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Priority to KR1019900018628ApriorityCriticalpatent/KR920010861A/en
Publication of KR920010861ApublicationCriticalpatent/KR920010861A/en
레이저를 이용한 리드플래임의 플래쉬 제거공정Flash removal process of lead frame using laser
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 본 발명의 목적을 달성하기 위한 개략도.1 is a schematic diagram for achieving the object of the present invention.
Claims (1)
몰딩된 팩키지에 물과 함께 돌가루에 의해 고압으로 분사되어 리드플래임표면에 덮어있는 플래쉬를 제거하는 플래쉬 제거공정에 덮어 있는 플래쉬(5)를 레이저장치(1)에서 레이저빔(2)으로 제거할수 있도록 구성된 것을 특징으로 하는 레이저를 이용한 리드플래임의 플래쉬 제거 공정.The flash (5) is removed from the laser device (1) with the laser beam (2) in the flash removal process in which the molded package is sprayed with high pressure by means of stone powder to remove the flash covered on the lead frame surface. Flash removal process of the lead frame using a laser, characterized in that configured to enable.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900018628A1990-11-161990-11-16
Flash removal process of lead frame using laser
KR920010861A
(en)
Mesa-structured semiconductor device for optical processing, with the addition of recombination centers on the side surfaces to improve the operating speed.