KR850006433A - Polypropylene resin composition stable to radiation - Google Patents

Polypropylene resin composition stable to radiation Download PDF

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KR850006433A
KR850006433A KR1019850001613A KR850001613A KR850006433A KR 850006433 A KR850006433 A KR 850006433A KR 1019850001613 A KR1019850001613 A KR 1019850001613A KR 850001613 A KR850001613 A KR 850001613A KR 850006433 A KR850006433 A KR 850006433A
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polypropylene resin
resin composition
phosphite
weight
peroxide
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KR1019850001613A
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KR870002104B1 (en
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요이찌 가와이
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오꾸 미쓰오
미쓰이 도오아쓰 가가꾸 가부시끼 가이샤
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Priority claimed from JP4652284A external-priority patent/JPS60190443A/en
Priority claimed from JP59069197A external-priority patent/JPS60212442A/en
Application filed by 오꾸 미쓰오, 미쓰이 도오아쓰 가가꾸 가부시끼 가이샤 filed Critical 오꾸 미쓰오
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C08K5/526—Esters of phosphorous acids, e.g. of H3PO3 with hydroxyaryl compounds
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L31/00—Materials for other surgical articles, e.g. stents, stent-grafts, shunts, surgical drapes, guide wires, materials for adhesion prevention, occluding devices, surgical gloves, tissue fixation devices
    • A61L31/14—Materials characterised by their function or physical properties, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials
    • A61L31/143—Stabilizers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/156—Heterocyclic compounds having oxygen in the ring having two oxygen atoms in the ring
    • C08K5/1575—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/14—Copolymers of propene
    • C08L23/142—Copolymers of propene at least partially crystalline copolymers of propene with other olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Abstract

내용 없음No content

Description

방사선에 안정한 폴리프로필렌 수지 조성물Polypropylene resin composition stable to radiation

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (11)

폴리프로필렌 수지 (a), 하기 구조식(I)을 갖는 소르비톨 유도체(b), 하기 구조식(II)를 갖는 포스파이트 화합물(c) 및 하기 구조식(III)을 갖는 폴리아민 화합물(d)로 구성되고 화합물(b), (c) 및 (d)의 함량이 폴리프로필렌 수지(a)의 100중량부에 대해 각각 0.005 내지 8중량부, 0.01 내지 4중량부 및 0.01 내지 4중량부인 우수한 투명성을 갖는 방사선에 안정한 폴리프로필렌 수지 조성물 :A polypropylene resin (a), a sorbitol derivative (b) having the following structural formula (I), a phosphite compound (c) having the following structural formula (II), and a polyamine compound (d) having the following structural formula (III) (b), (c) and (d) to the radiation having excellent transparency of the content of 0.005 to 8 parts by weight, 0.01 to 4 parts by weight and 0.01 to 4 parts by weight relative to 100 parts by weight of the polypropylene resin (a), respectively. Stable Polypropylene Resin Composition: 상기에서,In the above, R은 수소원자 또는 탄소원자 1 내지 18의 알킬기이고;R is a hydrogen atom or an alkyl group of 1 to 18 carbon atoms; R1은 3차 부틸, 1,1-디메틸프로필, 시클로헥실 또는 페닐기이고;R 1 is tertiary butyl, 1,1-dimethylpropyl, cyclohexyl or phenyl group; R2는 수소원자 또는 메틸, 3차 부틸, 1,1-디메틸프로필, 시클로헥실 또는 페닐기이고;R 2 is a hydrogen atom or a methyl, tertiary butyl, 1,1-dimethylpropyl, cyclohexyl or phenyl group; n은 평균 1 내지 40의 정수이다.n is an integer of 1-40 on average. 제 1 항에 있어서, 유기 과산화물(e)를 더 포함하는 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.2. The polypropylene resin composition stable to radiation according to claim 1, further comprising an organic peroxide (e). 제 1 항에 있어서, 수지 조성물이 유기 과산화물 존재하에 190°내지 270℃에서 열적 저하되는 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.The polypropylene resin composition stable to radiation according to claim 1, wherein the resin composition is thermally lowered at 190 ° to 270 ° C in the presence of an organic peroxide. 제 1 항에 있어서, 폴리프로필렌 수지가 폴리프로필렌 단일중합체, 에틸렌 0.1 내지 7중량%를 함유하는 프로필렌-에틸렌 공중함체 또는 α-올레핀 0.1 내지 20중량%를 함유하는 프로필렌-α-올레핀 공중합체인 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.The polypropylene resin according to claim 1, wherein the polypropylene resin is a polypropylene homopolymer, a propylene-ethylene copolymer containing 0.1 to 7% by weight of ethylene or a propylene-α-olefin copolymer containing 0.1 to 20% by weight of α-olefin. Polypropylene resin composition stable to radiation. 제 1 항에 있어서, 소르비톨 유도체 (b)가 디벤질리덴 소르비톨, 1.3,2.4-디(메틸벤질리덴)소르비톨 또는 1.3,2.4-디(헥실벤질리덴)소르비톨인 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.The polypropylene stable to radiation according to claim 1, wherein the sorbitol derivative (b) is dibenzylidene sorbitol, 1.3,2.4-di (methylbenzylidene) sorbitol or 1.3,2.4-di (hexylbenzylidene) sorbitol Resin composition. 제 1 항에 있어서, 소르비톨 유도체(b)의 함량이 폴리프로필렌 수지 100중량부당 0.05 내지 1중량부인 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.The polypropylene resin composition stable to radiation according to claim 1, wherein the content of the sorbitol derivative (b) is 0.05 to 1 part by weight per 100 parts by weight of the polypropylene resin. 제 1 항에 있어서, 포스파이트 화합물(c)가 트리스(2,5-디-t-부틸페닐)포스파이트, 트리스(2-t-부틸페닐)포스파이트, 트리스[2-(1,1-디메틸프로필)페닐]포스파이트, 트리스(2-페닐페닐)포스파이트, 트리스(2-시클로헥실페닐)포스파이트, 트리스(2,4-디-t-부틸페닐)포스파이트 또는 트리스(2-t-부틸-4-페닐)포스파이트인 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.A phosphite compound (c) according to claim 1, wherein the phosphite compound (c) is tris (2,5-di-t-butylphenyl) phosphite, tris (2-t-butylphenyl) phosphite, tris [2- (1,1- Dimethylpropyl) phenyl] phosphite, tris (2-phenylphenyl) phosphite, tris (2-cyclohexylphenyl) phosphite, tris (2,4-di-t-butylphenyl) phosphite or tris (2-t It is -butyl-4-phenyl) phosphite, Stable polypropylene resin composition characterized by the above-mentioned. 제 1 항에 있어서, 포스파이트 화합물(c)의 함량이 폴리프로필렌 수지(a)의 100중량부당 0.02 내지 2중량부인 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.The polypropylene resin composition stable to radiation according to claim 1, wherein the content of the phosphite compound (c) is 0.02 to 2 parts by weight per 100 parts by weight of the polypropylene resin (a). 제 1 항에 있어서, 폴리아민 화합물(d)의 함량이 폴리프로필렌 수지(a)의 100중량부당 0.02 내지 2중량부인 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.The polypropylene resin composition stable to radiation according to claim 1, wherein the content of the polyamine compound (d) is 0.02 to 2 parts by weight per 100 parts by weight of the polypropylene resin (a). 제 2 항에 있어서, 유기 과산화물(e)의 t-부틸퍼록시피발레이트, 라우로일퍼록사이드, 벤조일퍼록사이드, 시클로헥사논퍼록사이드, t-부틸퍼록시이소프로필카르보네이트, t-부틸퍼록시벤조에이트, 메틸에틸케톤퍼록사이드, 디큐밀퍼록사이드, 2,5-디메틸-2,5-디-(t-부틸퍼록시)헥산, 디-t-부틸퍼록사이드, 또는 2,5-디메틸-2,5-디(t-부틸퍼록시)헥신-3인 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.The t-butylperoxy pivalate, lauroyl peroxide, benzoyl peroxide, cyclohexanone peroxide, t-butylperoxyisopropyl carbonate and t-butyl of an organic peroxide (e). Peroxybenzoate, methylethylketone peroxide, dicumylperoxide, 2,5-dimethyl-2,5-di- (t-butylperoxy) hexane, di-t-butylperoxide, or 2,5- A dimethyl-2,5-di (t-butylperoxy) hexyne-3, wherein the polypropylene resin composition is stable to radiation. 제 3 항에 있어서, 유기 과산화물(e)이 t-부틸 퍼록시피발레이트, 라우로일퍼록사이드, 벤조일퍼록사이드, 시클로헥사논퍼록사이드, t-부틸퍼록시이소프로필카보네이트, t-부틸퍼록시벤조에이트, 메틸에틸케톤퍼록사이드, 디큐밀퍼록사이드, 2,5-디메틸-2,5-디-(t-부틸퍼록시)헥산, 디-t-부틸퍼록사이드, 또는 2,5-디메틸-2,5-디(t-부틸퍼록시)헥신-3인 것을 특징으로 하는 방사선에 안정한 폴리프로필렌 수지 조성물.The organic peroxide (e) according to claim 3, wherein the organic peroxide (e) is t-butyl peroxy pivalate, lauroyl peroxide, benzoyl peroxide, cyclohexanone peroxide, t-butyl peroxy isopropyl carbonate, t-butyl peroxy Benzoate, methyl ethyl ketone peroxide, dicumyl peroxide, 2,5-dimethyl-2,5-di- (t-butylperoxy) hexane, di-t-butylperoxide, or 2,5-dimethyl- It is 2, 5- di (t- butyl peroxy) hexine-3, The polypropylene resin composition stable to radiation. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019850001613A 1984-03-13 1985-03-13 Radiation stable polypropylene resin composition KR870002104B1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP46522/83 1984-03-13
JP4652284A JPS60190443A (en) 1984-03-13 1984-03-13 Polypropylene resin composition stable to radiation
JP46522 1984-03-13
JP59069197A JPS60212442A (en) 1984-04-09 1984-04-09 Polypropylene resin composition stable to radiation
JP69197 1984-04-09

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KR850006433A true KR850006433A (en) 1985-10-05
KR870002104B1 KR870002104B1 (en) 1987-12-08

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DE (1) DE3508983A1 (en)
FR (1) FR2561247B1 (en)
GB (1) GB2156360B (en)
IT (1) IT1184148B (en)
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DE3508983A1 (en) 1985-09-26
CA1254339A (en) 1989-05-16
IT1184148B (en) 1987-10-22
KR870002104B1 (en) 1987-12-08
GB2156360B (en) 1987-07-01
FR2561247B1 (en) 1987-12-11
IT8519844A0 (en) 1985-03-11
AU3957185A (en) 1985-09-19
AU552479B2 (en) 1986-06-05
GB2156360A (en) 1985-10-09
GB8505499D0 (en) 1985-04-03
NL8500696A (en) 1985-11-01
PT80096A (en) 1985-04-01
FR2561247A1 (en) 1985-09-20
PT80096B (en) 1986-11-20

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