KR910016068A - Lead frame joining method of frequency generating sensor - Google Patents

Lead frame joining method of frequency generating sensor Download PDF

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Publication number
KR910016068A
KR910016068A KR1019900002700A KR900002700A KR910016068A KR 910016068 A KR910016068 A KR 910016068A KR 1019900002700 A KR1019900002700 A KR 1019900002700A KR 900002700 A KR900002700 A KR 900002700A KR 910016068 A KR910016068 A KR 910016068A
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KR
South Korea
Prior art keywords
lead frame
frequency generating
generating sensor
joining method
frame joining
Prior art date
Application number
KR1019900002700A
Other languages
Korean (ko)
Other versions
KR940006086B1 (en
Inventor
추대호
임종부
한제범
Original Assignee
서주인
삼성전기 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 서주인, 삼성전기 주식회사 filed Critical 서주인
Priority to KR1019900002700A priority Critical patent/KR940006086B1/en
Publication of KR910016068A publication Critical patent/KR910016068A/en
Application granted granted Critical
Publication of KR940006086B1 publication Critical patent/KR940006086B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/603—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

내용 없음No content

Description

주파수발생센서의 리드프레임 접합방법Lead frame joining method of frequency generating sensor

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 의해 리드프레임을 접합한 센서의 평면도, 제3도는 본 발명에 의해 리드프레임을 접합한 센서의 단면도, 제4도는 본 발명에 의한 접합방법을 나타낸 사시도.2 is a plan view of a sensor bonded to a lead frame according to the present invention, FIG. 3 is a sectional view of a sensor bonded to a lead frame according to the present invention, and FIG.

Claims (2)

주파수 발생센서에 있어서, 유리기판의 전극층에 도금하는 재질과 동일한 재질로 리드프레임을 도금하여 가열압착에 의해 리드프레임의 도금층과 전극층이 용융되어 접합되는 것을 특징으로 하는 주파수 발생센서의 리드프레임 접합방법.In the frequency generating sensor, the lead frame bonding method of the frequency generating sensor, characterized in that the lead frame is plated with the same material as the plated on the electrode layer of the glass substrate, and the plated layer and the electrode layer of the lead frame are melted and joined. . 제1항에 있어서, 전극층 및 리드프레임을 Ni 0.5∼1.5㎛ 및 Pb-Sn 5∼20㎛로 도금하는 것을 특징으로 하는 주파수 발생센서의 리드프레임 접합방법.2. The method of joining a leadframe of a frequency generating sensor according to claim 1, wherein the electrode layer and the leadframe are plated with Ni 0.5 to 1.5 mu m and Pb-Sn 5 to 20 mu m. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900002700A 1990-02-28 1990-02-28 Method for junction of frequency-generating sensor and leadframe KR940006086B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900002700A KR940006086B1 (en) 1990-02-28 1990-02-28 Method for junction of frequency-generating sensor and leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900002700A KR940006086B1 (en) 1990-02-28 1990-02-28 Method for junction of frequency-generating sensor and leadframe

Publications (2)

Publication Number Publication Date
KR910016068A true KR910016068A (en) 1991-09-30
KR940006086B1 KR940006086B1 (en) 1994-07-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900002700A KR940006086B1 (en) 1990-02-28 1990-02-28 Method for junction of frequency-generating sensor and leadframe

Country Status (1)

Country Link
KR (1) KR940006086B1 (en)

Also Published As

Publication number Publication date
KR940006086B1 (en) 1994-07-06

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