KR840009026A - How to bond electrical conductors to insulated substrates - Google Patents

How to bond electrical conductors to insulated substrates Download PDF

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KR840009026A
KR840009026A KR1019840001015A KR840001015A KR840009026A KR 840009026 A KR840009026 A KR 840009026A KR 1019840001015 A KR1019840001015 A KR 1019840001015A KR 840001015 A KR840001015 A KR 840001015A KR 840009026 A KR840009026 A KR 840009026A
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substrate
granules
electrically conductive
conductive
mixture
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KR1019840001015A
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Korean (ko)
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아아르 미첼(외2) 데니스
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아아르 미첼(외2) 데니스
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
    • B29C70/64—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres the filler influencing the surface characteristics of the material, e.g. by concentrating near the surface or by incorporating in the surface by force
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
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    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
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    • H05K2201/03—Conductive materials
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    • H05K2201/0332—Structure of the conductor
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    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
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Abstract

내용 없음No content

Description

전기 전도체를 절연 기판에 접착하는 방법How to bond electrical conductors to insulated substrates

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 기판에 형성된 예비성형 트레이스(trace)통로를 나타내는 부분 단면도.1 is a partial cross-sectional view illustrating a preformed trace path formed on a substrate.

제2도는 예비성형 트레이스 통로에 응착된 분말전도물질을 기판에 압압하도록 통로와 정열된 암공구 요소의 부분 단면도.2 is a partial cross-sectional view of the arm tool element aligned with the passageway to press the powder conductive material adhered to the preformed trace passageway onto the substrate.

제13도는 양측 회로판에 쓰이는 기판의 예비성형된 구멍 공동구조물과 그 기판의 양측에 상응한 2개의 숫 공구 각각의 핀 요소들을 예시한다.Figure 13 illustrates the preformed hole cavity of a substrate for use on both circuit boards and the pin elements of each of the two male tools corresponding to both sides of the substrate.

Claims (43)

필요로 하는 전도체의 경로를 따라서 경계를 이루는 미리 형성된 통로를 갖는 플래스틱 물질의 절연기판을 형성하고, 용융점이 비교적 높은 제1의 과립기질과 용융점이 비교적 낮은 제2의 분말기질을 포함하는 분말화된 전기전도성물질의 혼합물을 상기 통로내에 침착(沈着)시키고 이 분말혼합물에 열을 가함으로써 상기 제2의 기질을 용융시키며 이분말 혼합물 아래의 기판물질을 연화시키고, 상기 분말혼합물에 압력을 가하여 고정된 제1의 고체기질을 기판에 압착시킴으로써 상기 제1 기질의 과립의 적어도 일부가 부분적으로 기판내에 함입되어 기판물질이 없는 누출부분을 갖도록 하여 주고 기판 및 상기 통로내의 전도성 물질을 냉각시킴에 의해 용융된 제2 기질을 고화시킴으로써 전기전도성이 있는 상기 제1 기질의 과립을 결합시키는 전기전도성 기재로 되도록하여 제기질의 부분적으로 함입된 과립에 의해 기판에 결합된 연속적인 전기전도체를 상기 미리 형성된 통로내에 형성시키는 단계들로 구성되는 프린트 인쇄기판을 제조하는 방법.A powdered substrate comprising an insulating substrate of plastic material having a preformed passageway bounded along the path of the conductor, and comprising a first granular substrate having a relatively high melting point and a second powder substrate having a relatively low melting point. A mixture of electroconductive materials is deposited in the passageway and heated to the powder mixture to melt the second substrate, soften the substrate material under the mixture and pressurize the powder mixture to fix it. Pressing the first solid substrate onto the substrate allows at least a portion of the granules of the first substrate to be partially embedded in the substrate to have a leak free portion of the substrate material and melted by cooling the conductive material in the substrate and the passageway. An electrical conductivity that binds the granules of the first substrate which are electrically conductive by solidifying the second substrate How to ensure that as the substrate producing a printed printing substrate consisting of a continuous electrical conductor coupled to the substrate by incorporation into the granules partially raised questions as steps to form in the preformed passage. 제1항에 있어서, 상기 기판물질이 열가소성 폴리에스터, 폴리페닐렌 설파이드, 폴리설폰, 폴리에테르설폰 및 폴리에테르이미드로 구성된 군으로 부터 선택된 열가소성 물질인 방법.The method of claim 1 wherein the substrate material is a thermoplastic material selected from the group consisting of thermoplastic polyesters, polyphenylene sulfides, polysulfones, polyethersulfones and polyetherimides. 제1항에 있어서, 상기 기판형성단계가 열가소성 물질을 사출성형하는 단계로 구성되는 방법.The method of claim 1, wherein the substrate forming step comprises injection molding a thermoplastic material. 제1항에 있어서, 용융점이 비교적 높은 분말화된 상기 제1의 전기전도성 과립물질이 구리과립인 방법.The method of claim 1 wherein the powdered first electrically conductive granular material having a relatively high melting point is copper granules. 제1항에 있어서, 용융점이 비교적 낮은 분말화된 상기 제2의 전기전도성 물질이 주석과 납의 공용혼합물인 방법.The method of claim 1 wherein the powdered second electrically conductive material having a relatively low melting point is a co-mixture of tin and lead. 제1항에 있어서, 상기 열 및 압력을 가하는 단계들이 상기 통로에 정합(整合)되는 숫(male)부분을 가진 가열된 공구로 상기 기판내의 상기 분말화된 전도성물질의 혼합물을 압착시킴에 의하여 동시에 수행되는 방법.2. The method of claim 1, wherein the steps of applying heat and pressure are simultaneously carried out by pressing the mixture of powdered conductive material in the substrate with a heated tool having a male portion mated to the passageway. How is it done. 제6항에 있어서, 상기 열을 가하는 단계가, 분말화된 제1 및 제2의 전도성물질의 혼합물을 압축시키기 전에 상기 분말화된 제2의 전도성물질의 용융점과 적어도 같은 온도로 공구를 가열하는 단계를 더욱 포함하는 방법.The tool of claim 6, wherein applying the heat heats the tool to a temperature at least equal to the melting point of the powdered second conductive material before compacting the mixture of powdered first and second conductive materials. Further comprising a step. 제1항에 있어서, 상기 미리 형성된 통로가 상기 기판내에 형성된 막힘 홈구멍을 소정의 성분장착 구멍에 대응하는 위치에 포함하는 방법.The method of claim 1, wherein the preformed passageway comprises a clogging groove hole formed in the substrate at a position corresponding to a predetermined component mounting hole. 제8항에 있어서, 상기 열 및 압력을 가하는 단계와 동시에 혹은 그후에 상기 막힌 홈구멍을 개구시키는 단계를 더욱 포함하는 방법.9. The method of claim 8, further comprising opening the blocked groove hole concurrently with or after applying the heat and pressure. 제8항에 있어서, 상기 열 및 압력은 상기 통로 및 막힌 홈구멍에 정합되는 숫부분을 가진 가열된 공구에 의해 가하여지는 방법.9. The method of claim 8, wherein the heat and pressure are applied by a heated tool having a male portion that mates to the passageway and the closed groove hole. 제10항에 있어서, 상기 가열된 공구의 숫부분으로 기판을 펀칭함에 의하여 상기 막힌 홈구멍을 개구시키는 단계를 더욱 포함하는 방법.11. The method of claim 10, further comprising opening the blocked groove hole by punching a substrate into the male portion of the heated tool. 제6항에 있어서, 상기 공구가 기판물질의 용융점보다 높은 온도로 가열되는 방법.The method of claim 6, wherein the tool is heated to a temperature above the melting point of the substrate material. 제1항에 있어서, 용융점이 높은 전도성 과립물질이 용융점이 낮은 전기전도성 분말물질보다 메쉬크기가 큰 방법.The method of claim 1, wherein the conductive granule material having a high melting point has a larger mesh size than the electrically conductive powder material having a low melting point. 제1항에 있어서, 상기 제1의 전도성 과립물질이 약 -200메쉬의 구리이고, 상기 제2의 전도성 분말물질은 65% 주석과 35%납의 공융합금이며, 이들의 혼합물은 5내지 60중량%의 주석/납합금을 포함하는 방법.The method of claim 1, wherein the first conductive granular material is about -200 mesh copper, the second conductive powder material is 65% tin and 35% lead eutectic alloy, the mixture thereof is 5 to 60% by weight To include tin / lead alloys. 제8항에 있어서, 상기 기판에는 성분면 및 전도 체면이 성형되며, 상기 막힌 홈구명에는 안쪽으로 경사진 측벽이 있고 각각의 막힌 홈구멍은 회방향의 벽에 의해 막혀 있는 방법.9. The method of claim 8, wherein the substrate is formed with a component surface and a conductor surface, wherein the blocked groove lifespan has an inwardly inclined sidewall and each blocked groove hole is blocked by a wall in a circumferential direction. 제15항에 있어서, 상기 각각의 막힌 구멍의 회방향벽은 이 홈구멍의 깊이에 비하여 얇으며, 또한 상기 압착단계의 도중에 상기 가열된 공구의 일부분으로 상기 바닥벽을 펀칭하는 단계를 더욱 포함하는 방법.16. The method of claim 15, wherein the circumferential wall of each blind hole is thinner than the depth of the groove hole and further comprises punching the bottom wall with a portion of the heated tool during the crimping step. Way. 제16항에 있어서, 상기 기판내에 형성된 홈구멍 및 상기 통로에 정합되는 숫부분을 가진 공구를 마드는 단계를 더욱 포함하는 방법.17. The method of claim 16, further comprising the step of making a tool having a groove formed in the substrate and a male portion mating to the passageway. 제17항에 있어서, 상기 압착단계의 도중에 기판내의 상기 막힌 홈구멍을 개구시키기 위한 펀치요소를 상기 공구내에 설치하는 단계를 더욱 포함하는 방법.18. The method of claim 17, further comprising installing a punch element in the tool to open the blocked groove hole in the substrate during the pressing step. 필요로 하는 회로 트레이스에 대응하는 통로가 형성되어 있는 플래스틱물질의 기판을 형성시키고, 용융점이 비교적 높은 전기전도성 과립기질을 상기 채널 및 홈구멍에 침착시키고 열 및 압력을 가하여 상기 전도성 과립기질을 기판에 압착시킴으로써 상기 전도성 과립기질의 적어도 일부를 열가서성 기판내에 함입시키며, 상기 기판물질이 없는 노출부분을 남겨 주고 전기전도성 기재물질내에 부분적으로 함입된 과립의 상기 노출부분을 포함하는 상기 압착된 과립을 결합시킴으로써 상기 기판에 결합된 연속적인 전기 전도체를 상기 통로내에 형성시키는 단계들로 구성되는 전도성 회로기판을 제조하는 방법.A substrate of plastic material having a passage corresponding to the required circuit trace is formed, and a conductive granule substrate having a relatively high melting point is deposited in the channel and the hole, and heat and pressure are applied to the substrate. Compressing the compressed granules into at least a portion of the conductive granular substrate in a thermotropic substrate, the exposed granules leaving the exposed portions free of the substrate material and comprising the exposed portions of granules partially embedded in the electrically conductive substrate material. Forming a continuous electrical conductor coupled to the substrate in the passage by bonding. 제19항에 있어서, 상기 결합단계가 사익 함입된 과립상에 전기전도성 물질을 도금시키는 단계로 구성되는 방법.20. The method of claim 19, wherein said bonding step consists in plating an electrically conductive material on the feed-in granulated granules. 제19항에 있어서, 상기 결합단계가 전기전도성 분발물질을 상기 압착된 과립상에 침착시키고, 이 분말불질을 용융시킴으로써 이 분말물질이 상기 압착된 과립과 부분적으로 함입된 과립사이의 간극을 실질적으로 채우고 과립들을 상호 연결시켜서 연속적인 전기전도성 경로가 이루어지도록 하는 단계들로 구성되는 방법.20. The method of claim 19, wherein the bonding step deposits an electrically conductive powder on the compacted granules, and melts the powdery defect so as to substantially fill the gap between the compacted granules and the granulated granules. Filling and interconnecting the granules so that a continuous conductive path is achieved. 전기전도성 과립물질을 기판내에 부분적으로 함입시키고, 이와같이 부분적으로 함입된 과립물질상에 전도성 물질을 전기도금하는 단계들로 구성되는, 전기전도체를 절연기판에 결합시키는 방법.A method of bonding an electrically conductive material to an insulating substrate, the method comprising the steps of partially incorporating an electrically conductive granular material into a substrate and electroplating a conductive material onto the partially impregnated granular material. 제2의 전도성 분말물질 및 플래스틱 기판물질에 비하여 용융점이 비교적 높은 제1의 전도성 과립물질과 제2의 전도성 분말물질의 혼합물을 기판상에 침착시키고, 열과 압력을 동시에 상기 혼합물에 가하여 제1의 과립물질의 적어도 일부의 과립을 플래스틱 기판내에 적어도 부분적으로 함입시키는 한편 제2의 전도성 분말물질을 용융시켜서 상기 제2의 분말물질이 제1의 과립물질의 과립에 결합되고, 상기 부분적으로 함입된 입자에 의해 기판에 결합된 연속적인 전도성 기재를 형성하도록 하는 단계들로 구성되는 플래스틱 기판에 결합된 전기전도체를 형성하는 방법.A mixture of the first conductive granular material and the second conductive powder material having a relatively high melting point relative to the second conductive powder material and the plastic substrate material is deposited on the substrate, and the first granule is formed by simultaneously applying heat and pressure to the mixture. At least a part of the granules of material are at least partially embedded in the plastic substrate while melting the second conductive powder material so that the second powder material is bound to the granules of the first granulated material and to the partially embedded particles. And forming an electrically conductive substrate coupled to the plastic substrate, the method comprising forming a continuous conductive substrate bonded to the substrate. 전기전도성 과립물질을 절연기판내에 부분적으로 함입시켜서 함입되지 않은 노출부분을 제공하고 전기 전도성 기재내에 부분적으로 함입돈 상기 과립들의 노출부분들을 결합시키는 단계로 구성되는 절연기판에 결합된 전기전도체를 형성하는 방법.Partially incorporating the electrically conductive granular material into the insulating substrate to provide an unembedded exposed portion and forming an electrically conductive coupled to the insulated substrate, which comprises combining the exposed portions of the granules partially embedded in the electrically conductive substrate. Way. 제24항에 있어서, 전기전도성 과립물질을 분적으로 함입시키는 단계가 상기 과립의 층을 플래스틱 기판의 표면상에 침착시키고 상기 과립을 플래스틱 기판에 압착시켜서 필요로 하는 프린트회로에 대응하는 부분적으로 함입된 과립의 패턴을 형성하도록 하는 단계들로 구성되는 방법.25. The method of claim 24, wherein the step of separately impregnating the electrically conductive granular material comprises depositing a layer of the granules on the surface of the plastic substrate and compressing the granules onto the plastic substrate to partially impregnate the required printed circuit. Forming a pattern of granules. 제25항에 있어서, 상기 압착단계의 도중에 열을 가하여 상기 입자들이 상기 플래스틱 기판내로 관통됨을 용이하게 하여 주는 단게가 더욱 포함되는 방법.27. The method of claim 25, further comprising a step of applying heat during the compression step to facilitate penetration of the particles into the plastic substrate. 제26항에 있어서, 상기 플래스틱 기판을 냉각시킴으로써 상기 부분적으로 함입돈 과립들을 기판내에 고정시키는 단계가 더욱 포함되는 방법.27. The method of claim 26, further comprising fixing the partially embedded granules in the substrate by cooling the plastic substrate. 제25항에 있어서, 상기 압착단계가 플래스틱 기판상에 형성될 필요로 하는 회로패턴에 대응하는 패턴에 대응하는 패턴으로 형성된 숫랜드(male land)들을 가진 공구로 상기 과립을 압착시키는 단계로 이루어지는 방법.26. The method of claim 25, wherein the pressing step comprises pressing the granules with a tool having male lands formed in a pattern corresponding to a pattern corresponding to a circuit pattern needed to be formed on a plastic substrate. . 제28항에 있어서, 상기 압착단계의 전에 상기 플래스틱 기판의 연화점 혹은 용융점에 가깝거나 이보다 높은 온도로 상기 공구를 가열하는 단계가 더욱 포함되는 방법.29. The method of claim 28, further comprising heating the tool to a temperature near or above a softening point or melting point of the plastic substrate prior to the pressing step. 제28항에 있어서, 플래스틱 기판상에 형성될 필요하는 회로패턴에 대응하는 패턴으로 형성되어 있는 랜드들을 가진 상기 공구를 가열하는 단계가 더욱 포함되는 방법.29. The method of claim 28, further comprising heating the tool with lands formed in a pattern corresponding to the circuit pattern required to be formed on the plastic substrate. 제25항에 있어서, 필요로 하는 전도성 트레이스의 패턴으로 상기 플래스틱 기판내에 통로를 미리 형성시키는 단계가 더욱 포함되며, 또한 상기 침착단계는 상기 전기전도성 과립물질을 이 통로내에 침착시키는 것으로 이루어지는 방법.27. The method of claim 25, further comprising preforming a passage in the plastic substrate with a desired pattern of conductive traces, wherein the depositing step consists in depositing the electrically conductive granule material in the passage. 제24항에 있어서, 상기 전기전도성 과립물질이 구리과립인 방법.The method of claim 24, wherein the electrically conductive granular material is copper granules. 제24항에 있어서, 상기 전기전도성 과립물질이 상기 결합단계의 전에 전기전도성 통로를 형성하기에 충분한 밀도로 함입되는 방법.The method of claim 24, wherein the electroconductive granular material is incorporated at a density sufficient to form an electroconductive passageway prior to the bonding step. 제28항에 있어서, 상기 결합단계가 전기전도성 물질을 상기 부분적으로 함입된 과립물질상에 전기도금하는 단계로 이루어지는 방법.29. The method of claim 28, wherein said bonding step comprises electroplating an electrically conductive material onto said partially impregnated granular material. 제24항에 있어서, 상기 결합단계가 전기전도성 물질을 상기 부분적으로 함입된 과립물질상에 무전기적으로 도금하는 단계로 이루어지는 방법.25. The method of claim 24, wherein said bonding step comprises electrolessly plating an electrically conductive material onto said partially impregnated granular material. 제24항에 있어서, 상기 전기전도성 물질이 구리, 니켈편(片)은 도금된 유리구슬로 구성되는 혼합물인 방법.25. The method of claim 24, wherein the electrically conductive material is a mixture of copper and nickel pieces consisting of plated glass beads. 제33항에 있어서, 상기 혼합물의 중량비 조성이 은도금된 유리구슬 약10% 니켈편 5-7%, 구리과립 83-85%인 방법.34. The method of claim 33, wherein the weight ratio composition of the mixture is about 5% to about 10% nickel pieces of silver plated glass and 83 to 85% of copper granules. 제34항에 있어서, 상기 은도금된 유리구슬의 직경이 5-45미크론이며, 4%은도금인 방법.35. The method of claim 34, wherein the silver plated glass beads are 5-45 microns in diameter and 4% silver plated. 제34항에 있어서, 상기 니켈편의 크기가 10미크론 이하인 방법.35. The method of claim 34, wherein the nickel piece has a size of 10 microns or less. 제34항에 있어서, 상기 구리가 200메쉬인 방법.35. The method of claim 34, wherein said copper is 200 mesh. 제19항에 있어서, 상기 기판내에 형성된 상기 통로는 상이한 단면적 및 전류 이동능력을 갖는 전도체를 형성할 수 있도록 깊이가 변화하는 것인 방법.20. The method of claim 19, wherein the passageway formed in the substrate is varied in depth to form conductors having different cross-sectional areas and current carrying capacity. 절연기판과 필요로 하는 트레이스선 또는 지역을 따라 상기 절연기판내에 부분적으로 함입되어서 함입되지 않은 노출된 과립부분을 제공하는 전기전도성 과립물질로 구성되며 상기 노출된 과립부분은 전기전도성 기재물질내에 결합됨으로써 상기 절연기판에 결합된 1개 혹은 다수의 전기전도체를 형서하는 제품.Consisting of an electrically conductive granular material that provides an exposed granulated portion that is not partially embedded in the insulating substrate along the insulating substrate and the required trace line or region, and the exposed granular portion is bonded within the electrically conductive substrate material. A product for forming one or a plurality of electrical conductors coupled to the insulating substrate. ※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
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