KR850000182A - 비료시용(施用)장치 부착 이앙기 - Google Patents

비료시용(施用)장치 부착 이앙기 Download PDF

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Publication number
KR850000182A
KR850000182A KR1019830004937A KR830004937A KR850000182A KR 850000182 A KR850000182 A KR 850000182A KR 1019830004937 A KR1019830004937 A KR 1019830004937A KR 830004937 A KR830004937 A KR 830004937A KR 850000182 A KR850000182 A KR 850000182A
Authority
KR
South Korea
Prior art keywords
fertilizer application
rice transplanter
fertilizer
application device
groove
Prior art date
Application number
KR1019830004937A
Other languages
English (en)
Inventor
히로요시(외 2) 후지끼
Original Assignee
미노 시계가스
구보다 덱고오 가부시기 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8592183U external-priority patent/JPS59191112U/ja
Priority claimed from JP11467483A external-priority patent/JPS606115A/ja
Application filed by 미노 시계가스, 구보다 덱고오 가부시기 가이샤 filed Critical 미노 시계가스
Publication of KR850000182A publication Critical patent/KR850000182A/ko
Priority to KR2019880001146U priority Critical patent/KR880001289Y1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Fertilizing (AREA)
  • Transplanting Machines (AREA)

Abstract

내용 없음.

Description

비료시용(施用)장치 부착 이앙기
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 전체측면도
제2도는 그 일부 절결된 전체 평면도
제3도는 모의 식재장치의 일부 절결된 측면도

Claims (3)

  1. 복수개의 모 식재용핑거(2)‥‥‥를 기체의 옆방향으로 병설하여 비료탱크(5)의 탱크내 비료에 대한 도출장치(9) 및 농작물 재배장면에 홈을 만들어서 홈에 비료 공급하는 복수개의 비료시용부(11)‥‥‥의 각각 그것을 보유하는 비료시용장치(6)를 전기한 비료시용부(11)가 기체 옆방향으로 병렬하는 상태로서 설치한 비료시용장치 부착이앙기에 있어서, 전기한 모 식재용 핑거(2) 및 비료시용부(11)의 각각 병렬한 피치(P1)(P2)를 동일한 혹은 대략 동일하게 하고 있는 것을 특징으로하는 비료시용장치 부착이앙기.
  2. 제2항에 있어서, 전기한 이앙기에 있어서 비료시용부(11)는 파종기능을 보유하도록 구성되어 있는 것을 특징으로 하는 비료시용장치 부착이앙기.
  3. 제2항에 있어서, 전기한 이앙기에 있어서 비료시용부(11)는 각각 식재용 핑거(2)의 비스듬이 앞쪽으로 설치되어 있는 것을 특징으로 하는 비료시용장치 부착이앙기.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019830004937A 1983-06-06 1983-10-19 비료시용(施用)장치 부착 이앙기 KR850000182A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019880001146U KR880001289Y1 (ko) 1983-06-24 1988-02-01 비료시용(施用)장치 부착이앙기

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP???58-85921 1983-06-06
JP8592183U JPS59191112U (ja) 1983-06-06 1983-06-06 農用粉粒体放出具
JP11467483A JPS606115A (ja) 1983-06-24 1983-06-24 施肥装置付田植機
JP???58-114674 1983-06-24

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019880001146U Division KR880001289Y1 (ko) 1983-06-24 1988-02-01 비료시용(施用)장치 부착이앙기

Publications (1)

Publication Number Publication Date
KR850000182A true KR850000182A (ko) 1985-02-26

Family

ID=55176779

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830004937A KR850000182A (ko) 1983-06-06 1983-10-19 비료시용(施用)장치 부착 이앙기

Country Status (1)

Country Link
KR (1) KR850000182A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100433335B1 (ko) * 2001-04-02 2004-05-28 이세키노우키가부시키가이샤 시비 이앙기

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100433335B1 (ko) * 2001-04-02 2004-05-28 이세키노우키가부시키가이샤 시비 이앙기

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Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E601 Decision to refuse application
WICV Withdrawal of application forming a basis of a converted application