KR860008620A - Manufacturing method of semiconductor integrated circuit - Google Patents
Manufacturing method of semiconductor integrated circuitInfo
- Publication number
- KR860008620A KR860008620A KR1019860002820A KR860002820A KR860008620A KR 860008620 A KR860008620 A KR 860008620A KR 1019860002820 A KR1019860002820 A KR 1019860002820A KR 860002820 A KR860002820 A KR 860002820A KR 860008620 A KR860008620 A KR 860008620A
- Authority
- KR
- South Korea
- Prior art keywords
- manufacturing
- integrated circuit
- semiconductor integrated
- semiconductor
- circuit
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8222—Bipolar technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8222—Bipolar technology
- H01L21/8228—Complementary devices, e.g. complementary transistors
- H01L21/82285—Complementary vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/732—Vertical transistors
- H01L29/7322—Vertical transistors having emitter-base and base-collector junctions leaving at the same surface of the body, e.g. planar transistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60-84834 | 1985-04-19 | ||
JP60084834A JPS61242062A (en) | 1985-04-19 | 1985-04-19 | Manufacture of semiconductor integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860008620A true KR860008620A (en) | 1986-11-17 |
KR900000826B1 KR900000826B1 (en) | 1990-02-17 |
Family
ID=13841810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860002820A KR900000826B1 (en) | 1985-04-19 | 1986-04-14 | Semiconductor ic manufacturing method |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS61242062A (en) |
KR (1) | KR900000826B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63128751A (en) * | 1986-11-19 | 1988-06-01 | Sanyo Electric Co Ltd | Vertical-type pnp transistor |
-
1985
- 1985-04-19 JP JP60084834A patent/JPS61242062A/en active Granted
-
1986
- 1986-04-14 KR KR1019860002820A patent/KR900000826B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR900000826B1 (en) | 1990-02-17 |
JPH0451067B2 (en) | 1992-08-18 |
JPS61242062A (en) | 1986-10-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR860006137A (en) | Semiconductor integrated circuit | |
KR910016235A (en) | Semiconductor integrated circuit | |
KR920003832A (en) | Semiconductor device manufacturing method | |
KR860009481A (en) | Method of manufacturing a semiconductor device | |
KR860004457A (en) | Semiconductor integrated circuit device and its manufacturing method and manufacturing device | |
KR860002862A (en) | Method of manufacturing a semiconductor device | |
EP0193117A3 (en) | Method of manufacturing semiconductor device | |
HK51294A (en) | Semiconductor integrated circuit device and method of manufacturing the same | |
KR850006258A (en) | Semiconductor device manufacturing method | |
KR880004552A (en) | Semiconductor device manufacturing method | |
DE3855797D1 (en) | Integrated semiconductor circuit | |
KR860000712A (en) | Semiconductor integrated circuit and circuit pattern design method | |
KR880006786A (en) | Method of manufacturing a semiconductor device | |
KR860006832A (en) | Method of manufacturing a semiconductor device | |
KR860005437A (en) | Method of manufacturing a semiconductor device | |
KR860000710A (en) | Semiconductor device manufacturing method | |
KR860009487A (en) | Redundant circuit of semiconductor device | |
KR880008418A (en) | Method of manufacturing a semiconductor device | |
KR890015418A (en) | Semiconductor integrated circuit and its manufacturing method | |
KR870000758A (en) | Method of manufacturing a semiconductor device | |
DE3650638T2 (en) | Integrated semiconductor circuit with isolation zone | |
KR880700457A (en) | Integrated circuit device manufacturing method | |
KR860005450A (en) | Semiconductor integrated circuit device and manufacturing method thereof | |
KR900007103A (en) | Semiconductor integrated circuit and its manufacturing method | |
KR860009484A (en) | Method of manufacturing a semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
N231 | Notification of change of applicant | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060210 Year of fee payment: 17 |
|
EXPY | Expiration of term |