KR920007519A - Thermal conductivity immersion cooling module and its cooling method - Google Patents
Thermal conductivity immersion cooling module and its cooling method Download PDFInfo
- Publication number
- KR920007519A KR920007519A KR1019900013942A KR900013942A KR920007519A KR 920007519 A KR920007519 A KR 920007519A KR 1019900013942 A KR1019900013942 A KR 1019900013942A KR 900013942 A KR900013942 A KR 900013942A KR 920007519 A KR920007519 A KR 920007519A
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- South Korea
- Prior art keywords
- semiconductor chip
- boiling
- thermal diffusion
- diffusion substrate
- heat
- Prior art date
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 풀(POOL)비등실험에서 한계열유속에 도달하면 상기 열유속의 별다른 증가없이 전자부품의 온도가 급격히 증가되는 것을 보여주는 그래프.FIG. 1 is a graph showing that when the limit heat flux is reached in a POOL boiling test, the temperature of an electronic component is rapidly increased without increasing the heat flux.
제2도는 본 발명의 1실시예에 관한 열전도액침냉각모듈이 인쇄회로 기판상에 설치되어 있는 단면도.2 is a cross-sectional view in which a thermally conductive liquid immersion cooling module according to an embodiment of the present invention is provided on a printed circuit board.
제3도는 제2도에 도시된 열전도액침냉각모듈이 열유속의 증가에 따라 비등현상이 일어나는 단계상태도.3 is a state diagram in which the boiling phenomenon occurs as the heat flux increases in the heat conduction liquid immersion cooling module shown in FIG.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1019900013942A KR920007519A (en) | 1990-09-04 | 1990-09-04 | Thermal conductivity immersion cooling module and its cooling method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900013942A KR920007519A (en) | 1990-09-04 | 1990-09-04 | Thermal conductivity immersion cooling module and its cooling method |
Publications (1)
Publication Number | Publication Date |
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KR920007519A true KR920007519A (en) | 1992-04-28 |
Family
ID=67542733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019900013942A KR920007519A (en) | 1990-09-04 | 1990-09-04 | Thermal conductivity immersion cooling module and its cooling method |
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KR (1) | KR920007519A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100411268B1 (en) * | 1999-12-18 | 2003-12-18 | 주식회사 포스코 | A neutralization method of alkaline leachate caused by slag |
KR100765074B1 (en) * | 2001-12-21 | 2007-10-09 | 주식회사 포스코 | Stabilization method of steel dust containing pb using humus |
-
1990
- 1990-09-04 KR KR1019900013942A patent/KR920007519A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100411268B1 (en) * | 1999-12-18 | 2003-12-18 | 주식회사 포스코 | A neutralization method of alkaline leachate caused by slag |
KR100765074B1 (en) * | 2001-12-21 | 2007-10-09 | 주식회사 포스코 | Stabilization method of steel dust containing pb using humus |
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