법 | |
| González-Henríquez et al. | Strategies for the fabrication of wrinkled polymer surfaces | |
| ATE520529T1 (de) | Lithographischer druckplattenvorläufer und verfahren zur herstellung einer lithographischen druckplatte | |
| KR940006250A (ko) | 마이크로 구조 소자의 제조방법 | |
| KR910018854A (ko) | 레지스트 구조를 만들기 위한 방법. | |
| ATE238906T1 (de) | Mehrschichtige trübe filmstrukturen mit verringerter oberflächenreibung sowie verfahren zur herstellung | |
| KR880014648A (ko) | 초미세관의 형성방법 | |
| DE69031655D1 (de) | Immobilisierung von molekülen durch verwendung von radioderivatisierten polymeren | |
| KR880701251A (ko) | 비등방성 폴리머 재료 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19920309 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |