KR20250042706A - 전자 부품의 액체 침지 냉각을 위한 냉각 시스템 - Google Patents

전자 부품의 액체 침지 냉각을 위한 냉각 시스템 Download PDF

Info

Publication number
KR20250042706A
KR20250042706A KR1020247043078A KR20247043078A KR20250042706A KR 20250042706 A KR20250042706 A KR 20250042706A KR 1020247043078 A KR1020247043078 A KR 1020247043078A KR 20247043078 A KR20247043078 A KR 20247043078A KR 20250042706 A KR20250042706 A KR 20250042706A
Authority
KR
South Korea
Prior art keywords
heat transfer
vessel
condenser unit
cooling system
transfer fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247043078A
Other languages
English (en)
Korean (ko)
Inventor
아힘 고터바름
하랄트 가이블러
귄터 펫저
베레나 옵스트
알렉산더 로이터
헤리베르트 뢰쉬
Original Assignee
빌란트-베르케악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빌란트-베르케악티엔게젤샤프트 filed Critical 빌란트-베르케악티엔게젤샤프트
Publication of KR20250042706A publication Critical patent/KR20250042706A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020247043078A 2022-07-25 2023-06-30 전자 부품의 액체 침지 냉각을 위한 냉각 시스템 Pending KR20250042706A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102022002696.1A DE102022002696B3 (de) 2022-07-25 2022-07-25 Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
DE102022002696.1 2022-07-25
PCT/EP2023/000042 WO2024022606A1 (de) 2022-07-25 2023-06-30 Kühlsystem zur flüssigkeitsimmersionskühlung von elektronischen bauteilen

Publications (1)

Publication Number Publication Date
KR20250042706A true KR20250042706A (ko) 2025-03-27

Family

ID=85476964

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247043078A Pending KR20250042706A (ko) 2022-07-25 2023-06-30 전자 부품의 액체 침지 냉각을 위한 냉각 시스템

Country Status (10)

Country Link
US (1) US20260107416A1 (https=)
EP (1) EP4562980A1 (https=)
JP (1) JP2025524883A (https=)
KR (1) KR20250042706A (https=)
CN (1) CN119318213A (https=)
CA (1) CA3258202A1 (https=)
DE (1) DE102022002696B3 (https=)
MX (1) MX2024015423A (https=)
TW (1) TW202423231A (https=)
WO (1) WO2024022606A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12363862B2 (en) * 2022-09-06 2025-07-15 Delta Electronics, Inc. Two-phase immersion cooling system, working fluid recovery device and method
WO2024237947A1 (en) * 2023-05-16 2024-11-21 MTS IP Holdings Ltd Bellows for immersion cooling
DE102023002672B3 (de) * 2023-06-30 2024-08-29 Wieland-Werke Aktiengesellschaft Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
CN116723685B (zh) 2023-08-08 2023-11-03 苏州浪潮智能科技有限公司 液冷散热系统
US20260020183A1 (en) * 2024-07-09 2026-01-15 Quanta Computer Inc. Immersion cooling system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10512192B2 (en) 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
GB2549946A (en) 2016-05-03 2017-11-08 Bitfury Group Ltd Immersion cooling
US11102912B2 (en) 2018-09-19 2021-08-24 TMGCore, LLC Liquid immersion cooling platform
US11076508B2 (en) 2019-11-14 2021-07-27 Baidu Usa Llc Cooling systems for immersion cooled IT equipment
US11076505B2 (en) * 2019-12-13 2021-07-27 Baidu Usa Llc Cooling system for edge computing device
JP7421176B2 (ja) 2020-01-07 2024-01-24 大成建設株式会社 液浸冷却システム
US10966349B1 (en) 2020-07-27 2021-03-30 Bitfury Ip B.V. Two-phase immersion cooling apparatus with active vapor management
US20210410320A1 (en) * 2021-09-13 2021-12-30 Intel Corporation Immersion cooling system with coolant boiling point reduction for increased cooling capacity

Also Published As

Publication number Publication date
MX2024015423A (es) 2025-02-10
TW202423231A (zh) 2024-06-01
JP2025524883A (ja) 2025-08-01
CA3258202A1 (en) 2025-04-08
EP4562980A1 (de) 2025-06-04
CN119318213A (zh) 2025-01-14
DE102022002696B3 (de) 2023-03-30
WO2024022606A1 (de) 2024-02-01
US20260107416A1 (en) 2026-04-16

Similar Documents

Publication Publication Date Title
KR20250042706A (ko) 전자 부품의 액체 침지 냉각을 위한 냉각 시스템
JP2025524883A5 (https=)
CN108141991B (zh) 浸入式冷却
KR20250113391A (ko) 전자 부품의 액침 냉각을 위한 냉각 시스템
EP4124193B1 (en) Immersion cooling system
US20220232734A1 (en) Systems and methods for immersion cooling with an air-cooled condenser
CN121220191A (zh) 用于电子部件的液体浸入冷却的冷却系统
JP2025523427A (ja) 電子コンポーネントを液浸冷却するための冷却システム
US20250338444A1 (en) Immersion cooling system
US12225689B2 (en) Cooling system for the liquid immersion cooling of electronic components
HK40080301B (zh) 用於电子部件的液体浸入冷却的冷却系统
HK40080301A (en) Cooling system for the liquid immersion cooling of electronic components
HK1261065B (en) Immersion cooling
HK1261065A1 (en) Immersion cooling

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20241226

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application