KR850002643A - Multilayer Metal / Organic Polymer Laminates - Google Patents

Abstract

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Description

Multilayer Metal / Organic Polymer Laminates

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1 is a partial cross-sectional view of a cable shielding tape structure according to the present invention. 2A is a terminal cutaway view of a cable shielding tape structure in which a conventional three-strand high-conductor cable conductor is inserted in accordance with the present invention. 2B is a cross-sectional view of a cable shielding tape structure according to the present invention in which a conventional three-strand high-voltage cable conductor is inserted.

Claims (15)

A stainless steel base having a primary and secondary major plane; When the laminate structure is bent, it has a thickness sufficient to provide a minimum continuous chromium metal layer having a thickness thinner than that of the two-layered layer from the base layer, and the first layer adheres to the primary and secondary main planes of the base layer without using an intermediate adhesive layer. And a secondary chromium metal layer; Primary and secondary chromium oxide layers each having a thickness of 2.69 to 53.76 mg of chromium oxide per m 2 of layer surface area, and adhering to the primary and secondary chromium metal layers described above without using an intermediate adhesive layer; A multilayer metal / organopolymer laminate structure, comprising one or more adhesive polymer film layers that adhere to a primary or secondary chromium oxide layer or a chromium oxide layer without using an intermediate adhesive layer. The laminate structure according to claim 1, wherein the thickness of the primary and secondary chromium metal layers is 21.5 to 516 mg per square meter of layer surface area. The laminate structure of claim 1 wherein the stainless steel substrate has a thickness of 0.0254 to 0.76 mm. 2. The laminate structure of Claim 1 wherein the stainless steel substrate has a thickness of 0.0762 to 0.254 mm. The laminate structure of claim 1 wherein the primary and secondary chromium metal layers and the primary and secondary chromium oxide layers are electroplated on a stainless steel substrate. The laminate structure of claim 1 wherein the thickness of the adhesive polymer film layer is from 0.00254 to 0.254 mm. 2. The laminate structure of Claim 1 wherein the thickness of the adhesive polymer film layer is between 0.0076 and 0.076 mm. The laminate structure of claim 1, wherein the adhesive polymer film layer is formed of a solid thermoplastic polymer of ethylene modified by at least one monomer of a reactive carboxylic acid group. The laminate structure according to claim 8, wherein the thermoplastic polymer of ethylene is an ethylene free copolymer having 1.0 to 30 weight of the ethylenically unsaturated carboxylic acid copolymer. 10. The laminate of claim 9, wherein the ethylenically unsaturated carboxylic acid is selected from acrylic acid, methacrylic acid, crotonic acid, fumaric acid, maleic acid, itaconic acid or maleic anhydride. The laminate structure of claim 1 comprising a non-adhesive polymer layer bonded to the adhesive polymer film layer without using an intermediate adhesive layer. The laminate structure of claim 11 wherein the thickness of the non-adhesive polymer is between 0.00254 and 0.38 mm. 12. The non-adhesive polymer layer of claim 11, wherein the non-adhesive polymer layer comprises low density polyethylene, medium density polyethylene, high density polyethylene, ethylene / ethylacrylate copolymer, ethylene / vinylacetate copolymer, ionic olefin polymer, chlorinated polyethylene, chlorosulfone polyethylene , Polypropylene, polyamide, polyethylene terephthalate, fluoropolymer, or laminated structure, characterized in that formed from a polymer selected from ethylene / propylene / diene / terpolymer. An improved cable suitable for high pressure or telecommunications, consisting of a sheath of the multilayer metal / organic polymer laminate structure of claim 1 surrounding a core, core and plastic sheath comprising at least one insulated conductor. The metal / plastic / metal comprising at least one adhesive polymer layer which is adhesively bonded between the primary metal base layer, the secondary metal base layer, the primary metal base layer and the secondary metal base layer of the multilayer metal laminate structure of claim 1. Laminated structure. ※ Note: The disclosure is based on the initial application.