KR850003516A - Flame retardant extruded product and its manufacturing method - Google Patents

Flame retardant extruded product and its manufacturing method Download PDF

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KR850003516A
KR850003516A KR1019840006897A KR840006897A KR850003516A KR 850003516 A KR850003516 A KR 850003516A KR 1019840006897 A KR1019840006897 A KR 1019840006897A KR 840006897 A KR840006897 A KR 840006897A KR 850003516 A KR850003516 A KR 850003516A
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flame retardant
wood
weight
insoluble
water
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후흐스 프리츠-라이하르트 (외 1)
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하인리히 벡커, 베른하르트 벡크
훽스트 아크티엔게젤샤프트 (외 1)
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27NMANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08Moulding or pressing
    • B27N3/28Moulding or pressing characterised by using extrusion presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27NMANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N9/00Arrangements for fireproofing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/12Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board next to a particulate layer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/32Phosphorus-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00Compositions of lignin-containing materials
    • C08L97/02Lignocellulosic material, e.g. wood, straw or bagasse
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00Fireproofing materials
    • C09K21/06Organic materials
    • C09K21/12Organic materials containing phosphorus
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00Fireproofing materials
    • C09K21/14Macromolecular materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/92Fire or heat protection feature
    • Y10S428/921Fire or flameproofing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/936Encapsulated chemical agent

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Veneer Processing And Manufacture Of Plywood (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Fireproofing Substances (AREA)

Abstract

내용 없음No content

Description

난연성 압출품 및 이의 제조방법Flame retardant extruded product and its manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (31)

목재 칩 및 또는 목재 섬유재료를 압출시켜 제조한, 방염제로서, ⓐ압출조건하에 물리-화학적으로 안정한 방염제 50 내지 99.5 중량%와 ⓑ방염제 개개 입자를 캡슐화시키는 경화 수-불용성 합성수지 약 0.5 내지 50중량%와의 생성물을, 건조 목재 침 및/또는 목재 섬유적료를 기준으로 하여 약 5 내지 50중량%의 농도로 함유하는 난연성 목재품, 특히 고체 및 파이프 보드로 이루어진 칩보드,Flame retardant produced by extruding wood chips and / or wood fiber materials, ⓐ 50 to 99.5% by weight of physically-chemically stable flame retardant under extrusion conditions and ⓑ flame retardant about 0.5 to 50% by weight of cured water-insoluble synthetic resin Flame retardant wood products, in particular solid and pipe boards, containing the product of the vinegar at a concentration of about 5 to 50% by weight based on dry wood needles and / or wood fiber 제1항에 있어서, 방염제로서, ⓐ일반식H(n-m)+2(NH4)mPnO3n+1(여기에서 n은 평균 약 20 내지 800의 정수를 나타내고 m/n의 비율은 약 1이다)의 분말상의 자유-유동성 다중인산 암모늄 75내지 99.5중량%와 ⓑ다중인산 암모늄 개개 입자를 캡슐화시키는 경화 수-불용성 합성 수지 약 0.5내지 25중량%와의 생성물을, 건조 목재 칩 및/또는 섬유재료를 기준하여 약 5 내지 50중량%의 농도로 함유하는 난연성 목재품.A flame retardant according to claim 1, wherein, as the flame retardant, ⓐ general formula H ( nm ) + 2 (NH 4 ) m P n O 3 n + 1 (where n represents an integer of about 20 to 800 on average and a ratio of m / n Is from about 75 to 99.5% by weight of the powdery free-flowing ammonium polyphosphate and about 0.5 to 25% by weight of the cured water-insoluble synthetic resin encapsulating individual polyammonium particles, dried wood chips and / Or flame retardant wood products containing at a concentration of about 5 to 50% by weight based on the fiber material. 제1항에 있어서, 방염제가 평균크기 약 0.03 내지 0.08㎜의 입자로 이루어진 난연성 목재품.The fire retardant wood product according to claim 1, wherein the flame retardant consists of particles having an average size of about 0.03 to 0.08 mm. 제2항에 있어서, 지수 n 이 평균 450 내지 800의 정수를 나타내는 난연성 목재품.The fire retardant wood product according to claim 2, wherein the index n represents an integer of 450 to 800 on average. 제1항에 있어서, 경화 수-불용성 합성 수지가 멜라민 및 포름알데히드의 다중축합 생성물인 난연성 목재품.The fire retardant wood product according to claim 1, wherein the cured water-insoluble synthetic resin is a polycondensation product of melamine and formaldehyde. 제5항에 있어서, 경화되지 않은 다중축합 생성물이, 50% 수용액이 동적 점도 20 내지 50mpa.s(20℃에서),pH-값 8.8 내지 9.8(20℃에서) 및 밀도 1.21내지 1.225g/㎖(20℃에서)을 갖는 분말인 난연성 목재품.6. The uncured multicondensation product of claim 5, wherein the 50% aqueous solution has a kinematic viscosity of 20 to 50 mpa · s (at 20 ° C.), a pH-value of 8.8 to 9.8 (at 20 ° C.) and a density of 1.21 to 1.225 g / ml A flame retardant wood product which is a powder with (at 20 ° C.). 제1항에 있어서, 수-불용성 경화합성수지가 폴리올, 이소시아네이트 및 폴리이소시아네이트중에서 선택된 물질의 다중축합 생성물인 난연성 목재품.The fire retardant wood article of claim 1, wherein the water-insoluble curable resin is a polycondensation product of a material selected from polyols, isocyanates and polyisocyanates. 제1항에 있어서, 수-불용성 경화합성수지가 이소시아네이트 및 폴리이소이사네이트 중에서 선택된 물질의 다중축합 생성물인 난연성 목재품.The flame retardant wood article of claim 1, wherein the water-insoluble curable resin is a multicondensation product of a material selected from isocyanates and polyisoisates. 제1항에 있어서, 수-불용성 경화합성수지가 에폭사이드 수지인 난연성 목재품.The flame retardant wood product according to claim 1, wherein the water-insoluble curable synthetic resin is an epoxide resin. 제1항에 있어서, 수-불용성 경화합성수지가 방향족 히드록시 화합물 및 포름알데히드의 다중축합 생성물인 난연성 목재품.The fire retardant wood product according to claim 1, wherein the water-insoluble curable resin is a polycondensation product of an aromatic hydroxy compound and formaldehyde. 제10항에 있어서, 방향족 히드록시 화합물이 페놀 또는 레솔시놀인 난연성 목재품.The fire retardant wood product according to claim 10, wherein the aromatic hydroxy compound is phenol or resorcinol. 목재 칩, 목재 섬유재료 및 이드의 혼합물중에서 선택된 물질을, ⓐ압출 조건하에 물리-화학적으로 안정한 방염제 50 내지 99.5중량%, 및 ⓑ방염제 개개 입자를 캡슐화시키는 적어도 부분경화된 수-불용성 합성 수지 약 0.5 내지 50중량%로 이루어진, 목재 칩 및/또는 목재 섬유재료를 기준하여 약 5 내지 50중량%의 방염제, 및 결합제,경화제 및 통상의 첨가제 중에서 선택된 하나 이상의 물질과 혼합시키고; 전체 혼합물을 스크루 압출기에 서서히 도입시켜 가열가능한 판 사이에서 여기저기 움직이는 프레스의 보조하에 압출 목재품으로 압출시킴을 특징으로 하여, 방염제로서, ⓐ압출조건하에 물리-화학적으로 안정한 방염제 50 내지 99.5중량%와 ⓑ방염제 개개 입자를 캡슐화시키는 경화 수-불용성 합성수지 약 0.5 내지 50중량%와의 생성물을, 건주 목재 칩 및/또는 목재 섬유재료를 기준하여 약 5 내지 50중량%의 농도로 함유하는 난연성 목재품을 제조하는 방법.A material selected from a mixture of wood chips, wood fiber materials and ids, ⓐ between 50 and 99.5 weight percent of a physically and chemically stable flame retardant under extrusion conditions, and at least a partially cured water-insoluble synthetic resin encapsulating individual particles of the flame retardant. From about 5 to 50% by weight of flame retardant, based on wood chips and / or wood fiber materials, and at least one material selected from binders, hardeners and conventional additives; Slowly introducing the entire mixture into a screw extruder and extruding it into extruded wood products under the aid of a press moving up and down between the heatable plates, as flame retardant, physicochemically stable flame retardant 50 to 99.5% by weight under extrusion conditions. And ⓑ flame retardant wood products containing from about 0.5 to 50% by weight of cured water-insoluble synthetic resin encapsulating individual particles of flame retardant at a concentration of about 5 to 50% by weight based on dry wood chips and / or wood fiber materials. How to manufacture. 제12항에 있어서, 목재 칩,목재 섬유재료 및 이들의 혼합물중에서 선택된 물질을, ⓐ일반식 H(n-m)+2(NH4)mPnO3n+1(여기에서 n은 평균 약 20 내지 800의 정수를 나타내고 m/n의 비율은 약 1이다)의 분말상의 자유-유동성 다중인산 암모늄 75 내지 99.5중량%, 및 ⓑ다중인산 암모늄 개개 입자를 캡슐화 시키는 적어도 부분 경화된 수-불용성 합성수지 0.5 내지 25중량%로 이루어진, 건조 목재 칩 및/또는 목재 섬유 재료를 기준하여 약 5 내지 50중량%의 방염제, 및 결합제, 경화제 및 통상적 첨가제 중에서 선택된 하나 이상의 물질과 혼합시키고; 전체 혼합물을 스크루 압출기에 서서히 도입시켜, 가열 가능한 판 사이에서 여기저기 움직이는 프레스의 보조하에 압출목재품으로 압출시킴을 특징으로 하는 방법.13. The method of claim 12, wherein the material selected from wood chips, wood fiber materials and mixtures thereof is selected from the following formulas: ⓐ general formula H (nm) + 2 (NH 4 ) m P n O 3 n + 1 , where n is on average about 20 to 75 to 99.5% by weight of a powdered free-flowing ammonium phosphate powder having an integer of 800 and a ratio of m / n of about 1), and at least partially cured water-insoluble synthetic resin encapsulating individual particles of 25% by weight of about 5 to 50% by weight of flame retardant based on dry wood chips and / or wood fiber materials, and one or more materials selected from binders, curing agents and conventional additives; Gradually introducing the entire mixture into a screw extruder and extruding the extruded wood with the aid of a press moving up and down between the heatable plates. 제12항에 있어서, 프레스가 0.5 내지 2.0N/㎟의 평균 성형압하에서 작동하는 방법.The method of claim 12 wherein the press is operated under an average forming pressure of 0.5 to 2.0 N / mm 2. 제12항에 있어서, 열판을 100 내지 250℃의 온도로 유지시키는 방법.The method of claim 12, wherein the hot plate is maintained at a temperature of 100 to 250 ° C. 제12항에 있어서, 우레아/포름알데히드 접착제를 결합제도 사용하고, 개질된 염화암모늄 용액 및/또는 특수 경화제를 경화제로 사용하는 방법.13. The method of claim 12, wherein a urea / formaldehyde adhesive is used as a binder and a modified ammonium chloride solution and / or special curing agent is used as curing agent. 제12항에 있어서, 이소시아네이트를 결합제로 사용하는 방법.13. The process of claim 12 wherein isocyanate is used as the binder. 제17항에 있어서, 디페닐메탄-디이소시아네이트(MDI)를 기재로한 이소시아네이트를 결합제로 사용하는 방법.18. The process of claim 17 wherein isocyanate based on diphenylmethane-diisocyanate (MDI) is used as the binder. 목재 또는 라미네이트로 베니어시킨 난연성 보드를 제조하는데 사용되는 제12항에 따라 제조된 제1항에 따른 칩 보드.The chip board according to claim 1, made according to claim 12 used to produce a flame retardant board veneered from wood or laminate. 목재 칩 및/또는 목재 섬유재료를 압출시켜 제조된, ①압출조건하에 물리화학적으로 안정한 방염제 50)내지 99.5중량%, 및 ②방염제 개개 입자를 캡슐화시키는 경화 수-불용성 합성수지 약 0.5 내지 50중량%로 이루어진, 각기 목재 칩 및/또는 목재 섬유재료를 기준하여 약 5 내지 50중량%의 방염제, 및 경화제 및 통상적 첨가제중에서 선택된 하나 이상의 물질을 함유하는 칩 보드, ⓑ특수 결합제를 사용하여 칩 보드에 접착시킨, 목재 또는 라미네이트시킨 쉬트물질의 커버용 베니어 및 임의로 ⓒ난연성 와니스 또는 라커의 표면층으로 이루어진 난연성 피복 칩 보드,특히 목재 또는 라미네이트로 베니어시킨 보드.Manufactured by extruding wood chips and / or wood fiber materials, ① physicochemically stable flame retardants 50) to 99.5 wt% under extrusion conditions, and ② about 0.5 to 50 wt% cured water-insoluble synthetic resin encapsulating individual particles of flame retardant. A chip board comprising about 5 to 50% by weight of a flame retardant, each based on a wood chip and / or wood fiber material, and at least one material selected from among curing agents and conventional additives, A flame retardant coated chip board comprising a surface veneer of wood or laminated sheet material and optionally a surface layer of a flame retardant varnish or lacquer, in particular a board veneered with wood or laminate. 제20항에 있어서, ①목재 칩 및/또는 목재 섬유재료로 압출시켜 제조된, 일반식H(n-m,)+2(NH4)mPnO3n-1(여기에서 n은 평균 약 20 내지 800의 정수를 나타내고 m/n의 비율은 약 1이다)의 분말상의 자유-유동성 다중인산 암모늄 75 내지 99.5중량%, 및 ②다중인산 암모늄개개의 입자를 캡슐화시키는 경화수-불용성 합성수지 약 0.5 내지 25중량%로 이루어진, 각기 목재 칩 및/또는 목재 섬유재료를 기준하여 약 5 내지 50중량%의 방염제, 및 결합체, 경화제 및 통상적 첨가제중에서 선택된 하나 이상의 물질을 함유하는 칩 보드, ⓑ특수 결합제를 사용하여 칩 보드에 접착시킨, 목재 또는 라미네이트시킨 쉬트물질의 커버용 또는 봉함용 베니어, 및 임의로 ⓒ난연성 와니스 또는 라커의 표면층으로 이루어진, 난연성 피복 칩 보드.The method according to claim 20 , which comprises: ( 1 ) general formula H (nm, ) +2 (NH 4 ) m P n O 3n-1 , wherein extruded from wood chips and / or wood fiber materials, where n is on average from about 20 to 75 to 99.5% by weight of a powdery free-flowing ammonium phosphate powder having an integer of 800 and a ratio of m / n of about 1), and (2) about 0.5 to 25 curable water-insoluble synthetic resins encapsulating individual particles. By using a chip board, ⓑ special binders, comprising from about 5 to 50% by weight of flame retardant, respectively, based on weight percent of wood chips and / or wood fiber materials, and at least one material selected from binders, curing agents and conventional additives. A flame retardant coated chip board comprising a veneer for covering or sealing a wood or laminated sheet material, and optionally a surface layer of a flame retardant varnish or lacquer, adhered to the chip board. 제20항에 있어서, 방염제가 평균 입자 크기 약 0.03 내지 0.08㎜인 입자로 이루어진 난연성 피복 칩 보드.The flame retardant coated chipboard of claim 20, wherein the flame retardant consists of particles having an average particle size of about 0.03 to 0.08 mm. 제21항에 있어서, 지수 n 이 평균 450 내지 800의 정수인 난연성 피복 칩 보드.The flame-retardant clad chip board of Claim 21 whose index n is an integer of an average of 450-800. 제20항에 있어서, 수-불용성 경화 합성 수지가 멜라민 및 포름알데히드의 다중축합 생성물인 난연성 피복 칩 보드.The flame retardant coated chipboard of claim 20, wherein the water-insoluble cured synthetic resin is a multicondensation product of melamine and formaldehyde. 제20항에 있어서, 수-불용성 경화 합성 수지가 폴리올과, 이소시아네이트 및 폴리이소시아네이트중에서 선택된 물질과의 다중축합 생성물인 피복 칩 보드.21. The coated chip board of claim 20, wherein the water-insoluble cured synthetic resin is a polycondensation product of a polyol with a material selected from isocyanates and polyisocyanates. 제20항에 있어서, 수-불용성 경화 합성수지가 이소시아네이트 및 폴리이소시아네이트중에서 선택된 물질의 다중축합 생성물인 난연성 피복 칩 보드.The flame retardant coated chip board of claim 20, wherein the water-insoluble cured synthetic resin is a polycondensation product of a material selected from isocyanates and polyisocyanates. 제20항에 있어서,수-불용성 경화 합성 수지가 에폭사이드 수지인 난연성 피복 칩 보드.The flame-retardant coated chip board of claim 20, wherein the water-insoluble cured synthetic resin is an epoxide resin. 제20항에 있어서,수-불용성 경화 합성 수지가 방향족 히드록시 화합물 및 포름알데히드의 다중축합 생성물인 난연성 피복 칩 보드.The flame retardant coated chip board of claim 20, wherein the water-insoluble cured synthetic resin is a polycondensation product of an aromatic hydroxy compound and formaldehyde. 제28항에 있어서, 방향족 히드록시 화합물이 페놀 및 레솔시놀중에서 선택된 난연성 피복 칩 보드.The flame retardant coated chip board of claim 28, wherein the aromatic hydroxy compound is selected from phenol and resorcinol. 제20항에 있어서, 목재 또는 라미네이트시킨 쉬트물질의 베니어에 사용하는 특수결합제가 페놀/멜라민/우레아-포름알데히드 또는 이소시아네이트를 기재로한 축합 생성물인 난연성 피복 칩 보드.21. The flame retardant coated chipboard of Claim 20, wherein the special binder used for veneering wood or laminated sheet material is a condensation product based on phenol / melamine / urea-formaldehyde or isocyanate. 제20항에 있어서, 목재-베니어시킨 보드표면에 투명한 난연성 1성분 라커 또는 와니스를 바른 난연성 피복 칩 보드.21. The flame retardant coated chipboard of claim 20, wherein the flame retardant monocomponent lacquer or varnish is applied to a wood-veneered board surface. ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019840006897A 1983-11-05 1984-11-03 Flame retardant extruded product and its manufacturing method KR850003516A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100828949B1 (en) * 2007-04-18 2008-05-13 아이케이 주식회사 Anti-flammable board and manufacturing method thereof
KR100837807B1 (en) * 2007-01-31 2008-06-13 최준한 Industrial incombustible composition using fibroid organanic material, formed article using the same and manufacturing method thereof

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JPS63315696A (en) * 1987-06-17 1988-12-23 株式会社ノダ Fiberboard and its production
MX174334B (en) * 1990-03-14 1994-05-09 Medite Corp APPARATUS AND METHOD FOR MANUFACTURING SYNTHETIC BOARDS INCLUDING PIRO-RETARDANT BOARDS

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100837807B1 (en) * 2007-01-31 2008-06-13 최준한 Industrial incombustible composition using fibroid organanic material, formed article using the same and manufacturing method thereof
KR100828949B1 (en) * 2007-04-18 2008-05-13 아이케이 주식회사 Anti-flammable board and manufacturing method thereof

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