KR830005811A - Copper foil for printed circuit and manufacturing method thereof - Google Patents

Copper foil for printed circuit and manufacturing method thereof Download PDF

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Publication number
KR830005811A
KR830005811A KR1019810001120A KR810001120A KR830005811A KR 830005811 A KR830005811 A KR 830005811A KR 1019810001120 A KR1019810001120 A KR 1019810001120A KR 810001120 A KR810001120 A KR 810001120A KR 830005811 A KR830005811 A KR 830005811A
Authority
KR
South Korea
Prior art keywords
printed circuit
manufacturing
copper foil
copper
containing phosphorus
Prior art date
Application number
KR1019810001120A
Other languages
Korean (ko)
Other versions
KR840001643B1 (en
Inventor
히로시 나까쯔가와
Original Assignee
마쯔오까 아다라시
후루가와 서킷트 호일 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마쯔오까 아다라시, 후루가와 서킷트 호일 가부시끼 가이샤 filed Critical 마쯔오까 아다라시
Priority to KR1019810001120A priority Critical patent/KR840001643B1/en
Publication of KR830005811A publication Critical patent/KR830005811A/en
Application granted granted Critical
Publication of KR840001643B1 publication Critical patent/KR840001643B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

내용 없음No content

Description

인쇄 회로용 구리박판 및 그의 제조방법Copper foil for printed circuit and manufacturing method thereof

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (2)

인쇄회로용 구리박판에 있어서, 구리층과, 상기 구리층의 한측부 또는 각각의 측부에 형성된 인을 함유하는 니켈층을 포함하는 것을 특징으로하는 인쇄회로용 구리박판.A copper foil for printed circuit, comprising: a copper layer and a nickel layer containing phosphorus formed on one side or each side of the copper layer. 인쇄회로용 구리박판의 제조방법에 있어서, 인을 함유하는 화합물을 분해시키는 니켈도금수숑액에서 전기도금하므로써 구리층의 한측부 또는 각각의 측부에 인을 함유하는 니켈층을 형성시키는 공정을 포함하는 것을 특징으로 하는 인쇄회로용 구리박판의 제조방법.A method of manufacturing a copper thin plate for a printed circuit, the method comprising: forming a nickel layer containing phosphorus on one side or each side of the copper layer by electroplating in a nickel plating solution that decomposes a compound containing phosphorus; Method of manufacturing a copper foil for a printed circuit, characterized in that. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019810001120A 1981-04-03 1981-04-03 Copper foil for a printed circuit KR840001643B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019810001120A KR840001643B1 (en) 1981-04-03 1981-04-03 Copper foil for a printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019810001120A KR840001643B1 (en) 1981-04-03 1981-04-03 Copper foil for a printed circuit

Publications (2)

Publication Number Publication Date
KR830005811A true KR830005811A (en) 1983-09-09
KR840001643B1 KR840001643B1 (en) 1984-10-12

Family

ID=19220610

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019810001120A KR840001643B1 (en) 1981-04-03 1981-04-03 Copper foil for a printed circuit

Country Status (1)

Country Link
KR (1) KR840001643B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100401340B1 (en) * 2001-11-16 2003-10-10 엘지전선 주식회사 The surface treatment of electrodeposited copper foil for Printed Circuit Board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100553840B1 (en) * 2003-05-29 2006-02-24 일진소재산업주식회사 Method for manufacturing thin copper film for printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100401340B1 (en) * 2001-11-16 2003-10-10 엘지전선 주식회사 The surface treatment of electrodeposited copper foil for Printed Circuit Board

Also Published As

Publication number Publication date
KR840001643B1 (en) 1984-10-12

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