KR20240070575A - Adhesive composition and laminate containing the same - Google Patents
Adhesive composition and laminate containing the same Download PDFInfo
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- KR20240070575A KR20240070575A KR1020247012226A KR20247012226A KR20240070575A KR 20240070575 A KR20240070575 A KR 20240070575A KR 1020247012226 A KR1020247012226 A KR 1020247012226A KR 20247012226 A KR20247012226 A KR 20247012226A KR 20240070575 A KR20240070575 A KR 20240070575A
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- meth
- less
- adhesive composition
- acrylate
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 96
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 70
- 239000000853 adhesive Substances 0.000 title claims abstract description 69
- 239000000178 monomer Substances 0.000 claims abstract description 94
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 64
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 45
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 21
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims abstract description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 17
- 229920001577 copolymer Polymers 0.000 claims abstract description 15
- 239000012790 adhesive layer Substances 0.000 claims description 51
- -1 bis(trifluoromethanesulfonyl)imide anion Chemical class 0.000 claims description 34
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 16
- 239000002216 antistatic agent Substances 0.000 claims description 14
- 239000010410 layer Substances 0.000 claims description 10
- 125000003277 amino group Chemical group 0.000 claims description 9
- 125000003368 amide group Chemical group 0.000 claims description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 239000010408 film Substances 0.000 description 45
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 27
- 238000000034 method Methods 0.000 description 20
- 239000011521 glass Substances 0.000 description 17
- 229920002799 BoPET Polymers 0.000 description 13
- 229920003050 poly-cycloolefin Polymers 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 13
- 125000000217 alkyl group Chemical group 0.000 description 12
- 239000006087 Silane Coupling Agent Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 150000008040 ionic compounds Chemical class 0.000 description 8
- 239000003505 polymerization initiator Substances 0.000 description 8
- 239000004372 Polyvinyl alcohol Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 150000001768 cations Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 150000003949 imides Chemical class 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 150000003377 silicon compounds Chemical class 0.000 description 3
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 2
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 150000001767 cationic compounds Chemical class 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 229910001411 inorganic cation Inorganic materials 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002892 organic cations Chemical class 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- ZXMGHDIOOHOAAE-UHFFFAOYSA-N 1,1,1-trifluoro-n-(trifluoromethylsulfonyl)methanesulfonamide Chemical compound FC(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)F ZXMGHDIOOHOAAE-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- HASUCEDGKYJBDC-UHFFFAOYSA-N 1-[3-[[bis(oxiran-2-ylmethyl)amino]methyl]cyclohexyl]-n,n-bis(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC1CC(CN(CC2OC2)CC2OC2)CCC1)CC1CO1 HASUCEDGKYJBDC-UHFFFAOYSA-N 0.000 description 1
- XDEQOBPALZZTCA-UHFFFAOYSA-N 1-octylpyridin-1-ium Chemical compound CCCCCCCC[N+]1=CC=CC=C1 XDEQOBPALZZTCA-UHFFFAOYSA-N 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- WGFZZGXKRATULP-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)aniline Chemical compound NC1=CC=CC=C1OCC1OC1 WGFZZGXKRATULP-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- AVFZRVATGMEQNJ-UHFFFAOYSA-N 3-methyl-1-octylpyridin-1-ium Chemical compound CCCCCCCC[N+]1=CC=CC(C)=C1 AVFZRVATGMEQNJ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- OSCFFOTZWZZXPR-UHFFFAOYSA-N 4-methyl-1-octylpyridin-1-ium Chemical compound CCCCCCCC[N+]1=CC=C(C)C=C1 OSCFFOTZWZZXPR-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- GBJVVSCPOBPEIT-UHFFFAOYSA-N AZT-1152 Chemical compound N=1C=NC2=CC(OCCCN(CC)CCOP(O)(O)=O)=CC=C2C=1NC(=NN1)C=C1CC(=O)NC1=CC=CC(F)=C1 GBJVVSCPOBPEIT-UHFFFAOYSA-N 0.000 description 1
- 229910016467 AlCl 4 Inorganic materials 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-O Piperidinium(1+) Chemical compound C1CC[NH2+]CC1 NQRYJNQNLNOLGT-UHFFFAOYSA-O 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- IKHOZNOYZQPPCK-UHFFFAOYSA-K aluminum;4,4-diethyl-3-oxohexanoate Chemical compound [Al+3].CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O IKHOZNOYZQPPCK-UHFFFAOYSA-K 0.000 description 1
- YNCDEEFMDXHURQ-UHFFFAOYSA-N aluminum;ethyl 3-oxobutanoate Chemical compound [Al].CCOC(=O)CC(C)=O YNCDEEFMDXHURQ-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 1
- MEQUMOPGFLCEGE-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide 4-methyl-1-octylpyridin-1-ium Chemical compound [N-](S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F.C(CCCCCCC)[N+]1=CC=C(C=C1)C MEQUMOPGFLCEGE-UHFFFAOYSA-N 0.000 description 1
- XSGKJXQWZSFJEJ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;butyl(trimethyl)azanium Chemical compound CCCC[N+](C)(C)C.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F XSGKJXQWZSFJEJ-UHFFFAOYSA-N 0.000 description 1
- WUFQNPMBKMKEHN-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;diethyl-(2-methoxyethyl)-methylazanium Chemical compound CC[N+](C)(CC)CCOC.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F WUFQNPMBKMKEHN-UHFFFAOYSA-N 0.000 description 1
- KQUVYHRORKUYQZ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)methylsulfonyl-trifluoromethane;lithium Chemical compound [Li].FC(F)(F)S(=O)(=O)C(S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F KQUVYHRORKUYQZ-UHFFFAOYSA-N 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940093858 ethyl acetoacetate Drugs 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 125000003010 ionic group Chemical group 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910003473 lithium bis(trifluoromethanesulfonyl)imide Inorganic materials 0.000 description 1
- QSZMZKBZAYQGRS-UHFFFAOYSA-N lithium;bis(trifluoromethylsulfonyl)azanide Chemical compound [Li+].FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F QSZMZKBZAYQGRS-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- 125000004170 methylsulfonyl group Chemical group [H]C([H])([H])S(*)(=O)=O 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KTQDYGVEEFGIIL-UHFFFAOYSA-N n-fluorosulfonylsulfamoyl fluoride Chemical compound FS(=O)(=O)NS(F)(=O)=O KTQDYGVEEFGIIL-UHFFFAOYSA-N 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 1
- ZVJHJDDKYZXRJI-UHFFFAOYSA-N pyrroline Natural products C1CC=NC1 ZVJHJDDKYZXRJI-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/017—Additives being an antistatic agent
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
[과제] 본 발명은 높은 내구성을 갖는 점착제 조성물을 제공한다.
[해결 수단] 본 발명의 점착제 조성물은 (메타)아크릴 코폴리머와 가교제를 함유하는 점착제 조성물로서, 상기 (메타)아크릴 코폴리머는 50 질량% 초과 99.9 질량% 이하의 알콕시알킬(메타)아크릴레이트 및 0.1 질량% 이상 10 질량% 이하의 수산기 함유 단량체를 포함하는 단량체 조성물의 코폴리머이며, 상기 (메타)아크릴 코폴리머의 중량평균 분자량이 165만 이상이다.[Problem] The present invention provides an adhesive composition with high durability.
[Solution] The adhesive composition of the present invention is an adhesive composition containing a (meth)acrylic copolymer and a crosslinking agent, and the (meth)acrylic copolymer is an alkoxyalkyl (meth)acrylate of more than 50% by mass and less than 99.9% by mass. It is a copolymer of a monomer composition containing 0.1% by mass or more and 10% by mass or less of a hydroxyl group-containing monomer, and the weight average molecular weight of the (meth)acrylic copolymer is 1.65 million or more.
Description
본 발명은 점착제 조성물 및 이것을 포함하는 적층체에 관한 것이다. 특히 본 발명은 높은 내구성을 갖는 점착제 조성물 및 이것을 포함하는 적층체에 관한 것이다.The present invention relates to an adhesive composition and a laminate containing the same. In particular, the present invention relates to a highly durable adhesive composition and a laminate containing the same.
화상표시장치는 광학 필름 등의 복수의 투명부재를 포함한다. 종래부터, 이들 투명부재를 적층하기 위해 점착제가 사용되고 있다.An image display device includes a plurality of transparent members such as optical films. Conventionally, adhesives have been used to laminate these transparent members.
이러한 용도에 있어서, 점착제에는 접착성 및 투명성에 더하여 고온환경 하에서 발포 및 박리가 발생하지 않는 것이 요구되고 있다.In these applications, the adhesive is required to have adhesion and transparency, as well as to not foam or peel in a high-temperature environment.
특허문헌 1에는 이러한 점착제가 개시되어 있다. 이 점착제는 중량평균 분자량이 40만 내지 160만인 아크릴계 폴리머를 포함하고, 이 아크릴계 폴리머의 단량체 성분은 카르복실 함유 단량체를 실질적으로 포함하지 않는다.Patent Document 1 discloses such an adhesive. This adhesive contains an acrylic polymer having a weight average molecular weight of 400,000 to 1.6 million, and the monomer component of this acrylic polymer substantially does not contain a carboxyl-containing monomer.
특허문헌 2에 개시되어 있는 점착제는 알킬렌옥사이드 사슬 함유 단량체, 수산기 함유 단량체, 아미드기 또는 아미노기 함유 단량체 및 (메타)아크릴산알킬에스테르 단량체를 특정량으로 포함하는 조성물의 공중합체를 포함한다. 특허문헌 2에 구체적으로 개시되어 있는 코폴리머(copolymer)의 중량평균 분자량은 모두 100만 이하이다.The adhesive disclosed in Patent Document 2 includes a copolymer of a composition containing a specific amount of an alkylene oxide chain-containing monomer, a hydroxyl group-containing monomer, an amide group or amino group-containing monomer, and a (meth)acrylic acid alkyl ester monomer. The weight average molecular weight of the copolymers specifically disclosed in Patent Document 2 is all 1 million or less.
특허문헌 3에 개시되어 있는 점착제는 폴리옥시알킬렌기 또는 알콕시알킬기 함유 단량체, 수산기 함유 단량체, 카르복실기 함유 단량체 및 (메타)아크릴산알킬에스테르 단량체를 특정량으로 포함하는 조성물의 공중합체를 포함한다. 특허문헌 3에 구체적으로 개시되어 있는 코폴리머의 중량평균 분자량은 모두 120만 이하이다.The adhesive disclosed in Patent Document 3 includes a copolymer of a composition containing a specific amount of a polyoxyalkylene group- or alkoxyalkyl group-containing monomer, a hydroxyl group-containing monomer, a carboxyl group-containing monomer, and a (meth)acrylic acid alkyl ester monomer. The weight average molecular weight of the copolymers specifically disclosed in Patent Document 3 is all 1.2 million or less.
본 발명은 높은 내구성을 갖는 점착제 조성물 및 이것을 포함하는 적층체를 제공한다.The present invention provides a highly durable adhesive composition and a laminate containing the same.
본 발명자들은 이하의 양태를 포함하는 본 발명에 의해 상기 과제를 해결할 수 있는 것을 발견하였다.The present inventors have discovered that the above problem can be solved by the present invention including the following aspects.
"양태 1""Aspect 1"
(메타)아크릴 코폴리머와 가교제를 함유하는 점착제 조성물로서,An adhesive composition containing a (meth)acrylic copolymer and a crosslinking agent,
상기 (메타)아크릴 코폴리머는 50 질량% 초과 99.9 질량% 이하의 알콕시알킬(메타)아크릴레이트 및 0.1 질량% 이상 10 질량% 이하의 수산기 함유 단량체를 포함하는 단량체 조성물의 코폴리머이며,The (meth)acrylic copolymer is a copolymer of a monomer composition containing more than 50% by mass and less than 99.9% by mass of alkoxyalkyl (meth)acrylate and 0.1% by mass and less than 10% by mass of a hydroxyl group-containing monomer,
상기 (메타)아크릴 코폴리머의 중량평균 분자량이 165만 이상이다.The weight average molecular weight of the (meth)acrylic copolymer is 1.65 million or more.
"양태 2"“Aspect 2”
양태 1에 따른 점착제 조성물에서, 상기 단량체 조성물은 80 질량% 초과의 알콕시알킬(메타)아크릴레이트를 포함한다.In the adhesive composition according to aspect 1, the monomer composition comprises more than 80% by mass of alkoxyalkyl (meth)acrylate.
"양태 3""Aspect 3"
양태 1 또는 2에 따른 점착제 조성물에서, 상기 (메타)아크릴 코폴리머의 중량평균 분자량은 185만 이상 250만 이하이다.In the adhesive composition according to Embodiment 1 or 2, the weight average molecular weight of the (meth)acrylic copolymer is 1.85 million or more and 2.5 million or less.
"양태 4""Aspect 4"
양태 1 내지 3 중 어느 하나에 따른 점착제 조성물에서, 상기 단량체 조성물은 아미드기 함유 단량체 또는 아미노기 함유 단량체를 실질적으로 포함하지 않는다.In the pressure-sensitive adhesive composition according to any one of aspects 1 to 3, the monomer composition is substantially free of amide group-containing monomers or amino group-containing monomers.
"양태 5""Aspect 5"
양태 1 내지 4 중 어느 하나에 따른 점착제 조성물에서, 상기 단량체 조성물은 카르복실기 함유 단량체를 실질적으로 포함하지 않는다.In the pressure-sensitive adhesive composition according to any one of aspects 1 to 4, the monomer composition is substantially free of carboxyl group-containing monomers.
"양태 6""Aspect 6"
양태 1 내지 5 중 어느 하나에 따른 점착제 조성물에서, 상기 점착제 조성물로부터 형성되는 점착제층의 겔 분율은 62% 이상 90% 이하이다.In the pressure-sensitive adhesive composition according to any one of Embodiments 1 to 5, the gel fraction of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition is 62% or more and 90% or less.
"양태 7""Aspect 7"
양태 1 내지 6 중 어느 하나에 따른 점착제 조성물에서, 비스(트리플루오로메탄술포닐)이미드 음이온을 포함하는 대전 방지제를 추가로 함유한다.In the pressure-sensitive adhesive composition according to any one of aspects 1 to 6, it further contains an antistatic agent containing a bis(trifluoromethanesulfonyl)imide anion.
"양태 8""Aspect 8"
제1 부재, 제2 부재 및 이들을 접착하는 점착제층을 포함하는 적층체로서, 상기 점착제층은 양태 1 내지 7 중 어느 하나에 따른 점착제 조성물로부터 형성된다.A laminate comprising a first member, a second member, and a pressure-sensitive adhesive layer for adhering them together, wherein the pressure-sensitive adhesive layer is formed from the pressure-sensitive adhesive composition according to any one of aspects 1 to 7.
도 1은 적층체의 일례를 모식적으로 나타낸 단면도이고,
도 2는 적층체의 다른 일례를 모식적으로 나타낸 단면도이다.1 is a cross-sectional view schematically showing an example of a laminate;
Figure 2 is a cross-sectional view schematically showing another example of a laminate.
"점착제 조성물"“Adhesive composition”
점착제 조성물은 (메타)아크릴 코폴리머와 가교제를 함유하고, 상기 (메타)아크릴 코폴리머는 50 질량% 초과 99.9 질량% 이하의 알콕시알킬(메타)아크릴레이트 및 0.1 질량% 이상 10 질량% 이하의 수산기 함유 단량체를 포함하는 단량체 조성물의 코폴리머이며, 또한 상기 (메타)아크릴 코폴리머의 중량평균 분자량은 165만 이상이다.The adhesive composition contains a (meth)acrylic copolymer and a crosslinking agent, and the (meth)acrylic copolymer contains more than 50% by mass and less than 99.9% by mass of alkoxyalkyl (meth)acrylate and 0.1% by mass and less than 10% by mass of hydroxyl group. It is a copolymer of a monomer composition containing monomers, and the weight average molecular weight of the (meth)acrylic copolymer is 1.65 million or more.
종래에 점착제 조성물로부터 얻어지는 점착제층의 내열성은 80℃로 충분하다고 생각되어 왔다. 이것은, 디스플레이 등 통상의 사용 환경을 고려하면, 그 내열성으로 충분하다고 생각되기 때문이다. 그러나, 본 발명자들은 특정 환경 하에서 그 내열성으로는 불충분해지는 경우가 있으며, 100℃를 초과하는 내열성을 가지면 그러한 환경 하에서도 점착제층에 발포를 발생시키지 않고, 또한 피착체로부터 점착제층이 벗겨지지 않는 것을 발견하였다. 또한, 종래에 점착제 조성물에 포함되는 코폴리머의 중량평균 분자량이 매우 높은 경우에는 점착제 조성물을 접착면에 도포하는 것이 곤란해지는 경우가 있었지만, 이 과제에 대해서는 도포방법을 변경하면 해결할 수 있다는 것을 알 수 있었다.Conventionally, the heat resistance of the adhesive layer obtained from the adhesive composition has been considered to be sufficient at 80°C. This is because the heat resistance is considered sufficient considering normal use environments such as displays. However, the present inventors have found that the heat resistance may be insufficient under certain circumstances, and that if the heat resistance exceeds 100°C, foaming does not occur in the adhesive layer even under such circumstances, and the adhesive layer does not peel off from the adherend. Found it. In addition, in the past, when the weight average molecular weight of the copolymer contained in the adhesive composition was very high, it sometimes became difficult to apply the adhesive composition to the adhesive surface. However, it was found that this problem could be solved by changing the application method. there was.
<(메타)아크릴 코폴리머><(meth)acrylic copolymer>
(메타)아크릴 코폴리머는 중량평균 분자량(Mw)이 165만 이상이다. 그 중량평균 분자량은 170만 이상, 180만 이상, 185만 이상, 190만 이상, 195만 이상, 또는 200만 이상일 수도 있고, 300만 이하, 280만 이하, 250만 이하, 220만 이하, 또는 200만 이하일 수도 있다. 예를 들어, 그 중량평균 분자량은 165만 이상 300만 이하 또는 185만 이상 250만 이하일 수도 있다. 이러한 범위이면, 점착제 조성물에 도포성의 과제를 부여하지 않고, 얻어지는 점착제층에 매우 높은 내열성을 부여할 수 있다.(Meth)acrylic copolymer has a weight average molecular weight (Mw) of 1.65 million or more. The weight average molecular weight may be 1.7 million or more, 1.8 million or more, 1.85 million or more, 1.9 million or more, 1.95 million or more, or 2 million or more, or 3 million or less, 2.8 million or less, 2.5 million or less, 2.2 million or less, or 2 million or less. It may be less than 10,000. For example, the weight average molecular weight may be 1.65 million to 3 million, or 1.85 million to 2.5 million. Within this range, very high heat resistance can be provided to the resulting adhesive layer without causing problems with applicability to the adhesive composition.
(메타)아크릴 코폴리머의 수평균 분자량(Mn)에 대한 중량평균 분자량(Mw)의 비로 나타내어지는 다분산도(Mw/Mn)는 15.0 이하, 10.0 이하, 8.0 이하, 6.0 이하, 또는 5.0이하로 할 수 있고, 1.5 이상, 2.0 이상, 3.0 이상, 또는 4.0 이상일 수도 있다. 예를 들어, (메타)아크릴 코폴리머의 다분산도는 1.5 이상 15.0 이하 또는 2.0 이상 8.0 이하일 수도 있다.The polydispersity (Mw/Mn), expressed as the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of the (meth)acrylic copolymer, is 15.0 or less, 10.0 or less, 8.0 or less, 6.0 or less, or 5.0 or less. It can be 1.5 or higher, 2.0 or higher, 3.0 or higher, or 4.0 or higher. For example, the polydispersity of the (meth)acrylic copolymer may be 1.5 or more and 15.0 or less, or 2.0 or more and 8.0 or less.
중량평균 분자량 및 수평균 분자량은 GPC(겔 투과 크로마토그래피)를 이용하고, 다음의 조건으로 표준 폴리스티렌 환산에 의한 중량평균 분자량(Mw) 및 수평균 분자량(Mn)을 구할 수 있다.The weight average molecular weight and number average molecular weight can be determined using GPC (gel permeation chromatography), and the weight average molecular weight (Mw) and number average molecular weight (Mn) can be obtained by conversion to standard polystyrene under the following conditions.
<GPC 측정조건><GPC measurement conditions>
측정장치: HLC-8120GPC(토소(TOSOH) 제조)Measuring device: HLC-8120GPC (manufactured by TOSOH)
GPC 컬럼 구성: 이하의 5연 컬럼(모두 토소 제조)GPC column configuration: 5-unit column as follows (all manufactured by Tosoh)
(1) TSK-GEL HXL-H(가드 컬럼)(1) TSK-GEL HXL-H (guard column)
(2) TSK-GEL G7000HXL(2) TSK-GEL G7000HXL
(3) TSK-GEL GMHXL(3) TSK-GEL GMHXL
(4) TSK-GEL GMHXL(4) TSK-GEL GMHXL
(5) TSK-GEL G2500HXL(5) TSK-GEL G2500HXL
샘플 농도: 1.0 mg/cm3이 되도록 테트라히드로푸란으로 희석Sample concentration: diluted with tetrahydrofuran to 1.0 mg/cm 3
이동상 용매: 테트라히드로푸란Mobile phase solvent: tetrahydrofuran
유량: 1.0 cm3/분Flow rate: 1.0 cm 3 /min
컬럼 온도: 40℃Column temperature: 40℃
<(메타)아크릴 코폴리머-알콕시알킬(메타)아크릴레이트> <(meth)acrylic copolymer-alkoxyalkyl (meth)acrylate>
(메타)아크릴 코폴리머를 중합하여 얻기 위한 단량체 조성물은 알콕시알킬(메타)아크릴레이트를 포함한다. 알콕시알킬(메타)아크릴레이트는 알킬(메타)아크릴레이트의 알킬기의 수소원자 중 적어도 하나가 알콕시기 또는 알콕시기를 갖는 화합물로 치환된 단량체이다. 예를 들어, 이 단량체는 CH2=CR1-COO-R2로 표시되며, 여기서 R1은 수소원자 또는 메틸기이고, R2는 탄소수 14 이하인 직선형 사슬 또는 분지형 사슬의 알킬기 또는 아랄킬기를 나타내지만, 이들 기를 구성하는 수소원자의 적어도 하나가 기-O-(CnH2nO)m-R3으로 치환되며, n은 1∼4의 정수를 나타내고, m은 0 또는 1∼10의 정수를 나타내며, R3은 탄소수 14 이하인 직선형 사슬 또는 분지형 사슬의 알킬기를 구성한다.The monomer composition to obtain the (meth)acrylic copolymer includes alkoxyalkyl (meth)acrylate. Alkoxyalkyl (meth)acrylate is a monomer in which at least one hydrogen atom of the alkyl group of the alkyl (meth)acrylate is replaced with an alkoxy group or a compound having an alkoxy group. For example, this monomer is represented by CH 2 =CR 1 -COO-R 2 , where R 1 is a hydrogen atom or a methyl group and R 2 represents an alkyl or aralkyl group of a straight or branched chain having 14 or less carbon atoms. However, at least one of the hydrogen atoms constituting these groups is substituted with the group -O-(C n H 2n O) m -R 3 , n represents an integer from 1 to 4, and m is 0 or an integer from 1 to 10. , and R 3 constitutes a straight chain or branched chain alkyl group having 14 or less carbon atoms.
구체적으로 알콕시알킬(메타)아크릴레이트로서는 메톡시메틸(메타)아크릴레이트, 2-메톡시에틸(메타)아크릴레이트, 2-에톡시에틸(메타)아크릴레이트, 3-메톡시프로필(메타)아크릴레이트, 3-에톡시프로필(메타)아크릴레이트, 4-메톡시부틸(메타)아크릴레이트, 4-에톡시부틸(메타)아크릴레이트, 에틸카르비톨아크릴레이트, 2-에틸헥실-디글루콜아크릴레이트, 메톡시-폴리에틸렌글리콜아크릴레이트 등을 들 수 있고, 그 중에서도 특히 2-메톡시에틸(메타)아크릴레이트를 들 수 있다.Specifically, alkoxyalkyl (meth)acrylates include methoxymethyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, and 3-methoxypropyl (meth)acrylate. Latex, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, 4-ethoxybutyl (meth)acrylate, ethylcarbitol acrylate, 2-ethylhexyl-diglucol acrylate ester, methoxy-polyethylene glycol acrylate, etc., and among them, 2-methoxyethyl (meth)acrylate is especially mentioned.
알콕시알킬(메타)아크릴레이트는 단량체 조성물 중에 50 질량% 초과 99.9 질량% 이하로 함유된다. 예를 들어, 알콕시알킬(메타)아크릴레이트는 단량체 조성물 중에 51 질량% 이상, 60 질량% 이상, 70 질량% 이상, 80 질량% 이상, 85 질량% 이상, 90 질량% 이상, 95 질량% 이상, 또는 98 질량% 이상 함유될 수도 있고, 99.5 질량% 이하, 99.0 질량% 이하, 98 질량% 이하, 95 질량% 이하, 90 질량% 이하, 또는 80 질량% 이하로 함유될 수도 있다. 예를 들어, 알콕시알킬(메타)아크릴레이트는 단량체 조성물 중에 70 질량% 이상 99.9 질량% 이하 또는 85 질량% 이상 99.9 질량% 이하로 포함될 수도 있다.Alkoxyalkyl (meth)acrylate is contained in the monomer composition in an amount exceeding 50% by mass and not exceeding 99.9% by mass. For example, the alkoxyalkyl (meth)acrylate is present in the monomer composition in an amount of 51% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, 85% by mass or more, 90% by mass or more, 95% by mass or more, Alternatively, it may be contained at 98 mass% or more, 99.5 mass% or less, 99.0 mass% or less, 98 mass% or less, 95 mass% or less, 90 mass% or less, or 80 mass% or less. For example, alkoxyalkyl (meth)acrylate may be included in the monomer composition in an amount of 70% by mass or more and 99.9% by mass or less, or 85% by mass or more and 99.9% by mass or less.
본 분야에서 사용되는 다른 단량체와 비교하여, 알콕시알킬(메타)아크릴레이트의 함유량이 상기한 바와 같이 높은 범위인 경우에는, 점착제층의 전기저항을 낮게 할 수 있다. 통상, 점착제층은 이온성 화합물 등의 대전 방지제를 이용함으로써 전기저항을 낮추고 있지만, (메타)아크릴 코폴리머의 조성을 변경함으로써 전기저항을 더욱 낮게 할 수 있다.Compared to other monomers used in this field, when the content of alkoxyalkyl (meth)acrylate is in the high range as described above, the electrical resistance of the adhesive layer can be lowered. Usually, the electrical resistance of the adhesive layer is lowered by using an antistatic agent such as an ionic compound, but the electrical resistance can be further lowered by changing the composition of the (meth)acrylic copolymer.
<(메타)아크릴 코폴리머-수산기 함유 단량체><(meth)acrylic copolymer-hydroxyl group-containing monomer>
(메타)아크릴 코폴리머를 중합하여 얻기 위한 단량체 조성물은 수산기 함유 단량체를 포함한다. 수산기 함유 단량체는 수산기 및 중합성기를 갖는 단량체이면 특히 한정되지 않지만, 예를 들어, 중합성기로서는 비닐기, (메타)아크릴로일기 등의 중합성 이중 결합을 갖는 기를 들 수 있다.The monomer composition for obtaining a (meth)acrylic copolymer by polymerizing it includes a hydroxyl group-containing monomer. The hydroxyl group-containing monomer is not particularly limited as long as it is a monomer having a hydroxyl group and a polymerizable group, but examples of the polymerizable group include groups having a polymerizable double bond, such as a vinyl group and a (meth)acryloyl group.
예를 들어, 수산기 함유 단량체는 CH2=CR4-COO-R5-OH의 화학식으로 표시되는 히드록시알킬(메타)아크릴레이트일 수도 있다. 여기서 R4는 수소원자 또는 메틸기이고, R5는 직선형 사슬 또는 분지형 사슬의 알킬렌기이다. R5의 탄소수는 1 이상 10 이하, 2 이상 5 이하, 또는 2 이상 4 이하의 범위로 할 수 있다.For example, the hydroxyl group-containing monomer may be a hydroxyalkyl (meth)acrylate represented by the formula CH 2 =CR 4 -COO-R 5 -OH. Here, R 4 is a hydrogen atom or a methyl group, and R 5 is a straight chain or branched chain alkylene group. The number of carbon atoms of R 5 may be 1 to 10, 2 to 5, or 2 to 4.
구체적으로는, 수산기 함유 단량체로서는 2-히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 6-히드록시헥실(메타)아크릴레이트, 8-히드록시옥틸(메타)아크릴레이트, 2-히드록시-3-페녹시프로필(메타)아크릴레이트 등을 들 수 있다.Specifically, hydroxyl group-containing monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and 6-hydroxyhexyl (meth)acrylate. late, 8-hydroxyoctyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, etc.
수산기 함유 단량체는 단량체 조성물 중에 0.1 질량% 이상 10 질량% 이하로 함유된다. 예를 들어, 수산기 함유 단량체는 단량체 조성물 중에 0.3 질량% 이상, 0.5 질량% 이상, 0.8 질량% 이상, 또는 1.0 질량% 이상 함유될 수도 있고, 8.0 질량% 이하, 5.0 질량% 이하, 3.0 질량% 이하, 2.0 질량% 이하, 또는 1.5 질량% 이하로 함유될 수도 있다. 예를 들어, 수산기 함유 단량체는 단량체 조성물 중에 0.3 질량% 이상 5.0 질량% 이하 또는 0.5 질량% 이상 2.0 질량% 이하로 포함될 수도 있다. 수산기 함유 단량체에서 유래하는 수산기는 가교점이 될 수 있고, 이러한 범위이면 (메타)아크릴 코폴리머를 적당한 겔 분율로 조정할 수 있다.The hydroxyl group-containing monomer is contained in the monomer composition in an amount of 0.1% by mass or more and 10% by mass or less. For example, the hydroxyl group-containing monomer may be contained in the monomer composition in an amount of 0.3 mass% or more, 0.5 mass% or more, 0.8 mass% or more, or 1.0 mass% or more, and 8.0 mass% or less, 5.0 mass% or less, or 3.0 mass% or less. , may be contained in 2.0 mass% or less, or 1.5 mass% or less. For example, the hydroxyl group-containing monomer may be included in the monomer composition in an amount of 0.3 mass% or more and 5.0 mass% or less, or 0.5 mass% or more and 2.0 mass% or less. Hydroxyl groups derived from hydroxyl group-containing monomers can serve as crosslinking points, and within this range, the (meth)acrylic copolymer can be adjusted to an appropriate gel fraction.
<(메타)아크릴 코폴리머-다른 단량체 성분><(meth)acrylic copolymer - other monomer components>
(메타)아크릴 코폴리머를 중합하여 얻기 위한 단량체 조성물은 본 발명의 유리한 효과를 얻을 수 있는 범위에서 알콕시알킬(메타)아크릴레이트 및 수산기 함유 단량체 이외의 단량체도 함유할 수 있다.The monomer composition obtained by polymerizing the (meth)acrylic copolymer may contain monomers other than alkoxyalkyl (meth)acrylate and hydroxyl group-containing monomers within the range that can obtain the advantageous effects of the present invention.
예를 들어, 단량체 조성물은 CH2=CR6-COO-R7의 화학식으로 표시되는 알킬(메타)아크릴레이트를 함유할 수 있다. 여기서 R6은 수소원자 또는 메틸기이고, R7은 직선형 사슬 또는 분지형 사슬의 알킬렌기이다. R7의 탄소수는 1 이상 20 이하, 1 이상 10 이하, 또는 2 이상 8 이하의 범위로 할 수 있다.For example, the monomer composition may contain an alkyl (meth)acrylate represented by the formula CH 2 =CR 6 -COO-R 7 . Here, R 6 is a hydrogen atom or a methyl group, and R 7 is a straight chain or branched chain alkylene group. The number of carbon atoms of R 7 may be in the range of 1 to 20, 1 to 10, or 2 to 8.
예를 들어, 알킬(메타)아크릴레이트로서는 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, n-프로필(메타)아크릴레이트, 이소프로필(메타)아크릴레이트, n-부틸(메타)아크릴레이트, 이소부틸(메타)아크릴레이트, tert-부틸(메타)아크릴레이트, n-펜틸(메타)아크릴레이트, n-헥실(메타)아크릴레이트, n-헵틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 이소옥틸(메타)아크릴레이트, n-노닐(메타)아크릴레이트, 이소노닐(메타)아크릴레이트, 데실(메타)아크릴레이트, 이소데실(메타)아크릴레이트, 운데카(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 올레일(메타)아크릴레이트, n-스테아릴(메타)아크릴레이트, 이소스테아릴(메타)아크릴레이트 등을 들 수 있다.For example, alkyl (meth)acrylates include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, and n-butyl (meth)acrylate. , isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, n-heptyl (meth)acrylate, 2-ethylhexyl ( Meth)acrylate, n-octyl(meth)acrylate, isooctyl(meth)acrylate, n-nonyl(meth)acrylate, isononyl(meth)acrylate, decyl(meth)acrylate, isodecyl(meth)acrylate ) Acrylate, undeca (meth)acrylate, lauryl (meth)acrylate, oleyl (meth)acrylate, n-stearyl (meth)acrylate, isostearyl (meth)acrylate, etc. there is.
예를 들어, 알킬(메타)아크릴레이트는 단량체 조성물 중에 0 질량% 이상, 5 질량% 이상, 10 질량% 이상, 또는 15 질량% 이상 함유될 수도 있고, 49 중량% 미만, 48 중량% 이하, 40 중량% 이하, 30 중량% 이하, 20 중량% 이하, 10 중량% 이하, 또는 5 중량% 이하로 함유될 수도 있다. 예를 들어, 알킬(메타)아크릴레이트는 단량체 조성물 중에 0 질량% 이상 48 질량% 이하 또는 0 질량% 이상 10 질량% 이하로 포함될 수도 있다. 본 발명자들의 검토에 의하면 알킬(메타)아크릴레이트의 함유량이 많은 경우, 얻어지는 코폴리머의 전기저항이 높아지는 경향이 있는 것을 알 수 있었다. 또한, 알킬(메타)아크릴레이트를 포함하는 경우에는, 유리에 대한 접착성이 저하되는 경향이 있는 것을 알 수 있었다. 따라서, 알킬(메타)아크릴레이트는 단량체 조성물 중에 실질적으로 포함되지 않을 수 있다.For example, the alkyl (meth)acrylate may be contained in the monomer composition in an amount of 0% by mass or more, 5% by mass or more, 10% by mass or more, or 15% by mass or more, and less than 49% by weight, less than 48% by weight, or less than 40% by weight. It may be contained in % by weight or less, 30% by weight or less, 20% by weight or less, 10% by weight or less, or 5% by weight or less. For example, alkyl (meth)acrylate may be included in the monomer composition in an amount of 0 mass% to 48 mass% or 0 mass% to 10 mass%. According to the examination by the present inventors, it was found that when the content of alkyl (meth)acrylate is high, the electrical resistance of the obtained copolymer tends to increase. Additionally, it was found that when alkyl (meth)acrylate was included, the adhesiveness to glass tended to decrease. Accordingly, alkyl (meth)acrylate may not be substantially included in the monomer composition.
기타 단량체 조성물로서, 예를 들어, 벤질(메타)아크릴레이트, 2-나프틸아크릴레이트, 페녹시에틸아크릴레이트 등의 방향환기를 갖는 (메타)아크릴산에스테르, 스티렌, α-메틸스티렌, o-메틸스티렌, p-메틸스티렌 등의 스티렌계 단량체; 아세트산비닐 등의 카르복실산비닐에스테르; 비닐(메타)아크릴로일기 함유 매크로 단량체를 함유할 수 있다.Other monomer compositions include, for example, (meth)acrylic acid esters having an aromatic ring group such as benzyl (meth)acrylate, 2-naphthylacrylate, and phenoxyethyl acrylate, styrene, α-methylstyrene, and o-methyl. Styrene-based monomers such as styrene and p-methylstyrene; Carboxylic acid vinyl esters such as vinyl acetate; It may contain a vinyl (meth)acryloyl group-containing macro monomer.
단량체 조성물은 질소 함유 단량체, 예를 들어 아미드기 함유 단량체 또는 아미노기 함유 단량체를 실질적으로 포함하지 않는 것이 바람직하다. 이들 단량체를 많이 포함하는 경우에는, 코폴리머의 전기저항이 높아지는 경우가 있다. 또한, 이들 단량체를 많이 포함하는 경우에는, 장기간에 걸쳐 고온환경 하에 노출되었을 경우에, 점착제층의 겔화가 지나치게 진행되는 결과, 점착제층과 접착하는 부재 사이에 박리 등이 발생하는 것을 알 수 있었다.It is preferred that the monomer composition is substantially free of nitrogen-containing monomers, such as amide group-containing monomers or amino group-containing monomers. When a large amount of these monomers are included, the electrical resistance of the copolymer may increase. In addition, when a large amount of these monomers are included, it was found that when exposed to a high temperature environment for a long period of time, gelation of the adhesive layer progresses excessively, resulting in peeling, etc. between the adhesive layer and the bonded member.
본 명세서에 있어서 "실질적으로 포함하지 않는다"란, 본 발명의 유리한 효과를 손상시키지 않는 범위이면 그 성분을 함유해도 되는 것을 의미한다. 예를 들어, 그 성분을 조성물 중에 실질적으로 포함하지 않는 것은 그 성분이 그 조성물 중에 0.50 질량% 미만, 0.30 질량% 미만, 0.20 질량% 미만, 0.10 질량% 미만, 또는 0.05 질량% 미만인 것을 의미하는 경우가 있다.In this specification, “substantially not included” means that the component may be contained as long as it does not impair the beneficial effects of the present invention. For example, if the component is not substantially included in the composition, it means that the component is less than 0.50 mass%, less than 0.30 mass%, less than 0.20 mass%, less than 0.10 mass%, or less than 0.05 mass% of the composition. There is.
아미드기 함유 단량체란, 전형적으로는 그 구조 중에 아미드기를 포함하고, 또한 (메타)아크릴로일기, 비닐기 등의 중합성 불포화 이중결합을 포함하는 화합물이다. 예를 들어, 아미드기 함유 단량체로서는 (메타)아크릴아미드 등의 아크릴아미드계 단량체; N-(메타)아크릴로일피페리딘 등의 N-아크릴로일 복소환 단량체; N-비닐피롤리돈 등의 N-비닐기 함유 락탐계 단량체 등을 들 수 있다.An amide group-containing monomer is a compound that typically contains an amide group in its structure and also contains a polymerizable unsaturated double bond such as a (meth)acryloyl group or vinyl group. For example, examples of the amide group-containing monomer include acrylamide-based monomers such as (meth)acrylamide; N-acryloyl heterocyclic monomers such as N-(meth)acryloylpiperidine; and N-vinyl group-containing lactam monomers such as N-vinylpyrrolidone.
아미노기 함유 단량체란, 전형적으로는 그 구조 중에 아미노기를 포함하고, 또한 (메타)아크릴로일기, 비닐기 등의 중합성 불포화 이중결합을 포함하는 화합물이다. 예를 들어, 아미노기 함유 단량체로서는 N,N-디메틸아미노에틸아크릴레이트, N,N-디메틸아미노에틸메타크릴레이트, N,N-디에틸아미노에틸메타크릴레이트 등을 들 수 있다.An amino group-containing monomer is a compound that typically contains an amino group in its structure and also contains a polymerizable unsaturated double bond such as a (meth)acryloyl group or vinyl group. For example, examples of amino group-containing monomers include N,N-dimethylaminoethyl acrylate, N,N-dimethylaminoethyl methacrylate, and N,N-diethylaminoethyl methacrylate.
단량체 조성물은 산성기 함유 단량체, 예를 들어 카르복실기 함유 단량체를 실질적으로 포함하지 않는 것이 바람직하다. 이 단량체를 많이 포함하는 경우에도 장기간에 걸쳐 고온환경 하에 노출되었을 경우에, 점착제층의 겔화가 지나치게 진행되는 결과, 점착제층과 접착하는 부재 사이에 박리 등이 발생하는 것을 알 수 있었다.It is preferred that the monomer composition is substantially free of acidic group-containing monomers, such as carboxyl group-containing monomers. It was found that even when a large amount of this monomer is contained, when exposed to a high temperature environment for a long period of time, gelation of the adhesive layer progresses excessively, resulting in peeling, etc. between the adhesive layer and the bonded member.
<(메타)아크릴 코폴리머-중합 개시제><(meth)acrylic copolymer-polymerization initiator>
(메타)아크릴 코폴리머를 형성하는 단량체 조성물은 추가로 중합 개시제를 포함할 수 있다. 중합 개시제로서는 통상 라디칼 중합에 사용할 수 있는 유기 과산화물, 아조 화합물 등을 사용하는 것이 가능하다. 구체적으로는, 중합 개시제로서 특허문헌 3에 기재된 바와 같은 중합 개시제를 사용할 수 있다.The monomer composition forming the (meth)acrylic copolymer may further include a polymerization initiator. As a polymerization initiator, it is possible to use organic peroxides, azo compounds, etc. that can normally be used in radical polymerization. Specifically, a polymerization initiator as described in Patent Document 3 can be used as a polymerization initiator.
중합 개시제 중, 단량체 성분의 중합반응 중에 그래프트 반응이 일어나기 어려운 중합 개시제가 바람직하고, 특히 아조 화합물이 바람직하다. 중합 개시제는 단량체 성분 합계 100 질량부에 대하여 0.01 질량부 이상 2.0 질량부 이하 또는 0.1 질량부 이상 1.0 질량부 이하로 사용할 수 있다.Among the polymerization initiators, polymerization initiators in which a graft reaction is unlikely to occur during the polymerization reaction of the monomer component are preferable, and azo compounds are especially preferable. The polymerization initiator can be used in an amount of 0.01 to 2.0 parts by mass or 0.1 to 1.0 parts by mass based on a total of 100 parts by mass of monomer components.
<(메타)아크릴 코폴리머-용매><(meth)acrylic copolymer-solvent>
단량체 조성물은 중합방법에 따라 용매를 포함할 수도 있다. 예를 들어, 용액중합에 의해 코폴리머를 얻는 경우에는, 단량체 성분을 용해 가능한 유기용매를 사용할 수 있다. 구체적으로는, 유기용매로서 특허문헌 3에 기재된 바와 같은 유기용매를 사용할 수 있다. 예를 들어, 그 중에서도 특히 중합반응 중에 연쇄이동을 일으키기 어려운 유기용매, 예를 들어 에스테르, 케톤을 사용하는 것이 바람직하고, 특히 단량체 성분의 용해성, 중합반응의 용이함 등의 점에서, 아세트산에틸, 메틸에틸케톤, 아세톤 등을 사용할 수 있다.The monomer composition may include a solvent depending on the polymerization method. For example, when obtaining a copolymer by solution polymerization, an organic solvent capable of dissolving the monomer component can be used. Specifically, an organic solvent such as that described in Patent Document 3 can be used as the organic solvent. For example, it is preferable to use organic solvents that are difficult to cause chain transfer during the polymerization reaction, such as esters and ketones. In particular, in view of the solubility of the monomer component and the ease of the polymerization reaction, ethyl acetate and methyl Ethyl ketone, acetone, etc. can be used.
<(메타)아크릴 코폴리머-다른 성분><(meth)acrylic copolymer-other ingredients>
단량체 조성물은 본 발명의 유리한 효과를 손상시키지 않는 범위이면 다른 성분을 포함할 수 있다. 예를 들어, 단량체 성분은 특허문헌 3에 기재된 바와 같은 연쇄이동제를 포함할 수 있고, 또한 중합방법에 따라 유화제, 분산제, 분산매 등을 포함할 수도 있다.The monomer composition may contain other components as long as they do not impair the beneficial effects of the present invention. For example, the monomer component may include a chain transfer agent as described in Patent Document 3, and may also include an emulsifier, dispersant, dispersion medium, etc. depending on the polymerization method.
<(메타)아크릴 코폴리머-중합방법><(Meth)acrylic copolymer-polymerization method>
(메타)아크릴 코폴리머의 중합방법은 특별히 제한되는 것은 아니고, 용액중합, 유화중합, 현탁중합, 괴상중합 등 공지의 방법에 의해 중합할 수 있다. 코폴리머를 사용하여 점착제 조성물을 제조함에 있어서, 처리공정이 비교적 간단하고 단시간에 실시할 수 있는 관점에서, 용액중합으로 코폴리머를 얻는 것이 바람직하다.The polymerization method of the (meth)acrylic copolymer is not particularly limited, and can be polymerized by known methods such as solution polymerization, emulsion polymerization, suspension polymerization, and bulk polymerization. When manufacturing an adhesive composition using a copolymer, it is preferable to obtain the copolymer by solution polymerization from the viewpoint that the processing process is relatively simple and can be performed in a short time.
<가교제><Cross-linking agent>
점착제 조성물은 가교제를 포함할 수 있다. 가교제를 함유시킴으로써, 점착제 조성물의 겔 분율을 적절한 범위로 할 수 있다. 가교제로서는 본 분야에서 공지된 이소시아네이트계 가교제를 사용할 수 있고, 예를 들어 2개 이상의 이소시아네이트기 또는 이소시아누레이트기 및 임의로 산소원자를 포함하는 탄소수 1 내지 20의 범위의 탄화수소기를 갖는 가교제를 사용할 수 있다. 구체적으로는, 특허문헌 3에 기재된 바와 같은 가교제를 사용할 수 있다.The adhesive composition may include a crosslinking agent. By containing a crosslinking agent, the gel fraction of the adhesive composition can be kept in an appropriate range. As a crosslinking agent, an isocyanate-based crosslinking agent known in the art can be used. For example, a crosslinking agent having two or more isocyanate groups or isocyanurate groups and a hydrocarbon group having 1 to 20 carbon atoms optionally containing an oxygen atom can be used. there is. Specifically, a crosslinking agent as described in Patent Document 3 can be used.
또한, 가교제로서 에폭시계 가교제를 사용할 수 있다. 에폭시계 가교제로서는 1분자 중에 에폭시기를 2개 이상 갖는 에폭시 화합물을 사용할 수 있고, 구체적으로는, 에틸렌글리콜디글리시딜에테르, 폴리에틸렌글리콜디글리시딜에테르, 글리세린디글리시딜에테르, 글리세린트리글리시딜에테르, 1,3-비스(N,N-디글리시딜아미노메틸)시클로헥산, N,N,N',N'-테트라글리시딜-m-자일릴렌디아민, N,N,N',N'-테트라글리시딜아미노페닐메탄, 트리글리시딜이소시아누레이트, m-N,N-디글리시딜아미노페닐글리시딜에테르, N,N-디글리시딜톨루이딘, N,N-디글리시딜아닐린을 사용할 수 있다.Additionally, an epoxy-based crosslinking agent can be used as a crosslinking agent. As an epoxy-based crosslinking agent, an epoxy compound having two or more epoxy groups per molecule can be used, specifically, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, and glycerin triglyceride. Diyl ether, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, N,N,N',N'-tetraglycidyl-m-xylylenediamine, N,N,N' ,N'-tetraglycidyl aminophenylmethane, triglycidyl isocyanurate, m-N,N-diglycidyl aminophenyl glycidyl ether, N,N-diglycidyl toluidine, N,N-di Glycidylaniline can be used.
또한, 가교제로서 금속 킬레이트 가교제를 사용할 수 있다. 금속 킬레이트 가교제로서는 알루미늄, 철, 구리, 아연, 주석, 티탄, 니켈, 안티몬, 마그네슘, 바나듐, 크롬, 지르코늄 등의 다가 금속에 알콕시드, 아세틸 아세톤, 아세토아세트산에틸 등이 배위한 화합물을 사용할 수 있고, 구체적으로는, 알루미늄이소프로필레이트, 알루미늄 sec-부틸레이트, 알루미늄에틸아세토아세테이트·디이소프로필레이트, 알루미늄트리스에틸아세토아세테이트, 알루미늄트리스아세틸아세토네이트를 사용할 수 있다.Additionally, a metal chelate crosslinking agent can be used as a crosslinking agent. As a metal chelate crosslinking agent, compounds in which alkoxide, acetylacetone, ethyl acetoacetate, etc. are coordinated to polyvalent metals such as aluminum, iron, copper, zinc, tin, titanium, nickel, antimony, magnesium, vanadium, chromium, and zirconium can be used. , specifically, aluminum isopropylate, aluminum sec-butylate, aluminum ethylacetoacetate/diisopropylate, aluminum trisethylacetoacetate, and aluminum trisacetylacetonate can be used.
가교제는 점착제 조성물 중에 (메타)아크릴 코폴리머 100 질량부에 대하여 0.05 질량부 이상, 0.1 질량부 이상, 0.2 질량부 이상, 0.3 질량부 이상, 또는 0.5 질량부 이상으로 함유될 수도 있고, 1.0 질량부 이하, 0.5 질량부 이하, 0.3 질량부 이하, 또는 0.2 질량부 이하로 함유될 수도 있다. 예를 들어, 가교제는 (메타)아크릴 코폴리머 100 질량부에 대하여 0.05 질량부 이상 1.0 질량부 이하 또는 0.1 질량부 이상 0.5 질량부 이하로 함유될 수도 있다.The crosslinking agent may be contained in the adhesive composition at 0.05 parts by mass, 0.1 parts by mass, 0.2 parts by mass, 0.3 parts by mass, or 0.5 parts by mass, or 1.0 parts by mass, based on 100 parts by mass of (meth)acrylic copolymer. Hereinafter, it may be contained at 0.5 parts by mass or less, 0.3 parts by mass or less, or 0.2 parts by mass or less. For example, the crosslinking agent may be contained in an amount of 0.05 parts by mass or more and 1.0 parts by mass or less, or 0.1 parts by mass or more and 0.5 parts by mass or less, based on 100 parts by mass of the (meth)acrylic copolymer.
점착제 조성물은 가교제가 코폴리머를 가교한 후의 상태에서 실시예에 기재된 방법으로 측정한 겔 분율이 50% 이상, 55% 이상, 60% 이상, 62% 이상, 64% 이상, 66% 이상, 또는 68% 이상일 수도 있고, 90% 이하, 85% 이하, 80% 이하, 75% 이하, 또는 70% 이하일 수도 있다. 예를 들어, 점착제 조성물의 겔 분율은 50% 이상 90% 이하 또는 62% 이상 90% 이하일 수도 있다.The adhesive composition has a gel fraction of 50% or more, 55% or more, 60% or more, 62% or more, 64% or more, 66% or more, or 68%, as measured by the method described in the Examples after the crosslinking agent crosslinks the copolymer. It may be % or more, 90% or less, 85% or less, 80% or less, 75% or less, or 70% or less. For example, the gel fraction of the adhesive composition may be 50% or more and 90% or less, or 62% or more and 90% or less.
점착제 조성물은 상기 성분 외, 본 발명의 효과를 손상시키지 않는 범위에서 대전 방지제, 자외선 흡수제, 산화 방지제, 점착 부여 수지, 가소제, 소포제, 충전제, 안정제, 연화제, 및 습윤성 조정제로부터 선택되는 성분을 함유할 수도 있다.In addition to the above components, the adhesive composition may contain components selected from antistatic agents, ultraviolet absorbers, antioxidants, tackifying resins, plasticizers, anti-foaming agents, fillers, stabilizers, softeners, and wettability regulators to the extent that they do not impair the effect of the present invention. It may be possible.
<실란 커플링제><Silane coupling agent>
점착제 조성물은 실란 커플링제를 포함할 수 있다. 실란 커플링제를 포함하는 점착제 조성물은 피착체와 점착제층의 접착을 양호하게 유지할 수 있다.The adhesive composition may include a silane coupling agent. An adhesive composition containing a silane coupling agent can maintain good adhesion between the adherend and the adhesive layer.
실란 커플링제로서는 본 분야에서 공지된 실란 커플링제를 사용할 수 있고, 예를 들어, 비닐트리메톡시실란 등의 중합성 불포화기 함유 규소화합물; 3-글리시독시프로필트리메톡시실란 등의 에폭시 구조를 갖는 규소화합물; 3-아미노프로필트리메톡시실란 등의 아미노기 함유 규소화합물; 3-클로로프로필트리메톡시실란; 올리고머형 실란 커플링제를 들 수 있다. 이들 중에서도 특히 (메타)아크릴 코폴리머 또는 그 단량체 성분에 포함되는 관능기와 반응하는 관능기를 갖는 실란 커플링제가 고습열환경 하에서 박리를 발생시키기 어렵다는 점에서 바람직하다.As the silane coupling agent, silane coupling agents known in the art can be used, for example, silicon compounds containing a polymerizable unsaturated group such as vinyltrimethoxysilane; Silicon compounds having an epoxy structure such as 3-glycidoxypropyltrimethoxysilane; Amino group-containing silicon compounds such as 3-aminopropyltrimethoxysilane; 3-chloropropyltrimethoxysilane; Oligomeric type silane coupling agents can be mentioned. Among these, a silane coupling agent having a functional group that reacts with a functional group contained in the (meth)acrylic copolymer or its monomer component is particularly preferable because it is difficult to cause peeling in a high-humidity heat environment.
실란 커플링제는 점착제 조성물 중에 (메타)아크릴 코폴리머 100 질량부에 대하여 0.05 질량부 이상, 0.1 질량부 이상, 0.2 질량부 이상, 0.3 질량부 이상, 또는 0.5 질량부 이상으로 함유될 수도 있고, 1.0 질량부 이하, 0.5 질량부 이하, 0.3 질량부 이하, 또는 0.2 질량부 이하로 함유될 수도 있다. 예를 들어, 실란 커플링제는 (메타)아크릴 코폴리머 100 질량부에 대하여 0.05 질량부 이상 1.0 질량부 이하 또는 0.1 질량부 이상 0.5 질량부 이하로 함유될 수도 있다.The silane coupling agent may be contained in the adhesive composition in an amount of 0.05 parts by mass or more, 0.1 parts by mass or more, 0.2 parts by mass or more, 0.3 parts by mass, or 0.5 parts by mass or more, based on 100 parts by mass of (meth)acrylic copolymer. It may be contained in 0.5 parts by mass or less, 0.3 parts by mass or less, or 0.2 parts by mass or less. For example, the silane coupling agent may be contained in an amount of 0.05 to 1.0 parts by mass, or 0.1 to 0.5 parts by mass, based on 100 parts by mass of the (meth)acrylic copolymer.
<대전 방지제><Antistatic agent>
점착제 조성물은 이온성 화합물로 이루어지는 대전 방지제를 포함할 수 있다. 대전 방지제를 포함하는 점착제 조성물은 (메타)아크릴 코폴리머의 알콕시알킬기의 산소원자가 대전 방지제에 포함되는 이온성기에 배위함으로써, 높은 대전 방지 성능을 실현할 수 있다.The adhesive composition may include an antistatic agent made of an ionic compound. The pressure-sensitive adhesive composition containing an antistatic agent can realize high antistatic performance by coordinating the oxygen atom of the alkoxyalkyl group of the (meth)acrylic copolymer to an ionic group contained in the antistatic agent.
대전 방지제로서는, 예를 들어 음이온과 양이온을 포함하는 25℃에서 액체 또는 고체인 이온성 화합물을 들 수 있다. 구체적으로는, 특허문헌 3에 기재된 바와 같은 알칼리 금속염, 이온성 액체, 계면활성제 등을 들 수 있다.Examples of antistatic agents include ionic compounds that are liquid or solid at 25°C and contain anions and cations. Specifically, alkali metal salts, ionic liquids, surfactants, etc. as described in Patent Document 3 can be mentioned.
이온성 화합물을 구성하는 양이온으로서는 무기계 양이온, 유기계 양이온을 들 수 있다. 무기계 양이온으로서는, 예를 들어 Li+, Na+, K+을 들 수 있다. 유기계 양이온으로서는, 예를 들어 피리디늄 양이온, 피페리디늄 양이온, 피롤리디늄 양이온, 피롤린 양이온, 피롤 양이온, 이미다졸륨 양이온, 테트라하이드로피리미디늄 양이온, 디하이드로피리미디늄 양이온, 피라졸륨 양이온, 피라졸리늄 양이온, 테트라알킬암모늄 양이온, 트리알킬설포늄 양이온, 테트라알킬포스포늄 양이온, 및 이들의 유도체를 들 수 있다.Cations constituting the ionic compound include inorganic cations and organic cations. Examples of inorganic cations include Li + , Na + , and K + . Examples of organic cations include pyridinium cation, piperidinium cation, pyrrolidinium cation, pyrroline cation, pyrrole cation, imidazolium cation, tetrahydropyrimidinium cation, dihydropyrimidinium cation, and pyrazolium cation. , pyrazolinium cation, tetraalkylammonium cation, trialkylsulfonium cation, tetraalkylphosphonium cation, and derivatives thereof.
이온성 화합물을 구성하는 음이온으로서는 상기 양이온과 이온 결합하여 이온성 화합물을 형성할 수 있는 것이면 특별히 제한되지 않는다. 예를 들어, F-, Cl-, Br-, I-, AlCl4 -, Al2Cl7 -, BF4 -, PF6 -, SCN-, ClO4 -, NO3 -, CH3COO-, CF3COO-, CH3SO3 -, CF3SO3 -, (CF3SO2)2N-, (FSO2)2N-, (CF3SO2)3C-, AsF6 -, SbF6 -, NbF6 -, TaF6 -, F(HF)n -, (CN)2N-, C4F9SO3 -, (C2F5SO2)2N-, C3F7COO-, 및 (CF3SO2)(CF3CO)N-을 들 수 있다.The anion constituting the ionic compound is not particularly limited as long as it can form an ionic compound by ionic bonding with the cation. For example, F - , Cl - , Br - , I - , AlCl 4 - , Al 2 Cl 7 - , BF 4 - , PF 6 - , SCN - , ClO 4 - , NO 3 - , CH 3 COO - , CF 3 COO - , CH 3 SO 3 - , CF 3 SO 3 - , (CF 3 SO 2 ) 2 N - , (FSO 2 ) 2 N - , (CF 3 SO 2 ) 3 C - , AsF 6 - , SbF 6 - , NbF 6 - , TaF 6 - , F(HF) n - , (CN) 2 N - , C 4 F 9 SO 3 - , (C 2 F 5 SO 2 ) 2 N - , C 3 F 7 COO - , and (CF 3 SO 2 )(CF 3 CO)N - .
이들 중에서도 특히 불소원자를 포함하는 음이온부는 이온 해리성이 좋은 이온 화합물이 얻어지는 점에서 바람직하게 사용된다. 또한, 불소원자를 포함하는 음이온 중에서도 불소 함유 이미드 음이온이 바람직하고, 그 중에서도 비스(트리플루오로메탄술포닐)이미드 음이온, 비스(플루오로술포닐)이미드 음이온인 것이 바람직하다. 특히 비스(트리플루오로메탄술포닐)이미드 음이온은 비교적 소량 첨가로 우수한 대전 방지성을 부여할 수 있고, 점착 특성을 유지하여 가습이나 가열환경 하에서의 내구성에 유리하게 되기 때문에 바람직하다.Among these, the anionic portion containing a fluorine atom is preferably used because an ionic compound with good ion dissociation properties can be obtained. Moreover, among the anions containing a fluorine atom, the fluorine-containing imide anion is preferable, and among them, the bis(trifluoromethanesulfonyl)imide anion and the bis(fluorosulfonyl)imide anion are preferable. In particular, bis(trifluoromethanesulfonyl)imide anion is preferable because it can provide excellent antistatic properties by adding a relatively small amount and maintains adhesive properties, which is advantageous for durability in humidified or heated environments.
이온성 화합물로서 구체적으로는 리튬비스(트리플루오로메탄술포닐)이미드, 리튬비스(디플루오로술포닐)이미드, 리튬트리스(트리플루오로메탄술포닐)메탄, 칼륨비스(트리플루오로메탄술포닐)이미드, 칼륨비스(디플루오로술포닐)이미드, 1-에틸피리디늄헥사플루오로포스페이트, 1-부틸-4-메틸피리디늄헥사플루오로포스페이트, 1-헥실-4-메틸피리디늄헥사플루오로포스페이트, 1-옥틸-4-메틸피리디늄헥사플루오로포스페이트, 1-옥틸-4-메틸피리디늄비스(플루오로술포닐)이미드, 1-옥틸-4-메틸피리디늄비스(트리플루오로메탄술포닐)이미드, (N,N-디에틸-N-메틸-N-(2-메톡시에틸)암모늄테트라플루오로보레이트, 부틸트리메틸암모늄비스(트리플루오로메탄술포닐)이미드, N,N-디에틸-N-메틸-N-(2-메톡시에틸)암모늄비스(트리플루오로메탄술포닐)이미드, 1-옥틸피리디늄비스(트리플루오로메탄술포닐)이미드, 1-옥틸-3-메틸피리디늄비스(트리플루오로술포닐)이미드를 들 수 있다.Ionic compounds specifically include lithium bis(trifluoromethanesulfonyl)imide, lithium bis(difluorosulfonyl)imide, lithium tris(trifluoromethanesulfonyl)methane, and potassium bis(trifluoro)imide. Methanesulfonyl)imide, potassium bis(difluorosulfonyl)imide, 1-ethylpyridinium hexafluorophosphate, 1-butyl-4-methylpyridinium hexafluorophosphate, 1-hexyl-4-methyl Pyridinium hexafluorophosphate, 1-octyl-4-methylpyridinium hexafluorophosphate, 1-octyl-4-methylpyridinium bis(fluorosulfonyl)imide, 1-octyl-4-methylpyridinium bis (trifluoromethanesulfonyl)imide, (N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium tetrafluoroborate, butyltrimethylammonium bis(trifluoromethanesulfonyl) Imide, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium bis(trifluoromethanesulfonyl)imide, 1-octylpyridinium bis(trifluoromethanesulfonyl) imide and 1-octyl-3-methylpyridinium bis(trifluorosulfonyl)imide.
상기 계면활성제로서는 비이온계 계면활성제, 양이온계 계면활성제, 음이온계 계면활성제, 및 양쪽성 계면활성제 중 어느 것도 사용할 수 있다. 또한, 그 외에 대전 방지제로서 도전성 폴리머, 도전성 카본, 염화암모늄, 염화알루미늄, 염화구리, 염화철, 황산암모늄 등을 사용할 수 있다.As the surfactant, any of nonionic surfactants, cationic surfactants, anionic surfactants, and amphoteric surfactants can be used. Additionally, as other antistatic agents, conductive polymers, conductive carbon, ammonium chloride, aluminum chloride, copper chloride, iron chloride, ammonium sulfate, etc. can be used.
대전 방지제는 점착제 조성물 중에 (메타)아크릴 코폴리머 100 질량부에 대하여 0.1 질량부 이상, 0.3 질량부 이상, 0.5 질량부 이상, 1.0 질량부 이상, 또는 2.0 질량부 이상으로 함유될 수도 있고, 10 질량부 이하, 5.0 질량부 이하, 3.0 질량부 이하, 또는 2.0 질량부 이하로 함유될 수도 있다. 예를 들어, 대전 방지제는 (메타)아크릴 코폴리머 100 질량부에 대하여 0.1 질량부 이상 10 질량부 이하 또는 0.5 질량부 이상 5.0 질량부 이하로 함유될 수도 있다.The antistatic agent may be contained in the adhesive composition in an amount of 0.1 parts by mass or more, 0.3 parts by mass or more, 0.5 parts by mass or more, 1.0 parts by mass, or 2.0 parts by mass or more, based on 100 parts by mass of (meth)acrylic copolymer. parts by mass or less, 5.0 parts by mass or less, 3.0 parts by mass or less, or 2.0 parts by mass or less. For example, the antistatic agent may be contained in an amount of 0.1 to 10 parts by mass, or 0.5 to 5.0 parts by mass, based on 100 parts by mass of the (meth)acrylic copolymer.
<용매><Solvent>
점착제 조성물은 도포성을 조정하기 위해 용매를 포함할 수 있다. 용매의 종류로서는 (메타)아크릴 코폴리머를 중합하기 위한 상기 중합용매와 동일한 것일 수도 있다.The adhesive composition may contain a solvent to adjust applicability. The type of solvent may be the same as the above polymerization solvent for polymerizing (meth)acrylic copolymer.
점착제 조성물은 용매를 함유함으로써 고형분 농도를 조정할 수 있다. 점착제 조성물의 고형분 농도는 10 질량% 이상, 12 질량% 이상, 14 질량% 이상, 또는 16 질량% 이상이어도 되고, 30 질량% 이하, 25 질량% 이하, 20 질량% 이하, 또는 18 질량% 이하일 수도 있다. 예를 들어, 점착제 조성물의 고형분 농도는 10 질량% 이상 30 질량% 이하 또는 12 질량% 이상 20 질량% 이하일 수도 있다.The solid content concentration of the adhesive composition can be adjusted by containing a solvent. The solids concentration of the adhesive composition may be 10 mass% or more, 12 mass% or more, 14 mass% or more, or 16 mass% or more, and may be 30 mass% or less, 25 mass% or less, 20 mass% or less, or 18 mass% or less. there is. For example, the solid content concentration of the adhesive composition may be 10 mass% or more and 30 mass% or less, or 12 mass% or more and 20 mass% or less.
《적층체》《Laminate》
적층체는 제1 부재, 제2 부재, 및 이들을 접착하는 점착제층을 포함하고, 점착제층은 상기와 같은 점착제 조성물로부터 형성된다. 점착제층은, 예를 들어 점착제 조성물을 건조 및/또는 가교시켜 얻을 수 있다.The laminate includes a first member, a second member, and an adhesive layer that adheres them, and the adhesive layer is formed from the adhesive composition described above. The adhesive layer can be obtained, for example, by drying and/or crosslinking the adhesive composition.
점착제층은 피착체인 제1 부재 및/또는 제2 부재에, 또는 이형(離型) 필름(세퍼레이터)의 표면에 점착제 조성물을 도포하고, 예를 들어 용매의 종류에 따라 50℃ 내지 150℃에서 건조시킨 후, 점착제층의 다른 층과 접하고 있지 않는 면에 이형 필름을 첩부하여 형성할 수 있다. 또한, 점착제층을 형성한 후에, 예를 들어 3 내지 10일간, 23℃ 내지 50℃ 환경 하 등에서 양생시켜 가교를 촉진시켜, 점착제 조성물의 겔 분율을 상기와 같은 범위로 할 수 있다.The adhesive layer is formed by applying an adhesive composition to the first member and/or second member as an adherend, or to the surface of a release film (separator), and drying it at, for example, 50°C to 150°C depending on the type of solvent. After this, it can be formed by attaching a release film to the side of the adhesive layer that is not in contact with other layers. In addition, after forming the pressure-sensitive adhesive layer, the gel fraction of the pressure-sensitive adhesive composition can be adjusted to the above-mentioned range by curing the pressure-sensitive adhesive layer in an environment of 23° C. to 50° C. for, for example, 3 to 10 days to promote crosslinking.
점착제 조성물의 도포방법으로서는 공지의 방법, 예를 들어 스핀 코트법, 나이프 코트법, 롤 코트법, 바 코트법, 블레이드 코트법, 다이 코트법, 그라비아 코트법 등을 들 수 있고, 특히 블레이드 코트법을 들 수 있다.Application methods of the adhesive composition include known methods, such as spin coat method, knife coat method, roll coat method, bar coat method, blade coat method, die coat method, and gravure coat method, especially the blade coat method. can be mentioned.
점착제층의 두께는 5μm 이상, 7μm 이상, 10μm 이상, 또는 15μm 이상일 수도 있고, 50μm 이하, 30μm 이하, 20μm 이하, 또는 15μm 이하일 수도 있다. 예를 들어, 점착제층의 두께는 5μm 이상 50μm 이하 또는 10μm 이상 30μm 이하일 수도 있다.The thickness of the adhesive layer may be 5 μm or more, 7 μm or more, 10 μm or more, or 15 μm or more, or 50 μm or less, 30 μm or less, 20 μm or less, or 15 μm or less. For example, the thickness of the adhesive layer may be 5 μm or more and 50 μm or less, or 10 μm or more and 30 μm or less.
피착체인 제1 부재 및 제2 부재로서는 특별히 한정되지 않지만, 예를 들어 광학부재를 들 수 있고, 예를 들어 유리기판, 편광판, 위상차 필름 등의 광학 필름 등을 들 수 있다. 편광판 및 광학 필름으로서 구체적으로는 특허문헌 3에 기재된 바와 같은 것을 사용할 수 있다. 점착제층에 포함된 (메타)아크릴 코폴리머가 단량체 성분으로서 알콕시알킬(메타)아크릴레이트를 많이 포함하는 경우에는, 점착제층의 유리기판에 대한 접착성이 높아지기 때문에 바람직하다.The first and second members that are adherends are not particularly limited, but examples include optical members, such as glass substrates, polarizing plates, and optical films such as retardation films. As a polarizing plate and an optical film, specifically, those described in Patent Document 3 can be used. It is preferable that the (meth)acrylic copolymer contained in the adhesive layer contains a large amount of alkoxyalkyl (meth)acrylate as a monomer component because the adhesiveness of the adhesive layer to the glass substrate increases.
도 1은 적층체의 일례를 모식적으로 나타내는 단면도이다.1 is a cross-sectional view schematically showing an example of a laminate.
적층체(100)는 도 1에 도시된 바와 같이 제1 부재인 유리기판(10), 제2 부재인 편광 필름(30), 및 그들을 접착하는 점착제층(20)을 포함한다. 편광 필름(30)은 폴리시클로올레핀계 필름(32), 폴리시클로올레핀계 필름(32) 위의 폴리비닐알코올 필름(34), 및 폴리비닐알코올 필름(34) 위의 TAC 필름(36)을 포함한다. 유리기판(10)과 폴리시클로올레핀계 필름(32)은 점착제층(20)으로 접착되어 있다.As shown in FIG. 1, the laminate 100 includes a glass substrate 10 as a first member, a polarizing film 30 as a second member, and an adhesive layer 20 that adheres them. The polarizing film 30 includes a polycycloolefin-based film 32, a polyvinyl alcohol film 34 on the polycycloolefin-based film 32, and a TAC film 36 on the polyvinyl alcohol film 34. do. The glass substrate 10 and the polycycloolefin-based film 32 are adhered to each other using an adhesive layer 20.
도 2는 적층체의 다른 일례를 모식적으로 나타내는 단면도이다.Figure 2 is a cross-sectional view schematically showing another example of a laminate.
적층체(200)는 도 2에 도시된 바와 같이 제1 부재인 유리기판(10), 제2 부재인 폴리시클로올레핀계 필름(위상차 필름)(32), 및 제3 부재인 편광 필름(130)을 포함하고, 이들을 접착하는 점착제층(20, 22)을 포함한다. 보다 구체적으로는, 폴리시클로올레핀계 필름(32)과 편광 필름(130)은 점착제층(20)으로 접착되어 있다. 또한, 유리기판(10)과 폴리시클로올레핀계 필름(32)은 점착제층(22)으로 접착되어 있다. 편광 필름(130)은 폴리시클로올레핀계 필름(제2 폴리시클로올레핀계 필름) 또는 TAC 필름인 층(38), 층(38) 위의 폴리비닐알코올 필름(34), 및 폴리비닐알코올 필름(34) 위의 TAC 필름(36)을 포함한다. 폴리시클로올레핀계 필름(제1 폴리시클로올레핀계 필름)(32)과 층(제2 폴리시클로올레핀계 필름)(38)은 점착제층(20)으로 접착되어 있다.As shown in FIG. 2, the laminate 200 includes a glass substrate 10 as a first member, a polycycloolefin-based film (retardation film) 32 as a second member, and a polarizing film 130 as a third member. and includes adhesive layers 20 and 22 that adhere them. More specifically, the polycycloolefin-based film 32 and the polarizing film 130 are adhered to each other using an adhesive layer 20. In addition, the glass substrate 10 and the polycycloolefin-based film 32 are adhered to each other using an adhesive layer 22. The polarizing film 130 includes a layer 38 that is a polycycloolefin-based film (second polycycloolefin-based film) or a TAC film, a polyvinyl alcohol film 34 on the layer 38, and a polyvinyl alcohol film 34 ) Includes the TAC film 36 above. The polycycloolefin-based film (first polycycloolefin-based film) 32 and the layer (second polycycloolefin-based film) 38 are adhered with an adhesive layer 20.
도 1 및 도 2에 있어서의 점착제층(20, 22)은 피착체의 표면에 형성되어 있다. 점착제 조성물을 피착체의 표면에 형성하는 방법으로서는, 예를 들어, 평활성이 양호한 이형 필름(세퍼레이터)의 표면에 점착제 조성물을 도포하고, 도막(塗膜)을 건조시킨 후, 당해 도막을 특정 수지 필름의 표면에 전사(轉寫)하는 전사법을 들 수 있다.The adhesive layers 20 and 22 in FIGS. 1 and 2 are formed on the surface of the adherend. As a method of forming the adhesive composition on the surface of the adherend, for example, the adhesive composition is applied to the surface of a release film (separator) with good smoothness, the coating film is dried, and then the coating film is applied to a specific resin film. One example is a transfer method that involves transferring onto the surface of .
적층체는 예를 들어 화상표시장치, 특히 액정표시장치에 이용할 수 있다. 보다 구체적으로는, 적층체는 예를 들어 터치패널(touch panel)용 화상표시장치에 이용할 수 있다. 이 경우, 적층체에 포함되는 유리기판은 액정표시장치용 유리기판일 수도 있다.The laminate can be used, for example, in an image display device, especially a liquid crystal display device. More specifically, the laminate can be used, for example, in an image display device for a touch panel. In this case, the glass substrate included in the laminate may be a glass substrate for a liquid crystal display device.
화상표시장치로서는 예를 들어 액정 TV, 컴퓨터 모니터, 핸드폰, 태블릿 등에 사용되는 TFT(박막 트랜지스트) 액정표시장치일 수도 있다.The image display device may be, for example, a TFT (thin film transistor) liquid crystal display device used in liquid crystal TVs, computer monitors, mobile phones, tablets, etc.
본 발명을 다음의 실시예에서 더 구체적으로 설명하지만, 본 발명은 이에 한정되는 것은 아니다.The present invention is explained in more detail in the following examples, but the present invention is not limited thereto.
실시예Example
《제조예》《Manufacturing example》
<실시예 1><Example 1>
교반장치, 질소 가스 도입관, 온도계, 및 환류 냉각관을 구비한 플라스크에 2-메톡시에틸아크릴레이트 99 질량부, 4-히드록시부틸아크릴레이트 1 질량부, 및 아세트산에틸 100 질량부를 투입하였다. 그 후, 플라스크 내에 질소 가스를 도입하면서 내용물을 65℃로 가열하였다. 그 다음, 질소 가스로 충분히 치환된 플라스크 내에 2,2'-아조비스-i-부티로니트릴(AIBN) 0.05 질량부를 교반 하에서 첨가하였다. 플라스크 내 내용물의 온도를 65℃로 유지하면서 6시간 동안 반응시켰다.99 parts by mass of 2-methoxyethyl acrylate, 1 part by mass of 4-hydroxybutylacrylate, and 100 parts by mass of ethyl acetate were added to a flask equipped with a stirring device, a nitrogen gas introduction pipe, a thermometer, and a reflux cooling pipe. Afterwards, the contents were heated to 65°C while introducing nitrogen gas into the flask. Next, 0.05 parts by mass of 2,2'-azobis-i-butyronitrile (AIBN) was added under stirring into a flask sufficiently substituted with nitrogen gas. The reaction was performed for 6 hours while maintaining the temperature of the contents in the flask at 65°C.
6시간 경과 후의 반응 혼합물에 아세트산에틸 300 질량부를 추가로 첨가하여 (메타)아크릴 코폴리머를 포함하는 용액을 얻었다. 얻어진 (메타)아크릴 코폴리머에 대해 GPC에 의해 측정된 Mw는 190만이었다.After 6 hours, 300 parts by mass of ethyl acetate was additionally added to the reaction mixture to obtain a solution containing a (meth)acrylic copolymer. The Mw measured by GPC for the obtained (meth)acrylic copolymer was 1.9 million.
얻어진 (메타)아크릴 코폴리머를 포함하는 용액의 고형분 100 질량부에 대하여, 고형분으로 표 1에 기재된 양으로 이소시아네이트계 가교제(TD-75, 소켄화학(綜硏化學) 제조) 및 대전 방지제(Py-PF6(1-부틸-4-메틸피리디늄헥사플루오로포스페이트))를 배합하였다. 또한, 0.2 질량부의 실란 커플링제(3-글리시독시프로필트리메톡시실란, 신에츠화학공업(信越化學工業) 제조)를 각 조성물에 더 배합한 후, 잘 혼합하여 점착제 조성물을 얻었다. 여기서, 고형분이란 점착제 조성물로부터 유기용매를 제외한 전체 성분을 말한다.An isocyanate-based crosslinking agent (TD-75, manufactured by Soken Chemical Co., Ltd.) and an antistatic agent (Py- PF6 (1-butyl-4-methylpyridinium hexafluorophosphate)) was blended. Additionally, 0.2 parts by mass of a silane coupling agent (3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.) was further added to each composition and mixed well to obtain an adhesive composition. Here, solid content refers to all components excluding the organic solvent from the adhesive composition.
<실시예 2∼13, 비교예 1∼3><Examples 2 to 13, Comparative Examples 1 to 3>
사용한 성분을 표 1과 같이 변경한 것 이외에는 실시예 1과 동일하게 하여, 실시예 2∼13 및 비교예 1∼3의 점착제 조성물을 얻었다.The adhesive compositions of Examples 2 to 13 and Comparative Examples 1 to 3 were obtained in the same manner as in Example 1 except that the components used were changed as shown in Table 1.
또한, 실시예 8에서 제조되는 (메타)아크릴 코폴리머에 대해서는 중합 초기에 투입하는 아세트산에틸을 90 질량부로, 실시예 9에서 제조되는 (메타)아크릴 코폴리머에 대해서는 중합 초기에 투입하는 아세트산에틸을 110 질량부로, 실시예 10에서 제조되는 (메타)아크릴 코폴리머에 대해서는 중합 초기에 투입하는 아세트산에틸을 80 질량부로, 실시예 11에서 제조되는 (메타)아크릴 코폴리머에 대해서는 중합 초기에 투입하는 아세트산에틸을 70 질량부로, 비교예 3에서 제조되는 (메타)아크릴 코폴리머에 대해서는 중합 초기에 투입하는 아세트산에틸을 120 질량부로 하고, (메타)아크릴 코폴리머의 Mw를 조정하였다.In addition, for the (meth)acrylic copolymer prepared in Example 8, ethyl acetate added at the beginning of polymerization was 90 parts by mass, and for the (meth)acrylic copolymer prepared in Example 9, ethyl acetate added at the beginning of polymerization was 90 parts by mass. 110 parts by mass, 80 parts by mass of ethyl acetate added at the beginning of polymerization for the (meth)acrylic copolymer prepared in Example 10, and 80 parts by mass of acetic acid added at the beginning of polymerization for the (meth)acrylic copolymer prepared in Example 11. The Mw of the (meth)acrylic copolymer was adjusted by setting ethyl to 70 parts by mass, and ethyl acetate added at the beginning of polymerization to the (meth)acrylic copolymer produced in Comparative Example 3 to 120 parts by mass.
<점착제층 부착 편광 필름><Polarizing film with adhesive layer>
박리 처리된 PET 필름 위에, 액체 온도 25℃에서 닥터 블레이드를 사용하여 건조 후의 막 두께가 25μm가 되도록, 실시예 및 비교예에서 얻어진 점착제 조성물을 도포하였다. 그 후, 90℃에서 3분간 건조시켜 점착제층 부착 PET 필름을 얻었다. 점착제층 부착 PET 필름과 편광판(COP 필름 40μm/편광 필름 20μm/TAC 필름 40μm)을, 점착제층 부착 PET 필름의 점착제층과 편광판의 COP 필름면이 접하도록 첩합했다. 그리고, 50℃의 조건으로 그것을 3일간 정치(靜置)하여 점착제층 부착 편광판을 얻었다.The adhesive composition obtained in the examples and comparative examples was applied onto the peeled PET film using a doctor blade at a liquid temperature of 25°C so that the film thickness after drying was 25 μm. After that, it was dried at 90°C for 3 minutes to obtain a PET film with an adhesive layer. PET film with an adhesive layer and a polarizing plate (COP film 40 μm/polarizing film 20 μm/TAC film 40 μm) were bonded together so that the adhesive layer of the PET film with an adhesive layer and the COP film surface of the polarizing plate were in contact. And it was left still for 3 days under conditions of 50°C, and a polarizing plate with an adhesive layer was obtained.
<점착 시트><Adhesive sheet>
박리 처리된 PET 필름 위에, 액체 온도 25℃에서 닥터 블레이드를 사용하여 건조 후의 막 두께가 25μm가 되도록, 실시예 및 비교예에서 얻어진 점착제 조성물을 도포하였다. 그 후, 90℃에서 3분간 건조시켜 점착제층 부착 PET 필름을 얻었다. 점착제층 부착 PET 필름과 박리 처리된 PET 필름을, 점착제층 부착 PET 필름의 점착제층과 PET 필름의 박리 처리면이 접하도록 첩합했다. 그리고, 50℃의 조건으로 그것을 3일간 정치하여 점착 시트를 얻었다.The adhesive composition obtained in the examples and comparative examples was applied onto the peeled PET film using a doctor blade at a liquid temperature of 25°C so that the film thickness after drying was 25 μm. After that, it was dried at 90°C for 3 minutes to obtain a PET film with an adhesive layer. The PET film with an adhesive layer and the peeled PET film were bonded together so that the adhesive layer of the PET film with an adhesive layer and the peeling treated surface of the PET film were in contact. Then, it was left to stand for 3 days under conditions of 50°C to obtain an adhesive sheet.
《시험방법》"Test Methods"
<표면저항률><Surface resistivity>
점착제층 부착 편광판으로부터 PET 필름을 박리한 후, 저항률계(하이레스타 UX MCP-HT800, 닛토 세이코(日東精工) 애널리텍 제조)를 이용하여 인가 전압 1000V에서 JIS-K-6911에 준하여 23℃/50%RH 환경 하에서 점착제층의 표면저항률을 측정하였다.After peeling the PET film from the polarizing plate with the adhesive layer, use a resistivity meter (Hiresta UX MCP-HT800, manufactured by Nitto Seiko Analytech) to measure 23°C/50°C at an applied voltage of 1000V in accordance with JIS-K-6911. The surface resistivity of the adhesive layer was measured under %RH environment.
<무알칼리 유리에 대한 점착력><Adhesion to alkali-free glass>
점착제층 부착 편광판을 25mm 폭으로 재단하여 시험편을 제작하였다. 시험편으로부터 박리 처리된 PET 필름을 박리하고, 노출된 점착제층을 무알칼리 유리판에 첩부하였다. 그 후, 50℃/5atm으로 조정된 오토클레이브(autoclave) 중에 20분간 유지하고, 이들을 압착하였다. 압착 후, 23℃/50%RH 환경 하에서 1시간 방치하고, 점착제층 부착 편광판을 유리판에 대하여 180°의 각도로 300mm/min의 속도로 시험편 단부를 당겨 점착력을 측정하였다.A test piece was produced by cutting a polarizing plate with an adhesive layer to a width of 25 mm. The peel-treated PET film was peeled from the test piece, and the exposed adhesive layer was attached to an alkali-free glass plate. Afterwards, they were kept in an autoclave adjusted to 50°C/5atm for 20 minutes and compressed. After compression, it was left to stand for 1 hour in an environment of 23°C/50%RH, and the end of the test piece was pulled at a speed of 300 mm/min with the polarizing plate with the adhesive layer at an angle of 180° with respect to the glass plate to measure the adhesive force.
<겔 분율><Gel fraction>
점착 시트로부터 약 0.1g의 점착제를 샘플병에 채취하였다. 그 샘플병에 아세트산에틸 30mL를 넣고 4시간 동안 진탕(振蕩)시켰다. 이 샘플병의 내용물을 200 메쉬의 스테인리스제 철망으로 여과하고, 철망상의 잔류물을 90℃에서 2시간 건조시켜 건조 중량을 측정하였다. 다음 식에 의해 점착제의 겔 분율을 구했다.Approximately 0.1 g of adhesive was collected from the adhesive sheet into a sample bottle. 30 mL of ethyl acetate was added to the sample bottle and shaken for 4 hours. The contents of this sample bottle were filtered through a 200 mesh stainless steel wire mesh, and the residue on the wire mesh was dried at 90°C for 2 hours and the dry weight was measured. The gel fraction of the adhesive was calculated using the following equation.
겔 분율(%)=(건조 중량/점착제 채취 중량)×100 (%)Gel fraction (%) = (dry weight/adhesive collected weight) × 100 (%)
<내열내구 후 겔 분율><Gel fraction after heat resistance>
점착 시트를 온도 105℃의 조건 하에서 500시간 방치하였다. 그 후, 23℃/50%RH 환경 하에서 1시간 방치하였다. 약 0.1g의 점착제를 샘플병에 채취하고, 아세트산에틸 30mL를 첨가하여 4시간 진탕시켰다. 이 샘플병의 내용물을 200 메쉬의 스테인리스제 철망으로 여과하고, 철망상의 잔류물을 90℃에서 2시간 건조시켜 건조 중량을 측정하였다. 다음 식에 의해 점착제의 겔 분율을 구했다.The adhesive sheet was left for 500 hours under conditions of a temperature of 105°C. After that, it was left for 1 hour in an environment of 23°C/50%RH. Approximately 0.1 g of adhesive was collected in a sample bottle, 30 mL of ethyl acetate was added, and the sample was shaken for 4 hours. The contents of this sample bottle were filtered through a 200 mesh stainless steel wire mesh, and the residue on the wire mesh was dried at 90°C for 2 hours and the dry weight was measured. The gel fraction of the adhesive was calculated using the following equation.
겔 분율(%)=(건조 중량/점착제 채취 중량)×100 (%)Gel fraction (%) = (dry weight/adhesive collected weight) × 100 (%)
<105℃ dry 내열내구성><105℃ dry heat resistance>
점착제층 부착 편광판을 160mm(MD방향)×90mm(TD방향)의 크기로 재단하여 시험편을 제작하였다. 시험편으로부터 PET 필름을 박리한 후, 점착제층 부착 편광판을 두께 2mm의 무알칼리 유리판을 유리기판으로서 갖는 액정 패널의 한쪽 면에 점착제층과 무알칼리 유리판이 접하도록, 라미네이터 롤을 사용하여 첩착하였다. 얻어진 적층체를 50℃/5기압으로 조정된 오토클레이브 중에 20분간 유지하여 시험판을 제작하였다. 상기 시험판을 온도 105℃의 조건 하에서 500시간 방치하고, 시험판의 점착제층으로부터의 발포, 시험판의 균열, 점착제층의 박리 등의 외관 결함을 육안 관찰하여 이하의 기준으로 평가했다.A test piece was produced by cutting a polarizing plate with an adhesive layer into a size of 160 mm (MD direction) x 90 mm (TD direction). After peeling the PET film from the test piece, the polarizing plate with the adhesive layer was attached to one side of a liquid crystal panel having an alkali-free glass plate with a thickness of 2 mm as a glass substrate using a laminator roll so that the adhesive layer and the alkali-free glass plate were in contact. The obtained laminate was kept in an autoclave adjusted to 50°C/5 atm for 20 minutes to produce a test plate. The test panel was left for 500 hours under conditions of a temperature of 105°C, and external defects such as foaming from the adhesive layer of the test panel, cracks in the test panel, and peeling of the adhesive layer were visually observed and evaluated according to the following criteria.
○: 외관 결함 없음○: No appearance defects
△: 약간의 외관 결함이 확인되지만 실제 사용상, 문제 없음△: Some cosmetic defects are observed, but there are no problems in actual use.
×: 외관 결함 있음×: Appearance defects
《결과》"result"
결과를 하기 표 1에 나타낸다.The results are shown in Table 1 below.
표 1로부터 알 수 있는 바와 같이, (메타)아크릴 코폴리머는 알콕시알킬(메타)아크릴레이트를 포함하는 단량체로 제조되어 있고, 또한 중량평균 분자량이 충분히 높은 경우에는 내열내구성이 양호해지는 것을 알 수 있었다.As can be seen from Table 1, the (meth)acrylic copolymer was made from a monomer containing alkoxyalkyl (meth)acrylate, and when the weight average molecular weight was sufficiently high, it was found that heat resistance and durability were good. .
또한, 단량체 성분에 아미드기 함유 단량체인 아크릴아미드 또는 아미노기 함유 단량체인 디메틸아미노에틸메타크릴레이트를 포함하는 경우에는, 실용상 문제는 없지만 내열내구성이 악화되었다. 이것은, 내열 후의 겔 분율이 지나치게 높아져 점착제층의 유연성이 상실된 것에 의한 것으로 생각된다.Additionally, when the monomer component includes acrylamide, an amide group-containing monomer, or dimethylaminoethyl methacrylate, an amino group-containing monomer, there is no practical problem, but heat resistance deteriorates. This is thought to be because the gel fraction after heat resistance became too high and the flexibility of the adhesive layer was lost.
또한, 단량체 성분에 알킬(메타)아크릴레이트인 부틸아크릴레이트를 포함하는 경우에는, 표면저항이 높아지는 것을 알 수 있었다. 또한, 유리에 대한 점착력도 저하되는 것을 알 수 있었다.In addition, it was found that when butyl acrylate, an alkyl (meth)acrylate, was included in the monomer component, the surface resistance increased. Additionally, it was found that the adhesion to glass also decreased.
또한, 실시예 1∼3에 있어서, 대전 방지제를 변경하여 행한 실시예 14∼19의 결과를 이하의 표 2에 나타낸다.In addition, in Examples 1 to 3, the results of Examples 14 to 19 performed by changing the antistatic agent are shown in Table 2 below.
10 유리기판
20, 22 점착제층
30, 130 편광 필름
32 위상차 필름(폴리시클로올레핀계 필름)
34 폴리비닐알코올(PVA) 필름
36 TAC 필름
38 폴리시클로올레핀계 필름 또는 TAC 필름
100, 200 적층체10 Glass substrate
20, 22 Adhesive layer
30, 130 polarizing film
32 Retardation film (polycycloolefin-based film)
34 Polyvinyl alcohol (PVA) film
36 TAC Film
38 Polycycloolefin-based film or TAC film
100, 200 laminate
Claims (8)
상기 (메타)아크릴 코폴리머는 50 질량% 초과 99.9 질량% 이하의 알콕시알킬(메타)아크릴레이트 및 0.1 질량% 이상 10 질량% 이하의 수산기 함유 단량체를 포함하는 단량체 조성물의 코폴리머이며,
상기 (메타)아크릴 코폴리머의 중량평균 분자량이 165만 이상인 점착제 조성물.An adhesive composition containing a (meth)acrylic copolymer and a crosslinking agent,
The (meth)acrylic copolymer is a copolymer of a monomer composition containing more than 50% by mass and less than 99.9% by mass of alkoxyalkyl (meth)acrylate and 0.1% by mass and less than 10% by mass of a hydroxyl group-containing monomer,
An adhesive composition in which the weight average molecular weight of the (meth)acrylic copolymer is 1.65 million or more.
상기 단량체 조성물은 80 질량% 초과의 알콕시알킬(메타)아크릴레이트를 포함하는 점착제 조성물.According to paragraph 1,
The monomer composition is an adhesive composition containing more than 80% by mass of alkoxyalkyl (meth)acrylate.
상기 (메타)아크릴 코폴리머의 중량평균 분자량은 185만 이상 250만 이하인 점착제 조성물.According to paragraph 1,
An adhesive composition wherein the (meth)acrylic copolymer has a weight average molecular weight of 1.85 million to 2.5 million.
상기 단량체 조성물은 아미드기 함유 단량체 또는 아미노기 함유 단량체를 실질적으로 포함하지 않는 점착제 조성물.According to paragraph 1,
The monomer composition is an adhesive composition that substantially does not contain an amide group-containing monomer or an amino group-containing monomer.
상기 단량체 조성물은 카르복실기 함유 단량체를 실질적으로 포함하지 않는 점착제 조성물.According to paragraph 1,
The monomer composition is an adhesive composition that substantially does not contain a carboxyl group-containing monomer.
상기 점착제 조성물로부터 형성되는 점착제층의 겔 분율은 62% 이상 90% 이하인 점착제 조성물.According to paragraph 1,
A pressure-sensitive adhesive composition wherein the gel fraction of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition is 62% or more and 90% or less.
비스(트리플루오로메탄술포닐)이미드 음이온을 포함하는 대전 방지제를 추가로 함유하는 점착제 조성물.According to paragraph 1,
An adhesive composition further containing an antistatic agent containing a bis(trifluoromethanesulfonyl)imide anion.
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PCT/JP2022/032007 WO2023053800A1 (en) | 2021-09-29 | 2022-08-25 | Adhesive composition and laminate containing same |
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KR (1) | KR20240070575A (en) |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009079203A (en) | 2007-09-06 | 2009-04-16 | Nitto Denko Corp | Pressure-sensitive adhesive composition, pressure-sensitive adhesive product and display using it |
KR20160059979A (en) | 2014-11-19 | 2016-05-27 | 인피니언 테크놀로지스 아게 | Receiver, sender, method for retrieving an additional datum from a signal and method for transmitting a datum and an additional datum in a signal |
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JP6632350B2 (en) * | 2015-11-27 | 2020-01-22 | 三星エスディアイ株式会社SAMSUNG SDI Co., LTD. | Pressure-sensitive adhesive for optical film, pressure-sensitive adhesive layer, optical member, and image display device |
JP6632349B2 (en) * | 2015-11-27 | 2020-01-22 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | Pressure sensitive adhesive for optical film, pressure sensitive adhesive layer for optical film, optical member and image display device |
JP7440993B2 (en) * | 2018-12-17 | 2024-02-29 | 日東電工株式会社 | Optical film with adhesive layer, image display panel and image display device |
KR20240033175A (en) * | 2018-12-26 | 2024-03-12 | 닛토덴코 가부시키가이샤 | Adhesive composition for optical films, adhesive layer for optical films, and optical film with adhesive layer |
JP7309522B2 (en) * | 2019-08-28 | 2023-07-18 | 日東電工株式会社 | Adhesive layer-attached polarizing film laminate and optical display panel using the adhesive layer-attached polarizing film laminate |
JPWO2021085136A1 (en) * | 2019-10-28 | 2021-05-06 | ||
JP2022074622A (en) * | 2020-11-05 | 2022-05-18 | 日東電工株式会社 | Polarizer and image display device |
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- 2022-08-25 WO PCT/JP2022/032007 patent/WO2023053800A1/en active Application Filing
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2009079203A (en) | 2007-09-06 | 2009-04-16 | Nitto Denko Corp | Pressure-sensitive adhesive composition, pressure-sensitive adhesive product and display using it |
KR20160059979A (en) | 2014-11-19 | 2016-05-27 | 인피니언 테크놀로지스 아게 | Receiver, sender, method for retrieving an additional datum from a signal and method for transmitting a datum and an additional datum in a signal |
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TW202313908A (en) | 2023-04-01 |
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