KR910007079A - 반응관 개폐장치 - Google Patents
반응관 개폐장치 Download PDFInfo
- Publication number
- KR910007079A KR910007079A KR1019900015286A KR900015286A KR910007079A KR 910007079 A KR910007079 A KR 910007079A KR 1019900015286 A KR1019900015286 A KR 1019900015286A KR 900015286 A KR900015286 A KR 900015286A KR 910007079 A KR910007079 A KR 910007079A
- Authority
- KR
- South Korea
- Prior art keywords
- fork
- reaction tube
- closed
- cover
- tube switch
- Prior art date
Links
- 230000037431 insertion Effects 0.000 claims 4
- 238000003780 insertion Methods 0.000 claims 4
- 238000001514 detection method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 본 발명의 제1실시예를 나타낸 정면도.
제2도 본 발명의 제1실시예를 나타낸 평면도.
제3도는 (a)는 본 발명의 1실시예에 따른 장치의 문개폐기구를 확대하여 나타낸 주요 확대도.
제3도(b)는 본 발명의 1실시예에 따른 장치의 회전각검지판을 나타낸 평면도.
Claims (1)
- 서로 독립되어 유동 및 전후운동이 자유로운 포크 삽입부(3a)를 내부에 구비한 포크 삽입시용 덮개(3)와 원판 형태의 포크비삽입시용 덮개(4)를 갖추고, 원통형의 반응관의 개구단면을 상기 한쪽 덮개로 막도록 한 반응관 개폐장치에 있어서, 상기 포크 삽입시용 덮개(3)가 중앙에서 2분할된 개폐가 자유로운 1쌍의 개폐문으로 구성됨과 동시에 이 각 개폐문의 접촉단면에 각각 절결부(14a)를 설치하여 개폐문을 닫았을 때에 이 2개의 절결부(14a)로 포크(2)의 외형에 합치된 포크 삽입부(3 a)를 형성하도록 된 것을 특징으로 하는 반응관 개폐장치.※ 참고사항 : 최초 출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP01-254665 | 1989-09-29 | ||
JP1254665A JPH0793279B2 (ja) | 1989-09-29 | 1989-09-29 | 炉芯管開閉装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR910007079A true KR910007079A (ko) | 1991-04-30 |
Family
ID=17268165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900015286A KR910007079A (ko) | 1989-09-29 | 1990-09-26 | 반응관 개폐장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5092080A (ko) |
JP (1) | JPH0793279B2 (ko) |
KR (1) | KR910007079A (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5718265A (en) * | 1995-02-24 | 1998-02-17 | Emco Wheaton Fleet Fueling, Corp. | Cap and shield assembly |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5844835U (ja) * | 1981-09-21 | 1983-03-25 | 日本電気ホームエレクトロニクス株式会社 | 半導体製造装置 |
JPS58122723A (ja) * | 1982-01-18 | 1983-07-21 | Toshiba Corp | 半導体ウエハの加熱処理装置 |
JPS58207626A (ja) * | 1982-05-28 | 1983-12-03 | Hitachi Ltd | 半導体処理装置 |
JPS63285926A (ja) * | 1987-05-18 | 1988-11-22 | Toshiba Corp | 半導体拡散炉 |
JP2628068B2 (ja) * | 1988-06-17 | 1997-07-09 | 日本電信電話株式会社 | 半導体製造装置における熱処理炉用キヤツプの構造 |
JPS6446921A (en) * | 1988-07-29 | 1989-02-21 | Sony Corp | Heat treatment furnace |
-
1989
- 1989-09-29 JP JP1254665A patent/JPH0793279B2/ja not_active Expired - Lifetime
-
1990
- 1990-09-26 KR KR1019900015286A patent/KR910007079A/ko not_active IP Right Cessation
- 1990-09-27 US US07/588,722 patent/US5092080A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0793279B2 (ja) | 1995-10-09 |
JPH03116823A (ja) | 1991-05-17 |
US5092080A (en) | 1992-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
SUBM | Surrender of laid-open application requested |