KR20240061521A - Display including structure for reducing damage and electronic device including same - Google Patents

Abstract

A display according to an embodiment includes a first area, a second area, a deformation area, a plurality of first subpixels arranged in the first area, a plurality of second subpixels arranged in the second area, and a pixel layer including a plurality of third sub-pixels disposed in the deformation region, and a plurality of TFTs disposed below the pixel layer, wherein the plurality of TFTs are disposed inside the first region, A plurality of first TFTs for driving the plurality of first subpixels, a plurality of second TFTs disposed inside the second area and driving the plurality of second subpixels, and the deformation area and includes a plurality of third TFTs for driving at least a portion of the plurality of third subpixels.

Description

Display including structure for reducing damage and electronic device including same {DISPLAY INCLUDING STRUCTURE FOR REDUCING DAMAGE AND ELECTRONIC DEVICE INCLUDING SAME}

The present disclosure relates to a display including a structure for reducing breakage and an electronic device including the same.

In order for users to be provided with various contents through electronic devices, the need for electronic devices that can change the size of the display for displaying content is increasing. For example, an electronic device may include a foldable flexible display, thereby providing a structure in which the size of the display for displaying content can be changed.

The above information may be provided as background art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing can be applied as prior art to the present disclosure.

A display according to an embodiment may include a first area. According to one embodiment, the display may include a second area that can be moved relative to the first area. According to one embodiment, the display may include a deformation area that is disposed between the first area and the second area and is changeable by movement of the second area with respect to the first area. According to one embodiment, the display includes a plurality of first subpixels arranged in the first area, a plurality of second subpixels arranged in the second area, and a plurality of third subpixels arranged in the deformation area. It may include a pixel layer including subpixels. According to one embodiment, the display may include a plurality of TFTs disposed below the pixel layer. According to one embodiment, the plurality of TFTs may be disposed inside the first area and may include a plurality of first TFTs for driving the plurality of first subpixels. According to one embodiment, the plurality of TFTs may be disposed inside the second area and may include a plurality of second TFTs for driving the plurality of second subpixels. According to one embodiment, the plurality of TFTs may be disposed outside the deformation area and may include a plurality of third TFTs for driving at least a portion of the plurality of third subpixels.

An electronic device according to an embodiment may include a first housing. According to one embodiment, the electronic device may include a second housing coupled to the first housing so as to be rotatable with respect to the first housing. According to one embodiment, the electronic device includes a first area, a second area spaced apart from the first area, a connection between the first area and the second area, and a second housing relative to the first housing. It may include a display including a deformable area that can be deformed by movement. According to one embodiment, the display includes a plurality of first subpixels arranged in the first area, a plurality of second subpixels arranged in the second area, and a plurality of second subpixels arranged in the deformation area. It may include a pixel layer including 3 subpixels. According to one embodiment, the display may include a plurality of TFTs disposed below the pixel layer. According to one embodiment, the plurality of TFTs may be disposed inside the first area and may include a plurality of first TFTs for driving the plurality of first subpixels. According to one embodiment, the plurality of TFTs may be disposed inside the second area and may include a plurality of second TFTs for driving the plurality of second subpixels. According to one embodiment, the plurality of TFTs may be disposed outside the deformation area and may include a plurality of third TFTs for driving at least a portion of the plurality of third subpixels.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
Figure 2 is a block diagram of a display module according to various embodiments.
3A shows an example of an unfolded state of an exemplary electronic device, according to one embodiment.
3B shows an example of a folded state of an exemplary electronic device, according to one embodiment.
3C is an exploded view of an example electronic device, according to one embodiment.
FIG. 4A is a top plan view of an unfolded state of an exemplary electronic device according to an embodiment.
FIG. 4B is a graph showing the relationship between stress and distance from the folding axis within an example display according to one embodiment.
FIG. 5A is a cross-sectional view illustrating an example of a display of an exemplary electronic device cut along line A-A' of FIG. 4A according to an embodiment.
FIG. 5B is a cross-sectional view illustrating an example of a display of an exemplary electronic device cut along line B-B' of FIG. 4A according to an embodiment.
FIG. 6 is a cross-sectional view illustrating an example of a display of an exemplary electronic device cut along line C-C' of FIG. 4A according to an embodiment.
FIG. 7 is a cross-sectional view illustrating an example of a display of an exemplary electronic device according to an embodiment.
FIG. 8 is a cross-sectional view illustrating an example of a display of an exemplary electronic device according to an embodiment.
9 is a top plan view of an example electronic device in an unfolded state, according to one embodiment.
10 is a top plan view of an example electronic device in an unfolded state, according to one embodiment.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band), for example, to achieve a high data rate. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Figure 2 is a block diagram 200 of the display module 160, according to various embodiments.

Referring to FIG. 2, the display module 160 may include a display 210 and a display driver IC (DDI) 230 for controlling the display 210. The DDI 230 may include an interface module 231, a memory 233 (eg, buffer memory), an image processing module 235, or a mapping module 237. For example, the DDI 230 receives image information including image data or an image control signal corresponding to a command for controlling the image data from other components of the electronic device 101 through the interface module 231. can do. For example, according to one embodiment, the image information is stored in the processor 120 (e.g., the main processor 121 (e.g., an application processor) or the auxiliary processor 123 (e.g., the main processor 121) that operates independently of the functions of the main processor 121. For example, the DDI 230 may communicate with the touch circuit 250 or the sensor module 176 through the interface module 231. The image processing module 235 may store at least a portion of the received image information in the memory 233, for example, in units of frames. The mapping module 237 may perform pre-processing or post-processing (eg, resolution, brightness, or size adjustment) based at least on the characteristics of the display 210. According to one embodiment, a voltage value or a current value corresponding to the image data may be generated, for example, through properties of pixels of the display 210 (e.g., an arrangement of pixels). At least some pixels of the display 210 may be based at least in part on the RGB stripe or pentile structure (or the size of each subpixel), for example, at least in part based on the voltage value or the current value. By driving, visual information (eg, text, image, or icon) corresponding to the image data may be displayed through the display 210.

According to one embodiment, the display module 160 may further include a touch circuit 250. The touch circuit 250 may include a touch sensor 251 and a touch sensor IC 253 for controlling the touch sensor 251. For example, the touch sensor IC 253 may control the touch sensor 251 to detect a touch input or a hovering input for a specific position of the display 210. For example, the touch sensor IC 253 may detect a touch input or a hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or charge amount) for a specific position of the display 210. The touch sensor IC 253 may provide information (e.g., location, area, pressure, or time) about the detected touch input or hovering input to the processor 120. According to one embodiment, at least a portion of the touch circuit 250 (e.g., touch sensor IC 253) is disposed outside the display driver IC 230, a part of the display 210, or the display module 160. It may be included as part of other components (e.g., auxiliary processor 123).

According to one embodiment, the display module 160 may further include at least one sensor (eg, a fingerprint sensor, an iris sensor, a pressure sensor, or an illumination sensor) of the sensor module 176, or a control circuit therefor. In this case, the at least one sensor or a control circuit therefor may be embedded in a part of the display module 160 (eg, the display 210 or the DDI 230) or a part of the touch circuit 250. For example, when the sensor module 176 embedded in the display module 160 includes a biometric sensor (e.g., a fingerprint sensor), the biometric sensor records biometric information associated with a touch input through a portion of the display 210. (e.g. fingerprint image) can be obtained. For another example, when the sensor module 176 embedded in the display module 160 includes a pressure sensor, the pressure sensor may acquire pressure information associated with a touch input through part or the entire area of the display 210. You can. According to one embodiment, the touch sensor 251 or the sensor module 176 may be disposed between pixels of a pixel layer of the display 210, or above or below the pixel layer.

FIG. 3A shows an example of an unfolded state of an electronic device, according to an embodiment, FIG. 3B shows an example of a folded state of an electronic device, according to an embodiment, and FIG. 3C shows an example of an unfolded state of an electronic device, according to an embodiment. According to , this is an exploded view of an electronic device.

3A, 3B, and 3C, the electronic device 300 (e.g., the electronic device 101 of FIG. 1) includes a first housing 310, a second housing 320, and a display 330. (e.g., display 210 of FIG. 2), at least one camera 340 (e.g., camera module 180 of FIG. 1), hinge structure 350, and/or at least one electronic component 360. It can be included.

The first housing 310 and the second housing 320 may form at least a portion of the outer surface of the electronic device 300 that can be gripped by a user. At least a portion of the outer surface of the electronic device 300 defined by the first housing 310 and the second housing 320 may be exposed to a portion of the user's body when the electronic device 300 is used by the user. You can access it. According to one embodiment, the first housing 310 includes a first side 311, a second side 312 facing the first side 311 and spaced apart from the first side 311, and a first side 311. It may include a first side 313 surrounding at least a portion of 311 and the second side 312 . The first side 313 may connect the periphery of the first side 311 and the edge of the second side 312. The first side 311, the second side 312, and the first side 313 may define the internal space of the first housing 310. According to one embodiment, the first housing 310 uses the space formed by the first side 311, the second side 312, and the first side 313 to store the components of the electronic device 300. It can be provided as a space for placement.

According to one embodiment, the second housing 320 has a third side 321, a fourth side 322 facing the third side 321 and spaced apart from the third side 321, and a third side 322. It may include a second side 323 surrounding at least a portion of 321 and the fourth side 322 . The second side 323 may connect the periphery of the third side 321 and the edge of the fourth side 322. The third side 321, the fourth side 322, and the second side 323 may define the internal space of the second housing 320. According to one embodiment, the second housing 320 has a third side 321, a fourth side 322, and a second side surrounding at least a portion of the third side 321 and the fourth side 322. The space formed by 323 can be provided as a space for mounting the components of the electronic device 101. According to one embodiment, the second housing 320 may be coupled to the first housing 310 so as to be rotatable with respect to the first housing 310 .

According to one embodiment, each of the first housing 310 and the second housing 320 may include a first protection member 314 and a second protection member 324, respectively. The first protection member 314 and the second protection member 324 may be disposed on the first side 311 and the third side 321 along the periphery of the display 330. According to one embodiment, the first protective member 314 and the second protective member 324 are configured to prevent foreign substances ( It can prevent the inflow of dust or moisture). For example, the first protection member 314 surrounds the edge of the first display area 331 of the display 330, and the second protection member 324 surrounds the edge of the second display area 332 of the display 330. ) can surround the edges. The first protection member 314 may be attached to the first side 313 of the first housing 310, or may be formed integrally with the first side 313. The second protection member 324 may be attached to the second side 323 of the second housing 320, or may be formed integrally with the second side 323.

According to one embodiment, the first side 313 and the second side 323 may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side 323 may include at least one conductive member 325 and at least one non-conductive member 326. At least one conductive member 325 may include a plurality of conductive members spaced apart from each other. At least one non-conductive member 326 may be disposed between the plurality of conductive members. The plurality of conductive members may be disconnected from each other by at least one non-conductive member 326 disposed between the plurality of conductive members. According to one embodiment, the plurality of conductive members and the plurality of non-conductive members may together form an antenna radiator. The electronic device 300 may be capable of communicating with an external electronic device through an antenna radiator formed by a plurality of conductive members and a plurality of non-conductive members.

The display 330 may be configured to display visual information. According to one embodiment, the display 330 is connected to the first side 311 of the first housing 310 and the third side 321 of the second housing 320 across the hinge structure 350. It can be placed on top. For example, the display 330 includes a first display area 331 disposed on the first side 311 of the first housing, and a second display area disposed on the third side 321 of the second housing. 332 , and a third display area 333 disposed between the first display area 331 and the second display area 332 . The first display area 331, the second display area 332, and the third display area 333 may form the front surface of the display 330. According to one embodiment, the display 330 may further include a sub-display panel 335 disposed on the fourth surface 322 of the second housing 320. For example, the display 330 may be referred to as a flexible display. According to one embodiment, the display 330 may include a window exposed to the outside of the electronic device 300. The window protects the surface of the display 330 and includes a substantially transparent material, so that visual information provided by the display 330 can be transmitted to the outside of the electronic device 300. For example, the window may include, but is not limited to, glass (eg, UTG, ultra-thin glass) and/or polymer (eg, PI, polyimide).

At least one camera 340 may be configured to acquire an image based on receiving light from a subject external to the electronic device 300. According to one embodiment, at least one camera 340 may include first cameras 341, second cameras 342, and third cameras 343. The first cameras 341 may be disposed in the first housing 310 . For example, the first cameras 341 may be disposed inside the first housing 310, and at least a portion may be visible through the second surface 312 of the first housing 310. . The first cameras 341 may be supported by a bracket (not shown) within the first housing 310. The first housing 310 may include at least one opening 341a that overlaps the first cameras 341 when the second surface 312 is viewed from above. The first cameras 341 may acquire images based on receiving light from the outside of the electronic device 300 through at least one opening 341a.

According to one embodiment, the second camera 342 may be placed in the second housing 320. For example, the second camera 342 may be placed inside the second housing 320 and visible through the sub-display panel 335. The second housing 320 may include at least one opening 342a that overlaps the second camera 342 when the fourth surface 322 is viewed from above. The second camera 342 may acquire an image based on receiving light from the outside of the electronic device 300 through at least one opening 342a.

According to one embodiment, the third camera 343 may be placed in the first housing 310. For example, the third camera 343 may be disposed inside the first housing 310, and at least a portion of the third camera 343 may be visible through the first surface 311 of the first housing 310. For another example, the third camera 343 may be disposed inside the first housing 310, and at least a portion of the third camera 343 may be visible through the first display area 331 of the display 330. The first display area 331 of the display 330 may include at least one opening (not shown) that overlaps the third camera 343 when the display 330 is viewed from above. The third camera 343 may acquire an image based on receiving light from the outside of the display 330 through at least one opening.

According to one embodiment, the second camera 342 and the third camera 343 are directed below the display 330 (e.g., toward the inside of the first housing 310 or toward the inside of the second housing 320). ) can be placed in. For example, the second camera 342 and the third camera 343 may be under display cameras (UDC). When the second camera 342 and the third camera 343 are under-display cameras, an area of the display 330 corresponding to each position of the second camera 342 and the third camera 343 is an inactive area. This may not be the case. For example, when the second camera 342 and the third camera 343 are under-display cameras, an area of the display 330 corresponding to the respective positions of the second camera 342 and the third camera 343 may have a lower pixel density than the pixel density of other areas of the display 330. The inactive area of the display 330 may refer to an area of the display 330 that does not contain pixels or does not emit light to the outside of the electronic device 300. For another example, the second camera 342 and the third camera 343 may be punch hole cameras. When the second camera 342 and the third camera 343 are punch hole cameras, an area of the display 330 corresponding to each position of the second camera 342 and the third camera 343 is an inactive area. It can be. For example, when the second camera 342 and the third camera 343 are punch hole cameras, an area of the display 330 corresponding to the respective positions of the second camera 342 and the third camera 343 may include an aperture that does not contain pixels.

According to one embodiment, the hinge structure 350 may rotatably connect the first housing 310 and the second housing 320. The hinge structure 350 may be disposed between the first housing 310 and the second housing 320 of the electronic device 101 so that the electronic device 300 can be bent, bent, or folded. For example, the hinge structure 350 may be disposed between a portion of the first side 313 and a portion of the second side 323 that face each other. The hinge structure 350 unfolds the electronic device 300 such that the first side 311 of the first housing 310 and the third side 321 of the second housing 320 face substantially the same direction. It may be changed to an unfolding state or a folding state where the first side 311 and the third side 321 face each other. When the electronic device 300 is in a folded state, the first housing 310 and the second housing 320 may overlap or overlap each other by facing each other.

According to one embodiment, when the electronic device 300 is in a folded state, the direction in which the first side 311 faces and the direction in which the third side 321 faces may be different. For example, when the electronic device 300 is in a folded state, the direction in which the first side 311 faces and the direction in which the third side 321 faces may be opposite to each other. For another example, when the electronic device 300 is in a folded state, the direction in which the first side 311 faces and the direction in which the third side 321 faces may be tilted with respect to each other. When the direction in which the first surface 311 faces is inclined with respect to the direction in which the third surface 321 faces, the first housing 310 may be inclined with respect to the second housing 320 .

According to one embodiment, the electronic device 300 may be foldable based on the folding axis f. The folding axis f may refer to an imaginary line extending through the hinge cover 351 in a direction substantially parallel to the longitudinal direction of the electronic device 300 (e.g., d1 in FIGS. 3A and 3B). , but is not limited to this. For example, the folding axis f may be an imaginary line extending in a direction substantially perpendicular to the longitudinal direction of the electronic device 300 (eg, d2 in FIGS. 3A and 3B). When the folding axis f extends in a direction substantially perpendicular to the longitudinal direction of the electronic device 300, the hinge structure 350 extends in a direction parallel to the folding axis f to be connected to the first housing 310 and the second housing 310. 2 Housing 320 can be connected. The first housing 310 and the second housing 320 may be rotatable by a hinge structure 350 extending in a direction substantially perpendicular to the longitudinal direction of the electronic device 300.

According to one embodiment, the hinge structure 350 may include a hinge cover 351, a first hinge plate 352, a second hinge plate 353, and a hinge module 354. The hinge cover 351 may surround the internal components of the hinge structure 350 and form the outer surface of the hinge structure 350. According to one embodiment, the hinge cover 351 surrounding the hinge structure 350 is connected to the electronic device through between the first housing 310 and the second housing 320 when the electronic device 300 is in a folded state. At least a portion may be exposed to the outside of 300. According to one embodiment, when the electronic device 300 is in an unfolded state, the hinge cover 351 is covered by the first housing 310 and the second housing 320 and is exposed to the outside of the electronic device 300. It may not be exposed.

According to one embodiment, the first hinge plate 352 and the second hinge plate 353 are coupled to the first housing 310 and the second housing 320, respectively, so that the first housing 310 and the second housing 320 The housing 320 can be rotatably connected. For example, the first hinge plate 352 is coupled to the first front bracket 315 of the first housing 310, and the second hinge plate 353 is coupled to the second front bracket 315 of the second housing 320. It can be combined with the bracket 327. As the first hinge plate 352 and the second hinge plate 353 are coupled to the first front bracket 315 and the second front bracket 327, respectively, the first housing 310 and the second housing 320 may be rotatable according to the rotation of the first hinge plate 352 and the second hinge plate 353.

The hinge module 354 can rotate the first hinge plate 352 and the second hinge plate 353. For example, the hinge module 354 includes gears that engage with each other and can rotate, and can rotate the first hinge plate 352 and the second hinge plate 353 about the folding axis f. According to one embodiment, there may be multiple hinge modules 354. For example, the plurality of hinge modules 354 may be arranged to be spaced apart from each other at both ends of the first hinge plate 352 and the second hinge plate 353, respectively.

According to one embodiment, the first housing 310 includes a first front bracket 315 and a first rear bracket 316, and the second housing 320 includes a second front bracket 327, and It may include a second rear bracket 328. The first front bracket 315 and the first rear bracket 316 may support components of the electronic device 300. The first front bracket 315 may be combined with the first rear bracket 316 to define the first housing 310. The first rear bracket 316 may define a portion of the outer surface of the first housing 310. The second front bracket 327 and the second rear bracket 328 may support components of the electronic device 300. The second front bracket 327 may be combined with the second rear bracket 328 to define the second housing 320. The second rear bracket 328 may define a portion of the outer surface of the second housing 320. For example, the display 330 may be disposed on one side of the first front bracket 315 and one side of the second front bracket 327. The first rear bracket 316 may be disposed on the other side of the first front bracket 315, which is opposite to one side of the first front bracket 315. The second rear bracket 328 may be disposed on the other side of the second front bracket 327, which is opposite to one side of the second front bracket 327. The sub-display panel 335 may be disposed between the second front bracket 327 and the second rear bracket 328.

According to one embodiment, a portion of the first front bracket 315 may be surrounded by the first side 313, and a portion of the second front bracket 327 may be surrounded by the second side 323. . For example, the first front bracket 315 may be formed integrally with the first side 313, and the second front bracket 327 may be formed integrally with the second side 323. For another example, the first front bracket 315 may be formed separately from the first side 313, and the second front bracket 327 may be formed separately from the second side 323.

At least one electronic component 360 may implement various functions to provide to the user. According to one embodiment, the at least one electronic component 360 includes a first printed circuit board 361, a second printed circuit board 362, a flexible printed circuit board 363, and a battery 364 (e.g., FIG. 1 battery 189), and/or an antenna 365 (e.g., the antenna module 197 of FIG. 1). The first printed circuit board 361 and the second printed circuit board 362 may form electrical connections between components within the electronic device 300, respectively. For example, components for implementing the overall function of the electronic device 300 (e.g., processor 120 of FIG. 1) are disposed on the first printed circuit board 361, and the second printed circuit board 362 ), electronic components to implement some functions of the first printed circuit board 361 may be disposed. For another example, components for operating the sub-display panel 335 disposed on the fourth surface 322 may be disposed on the second printed circuit board 362 .

According to one embodiment, the first printed circuit board 361 may be disposed within the first housing 310. For example, the first printed circuit board 361 may be disposed on one side of the first front bracket 315. According to one embodiment, the second printed circuit board 362 may be disposed within the second housing 320. For example, the second printed circuit board 362 is spaced apart from the first printed circuit board 361 and may be disposed on one side of the second front bracket 327. The flexible printed circuit board 363 is , the first printed circuit board 361, and the second printed circuit board 362 can be connected. For example, the flexible printed circuit board 363 may extend from the first printed circuit board 361 to the second printed circuit board 362.

The battery 364 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. there is. At least a portion of the battery 364 may be disposed on substantially the same plane as the first printed circuit board 361 or the second printed circuit board 362.

The antenna 365 may be configured to receive power or signals from outside the electronic device 300. According to one embodiment, the antenna 365 may be disposed between the first rear bracket 316 and the battery 364. The antenna 365 may include, for example, a near field communication (NFC) antenna, an antenna module, and/or a magnetic secure transmission (MST) antenna. For example, the antenna 365 can perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.

FIG. 4A is a top plan view of an exemplary electronic device in an unfolded state, according to an embodiment, and FIG. 4B illustrates stresses within an exemplary display and distance from the folding axis, according to an embodiment. It is a graph showing the relationship between and.

4A and 4B, the electronic device 300 according to one embodiment includes a first housing 310, a second housing 320, a hinge structure 350, and/or a display 400 ( Example: display 210 of FIG. 2, display 330 of FIGS. 3A, 3B, and 3C).

According to one embodiment, the first housing 310 and the second housing 320 may be rotatably coupled to each other through a hinge structure 350. For example, in the folded state of the electronic device 300, the first side 311 and the third side 321 of the first housing 310 may face each other. For example, in the unfolded state of the electronic device 300, the direction in which the first side 311 of the first housing 310 faces (e.g., +z direction) is the third side of the second housing 320. It may be substantially the same as the direction toward which the surface 321 faces (eg, +z direction). As the first housing 310 and the second housing 320 move relative to each other, the display 400 may be folded or unfolded. For example, within the unfolded state of the electronic device 300, the display 400 may be unfolded. For example, in the folded state of the electronic device 300, the display 400 may be folded. According to one embodiment, the display 400 may be folded or unfolded based on the folding axis f by moving the second housing 320 relative to the first housing 310.

According to one embodiment, the display 400 may be configured to provide visual information. The display 400 may include a first area 401, a second area 402, a deformation area 403, and/or a bezel area 404.

At least a portion of the first area 401 may be disposed on the first housing 310 . For example, the first area 401 may be disposed only on the first housing 310. For example, the first region 401 may be disposed on a portion of the first housing 310 and the hinge structure 350 . According to one embodiment, the first area 401 may include a plurality of pixels configured to emit light to provide visual information. A plurality of pixels in the first area 401 may emit light to provide visual information based on receiving a control signal from a display driving circuit (eg, DDI 230 in FIG. 2).

The second area 402 may be spaced apart from the first area 401 . For example, the folding axis f may be disposed between the first area 402 and the second area 402. According to one embodiment, at least a portion of the second area 402 may be disposed on the second housing 320 . For example, the second area 402 may be disposed only on the second housing 320 . For example, second region 402 may be disposed on other portions of second housing 320 and hinge structure 350 . According to one embodiment, the second area 402 may be movable with respect to the first area 401. For example, the second area 402 may move with respect to the first area 401 as the second housing 320 moves with respect to the first housing 310 . According to one embodiment, the second area 402 may include a plurality of pixels configured to emit light to provide visual information. A plurality of pixels in the second area 402 may emit light to provide visual information based on receiving a control signal from the display driving circuit.

The deformation area 403 may be disposed between the first area 401 and the second area 402. For example, the deformation area 403 may connect the first area 401 and the second area 402. For example, the deformation region 403 may extend from the first region 401 to the second region 402. According to one embodiment, the deformable area 403 may be deformable by moving the second area 402 relative to the first area 401. For example, the deformation area 403 may be folded by moving the second area 402 relative to the first area 401 . For example, the deformation region 403 may be unfolded by movement of the second region 402 relative to the first region 401 . For example, the deformation area 403 may have a curvature and be bent by movement of the second area 402 with respect to the first area 401. According to one embodiment, the deformation area 403 may include a plurality of pixels configured to emit light to provide visual information. A plurality of pixels in the deformation area 403 may emit light to provide visual information based on receiving a control signal from the display driving circuit.

The bezel area 404 may refer to an area configured not to provide visual information among areas of the display 400. For example, the bezel area 404 may not include pixels to provide visual information. However, the present invention is not limited thereto, and the bezel area 404 may include at least one pixel that does not emit light. For example, the bezel area 404 may refer to an area that is viewed as substantially black while the display 400 provides visual information. For example, the bezel area 404 includes circuits (e.g., DDI in FIG. 2) for driving a plurality of pixels in the first area 401, the second area 402, and/or the deformation area 403. (230)) and/or may include a signal line. For example, the bezel area 404 may be referred to as dead space of the display 400. According to one embodiment, the bezel area 404 may be connected to the first area 401, the second area 402, and/or the deformation area 403. For example, the bezel area 404 may surround the first area 401, the second area 402, and/or the deformation area 403. For example, the bezel area 404 may surround the first area 401, the second area 402, and/or the deformation area 403. According to one embodiment, the bezel area 404 may define the periphery of the display 400. An edge may be an area that includes a boundary that can distinguish one component from another component among the areas included in one component, and the corresponding expression is practically used hereinafter, unless otherwise stated. It can be used the same way.

According to one embodiment, the deformation area 403 may include a first edge 403a, a second edge 403b, a third edge 403c, and/or a fourth edge 403d. The first edge 403a may be disposed between the first area 401 and the deformation area 403. The first edge 403a may be connected to the first area 401. For example, the first edge 403a may define a boundary between the first area 401 and the deformation area 403. According to one embodiment, the first edge 403a may be substantially parallel to the folding axis f. The second edge 403b may be disposed between the second area 402 and the deformation area 403. The second edge 403b may be connected to the second area 402. For example, the second edge 403b may define a boundary between the second area 402 and the deformation area 403. According to one embodiment, the second edge 403b may be substantially parallel to the folding axis f. For example, the second edge 403b may be substantially parallel to the first edge 403a. The third edge 403c may be disposed between the deformation area 403 and the bezel area 404. The third edge 403c may connect the deformation area 403 and the bezel area 404. For example, the third edge 403c may define a boundary between the deformation area 403 and the bezel area 404. According to one embodiment, the third edge 403c may extend from the first edge 403a to the second edge 403b. For example, the third edge 403c may extend from one end of the first edge 403a to one end of the second edge 403b. According to one embodiment, in the unfolded state of the electronic device 300, the third edge 403c may be substantially perpendicular to the folding axis f1. For example, in the unfolded state of the electronic device 300, the third edge 403c may be substantially perpendicular to the first edge 403a and/or the second edge 403b. The fourth edge 403d may be disposed between the deformation area 403 and the bezel area 404. The fourth edge 403d may connect the deformation area 403 and the bezel area 404. For example, the fourth edge 403d may define a boundary between the deformation area 403 and the bezel area 404. The fourth edge 403d may be spaced apart from the third edge 403c. According to one embodiment, the fourth edge 403d may extend from the first edge 403a to the second edge 403b. For example, the fourth edge 403d may extend from the other end of the first edge 403a to the other end of the second edge 403b. According to one embodiment, in the unfolded state of the electronic device 300, the fourth edge 403d may be substantially perpendicular to the first edge 403a and/or the second edge 403b. For example, in the unfolded state of the electronic device 300, the fourth edge 403d may be substantially parallel to the third edge 403c.

According to one embodiment, the first edge 403a may define a boundary between the first housing 310 and the hinge structure 350. When the first edge 403a defines the boundary between the first housing 310 and the hinge structure 350, the first area 401 is a first display area (e.g., the first display area 331 in FIG. 3A). )) may be substantially the same as. According to one embodiment, when the first edge 403a defines the boundary between the first housing 310 and the hinge structure 350, when the display 400 is folded or unfolded, the first area 401 The shape of may not change. According to one embodiment, the second edge 403b may define a boundary between the second housing 320 and the hinge structure 350. When the second edge 403b defines the boundary between the second housing 320 and the hinge structure 350, the second area 402 is a second display area (e.g., the second display area 332 in FIG. 3A). )) may be substantially the same as. If the second edge 403b defines the boundary between the second housing 320 and the hinge structure 350, the shape of the second region 402 will not change when the display 400 is folded or unfolded. You can. However, it is not limited to this. For example, the first edge 403a and the second edge 403b are each a boundary between the first housing 310 and the hinge structure 350, and a boundary between the second housing 320 and the hinge structure 350. Boundaries may not be defined. A description of other criteria by which the boundary of the deformation area 403 can be distinguished can be explained with reference to FIG. 4B.

The graph of FIG. 4B shows the relationship between the stress applied within the display 400 and the distance from the folding axis f when the display 400 is folded. In the graph of FIG. 4B, the horizontal axis represents the distance from the folding axis f, and the vertical axis represents the magnitude of stress applied within the display 400.

Referring to FIG. 4B, according to one embodiment, the deformation area 403 may be an area of the display 400 where a relatively large amount of stress is applied when the display 400 is in an unfolded state. . The first edge 403a of the deformed area 403, which is the boundary between the first area 401 and the deformed area 403, may be set based on the inflection point (p1) in FIG. 4B. For example, the first edge 403a may be defined at a point p2 spaced apart from the folding axis f by a specified distance from the inflection point p1. For example, the first edge 403a may be defined as a point p2 spaced apart from the inflection point p1 by approximately 4 mm in a direction away from the folding axis f. When the first edge 403a is defined as point p2 in FIG. 4B, when the display 400 is folded or unfolded, a portion of the first area 401 adjacent to the deformable area 403 may be deformable. You can. However, the present invention is not limited thereto, and the position of the first edge 403a may correspond to the inflection point p1 in FIG. 4B.

According to one embodiment, the second edge 403b of the deformation area 403, which is the boundary between the second area 402 and the deformation area 403, is to be set based on the inflection point (p1) in FIG. 4B. You can. For example, the second edge 403b may be defined at a point p2 spaced along a direction away from the folding axis f by a specified distance from the inflection point p1. For example, the second edge 403b may be defined as a point p2 spaced apart from the inflection point p1 by approximately 4 mm along a direction away from the folding axis f. When the second edge 403b is defined as point p2 in FIG. 4B, when the display 400 is folded or unfolded, a portion of the second area 402 adjacent to the deformable area 403 may be deformable. You can. However, the present invention is not limited thereto, and the position of the second edge 403b may correspond to the inflection point p1 in FIG. 4B.

For example, as the display 400 is folded or unfolded, stress may be generated inside the display 400. As folding or unfolding of the display 400 is repeated, stress may be generated in components within the display 400. Below, a structure that can reduce damage due to stress generated within the display 400 will be described in detail.

FIG. 5A is a cross-sectional view illustrating an example of a display of an exemplary electronic device cut along line A-A' of FIG. 4A according to an embodiment, and FIG. 5B is an example according to an embodiment. This is a cross-sectional view showing an example of a display of an electronic device cut along line B-B' of FIG. 4A.

5A and 5B, according to one embodiment, the display 400 includes a pixel layer 410, a substrate 420, a plurality of thin film transistors (TFTs) 430, and an organic insulating layer ( 440), an encapsulation layer 450, a plurality of dummy patterns 460, and/or a conductive line 470.

The pixel layer 410 may include a plurality of subpixels 411, 412, and 413 configured to emit light. Each of the plurality of subpixels 411, 412, and 413 may provide a designated color. For example, each of the plurality of subpixels 411, 412, and 413 may be configured to provide red light, green light, or blue light. A set of multiple subpixels 411, 412, and 413 may define a pixel. For example, the pixel may include, but is not limited to, one subpixel for emitting red light, two subpixels for emitting green light, and/or one subpixel for emitting blue light. According to one embodiment, the pixel layer 410 may be disposed above the plurality of TFTs 430.

According to one embodiment, the pixel layer 410 includes a plurality of first subpixels 411, a plurality of second subpixels 412, a plurality of third subpixels 413, and a pixel defining member ( 414), an organic light emitting layer 415, a first electrode 416, and a second electrode 417. A plurality of first subpixels 411 may be disposed in the first area 401 . For example, a plurality of first subpixels 411 may be included in the first area 401 . A plurality of second subpixels 412 may be disposed in the second area 402 . For example, a plurality of second subpixels 412 may be included in the second area 402. A plurality of third subpixels 413 may be disposed within the deformation area 403. For example, the plurality of third subpixels 413 may be included in the deformation area 403. The plurality of subpixels 411, 412, and 413 may be distinguished by a pixel defining member 414. For example, the pixel defining member 414 may surround each of the plurality of subpixels 411, 412, and 413, thereby distinguishing the plurality of subpixels 411, 412, and 413 from each other. By being separated by the pixel defining member 414, interference of light emitted from the plurality of subpixels 411, 412, and 413 can be reduced. According to one embodiment, the pixel defining member 414 may include an organic material. For example, the proportion of organic materials included in the pixel defining member 414 may be higher than the proportion of inorganic materials included in the pixel defining member 414. For example, the pixel definition member 414 may be referred to as a pixel definition layer (PDL). The organic light emitting layer 415 may be configured to emit light based on energy generated by electrons and holes. According to one embodiment, the organic light emitting layer 415 may be included in each of the plurality of subpixels 411, 412, and 413. The first electrode 416 may be disposed below the organic light emitting layer 415 . The first electrode 416 may be electrically connected to a plurality of TFTs 430 . According to one embodiment, the first electrode 416 may be included in each of the plurality of subpixels 411, 412, and 413. For example, the first electrode 416 may be an anode. When the first electrode 416 is an anode, the first electrode 416 may transfer holes to the organic light emitting layer 415 by the electric field applied from the plurality of TFTs 430. The second electrode 417 may be disposed on the organic light emitting layer 415 . The second electrode 417 may be disposed along the pixel defining member 414 . For example, the second electrode 417 may surround the pixel defining member 414. According to one embodiment, the second electrode 417 may be included in each of the plurality of subpixels 411, 412, and 413. For example, the second electrode 417 may be a cathode. When the second electrode 417 is a cathode, the second electrode 417 can transfer electrons to the organic light emitting layer 415 by the electric field applied from the plurality of TFTs 430. As holes and electrons transferred from each of the first electrode 416 and the second electrode 417 are transferred to the organic light-emitting layer 415, the organic light-emitting layer 415 may emit light. For example, light may be emitted from the organic light emitting layer 415 toward the top of the pixel layer 410 (eg, in the +z direction), but is not limited thereto. For example, light may be emitted from the organic light emitting layer 415 toward the bottom of the pixel layer 410 (eg, -z direction).

The substrate 420 may support various components included in the display 400. For example, the substrate 420 may support a plurality of TFTs 430. The substrate 420 may be disposed below the pixel layer 410 . According to one embodiment, the substrate 420 may be disposed in the first region 401, the second region 402, and/or the deformation region 403. The substrate 420 may be included in the first region 401 , second region 402 , and/or deformation region 403 . For example, the substrate 420 may be disposed across the strained region 403 and within the first region 401 and the second region 402 . According to one embodiment, the substrate 420 may be flexible so that the display 400 can be folded or unfolded. For example, the substrate 420 may include polyimide (PI, polyimide), but is not limited thereto.

The plurality of TFTs 430 may drive the plurality of subpixels 411, 412, and 413 within the pixel layer 410. For example, the plurality of TFTs 430 may be manufactured based on low temperature polycrystalline silicon (LTPS) or low temperature polycrystalline oxide (LTPO). According to one embodiment, the plurality of TFTs 430 may be disposed below the pixel layer 410. For example, the plurality of TFTs 430 may be disposed between the substrate 420 and the pixel layer 410. For example, a plurality of TFTs 430 may be disposed on the substrate 420 . According to one embodiment, the plurality of TFTs 430 may include an inorganic material. For example, the proportion of inorganic materials included in the plurality of TFTs 430 may be greater than the proportion of organic materials included in the plurality of TFTs 430 . According to one embodiment, the number of TFTs 430 may correspond to the number of subpixels 411, 412, and 413. For example, the number of TFTs 430 may be substantially equal to the number of subpixels 411, 412, and 413. However, the present invention is not limited thereto, and the number of TFTs 430 may be smaller than the number of subpixels 411, 412, and 413.

According to one embodiment, the plurality of TFTs 430 include a buffer layer 431, an active layer 432, a gate electrode 433, a source electrode 434, a drain electrode 435, and a first insulating layer ( 436), a second insulating layer 437, and/or an intermediate insulating layer 438. According to one embodiment, each of the plurality of TFTs 430 may include a gate electrode 433, a source electrode 434, and a drain electrode 435. A plurality of TFTs 430 may share a buffer layer 431, an active layer 432, a first insulating layer 436, a second insulating layer 437, and/or an intermediate insulating layer 438. there is. For example, one TFT among the plurality of TFTs 430 may be defined as including a gate electrode 433, a source electrode 434, and a drain electrode 435. For example, the number of TFTs 430 may correspond to the number of gate electrodes 433. For example, the number of TFTs 430 may correspond to the number of source electrodes 434. For example, the number of TFTs 430 may correspond to the number of drain electrodes 435.

The buffer layer 431 can reduce the amount of foreign substances penetrating into the plurality of TFTs 430 when the display 400 is manufactured. For example, the buffer layer 431 may block the inflow of foreign substances into the active layer 432. According to one embodiment, the buffer layer 431 may be disposed on the substrate 420. For example, the buffer layer 431 may be in contact with the substrate 420 .

The active layer 432 may provide a path for electrons moving from the source electrode 434 to the drain electrode 435. According to one embodiment, the active layer 432 may be disposed on the substrate 420. For example, the active layer 432 may be placed on the buffer layer 431. For example, the active layer 432 may be in contact with the buffer layer 431. According to one embodiment, the active layer 432 may include low-temperature polycrystalline silicon (LTPS).

The gate electrode 433 may apply an electric field for the movement of electrons from the source electrode 434 to the drain electrode 435. According to one embodiment, the gate electrode 433 may be disposed on the active layer 432.

The source electrode 434 and the drain electrode 435 may be connected to the active layer 432. For example, the source electrode 434 and the drain electrode 435 may be electrically connected to the active layer 432 through a contact hole. According to one embodiment, the source electrode 434 and the drain electrode 435 may be disposed above the active layer 432 and the gate electrode 433. The source electrode 434 and the drain electrode 435 may be electrically connected to the gate electrode 433. When the gate electrode 433 applies an electric field to the active layer 432, current may flow from the source electrode 434 to the drain electrode 435. The electric field generated by the flow of current from the source electrode 434 to the drain electrode 435 may be applied to the first electrode 416 and/or the second electrode 417 in the pixel layer 410. As an electric field is applied to the first electrode 416 and/or the second electrode 417, light may be emitted from the organic light emitting layer 415.

The first insulating layer 436 can prevent short circuit between the active layer 432 and the gate electrode 433. The first insulating layer 436 may be interposed between the active layer 432 and the gate electrode 433. For example, the first insulating layer 436 may be disposed on the active layer 432. According to one embodiment, the first insulating layer 436 may include an inorganic material. For example, the first insulating layer 436 may be formed of an inorganic material. For example, the first insulating layer 436 may be referred to as a gate insulator (GI).

The second insulating layer 437 may be disposed on the first insulating layer 436 . For example, the second insulating layer 437 may surround the gate electrode 433. According to one embodiment, the second insulating layer 437 may include an inorganic material. For example, the second insulating layer 437 may be formed of an inorganic material. For example, the second insulating layer 437 may be referred to as a gate insulator (GI).

The intermediate insulating layer 438 can prevent short circuit between the gate electrode 433 and the source electrode 434. The intermediate insulating layer 438 can prevent short circuit between the gate electrode 433 and the drain electrode 435. According to one embodiment, the intermediate insulating layer 438 may be disposed between the gate electrode 433 and the source electrode 434. The intermediate insulating layer 438 may be disposed between the gate electrode 433 and the drain electrode 435. The middle insulating layer 438 may be disposed on the second insulating layer 437 . According to one embodiment, the middle insulating layer 438 may include an inorganic material. For example, the intermediate insulating layer 438 may be formed of an inorganic material. For example, the intermediate insulating layer 438 may be referred to as an interlayer dielectric layer (ILD layer).

The organic insulating layer 440 may cover the plurality of TFTs 430 . According to one embodiment, the organic insulating layer 440 may be disposed between the plurality of TFTs 430 and the pixel layer 410. The organic insulating layer 440 may be disposed on the plurality of TFTs 430 . As the organic insulating layer 440 is disposed on the plurality of TFTs 430, when the display 400 is manufactured, a space where the pixel layer 410 is disposed can be secured. For example, the organic insulating layer 440 may be referred to as a passivation layer. According to one embodiment, the organic insulating layer 440 may include an organic material. For example, the proportion of organic materials included in the organic insulating layer 440 may be higher than the proportion of inorganic materials included in the organic insulating layer 440.

The encapsulation layer 450 may encapsulate a plurality of subpixels 411, 412, and 413 within the pixel layer 410. The encapsulation layer 450 may block foreign substances (eg, moisture) and/or oxygen from entering the plurality of subpixels 411, 412, and 413. According to one embodiment, the encapsulation layer 450 may be disposed on the pixel layer 410. For example, the encapsulation layer 450 may cover a plurality of subpixels 411, 412, and 413. For example, the encapsulation layer 450 may be disposed on a plurality of subpixels 411, 412, and 413. The encapsulation layer 450 may be disposed on the second electrode 417. According to one embodiment, the encapsulation layer 450 may include an organic layer and an inorganic layer stacked on top of each other. For example, the encapsulation layer 450 may be referred to as a thin film encapsulation layer (TFE).

According to one embodiment, the plurality of TFTs 430 may include a plurality of first TFTs 430a, a plurality of second TFTs 430b, and/or a plurality of third TFTs 430c. You can. A plurality of first TFTs 430a may be disposed in the first area 401 .

The plurality of first TFTs 430a may be configured to drive the plurality of first subpixels 411 disposed in the first area 401. For example, each of the plurality of first TFTs 430a may be electrically connected to each of the plurality of first subpixels 411. According to one embodiment, the plurality of first TFTs 430a may be disposed outside the deformation area 403. For example, a plurality of first TFTs 430a may be disposed in the first area 401. For example, the plurality of first TFTs 430a may be spaced apart from the deformation region 403.

A plurality of second TFTs 430b may be disposed in the second area 402 . The plurality of second TFTs 430b may be configured to drive the plurality of second subpixels 412 disposed in the second area 402. For example, each of the plurality of second TFTs 430b may be electrically connected to each of the plurality of second subpixels 412. According to one embodiment, the plurality of second TFTs 430b may be disposed outside the deformation area 403. For example, a plurality of second TFTs 430b may be disposed in the second area 402. For example, the plurality of second TFTs 430b may be spaced apart from the deformation region 403.

The plurality of third TFTs 430c may be configured to drive the plurality of third subpixels 413 in the deformation area 403. For example, the plurality of third TFTs 430c may be electrically connected to the plurality of third subpixels 413. According to one embodiment, the plurality of third TFTs 430c may be disposed outside the deformation area 403. The plurality of third TFTs 430c may be disposed in an area different from the deformation area 403 among the first area 401, the second area 402, and the deformation area 403. The plurality of third TFTs 430c may be disposed in at least one of the first area 401 and the second area 402. For example, the plurality of TFTs 430 may not be disposed within the deformation area 403 of the display 400. For example, a plurality of third TFTs 430c may be disposed in the first area 401. When the plurality of third TFTs 430c are disposed in the first region 401, the deformation region 403 is one of the plurality of first TFTs 430a and the plurality of third TFTs 430c, It may be close to the plurality of third TFTs 430c, but is not limited thereto. For example, a plurality of third TFTs 430c may be disposed in the second area 402. When the plurality of third TFTs 430c are disposed in the second area 402, the deformation area 403 is one of the plurality of second TFTs 430b and the plurality of third TFTs 430c, It may be close to the plurality of third TFTs 430c, but is not limited thereto. For example, as the plurality of TFTs 430 include an inorganic material, the plurality of TFTs 430 may have brittleness. As the plurality of TFTs 430 are brittle, if the display 400 is repeatedly folded or unfolded, the plurality of TFTs 430 may be damaged. In the display 400 according to an embodiment, a plurality of third TFTs 430c for driving a plurality of third subpixels 413 within the deformation area 403 are disposed outside the deformation area 403. Therefore, it is possible to provide a structure that can reduce damage caused by stress caused by deformation of the display 400.

According to one embodiment, the ratio of the inorganic material contained in the deformation region 403 may be different from the ratio of the inorganic material contained in the first region 401. For example, the ratio of the inorganic material contained in the deformation region 403 may be lower than the ratio of the inorganic material contained in the first region 401 . For example, the ratio of organic materials contained in the deformation region 403 may be higher than that of the organic materials contained in the first region 401 . The proportion of the inorganic material contained in the deformation region 403 may be different from the proportion of the inorganic material contained in the second region 402 . For example, the ratio of the inorganic material contained in the deformation region 403 may be lower than the ratio of the inorganic material contained in the second region 402 . For example, the ratio of the organic material contained in the deformation region 403 may be higher than the ratio of the organic material contained in the second region 402 .

According to one embodiment, a portion 430c-1 of the plurality of third TFTs 430c may be spaced apart from another portion 430c-2 of the plurality of third TFTs 430c. Some 430c-1 of the plurality of third TFTs 430c may be disposed in the first area 401. For example, some 430c-1 of the plurality of third TFTs 430c may be arranged along the first edge 403a of the deformation area 403 within the first area 401. Another portion 430c-2 of the plurality of third TFTs 430c may be disposed in the second area 402. For example, another portion 430c-2 of the plurality of third TFTs 430c may be disposed along the second edge 403b of the deformation region 403 within the second region 402. According to one embodiment, a portion 430c-1 of the plurality of third TFTs 430c and another portion 430c-2 of the plurality of third TFTs 430c may be disposed on the substrate 420. You can. For example, a portion 430c-1 of the plurality of third TFTs 430c and another portion 430c-2 of the plurality of third TFTs 430c may be supported by the substrate 420. .

According to one embodiment, the organic insulating layer 440 may include a first part 441 and/or a second part 442. The first part 441 may be disposed within the deformation area 403. The first part 441 may be disposed on the substrate 420 . The first portion 441 may be disposed between a portion 430c-1 of the plurality of third TFTs 430c and another portion 430c-2 of the plurality of third TFTs 430c. The first part 441 may fill the gap between a part 430c-1 of the plurality of third TFTs 430c and another part 430c-2 of the plurality of third TFTs 430c. . The first portion 441 is attached to the substrate 420 between a part 430c-1 of the plurality of third TFTs 430c and another part 430c-2 of the plurality of third TFTs 430c. You can access it. The second portion 442 may be disposed in the first region 401, the second region 402, and the deformation region 403. For example, second portion 442 may extend from first region 401 across deformation region 403 to second region 402 . According to one embodiment, the second portion 442 may be disposed on a plurality of TFTs 430 . For example, the second portion 442 includes a portion 430c-1 of the plurality of third TFTs 430c, another portion 430c-2 of the plurality of third TFTs 430c, and the first portion 430c-1. It may be placed on portion 441. For example, because the brittleness of organic materials is lower than that of inorganic materials, the brittleness of the organic insulating layer 440 may be lower than that of the plurality of TFTs 430 . The display 400 according to an embodiment includes a portion 430c-1 of the plurality of third TFTs 430c and another portion of the plurality of third TFTs 430c spaced apart from each other within the deformable region 403. By the organic insulating layer 440 that fills the gap between (430c-2), a structure robust against stress can be provided.

According to one embodiment, the plurality of third TFTs 430c may include a stepped structure. For example, a portion 430c-1 of the plurality of third TFTs 430c adjacent to the first edge 403a of the deformation region 403 may include a step structure. For example, another portion 430c-2 of the plurality of third TFTs 430c adjacent to the second edge 403b of the deformation region 403 may include a step structure. The buffer layer 431 in the plurality of third TFTs 430c is connected to at least one of the active layer 432, the first insulating layer 436, the second insulating layer 437, and the middle insulating layer 438. You can define a step for this. For example, the buffer layer 431 within the plurality of third TFTs 430c may define a step with respect to the middle insulating layer 438. According to one embodiment, the distance from the first edge 403a of the deformation region 403 to the buffer layer 431 is the distance from the first edge 403a of the deformation region 403 to the intermediate insulating layer 438. It may be different from For example, the distance from the first edge 403a is the buffer layer 431, the active layer 432, the first insulating layer 436, the second insulating layer 437, and the middle insulating layer 438. It can increase in the following order. However, it is not limited to this. For example, the distance from the first edge 403a is the buffer layer 431, the active layer 432, the first insulating layer 436, the second insulating layer 437, and the middle insulating layer 438. It can be reduced in the following order.

The plurality of dummy patterns 460 may compensate for the reflectance of the deformed area 403. For example, the plurality of dummy patterns 460 may reduce the difference between the reflectance of the deformed area 403 and the reflectance of the first area 401. For example, the plurality of dummy patterns 460 may reduce the difference between the reflectance of the deformed area 403 and the reflectance of the second area 402. According to one embodiment, a plurality of dummy patterns 460 may be disposed in the deformation area 403. For example, the plurality of dummy patterns 460 are between a portion 430c-1 of the plurality of third TFTs 430c and another portion 430c-2 of the plurality of third TFTs 430c. can be placed in According to one embodiment, the plurality of dummy patterns 460 may be disposed inside a portion of the organic insulating layer 440 within the strained region 403. For example, a plurality of dummy patterns 460 may be disposed between the first part 441 and the second part 442. For example, the plurality of dummy patterns 460 may be disposed on the first portion 441, but is not limited thereto. For example, the plurality of dummy patterns 460 may be placed inside the first part 441 or inside the second part 442 . According to one embodiment, the plurality of dummy patterns 460 may include conductive members spaced apart from each other. However, the present invention is not limited thereto, and the plurality of dummy patterns 460 may include only one conductive member extending within the deformation region 403 .

The conductive line 470 may connect the plurality of third subpixels 413 and the plurality of third TFTs 430c. For example, the conductive line 470 may electrically connect the plurality of third subpixels 413 and the plurality of third TFTs 430c. According to one embodiment, the conductive line 470 may electrically connect a portion 430c-1 of the plurality of third TFTs 430c and at least one of the plurality of third subpixels 413. The conductive line 470 may electrically connect another portion 430c-2 of the plurality of third TFTs 430c and at least one of the plurality of third subpixels 413. According to one embodiment, the conductive line 470 may extend from the outside of the deformation region 403 to the inside of the deformation region 403. For example, the conductive line 470 is the drain electrode 435 (or source electrode 434) of a portion 430c-1 of the plurality of third TFTs 430c disposed in the first region 401. It may extend to a plurality of third subpixels 413 disposed in the deformation area 403. The conductive line 470 is connected to the drain electrode 435 (or source electrode 434) of a portion 430c-1 of the plurality of third TFTs 430c and the third electrode of the plurality of third subpixels 413. 1 Electrode 416 can be connected. For example, the conductive line 470 is connected to the drain electrode 435 (or source electrode 434) of another portion 430c-2 of the plurality of third TFTs 430c disposed in the second region 402. ), may extend to a plurality of third subpixels 413 disposed in the deformation area 403. The conductive line 470 is connected to the drain electrode 435 (or source electrode 434) of another part 430c-2 of the plurality of third TFTs 430c and the plurality of third subpixels 413. The first electrode 416 can be connected. As the plurality of third TFTs 430c and the plurality of third subpixels 413 are electrically connected by the conductive line 470, the plurality of third subpixels 413 in the deformation region 403 Light can be emitted from According to one embodiment, the conductive line 470 may include a plurality of conductive lines 470. For example, the number of conductive lines 470 may correspond to the number of third TFTs 430c.

As described above, in the display 400 according to one embodiment, the plurality of third TFTs 430c including an inorganic material are disposed outside the deformation region 403, so the display 400 due to stress ) can provide a structure that can reduce damage.

FIG. 6 is a cross-sectional view illustrating an example of a display of an exemplary electronic device cut along line C-C' of FIG. 4A according to an embodiment.

Referring to FIG. 6 , according to one embodiment, a plurality of third TFTs 430c may be disposed within the bezel area 404. For example, the plurality of third TFTs 430c may be arranged along the third edge 403c between the bezel area 404 and the deformation area 403. However, it is not limited to this. For example, the plurality of third TFTs 430c may be arranged along the fourth edge (e.g., the fourth edge 403d in FIG. 4A) between the bezel area 404 and the deformation area 403. .

According to one embodiment, the conductive line 470 includes a plurality of third TFTs 430c disposed in the bezel area 404 and a plurality of third subpixels 413 disposed in the deformation area 403. can be connected. The conductive line 470 may electrically connect the plurality of third TFTs 430c disposed in the bezel area 404 and the plurality of third subpixels 413 disposed in the deformation area 403. . For example, the conductive line 470 is formed from the drain electrode 435 (or the source electrode 434 in FIGS. 5A and 5B) of the plurality of third TFTs 430c disposed in the bezel area 404. It may extend to the first electrode 416 of the plurality of third subpixels 413 disposed in the deformation area 403.

As described above, in the display 400 according to one embodiment, the plurality of third TFTs 430c having brittleness are disposed outside the deformation region 403, so the display 400 is damaged due to stress. A structure that can reduce can be provided.

FIG. 7 is a cross-sectional view illustrating an example of a display of an exemplary electronic device according to an embodiment.

Referring to FIG. 7 , the display 400 according to one embodiment may include an inorganic member 480. The inorganic member 480 can reduce the propagation of cracks within the deformation region 403. The inorganic member 480 may include an inorganic material. For example, the inorganic member 480 may include substantially the same material as the plurality of TFTs 430 . For example, the inorganic member 480 may be brittle, but is not limited thereto. For example, the inorganic member 480 may include a flexible metal.

According to one embodiment, the thickness of the inorganic member 480 may correspond to the thickness of each of the plurality of third TFTs 430c. The thickness of one component may mean a length extending in an upward direction (e.g., +z direction), and unless otherwise specified, the expression may be applied substantially the same hereinafter. For example, the inorganic member 480 may include, among the components included in the plurality of TFTs 430, a gate electrode (e.g., the gate electrode 433 in FIGS. 5A and 5B) and a source electrode (e.g., : May include substantially the same material as the layers except for the source electrode 434 in FIGS. 5A and 5B) and the drain electrode (e.g., the drain electrode 435 in FIGS. 5A and 5B). For example, the inorganic member 480 may include substantially the same material as the buffer layer 431, the active layer 432, the first insulating layer 436, and/or the intermediate insulating layer 438. there is.

According to one embodiment, the inorganic member 480 may be disposed within the deformation region 403. For example, the inorganic member 480 may be disposed within a portion of the organic insulating layer 440 within the deformation region 403 . For example, the inorganic member 480 may be disposed within the first portion 441 of the organic insulating layer 440. However, the inorganic member 480 is not limited to this and may be disposed within the second portion 442. According to one embodiment, the inorganic member 480 may be disposed on the substrate 420. For example, the inorganic member 480 may extend from the substrate 420 in an upward direction (eg, +z direction). For example, the inorganic member 480 may extend from the substrate 420 and contact one of the plurality of dummy patterns 460 . According to one embodiment, the inorganic member 480 may include a plurality of inorganic members spaced apart from each other. However, the present invention is not limited thereto, and the inorganic member 480 may be formed integrally within the deformation region 403.

As described above, the display 400 according to one embodiment can provide a structure capable of reducing damage to the deformable area 403 by the inorganic member 480 disposed within the deformable area 403. there is.

FIG. 8 is a cross-sectional view illustrating an example of a display of an exemplary electronic device according to an embodiment.

Referring to FIG. 8, according to one embodiment, the display 400 may include a bottom metal layer 490 (BML). The lower metal layer 490 may reduce the amount of light from the outside of the display 400 transmitted to the plurality of TFTs 430. For example, the lower metal layer 490 may reflect light incident on the plurality of TFTs 430 by being disposed below the plurality of TFTs 430 . According to one embodiment, the lower metal layer 490 may be disposed between the plurality of TFTs 430 and the substrate 420. For example, the lower metal layer 490 may be disposed between the buffer layer 431 and the substrate 420. For example, the lower metal layer 490 may be disposed between a portion 430c-1 of the plurality of third TFTs 430c and the substrate 420. However, it is not limited thereto, and the lower metal layer 490 includes another part of the plurality of third TFTs 430c (e.g., another part 430c-2 in FIGS. 4A and 4B) and the substrate 420. It can be placed between .

Hereinafter, the description will be based on the relationship between some 430c-1 of the plurality of third TFTs 430c and the lower metal layer 490, but this is for convenience of explanation. A description of the relationship between some 430c-1 of the plurality of third TFTs 430c and the lower metal layer 490 is provided below. Substantially the same can be applied to the relationship between layers 490.

According to one embodiment, the lower metal layer 490 may be electrically connected to some 430c-1 of the plurality of third TFTs 430c. The lower metal layer 490 may be electrically connected to some 430c-1 of the plurality of third TFTs 430c through the first conductive member 491. The first conductive member 491 includes the drain electrode 435 (or the source electrode 434 in FIGS. 5A and 5B) of a portion 430c-1 of the plurality of third TFTs 430c and the lower metal layer. (490) can be connected. For example, the first conductive member 491 may penetrate a portion 430c-1 of the plurality of third TFTs 430c.

According to one embodiment, the lower metal layer 490 may be electrically connected to one 461 of the plurality of dummy patterns 460. For example, the lower metal layer 490 may be electrically connected to one 461 of the plurality of dummy patterns 460 through the second conductive member 492. The second conductive member 492 may extend from the lower metal layer 490 to one 461 of the plurality of dummy patterns 460 . For example, the second conductive member 492 may penetrate the first portion 441 within the deformation region 403.

According to one embodiment, the conductive line 470 may extend from inside the deformation region 403. The conductive line 470 extends inside the deformation region 403 to form a plurality of third subpixels 413 disposed inside the deformation region 403 and a plurality of third subpixels 413 disposed outside the deformation region 403. The third TFTs 430 may be electrically connected. For example, the conductive line 470 may connect one 461 of the plurality of dummy patterns 460 and at least one of the plurality of third subpixels 413. As one of the plurality of dummy patterns 460 461 is connected to at least one of the plurality of third subpixels 413 by the conductive line 470, some of the plurality of third TFTs 430c At least one of the plurality of third subpixels 413 may be electrically connected to 430c-1.

As described above, the display 400 according to one embodiment includes a plurality of third subpixels 413 disposed in the deformation area 403 by a conductive line 470 connected within the deformation area 403. ) and a portion 430c-1 of the plurality of third TFTs 430c disposed outside the deformation region 403 may be provided.

9 is a top plan view of an example electronic device in an unfolded state, according to one embodiment.

Referring to FIG. 9 , according to one embodiment, the encapsulation layer 450 may be disposed within the first region 401, the second region 402, and the deformation region 403. The encapsulation layer 450 may be disposed outside the portion 404a of the bezel area 404. A portion 404a of the bezel area 404 may surround the deformation area 403. For example, the part 404a of the bezel area 404 may mean a part of the bezel area 404 surrounding the third edge 403c of the deformation area 403. For example, the part 404a of the bezel area 404 may mean a part of the bezel area 404 surrounding the fourth edge 403d of the deformation area 403. For example, as the encapsulation layer 450 includes one or more inorganic films, the encapsulation layer 450 may be brittle. As the encapsulation layer 450 is brittle, stress generated by folding or unfolding the display 400 may damage the encapsulation layer 450. If the encapsulation layer 450 is omitted, damage to pixels in the display 400 may occur due to moisture or oxygen. The display 400 according to one embodiment can reduce damage to the display 400 by an encapsulation layer 450 disposed outside a portion 404a of the bezel area 404 where pixels are not disposed. It can provide structure. For example, the display 400 reduces damage to the encapsulation layer 450 due to stress as the encapsulation layer 450 corresponding to the portion 404a of the bezel area 404 where pixels are not disposed is deleted. We can provide a structure that can do this.

As described above, the display 400 according to one embodiment has an encapsulation layer 450 including a notch in a portion 404a of the bezel area 404, which can reduce damage to the display 400. It can provide structure. For example, because the encapsulation layer 450 includes a notch in the portion 404a of the bezel area 404, the area of the encapsulation layer 450 including the inorganic material may be reduced. As the area of the encapsulation layer 450 containing an inorganic material is reduced, damage due to stress of the display 400 may be reduced.

10 is a top plan view of an example electronic device in an unfolded state, according to one embodiment.

Referring to FIG. 10, according to one embodiment, the bezel area 404 includes a first bezel part 404b, a second bezel part 404c, a third bezel part 404d, and/or a fourth bezel part. (404e). The first bezel portion 404b may be disposed on the first housing 310 . The first bezel portion 404b may be substantially parallel to the folding axis f. For example, the first bezel portion 404b may be disposed along one edge of the first area 401 substantially parallel to the folding axis f. The second bezel portion 404c may be disposed on the second housing 320 . The second bezel portion 404c may be substantially parallel to the folding axis f. For example, the second bezel portion 404c may be disposed along one edge of the second area 402 substantially parallel to the folding axis f. According to one embodiment, the second bezel part 404c may be spaced apart from the first bezel part 404b. For example, the folding axis f may be located between the first bezel portion 404b and the second bezel portion 404c. For example, the second bezel part 404c may be opposite to the first bezel part 404b. For example, the second bezel part 404c may face the first bezel part 404b. The third bezel part 404d may connect the first bezel part 404b and the second bezel part 404c. The third bezel portion 404d may be disposed between the first bezel portion 404b and the second bezel portion 404c. For example, the third bezel part 404d may extend from one end of the first bezel part 404b to one end of the second bezel part 404c. For example, the third bezel portion 404d may extend from the first housing 310, across the hinge structure 350, to the second housing 320. According to one embodiment, in the unfolded state of the electronic device 300, the third bezel portion 404d may be substantially perpendicular to the folding axis f. The fourth bezel part 404e may connect the first bezel part 404b and the second bezel part 404c. The fourth bezel portion 404e may be disposed between the first bezel portion 404b and the second bezel portion 404c. For example, the fourth bezel part 404e may extend from the other end of the first bezel part 404b to the other end of the second bezel part 404c. For example, the fourth bezel portion 404e may extend from the first housing 310, across the hinge structure 350, to the second housing 320. According to one embodiment, in the unfolded state of the electronic device 300, the fourth bezel portion 404e may be substantially perpendicular to the folding axis f. The fourth bezel portion 404e may be spaced apart from the third bezel portion 404d. For example, the fourth bezel part 404e may be opposite to the third bezel part 404d. For example, the fourth bezel part 404e may face the third bezel part 404d.

According to one embodiment, a plurality of third TFTs (eg, a plurality of third TFTs 430c in FIGS. 5A and 5B) may be disposed in the bezel area 404 of the display 400. When a DDI (e.g., DDI 230 in FIG. 2) is disposed in one of the first bezel part 404b and the second bezel part 404c, the plurality of third TFTs 430c have a hinge structure ( It may be disposed in at least one of a portion of the third bezel portion 404d disposed on 350) and a portion of the fourth bezel portion 404e disposed on the hinge structure. For example, when the DDI 230 is disposed in the first bezel portion 404b, the plurality of third TFTs 430c are part of the third bezel portion 404d disposed on the hinge structure 350. , and may be disposed within a portion of the fourth bezel portion 404e disposed on the hinge structure. For example, when the DDI 230 is disposed within the second bezel portion 404c, the plurality of third TFTs 430c are part of the third bezel portion 404d disposed on the hinge structure 350. , and may be disposed within a portion of the fourth bezel portion 404e disposed on the hinge structure.

According to one embodiment, when the DDI 230 is disposed in one of the third bezel part 404d and the fourth bezel part 404e, the plurality of third TFTs 430c are It may be disposed in another bezel portion opposite to the disposed bezel portion. When the DDI 230 is disposed in one of the third bezel portion 404d and the fourth bezel portion 404e, the plurality of third TFTs 430c face the bezel portion where the DDI 230 is disposed. It may be placed within another bezel portion. For example, when the DDI 230 is disposed within the third bezel portion 404d, the plurality of third TFTs 430c are within a portion of the fourth bezel portion 404e overlapping the hinge structure 350. can be placed. For example, when the DDI 230 is disposed within the fourth bezel portion 404e, the plurality of third TFTs 430c are within a portion of the third bezel portion 404d that overlaps the hinge structure 350. can be placed.

As described above, the display 400 according to one embodiment has a structure that can reduce damage to the display 400 because the plurality of third TFTs 430c are disposed outside the deformation area 403. can be provided.

In order to provide various contents to users, the display may have a curvature and be curved. For example, the display may be referred to as a flexible display that can be folded or unfolded. Stress generated by repeated folding or unfolding of the display may damage at least some of the internal components of the display. For example, stress generated within a display may damage brittle components within the display. Displays and electronic devices including them may require a structure that can reduce damage due to stress caused by changes in the shape of the display.

The technical challenges sought to be achieved in this document are not limited to the technical challenges mentioned above, and other technical challenges not mentioned can be clearly understood by those skilled in the art of this document from the description below. There will be.

A display (eg, display 400 in FIG. 4A) according to an embodiment may include a first area (eg, first area 401 in FIG. 4A). According to one embodiment, the display may include a second area (eg, the second area 402 in FIG. 4A) that can be moved with respect to the first area. According to one embodiment, the display is disposed between the first area and the second area, and has a deformation area that can be modified by movement of the second area with respect to the first area (e.g., the deformation area in FIG. 4A). (403)). According to one embodiment, the display includes a plurality of first subpixels (e.g., a plurality of first subpixels 411 in FIG. 5A) arranged in the first area, a plurality of first subpixels arranged in the second area. Second subpixels (e.g., the plurality of second subpixels 412 in FIG. 5B), and a plurality of third subpixels (e.g., the plurality of third subpixels in FIGS. 5A and 5B) disposed in the deformation area. It may include a pixel layer (eg, the pixel layer 410 in FIGS. 5A and 5B) including 3 subpixels 413. According to one embodiment, the display may include a plurality of TFTs (eg, a plurality of TFTs 430 in FIGS. 5A and 5B) disposed below the pixel layer. According to one embodiment, the plurality of TFTs are disposed inside the first area, and a plurality of first TFTs for driving the plurality of first subpixels (e.g., the plurality of first TFTs in FIG. 5A may include fields 430a). According to one embodiment, the plurality of TFTs are disposed inside the second area, and a plurality of second TFTs for driving the plurality of second subpixels (e.g., a plurality of second TFTs in FIG. 5B) 430b) may be included. According to one embodiment, the plurality of TFTs are disposed outside the deformation area, and a plurality of third TFTs for driving at least a portion of the plurality of third subpixels (e.g., FIGS. 5A and 5B may include a plurality of third TFTs 430c).

The display according to one embodiment can provide a structure that is robust against damage due to stress because a plurality of relatively brittle third TFTs are disposed outside the deformation area of the display.

According to one embodiment, the plurality of third TFTs may be disposed in at least one of the first area and the second area.

The display according to one embodiment provides a structure that is robust against damage due to stress because a plurality of relatively brittle third TFTs are disposed in at least one of the first region and the second region outside the deformation region of the display. can do.

According to one embodiment, the display may include a bezel area (eg, bezel area 404 in FIG. 4A) surrounding the first area, the second area, and the deformation area. According to one embodiment, some of the plurality of third TFTs may be disposed within the bezel area.

The display according to one embodiment can provide a structure that is robust against damage due to stress because a plurality of relatively brittle third TFTs are disposed in the bezel area outside the deformation area of the display.

According to one embodiment, the display may include a plurality of dummy patterns (eg, a plurality of dummy patterns 460 in FIGS. 5A and 5B) disposed in the deformation area.

A display according to an embodiment may provide a structure that can reduce the difference in reflectance between the deformed area and other areas in the display by using a plurality of dummy patterns disposed in the deformed area.

According to one embodiment, the ratio of the inorganic material in the deformed region may be lower than the proportion of the inorganic material included in the first region.

The display according to one embodiment can provide a structure that is robust against breakage because the proportion of inorganic material in the deformation area is reduced as the plurality of third TFTs are disposed outside the deformation area.

According to one embodiment, the display electrically connects some of the plurality of third TFTs (e.g., part 430c-1 in FIG. 5A) and at least one of the plurality of third subpixels. It may include a conductive line (eg, conductive line 470 in FIG. 5A).

The display according to one embodiment may provide visual information through the deformed area by a conductive line connected to a plurality of third subpixels disposed in the deformed area.

According to one embodiment, the conductive line may extend from the outside of the deformation area to the at least one of the plurality of third subpixels within the deformation area.

The display according to one embodiment may provide visual information through the deformation area by a conductive line extending from the outside of the deformation area.

According to one embodiment, the display is disposed in the first area, the second area, and the deformation area, and includes a portion of the plurality of third TFTs (e.g., portion 430c-1 in FIG. 5A) , and a substrate (e.g., FIG. 5a, and It may include the substrate 420 of FIG. 5B. According to one embodiment, the display includes a first part disposed on the substrate to fill a gap between the part of the plurality of third TFTs and the other part of the plurality of third TFTs (e.g., a first portion 441 in FIGS. 5A and 5B ), and a second portion disposed on the first portion, the portion of the plurality of third TFTs, and the other portion of the plurality of third TFTs. It may include an organic insulating layer (e.g., the organic insulating layer 440 in FIGS. 5a and 5b) including a portion (e.g., the second portion 442 in FIGS. 5a and 5b).

The display according to one embodiment can provide a structure that is resistant to breakage by using an organic insulating layer that fills the space between the plurality of third TFTs.

According to one embodiment, the display includes a bottom metal layer disposed between the substrate and some of the plurality of third TFTs and electrically connected to one of the plurality of third TFTs. (e.g., the lower metal layer 490 in FIG. 8). According to one embodiment, the display may include a plurality of dummy patterns (eg, a plurality of dummy patterns 460 in FIG. 8) disposed on the first portion and spaced apart from each other. According to one embodiment, the display includes a conductive member (e.g., one 461 of the plurality of dummy patterns 460 in FIG. 8) connecting the lower metal layer and one of the plurality of dummy patterns. : May include the second conductive member 492 in FIG. 8). According to one embodiment, the display is configured to connect the one of the plurality of dummy patterns and at least one of the plurality of third subpixels, thereby connecting the part of the plurality of third TFTs and the plurality of third subpixels. It may include a conductive line (eg, conductive line 470 in FIG. 8) that electrically connects at least one of the three subpixels.

A display according to an embodiment may be configured to provide visual information through a deformation area by a conductive line that electrically connects a plurality of third TFTs and a plurality of third subpixels.

According to one embodiment, the plurality of third TFTs may include a buffer layer (eg, the buffer layer 431 in FIGS. 5A and 5B) disposed on the substrate. According to one embodiment, the plurality of third TFTs may include an active layer (eg, the active layer 432 in FIGS. 5A and 5B) disposed on the buffer layer. According to one embodiment, the plurality of third TFTs may include an intermediate insulating layer (eg, the intermediate insulating layer 438 in FIGS. 5A and 5B) disposed on the active layer.

According to one embodiment, the buffer layer may define a step with respect to the intermediate insulating layer.

The display according to one embodiment can provide a structure that can reduce damage caused by stress caused by folding or unfolding of the display because the buffer layer and the intermediate layer define the step.

According to one embodiment, the display may include inorganic members (eg, inorganic members 480 in FIG. 7) disposed within the deformable area and spaced apart from each other.

The display according to one embodiment may provide a structure capable of reducing the propagation of cracks within the deformation area by using an inorganic member disposed within the deformation area.

According to one embodiment, the thickness of the inorganic member may correspond to the thickness of each of the plurality of third TFTs.

The display according to one embodiment may provide a structure that can reduce the propagation of cracks in the deformation region by using an inorganic member corresponding to the thickness of the plurality of third TFTs.

According to one embodiment, the display is disposed within the first area, the second area, and the deformation area, and includes an encapsulation layer (e.g., encapsulation layer 450 in FIGS. 5A and 5B) covering the pixel layer. ) may include.

A display according to an embodiment may provide a structure that can reduce contact between a plurality of subpixels and foreign substances by using an encapsulation layer that covers the plurality of subpixels.

According to one embodiment, the display may include a bezel area (eg, bezel area 404 in FIG. 4A) surrounding the first area, the second area, and the deformation area. According to one embodiment, the encapsulation layer may be disposed outside at least a portion of the bezel area (eg, portion 404a of FIG. 9 ) when the display is viewed from above.

The display according to one embodiment may provide a structure in which the area of the encapsulation layer containing an inorganic material is reduced by the encapsulation layer disposed outside the bezel area.

The electronic device according to one embodiment may include a first housing (eg, the first housing 310 in FIG. 4A). According to one embodiment, the electronic device may include a second housing (eg, the second housing 320 in FIG. 4A) coupled to the first housing so as to be rotatable with respect to the first housing. According to one embodiment, the electronic device includes a first area (e.g., first area 401 in FIG. 4A) and a second area spaced apart from the first area (e.g., second area 402 in FIG. 4A). ), and a display connecting the first area and the second area and including a deformation area (e.g., deformation area 403 in FIG. 4A) that is deformable by movement of the second housing with respect to the first housing. (For example, the display 400 of FIG. 4A). According to one embodiment, the display includes a plurality of first subpixels (e.g., a plurality of first subpixels 411 in FIG. 5A) disposed in the first area, and a plurality of first subpixels disposed in the second area. second subpixels (e.g., the plurality of second subpixels 412 in FIG. 5B), and a plurality of third subpixels (e.g., the plurality of third subpixels in FIGS. 5A and 5B) disposed in the deformation area. It may include a pixel layer (eg, the pixel layer 410 of FIGS. 5A and 5B) including third subpixels 413. According to one embodiment, the display may include a plurality of TFTs (eg, a plurality of TFTs 430 in FIGS. 5A and 5B) disposed below the pixel layer. According to one embodiment, the plurality of TFTs are disposed inside the first area, and a plurality of first TFTs for driving the plurality of first subpixels (e.g., the plurality of first TFTs in FIG. 5A 430a) may be included. According to one embodiment, the plurality of TFTs are disposed inside the second area, and a plurality of second TFTs for driving the plurality of second subpixels (e.g., a plurality of second TFTs in FIG. 5B) 430b) may be included. According to one embodiment, the plurality of TFTs are disposed outside the deformation area, and a plurality of third TFTs for driving at least a portion of the plurality of third subpixels (e.g., FIGS. 5A and 5B may include a plurality of third TFTs 430c).

The electronic device according to one embodiment can provide a structure that is robust against damage due to stress because the plurality of third TFTs, which are relatively brittle, are disposed outside the deformation area of the display.

According to one embodiment, the plurality of third TFTs may be disposed in at least one of the first area and the second area.

The electronic device according to one embodiment has a structure that is robust against damage due to stress because a plurality of relatively brittle third TFTs are disposed in at least one of the first area and the second area outside the deformation area of the display. can be provided.

According to one embodiment, the display may include a bezel area (eg, bezel area 404 in FIG. 4A) surrounding the first area, the second area, and the deformation area. According to one embodiment, some of the plurality of third TFTs may be disposed within the bezel area.

The electronic device according to one embodiment can provide a structure that is robust against damage due to stress because a plurality of relatively brittle third TFTs are disposed in the bezel area outside the deformation area of the display.

According to one embodiment, the display may include a plurality of dummy patterns (eg, a plurality of dummy patterns 460 in FIGS. 5A and 5B) disposed in the deformation area.

An electronic device according to an embodiment may provide a structure that can reduce the difference in reflectance between the deformed area and other areas in the display by using a plurality of dummy patterns disposed in the deformed area.

According to one embodiment, the display electrically connects some of the plurality of third TFTs (e.g., part 430c-1 in FIG. 5A) and at least one of the plurality of third subpixels. It may include a conductive line (eg, conductive line 470 in FIG. 5A).

The electronic device according to one embodiment may provide visual information through the deformation area through a conductive line connected to a plurality of third subpixels disposed in the deformation area.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

Meanwhile, relative terms such as “lower” or “bottom” and “upper” or “top” are different as shown in the drawing. It can be used here to describe the relationship between components and one component. Relative terms should be understood to encompass other orientations of the device in addition to the orientation depicted in the drawings. For example, elements described as being on the "lower" side of other elements may be facing "upper" than the other elements if the device in one of the figures is turned over. oriented) can be. Accordingly, the term “lower” may include both “lower” and “upper” directions, depending on the particular direction of the drawing. Similarly, if the device in one of the figures is turned over, elements described as “below” or “beneath” other elements will be oriented “above” those other elements. ) can. Accordingly, the terms “below” or “beneath” can include both upward and downward directions.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to those components in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims (20)

In the display 400,
first area 401;
a second area 402 movable with respect to the first area 401;
a deformation area 403 disposed between the first area 401 and the second area 402 and deformable by movement of the second area 402 relative to the first area 401;
a plurality of first subpixels 411 disposed in the first area 401, a plurality of second subpixels 412 disposed in the second area 402, and a plurality of second subpixels 412 disposed in the deformation area 403. a pixel layer 410 including a plurality of third subpixels 413; and
a plurality of TFTs 430 disposed below the pixel layer 410; Including,
The plurality of TFTs 430 are,
a plurality of first TFTs 430a disposed inside the first area 401 and for driving the plurality of first subpixels 411;
a plurality of second TFTs 430b disposed inside the second area 402 and for driving the plurality of second subpixels 412; and
a plurality of third TFTs 430c disposed outside the deformation area 403 and configured to drive at least a portion of the plurality of third subpixels 413; Including,
Display (400).
According to paragraph 1,
The plurality of third TFTs 430c are,
disposed in at least one of the first area 401 and the second area 402,
Display (400).
According to any one of paragraphs 1 and 2,
a bezel area 404 surrounding the first area 401, the second area 402, and the deformation area 403; It further includes,
Some of the plurality of third TFTs 430c are,
disposed within the bezel area 404,
Display (400).
According to any one of claims 1 to 3,
a plurality of dummy patterns 460 disposed within the deformation area 403; Including,
Display (400).
According to any one of claims 1 to 4,
The proportion of inorganic material in the deformation region 403 is,
lower than the proportion of inorganic material contained in the first region 401,
Display (400).
According to any one of claims 1 to 5,
a conductive line 470 electrically connecting some (430c-1; 430c-2) of the plurality of third TFTs 430c and at least one of the plurality of third subpixels 413; Containing more,
Display (400).
According to any one of claims 1 to 6,
The conductive line 470 is,
extending from the outside of the deformation area 403 to the at least one of the plurality of third subpixels 413 within the deformation area 403,
Display (400).
According to any one of claims 1 to 7,
disposed in the first area 401, the second area 402, and the deformation area 403, a portion 430c-1 of the plurality of third TFTs 430c, and the plurality of third TFTs 430c. a substrate 420 supporting another part 430c-2 of the plurality of third TFTs 430c spaced apart from the part 430c-1 of the three TFTs 430c;
on the substrate 420 to fill the gap between the part 430c-1 of the plurality of third TFTs 430c and the other part 430c-2 of the plurality of third TFTs 430c. A first part 441 disposed in, and among the first part 441, the part 430c-1 of the plurality of third TFTs 430c, and the plurality of third TFTs 430c. an organic insulation layer 440 including a second part 442 disposed on the other part 430c-2; Containing more,
Display (400).
According to any one of claims 1 to 8,
A bottom metal layer 490 is disposed between the substrate 420 and some of the plurality of third TFTs 430c and is electrically connected to one of the plurality of third TFTs 430c. layer);
a plurality of dummy patterns 460 disposed on the first portion 441 and spaced apart from each other;
a conductive member connecting the lower metal layer 490 and one of the plurality of dummy patterns 460 (461); and
By connecting the one 461 of the plurality of dummy patterns 460 and at least one of the plurality of third subpixels 413, the portion of the plurality of third TFTs 430c and the plurality of a conductive line 470 electrically connecting the at least one of the third subpixels 413; Including,
Display (400).
According to any one of claims 1 to 9,
The plurality of third TFTs 430c are,
A buffer layer 431 disposed on the substrate 420; and
an active layer 432 disposed on the buffer layer;
an intermediate insulating layer 438 disposed on the active layer 432; Including,
Display (400).
According to any one of claims 1 to 10,
The buffer layer 431 is,
Defining a step with respect to the intermediate insulating layer 438,
Display (400).
According to any one of claims 1 to 11,
inorganic members 480 disposed within the deformation area 403 and spaced apart from each other; Containing more,
Display (400).
According to any one of claims 1 to 12,
The thickness of the inorganic member 480 is,
Corresponding to the thickness of each of the plurality of third TFTs 430c,
Display (400).
According to any one of claims 1 to 13,
an encapsulation layer 450 disposed in the first area 401, the second area 402, and the deformation area 403 and covering the pixel layer 410; Containing more,
Display (400).
According to any one of claims 1 to 14,
a bezel area 404 surrounding the first area 401, the second area 402, and the deformation area 403; It further includes,
The bag layer 450 is,
When the display 400 is viewed from above, disposed outside of at least a portion 404a of the bezel area 404,
Display (400).
In the electronic device (101; 300),
First housing 310;
a second housing 320 coupled to the first housing 310 so as to be rotatable relative to the first housing 310; and
A first area 401, a second area 402 spaced apart from the first area 401, and a first housing 310 connecting the first area 401 and the second area 402. a display 400 including a deformable area 403 that can be deformed by movement of the second housing 320 relative to ); Including,
The display 400 is
a plurality of first subpixels 411 disposed in the first area 401, a plurality of second subpixels 412 disposed in the second area 402, and a plurality of second subpixels 412 disposed in the deformation area 403. a pixel layer 410 including a plurality of third subpixels 413; and
a plurality of TFTs 430 disposed below the pixel layer 410; It further includes,
The plurality of TFTs 430 are,
a plurality of first TFTs 430a disposed inside the first area 401 and for driving the plurality of first subpixels 411;
a plurality of second TFTs 430b disposed inside the second area 402 and for driving the plurality of second subpixels 412; and
a plurality of third TFTs 430c disposed outside the deformation area 403 and configured to drive at least a portion of the plurality of third subpixels 413; Including,
Electronic devices (101; 300).
According to clause 16,
The plurality of third TFTs 430c are,
disposed in at least one of the first area 401 and the second area 402,
Electronic devices (101; 300).
According to any one of claims 16 and 17,
a bezel area 404 surrounding the first area 401, the second area 402, and the deformation area 403; It further includes,
Some of the plurality of third TFTs 430c are,
disposed within the bezel area 404,
Electronic devices (101; 300).
According to any one of claims 16 to 18,
a plurality of dummy patterns 460 disposed within the deformation area 403; Including,
Electronic devices (101; 300).
According to any one of claims 16 to 19,
A conductive line 470 electrically connecting some of the plurality of third TFTs 430c and at least one of the plurality of third subpixels 413; Containing more,
Electronic devices (101; 300).

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