KR910007079A - 반응관 개폐장치 - Google Patents

반응관 개폐장치 Download PDF

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Publication number
KR910007079A
KR910007079A KR1019900015286A KR900015286A KR910007079A KR 910007079 A KR910007079 A KR 910007079A KR 1019900015286 A KR1019900015286 A KR 1019900015286A KR 900015286 A KR900015286 A KR 900015286A KR 910007079 A KR910007079 A KR 910007079A
Authority
KR
South Korea
Prior art keywords
fork
reaction tube
closed
cover
tube switch
Prior art date
Application number
KR1019900015286A
Other languages
English (en)
Inventor
다츠오 오케다
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
다케다이 마사다카
도시바 마이크로 일렉트로닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바, 다케다이 마사다카, 도시바 마이크로 일렉트로닉스 가부시키가이샤 filed Critical 아오이 죠이치
Publication of KR910007079A publication Critical patent/KR910007079A/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

내용 없음

Description

반응관 개폐장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 본 발명의 제1실시예를 나타낸 정면도.
제2도 본 발명의 제1실시예를 나타낸 평면도.
제3도는 (a)는 본 발명의 1실시예에 따른 장치의 문개폐기구를 확대하여 나타낸 주요 확대도.
제3도(b)는 본 발명의 1실시예에 따른 장치의 회전각검지판을 나타낸 평면도.

Claims (1)

  1. 서로 독립되어 유동 및 전후운동이 자유로운 포크 삽입부(3a)를 내부에 구비한 포크 삽입시용 덮개(3)와 원판 형태의 포크비삽입시용 덮개(4)를 갖추고, 원통형의 반응관의 개구단면을 상기 한쪽 덮개로 막도록 한 반응관 개폐장치에 있어서, 상기 포크 삽입시용 덮개(3)가 중앙에서 2분할된 개폐가 자유로운 1쌍의 개폐문으로 구성됨과 동시에 이 각 개폐문의 접촉단면에 각각 절결부(14a)를 설치하여 개폐문을 닫았을 때에 이 2개의 절결부(14a)로 포크(2)의 외형에 합치된 포크 삽입부(3 a)를 형성하도록 된 것을 특징으로 하는 반응관 개폐장치.
    ※ 참고사항 : 최초 출원 내용에 의하여 공개하는 것임.
KR1019900015286A 1989-09-29 1990-09-26 반응관 개폐장치 KR910007079A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP01-254665 1989-09-29
JP1254665A JPH0793279B2 (ja) 1989-09-29 1989-09-29 炉芯管開閉装置

Publications (1)

Publication Number Publication Date
KR910007079A true KR910007079A (ko) 1991-04-30

Family

ID=17268165

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900015286A KR910007079A (ko) 1989-09-29 1990-09-26 반응관 개폐장치

Country Status (3)

Country Link
US (1) US5092080A (ko)
JP (1) JPH0793279B2 (ko)
KR (1) KR910007079A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5718265A (en) * 1995-02-24 1998-02-17 Emco Wheaton Fleet Fueling, Corp. Cap and shield assembly

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844835U (ja) * 1981-09-21 1983-03-25 日本電気ホームエレクトロニクス株式会社 半導体製造装置
JPS58122723A (ja) * 1982-01-18 1983-07-21 Toshiba Corp 半導体ウエハの加熱処理装置
JPS58207626A (ja) * 1982-05-28 1983-12-03 Hitachi Ltd 半導体処理装置
JPS63285926A (ja) * 1987-05-18 1988-11-22 Toshiba Corp 半導体拡散炉
JP2628068B2 (ja) * 1988-06-17 1997-07-09 日本電信電話株式会社 半導体製造装置における熱処理炉用キヤツプの構造
JPS6446921A (en) * 1988-07-29 1989-02-21 Sony Corp Heat treatment furnace

Also Published As

Publication number Publication date
JPH0793279B2 (ja) 1995-10-09
JPH03116823A (ja) 1991-05-17
US5092080A (en) 1992-03-03

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E902 Notification of reason for refusal
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