KR830001878B1 - Device for mounting parts on printed circuit boards - Google Patents

Abstract

A device and a method of automatically mounting plateshaped chips on printed circuit boards, the chips first being aligned and positioned with respect to each other before they are glued onto the printed circuit board, after which the whole assembly of parts is soldered down.

Description

Device for mounting components on a printed circuit board

1 is a perspective cross-sectional view of a magazine having components arranged in a matrix holder and a suitable conveying device.

2 is a perspective view of a transfer device and a transfer unit.

3 is an enlarged cross-sectional view of the transfer stage shown in FIG.

4 is an enlarged perspective view of the calibration plnte shown in FIG.

Figures 5a, 5b and 5c show printed circuit boards having parts and transfer stages in different positions during the execution of the method.

6A and 6B are cross-sectional views of the device for attaching parts in two locations.

7A, 7B, 7C and 7D are diagrams of an apparatus for attaching a printed circuit board at various locations.

8A, 8B, 8C, and 8D show the operation of the quartz plate shown in FIG.

9a to 9g illustrate the principle of mutual operation between the quartz plate and the conveying plate.

10 is an enlarged view of the transfer apparatus.

11 shows the separating means of the present invention.

FIELD OF THE INVENTION The present invention relates to an apparatus for mounting a plate-shaped electrical component on a printed circuit board, the tubular being arranged at a given relative position relative to each other corresponding to a predetermined position of the component with respect to each other on the printed circuit board. ) Are stacked in magazines.

It is known to manufacture printed circuit boards by printing the conductor tracks on the gig of insulating material so that the conductor tracks are connected in accordance with the circuit pattern to be realized by the electrical components arranged on the insulating boards. In general, for this printed circuit board, a part including a connection wire welded on the side of the conductor track and inserted through a hole in the board is used. However, in order to reduce these circuits, the bottom as well as the top of the substrate has recently been equipped with conductor tracks. Preferably one side of the substrate is provided with parts having a connecting wire which projects slightly over the surface of the other side of the substrate and is inserted through a hole in the substrate. The other side of the substrate is arranged in the space between the so-called chip-like components and the wire connections. Chips are understood to mean components that do not include a conventional connection wire. The chips here contain very short studs or splices and splices.

The German Offen Les Schrift 27 16 330 describes a device for mounting plate- or block-type electrical components on a printed circuit board. In other words, the device can be mounted on a printed circuit board which increases the amount of adhesion at a given repair position on its bottom side. These parts are transferred to a printed circuit board from a number of tubular magazines that are stacked and arranged in a magazine arrangement. That is, the upper parts stacked in each magazine each time are pressed by the corresponding adhesion amount on the printed circuit board.

The German Offensives Schiffre also describes a method for mounting a plate or block component on a printed circuit board by the apparatus.

Known devices and known methods suffer from a number of drawbacks of proportionally hindering and accurately producing in volume. The reduction of circuits is only possible to a given extent because the printed circuit boards have the components directly from the stack containing the components' magazines. The magazine is relatively large and has a corresponding large space containing the desired tolerances that should be freed between locations on the printed circuit board on which the component is to be provided.

Another drawback of the known devices is that parts of different thicknesses cannot be mounted on a printed circuit board at the same time. Only parts of the same thickness can be processed during one mounting movement. This is because the arranged magazines are on the printed circuit board and include means for conveying parts from the magazine in the same stroke and the parts guided in the arrangement of the magazines so that the openings are always located in one side. That is, only the thickness tolerances of the respective elements are compensated by the elastic mounting of each transfer device. The distance between the opening of the magazine and the desired circuit board is so large that only a minimum thickness of the part contacts the printed circuit board each time. Thicker parts from other magazines are not realized. The distance between the opening of the magazine and the printed circuit board is so large that the parts with the largest thickness are ejected from the magazine. In a given state several parts are released simultaneously from a magazine containing parts of small thickness. These various parts are loosened without the guides and holders except for one part contained by the printed circuit board by the attachment provided here.

Furthermore, in this known device only a single part is extracted from the magazine each time. Parts are actually fitted for a variety of reasons. This shortcoming is not always eliminated by a tendency to include an elastic tongue, as described in the German Offensives Srift 27160 330.

This is because the operation by this depends on the respective tolerances of the successive parts. For example, it is not contained in the smallest sized part between the largest sized parts within the tolerance limits of the magazine parts.

Moreover, the complete operation of this device depends almost on the form of the magazine and imposes strict requirements as related to their uniformity. However, this does not always appear when using magazines made by other manufacturing methods.

It should be noted that the complete separation of these components after release from the magazine will be satisfactory to fully mount these elements on the printed circuit board.

It is an object of the present invention to provide an apparatus for mounting plate-type electrical components (chips) on a printed circuit board capable of simultaneously mounting a plurality of component types on the printed circuit board at a smaller distance from each other than known devices. . Multiple parts of different thickness are arranged simultaneously on a printed circuit board in a single operation and the separation of these parts is assured even if the thickness is different.

The purpose is to provide a device for mounting a plate-shaped component on a printed circuit board with a plurality of retractable suction tubes which transfer the component from the magazine onto the printed circuit board and on the opposite side of the opening of the magazine and protrude from the conveying plate to transfer the components. According to the present invention comprising a transfer plate comprising a.

In a preferred embodiment of this device the free end length of the suction tubes protruding from the conveying plate is different and corresponds to the thickness difference of the components conveyed by each suction tube.

The overall length of the suction tubes and the distance between the conveying plate and the quartz plate are chosen so that the parts can be pressed on the printed circuit board even though the wire ends protrude as shown above. Therefore, parts with different thicknesses can be processed simultaneously by the mounting apparatus, and the parts are placed in one surface for mounting on the printed circuit board despite the different thicknesses. Moving parts from a magazine can always be adjusted so that only one part is moved from each magazine.

In another preferred embodiment according to the present invention, a quartz plate, which can be inclined in the X or Y direction with respect to the transfer plate, is arranged between the transfer plate and the printed circuit board. The revision plate includes a plurality of openings corresponding to the part to be conveyed and which the tongue tolerance is correct. A suction tube for conveying the part protrudes in the opening with free space corresponding to the thickness of the part to be conveyed from the magazine. The quartz plate consists of a conical discrete crystal element with openings arranged along the matrix. Therefore, the parts can be focused and positioned very accurately with respect to the position on the printed circuit board provided with the parts, and switching to another circuit pattern can be formed very simply by the corresponding rearrangement of the crystal elements.

Further embodiments of the present invention provide an auxiliary device for attaching to a printed circuit engine or parts by a stamp arranged in a plate having a number and a position corresponding to a position on a printed circuit board, each of which will be equipped with a component. It is characterized by including. These stamps allow for very accurate attachment. On the one hand each stamp comprises a head of elastic material and on the other hand very small sections corresponding to those of the parts are easily made to contact the surfaces between the parts arranged on the printed circuit engine. It is therefore possible for printed circuit boards not to be flat and components to be attached in a very accurate way.

Another embodiment according to the invention relates to a matrix holder configuration of a magazine. Each magazine can be arranged very quickly in the matrix holder and very well guided, focused, positioned and contained therein. This is because the matrix holders are arranged at a distance from each other and the matrix frame consists of a plurality of matrix frames in the openings in which the magazines are arranged, and the last frame is covered with a cover plate. The distance between the matrix frames continues to increase in the cover plate direction because the openings in each matrix frame are conical in correspondence to the cross section of the openings in the matrix frame. The largest cross section among them is located on the side of the matrix frame which is moved from the cover plate.

In another preferred embodiment of the invention the suction tube is elastically mounted in the transfer plate and is convertible. The suction tube has a cross section proportional to the cross section of the components to be included. This embodiment of the suction tube is important when the contained parts are very small. Because if a part is square, the largest part of the surface it contains is lost when it is enclosed in order to be able to hold these parts by a retractable tube.

However, enclosed suction tubes, which are easier to fabricate than tubes with square cross-sections, can be advantageously used when the parts with large contents and correspondingly large parts are contained and transported.

Another preferred embodiment of the present invention is characterized in that it comprises a conveying device comprising a conveying piston in each magazine for conveying the components in stages. The feed piston can be inclined in the hole of the pressure distribution box for the pressure-bearing medium. All holes through the space are filled with pressurized media.

This conveying device is preferably configured so that the separating box can be lifted and lowered by the separating activating device to be pressed. The separation box includes a switching piston having a plunger for counter-pressing and for limiting the location of the separation box with a plunger to limit the location of the separation box via a switch.

The transfer piston includes a needle tip at the end facing the magazine. The pressurized medium may be a gas, air or viscous paste type solution that cannot be pressed.

Highly accurate and good pressure adjustment and thus very precise stroke of each transport piston can be made distinct when the press medium is a viscose paste-type solution. Each oscillation of this conveying device allows parts of different thicknesses with respect to the suction tube to be arranged from the magazine in a single operation by a single device.

The method of fixing a plate-type electrical component on a printed circuit board by the above-described method has a number and position corresponding to the position of the printed circuit board on which the component is to be mounted, and is retractable opposite to the opening of the magazine in the transfer plate. The parts are carried into the magazine until the parts are glued and contained by the suction tube. The parts are transferred to the mounting position of the printed circuit board instead of the transfer plate, where these parts are contained by an attachment applied to the printed circuit board or parts.

According to another invention according to the present invention, since the light plate having the suction pipe is arranged in relation to the quartz plate having a number of openings corresponding to the suction pipe, the free space in the opening corresponds to the thickness of the part to be conveyed from the magazine. The suction tube carrying the part protrudes into the opening. After this each time the part slides against the suction tube in the opening and is thus contained. Since the conveying plate is moved with the quartz plate in the X or Y direction with respect to the magazine near the quartz plate, the openings of the magazine are at least partially covered by the quartz plate.

The movement of the transfer plate and the correction plate is performed well so that the pine plate rotates with the correction plate after removing one part each time by the suction pipe. As a result, the parts removed from the magazine are again located on the same side in the device as the opening of the magazine, so that all fisheries in the device can be carried out from one side. This allows each part to be easily and automatically remeasured and tested when needed. The attachment can easily be applied to the revolving position of the transfer plate. Furthermore, the printed circuit board may have components from the bottom side. This provides the advantage that the printed circuit board is not rotated between mounting the plate-shaped component from the bottom side and mounting other components from the top side. Other components already mounted on the printed circuit board prior to mounting the plate-shaped components cannot fall off the printed circuit board, so there is no need for further welding on the printed circuit board.

An advantage entailed by the present invention is that multiple plate-shaped parts of very different thicknesses and cross-sections can be simultaneously positioned on a printed circuit board in the location where the parts will be equipped. This is because the suction line can be used separately and its length can be selected depending on the thickness of the parts to be contained. Therefore, the parts to be transferred to the printed circuit board are all located in one surface even though the thicknesses of the respective parts vary greatly.

Another advantage of the present invention is that the stepwise transfer of parts into the magazine can be carried out with each stroke corresponding to the thickness of the parts stacked in the magazine.

Another advantage of the present invention is that complete separation of the moved parts from the magazine occurs after moving one part from the magazine with respect to the suction tube each time. Since the conveying plate and the receiving plate are moved relative to the magazine in the X or Y direction, each part moved from the magazine can be inclined to the edge of the magazine and the magazine is partially covered by the quartz plate and the other from the magazine during this phase. It is supported to move the part.

In special cases, the advantage is that the components are placed on a printed circuit board that is spaced from each other so as to be inclined larger than the components themselves. Because the parts can be positioned and connected very precisely by means of the device according to the invention and can be located in very small areas on the printed circuit board, they correspond proportionally to the cross section of the parts to contain the suction tube which carries the parts themselves. This is because it has a very small cross section which is inclined smaller than the cross sections.

Another advantage of the present invention is that by means of pressure-controlled-step transfer of parts in a magazine, the press medium can be a gas or viscose liquid that cannot be pressed, depending on the thickness of the parts shown in each stack of the stack of parts. Different strokes can be obtained by a single device.

Another advantage of the invention is that the mounting device according to the invention can be easily integrated into the machine of the manufacturing plant. As already known, firstly, a printed circuit board can be easily equipped with a component having a conventional connection wire. This printed circuit board can be equipped with a plate-like component by the device according to the invention during the next step before welding all the components. A very small area is needed to install the latter part between the parts already shown on the printed circuit board. This is because the attachment is artificial between the protruding parts by the separating stamp. Suction tubes used for arranging parts on a printed circuit can be reached as long as there is a printed circuit board between the protruding parts already present on the circuit board, as described above, having a smaller cross section than the parts themselves. Has a length.

For this mounting method it is advisable to apply the attachment locally in a controlled manner to the selected location where the stamp will be equipped with the part.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a perspective view of magazine 1 in matrix holder 3 comprising a plurality of matrix frames 5. Matrix frame 5 includes conical openings 7. The maximum cross section of this spherical opening 7 is removed each time from the cover plate covering frame 5. The frames 5 are arranged at each other at increasing distances in the direction of the cover plate 9. The position of the conical opening 7 of frame 5 offers the advantage that the stack of plate-shaped part 11 can be simply inserted into frame 5 quickly. This is because the largest cross section of the conical opening 7 is on the inlet side of the magazine 1. Magazine 1 is designed to be thin and guided very well. The increasing distance between the frames 5 in the direction of the cover plate 9 provides the advantage that the matrix holder 3 is very light and the magazines are properly and accurately contained and guided despite the overall length. In order to provide a plurality of parts on the printed circuit board in one operation, the plurality of magazines are arranged in positions relative to each other in the conical opening 7 corresponding to the relative positions of the parts with respect to the parts to be realized on the printed circuit board. On the side of the cover plate 9 controlled from the matrix holder 3 for conveying the plate-shaped part 11 in the magazine 1, the pressing medium 34 for moving the conveying end consisting of a needle tip 17 and a feeding piston 15 (Fig. 10). Dispensing box 14 is arranged. This distribution box is moved upward by the drive device 12 (FIG. 10). The transfer piston 15 is guided in an interconnected hole 18 through a space 16 filled with pressurized medium 34 such as, for example, a viscose solution or air which cannot be extruded. This transmission system compensates for the essential different strokes of each transfer piston 15. The needle tip 17 passes through opening 21 of cover plate 9 (only four openings 21 are shown for simplicity in the drawing). The plate-shaped parts are transferred from magazine 1 at an uneven rate. The required distance between frames 5 is adjusted by space 23. Reference numeral 25 denotes a space plate which contains grooves 36 and is free from pressure due to leakage of each transfer piston 15 when guided between magazines 1 and does not foul each transfer 11 and does not disturb the transfer.

2 systematically illustrates the transfer of a plate-shaped part 11 of different thickness into two magazines 1 by means of a moving piston 15 and its needle-shaped tip 17. Magazine 1 is in matrix holder 3 and the matrix of the holder with frame 5 is shown in the figure. The transfer piston 15 is joined in the distribution box 14 for the press medium and exposed to the press medium 34 appearing in the space 16 and the hole 18. Drive stage 12 lifts distribution box 14 until needle 17 slides component 11 in a corresponding manner. They first slide the stack of plate component 11 in the direction of the revision plate 27 until the plate component 11 contacts the suction tube 29 (described in detail later). The pressure sent on the space 16 can be transferred by the press medium to a pressure sensor (not shown) which causes the decomposition box 14 to transfer when the switch is turned off. The lack of pressure in the suction tube 29 is created through the hole 33. Parts of different thickness (two stacking parts in two magazines 1 in Fig. 2) are picked up by suction tube 29 so that all parts 11 contained by suction tube 29 are in one plane, despite their different thicknesses. The suction tubes 29 can each be arranged in the conveying plate 31 so that different length tubes can be used. Therefore, using the transfer plate 31, parts of different thicknesses can be transferred in a single operation to the printed circuit board on which the parts are to be provided.

3 is an enlarged view of the suction pipe 29 and the transfer plate 31 again. The plate part 11 (different thicknesses) is in magazine 1. Each time part 11 'is moved as far as possible into the modification 27 in contact with the suction tube 29. Modification plate 2 includes an opening 19 which varies with the size of the parts to be transferred to the printed circuit board and should be slightly larger than these parts.

In order to properly match the various cross sections of the complete device to the various sizes of the components, the revision plate 27 consists of a frame in which the conical section 37 (see FIG. 4) with different openings can be arranged.

The suction tube 29 is elastically contained in the transfer plate 31 by the spring 39 to flexibly position the component 11 'contained by the suction tube 29 on the printed circuit board and compensate for the thickness tolerance of each component to be fixed.

5a to 5c show the transfer of the component 11 'to the printed circuit board 41 by the suction tube 29. FIGS. On the side of the printed circuit board 41 in contact with the transfer plate 31, a component 43 consisting of a connecting wire 45 is already mounted during the subsequent mounting step. Due to the very small size of the suction tube 29 which has a cross section slightly smaller than the plate-shaped component 11 'to be arranged on the printed circuit board, the plate-shaped component 11' can be positioned very precisely between the connecting wires 45 of the component 43 and the component 11 ' The very accurate guidance of is confirmed by revision 2. Bonding point 49 having a height corresponding to the free length of the connecting wire 45 inserted through the printed circuit board 41 (this height is slightly larger) prevents the correction plate 27 from adjoining the connecting wire protruding through the printed circuit board 41. .

FIG. 5A shows the suction tube 29 in the first phase of the process through which the quartz plate 27 passes and the plate-shaped part 11 'is contained together. During the subsequent mounting step, the amount 69 'of one of the two component contact glues is deposited at the location where the part will be equipped. During the different mounting stages, the other components of the two-component connection glue are provided on the part 11 contained by the suction tube 29.

FIG. 5B shows how the suction tube 29 correctly presses the component 11 'at the position on the printed circuit board which provided the contact glue.

FIG. 5C shows a mounting step in which plate-shaped parts 11 ′ having different thicknesses are simultaneously transferred to the printed circuit board 41 by the suction pipe 29 by eliminating the pressure deficiency. The parts are contained on the substrate by reaction of the glue and the suction tube 29 is recovered.

5a and 6b show an apparatus for applying glue to part 11 'contained by suction tube 29. FIG. The stamp comprising the attachment part 57 consisting of an elastic material is elastically contained in the plate 53. To extract the glue 59 from the glue container 61, the plate 53 is moved in the direction of the glue container 61 as long as the amount of glue 59 'is picked up by the tip of the attachment portion 57. The transfer plate 31 and the correction plate 27 are positioned such that the glue 59 'shown on the stamp 55 is transferred to the plate-shaped part 11' contained on the transfer plate 31 by the suction pipe 29 by the lowering of the plate 53.

Figure 6b shows a plate part 11 'with a glue 59.

7A, 7B and 7C show an apparatus for supplying glue to a printed circuit board 41. Stamp 65 is elastically mounted in plate 63. Stamp 65 includes an attachment portion 67 composed of an elastic material. To extract glue 69 from glue container 71, plate 63 is moved toward glue container 71 as long as the amount of glue 69 'is picked up by the tip of attachment 67. The printed circuit board 41, which already has the component 43 comprising the connecting wire 45, is positioned so that the glue 69 'on the stamp 65 is transported to the position on the printed circuit board 41 where the plate-shaped component 11' is to be arranged by the movement of the plate 63. .

7C shows a printed circuit board 41 having a glue 69 '.

Figure 7d shows another embodiment of an apparatus for feeding glue to the position of the printed circuit board on which the components are to be mounted. However, this device can also be used to supply glue to the parts. Stamp 65 made of an elastic material (preliminary rubber) such as plate 63 is fixed on plate 63 and their number and position correspond to the maximum number of positions to be glued in one operation.

If only a selected number of positions are glued by this embodiment of the device according to the invention in one operation, the plate 83 comprising an opening 89 corresponding to the position to be glued is a distribution box 75 for pressurized medium such as air. And plate 63 with stamp 65 is arranged.

On the elastic plate 63 is arranged a static hole mask 77 which includes the number of holes 79 to distribute corresponding to the maximum number of positions to be glued in one operation. Stamp 65 is conveyed through hole 79 of hole mask 77. For example, the first hole plate 81, the plate 83 arranged on the hole plate 81, the cover plate 85, and the second hole plate 87 are conveyed by the distribution box 75 to the elastic material at a position where the opening 89 appears in the plate 83. It is conveyed by the compressed air pressing stamp 65 upwards.

8a to 8d show systematically the very accurate positioning of part 11 by revision plate 27. As already noted, the correction plate 27 is composed of matetics in which the conical portions comprising the opening 19 can be arranged separately. Until plate-shaped part 11 is in the vicinity of revision plate 27 (see Fig. 8), this plate is moved in the X-direction (Fig. 8c) and Y-direction (Fig. 8b) with zero transfer plate 31, The parts 11 along the recess 19 are precisely arranged with respect to the position on the printed circuit board (Fig. 8) where the parts are equipped. The movement of revision 27 in the X and Y directions not only correctly positions part 11 but also prevents double pickup of the parts. It also acts as a cover for other parts stuck in the magazine after the revision plate has moved.

9A to 9G show the interaction relationship between the quartz plate 27 and the transfer plate 31. Transfer plate 31 and revision plate 27 transfer plate into opening 19 of revision plate 27 with free space remaining in opening 19 corresponding to the thickness of the part 11 to be taken from magazine 1 arranged directly below revision plate 27 in frame 5 (see also figure 9a). The suction tubes 29 of 31 are arranged at intervals from each other so as to protrude.

FIG. 9B shows part 11 ′ in opening 19 that mechanically connects to suction tube 29. In order for the part 11 'appearing in the opening 19 to be properly removed from the stack of the part 11 in magazine 1 and not to be picked up by other parts, the revision plate 27 is adapted to the position of the part 11' appearing in the opening 19 of the correction plate 27. It is moved together with the transfer plate 31 to be separated by the correction plate 27 (see also 9c) to enable handling. For example, from the same side, the transfer plate 31 and the correction plate 27 are rotated together regardless of the position of the opening of the magazine 1 (see also FIG. 9d).

FIG. 9E shows that part 11 'appearing in conveyance plate 31, quartz plate 27 and opening 19 in rotation has an amount of glue 59'. The modification step of revision 27 is then performed just before mounting the component 11 'on the printed circuit board to accurately position and align the component 11'. For this purpose, the quartz plate 27 is moved in the Y and Y directions so that the component 11 'to be transferred to the printed circuit board is stuck by at least one sidewall of the opening 19 (see also FIG. 9f).

Next, the conveying plate 31 is moved in a rectangle of the printed circuit board 41 such that the part 11 ', which flows down from the suction pipe 29, passes through the opening 19 of the quartz plate 27 and reaches a position 73 on the printed circuit board 41 on which the part 11' is to be arranged. When two-component glue is used, one component of glue 69 is applied at position 73 where the components will be mounted before mounting the component 11 'on the printed circuit board 41, in which case the other component of the two-component glue is glued. Applied to part 11 ', such as 59'.

FIG. 10 examines the principle of a pressure-controlled conveying system for conveying 11 measured in magazine 1. FIG.

In order to move the component 11 in the direction of the suction tube 29 opposite the stack, the transfer piston 15 is arranged in a distribution box 14 'for the pressing medium 34 which comprises a system of a delivery space consisting of a space 16 and a hole 18. One hole 18 guides the transfer piston 15 and the other hole 18 transfers to space 19 following the principle of the transfer container. Space 16 is closed at two ends, closed at one end by suture 20 and at the other end by switching piston 24 loaded by spring 22. Thus, for example, here the plunger 26 is passed through the wall of the distribution box 4. When the transfer piston 15 and the distribution box 14 are conveyed in the direction of the part 11 with a thickness different from that of the transfer piston 15 in the magazine 1 by the pressure control drive 12, the bar of the transfer piston 15 is first formed by the suction tube 29 on the other side. When the mechanical stack contacts mechanical parts and the distribution box 14 is moved in the stacking direction of the parts, a slight excess pressure is generated in the system formed by the space 16 and the hole 18. Instead of these parts, they are pushed upwards to contact the stack of parts or model 28. When the distribution box 14 is moved towards the stacked part 11, the pressure in the system formed by the space 16 and the hole 18 increases and the switching piston 24 is pushed outward, so that the plunger 26 connected to the pressure sensor or the switching piston 24 is driven. The reaction of 12 activates switch 30, which ends the movement of distribution box 14. Therefore, the pressure in the pressurized medium 34 is reduced. Part 11 in suction tube 29 is then picked up by suction tube 29 and removed from the appropriate stack of parts. When the pressure in the system decreases, the switching piston 24 is pushed back into the system by spring 22 and a new step is performed. To maintain the action of suction tube 29 or to switch off suction in the area where model 28 appears, a suitable suction tube 29 is equipped with a cap 32.

Gases or viscose taste solutions that cannot be compressed can be used as pressurized medium 34 in the system formed by the spaces 16 and 18.

11 shows a method of mounting components on a printed circuit board by the apparatus shown in FIGS.

The printed circuit board 41, which will be equipped with components, is glued in area 73 where the components are arranged by gluestamp 65, which is arranged on a plate 63 and first settles in the glue container 71.

Parts 11 are moved from the magazine into the matrix holder 3 by a suction tube provided in the transfer plate 31 and glue 59 is applied from the glue station K (see FIG. 6) to this part 11 '.

The printed circuit board 41 with glue at position 73 where the parts will be equipped is positioned relative to the transfer plate 31 such that the component 11 'with glue 59 can be positioned within position 73.

Claims (1)

In the arrangement for mounting on the printed circuit board plate-shaped electrical components which are stacked in tubular magazines arranged at given relative relative positions corresponding to the intended positions of the mutually related components on the printed circuit board, in particular the opening of the magazine 1. Characterized by having a transfer plate 31 comprising a plurality of vacuum-capable suction tubes 29 protruding from the transfer plate for transferring the parts 11, 11 ′ from the magazine to the printed circuit board 41 on the opposite side. Device for mounting components on a printed circuit board.

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