KR890003008A - Bonding Wire - Google Patents

Bonding Wire Download PDF

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Publication number
KR890003008A
KR890003008A KR1019870007830A KR870007830A KR890003008A KR 890003008 A KR890003008 A KR 890003008A KR 1019870007830 A KR1019870007830 A KR 1019870007830A KR 870007830 A KR870007830 A KR 870007830A KR 890003008 A KR890003008 A KR 890003008A
Authority
KR
South Korea
Prior art keywords
bonding wire
semiconductor devices
gold
bonding
barium
Prior art date
Application number
KR1019870007830A
Other languages
Korean (ko)
Other versions
KR910009479B1 (en
Inventor
가즈오 요꼬하마
야다마사히로
겐니찌 히라노
Original Assignee
아사다 에이이찌
쇼우에 이가가구 고우교우 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사다 에이이찌, 쇼우에 이가가구 고우교우 가부시기가이샤 filed Critical 아사다 에이이찌
Priority to KR1019870007830A priority Critical patent/KR910009479B1/en
Publication of KR890003008A publication Critical patent/KR890003008A/en
Application granted granted Critical
Publication of KR910009479B1 publication Critical patent/KR910009479B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음No content

Description

본딩와이어Bonding Wire

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (2)

0.0003~0.01wt.%의 바륨과 나머지 부분은 금으로 되고, 본딩용 와이어의 금 순도는 99.99% 이상인 반도체 디바이스용 본딩와이어.Bonding wires for semiconductor devices having 0.0003 to 0.01 wt.% Of barium and the remainder being gold, and the gold purity of the bonding wire is 99.99% or more. 특허청구의 범위 제 1 항에 있어서, 알루미늄 0.0005~0.005wt.%, 칼슘 0.0001~0.003wt.%, 은 0.0005~0.005wt.%중 적어도 1 종 이상의 원소를 더 포함하고, 본딩용 와이어에서 바륨과 상기 원소의 합계 함유랑이 0.01%이하인 반도체 디바이스용 본딩와이어.The method of claim 1, further comprising at least one element of 0.0005 to 0.005 wt.% Of aluminum, 0.0001 to 0.003 wt.% Of calcium, and 0.0005 to 0.005 wt.% Of silver. Bonding wire for semiconductor devices whose sum total content of the said element is 0.01% or less. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870007830A 1987-07-20 1987-07-20 Bonding wire KR910009479B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019870007830A KR910009479B1 (en) 1987-07-20 1987-07-20 Bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019870007830A KR910009479B1 (en) 1987-07-20 1987-07-20 Bonding wire

Publications (2)

Publication Number Publication Date
KR890003008A true KR890003008A (en) 1989-04-12
KR910009479B1 KR910009479B1 (en) 1991-11-16

Family

ID=19263108

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870007830A KR910009479B1 (en) 1987-07-20 1987-07-20 Bonding wire

Country Status (1)

Country Link
KR (1) KR910009479B1 (en)

Also Published As

Publication number Publication date
KR910009479B1 (en) 1991-11-16

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Payment date: 19970822

Year of fee payment: 12

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