KR830003601A - Steel plating electroplating without additives and their products - Google Patents

Steel plating electroplating without additives and their products Download PDF

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Publication number
KR830003601A
KR830003601A KR1019800003528A KR800003528A KR830003601A KR 830003601 A KR830003601 A KR 830003601A KR 1019800003528 A KR1019800003528 A KR 1019800003528A KR 800003528 A KR800003528 A KR 800003528A KR 830003601 A KR830003601 A KR 830003601A
Authority
KR
South Korea
Prior art keywords
solution
gold
anode
cyanide
electroplating
Prior art date
Application number
KR1019800003528A
Other languages
Korean (ko)
Inventor
로버트 블레싱톤 다니엘
러스 버클리 레지날드
바야드 코흐 프레데릭
유다까 오끼나까
사드 리챠드
Original Assignee
오. 이. 앨버
웨스턴 이렉트릭 컴패니, 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오. 이. 앨버, 웨스턴 이렉트릭 컴패니, 인코퍼레이티드 filed Critical 오. 이. 앨버
Publication of KR830003601A publication Critical patent/KR830003601A/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

내용 없음No content

Description

첨가제가 없는 강금 전기도금 및 그 산물Steel plating electroplating without additives and their products

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제 1 도는 본 발명의 실시에 적합한 형태의 하나인 판형기구의 횡단면도.1 is a cross-sectional view of a plate-shaped mechanism which is one of forms suitable for the practice of the present invention.

제 2 도는 본 발명에 따라서 사용하기 적합한, 특히 고생산이 요구되는, "스트립(strip)" 도금기 라인의 개략도.Figure 2 is a schematic diagram of a "strip" plating machine line suitable for use in accordance with the present invention, particularly where high production is required.

제 3 도는 제 2 도의 라인에 포함된 고속도금 셀(cell)의 횡단면도.3 is a cross-sectional view of a high speed plating cell included in the line of FIG.

제 4 도는 다른 관련된 변수들이 일정한 상태하에서 본 발명에 따라 생산된 도금의 두특성에 관한 도표. (온도에 따른 누우프경도)4 is a diagram of two characteristics of plating produced in accordance with the present invention with other related variables constant. (Keep hardness according to temperature)

Claims (1)

표면이 양극에 관련된 음극을 만들고, 표면과 양극은 시안화물 유니트의 모든 수와 같은 량으로 시안화물을 포함하는 금 포함 수성 이온화용액에 의해 적셔지며, 각각의 시안화물유니트는 단일 탄소원자와 단일 질소원자를 포함하고, 용액내에서 금원자의 모든 수와 최소한 같게 용해물로 충전되며 상기 용액은 상기 표면과 상기 양극 사이에 이온화물 이송용통로를 규정하는, 최소한 100의 누우프경도수를 갖고 있는 금-포함 피착물과 부품의 최소한 일부분의 표면을 전자도금하기 위한 처리방법에 있어서, 특히, 코발트, 니켈, 칼슘 및 비소와 같은 경도성분을 갖고 있고 부수적인 금속성분의 0.1중량퍼센트보다 더 많이 포함하지 않은 경도를 갖고 있으며 5㎛ 정방형의 견본지역내의 0.5㎛의 평평한 것으로부터 최대 허용공차 편차로 규정되는 주요면의 최소한 95퍼센트 이상으로 유연해지는 금 피착물을 상기 표면상에 만들기 위해서, 1) 상기 용액이 경화금속의 전체량을 포함하고 7.5pH 이하를 갖고 있으며 상기 용액의 상기 금용량의 0.5퍼센트를 넘지 않도록 충전되게 하고, 2) 상기 표면 부근의 상기 용액의 온도가 50℃ 보다 크지 않은 온도로 유지되게 하며, 3) 상기 표면 부근의 상기 용액의 흐름속도가 최소한 50cm/sec로 되게 하며, 4) i, 이 금도금 속도를 증가시키지 않게 증가하는 전류인 중량 이송제한 전류로 규정될 때 상기 양극에 관련된 상기 표면 음극을 유지하게 하는 전류 흐름이 0.9i, 보다 크지 않은 최대값으로 되도록 하기 위해서, 도금 상태가 조정되도록 처리하는 것을 특징으로하는 첨가제가 없는 강금 전기도금 및 그 산물.The surface makes a cathode related to the anode, and the surface and anode are wetted by a gold-containing aqueous ionization solution containing cyanide in the same amount as all the number of cyanide units, each cyanide unit having a single carbon atom and a single nitrogen Containing atoms and filled with a lysate at least equal to all the number of gold atoms in the solution, the solution having at least 100 knoop hardness coefficients defining an ionic transport path between the surface and the anode; Processes for the electroplating of the surface of at least a portion of gold-containing deposits and parts, in particular containing more than 0.1% by weight of incident metals with hardness such as cobalt, nickel, calcium and arsenic Of major surfaces defined as the maximum allowable tolerance deviation from flat of 0.5 µm in a sample area of 5 µm square. In order to make a gold deposit on the surface that becomes soft to at least 95 percent, 1) the solution contains the entire amount of hardened metal and has a content of 7.5pH or less and is filled not more than 0.5 percent of the gold capacity of the solution 2) the temperature of the solution near the surface is maintained at a temperature no greater than 50 ° C., 3) the flow rate of the solution near the surface is at least 50 cm / sec, and 4) i, The plating state is adjusted so that the current flow that maintains the surface cathode associated with the anode is not greater than 0.9i, when defined as the weight transfer limit current, which is an increasing current without increasing the gold plating rate. An additive-free steel plating electroplating and product thereof characterized by the treatment. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019800003528A 1979-09-06 1980-09-05 Steel plating electroplating without additives and their products KR830003601A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7306679A 1979-09-06 1979-09-06
US73.066 1979-09-06

Publications (1)

Publication Number Publication Date
KR830003601A true KR830003601A (en) 1983-06-21

Family

ID=22111517

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019800003528A KR830003601A (en) 1979-09-06 1980-09-05 Steel plating electroplating without additives and their products

Country Status (3)

Country Link
EP (1) EP0025220A1 (en)
JP (1) JPS5644791A (en)
KR (1) KR830003601A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5318687A (en) * 1992-08-07 1994-06-07 International Business Machines Corporation Low stress electrodeposition of gold for X-ray mask fabrication
ES2166660B1 (en) * 1999-05-06 2003-02-16 Torres Josep Ferre PROCEDURE AND EQUIPMENT FOR THE ELECTRODEPOSITION OF GOLD OR GOLD ALLOYS.
US20050158621A1 (en) * 2003-09-30 2005-07-21 Benoit Stephen A. Battery with flat housing
DE102005036133C5 (en) 2005-07-26 2017-07-13 Ivoclar Vivadent Ag Bath for the electrodeposition of gold and gold alloys and additive mixture for such a bath

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1070683A (en) * 1964-04-01 1967-06-01 Engelhard Ind Inc Improvements in or relating to the electro-deposition of gold alloys
GB1177373A (en) * 1966-01-21 1970-01-14 Engelhard Min & Chem Improvements in or relating to gold electroplating
US3423295A (en) * 1966-02-23 1969-01-21 Engelhard Ind Inc Gold plating
US3617452A (en) * 1969-07-03 1971-11-02 Engelhard Min & Chem Gold plating
DE1941822B2 (en) * 1969-08-16 1972-12-28 Deutsch Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt GALVANIC GOLD ALLOY BATH FOR DEFINING HIGH AND LOW ALLOY GOLD COATINGS
DE2523510B1 (en) * 1975-05-27 1976-10-14 Siemens Ag Acid gold cyanide plating solution - for the production of gold and gold alloy coatings

Also Published As

Publication number Publication date
JPS5644791A (en) 1981-04-24
EP0025220A1 (en) 1981-03-18

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