KR890010092A - Liquid Epoxy Resin Composition - Google Patents

Liquid Epoxy Resin Composition Download PDF

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Publication number
KR890010092A
KR890010092A KR870014438A KR870014438A KR890010092A KR 890010092 A KR890010092 A KR 890010092A KR 870014438 A KR870014438 A KR 870014438A KR 870014438 A KR870014438 A KR 870014438A KR 890010092 A KR890010092 A KR 890010092A
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South Korea
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epoxy resin
resin composition
liquid
weight
group
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KR870014438A
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Korean (ko)
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KR950006811B1 (en
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도미오 노베
시게오 다까쯔지
쇼우지 다니
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무라이 고우이찌
신니홍리까가부시끼가이샤
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Priority to KR1019870014438A priority Critical patent/KR950006811B1/en
Publication of KR890010092A publication Critical patent/KR890010092A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음No content

Description

액상 에폭시수지 조성물Liquid Epoxy Resin Composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (10)

(A) 에폭시수지, (B) 액상카르본산 무수물, (C)수화알루미나 및 탄산칼슘을 함유하는 무기충전제, (D) 유기포스핀 화합물 및 (E) 유기인산 에스테르를 배합하여 되는 것을 특징으로 하는 액상에폭시수지 조성물.(A) an epoxy resin, (B) liquid carboxylic anhydride, (C) an inorganic filler containing hydrated alumina and calcium carbonate, (D) an organic phosphine compound, and (E) an organic phosphate ester. Liquid epoxy resin composition. 제1항에 있어서, 에폭시 수지(A)가 액상 에폭시수지로서, 그 에폭시 당량이 최대 250인 것을 특징으로 하는 액상세폭시수지 조성물.The liquid fine resin composition according to claim 1, wherein the epoxy resin (A) is a liquid epoxy resin, the epoxy equivalent of which is at most 250. 제1항에 있어서, 액상 카르본산 무수물(B)가 25℃에서 액상인 것을 특징으로 하는 액상 에폭시수지조성물.The liquid epoxy resin composition according to claim 1, wherein the liquid carboxylic anhydride (B) is liquid at 25 ° C. 제1항에 있어서, 액상 카르본산 무수물(B)가 메틸 테트라히드로무수프탈산인 것을 특징으로 하는 액상 에폭시수지 조성물.The liquid epoxy resin composition according to claim 1, wherein the liquid carboxylic anhydride (B) is methyl tetrahydrophthalic anhydride. 제1항에 있어서, 액상 카르본산 무수물(B)가 3-메틸 테트라히드로무수프탈산을 50중량% 이상 함유하는 것임을 특징으로 하는 액상 에폭시수지 조성물The liquid epoxy resin composition according to claim 1, wherein the liquid carboxylic anhydride (B) contains 50% by weight or more of 3-methyl tetrahydrophthalic anhydride. 제1항에 있어서, 에폭시수지(A) 100중량부에 대하여, 무기충전제로서 (B)수화알루미나를 65-160 중량부 및 탄산칼슘을 55-150중량부 배합함을 특징으로 하는 액상에폭시수지 조성물.The liquid epoxy resin composition according to claim 1, wherein 65 to 160 parts by weight of (B) hydrated alumina and 55 to 150 parts by weight of calcium carbonate are blended with respect to 100 parts by weight of the epoxy resin (A). . 제1항에 있어서, 에폭시 수지(A) 100중량부에 대하여, 무기충전제(B)수화알루미나를 65-160 중량부, 탄산칼슘을 55-150중량부 및 이산화규소를 0~75중량부를 배합하고, 단 수화알루미나와 이산화규소의 합계량이 160중량을 넘지 않음을 특징으로 하는 액상에폭시수지 조성물.The amount of the inorganic filler (B) hydrated alumina, 65-160 parts by weight of calcium carbonate, 55-150 parts by weight of calcium carbonate and 0-75 parts by weight of silicon dioxide are added to 100 parts by weight of the epoxy resin (A). However, the liquid epoxy resin composition, characterized in that the total amount of hydrated alumina and silicon dioxide does not exceed 160 weight. 제1항에 있어서, 유기 포스핀 화합물이 아릴 포스핀 화합물임을 특징으로 하는 액상 에폭시 수지 조성물.The liquid epoxy resin composition according to claim 1, wherein the organic phosphine compound is an aryl phosphine compound. 제8항에 있어서, 아릴포스핀 화합물이 트리페닐포스핀임을 특징으로 하는 액상 에폭시수지 조성물.The liquid epoxy resin composition of claim 8, wherein the arylphosphine compound is triphenylphosphine. 제8항에 있어서, 유기인산에스테르가 일반식The method of claim 8, wherein the organophosphate ester is of the general formula [식중, R4및 R5는 동일 또는 상이하며, 수소원자 또는 기을 나타내는데, 여기서 R6는 탄소수 3-22의 알킬기, 탄소수 3-22의 알캐닐기, 시클로헥실기, 페닐기, 치환기로서 탄소수 1~18의 알킬기를 갖는 페닐기, 아크릴기 또는 메타크릴기를 나타내고, R7는 수소원자 또는 메틸기를 나타내며, n은 0또는 1~30의 정수를 나타내고, 단 R4및 R5는 동시에 수소가 아니다.]로 나타내어지는 모노 및/또는 디유기인산에스테르임을 특징으로 하는 액상에폭시수지 조성물.[Wherein, R 4 and R 5 are the same or different and represent a hydrogen atom or a group R 6 represents an alkyl group having 3 to 22 carbon atoms, an alkanyl group having 3 to 22 carbon atoms, a cyclohexyl group, a phenyl group, a phenyl group having an alkyl group having 1 to 18 carbon atoms as a substituent, an acryl group or a methacryl group, and R 7 Represents a hydrogen atom or a methyl group, n represents an integer of 0 or 1 to 30, provided that R 4 and R 5 are not hydrogen at the same time.] Mono- and / or diorganophosphate ester represented by Resin composition. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870014438A 1987-12-17 1987-12-17 Liquid epoxy resin composition KR950006811B1 (en)

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Application Number Priority Date Filing Date Title
KR1019870014438A KR950006811B1 (en) 1987-12-17 1987-12-17 Liquid epoxy resin composition

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Application Number Priority Date Filing Date Title
KR1019870014438A KR950006811B1 (en) 1987-12-17 1987-12-17 Liquid epoxy resin composition

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KR890010092A true KR890010092A (en) 1989-08-05
KR950006811B1 KR950006811B1 (en) 1995-06-22

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KR1019870014438A KR950006811B1 (en) 1987-12-17 1987-12-17 Liquid epoxy resin composition

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