KR20240166501A - 하이브리드 본딩 절연막 형성 재료, 반도체 장치의 제조 방법, 및 반도체 장치 - Google Patents

하이브리드 본딩 절연막 형성 재료, 반도체 장치의 제조 방법, 및 반도체 장치 Download PDF

Info

Publication number
KR20240166501A
KR20240166501A KR1020247032056A KR20247032056A KR20240166501A KR 20240166501 A KR20240166501 A KR 20240166501A KR 1020247032056 A KR1020247032056 A KR 1020247032056A KR 20247032056 A KR20247032056 A KR 20247032056A KR 20240166501 A KR20240166501 A KR 20240166501A
Authority
KR
South Korea
Prior art keywords
group
insulating film
forming material
electrode
represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247032056A
Other languages
English (en)
Korean (ko)
Inventor
켄야 아다치
사토시 요네다
카오리 코바야시
다이사쿠 마츠카와
Original Assignee
에이치디 마이크로시스템즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이치디 마이크로시스템즈 가부시키가이샤 filed Critical 에이치디 마이크로시스템즈 가부시키가이샤
Publication of KR20240166501A publication Critical patent/KR20240166501A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01L21/304—
    • H01L21/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H01L2021/60015—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/301—Bonding techniques, e.g. hybrid bonding
    • H10W80/312—Bonding techniques, e.g. hybrid bonding characterised by the direct bonding of electrically conductive pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/301—Bonding techniques, e.g. hybrid bonding
    • H10W80/327—Bonding techniques, e.g. hybrid bonding characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/794—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Formation Of Insulating Films (AREA)
KR1020247032056A 2022-03-25 2023-01-27 하이브리드 본딩 절연막 형성 재료, 반도체 장치의 제조 방법, 및 반도체 장치 Pending KR20240166501A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022050451 2022-03-25
JPJP-P-2022-050451 2022-03-25
PCT/JP2023/002759 WO2023181637A1 (ja) 2022-03-25 2023-01-27 ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法、及び半導体装置

Publications (1)

Publication Number Publication Date
KR20240166501A true KR20240166501A (ko) 2024-11-26

Family

ID=88101051

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247032056A Pending KR20240166501A (ko) 2022-03-25 2023-01-27 하이브리드 본딩 절연막 형성 재료, 반도체 장치의 제조 방법, 및 반도체 장치

Country Status (6)

Country Link
US (1) US20250201760A1 (https=)
JP (1) JPWO2023181637A1 (https=)
KR (1) KR20240166501A (https=)
CN (1) CN118946610A (https=)
TW (1) TW202339006A (https=)
WO (1) WO2023181637A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250185163A1 (en) * 2023-12-05 2025-06-05 Adeia Semiconductor Bonding Technologies Inc. Organic-to-inorganic bonding methods and structures
CN118605083B (zh) * 2024-06-07 2025-03-07 上海镭利电子材料有限公司 一种干膜型感光性树脂组合物及其制备方法和应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019204818A (ja) 2018-05-21 2019-11-28 住友ベークライト株式会社 電子装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102090449B1 (ko) * 2016-03-31 2020-03-18 아사히 가세이 가부시키가이샤 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법 및 반도체 장치
JP6923334B2 (ja) * 2016-04-14 2021-08-18 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
JP6704048B2 (ja) * 2016-06-29 2020-06-03 富士フイルム株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイス、積層体の製造方法、半導体デバイスの製造方法およびポリイミド前駆体
WO2022070362A1 (ja) * 2020-09-30 2022-04-07 昭和電工マテリアルズ株式会社 樹脂組成物、半導体装置の製造方法、硬化物及び半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019204818A (ja) 2018-05-21 2019-11-28 住友ベークライト株式会社 電子装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
비특허문헌 1: F.C. Chen et al., "System on Integrated Chips(SoIC TM) for 3D Heterogeneous Integration", 2019 IEEE 69th Electronic Components and Technology Conference(ECTC), p.594-599(2019)

Also Published As

Publication number Publication date
US20250201760A1 (en) 2025-06-19
TW202339006A (zh) 2023-10-01
CN118946610A (zh) 2024-11-12
WO2023181637A1 (ja) 2023-09-28
JPWO2023181637A1 (https=) 2023-09-28

Similar Documents

Publication Publication Date Title
US20240018306A1 (en) Resin composition, method for producing semiconductor device, cured product, semiconductor device, and method for synthesizing polyimide precursor
JP7790560B2 (ja) 半導体装置の製造方法、ハイブリッドボンディング絶縁膜形成材料及び半導体装置
JP2023151490A (ja) ポリイミド前駆体、ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法、及び半導体装置
JP7619050B2 (ja) 樹脂組成物、積層体の製造方法及び硬化膜
US20250201760A1 (en) Hybrid bonding insulation membrane forming material, method of producing semiconductor device and semiconductor device
JP7443970B2 (ja) 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
JP7491116B2 (ja) 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
JP2023151489A (ja) ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法、及び半導体装置
JP2023132964A (ja) 絶縁膜形成材料、半導体装置の製造方法及び半導体装置
JP2025094282A (ja) 絶縁膜形成材料、半導体装置の製造方法及び半導体装置
JP7853216B2 (ja) 樹脂組成物、半導体装置の製造方法、硬化物、半導体装置及びポリイミド前駆体の合成方法
JP2023039804A (ja) 樹脂組成物、半導体装置の製造方法、硬化物及び半導体装置
JP7845459B2 (ja) ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法及び半導体装置
JP2023136962A (ja) 絶縁膜形成材料、半導体装置の製造方法及び半導体装置
JP2023136961A (ja) 絶縁膜形成材料、半導体装置の製造方法及び半導体装置
WO2024209647A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、及び電子部品
WO2025088705A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、及び電子部品
TW202519984A (zh) 感光性樹脂組成物、圖案硬化物的製造方法及硬化物
KR20250168593A (ko) 감광성 수지 조성물, 패턴 경화물, 패턴 경화물의 제조 방법, 및 전자 부품
WO2025182048A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
KR20250167604A (ko) 감광성 수지 조성물, 패턴 경화물, 패턴 경화물의 제조 방법, 및 전자 부품
WO2025099883A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
TW202419536A (zh) 感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件
WO2025182050A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
WO2025182049A1 (ja) パターン硬化物の製造方法、現像剤の選択方法、溶剤の選択方法及び感光性樹脂組成物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000