KR880003395A - Wafer handling arms - Google Patents

Wafer handling arms Download PDF

Info

Publication number
KR880003395A
KR880003395A KR870004070A KR870004070A KR880003395A KR 880003395 A KR880003395 A KR 880003395A KR 870004070 A KR870004070 A KR 870004070A KR 870004070 A KR870004070 A KR 870004070A KR 880003395 A KR880003395 A KR 880003395A
Authority
KR
South Korea
Prior art keywords
cam
arm
arm member
path
semiconductor substrate
Prior art date
Application number
KR870004070A
Other languages
Korean (ko)
Inventor
에스. 웨인버그 리챠드
Original Assignee
스탠리 젯드. 코울
배리언 어소시에이츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스탠리 젯드. 코울, 배리언 어소시에이츠 인코포레이티드 filed Critical 스탠리 젯드. 코울
Publication of KR880003395A publication Critical patent/KR880003395A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

내용 없음No content

Description

웨이퍼 취급 아암Wafer handling arms

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 따른 시스템의 한 실시예의 개략적인 부분평면도.1 is a schematic partial plan view of one embodiment of a system according to the invention.

제2도는 제1도에 도시한 시스템의 부분사시도.2 is a partial perspective view of the system shown in FIG.

제3도는 본 발명에 따른 시스템의 제2실시예의 개략적인 부분평면도.3 is a schematic partial plan view of a second embodiment of a system according to the invention.

Claims (10)

제1캠과, 제2캠과, 상기 제1캠의 외주상의 제1고정점으로 부터 상기 제2캠의 외주의 일부를 돌아상기 제1캠의 외주상의 제2고정점까지 연장하며, 상기 제2캠상에 제3고정점을 갖는 매끄러운 벨트와, 제1단부 및 제2단부를 갖고, 상기 제1단부에서 상기 제1캠상에 회전가능하게 장착되는 제1아암부재와, 제1단부 및 제2단부를 갖고, 상기 제2단부가 반도체 기판을 보유 지지해주도록 된 제2아암부재와, 상기 제2아암부재의 제1단부와 상기 제2캠을 견고하게 연결해주며, 상기 제1아암부재의 상기 제2단부를 통과하는 샤프트 및, 고정되는 상기 제1캠에 대해 상기 제1아암부재를 회전시시켜주는 수단을 포함하고, 상기 제1캠에 대한 제1방향으로의 제1아암부재의 회전으로 인해 상기 벨트가 상기 제1캠에 감기고 풀려지므로서 상기 제2캠과 거기에 단단히 부착된 상기 제2아암부재를 회전시켜서 상기 제2아암부재의 상기 제2단부가 그일부에 걸쳐 대략 선형을 이루는 경로를 따라 상기 제1캠쪽을 향해 이동되게 하며, 상기 제1캠에 대한 제2방향으로서의 제1아암부재의 회전으로 인해 상기 벨트가 상기 제1캠에 풀리고 감기고 하므로서 상기 제2캠과 거기에 단단히 부착된 상기 제2아암부재를 회전시켜서 상기 제2아암부재의 상기 제2단부가 그 일부에 걸쳐 대략 선형을 이루는 경로를 따라 상기 제1캠쪽으로 부터 멀어지게 이동되게 한 것을 특징으로 하는 반도체 기판 운반 아암.Extends a part of the outer periphery of the second cam from the first fixed point on the outer periphery of the first cam to the second fixed point on the outer periphery of the first cam; 2 a smooth belt having a third fixing point on the cam, a first arm member having a first end and a second end and rotatably mounted on the first cam at the first end, and the first end and the second end. A second arm member having an end portion, wherein the second end portion is configured to hold a semiconductor substrate, and firmly connects the first end portion of the second arm member and the second cam, A shaft passing through the second end and means for rotating the first arm member relative to the fixed first cam, the rotation of the first arm member in a first direction relative to the first cam. As the belt is wound around the first cam and released, the second cam and the image firmly attached thereto Rotating the second arm member such that the second end of the second arm member is moved toward the first cam along a substantially linear path across the portion and serving as a second direction relative to the first cam; The second end of the second arm member is rotated by rotating the second cam and the second arm member firmly attached thereto as the belt unwinds and winds around the first cam due to the rotation of the first arm member. And move away from the first cam along a substantially linear path over the semiconductor substrate transport arm. 제1항에 있어서, 상기 회전수단은 상기 제2아암부재의 상기 제2단부가 적어도 D/2의 길이를 갖는 경로를 따라 이동하게 해주며, 여기서 D는 상기 제1캠에 대한 상기 제1아암부재의 회전축과 상기 샤프트의 회전축 사이의 거리인 것을 특징으로 하는 반도체 기판 운반 아암.The method of claim 1, wherein the rotating means causes the second end of the second arm member to move along a path having a length of at least D / 2, where D is the first arm relative to the first cam. And a distance between the axis of rotation of the member and the axis of rotation of the shaft. 제2항에 있어서, 상기 경로의 일부가 적어도 D/2인 것을 특징으로 하는 반도체 기판 운반 아암.The semiconductor substrate transport arm of claim 2, wherein a portion of the path is at least D / 2. 제1항에 있어서, 상기 제2캠은 원형이고, 상기 제1캠은 상기 제1방향으로의 상기 제1아암 부재의 회전이 그 초기 일부에 걸쳐 대략 선형을 이루는 상기 경로를 따라 상기 제1캠쪽으로 상기 제2아암 부재의 상기 제2단부를 이동시킬 수 있도록 상기 제2캠에 관련하여 칫수가 정해지는 것을 특징으로 하는 반도체 기판 운반 아암.2. The first cam of claim 1, wherein the second cam is circular and the first cam is along the path along which the rotation of the first arm member in the first direction is approximately linear over its initial portion. A dimension is determined in relation to the second cam so as to move the second end of the second arm member toward. 제1항에 있어서, 상기 제1캠과 상기 제1아암부재의 제1단부를 통과하는 축을 중심으로 동일한 선택된 각도에 걸쳐 상기 제1캠 및 상기 제1아암부재를 함께 회전시켜주는 수단을 포함하는 것을 특징으로 하는 반도체 기판 운반 아암.2. The apparatus of claim 1, comprising means for rotating the first cam and the first arm member together over the same selected angle about an axis passing through the first cam and the first end of the first arm member. A semiconductor substrate carrying arm, characterized in that. 제5항에 있어서, 상기 선택된 각도에 걸쳐 회전하는 상기 수단은 90°,180°,270°및 360°,-90°-180°-270°및 -360°에 걸쳐 회전하는 수단을 포함하는 것을 특징으로 하는 반도체 기판 운반 아암.The method of claim 5, wherein the means for rotating over the selected angle comprises means for rotating over 90 °, 180 °, 270 ° and 360 °, -90 ° -180 ° -270 ° and -360 °. A semiconductor substrate carrying arm. 제1항에 있어서, 상기 경로의 일부는 상기 제2아암부재의 상기 제2단부에 의해 가로지를 수 있는 최대 경로 길이의 적어도 1/2인 것을 특징으로 하는 반도체 기판 운반 아암.The semiconductor substrate transport arm of claim 1, wherein a portion of the path is at least one half of a maximum path length that can be traversed by the second end of the second arm member. 제1항에 있어서, 상기 제1고정점이 상기 제2고정점과 일치하는 것을 특징으로 하는 반도체 기판 운반 아암.The semiconductor substrate carrying arm of claim 1, wherein the first fixed point coincides with the second fixed point. 웨이퍼 보유 단부를 가진 길다란 제1아암수단과, 제1단부가 상기 제1아암 수단의 다른 단부에 회전 가능하게 결합되며, 제2단부가 지지수단에 회전 가능하게 고정되는 길다란 제2아암수단 및, 상기 지지수단에 인접한 제1위치와 상기 지지수단으로 부터 예정된 제1경로에 걸쳐 이격된 제2위치 사이로 미끄럼 또는 구름 마찰없이 상기 웨이퍼 보유단부를 연장해주기 위한 상기 제1및 제2아암 수단용 가변비 제어수단을 포함하며, 상기 제1및 제2위치들 사이의 거리가 상기 웨이퍼 직경의 적어도 몇배 정도되는 것을 특징으로 하는 예정된 경로에 걸쳐 웨이퍼를 이동하기 위한 웨이퍼 운반기.Elongated first arm means having a wafer holding end, elongated second arm means firstly rotatably coupled to the other end of the first arm means, and second end means rotatably fixed to the support means; Variable ratio for the first and second arm means for extending the wafer holding end without sliding or rolling friction between a first position adjacent the support means and a second position spaced from the support means over a predetermined first path And control means, wherein the distance between the first and second positions is at least several times the diameter of the wafer. 제9항에 있어서, 상기 제어수단은 상기 웨이퍼 보유 단부를 적어도 하나의 예정된 부가 경로에 걸쳐 이동시켜주며, 상기 부가 경로는 상기 제1경로와 동일 평면에 있는 것을 특징으로 하는 웨이퍼 운반기.10. The wafer carrier of claim 9, wherein said control means moves said wafer holding end over at least one predetermined additional path, said additional path being coplanar with said first path. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR870004070A 1986-04-28 1987-04-28 Wafer handling arms KR880003395A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85674986A 1986-04-28 1986-04-28
US856749 1986-08-05

Publications (1)

Publication Number Publication Date
KR880003395A true KR880003395A (en) 1988-05-16

Family

ID=25324414

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870004070A KR880003395A (en) 1986-04-28 1987-04-28 Wafer handling arms

Country Status (4)

Country Link
JP (1) JPS6342142A (en)
KR (1) KR880003395A (en)
DE (1) DE3714045A1 (en)
GB (2) GB8709064D0 (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3704505A1 (en) * 1987-02-13 1988-08-25 Leybold Ag INSERT UNIT FOR VACUUM SYSTEMS
DE3716549A1 (en) * 1987-05-17 1988-12-08 Leitz Ernst Gmbh HANDLING MACHINE FOR PLATE-SHAPED OBJECTS
DE3717628A1 (en) * 1987-05-26 1988-12-15 Loehr & Herrmann Gmbh DEVICE FOR INPUTING AND OUTPUTING PCBS IN SLOTED REPLACEMENT PALLETS
EP0322205A3 (en) * 1987-12-23 1990-09-12 Texas Instruments Incorporated Automated photolithographic work cell
ATE208961T1 (en) * 1988-05-24 2001-11-15 Unaxis Balzers Ag VACUUM SYSTEM
EP0419461B1 (en) * 1988-06-17 1998-09-02 Advanced Semiconductor Materials America, Inc. Wafer handling system with bernoulli pick-up
DE3822598C2 (en) * 1988-07-04 1997-09-04 Siemens Ag Adjustment arrangement and method for adjusting a gripping device of a robot arm for handling a semiconductor wafer
JP2545591B2 (en) * 1988-09-30 1996-10-23 国際電気株式会社 Wafer processing equipment
US5064340A (en) * 1989-01-20 1991-11-12 Genmark Automation Precision arm mechanism
US5241183A (en) * 1991-03-22 1993-08-31 Nippon Telegraph And Telephone Corporation Vertical xy stage
JP2751975B2 (en) * 1991-12-20 1998-05-18 株式会社日立製作所 Load lock chamber of semiconductor processing equipment
CA2094208A1 (en) * 1992-04-28 1993-10-29 Richard D. Hein Prepackaged fluid-damping article for elastomeric mounts and methods of formation and installation
CH686445A5 (en) * 1992-10-06 1996-03-29 Balzers Hochvakuum Chamber and chamber combination for a vacuum system and method for passing at least one Werkstueckes.
DE4235676C2 (en) * 1992-10-22 1997-08-28 Balzers Hochvakuum Vacuum chamber for transporting disk-shaped workpieces in a vacuum system
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
JP2801489B2 (en) * 1992-12-17 1998-09-21 古河電気工業株式会社 Ring frame automatic cleaning device
JPH06204316A (en) * 1992-12-28 1994-07-22 Mitsubishi Electric Corp Heatproof robot hand
DE4336792A1 (en) * 1993-10-28 1995-05-04 Leybold Ag Device for transporting workpieces in vacuum coating installations
DE4430844C1 (en) * 1994-08-31 1996-02-22 Jenoptik Technologie Gmbh Feeding device for semiconductor processing systems
DE4430846C2 (en) * 1994-08-31 1997-04-10 Jenoptik Jena Gmbh Device for the implementation of a transport object between two end positions
DE19812670A1 (en) * 1998-03-23 1999-10-07 Singulus Technologies Ag Substrate transport equipment especially for transporting substrates, e.g. CDs or DVDs, between stations in a sputter coating chamber
US6277753B1 (en) 1998-09-28 2001-08-21 Supercritical Systems Inc. Removal of CMP residue from semiconductors using supercritical carbon dioxide process
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
JP3883929B2 (en) 2001-09-25 2007-02-21 大日本スクリーン製造株式会社 Thin film forming apparatus and thin film forming method
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
US7789971B2 (en) 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
JP4098338B2 (en) 2006-07-20 2008-06-11 川崎重工業株式会社 Wafer transfer device and substrate transfer device
CN101929535A (en) * 2009-10-29 2010-12-29 浙江大学 Method and device for realizing planar reciprocating motion by using cams and planar band
US9149936B2 (en) 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
WO2014113364A1 (en) * 2013-01-18 2014-07-24 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
CN107408526B (en) * 2015-03-12 2022-03-15 柿子技术公司 Robot with driven end effector movement
KR102145848B1 (en) * 2018-11-02 2020-08-19 세메스 주식회사 Die transfer module and die bonding apparatus having the same

Also Published As

Publication number Publication date
JPS6342142A (en) 1988-02-23
DE3714045A1 (en) 1987-11-05
GB2193482A (en) 1988-02-10
GB8709064D0 (en) 1987-05-20
GB8709595D0 (en) 1987-05-28

Similar Documents

Publication Publication Date Title
KR880003395A (en) Wafer handling arms
KR950021340A (en) Turntable for Wafer Carrier Rotation
US4198871A (en) Transducer positioning apparatus
KR920015502A (en) Wafer Transfer Device
KR950031399A (en) Industrial Robot
KR930017792A (en) Holders for conveying devices for transporting one or several prints
RU95113604A (en) Regulating device for supporting member positioned within seat for rotation in vertical plane
RU93045142A (en) DEVICE FOR PROCESSING A PIPELINE
KR910010795A (en) Taping Device and Taping System
KR880014228A (en) Dual eccentric fixture
JPS6055896B2 (en) Recording and or playback equipment
KR880014540A (en) Magnetic recording and playback equipment
KR910017921A (en) Assembly device and assembly method of the workpiece
SE9000662L (en) CONTROL FOR A RINSE MACHINE FOR STAND FORMATS
KR950700209A (en) A METHOD OF AND A DEVICE FOR WINDING A WIRE-LIKE PRODUCT ON A FLANGED REEL
JPH0324528Y2 (en)
KR840004021A (en) Traverse winding device of long material
BR8807887A (en) DEVICE FOR DETERMINING SPEED, ANGLE POSITION AND ROTATION DIRECTION OF A ROTATING AXIS
DE69001186D1 (en) DEVICE WITH ROLLER AND UNWINDER TO AVOID TORSION IN THE CONNECTING CABLE OF THE ROTATING COUPLING.
DE68904056D1 (en) WIRE UNWINDING DEVICE AND UNWINDING DEVICE WITH SUCH DEVICES.
EP0219116B1 (en) Positioning device for a read/write head
KR890006458A (en) Ball detector of vehicle seat belt winding device
KR900016997A (en) Tape loading device
KR840001748A (en) Recording and playback device
KR970008618B1 (en) Tension control device of reel shift deck mechanism

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid