KR920007029U - Wafer tongs and carrier - Google Patents

Wafer tongs and carrier

Info

Publication number
KR920007029U
KR920007029U KR2019900013995U KR900013995U KR920007029U KR 920007029 U KR920007029 U KR 920007029U KR 2019900013995 U KR2019900013995 U KR 2019900013995U KR 900013995 U KR900013995 U KR 900013995U KR 920007029 U KR920007029 U KR 920007029U
Authority
KR
South Korea
Prior art keywords
carrier
tongs
wafer
wafer tongs
Prior art date
Application number
KR2019900013995U
Other languages
Korean (ko)
Other versions
KR930006275Y1 (en
Inventor
권병조
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019900013995U priority Critical patent/KR930006275Y1/en
Publication of KR920007029U publication Critical patent/KR920007029U/en
Application granted granted Critical
Publication of KR930006275Y1 publication Critical patent/KR930006275Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019900013995U 1990-09-10 1990-09-10 Wafer tweezer and carring apparatus KR930006275Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900013995U KR930006275Y1 (en) 1990-09-10 1990-09-10 Wafer tweezer and carring apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900013995U KR930006275Y1 (en) 1990-09-10 1990-09-10 Wafer tweezer and carring apparatus

Publications (2)

Publication Number Publication Date
KR920007029U true KR920007029U (en) 1992-04-22
KR930006275Y1 KR930006275Y1 (en) 1993-09-17

Family

ID=19303254

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900013995U KR930006275Y1 (en) 1990-09-10 1990-09-10 Wafer tweezer and carring apparatus

Country Status (1)

Country Link
KR (1) KR930006275Y1 (en)

Also Published As

Publication number Publication date
KR930006275Y1 (en) 1993-09-17

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20020820

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee