KR890010088A - Thermosetting resin composition for molding - Google Patents

Thermosetting resin composition for molding Download PDF

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Publication number
KR890010088A
KR890010088A KR1019870015568A KR870015568A KR890010088A KR 890010088 A KR890010088 A KR 890010088A KR 1019870015568 A KR1019870015568 A KR 1019870015568A KR 870015568 A KR870015568 A KR 870015568A KR 890010088 A KR890010088 A KR 890010088A
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KR
South Korea
Prior art keywords
resin composition
thermosetting resin
parts
weight
molding thermosetting
Prior art date
Application number
KR1019870015568A
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Korean (ko)
Other versions
KR900005205B1 (en
Inventor
여종기
김청수
이동재
장성훈
Original Assignee
허신구
주식회사 럭키
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 허신구, 주식회사 럭키 filed Critical 허신구
Priority to KR1019870015568A priority Critical patent/KR900005205B1/en
Priority to US07/289,308 priority patent/US5004774A/en
Priority to JP63332698A priority patent/JPH01301751A/en
Publication of KR890010088A publication Critical patent/KR890010088A/en
Application granted granted Critical
Publication of KR900005205B1 publication Critical patent/KR900005205B1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/24—Homopolymers or copolymers of amides or imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

내용 없음No content

Description

성형용 열경화성 수지 조성물Thermosetting resin composition for molding

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (6)

분자량 600-1600, 연화점 40-110℃인 비스말레이미드에 방향족 1차 및 2차 디아민이 부가반응된 변성 비스말레이미드 수지 20-60중량부, 무기충전재 40-80 중량부, 실리콘 오일 0.8-25중량부 및 유기 과산화물과 이미다졸 유도체로 구성된 혼합촉매 0.5-5.0 중량부로 구성된 것임을 특징으로 하는 성형용 열경화성 수지 조성물.20-60 parts by weight of modified bismaleimide resin in which bismaleimide with a molecular weight of 600-1600 and a softening point of 40-110 ° C. is added to aromatic primary and secondary diamines, 40-80 parts by weight of inorganic filler, and 0.8-25 parts of silicone oil. Molding thermosetting resin composition, characterized in that consisting of 0.5 to 5.0 parts by weight of mixed catalyst consisting of parts by weight and organic peroxide and imidazole derivatives. 제1항에 있어서, 변성 비스말레이미드 수지는 비스말레이미드와 방향족 1차 디아민 및 방향족 2차 디아민을 1.2:1-10:1의 몰비로 마이클 부가반응시킨 것을 특징으로 하는 성형용 열경화성 수지 조성물.The molding thermosetting resin composition according to claim 1, wherein the modified bismaleimide resin is Michael addition reaction of bismaleimide with aromatic primary diamine and aromatic secondary diamine in a molar ratio of 1.2: 1-10: 1. 제1항에 있어서, 변성 비스말레이미드 수지에 부가된 방향족 디아민은 1차 디아민과 2차 디아민의 몰비는1:9-9:1인 것을 특징으로 하는 성형용 열경화성 수지 조성물.The molding thermosetting resin composition according to claim 1, wherein the molar ratio of the primary diamine and the secondary diamine in the aromatic diamine added to the modified bismaleimide resin is 1: 9-9: 1. 제1항에 있어서, 무기충전재는 산화실리콘, 탄산칼슘, 알루미나, 용융실리카, 결정성실리카, 유리섬유, 탄소섬유, 그라파이트, 석고,흑연, 타트, 마이카, 규사, 카오린, 수산화알루미늄, 석면단독 또는 2종 이상임을 특징으로 하는 성형용 열경화성 수지 조성물.The method of claim 1, wherein the inorganic filler is silicon oxide, calcium carbonate, alumina, molten silica, crystalline silica, glass fiber, carbon fiber, graphite, gypsum, graphite, tart, mica, silica sand, kaolin, aluminum hydroxide, asbestos alone or Molding thermosetting resin composition, characterized in that two or more. 제1항에 있어서, 실리콘 오일은 아민 관능기를 가진(25℃)에서 점도가 500-1,000,000CPS인 것임을 특징으로 하는 성형용 열경화성 수지 조성물.The molding thermosetting resin composition according to claim 1, wherein the silicone oil has a viscosity of 500-1,000,000 CPS at 25 ° C. with an amine function. 제1항 또는 5항에 있어서, 혼합촉매중 유기과산화물과 이미다졸 유도체의 사용비는 1:5-5:1임을 특징으로 하는 성형용 열경화성 수지 조성물.The molding thermosetting resin composition according to claim 1 or 5, wherein the ratio of the organic peroxide and imidazole derivative in the mixed catalyst is 1: 5-5: 1. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870015568A 1987-12-29 1987-12-31 Thermosetting resin composition for molding KR900005205B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019870015568A KR900005205B1 (en) 1987-12-31 1987-12-31 Thermosetting resin composition for molding
US07/289,308 US5004774A (en) 1987-12-29 1988-12-23 Thermosetting polyimide resin composition
JP63332698A JPH01301751A (en) 1987-12-29 1988-12-28 Thermosetting polyimide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019870015568A KR900005205B1 (en) 1987-12-31 1987-12-31 Thermosetting resin composition for molding

Publications (2)

Publication Number Publication Date
KR890010088A true KR890010088A (en) 1989-08-05
KR900005205B1 KR900005205B1 (en) 1990-07-21

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Application Number Title Priority Date Filing Date
KR1019870015568A KR900005205B1 (en) 1987-12-29 1987-12-31 Thermosetting resin composition for molding

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100063241A1 (en) * 2008-09-09 2010-03-11 Spirit Aerosystems, Inc. High performance polyaspartimide resin

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KR900005205B1 (en) 1990-07-21

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