KR920008216Y1 - Multiple structure die casting fixtures - Google Patents

Multiple structure die casting fixtures Download PDF

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Publication number
KR920008216Y1
KR920008216Y1 KR2019900018703U KR900018703U KR920008216Y1 KR 920008216 Y1 KR920008216 Y1 KR 920008216Y1 KR 2019900018703 U KR2019900018703 U KR 2019900018703U KR 900018703 U KR900018703 U KR 900018703U KR 920008216 Y1 KR920008216 Y1 KR 920008216Y1
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KR
South Korea
Prior art keywords
die casting
mechanical
casting mold
shielding
multiple structure
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KR2019900018703U
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Korean (ko)
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KR920010838U (en
Inventor
박찬현
Original Assignee
현대전자산업 주식회사
정몽헌
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Priority to KR2019900018703U priority Critical patent/KR920008216Y1/en
Publication of KR920010838U publication Critical patent/KR920010838U/en
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Publication of KR920008216Y1 publication Critical patent/KR920008216Y1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20Accessories: Details
    • B22D17/22Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

내용 없음.No content.

Description

다중구조 다이캐스팅 금형기구Multi-structure die casting mold mechanism

제1도는 종래의 기구적 EMI 차폐를 위한 다이캐스팅 금형 구조도.1 is a die casting mold structure diagram for conventional mechanical EMI shielding.

제2도는 종래 기술의 문제점을 나타내는 구도조.2 is a composition diagram showing the problems of the prior art.

제3도는 본 고안의 이중구조화된 다이캐스팅 금형을 나타내는 구조도.3 is a structural diagram showing a dual structured die casting mold of the present invention.

제4도는 종래 다이캐스팅 금형에 의한 감쇄를 나타내는 구조도.4 is a structural diagram showing attenuation by a conventional die casting mold.

제5도는 본 고안에 의한 감쇄를 나타내는 구조도.5 is a structural diagram showing attenuation according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 프린트 기판 2 : 다이캐스팅 기구1 printed board 2 die casting mechanism

3 : 불완전 그라운드 접속 4 : 홈3: incomplete ground connection 4: home

T, t1, t2 : 기구적 차폐용 벽두께T, t1, t2: wall thickness for mechanical shielding

본 고안은 다중구조 다이캐스팅 금형기구에 관한 것으로서, 특히 프린트 기판에 적용되어 EMI(Electromagnetic Interface)를 차폐하는 다중구조 다이캐스팅 금형기구에 관한 것이다.The present invention relates to a multi-structure die casting mold mechanism, and more particularly, to a multi-structure die casting mold mechanism applied to a printed board to shield the electromagnetic interface (EMI).

EMI 차폐에는 필터형, 쉴드형, 전원분리형등이 있지만 특히 VHF 대역 이상의 신호(Signal)를 다루는 회로에 있어서는, 각 회로 계통간의 독립화 즉, 차폐가 극히 중요하며, 각 신호선로상을 통한 원하는 (Wanted)신호 및 원하지 않은 (Unwanted) 신호의 분리보다도 공간을 통한 직접 도달에 의한 전자파 방해 및 간섭(EMI)을 기구적인 차폐를 통하여 실현함이 바람직하다.EMI shielding includes filter type, shield type, and power separation type, but especially for circuits that handle signals over the VHF band, independence between each circuit system, that is, shielding, is extremely important, It is desirable to realize electromagnetic interference and interference (EMI) through mechanical shielding by direct arrival through space rather than separation of signals and unwanted signals.

제1도 및 제2도를 참조하여 종래 기술을 설명하면 다음과 같다.The prior art will be described with reference to FIGS. 1 and 2 as follows.

제1도는 종래의 기구적 EMI 차폐를 위한 다이캐스팅 금형 구조를 나타낸다. 제2도에서 1은 프린트 기판, 2는 다이캐스팅 기구, 3은 불완전 그라운드 접속을 나타낸다.1 shows a die casting mold structure for conventional mechanical EMI shielding. In FIG. 2, 1 represents a printed board, 2 represents a die casting mechanism, and 3 represents an incomplete ground connection.

프린트 기판(1)과 다이캐스팅 기구(2)물이 접속할때, 다이 캐스팅 기구(2)물의 불균형 사출이나 프린터 기판(1)의 뒤틀림, 또는 접속부위에 납이 분포되어 있을 경우에는 그라운드나 다이캐스팅 기구물(2)의 접속이 불완전하여(제2도 참조) 오히려 기구적인 전자기파의 통로(Wave Guide)를 구성하여 기구적인 처리가 전혀 없는 것보다 EMI의 차폐가 못한 결과가 종종 발생하는 문제점이 있었다.When the printed circuit board 1 and the die casting mechanism 2 are connected, the ground or the die casting mechanism (if the lead is distributed in an unbalanced injection of the die casting mechanism 2, the warpage of the printer substrate 1, or in the connection area) 2) the connection is incomplete (see Fig. 2), rather, the configuration of the electromagnetic wave (wave guide) of the electromagnetic wave (Wave Guide), there is a problem that often results in the shielding of EMI than the mechanical treatment at all.

본 고안은 상기 문제점을 해결하기 위해 안출된 것으로서, 다이캐스팅에 의한 기구의 요철에 의한 쉴드(Shield) 벽을 다중구조화하여 확실한 그라운드 접촉을 유도하여, 다중구조에 의한 불필요한 신호(Unwanted Signal)의 다중감쇄를 유도하여 양산 제품의 신뢰성을 극대화 할수 있는 다중 구조 다이캐스팅 금형 기구를 제공함에 그 목적이 있다.The present invention has been made to solve the above problems, by multi-structuring the shield wall due to the unevenness of the mechanism by die casting to induce a reliable ground contact, multiple attenuation of the unnecessary signal (unwanted signal) by the multiple structure Its purpose is to provide a multi-structure die casting mold mechanism that can maximize the reliability of mass-produced products.

본 고안은 상기 목적을 달성하기 위해 기구적 EMI 차폐를 위한 다이캐스팅(Dicasting) 금형 기구에 있어서, 기구적 차폐용 벽의 상부에 길이 방향으로 일정 홈을 형성하여 다중구조화하는 것을 특징으로 한다.In order to achieve the above object, the present invention is characterized in that, in a die casting mold apparatus for mechanical EMI shielding, a multi-structure is formed by forming a predetermined groove in a longitudinal direction on an upper portion of the mechanical shielding wall.

이하, 제3도와 4도 및 5도를 참조하여 본 고안의 일실시예를 설명한다.Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 3 and 4 and 5.

제3도는 기구적 EMI 차폐용 벽의 상부에 길이 방향으로 홈을 형성하여 이중구조화 하는 것을 나타낸다.3 shows a double structure by forming a groove in the longitudinal direction on top of the mechanical EMI shielding wall.

제4도는 종래 기술에 의한 감쇄를 나타내면 제5도는 본 고안에 의한 감쇄를 나타낸다.4 shows the attenuation according to the prior art, and FIG. 5 shows the attenuation according to the present invention.

제4도와 5도에서 T는 기구적 EMI 차폐용 벽의 전체두께, t1과 t2는 부분 두께를 나타낸다.In Figures 4 and 5, T represents the total thickness of the mechanical EMI shielding wall, and t1 and t2 represent the partial thickness.

제4도에서 감쇄도를 LogT라고 가정하면 제5도에서의 감쇄도는 Log(t1+t2)가 아니라 Longt1+Logt2가 되며 t1 및 t2의 두께가 같은 경우, 제5도의 감쇄 효과는 2Logt1이 된다. 이때 t1 및 t2의 두께가 T/3이상이라고 하면 T=10이라고 가정할때 LogT < 2Log⅓가 되며 즉 이식은 제4도의 경우보다 제5도의 다중차폐 구조가 같은 두께라 하더라도 차폐 효과가 크다는 것을 알수 있다.Assuming the attenuation degree in FIG. 4 is LogT, the attenuation degree in FIG. 5 is not Log (t1 + t2) but Longt1 + Logt2. When the thicknesses of t1 and t2 are the same, the damping effect of FIG. 5 is 2Logt1. . At this time, if the thickness of t1 and t2 is more than T / 3, assuming that T = 10, LogT <2Log⅓, that is, the graft has a large shielding effect even if the multiple shield structure of FIG. 5 is the same thickness than that of FIG. have.

상기한 바와 같이 다중구조 다이캐스팅 금형 기구는 다음과 같은 효과를 지닌다.As described above, the multi-structure die casting mold mechanism has the following effects.

1. 프린트 기판과 기구물 사이의 불완전 접속 가능성이 줄어든다.1. The possibility of incomplete connection between the printed board and the apparatus is reduced.

2. 보다 완전한 차폐를 얻어 양산 제품의 신뢰성이 증대된다.2. The more complete the shield, the more reliable the mass production product.

3. 동일한 벽 두께로 높은 차폐 효과가 기대된다.3. High shielding effect is expected with the same wall thickness.

4. 기구적인 고려외에 실시비용이 전혀 들지 않는다.4. There is no cost to implement except mechanical considerations.

Claims (1)

기구적 EMI 차폐를 위한 다이캐스팅(Dicasting) 금형 기구에 있어서; 기구적 차폐용 벽의 상부에 길이 방향으로 일정 홈을 형성하여 다중구조화하는 것을 특징으로 하는 다중구조 다이캐스팅 금형 기구.A die casting mold apparatus for mechanical EMI shielding; A multi-structure die casting mold mechanism, characterized in that the multi-structure by forming a predetermined groove in the longitudinal direction on the top of the mechanical shielding wall.
KR2019900018703U 1990-11-30 1990-11-30 Multiple structure die casting fixtures KR920008216Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900018703U KR920008216Y1 (en) 1990-11-30 1990-11-30 Multiple structure die casting fixtures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900018703U KR920008216Y1 (en) 1990-11-30 1990-11-30 Multiple structure die casting fixtures

Publications (2)

Publication Number Publication Date
KR920010838U KR920010838U (en) 1992-06-17
KR920008216Y1 true KR920008216Y1 (en) 1992-11-14

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