KR900004895A - Polyimide Film Die Attach Adhesive Composition - Google Patents

Polyimide Film Die Attach Adhesive Composition Download PDF

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Publication number
KR900004895A
KR900004895A KR1019890013837A KR890013837A KR900004895A KR 900004895 A KR900004895 A KR 900004895A KR 1019890013837 A KR1019890013837 A KR 1019890013837A KR 890013837 A KR890013837 A KR 890013837A KR 900004895 A KR900004895 A KR 900004895A
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South Korea
Prior art keywords
composition
formula
bis
aromatic
polyimide
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KR1019890013837A
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Korean (ko)
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데이비드 비 포웰
로버트 알 영
Original Assignee
고든 시.앤드류스
엠 앤드 티 케미칼스 인코포레이티드
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Application filed by 고든 시.앤드류스, 엠 앤드 티 케미칼스 인코포레이티드 filed Critical 고든 시.앤드류스
Publication of KR900004895A publication Critical patent/KR900004895A/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

내용 없음No content

Description

폴리이미드 필름 다이 부착 접착제 조성물Polyimide Film Die Attach Adhesive Composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (20)

100부의 폴리이미드당 약 10-80부의 아미노플라스트를 갖는 페놀 말단-켑 폴리이미드의 혼합물임을 특징으로 하는 조성물.And a phenol end-VII polyimide having about 10-80 parts aminoplast per 100 parts polyimide. 제1항에 있어서, 폴리이미드가 다음 일반식을 가짐을 특징으로 하는 조성물.The composition of claim 1 wherein the polyimide has the general formula: (상기식에서 n는 0-200의 정수이고, A는 다음 식을 갖는 방향족 디에테르 이무수물의 4가 잔기이고:Wherein n is an integer from 0 to 200 and A is a tetravalent residue of an aromatic diether dianhydride having the formula: 여기서 K는 다음식의 치환 또는 비치환기이고:Where K is a substituted or unsubstituted group of the formula: W는 -O-, -S-, -SO2, 선상이나 분지상 알킬렌 또는 1-8개의 탄소를 갖는 알케닐렌 또는 R과 Ra가 같거나 다른 저급 알킬 또는 저급 알케닐 또는 6-24개의 탄소를 갖는 치환 또는 비치환 아릴기이고, m는 0 또는 1이고 Y는 다음중 하나 또는 이의 혼합물이다:(a) 다음 식을 갖는 방향족 디에테르디아민의 2가W is -O-, -S-, -SO 2 , linear or branched alkylene or alkenylene having 1-8 carbons or lower alkyl or lower alkenyl or 6-24 carbons having the same or different R as Ra A substituted or unsubstituted aryl group with m being 0 or 1 and Y is one or a mixture thereof: (a) a divalent aromatic dietherdiamine having the formula 잔기:Residues: 상기식에서 G는 다음식의 치환 또는 비치환기이다:Wherein G is a substituted or unsubstituted group of the formula: 여기서 E는 -S-, -SO2, 선상이나 분지상 알킬렌 또는 1-8개의 탄소를 갖는 알케닐렌 또는 R과 Ra와 m가 전술한 바와 같은이다. (b) 다음식을 갖는 디아미노폴리실옥산의 2가 잔기:Wherein E is -S-, -SO 2 , linear or branched alkylene or alkenylene having 1-8 carbons or R and Ra and m as described above. (b) divalent residues of diaminopolysiloxanes having the formula: 상기식에서 Q는 아릴렌이고, Z는 2가 산소, 활화물, 술폰, 술폭시드나 카르복실산 에스테르, 또는 아미드기이고, D는 하이드로카르빌렌기이고, R1,R2,R3,R4,R5 R6는 각기 알킬이고, x,y와 z는 0-100의 정수이다)Wherein Q is arylene, Z is divalent oxygen, a lubricant, a sulfone, a sulfoxide or a carboxylic ester, or an amide group, D is a hydrocarbylene group, ROne, R2, R3, R4, R5Wow R6Are each alkyl, x, y and z are integers from 0-100) 제2항에 있어서, Y가(a)와 (b)의 혼합물임을 특징으로 하는 조성물.The composition of claim 2 wherein Y is a mixture of (a) and (b). 제3항에 있어서, (a)와 (b)의 몰비가 약 10:90 내지 90:10임을 특징으로 하는 조성물.The composition of claim 3, wherein the molar ratio of (a) and (b) is about 10:90 to 90:10. 제2항에 있어서, 방향족 디에테르 이무수물이 비스(P-(3,4디카르복시펜옥시)페닐)술파이드 무수물임을 특징으로 하는 조성물.A composition according to claim 2, wherein the aromatic diether dianhydride is bis (P- (3,4dicarboxyphenoxy) phenyl) sulfide anhydride. 제2항에 있어서, 방향족 디아민의 4,4'-비스(P-아미노펜옥시)디페닐 술폰임을 특징으로 하는 조성물.3. The composition of claim 2, which is 4,4'-bis (P-aminophenoxy) diphenyl sulfone of aromatic diamine. 제2항에 있어서, 방향족 디아민이 2,2-비스(4-(P-아미노펜옥시)페닐)프로판과 디아미노폴리실옥산의 혼합물임을 특징으로 하는 조성물.The composition of claim 2 wherein the aromatic diamine is a mixture of 2,2-bis (4- (P-aminophenoxy) phenyl) propane and diaminopolysiloxane. 제7항에 있어서, 디아미노폴리실옥산이 비스(m-아미노펜옥시부틸)헥사데카메틸옥타실옥산임을 특징으로 하는 조성물.8. A composition according to claim 7, wherein the diaminopolysiloxane is bis (m-aminophenoxybutyl) hexadecamethyloctasiloxane. 제2항에 있어서, n가 10-100임을 특징으로 하는 조성물.The composition of claim 2 wherein n is 10-100. 제2항에 있어서, m가 1임을 특징으로 하는 조성물.The composition of claim 2, wherein m is 1. 제2항에 있어서, W가 -S-임을 특징으로 하는 조성물.The composition of claim 2, wherein W is -S-. 제2항에 있어서, E가 -SO2-임을 특징으로 하는 조성물.The composition of claim 2, wherein E is —SO 2 —. 제1항에 있어서, E가 -(R)C(Ra)-임을 특징으로 하는 조성물.The composition of claim 1, wherein E is-(R) C (Ra)-. 제13항에 있어서, R과 Ra가 각각 메틸임을 특징으로 하는 조성물.The composition of claim 13, wherein R and Ra are each methyl. 제1항에 있어서, 아미노플라스트가 알콕시메틸멜라민임을 특징으로 하는 조성물.The composition of claim 1 wherein the aminoplast is alkoxymethylmelamine. 제15항에 있어서, 알콕시메틸멜라민이 헥사메톡시-메틸멜라민임을 특징으로 하는 조성물.16. The composition of claim 15, wherein the alkoxymethylmelamine is hexamethoxy-methylmelamine. 제1항에 있어서, 불활성 충전제를 함유함을 특징으로 하는 조성물.The composition of claim 1 containing inert fillers. 제17항에 있어서, 충전제가 실리카임을 특징으로 하는 조성물.18. The composition of claim 17, wherein the filler is silica. 제17항에 있어서, 충전제가 세라믹임을 특징으로 하는 조성물.18. The composition of claim 17, wherein the filler is a ceramic. 제17항에 있어서, 충전제가 은임을 특징으로 하는 조성물.18. The composition of claim 17, wherein the filler is silver. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890013837A 1988-09-26 1989-09-26 Polyimide Film Die Attach Adhesive Composition KR900004895A (en)

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US24915088A 1988-09-26 1988-09-26
US249150 1994-05-25

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JP (1) JPH02120383A (en)
KR (1) KR900004895A (en)
CN (1) CN1042168A (en)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR102376589B1 (en) * 2021-10-06 2022-03-18 조명섭 Mouthpiece manufacturing method for wind instruments

Families Citing this family (11)

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JP2597706B2 (en) * 1989-03-28 1997-04-09 株式会社日立製作所 Heat resistant adhesive
US5667899A (en) * 1992-09-16 1997-09-16 Hitachi Chemical Co. Ltd. Electrically conductive bonding films
JP3288146B2 (en) * 1992-09-16 2002-06-04 日立化成工業株式会社 Conductive adhesive film, bonding method, support member with conductive adhesive film, and semiconductor device
JP4102051B2 (en) * 2001-10-12 2008-06-18 株式会社カネカ Laminated body and multilayer printed wiring board
KR100739403B1 (en) * 2006-01-03 2007-07-16 주식회사 코오롱 Intermediate transfer belt and manufacturing method thereof
KR101037018B1 (en) * 2006-01-17 2011-05-25 아사히 가세이 가부시키가이샤 Polyimide resin composition and metal polyimide laminate
JP5562574B2 (en) * 2009-04-14 2014-07-30 信越化学工業株式会社 Thermally conductive adhesive
JP5489261B2 (en) * 2009-04-14 2014-05-14 信越化学工業株式会社 Thermally conductive adhesive
CN105801830B (en) * 2016-05-03 2018-01-19 中国航空工业集团公司北京航空材料研究院 A kind of high temperature resistant makrolon and preparation method thereof
CN108641665B (en) * 2018-05-14 2020-08-21 中国科学院化学研究所 Polyimide adhesive and preparation method thereof
TWI749351B (en) * 2019-08-08 2021-12-11 達興材料股份有限公司 Composition for temporary bonding, film for temporary bonding, composite film, method for temporary bonding workpiece and semiconductor wafer packaging

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847349A (en) * 1985-08-27 1989-07-11 Mitsui Toatsu Chemicals, Inc. Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines
EP0309190A3 (en) * 1987-09-22 1990-10-17 National Starch And Chemical Investment Holding Corporation Polyimide coating compositions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102376589B1 (en) * 2021-10-06 2022-03-18 조명섭 Mouthpiece manufacturing method for wind instruments
WO2023058902A1 (en) * 2021-10-06 2023-04-13 조명섭 Wind instrument mouthpiece manufacturing method

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EP0361728A2 (en) 1990-04-04
JPH02120383A (en) 1990-05-08
EP0361728A3 (en) 1991-04-17
CN1042168A (en) 1990-05-16

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