KR830005321A - Adhesive Compositions Used in Metal-to-Metal Adhesion - Google Patents

Abstract

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Description

Adhesive Compositions Used in Metal-to-Metal Adhesion

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Claims (14)

Metal powder selected from the group consisting of aluminum and copper with at least one amorphous thermoplastic polyamide resin having a softening point of less than about 150 ° C., which accounts for 30-90 of the weight of the adhesive composition and accounting for 10-70% of the weight of the composition A thermally conductive high melting point adhesive composition for use in metal bonding with metal with filler. The adhesive composition of claim 1 having two amorphous thermoplastic polyamide resins having a softening point of less than about 150 ° C. The adhesive composition of claim 1 having an amorphous thermoplastic polyamide resin having a softening point of about 150 ° C. or higher. The adhesive composition of claim 3 wherein the ratio of high softening point resin to low softening point resin is in the range of 1: 1 to 1: 3. Adhesive composition of claim 1 having a reactive or thermoset polyamide resin. The adhesive composition of any one of claims 1 to 5, wherein the metal powder has a particle size in the range of 100 mesh to 550 mesh. The adhesive composition of claim 6, wherein the metal powder has a particle size in the range of 200 mesh to 350 mesh. The adhesive composition of claim 7, wherein the metal powder is a mixture of 220 mesh particles and 350 mesh particles. The adhesive composition of any one of claims 1 to 8 having a plasticizer for said polyamide resin. The adhesive composition of claim 9 wherein the plasticizer comprises up to 25% of the weight of the composition. Applying the adhesive composition of claim 1 to a primary metal substrate, preheating the secondary metal substrate to a temperature not exceeding the softening temperature of the adhesive composition, and contacting the secondary metal substrate on the primary metal substrate as the adhesive composition. To bond the metal substrate having a process of cooling the primary and secondary metal substrates to fix the adhesive composition and to increase the temperature of the primary and secondary metal substrates to a temperature above the softening temperature. . Applying the adhesive composition of claim 1 to the coil or tube, preheating the substrate to a temperature not exceeding the softening temperature of the adhesive composition, placing the substrate in contact with the coil or tube and placing the substrate and the coil or tube A method of adhering a metal coil or tube to a metal plate substrate, wherein the temperature increases above a temperature and has a process of cooling the coil or tube and the substrate for fixing the adhesive composition. The method of claim 11 or 12 wherein the preheating temperature is about 20 ° C. below the softening temperature of the adhesive composition. The secondary metal substrate is passed through a preheating portion preheated by a preheating platen, and the adhesive composition assembles the primary metal substrate applied to the secondary metal substrate at the preheating portion, and continues the primary and A support device for holding an assembly of secondary metal substrates is used, the assembly is passed through a heating portion heated by a heating platen, the assembly is passed through a cooling portion cooled by a cooling platen, and the support apparatus is moved. The method of claim 11 having a removal process. ※ Note: The disclosure is based on the initial application.