KR20240067670A - Light emitting characteristic inspection device of light emitting device - Google Patents

Abstract

Receives light generated by a light-emitting device in an inspection area of a predetermined size, divides the received light into a first direction and a second direction, and measures the light emission intensity distribution within the inspection area for the light traveling in the first direction. and an inspection device comprising a measuring unit that measures optical characteristics including a ray flux and color coordinates for light traveling in the second direction. According to the present invention, the manufacturing process time for a light emitting device can be shortened, thereby improving the manufacturing process efficiency. Additionally, by shortening the probing process, the occurrence of progressive defects applied to the light emitting device can be reduced, thereby improving quality.

Description

Light emitting device inspection device {LIGHT EMITTING CHARACTERISTIC INSPECTION DEVICE OF LIGHT EMITTING DEVICE}

The present invention relates to an apparatus for inspecting the light-emitting characteristics of a light-emitting device during the manufacturing process of the light-emitting device. In detail, the present invention relates to a device for measuring the quality of a light-emitting device by applying power to the light-emitting device and inspecting the light-emitting characteristics.

When assembling a display device using light-emitting devices, there is a need to measure and classify the quality and quality of each light-emitting device. In order to accurately test the characteristics of a light emitting device, measurement by applying a constant current is required. Appearance defects of light-emitting devices can be inspected through AOI (Automated Optical Inspection), but especially in the case of display devices, electroluminescence inspection is essential to ensure high quality and reliability. Although this electroluminescence inspection method requires probing technology with high technical difficulty, it is an essential requirement for after-sales service costs and securing the manufacturer's reliability after product production and shipment.

The conventional probing process is confirmed by performing a lighting inspection of the light emitting device after the final combination of the light emitting device is completed. This not only increases repair costs, but also reduces the operation rate of process equipment as unnecessary work may be performed. Furthermore, it causes the problem of an increase in overall manufacturing costs.

Republic of Korea Patent No. 10-1900329 (registered on September 13, 2018) Republic of Korea Patent No. 10-1959484 (registered on March 12, 2019)

The technical task of the present invention is to improve the efficiency of the manufacturing process by reducing unnecessary work by examining the luminous properties during the manufacturing process of the light emitting device.

In order to solve the above problem, an inspection device according to the present invention receives light generated by a light-emitting element in an inspection area of a predetermined size, divides the received light into a first direction and a second direction, and transmits the light in the first direction. It is characterized by comprising a measuring unit that measures the light emission intensity distribution within the inspection area for the light traveling in the second direction, and measuring optical characteristics including a ray flux and color coordinates for the light traveling in the second direction.

According to the present invention, the manufacturing process time for a light emitting device can be shortened, thereby improving the manufacturing process efficiency.

Additionally, by shortening the probing process, the occurrence of progressive defects applied to the light emitting device can be reduced, thereby improving quality.

Figure 1 shows a testing device according to an embodiment of the present invention.
Figure 2 shows the operation of the first moving part according to the present invention.
Figure 3 shows the operation of the second moving part according to the present invention.
Figure 4 shows the operation of the third moving part according to the present invention.
Figure 5 shows a first height sensor and a second height sensor according to an embodiment of the present invention.
Figure 6 is a cross-sectional view showing a case where there is bowing in the substrate.
Figure 7 is a flowchart showing a method of measuring the emission characteristics of a light-emitting device according to an embodiment of the present invention.
Figure 8 is a perspective view showing a probe card according to an embodiment of the present invention.
Figure 9 shows the cross-sectional structure of a probe substrate according to an embodiment of the present invention.
Figure 10 is a cross-sectional view showing a method of aligning an inspection device according to an embodiment of the present invention.
Figure 11 is a cross-sectional view showing a measuring unit according to an embodiment of the present invention.
Figure 12 shows a graph of measurement results according to an embodiment of the present invention.

The terms used in this specification will be briefly described, and an embodiment of the present invention will be described in detail. The terms used in this specification are general terms that are currently widely used as much as possible while considering the function in the present invention, but this may vary depending on the intention or precedent of a person working in the art, the emergence of new technology, etc. In addition, in certain cases, there are terms arbitrarily selected by the applicant, and in this case, the meaning will be described in detail in the description of the relevant invention. Therefore, the terms used in this specification should be defined based on the meaning of the term and the overall content of the present invention, rather than simply the name of the term.

In this description, unless otherwise specified, 'top' refers to the upward direction in the drawing as the direction in which the terminals of the light emitting device are formed, and 'top' refers to the surface in the upper direction. Unless otherwise specified, 'lower side' refers to the downward direction in the drawing as the direction in which light generated by a light-emitting device travels, and 'lower side' refers to the lower side.

Hereinafter, embodiments according to the present invention will be described in detail through the attached drawings.

Figure 1 shows an inspection device 1 according to an embodiment of the present invention.

According to the present invention, the inspection device 1 includes a measuring unit 10, a probe-card (20), a bed unit 30, and an alignment sensor unit 40.

The measuring unit 10 is configured to measure the electroluminescence characteristics of the light emitting device. In detail, the measuring units 10 are provided at a predetermined distance apart in the light emission direction of the light emitting elements formed on the upper surface of the substrate W, and when power is supplied to each light emitting element, the light emission characteristics of each light emitting element are measured through a camera or photometer. Measure. 1 is shown based on the fact that the light emitting device emits light in a downward direction and the measuring unit 10 is located on the lower side of the substrate. The measuring unit will be described in detail later with reference to FIG. 11.

The probe card 20 is configured to apply power to each light emitting device. In detail, the probe card 20 is positioned spaced apart from the substrate W in the direction in which the terminal of the light emitting device is formed, and the probe pin 21 is formed to protrude in the direction toward the light emitting device (see FIG. 3). . The probe card 20 is moved in the direction of the light emitting device so that the probe pin 21 contacts the terminal of each light emitting device. The light emitting element is electrically connected to the inspection device 1 through the probe pin 21 and can receive power.

The bed portion 30 is configured to fix the substrate W, which is the measurement target. In detail, the bed portion 30 is located on the upper side of the measuring portion 10, and a ring portion corresponding to the edge shape of the substrate W is formed on the upper side of the bed portion 30 so that the substrate W is positioned on the bed portion ( 30) can be fixed to the upper surface. Preferably, at least a portion of the bed portion 30 where the substrate is disposed may be made of a transparent material to allow light to pass through from the top surface to the bottom surface. Accordingly, the light generated by the light emitting device can penetrate the bed part 30 and reach the measuring part 10.

The alignment sensor unit 40 is configured to detect the alignment state of the probe card 20 and the substrate (W). In detail, the probe card 20 needs to be aligned with the substrate W in order for the probe pin 21 to contact the terminal of the light emitting device. To this end, the alignment sensor unit 40 may be disposed in a position opposite to the probe card 20 of the substrate W. The alignment sensor unit 40 will be described in detail later with reference to FIG. 10.

Preferably, the bed portion 30 can be moved in a horizontal direction (x-direction and y-direction in FIG. 1) with respect to the substrate. In detail, the table part (T) fixed to the ground is provided with a first moving part 51, and the first moving part 51 moves in one horizontal axis direction (y-axis direction in FIG. 1) and the other axis direction. It can be moved along each rail portion formed in (x-axis direction in FIG. 1). Accordingly, the horizontal position of the substrate can be changed by moving the bed portion 30.

Preferably, the probe card 20 can be moved in a direction perpendicular to the substrate (z direction in FIG. 1). In detail, the table part T fixed to the ground is provided with a second moving part 52, and the second moving part 52 can be moved along a rail formed in the vertical direction. Accordingly, the probe card 20 can be moved to the position of each light-emitting device on the substrate W on which the light-emitting device is disposed.

Preferably, the alignment sensor unit 40 can be moved through the third moving unit 53. In detail, the table part (T) fixed to the ground is provided with a third moving part 53, and the third moving part 53 is connected to an actuator disposed in the horizontal direction and moves in one horizontal direction (in FIG. 1). y direction) and the opposite direction. The alignment error of the alignment sensor unit 40 can be adjusted through the third moving unit 53.

Additionally, the third moving unit 53 includes a vertical actuator and can reciprocate the alignment sensor unit 40 in the vertical direction. That is, the alignment sensor unit 40 can be moved in one horizontal direction and one vertical direction through the third moving unit 53.

Preferably, the inspection device 1 according to the present invention may include an inspection camera unit 60 for checking the condition of the probe card 20 including the probe pin 21. Preferably, the inspection camera unit 60 may be provided on the lower side of the probe pin 21 and may be provided in an imaging direction toward the probe pin 21. More preferably, the inspection camera unit 60 may be provided connected to the first moving unit 51. Accordingly, the inspection camera unit 60 may be moved to the inspection position of the probe pin 21 as needed, or may be moved to deviate from the light path when measuring the light emission characteristics of the light emitting device.

By providing the inspection camera unit 60, it is possible to remotely inspect the status of the probe pin 21. In addition, when the probe pin 21 is provided so small that it is difficult to check with the naked eye, the inspection camera unit 60 can facilitate inspection through enlarged photography. In particular, in the case of the probe pin 21 for a very small light emitting device such as a micro LED, the size of the probe pin 21 is inevitably provided to be small corresponding to the size of the light emitting device. The status of the probe pin 21 can be easily checked through the inspection camera unit 60, thereby preventing measurement errors due to damage to the probe pin 21, and the reliability of the inspection device 1 is increased. It can be improved.

Figure 2 shows the operation of the first moving part 51 according to the present invention.

Preferably, the table portion T may be provided with a hole through which light generated by the light emitting device can pass. <a> in FIG. 2 shows a state in which the bed portion 50 is disposed at an arbitrary position that does not cover the hole. A probe card 20 or an alignment sensor unit 40 is located around the hole, so that when the bed part 50 is located around the hole, the substrate to be measured is placed on the bed part 50. It may not be easy to seat and secure (W). On the other hand, as shown in <a> in FIG. 2, when the bed portion 50 is positioned away from the position of the hole, it does not interfere with the probe card 20 or the alignment sensor portion 40, so the substrate to be measured (W) can be easily placed.

Preferably, the first moving part 51 may be provided with a rotating part 511 to rotate the bed part 30 about the central axis (shown as a dotted line in FIG. 2).

<b> in FIG. 2 shows a state in which the bed part 50 is moved to a position corresponding to the hole through the operation of the first moving part 51. The arrow shown in <b> of FIG. 2 indicates the movement path of the bed portion 50.

As the bed part 50 is moved to a position corresponding to the hole, the light generated by the light emitting device formed on the substrate W mounted on the bed part 50 passes through the hole to the measuring part ( 10) can be reached.

Additionally, as described above, the inspection camera unit 60 may be provided connected to the first moving unit 51. Accordingly, the inspection camera unit 60 may be moved to the inspection position of the probe pin 21 as needed, or may be moved to deviate from the light path when measuring the light emission characteristics of the light emitting device.

Meanwhile, a pin cleaning unit 70 may be connected to the first moving unit 51 and provided thereon. The pin cleaning unit 70 is configured to remove foreign substances attached to the probe pin 21. In detail, if a foreign substance attaches to the probe pin 21, it can be detected through the inspection camera unit 60. When a foreign substance is detected, the pin cleaning unit 70 moves to a position corresponding to the probe pin 21 through the operation of the first moving unit 51 to clean the probe pin 21. Additionally, cleaning may be performed when the number of times the light emitting characteristic has been tested exceeds a predetermined number of times. Accordingly, it is possible to prevent problems caused by foreign substances that are not detected by the inspection camera unit 60 in advance.

Figure 3 shows the operation of the second moving part 52 according to the present invention. Figure 3 shows the inspection device as viewed from the side, and the measuring unit 10 is omitted.

<a> in FIG. 3 shows a state in which the bed portion 30 is aligned at the position (shown by a dotted line in FIG. 3) when measuring luminescence characteristics. The method of aligning the probe card 20, bed unit 30, and alignment sensor unit 40 will be described in detail later with reference to FIG. 10.

<b> in FIG. 3 shows a state in which the probe card 20 is vertically lowered by the operation of the second moving part 52. The arrows shown in FIG. 3 indicate the movement paths of the probe card 20 and the second moving unit 52, respectively. As shown in <b> of FIG. 3, the second moving part 52 moves downward along the vertical rail part 521 so that the probe pin 21 protruding from the lower surface of the probe card 20 moves into the bed part ( It comes into contact with the upper surface of the substrate (W) disposed on the upper surface of 30). In Figure 3, the probe pin 21 and the substrate W are omitted.

Figure 4 shows the operation of the third moving part 53 according to the present invention. Figure 4 shows the inspection device as viewed from the side, and the measuring unit 10 and the second moving unit 52 are omitted. In addition, FIG. 4 shows the state in which the bed portion 30 is aligned at the position (shown by a dotted line in FIG. 4) when measuring luminescence characteristics.

<b> in FIG. 4 shows a state in which the alignment sensor unit 40 is moved horizontally by the operation of the third moving unit 53. The arrow shown in FIG. 4 indicates the movement path of the alignment sensor unit 40. As shown in <b> of FIG. 4, the third moving part 53 can be moved to the right along the horizontal rail part 531 and aligned at the vertically upper position of the probe card 20. In this way, the horizontal position of the alignment sensor unit 40 can be adjusted by the third moving part 53, so that the alignment between the alignment sensor unit 40 and the probe card 20 can be adjusted, and the probe card 20 When replacing, it may not be disturbed by interference from the alignment sensor unit 40.

Meanwhile, as a preferred embodiment of the present invention, the inspection device 1 may include a first height sensor 41 and a second height sensor 42.

Figure 5 shows the first height sensor 41 and the second height sensor 42 according to an embodiment of the present invention.

The first height sensor 41 is configured to measure the height difference (hereinafter referred to as first height, h1) between the upper surface of the substrate W and the first height sensor 41. In detail, the first height sensor 41 is disposed in the upper direction of the bed part 30 and is fixed to the table part T. The first height sensor 41 measures the height to the top surface of the substrate W disposed on the top surface of the bed portion 30 by generating radio waves or light rays in a downward direction. Preferably, the first height sensor 41 may be a laser sensor.

The second height sensor 42 is configured to measure the height difference (hereinafter referred to as second height, h2) between the bottom of the probe pin 21 and the second height sensor 42. In detail, the second height sensor 42 is disposed above the probe card 20 and is fixed to the third moving part 53. Accordingly, the second height sensor 42 can be moved along the horizontal movement of the third moving part 53. When the probe card 20 and the bed unit 30 are vertically aligned through the alignment sensor unit 40, the second height sensor 42 is operated by the third moving unit 53. ) can be aligned on the upper side of the probe card 20.

Since the alignment sensor unit 40 and the second height sensor 42 are fixed together on the third moving part 53, the distance d between the second alignment sensor unit 40 and the second height sensor 42 is After pre-measurement, the third moving part 53 is moved by the distance d, so that the second height sensor 42 can be easily aligned on the upper side of the probe card 20.

The second height sensor 42 measures the height to the bottom of the probe pin 21 formed on the lower surface of the probe card 20 by generating radio waves or light rays in the downward direction. In Figure 5, the probe pin 21 is omitted because its size is small compared to the size of the probe card 20. Preferably, the second height sensor 42 may be a laser sensor.

Since the first height sensor 41 is fixed to the table part (T) and the second height sensor 42 moves only horizontally, the height difference between the first height sensor 41 and the second height sensor 42 (hereinafter, third height, h3) is predetermined.

Therefore, the distance (h4) to which the probe card 20 must be moved to measure the luminescence characteristics can be calculated using the measured values of the first height (h1) and the second height (h2) and the third height (h3). there is. The distance (h4) to which the probe card 20 must be moved is calculated using Equation 1 below.

[Equation 1]

Figure 6 is a cross-sectional view showing a case where there is bowing in the substrate.

As shown in FIG. 6, when the substrate W is not flat, such as with bowing, if the probe pin 21 is moved downward at the same distance, the probe pin (21) is moved at some positions on the substrate W. 21) may not be in contact with the terminal of the light emitting device, or excessive pressure may be generated between the probe pin 21 and the terminal of the light emitting device at other locations on the substrate W.

However, according to the present invention, the first height (h1, h1`, h1``) at each measurement position (P1, P2, P3) of the substrate W is measured, and the first height (h1, h1`, h1``) is measured at each measurement position (P1, P2, When the probe pin 21 moves downward at P3), it can be controlled to move an appropriate distance.

Figure 7 is a flowchart showing a method of measuring the emission characteristics of a light-emitting device according to an embodiment of the present invention.

1) First, the substrate W is placed on the bed 30 (S1).

2) Afterwards, the first moving unit 51 horizontally moves and rotates the bed unit 30 to position it below the alignment sensor unit 40, and the alignment sensor unit 40 is pre-printed on the substrate W. The alignment is measured by detecting an alignment mark, and the substrate W is aligned through a fine operation of the first moving part 51 (S2).

3) The first moving part 51 moves by the unit measurement width and measures the flatness of the substrate W through the first height sensor 41 (S3). Here, the 'unit measurement width' is the distance between the terminal groups of the light-emitting device that the probe pin 21 touches at one time when measuring the light-emitting characteristics of the light-emitting device. It consists of a combination of distance values in two directions (x, y) based on the horizontal.

4) The second height sensor 42 is placed on the upper side of the probe card 20 through the operation of the third moving part 53 (S4).

5) The second height sensor 42 measures the height of the probe pin 21, that is, the second height h2 described above (S5).

6) Through the operation of the first moving part 51, the bed part 30 and the substrate (W) are positioned on the lower side of the probe card 20, and through the operation of the third moving part 53, the alignment sensor part ( 40) is placed on the upper side of the probe card 20 (S6).

7) The alignment sensor unit 40 detects the alignment display unit of the probe card 20 and the alignment mark printed on the substrate W to measure the alignment state, and the first moving unit 51 and the third moving unit 53 The substrate (W) and the alignment sensor unit 40 are aligned to the vertical lower and upper positions of the probe card 20, respectively, through fine operation (S7).

8) Based on the flatness measured previously (S3), the probe pin 21 is moved to contact the terminal of the light-emitting device, and the measuring unit 10 measures the light-emitting characteristics of the light-emitting device (S8).

Figure 8 is a perspective view showing the probe card 20 according to an embodiment of the present invention. In Figure 8, the probe card 20 is shown upside down (up, down).

According to the present invention, the probe card 20 includes a body portion 22, a probe substrate 23, and an alignment display portion 24.

The probe board 23 is configured to fix the probe pin 21. In detail, the probe pin 21 is formed to protrude from one side of the probe substrate 23, and power can be applied to the probe pin 21 through a circuit electrode formed on the probe substrate 23.

Preferably, the probe substrate 23 may be made of a transparent material. Accordingly, the light emitted by the light emitting device can pass through the probe substrate 23 and reach the measuring unit 10. Additionally, the circuit electrode may be made of a transparent electrode material. For example, the circuit electrode may be made of indium tin oxide (ITO).

The body portion 22 is configured to fix the probe substrate 23. The probe substrate 23 is coupled to the body 22 and the body 22 is fixed to the inspection device, thereby fixing the position of the probe pin 21 and stably contacting the electrode of the light emitting device. It can be.

The alignment display unit 24 is a means for measuring the alignment state between the probe card 20, the measurement unit 10, and the substrate (W). In detail, at least one alignment display unit 24 may be provided at a predetermined position on the surface of the probe substrate 23 and may be provided in the form of a transparent window penetrating both sides of the probe substrate 23. In FIG. 8, four alignment display units 24 are formed, and each alignment display unit 24 is shown as a cross-shaped transparent window.

Figure 9 shows the cross-sectional structure of the probe substrate 23 according to an embodiment of the present invention. In Figure 4, the probe substrate 23 is shown upside down.

Preferably, the probe substrate 23 is made of a transparent material such as sapphire, one side is coated with a transparent synthetic resin layer 222, and the circuit electrode 223 is embedded inside the transparent synthetic resin layer 222. It can be provided in the form The transparent synthetic resin layer 222 is made of a material having a certain elasticity. Accordingly, the transparent synthetic resin layer 222 can distribute the load applied to the circuit electrode 223. In detail, when the probe pin 21 contacts the electrode of the light emitting device, an impact may occur, and excessive load may be applied to the probe pin 21 and the electrode of the light emitting device. At this time, the elastic action of the transparent synthetic resin layer 222 can absorb shock and distribute the load applied to the probe pin 21. In addition, even when there is a height difference between the electrodes of the light emitting device, the probe pin 21 can fluidly contact the electrode of the light emitting device due to the elastic action of the transparent synthetic resin layer 222, which has the effect of preventing measurement errors. .

Figure 10 is a cross-sectional view showing a method of aligning an inspection device according to an embodiment of the present invention.

The alignment sensor unit 40 includes a camera. Accordingly, the alignment sensor unit 40 can detect the alignment display unit 24. In addition, since the alignment display unit 24 is provided in the form of a transparent window, the alignment sensor unit 40 can detect the upper surface of the substrate W located on the lower side of the probe card 20 through the alignment display unit 24. there is. Accordingly, the alignment sensor unit 40 can detect the alignment state between the alignment sensor unit 40, the probe card 20, and the substrate (W). After checking the alignment state through the alignment sensor unit 40, the substrate (W), probe pin 21, and alignment sensor unit 40 are connected through the above-described first moving part 51 and third moving part 53. The alignment state can be adjusted.

In detail, when the alignment between the probe card 20 and the substrate W is not correct, the position of the probe card 20 is adjusted by horizontal movement of the first moving part 51, thereby adjusting the electrode of the light emitting element C. E) can be adjusted to correspond to the vertical position of the probe pin (21).

In addition, when the alignment between the probe card 20 and the alignment sensor unit 40 is misaligned, the alignment sensor unit 40 is adjusted by adjusting the position of the alignment sensor unit 40 through horizontal and vertical movement of the third moving unit 53. (40) can be adjusted so that it is located at the exact position vertically above the probe card (20).

Conventionally, in order to measure the emission characteristics of a light emitting device, luminance, color coordinates, and light quantity were measured at one point. This means that a single measurement is performed for a single light-emitting device, and if the light-emitting characteristics must be measured for multiple light-emitting devices, the measurement time becomes proportionally longer.

Therefore, there is a problem that the manufacturing time is prolonged in the manufacturing process of products using a large number of light-emitting devices, such as when light-emitting devices are used as pixel units of a display.

The inspection device according to the present invention is characterized in that it performs measurement on a per-surface basis, rather than on a single point as in the prior art.

Figure 11 is a cross-sectional view showing the measuring unit 10 according to an embodiment of the present invention.

According to the present invention, the measuring unit 10 includes a lens unit 12, a band-pass filter (13), a splitter (14), a camera (15), and a photometer (18). may include.

The lens unit 12 is configured to adjust the inspection area of the light emitting device. In detail, the lens unit 12 is disposed at a position where light generated by the light emitting device is first received. The inspection area can be adjusted by adjusting the degree to which the lens unit 12 refracts light.

The band-pass filter 13 is configured to pass only a specific wavelength range of the light generated by the light-emitting device. In detail, the band pass filter 13 is disposed on the optical path next to the lens unit 12 of the light received by the measuring unit 10, and is located in a preset wavelength band (hereinafter referred to as 'target') according to the design of the device to be manufactured. Only light in the ‘wavelength band’ passes through.

The splitter 14 is configured to divide the light received by the measuring unit 10 into two branches. In detail, the splitter 14 is disposed on the optical path next to the band pass filter 13 and splits light in the first direction d1 and the second direction d2. Accordingly, light traveling in the first direction d1 can be received by the camera 15, and light traveling in the second direction d2 can be received by the photometer 18.

The camera 15 is configured to measure the intensity distribution of light. In detail, the camera 15 is disposed in the optical path in the first direction d1 and measures the intensity distribution of the received light. That is, by identifying the distribution of light emission intensity between a plurality of light emitting devices, the presence and location of a defective device can be determined. In addition, as described above, it can serve to check the alignment state of the measurement unit 10 before measurement.

The photometer 18 is configured to inspect the overall characteristics of light. In detail, the photometer 18 is disposed in the optical path in the second direction (d2) and measures optical properties including ray flux and color coordinates of the received light. Preferably, the light received by the photometer 18 is transmitted through the pinhole 16 and the optical fiber 17, and the light transmitted through the integrating sphere (not shown) is collected to determine the optical characteristics of the optical sensor (not shown). can be measured.

In this way, the measuring unit 10 according to the present invention performs measurement by splitting light in two directions of the camera 15 and the photometer 18, thereby measuring the intensity distribution of a plurality of light emitting devices at the same time as inspecting optical properties. You can.

In addition, by only inspecting the target wavelength band through the band-pass filter 13, it is possible to immediately determine whether each light-emitting device is defective without the need for spectrum analysis. Accordingly, measurement can be completed by performing only one lighting inspection on a plurality of light emitting device chips in the inspection area, and the manufacturing time of the product can be significantly shortened.

Figure 12 shows a graph of measurement results according to an embodiment of the present invention. In detail, <a> in FIG. 12 shows the measurement direction for one row of measurement pixels, and <b> in FIG. 12 is a graph showing measurement results for the one row.

Figure 12 shows an example of measurement for one row of measurement pixels, and it will be easy for those skilled in the art to perform the same measurement on all pixels in the inspection area.

The preferred embodiments of the present invention described above have been disclosed for illustrative purposes, and those skilled in the art will be able to make various modifications, changes, and additions within the spirit and scope of the present invention, and such modifications, changes, and additions will be possible. should be regarded as falling within the scope of the above patent claims.

Those of ordinary skill in the technical field to which the present invention pertains can make various substitutions, modifications and changes without departing from the technical spirit of the present invention. Therefore, the present invention is limited to the above-described embodiments and the accompanying drawings. It is not limited by

1: Inspection device
10: Measuring part 20: Probe card
30: Bed part 40: Alignment sensor part
51, 52, 53: moving part 60: inspection camera part
70: Pin Cleaner
W: Substrate C: Light emitting device

Claims (7)

Receives light generated by a light emitting element within an inspection area of a predetermined size,
Dividing the received light into a first direction and a second direction,
Measure the light emission intensity distribution within the inspection area for light traveling in the first direction,
A luminescence characteristics inspection device comprising a measuring unit that measures optical characteristics including a ray flux and color coordinates for light traveling in the second direction.
According to claim 1,
The measuring unit,
A band-pass filter that passes light in a target wavelength band among the received light,
The measuring unit,
A luminescence characteristics inspection device characterized in that the luminescence intensity distribution and the optical properties are measured for light in the target wavelength band.
According to clause 2,
a splitter located in an optical path next to the band pass filter and splitting the received light into the first direction and the second direction;
a camera that measures light emission intensity distribution within the inspection area for light traveling in the first direction;
A photometer that measures optical characteristics including a ray flux and color coordinates for light traveling in the second direction.
According to claim 1,
It is positioned spaced apart from the substrate on which the light-emitting device is formed in the direction in which the terminal of the light-emitting device is formed,
A probe card that contacts a terminal of the light emitting device to form an electrical connection with the light emitting device.
According to clause 4,
The probe card is,
It includes a probe pin formed to protrude from the surface in the direction facing the light emitting device,
A light emitting characteristic inspection device, wherein the probe pin contacts a terminal of the light emitting device to form an electrical connection with the light emitting device.
According to clause 5,
The probe card is,
An alignment indicator formed in the form of a transparent window penetrating both sides of the probe card at a predetermined position on the surface of the probe card,
An alignment sensor unit that detects an alignment state of the probe card and the substrate by detecting the probe card and the substrate on which the light emitting device is disposed through the alignment display unit.
According to clause 5,
The probe card is,
Probe board made of transparent material,
A transparent synthetic resin layer coated on one side of the probe substrate and made of a material having a predetermined elasticity;
A circuit electrode embedded in the transparent synthetic resin layer and connected to the probe pin.

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