KR850005176A - 노출 마스크와 대상물을 얼라인먼트하는 노출장치 및 그 방법 - Google Patents
노출 마스크와 대상물을 얼라인먼트하는 노출장치 및 그 방법Info
- Publication number
- KR850005176A KR850005176A KR1019840008344A KR840008344A KR850005176A KR 850005176 A KR850005176 A KR 850005176A KR 1019840008344 A KR1019840008344 A KR 1019840008344A KR 840008344 A KR840008344 A KR 840008344A KR 850005176 A KR850005176 A KR 850005176A
- Authority
- KR
- South Korea
- Prior art keywords
- exposure
- aligning
- mask
- exposure device
- exposure mask
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58243866A JPH0612753B2 (ja) | 1983-12-26 | 1983-12-26 | パターン検出方法及びその装置 |
JP58-243866 | 1983-12-26 | ||
JP59222010A JPS61100931A (ja) | 1984-10-24 | 1984-10-24 | 縮小投影式アライメント方法 |
JP59-222010 | 1984-10-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR850005176A true KR850005176A (ko) | 1985-08-21 |
KR900001269B1 KR900001269B1 (ko) | 1990-03-05 |
Family
ID=26524628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019840008344A KR900001269B1 (ko) | 1983-12-26 | 1984-12-26 | 노출 마스크와 대상물을 얼라인먼트하는 노출장치 및 그 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4668089A (ko) |
EP (1) | EP0148477B1 (ko) |
KR (1) | KR900001269B1 (ko) |
DE (1) | DE3485022D1 (ko) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4937618A (en) * | 1984-10-18 | 1990-06-26 | Canon Kabushiki Kaisha | Alignment and exposure apparatus and method for manufacture of integrated circuits |
US4828392A (en) * | 1985-03-13 | 1989-05-09 | Matsushita Electric Industrial Co., Ltd. | Exposure apparatus |
JPH0616480B2 (ja) * | 1985-06-03 | 1994-03-02 | 株式会社日立製作所 | 縮小投影式アライメント方法およびその装置 |
US4771180A (en) * | 1985-10-11 | 1988-09-13 | Matsushita Electric Industrial Co. Ltd. | Exposure apparatus including an optical system for aligning a reticle and a wafer |
JPH0685387B2 (ja) * | 1986-02-14 | 1994-10-26 | 株式会社東芝 | 位置合わせ方法 |
JPH0785466B2 (ja) * | 1986-07-04 | 1995-09-13 | キヤノン株式会社 | 位置合せ装置 |
US4943733A (en) * | 1987-05-15 | 1990-07-24 | Nikon Corporation | Projection optical apparatus capable of measurement and compensation of distortion affecting reticle/wafer alignment |
JPH065663B2 (ja) * | 1987-06-30 | 1994-01-19 | 株式会社日立製作所 | 半導体露光方法及びその装置 |
JPH01189503A (ja) * | 1988-01-25 | 1989-07-28 | Hitachi Ltd | パターン検出方法及びその装置 |
US5340992A (en) * | 1988-02-16 | 1994-08-23 | Canon Kabushiki Kaisha | Apparatus and method of detecting positional relationship using a weighted coefficient |
US5260771A (en) * | 1988-03-07 | 1993-11-09 | Hitachi, Ltd. | Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same |
US5094539A (en) * | 1988-03-07 | 1992-03-10 | Hitachi, Ltd. | Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same |
US5155370A (en) * | 1988-09-09 | 1992-10-13 | Canon Kabushiki Kaisha | Device for detecting the relative position of first and second objects |
JP2650396B2 (ja) * | 1989-02-07 | 1997-09-03 | キヤノン株式会社 | 位置検出装置及び位置検出方法 |
JPH032504A (ja) * | 1989-05-30 | 1991-01-08 | Nikon Corp | 位置合わせ装置 |
US5053628A (en) * | 1989-07-13 | 1991-10-01 | Matsushita Electric Industrial Co., Ltd. | Position signal producing apparatus for water alignment |
FR2656700B1 (fr) * | 1989-12-28 | 1992-08-07 | Aerospatiale | Procede de restitution du mouvement d'un mobile par observation d'un symbole forme sur ce dernier et dispositifs pour la mise en óoeuvre du procede. |
US5357311A (en) * | 1991-02-25 | 1994-10-18 | Nikon Corporation | Projection type light exposure apparatus and light exposure method |
JP3210123B2 (ja) * | 1992-03-27 | 2001-09-17 | キヤノン株式会社 | 結像方法及び該方法を用いたデバイス製造方法 |
US5274420A (en) * | 1992-04-20 | 1993-12-28 | International Business Machines Corporation | Beamsplitter type lens elements with pupil-plane stops for lithographic systems |
US5446587A (en) * | 1992-09-03 | 1995-08-29 | Samsung Electronics Co., Ltd. | Projection method and projection system and mask therefor |
JP3195200B2 (ja) * | 1994-12-09 | 2001-08-06 | キヤノン株式会社 | 半導体露光装置および異物検出方法 |
JP3450509B2 (ja) * | 1995-04-13 | 2003-09-29 | キヤノン株式会社 | 投影露光装置及び該装置を用いて素子を製造する方法 |
US6270947B2 (en) * | 1999-04-30 | 2001-08-07 | Infineon Technologies Ag | Method and apparatus for reducing non-uniformity area effects in the manufacture of semiconductor devices |
GB2356786B (en) * | 1999-11-29 | 2003-09-03 | Marconi Electronic Syst Ltd | Method and apparatus for aligning a crystalline substrate |
JP4414535B2 (ja) * | 2000-01-13 | 2010-02-10 | 進 野田 | 半導体装置の製造方法 |
US6700096B2 (en) * | 2001-10-30 | 2004-03-02 | Semiconductor Energy Laboratory Co., Ltd. | Laser apparatus, laser irradiation method, manufacturing method for semiconductor device, semiconductor device, production system for semiconductor device using the laser apparatus, and electronic equipment |
TWI289896B (en) * | 2001-11-09 | 2007-11-11 | Semiconductor Energy Lab | Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device |
TWI291729B (en) | 2001-11-22 | 2007-12-21 | Semiconductor Energy Lab | A semiconductor fabricating apparatus |
TWI267145B (en) * | 2001-11-30 | 2006-11-21 | Semiconductor Energy Lab | Manufacturing method for a semiconductor device |
JP3949564B2 (ja) * | 2001-11-30 | 2007-07-25 | 株式会社半導体エネルギー研究所 | レーザ照射装置及び半導体装置の作製方法 |
US7133737B2 (en) * | 2001-11-30 | 2006-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer |
US7214573B2 (en) * | 2001-12-11 | 2007-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device that includes patterning sub-islands |
JP4282985B2 (ja) * | 2002-12-27 | 2009-06-24 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
KR100531416B1 (ko) * | 2003-09-17 | 2005-11-29 | 엘지.필립스 엘시디 주식회사 | Sls 장비 및 이를 이용한 실리콘 결정화 방법 |
US7385671B2 (en) * | 2004-05-28 | 2008-06-10 | Azores Corporation | High speed lithography machine and method |
JP2007142275A (ja) * | 2005-11-21 | 2007-06-07 | Toshiba Corp | フォトマスクの判定方法、半導体装置の製造方法及びプログラム |
DE102006003535A1 (de) * | 2006-01-24 | 2007-08-02 | Schott Ag | Verfahren zur Temperaturbeeinflussung einer Schmelze |
DE102008048660B4 (de) * | 2008-09-22 | 2015-06-18 | Carl Zeiss Sms Gmbh | Verfahren und Vorrichtung zur Vermessung von Strukturen auf Photolithographiemasken |
NL2005975A (en) | 2010-03-03 | 2011-09-06 | Asml Netherlands Bv | Imprint lithography. |
JP6096515B2 (ja) * | 2013-01-15 | 2017-03-15 | 株式会社アドテックエンジニアリング | Itoパターン露光装置 |
CN103412428B (zh) * | 2013-07-24 | 2016-01-27 | 北京京东方光电科技有限公司 | 一种对位系统 |
GB201604940D0 (en) | 2016-03-23 | 2016-05-04 | Stfc Science & Technology | Laser-chain alignment |
WO2019067809A2 (en) | 2017-09-29 | 2019-04-04 | Rudolph Technologies, Inc. | SYSTEM AND METHOD FOR OPTIMIZING LITHOGRAPHIC EXPOSURE METHOD |
CN107844025A (zh) * | 2017-12-11 | 2018-03-27 | 京东方科技集团股份有限公司 | 掩膜版、曝光装置及曝光方法 |
WO2021168359A1 (en) | 2020-02-21 | 2021-08-26 | Onto Innovation, Inc. | System and method for correcting overlay errors in a lithographic process |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3989385A (en) * | 1974-09-16 | 1976-11-02 | International Business Machines Corporation | Part locating, mask alignment and mask alignment verification system |
JPS5212577A (en) * | 1975-07-21 | 1977-01-31 | Nippon Kogaku Kk <Nikon> | Automatic location device |
DE2539206A1 (de) * | 1975-09-03 | 1977-03-17 | Siemens Ag | Verfahren zur automatischen justierung von halbleiterscheiben |
JPS52109875A (en) * | 1976-02-25 | 1977-09-14 | Hitachi Ltd | Position matching system for mask and wafer and its unit |
JPS5369063A (en) * | 1976-12-01 | 1978-06-20 | Hitachi Ltd | Detector of position alignment patterns |
DE2845603C2 (de) * | 1978-10-19 | 1982-12-09 | Censor Patent- und Versuchs-Anstalt, 9490 Vaduz | Verfahren und Einrichtung zum Projektionskopieren |
DE2900921C2 (de) * | 1979-01-11 | 1981-06-04 | Censor Patent- und Versuchs-Anstalt, 9490 Vaduz | Verfahren zum Projektionskopieren von Masken auf ein Werkstück |
DE2905636C2 (de) * | 1979-02-14 | 1985-06-20 | Censor Patent- Und Versuchs-Anstalt, Vaduz | Verfahren zum Kopieren von Masken auf ein Werkstück |
DE2905635A1 (de) * | 1979-02-14 | 1980-08-21 | Censor Patent Versuch | Verfahren und vorrichtung zum ausrichten der bild- und/oder objektflaechen bei optischen kopiereinrichtungen |
US4353087A (en) * | 1979-03-12 | 1982-10-05 | The Perkin-Elmer Corporation | Automatic mask alignment |
US4362389A (en) * | 1980-02-19 | 1982-12-07 | Hitachi, Ltd. | Method and apparatus for projection type mask alignment |
JPS56122128A (en) * | 1980-02-29 | 1981-09-25 | Telmec Co Ltd | Positioning system for printing device of semiconductor or the like |
-
1984
- 1984-12-20 EP EP84115889A patent/EP0148477B1/en not_active Expired - Lifetime
- 1984-12-20 US US06/684,292 patent/US4668089A/en not_active Expired - Lifetime
- 1984-12-20 DE DE8484115889T patent/DE3485022D1/de not_active Expired - Lifetime
- 1984-12-26 KR KR1019840008344A patent/KR900001269B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0148477B1 (en) | 1991-09-04 |
DE3485022D1 (de) | 1991-10-10 |
US4668089A (en) | 1987-05-26 |
KR900001269B1 (ko) | 1990-03-05 |
EP0148477A3 (en) | 1985-09-04 |
EP0148477A2 (en) | 1985-07-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20040302 Year of fee payment: 15 |
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EXPY | Expiration of term |