KR890005874Y1 - Panel for underfloor heating - Google Patents
Panel for underfloor heating Download PDFInfo
- Publication number
- KR890005874Y1 KR890005874Y1 KR2019870000494U KR870000494U KR890005874Y1 KR 890005874 Y1 KR890005874 Y1 KR 890005874Y1 KR 2019870000494 U KR2019870000494 U KR 2019870000494U KR 870000494 U KR870000494 U KR 870000494U KR 890005874 Y1 KR890005874 Y1 KR 890005874Y1
- Authority
- KR
- South Korea
- Prior art keywords
- hot water
- heat transfer
- water pipe
- heat
- transfer plate
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D3/00—Hot-water central heating systems
- F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
- F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
- F24D3/148—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor with heat spreading plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/06—Casings, cover lids or ornamental panels, for radiators
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Steam Or Hot-Water Central Heating Systems (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 전열판부분 예시도.1 is an exemplary view of the heat transfer plate portion of the present invention.
제2도는 제1도의 종단면도.2 is a longitudinal cross-sectional view of FIG.
제3도는 본 고안의 전열판에 충진제를 충입한 사시도.Figure 3 is a perspective view of the filler filled in the heat transfer plate of the present invention.
제4도는 본 고안의 배관상태 예시도.Figure 4 is an exemplary view of the piping state of the present invention.
제5도는 본 고안의 양단연결구조 예시도.Figure 5 is an illustration of both ends of the connection structure of the present invention.
제6도는 본 고안의 전열덮개의 사시도이다.6 is a perspective view of a heat shield of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 전열판(금속재) 2, 2a : 온수파이프제치대1: Heat transfer plate (metal material) 2, 2a: Hot water pipe preparation stand
3, 3a : 내향돌출부 1a : 합성수지제피복물3, 3a: inward protrusion 1a: synthetic resin coating
4, 4a : 요입홈 5 : 나사공4, 4a: recess groove 5: screw hole
6 : 충진제(광물질) 7 : 온수파이프6: filler (mineral) 7: hot water pipe
8 : 전열성덮개 8a : 합성수지제피복물8: heat insulating cover 8a: synthetic resin coating
9 : 나사못 10 : 못구멍9: screw 10: nail hole
본 고안은 온수난방에 사용하는 전열배관판에 관한 것으로, 난방용파이프의 배관이 용이하고, 온수파이프의 열기를 방바닥전체에 골고루 전열시켜 에너지의 이용을 보다 합리적으로 확산할수 있게한 것이다.The present invention relates to a heat transfer pipe plate used for hot water heating, and the piping of the heating pipe is easy, and the heat of the hot water pipe is evenly heat-transmitted throughout the floor to enable more efficient use of energy.
종래의 온수파이프용 배관판은 시멘트나 합성수지제로 되어서 온수파이프를 안전하게 매설시킬수 있는 장점은 있으나 온수파이프가 설치된 부분에서 직상부로만 열기가 발산되어 방바닥이 골고루 따뜻하지않은 불편이 있었다.Conventional hot pipe pipe plate is made of cement or synthetic resin has the advantage of being able to safely embed the hot water pipe, but the heat dissipated only upstream from the hot water pipe is installed, there was an inconvenience that the floor is not evenly warm.
본 고안은 위와같은 종래의 결점을 시정하기 위하여 안출한 것으로 이를 보다 상세히 설명하면 다음과 같다.The present invention has been devised to correct the above-described drawbacks, which will be described in more detail as follows.
금속판으로된 전열판(1)의 양측벽하단에서 외측으로 온수파이프의 반경과 비슷한 폭으로 온수 파이프제치대(2) (2a)를 돌설하고, 내향측으로 내향돌출부(3) (3a)를 형성하며, 상면양측으로 요입홈(4) (4a)을 형성하여 요입홈을 따라 나사공(5)을 뚫고, 전열판 외면에 내열성합성수지제 피복물(1a)를 피복시킨다음 전열판(1)의 내부공간에 광물질로된 충진제(6)를 내장하여 일체로 형성시키고, 길이방향으로 연결부를 만들어서 별도사출물로된 홈통연결자(11)를 연결케하여 요입홈(4) (4a)위에 전열덮개(7)를 덮어 나사못으로 고정할수 있게한 구조이다.From the lower end of both side walls of the heat transfer plate (1) made of a metal plate, the hot water pipe rests (2) (2a) are projected outwardly in a width similar to the radius of the hot water pipe, and the inward protrusions (3) (3a) are formed inwardly. The concave grooves (4) (4a) are formed on both sides of the upper surface to drill the screw holes (5) along the concave grooves, and the heat-resistant synthetic resin coating (1a) is coated on the outer surface of the heat transfer plate, and then the inner space of the heat transfer plate (1) Built-in filler (6) to form integrally, and make a connection in the longitudinal direction to connect the trough connector 11 as a separate injection to cover the heat cover (7) on the inlet groove (4) (4a) with a screw It is a structure that can be fixed.
이와같이된 본 고안은 온수파이프를 설치하고저하는 곳을 평탄하게 시공한다음 그 표면에 전열판(1)을 나란히 펼치면 양측의 온수파이프제치대(2) (2a)가 서로 연결되어 온수파이프(7) 함장홈이 형성되고, 양단에 홈통연결자(11)를 연결시키면 온수파이프(7)를 배관할 수 있으므로 온수파이프를 배관한후 그위에 전열덮개(7)를 덮어 전열판(1)과 나사못(9)으로 나착시키면 온돌이 완성되므로 온수 파이프에서 발생되는 열기가 전열판(1)과 전열 덮개(7)를 통해 방바닥에 골고루 퍼지게되어 방이 골고루 따뜻하게되는 효과가 있으며, 전열판(1) 저부에 충진제(6)가 내장되어 서로 결착이되어 한 몸체가 되므로 하중을 받아도 붕괴되지 않으며, 열기가 머금게되면 빨리 식지않게되어서 보열효과가 높은 바닥제역할을 하게되고, 방습효과까지 발휘할수 있는 장점이 있도록되고, 전열판(1)의 양단부에는 홈통연결자(11)을 연결하도록 하였기때문에 배관형태에 따라 변형시킬수가 용이하여 실용성과 경제성이 높은 효율이 높고 내구성이 큰 온수난방용 배관판을 얻을수 있는 이점이 있는 것이다.According to the present invention, the hot water pipe is installed and installed in a flat place, and then the heat transfer plate 1 is spread side by side on the surface of the hot water pipe stand (2) (2a) connected to each other so that the hot water pipe (7) Captain groove is formed, and connecting the gutter connector 11 at both ends can pipe the hot water pipe (7), so after piping the hot water pipe, cover the heat cover (7) on the heat transfer plate (1) and screw (9) If it is attached to the ondol is completed, the heat generated from the hot water pipe is spread evenly on the floor through the heat transfer plate (1) and the heat transfer cover (7) has an effect that the room is evenly warm, the filler (6) at the bottom of the heat transfer plate (1) Because it is built and bound together, it becomes one body, so it doesn't collapse even under load. Since the trough connector 11 is connected to both ends of the heat transfer plate 1, it is easy to be deformed according to the pipe type, and thus, there is an advantage that a high efficiency and high efficiency and high durability of the hot water heating pipe plate can be obtained. will be.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019870000494U KR890005874Y1 (en) | 1987-01-15 | 1987-01-15 | Panel for underfloor heating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019870000494U KR890005874Y1 (en) | 1987-01-15 | 1987-01-15 | Panel for underfloor heating |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880015208U KR880015208U (en) | 1988-09-15 |
KR890005874Y1 true KR890005874Y1 (en) | 1989-08-30 |
Family
ID=19259064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019870000494U KR890005874Y1 (en) | 1987-01-15 | 1987-01-15 | Panel for underfloor heating |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR890005874Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015088165A1 (en) * | 2013-12-10 | 2015-06-18 | 케이제이알디(주) | Heating floor panel and panel unit |
-
1987
- 1987-01-15 KR KR2019870000494U patent/KR890005874Y1/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015088165A1 (en) * | 2013-12-10 | 2015-06-18 | 케이제이알디(주) | Heating floor panel and panel unit |
Also Published As
Publication number | Publication date |
---|---|
KR880015208U (en) | 1988-09-15 |
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E701 | Decision to grant or registration of patent right | ||
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