KR840004828A - Self-positioning heat transfer - Google Patents

Self-positioning heat transfer Download PDF

Info

Publication number
KR840004828A
KR840004828A KR1019830001389A KR830001389A KR840004828A KR 840004828 A KR840004828 A KR 840004828A KR 1019830001389 A KR1019830001389 A KR 1019830001389A KR 830001389 A KR830001389 A KR 830001389A KR 840004828 A KR840004828 A KR 840004828A
Authority
KR
South Korea
Prior art keywords
heat transfer
self
positioning
lead frame
transfer device
Prior art date
Application number
KR1019830001389A
Other languages
Korean (ko)
Inventor
엘·헌터 윌리엄 (외 1)
Original Assignee
빈스 제이 라우너
모터로라 인코오포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빈스 제이 라우너, 모터로라 인코오포레이티드 filed Critical 빈스 제이 라우너
Publication of KR840004828A publication Critical patent/KR840004828A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

내용 없음No content

Description

자체위치고정 열전달기Self-positioning heat transfer

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 양호한 실시예에 따라서 구성된 자체위치고정한 열전달기를 위에서 본 평면도.1 is a plan view from above of a self-positioning heat transfer device constructed in accordance with a preferred embodiment of the present invention.

제2도는 제1도의 열전달기를 옆에서 본 정면도.2 is a front view of the heat transfer of FIG.

제3도는 제1도의 라인 3―3을 절단한 본 발명에 대한 열전달기의 교차단면도.3 is a cross sectional view of a heat transfer device for the present invention, taken along line 3-3 of FIG.

Claims (10)

리드 프레인의 제2표면에 접속되고 배치된 반도체 다이를 갖는 금속리드 프레임의 제1표면에 대체로 병렬인 것부터 캡슐화하기전에 모울드 공동내에 삽입하기 위해 적용되는 열전달기에 있어서, 상기 제1표면에 병렬인 각각의 측면으로부터 상기 공동의 측벽에 대한 예정된 제2허용한도 이내까지 확정한 적어도 한쌍의 공간격리 래터럴 스텐드 오프들, 그것의 하부면으로부터 예정된 간격만큼 확장한 적어도 한쌍의 공간격리 피트의 캡슐된 위치내에 림을 씌운 리등 프레임부를 보충하는 각각의 그런 림의 내부 에지들과 함께 상기 공동의 단부벽들에 대한 에정된 제1허용한도 이내에서 확장되도록 하는 크기로 된 분기림들을 한정하기 위해 그것의 반대단부내에 형성된 노치들을 갖는 열전도 프레임과, 그리고 열전도 프레임에서 부터 캡슐화한 위치내에 설치된 상기 다이상에 상기 리드 프레임부의 제1표면에 대한 예정된 제3허용한도 이내까지 확장한 중앙부와, 상기 제1표면에 의해 제2 및 제3예정된 허용한도들이 선택되므로서 사기 열전달기가 상기 모울드 공동 및 리드 프레임에 대하여 자체위치 고정되어 있는 것으로 구성된 열전달기를 특징으로 하는 자체위치고정 열전달기.A heat transfer device adapted for insertion into a mold cavity prior to encapsulation, from substantially parallel to a first surface of a metal lead frame having a semiconductor die connected to and disposed on a second surface of the lead plane, the parallel to the first surface. In at least one pair of space isolation lateral standoffs established from each side to within a predetermined second tolerance for the sidewall of the cavity, within at least one pair of space isolation feet extending from the bottom surface by a predetermined distance Its opposite end to define branching rims that are sized to extend within the first allowable limits for the end walls of the cavity with the inner edges of each such rim supplementing the rimmed back frame portion A thermally conductive frame having notches formed therein, and in a position encapsulated from the thermally conductive frame On the die installed in the center, the central portion extends to within a predetermined third allowable limit for the first surface of the lead frame portion, and the second and third predetermined tolerances are selected by the first surface, so that a fraud heat transfer is performed on the mold. Self-positioning heat transfer characterized by a heat transfer consisting of a self-position fixed relative to the cavity and lead frame. 제1항에 있어서, 열전달기의 상부면으로부터, 상기 리드 프레임의 제1표면에 대한 제4예정된 허용한도 이내까지 확장한 적어도 하나의 립으로 구성된 것을 특징으로 하는 자체위치고정 열전달기.2. The self-positioning heat transfer device of claim 1, comprising at least one rib extending from an upper surface of the heat transfer device to within a fourth predetermined tolerance for the first surface of the lead frame. 제1항에 있어서, 상기 연장된 열전도 프레임은 그것의 반대단부들로부터 상기 리드프레임의 제1표면에 대한 제5예정된 허용한도 이내까지 확장한 상승된 내부구획으로 된 것을 특징으로 하는 자체위치 고정 열전달기.2. The self-positioning thermoelectric element of claim 1, wherein the elongated thermally conductive frame has a raised internal compartment extending from opposite ends thereof to within a fifth predetermined tolerance for the first surface of the leadframe. Running. 제1항에 있어서, 상기 분기된 림들은 상기 열전달기의 측면들로부터 상기 분기된 림들의 단부까지 가늘게 되어 있는 것을 특징으로 하는 자체위치고정 열전달기.2. The self-positioning heat transfer device of claim 1, wherein the branched rims are tapered from the sides of the heat transferer to the ends of the branched rims. 리드 프레임의 제2표면에 접속되고 설치된 반도체 다이를 갖는 금속리드 프레임의 제1표면에 대체로 병렬 프라스틱내에 캡슐화전에 모울드 공동내에 삽입하기 위해 적용되는 자체위치고정 열전달기에 있어서, 그것의 각각의 측면들로부터 상기 공동의 측벽들에 대한 제2예정된 허용한도 이내까지 확장한 적어도 한 쌍의 공간격리 래터럴 스탠드오프들, 그것의 하부면으로부터 예정된 간격을 확장한 적어도 한쌍의 공간격 리피트의 캡슐된 위치에서 림을 씌운 리드 프레임부를 보충하는 각각의 그러한 림의 내부 예지들과 함께 상기 공동의 단부벽에 대한 제1예정된 허용한도 이내까지 확장하도록 하는 크기로 된 분기림들을 한정하기 위하여 그것의 반대단부들에 형성된 노치들을 갖는 열전도 프레임으로 구성된 열전달기를 특징으로 하는 자체위치고정 열전달기.A self-positioning heat transfer device adapted for insertion into a mold cavity prior to encapsulation in a parallel plastic, generally at a first surface of a metal lead frame having a semiconductor die connected to and installed on a second surface of the lead frame, each of its side surfaces. At least one pair of space isolation lateral standoffs extending from within a second predetermined tolerance for the sidewalls of the cavity, the rim in an encapsulated position of at least one pair of space separation repeats extending a predetermined distance from its bottom surface Formed at its opposite ends to define branching rims that are sized to extend within a first predetermined tolerance for the end wall of the cavity together with internal projections of each such rim supplementing the enclosed lead frame portion. Self-positioning feature of heat transfer consisting of a heat conduction frame with notches Reply thermal. 제5항에 있어서, 상기 열전도 프레임은 그것의 반대단부로부터 상기 리드 프레임의 제1표면에 대한 제3에정된 허용한도 이내까지 대체로 확장한 상승한내부구획을 추가로 하여 구성한 것을 특징으로 하는 자체위치고정 열전달기.6. The self-positioning lock according to claim 5, wherein the heat conduction frame further comprises a raised inner compartment extending generally from an opposite end thereof to within a third defined allowance for the first surface of the lead frame. Heat transfer. 제6항에 있어서, 열전달기의 캡슐위치내에 설치된 상기 다이사에 상기 리드 프레임부의 제1표면에 대한 제4예정된 허용한도 이내까지 확장한 중앙부를 추가로 하여 구성된 것을 특징으로 하는 자체위치고정 열전달기.7. The self-positioning heat transfer device according to claim 6, further comprising a central portion extending to the die yarn provided in the capsule position of the heat transfer device within a fourth predetermined allowable limit for the first surface of the lead frame portion. . 적어도 리드프레임 및 열전달기를 가진 반도체 장치를 캡슐화하는 방법에 있어서, 모울드 공동내에 열전달기를 배치하는 것과, 모울드 공동의 두개의 벽돌에 대하여 열전달기를 위치하도록 열전달기의 두개측면상에 위치고정하는 스텐드 오프들을 제공하는 것과, 모울드 공동의 다른 두개의 벽들에 대하여 열전달기를 제공하도록 열전달기의 각각의 단부상에 적어도 하나의 가늘게 된 림을 제공하는 것과, 열전달기 바로 아래에서 자유롭게 유동하는 캡슐을 허용하도록 열전달기의 하부면을 따라서 채널을 제공하는 것과, 모울드 공동내에 리드프레임을 배치하는 것과, 모울드 공동을 접속하는 것과, 그리고 모울드 공동내에 캡슐을 주입하는 방법으로 된 것을 특징으로 하는 자체위치고정 열전달기.A method of encapsulating a semiconductor device having at least a leadframe and a heat transferer, the method comprising: placing a heat transfer in a mold cavity and standoffs positioned on two sides of the heat transferer to position the heat transfer with respect to the two bricks of the mold cavity; Providing at least one tapered rim on each end of the heat carrier to provide heat transfer to the other two walls of the mold cavity, and to allow the capsule to flow freely underneath the heat transfer. Self-positioning heat transfer comprising: providing a channel along a bottom surface of the device, placing a leadframe in the mold cavity, connecting the mold cavity, and injecting a capsule into the mold cavity. 리드 프레임 반도체 다이, 및 열전달기를 갖는 반도체 장치에 있어서 열전달기는 각각의 림의 말초단부에서 가늘게 한 각각의 림의 내부에 지들을 지닌 분기림들을 한정하기 위하여 열전달기의 적어도 두개의 단부에 형성된 노치들과 열전달기의 각각의 측면으로부터 확장한 적어도 한쌍의 공간격리래터럴 스텐드 오프들과 열전달기의 제1표면으로부터 확장한 적어도 한쌍의 공간격리리피트와 그리고 하나의 노치들로부터 다른 하나의 노치들까지 확장한 제1표면을 따라서 형성된 채녈을 구성되는 것을 특징으로 하는 자체위치고정 열전달기.In a semiconductor device having a lead frame semiconductor die and a heat transfer device, the heat transfer device includes a notch formed at at least two ends of the heat transfer unit to define branching branches having edges inside each rim tapered at the distal end of each rim. At least one pair of spatially isolated lateral standoffs extending from each side of the field and heat transferr and at least one pair of spatially isolated repeats extending from the first surface of the heat transferr and from one notch to the other notch. Self-positioning heat transfer comprising a channel formed along a first surface. 제9항의 반도체 장치에 있어서, 열전달기는 반도체 다이에 아주 근접하여 배치되도록 열전달기의 제2표면상에서 상승되는 부를 포함하고, 그리고 상기 제2표면은 열전달기 및 리드프레임 사이에서 전자적으로 전도접촉을 방지하기 위해 절연필름을 갖는 것을 특징으로 하는 자체위치고정 열전달기.10. The semiconductor device of claim 9, wherein the heat transfer device includes a portion raised on the second surface of the heat transfer device to be disposed in close proximity to the semiconductor die, and the second surface is electrically conductively contacted between the heat transfer device and the lead frame. Self-positioning heat transfer, characterized in that it has an insulating film to prevent. ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is to be disclosed based on the initial application.
KR1019830001389A 1982-04-05 1983-04-04 Self-positioning heat transfer KR840004828A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36511482A 1982-04-05 1982-04-05
US365,114 1982-04-05

Publications (1)

Publication Number Publication Date
KR840004828A true KR840004828A (en) 1984-10-24

Family

ID=23437521

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830001389A KR840004828A (en) 1982-04-05 1983-04-04 Self-positioning heat transfer

Country Status (6)

Country Link
EP (1) EP0104231A4 (en)
JP (1) JPS59500541A (en)
KR (1) KR840004828A (en)
CA (1) CA1201817A (en)
IT (1) IT1164597B (en)
WO (1) WO1983003712A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2597261B1 (en) * 1986-04-11 1988-10-14 Aix Les Bains Composants ENCAPSULATION BOX OF INTEGRATED CIRCUITS WITH IMPROVED THERMAL DISSIPATION, AND MANUFACTURING METHOD
JP3322429B2 (en) * 1992-06-04 2002-09-09 新光電気工業株式会社 Semiconductor device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6901240A (en) * 1968-01-26 1969-07-29
DE2004768C3 (en) * 1968-07-30 1979-09-06 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) Semiconductor component
GB1239634A (en) * 1968-10-02 1971-07-21
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS53126275A (en) * 1977-04-11 1978-11-04 Hitachi Ltd Semiconductor device
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
JPS55134951A (en) * 1979-04-10 1980-10-21 Toshiba Corp Semiconductor device
JPS6050346B2 (en) * 1980-04-16 1985-11-08 日本電気株式会社 Manufacturing method of semiconductor device
FR2488445A1 (en) * 1980-08-06 1982-02-12 Efcis PLASTIC CASE FOR INTEGRATED CIRCUITS

Also Published As

Publication number Publication date
IT1164597B (en) 1987-04-15
WO1983003712A1 (en) 1983-10-27
EP0104231A1 (en) 1984-04-04
IT8348015A0 (en) 1983-03-29
CA1201817A (en) 1986-03-11
JPS59500541A (en) 1984-03-29
EP0104231A4 (en) 1985-10-30

Similar Documents

Publication Publication Date Title
US7541669B2 (en) Semiconductor device package with base features to reduce leakage
US3423516A (en) Plastic encapsulated semiconductor assemblies
US5334872A (en) Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad
US4167647A (en) Hybrid microelectronic circuit package
KR950021435A (en) Resin-sealed semiconductor device and manufacturing method thereof
KR940013306A (en) Electronic module with flat structure
KR920003482A (en) Semiconductor device and semiconductor package
KR920704554A (en) Housing for electronic circuit
KR920011310A (en) Electronic seal and manufacturing process
CA1230184A (en) Liquid cooling type high frequency solid state device
JPS5745959A (en) Resin-sealed semiconductor device
KR920007134A (en) IC package with electrical leads in the dielectric package body
JPS5825246A (en) Package for electronic device
MY106696A (en) Electrically isolated heatsink for single-in-line package
GB1207728A (en) Housing assembly for an electric circuit
GB1238569A (en)
KR920015577A (en) Semiconductor device
KR840004828A (en) Self-positioning heat transfer
KR960016668A (en) Microelectronics with package with internal conduit for cooling fluid passage
US4196444A (en) Encapsulated power semiconductor device with single piece heat sink mounting plate
US5137479A (en) Lead structure for packaging semiconductor chip
US3723833A (en) Heat sinking of semiconductor integrated circuit devices
US5953593A (en) Method and mold for manufacturing a plastic package for an electronic device having a heat sink
US3753634A (en) Molding means for strip frame semiconductive device
KR870003563A (en) Semiconductor device

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid