KR830004331U - Hybrid integrated circuit sealing structure - Google Patents

Hybrid integrated circuit sealing structure

Info

Publication number
KR830004331U
KR830004331U KR2019820003095U KR820003095U KR830004331U KR 830004331 U KR830004331 U KR 830004331U KR 2019820003095 U KR2019820003095 U KR 2019820003095U KR 820003095 U KR820003095 U KR 820003095U KR 830004331 U KR830004331 U KR 830004331U
Authority
KR
South Korea
Prior art keywords
integrated circuit
sealing structure
hybrid integrated
circuit sealing
hybrid
Prior art date
Application number
KR2019820003095U
Other languages
Korean (ko)
Other versions
KR860000239Y1 (en
Inventor
아끼라 가자미
다께오 콘도오
Original Assignee
산요덴기 가부시기가이샤
도오교오 산요덴기 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 산요덴기 가부시기가이샤, 도오교오 산요덴기 가부시기가이샤 filed Critical 산요덴기 가부시기가이샤
Publication of KR830004331U publication Critical patent/KR830004331U/en
Application granted granted Critical
Publication of KR860000239Y1 publication Critical patent/KR860000239Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/298—Semiconductor material, e.g. amorphous silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
KR2019820003095U 1981-10-26 1982-04-20 Mould in compound integrated circuit KR860000239Y1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1981160053U JPS5866646U (en) 1981-10-26 1981-10-26 Sealing structure of hybrid integrated circuit
JP56-160053(U) 1981-10-26

Publications (2)

Publication Number Publication Date
KR830004331U true KR830004331U (en) 1983-12-30
KR860000239Y1 KR860000239Y1 (en) 1986-03-05

Family

ID=29952483

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019820003095U KR860000239Y1 (en) 1981-10-26 1982-04-20 Mould in compound integrated circuit

Country Status (2)

Country Link
JP (1) JPS5866646U (en)
KR (1) KR860000239Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3539467B2 (en) * 1997-03-25 2004-07-07 ミツミ電機株式会社 Electronic component module

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139206U (en) * 1977-04-07 1978-11-04

Also Published As

Publication number Publication date
JPS5866646U (en) 1983-05-06
JPS622775Y2 (en) 1987-01-22
KR860000239Y1 (en) 1986-03-05

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