DE102022002696B3 - Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen - Google Patents

Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen Download PDF

Info

Publication number
DE102022002696B3
DE102022002696B3 DE102022002696.1A DE102022002696A DE102022002696B3 DE 102022002696 B3 DE102022002696 B3 DE 102022002696B3 DE 102022002696 A DE102022002696 A DE 102022002696A DE 102022002696 B3 DE102022002696 B3 DE 102022002696B3
Authority
DE
Germany
Prior art keywords
heat transfer
container
condenser unit
cooling system
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102022002696.1A
Other languages
German (de)
English (en)
Inventor
Achim Gotterbarm
Günter Fetzer
Harald Gaibler
Verena Obst
Alexander Reuter
Heribert Rösch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Original Assignee
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG filed Critical Wieland Werke AG
Priority to DE102022002696.1A priority Critical patent/DE102022002696B3/de
Application granted granted Critical
Publication of DE102022002696B3 publication Critical patent/DE102022002696B3/de
Priority to TW112114822A priority patent/TW202423231A/zh
Priority to CA3258202A priority patent/CA3258202A1/en
Priority to CN202380047381.6A priority patent/CN119318213A/zh
Priority to JP2025503095A priority patent/JP2025524883A/ja
Priority to PCT/EP2023/000042 priority patent/WO2024022606A1/de
Priority to US18/992,737 priority patent/US20260107416A1/en
Priority to EP23757514.7A priority patent/EP4562980A1/de
Priority to KR1020247043078A priority patent/KR20250042706A/ko
Priority to MX2024015423A priority patent/MX2024015423A/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE102022002696.1A 2022-07-25 2022-07-25 Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen Active DE102022002696B3 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE102022002696.1A DE102022002696B3 (de) 2022-07-25 2022-07-25 Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
TW112114822A TW202423231A (zh) 2022-07-25 2023-04-20 用於電子器件之液體浸入式冷卻的冷卻系統
KR1020247043078A KR20250042706A (ko) 2022-07-25 2023-06-30 전자 부품의 액체 침지 냉각을 위한 냉각 시스템
CN202380047381.6A CN119318213A (zh) 2022-07-25 2023-06-30 用于电子部件的液体浸入冷却的冷却系统
CA3258202A CA3258202A1 (en) 2022-07-25 2023-06-30 COOLING SYSTEM FOR LIQUID IMMERSION COOLING OF ELECTRONIC COMPONENTS
JP2025503095A JP2025524883A (ja) 2022-07-25 2023-06-30 電子コンポーネントを液浸冷却するための冷却システム
PCT/EP2023/000042 WO2024022606A1 (de) 2022-07-25 2023-06-30 Kühlsystem zur flüssigkeitsimmersionskühlung von elektronischen bauteilen
US18/992,737 US20260107416A1 (en) 2022-07-25 2023-06-30 Cooling system for the liquid immersion cooling of electronic components
EP23757514.7A EP4562980A1 (de) 2022-07-25 2023-06-30 Kühlsystem zur flüssigkeitsimmersionskühlung von elektronischen bauteilen
MX2024015423A MX2024015423A (es) 2022-07-25 2024-12-12 Sistema de refrigeracion para el enfriamiento por inmersion en liquido de componentes electronicos

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102022002696.1A DE102022002696B3 (de) 2022-07-25 2022-07-25 Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen

Publications (1)

Publication Number Publication Date
DE102022002696B3 true DE102022002696B3 (de) 2023-03-30

Family

ID=85476964

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102022002696.1A Active DE102022002696B3 (de) 2022-07-25 2022-07-25 Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen

Country Status (10)

Country Link
US (1) US20260107416A1 (https=)
EP (1) EP4562980A1 (https=)
JP (1) JP2025524883A (https=)
KR (1) KR20250042706A (https=)
CN (1) CN119318213A (https=)
CA (1) CA3258202A1 (https=)
DE (1) DE102022002696B3 (https=)
MX (1) MX2024015423A (https=)
TW (1) TW202423231A (https=)
WO (1) WO2024022606A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116723685A (zh) * 2023-08-08 2023-09-08 苏州浪潮智能科技有限公司 液冷散热系统
US11997825B1 (en) 2023-05-16 2024-05-28 MTS IP Holdings Ltd Bellows for immersion cooling
DE102023002672B3 (de) 2023-06-30 2024-08-29 Wieland-Werke Aktiengesellschaft Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12363862B2 (en) * 2022-09-06 2025-07-15 Delta Electronics, Inc. Two-phase immersion cooling system, working fluid recovery device and method
US20260020183A1 (en) * 2024-07-09 2026-01-15 Quanta Computer Inc. Immersion cooling system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10477726B1 (en) 2018-09-19 2019-11-12 TMGCore, LLC Liquid immersion cooling platform
US10512192B2 (en) 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
US10966349B1 (en) 2020-07-27 2021-03-30 Bitfury Ip B.V. Two-phase immersion cooling apparatus with active vapor management
EP3453235B1 (en) 2016-05-03 2021-04-21 Bitfury Group Limited Immersion cooling
US20210153392A1 (en) 2019-11-14 2021-05-20 Baidu Usa Llc Cooling systems for immersion cooled it equipment
JP2021111660A (ja) 2020-01-07 2021-08-02 大成建設株式会社 液浸冷却システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11076505B2 (en) * 2019-12-13 2021-07-27 Baidu Usa Llc Cooling system for edge computing device
US20210410320A1 (en) * 2021-09-13 2021-12-30 Intel Corporation Immersion cooling system with coolant boiling point reduction for increased cooling capacity

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10512192B2 (en) 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
EP3453235B1 (en) 2016-05-03 2021-04-21 Bitfury Group Limited Immersion cooling
US10477726B1 (en) 2018-09-19 2019-11-12 TMGCore, LLC Liquid immersion cooling platform
US20210153392A1 (en) 2019-11-14 2021-05-20 Baidu Usa Llc Cooling systems for immersion cooled it equipment
JP2021111660A (ja) 2020-01-07 2021-08-02 大成建設株式会社 液浸冷却システム
US10966349B1 (en) 2020-07-27 2021-03-30 Bitfury Ip B.V. Two-phase immersion cooling apparatus with active vapor management

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11997825B1 (en) 2023-05-16 2024-05-28 MTS IP Holdings Ltd Bellows for immersion cooling
WO2024237947A1 (en) * 2023-05-16 2024-11-21 MTS IP Holdings Ltd Bellows for immersion cooling
US20240389268A1 (en) * 2023-05-16 2024-11-21 MTS IP Holdings Ltd Bellows for immersion cooling
US12309972B2 (en) 2023-05-16 2025-05-20 MTS IP Holdings Ltd Bellows for immersion cooling
US12439557B2 (en) 2023-05-16 2025-10-07 MTS IP Holdings Ltd Bellows for immersion cooling
DE102023002672B3 (de) 2023-06-30 2024-08-29 Wieland-Werke Aktiengesellschaft Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
WO2025002700A1 (de) * 2023-06-30 2025-01-02 Wieland-Werke Ag Kühlsystem zur flüssigkeitsimmersionskühlung von elektronischen bauteilen
CN116723685A (zh) * 2023-08-08 2023-09-08 苏州浪潮智能科技有限公司 液冷散热系统
CN116723685B (zh) * 2023-08-08 2023-11-03 苏州浪潮智能科技有限公司 液冷散热系统
US12520454B2 (en) 2023-08-08 2026-01-06 Suzhou Metabrain Intelligent Technology Co., Ltd. Liquid cooling heat dissipation system

Also Published As

Publication number Publication date
MX2024015423A (es) 2025-02-10
TW202423231A (zh) 2024-06-01
JP2025524883A (ja) 2025-08-01
CA3258202A1 (en) 2025-04-08
KR20250042706A (ko) 2025-03-27
EP4562980A1 (de) 2025-06-04
CN119318213A (zh) 2025-01-14
WO2024022606A1 (de) 2024-02-01
US20260107416A1 (en) 2026-04-16

Similar Documents

Publication Publication Date Title
DE102022002696B3 (de) Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
EP2095370B1 (de) Kerntechnische anlage und verfahren zum betreiben einer kerntechnischen anlage
DE10297837B4 (de) Verfahren zum Befestigen einer Kühlmaschine und Befestigungsvorrichtung dafür
DD201726A5 (de) Waermetechnische einrichtung zur durchfuehrung thermodynamischer prozesse
DE102016200744A1 (de) Transformator mit temperaturabhängiger Kühlung
DE19914778A1 (de) Supraleitende Magnetvorrichtung
WO2024110144A1 (de) Kühlsystem zur flüssigkeitsimmersionskühlung von elektronischen bauteilen
EP4483444A1 (de) Batterietemperiersystem und kraftfahrzeug
JP2025524883A5 (https=)
DE102023002672B3 (de) Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
CH691081A5 (de) Vorrichtung und Verfahren zum Aufheizen von Teilen.
EP3364735A1 (de) Kühlvorrichtung, umrichter mit einer kühlvorrichtung und verfahren zur kühlung eines umrichters
DE8712814U1 (de) Meßgaskühleinrichtung
DE60108438T2 (de) Verdampfer/Kondensator mit Thermosiphonkreislauf
EP0811410A1 (de) Verfahren und Vorrichtung zur Stofftrennung eines flüssigen Gemisches durch fraktionierte Kristallisation
DE102022002216A1 (de) Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
EP0019905A1 (de) Vorrichtung zur Zerlegung eines Gasgemisches durch Rektifikation
EP1030135B1 (de) Verfahren zur geregelten Kühlung durch Verdampfen flüssigen Stickstoffs
WO2001045163A1 (de) Stromrichtergerät mit einer zweiphasen-wärmetransportvorrichtung
DE2753495A1 (de) Verfahren und vorrichtung zur entnahme von gasen aus einem geschlossenen behaelter
WO2022106046A1 (de) Kühlsystem zur flüssigkeitsimmersionskühlung von elektronischen bauteilen
DE2219083C3 (de) Absorptionskälteanlage
DE3014831A1 (de) Kaskadenverdampfer fuer kondensations-trocknungsvorrichtungen
EP1636528A1 (de) Behälter/wärmetauscher für kompakte sorptionskälteanlagen und -wärmepumpen sowie sorptionskälteanlage und -wärmepumpe mit einem solchen behälter/wärmetauscher
WO2005005011A1 (de) Verdampfer-kondensator-wärmeübertrager

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final