KR840005523U - 전착 절연 장치 - Google Patents

전착 절연 장치

Info

Publication number
KR840005523U
KR840005523U KR2019830002133U KR830002133U KR840005523U KR 840005523 U KR840005523 U KR 840005523U KR 2019830002133 U KR2019830002133 U KR 2019830002133U KR 830002133 U KR830002133 U KR 830002133U KR 840005523 U KR840005523 U KR 840005523U
Authority
KR
South Korea
Prior art keywords
insulation device
electrodeposition
electrodeposition insulation
insulation
Prior art date
Application number
KR2019830002133U
Other languages
English (en)
Other versions
KR900003233Y1 (ko
Inventor
쓰기오 니시무라
Original Assignee
미쯔비시 덴끼 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쯔비시 덴끼 가부시기가이샤 filed Critical 미쯔비시 덴끼 가부시기가이샤
Publication of KR840005523U publication Critical patent/KR840005523U/ko
Application granted granted Critical
Publication of KR900003233Y1 publication Critical patent/KR900003233Y1/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00Electrophoretic coating characterised by the process
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/135Electrophoretic deposition of insulating material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Manufacture Of Motors, Generators (AREA)
KR2019830002133U 1982-03-15 1983-03-11 전착 절연 장치 KR900003233Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57043538A JPS58158808A (ja) 1982-03-15 1982-03-15 電着絶縁装置
JP57-43538 1982-03-15

Publications (2)

Publication Number Publication Date
KR840005523U true KR840005523U (ko) 1984-10-20
KR900003233Y1 KR900003233Y1 (ko) 1990-04-17

Family

ID=12666512

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019830002133U KR900003233Y1 (ko) 1982-03-15 1983-03-11 전착 절연 장치

Country Status (2)

Country Link
JP (1) JPS58158808A (ko)
KR (1) KR900003233Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2709106B2 (ja) * 1988-12-06 1998-02-04 極東開発工業株式会社 ダンプカーの荷箱用電着浴槽

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1342005A (en) * 1971-08-11 1973-12-25 Rowland M C Photocathodes
JPS4910521U (ko) * 1972-04-26 1974-01-29

Also Published As

Publication number Publication date
JPS58158808A (ja) 1983-09-21
KR900003233Y1 (ko) 1990-04-17

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19940319

Year of fee payment: 5

EXPY Expiration of term