KR900003233Y1 - Electro-deposition insulating device - Google Patents
Electro-deposition insulating device Download PDFInfo
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- KR900003233Y1 KR900003233Y1 KR2019830002133U KR830002133U KR900003233Y1 KR 900003233 Y1 KR900003233 Y1 KR 900003233Y1 KR 2019830002133 U KR2019830002133 U KR 2019830002133U KR 830002133 U KR830002133 U KR 830002133U KR 900003233 Y1 KR900003233 Y1 KR 900003233Y1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
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- Electrochemistry (AREA)
- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Manufacture Of Motors, Generators (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Abstract
내용 없음.No content.
Description
제1도는 종래의 이 종류의 전착절연장치의 개략 구성도.1 is a schematic configuration diagram of a conventional electrodeposition insulation device of this type.
제2도는 및 제3도는 제1도에 나타낸 종래 장치의 동작을 설명하는 동작 설명도.2 and 3 are operation explanatory diagrams for explaining the operation of the conventional apparatus shown in FIG.
제4도는 본원 고안의 일실시예를 나타낸 개략 구성도.Figure 4 is a schematic diagram showing an embodiment of the present invention.
제5도 및 제6도는 제1도 및 제4도의 각 장치의 특성도.5 and 6 are characteristic views of the apparatus of FIGS. 1 and 4.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1, 6 : 전착조 2 : 전착액1, 6: electrodeposition tank 2: electrodeposition liquid
3 : 운모편 5 : 회전기코일3: mica piece 5: rotary coil
61, 62 : 흡입구 7 : 토출노즐61, 62: suction port 7: discharge nozzle
8 : 유량조정밸브 9 : 토출구8: flow rate control valve 9: discharge port
본원 고안은 회전기(回轉機)코일 등의 도체표면에 전착법(電着法)에 의해 운모(mica)절연피막등의 절연층을 형성시키는 전착절연장치에 관한 것이다.The present invention relates to an electrodeposition insulation device for forming an insulation layer such as a mica insulation film on the surface of a conductor such as a rotor coil by an electrodeposition method.
일반적으로 전착운모 절연용의 물분산형 도료는 고분자량화된 수지의 콜로이드(colloid)입자 또는 운모편이 수중에 분산된 상태이지만, 전계중에서는 수지콜로이드 표면은 마이너스로 크게 대전(帶電) 되며, 또 고전압 절연재료로서 불가결인 운모도 수중에서는 마이너스로 대전되어 있다.In general, the water-dispersed paint for electrodeposition mica insulation is a state in which colloidal particles or mica fragments of high molecular weight resin are dispersed in water, but in the electric field, the surface of resin colloid is negatively charged and high voltage is applied. Mica, which is indispensable as an insulating material, is also negatively charged underwater.
따라서 전계내에서는 수지콜로이드 입자나 운모편은 양극을 향해서 영동(泳動)한다.Therefore, in the electric field, the resin colloidal particles and mica pieces move toward the anode.
이 운모편은 영동중에는 물의 저항을 되도록 받지 않는 상태, 즉 전극면과 수직방향으로 평판 형태로 나아가지만 전극 근방에 오면 방전 현상에 의해 회전 운동하여 전극면과 평행으로 석출된다.This mica piece is moved in the form of a flat plate in a state in which it is not subjected to water resistance during movement, that is, perpendicular to the electrode surface, but when it comes near the electrode, it is rotated due to a discharge phenomenon and precipitates in parallel with the electrode surface.
그러나 수중에 분산되어 있는 운모편은 그 중력에 의해서 수중에서 침전하기 때문에, 균일한 전착운모 절연 피막을 코일표면에 석출시키기 위해서는 항상 물분산도료(이하 전착액이라고 함)를 휘저어 섞을 필요가 있다.However, since the mica pieces dispersed in water settle in the water by gravity, it is always necessary to stir and mix the water dispersion paint (hereinafter referred to as electrodeposition liquid) in order to deposit a uniform electrodeposited mica insulating film on the coil surface.
그래서 종래의 이 종류의 전착절연장치는 전차액중에 설치한 믹서를 휘저어 섞거나, 제1도에 나타낸 것처럼 도시 생략의 전착액 순환펌프에 의해 전착조(1)의 토출구(11) (12)에서 전착액을 실선화살표 방향으로 토출시켜, 흡입구(13)에서 점선화살표 방향으로 흡입함으로써 전착액(2)을 휘저어 섞고, 운모편(3)과 수지콜로이드입자(4)의 농도를 균일하게 하여 회전기코일(5)에 절연피막을 형성하고 있었다.Thus, this type of electrodeposition insulator is agitated by mixing the mixer installed in the electrolytic solution, or at the discharge ports 11 and 12 of the electrodeposition tank 1 by an electrodeposition fluid circulation pump (not shown) as shown in FIG. The electrodeposition liquid is discharged in the direction of the solid arrow and sucked in the direction of the dotted arrow in the suction port 13 to stir the electrodeposition liquid 2, to uniform the concentration of the mica piece 3 and the resin colloidal particle 4, and the rotary coil The insulating film was formed in (5).
그러나 이 종래의 것에는 전착조내의 전착액중의 운모편(3)의 분포를 균일하게 하는데는 그 액유속(液流速)을 크게 할 필요가 있다.However, in this conventional one, in order to make the distribution of the mica piece 3 in the electrodeposition liquid in an electrodeposition tank uniform, it is necessary to enlarge the liquid flow velocity.
제2도에 있어서, 전착액유속으로 유동하는 운모편(3)은 이것에 적용하는 중력 G에 의해 침전하면서 A 방향으로 흐른다.In FIG. 2, the mica piece 3 flowing at the electrodeposition liquid flows in the A direction while settling by the gravity G applied thereto.
따라서 전착액 중의 운모편 분포를 균일하게 하는데는 유선V1을 크게 할 필요가 있다.Therefore, to even out the distribution of the mica pieces electrodeposition solution, it is necessary to increase the wire V 1.
한편 제3도에 있어서 운모편(3)의 피전착체(5)의 좌측면(51)에서는 전계에 의해 영동하는 속도와 전착액유속 V1과의 합의 속도 V2이며, 또 피전착체(5)의 우측면(52)에서는 그 차의 속도V3로 극면(極面)인 피전착체(5)에 향해서 이동하게 된다.On the other hand, in FIG. 3, the left side surface 51 of the electrodeposited body 5 of the mica piece 3 is the speed V 2 which is the sum of the speed of electrophoresis and the electrodeposition liquid flow rate V 1, and the electrodeposited body 5. In the right side surface 52 of the to be moved toward the electrodeposited body 5 which is the pole surface at the speed V 3 of the difference.
따라서 전착액류가 닿는 면과 그 뒷면에서는 단위시간당의 생성피막의 두께가 다르기 때문에 피전착체를 반전하여 두 번 전착을 할 필요가 있었다.Therefore, since the thickness of the formed film per unit time was different on the surface where the electrodeposited liquid reached, the electrodeposited body had to be reversed and electrodeposited twice.
예를 들면 피전착체가 회전기코일의 경우는 전착운모 절연피막의 두께를 균일한 것으로 하기 위해 회전기코일을 반전하여 두 번 전착할 필요가 있다.For example, when the electrodeposited body is a rotor coil, the electrode coil needs to be inverted twice and electrodeposited in order to make the thickness of the electrodeposited mica insulating film uniform.
또한 회전기코일 표면에 생성된 전착운모피막을 운모분율의 불균일성이 크며, 고온 고전압 절연조직으로서 성능이 뒤지는 결함이 있었다.In addition, the electrodeposited mica film formed on the surface of the rotor coil had a large unevenness in the mica fraction, and had a poor performance as a high temperature high voltage insulating structure.
본원 고안은 이와 같은 종래의 것의 결점을 제거하기 위해 이루어진 것으로, 전착조내의 전착액을 저속으로 전착조의 윗쪽에서 아래쪽으로 흐르도록 하여 피전착체의 표면에 균일한 절연층을 형성하는 전착절연장치를 제공한다.The present invention has been made to eliminate the drawbacks of such a conventional one, and provides an electrodeposition insulation device which forms a uniform insulation layer on the surface of the electrodeposited body by flowing the electrodeposition liquid in the electrodeposition tank from the upper side to the lower side of the electrodeposition vessel at a low speed. do.
다음에 본원 고안의 일실시예를 제4도에 의거하여 설명한다.Next, an embodiment of the present invention will be described with reference to FIG.
즉 제4도에 있어서, (6)은 저부가 테이퍼형으로 형성되며, 저부에 설치된 흡입구(61)와, 전착액(2)의 수위를 일정하게 유지하는 흡입구(62)를 갖는 전착조, (7)은 전착조(6)내의 전착액면과 동일한 위치에 설치된 토출노즐군, (8)은 토출노즐군(7)에 도시생략의 펌프로 이루어진 전착액 순환계통에서 순환송급되는 전착액의 토출량을 조정하는 유량조정밸브, (9)는 도시생략의 펌프로 부터의 전착액 공급계통에서 공급되는 전착액 공급용의 토출구이다.That is, in FIG. 4, (6) is an electrodeposition tank which has a bottom part formed in a tapered shape, and has a suction port 61 provided at the bottom part and a suction port 62 which keeps the level of the electrodeposition liquid 2 constant. Is a discharge nozzle group installed at the same position as the electrodeposition liquid surface in the electrodeposition tank 6, and (8) adjusts the discharge amount of the electrodeposition liquid circulated and supplied to the discharge nozzle group 7 in the electrodeposition liquid circulation system consisting of a pump (not shown). 9 is a discharge port for electrodeposition liquid supply supplied from an electrodeposition liquid supply system from a pump (not shown).
여기서 전착액 공급계통은 전착조(6)내에서 전착에 의해서 소비되는 전착액을 공급하고 전착액면을 일정하게 유지하기 위한 것이다.Here, the electrodeposition liquid supply system is for supplying the electrodeposition liquid consumed by electrodeposition in the electrodeposition tank 6 and for maintaining the electrodeposition liquid surface constant.
그리고 그밖의 구성은 제1도에 나타낸 종래의 것과 같으므로 설명을 생략한다.In addition, since the other structure is the same as the conventional thing shown in FIG. 1, it abbreviate | omits description.
이와 같이 구성된 것에서는 전착조(6)내의 전착액은 흡입구(61)에서 도시 생략의 펌프에 의해서 순환되며, 유량조정밸브(8)를 거쳐 유량조정되어 토출노즐군(7)에서 토출된다.In this structure, the electrodeposition liquid in the electrodeposition tank 6 is circulated by the pump of illustration not shown in the inlet 61, and flow volume is adjusted through the flow regulating valve 8, and it is discharged from the discharge nozzle group 7. As shown in FIG.
여기서 전착액의 토출량을 ℓ(m3/분), 전착조의 유효단면적을 S라고 하면, 조내를 상부에서 하부로 흐르는 전착액의 평균유속 V2(m/분)는 V4=(m/분)으로 된다. 한편 전착운모 절연에 사용하는 운모편은 직경 0.5㎜ 이하, 아스펙트비 1000정도의 매우 얇은 운모입자이기 때문에, 수중에서는 10수초-수시간으로 조의 저부에 침전한다.Here, if the discharge amount of the electrodeposition liquid is l (m 3 / min) and the effective cross-sectional area of the electrodeposition tank is S, the average flow velocity V 2 (m / min) of the electrodeposition liquid flowing from the upper part to the lower part of the tank is V 4 = (m / min). On the other hand, since the mica pieces used for electrodeposited mica insulation are very thin mica particles having a diameter of 0.5 mm or less and an aspect ratio of about 1000, they settle in the bottom of the tank in water for 10 seconds to several hours.
이 운모편의 침전속도를 V5(m/분)이라고 하면, 전착액류증의 운모편 유속 V6은 V6= V4+ V5(m/분)으로 된다. 또한 운모편은 침전하는데 따라서 조의 저부가 테이퍼형으로 되어 있으므로 조의 저부에 고이는 일없이 저속도로 순환한다.When the mica convenience settling velocity as V 5 (m / min), mica piece velocity V 6 of the electrodeposition solution is to ryujeung V 6 = V 4 + V 5 (m / min). In addition, as the mica pieces settle, the bottom of the bath is tapered, so the mica circulates at low speed without accumulating at the bottom of the bath.
이와 같이 구성된 것에서는 운모편의 평균유속을 1(m/분) 이하로 조정할 수 있으며, 전착조내의 운모편 분포보다도 보다 균일한 것으로 할 수 있다.In this configuration, the average flow velocity of the mica pieces can be adjusted to 1 (m / min) or less, and more uniform than the mica piece distribution in the electrodeposition tank.
이와같이 전착액중의 운모편의 운동에너지가 작은 것은 전극인 코일의 전체면에 운모편이 평행으로 석출할 수 있는 것 및 전착액중의 운모분율이 균일한 것과 아울러서 운보분율이 균일한 전착운모 절연 피막을 코일 전체면에 석출시키는 것이 가능하게 된다.The kinetic energy of the mica pieces in the electrodeposited liquid is such that the mica pieces can be deposited in parallel on the entire surface of the coil as an electrode, and the mica fraction in the electrodeposited liquid is uniform, and the electrodeposited mica insulating film is uniform. It becomes possible to deposit on the coil whole surface.
즉 코일 각부에서 석출된 운모분율이 종래의 것에서는 제5도에 나타낸 것처럼 65-90％인데 대해, 제6도에 나타낸 것처럼 80-90％가 된다.In other words, the mica fraction precipitated at each coil portion is 65-90% in the conventional one as shown in FIG. 5, but becomes 80-90% as shown in FIG.
이와같이 해서 형성된 회전기코일의 전착운모 절연피막은 운모분율이 균일하며, 분율도 높고 더구나 무기질인 운모로 구성되기 때문에, 고온 고전압용의 H종, C종 등의 절연에 적합하다.The electrodeposited mica insulating film of the rotor coil thus formed has a uniform mica fraction, a high fraction, and is composed of inorganic mica, which is suitable for insulation of Class H and Class C for high temperature and high voltage.
또 한번의 전착에 의해서 코일 전체면에 절연층을 실시할 수 있으므로, 생산원가가 저감된다.The electrodeposition layer can be applied to the entire surface of the coil by another electrodeposition, thereby reducing the production cost.
또한 전착액을 자동공급할 수 있으므로, 자동처리가 가능해져서 생산원가가 염가로 된다.In addition, the electrodeposition liquid can be automatically supplied, which enables automatic processing, resulting in low production costs.
상기와 같이 본원 고안에 의한 전착절연장치는 피전착체를 수용하는 전착조의 상부에서 전착액을 송급하여 저부로부터 배출해서 순환하는 동시에 전착액을 보급하여 전착액의 액면을 일정하게 유지하도록 했으므로, 균일한 절연층을 용이하게 얻을 수 있다.As described above, the electrodeposition insulation device according to the present invention supplies the electrodeposition liquid at the upper part of the electrodeposition tank containing the electrodeposited body, discharges it from the bottom, circulates, and supplies the electrodeposition liquid to maintain the liquid level of the electrodeposition liquid uniformly. An insulating layer can be obtained easily.
Claims (3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57043538A JPS58158808A (en) | 1982-03-15 | 1982-03-15 | Electrodeposition insulating device |
| JP57-43538 | 1982-03-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR840005523U KR840005523U (en) | 1984-10-20 |
| KR900003233Y1 true KR900003233Y1 (en) | 1990-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019830002133U KR900003233Y1 (en) | 1982-03-15 | 1983-03-11 | Electro-deposition insulating device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS58158808A (en) |
| KR (1) | KR900003233Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2709106B2 (en) * | 1988-12-06 | 1998-02-04 | 極東開発工業株式会社 | Electroplated bathtub for dump truck packing boxes |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1342005A (en) * | 1971-08-11 | 1973-12-25 | Rowland M C | Photocathodes |
| JPS4910521U (en) * | 1972-04-26 | 1974-01-29 |
-
1982
- 1982-03-15 JP JP57043538A patent/JPS58158808A/en active Pending
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1983
- 1983-03-11 KR KR2019830002133U patent/KR900003233Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR840005523U (en) | 1984-10-20 |
| JPS58158808A (en) | 1983-09-21 |
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