KR20240061224A - Display apparatus - Google Patents

Abstract

A display device according to an embodiment of the present specification includes a substrate including a display area and a non-display area, a plurality of sub-pixels disposed in the display area and including an emission area and a non-emission area, a thin film transistor on the substrate, and a thin film transistor. A plurality of light emitting elements on the plurality of light emitting elements, an encapsulation part on the plurality of light emitting elements, at least one protective layer disposed on the encapsulation part, a first touch electrode on the encapsulation part, and a second touch on the first touch electrode. It may include an organic insulating layer on the electrode and the second touch electrode. In order to improve reliability and transmission efficiency while improving reliability, a display device according to an embodiment of the present specification includes at least one protective layer and an organic insulating layer in at least one sub-pixel among a plurality of sub-pixels in an area corresponding to the light-emitting area. Can have one open area.

Description

DISPLAY APPARATUS}

This specification relates to a display device.

Display devices used in computer monitors, TVs, mobile phones, etc. include organic light emitting displays (OLED) that emit light on their own, and liquid crystal displays (LCD) that require a separate light source. there is.

The scope of application of display devices is becoming more diverse, including not only computer monitors and TVs but also personal portable devices, and research is being conducted on display devices that have a large display area but reduced volume and weight.

Among display devices, there is a display device integrated with a touch screen that includes a touch portion that can recognize a user's touch. The touch screen-integrated display device allows information to be input directly using a finger or a pen, and is widely applied to navigation, portable terminals, and home appliances.

The inventors of this specification studied a touch screen-integrated display device that manufactures a touch screen panel together during the display panel manufacturing process. In relation to this, several studies are being conducted to enhance reliability to protect the touch area. When strengthening the reliability of a display device, there is a problem with the performance of the display device because it affects the luminance and transmittance characteristics of the display device.

Accordingly, the inventors of the present specification recognized the above-mentioned problems and conducted research to improve the luminance of the display device and improve the performance of the display device. Through various experiments, a new display device was invented that can improve the luminance of the display device and improve the performance of the display device.

The problem to be solved according to the embodiments of the present specification is to provide a display device that can improve the reliability of the display device while improving luminance, light transmittance, and viewing angle characteristics.

The problems to be solved according to the embodiments of the present specification are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

A display device according to an embodiment of the present specification includes a substrate including a display area and a non-display area, a plurality of sub-pixels disposed in the display area and including an emission area and a non-emission area, a thin film transistor on the substrate, and a thin film transistor. A plurality of light emitting elements on the plurality of light emitting elements, an encapsulation part on the plurality of light emitting elements, at least one protective layer disposed on the encapsulation part, a first touch electrode on the encapsulation part, and a second touch on the first touch electrode. It includes an organic insulating layer on the electrode and the second touch electrode. In at least one sub-pixel among the plurality of sub-pixels, at least one protective layer and an organic insulating layer may have at least one open area in an area corresponding to the light-emitting area.

A display device according to an embodiment of the present specification includes a substrate including a display area and a non-display area, a plurality of sub-pixels disposed in the display area and including an emission area and a non-emission area, a thin film transistor on the substrate, and a thin film transistor. A plurality of light-emitting elements on the surface, an encapsulation unit disposed on the plurality of light-emitting elements, at least one protective layer disposed on the encapsulation unit, a first touch electrode disposed on the encapsulation unit, and a first touch electrode disposed on the first touch electrode. At least one protective layer in at least one sub-pixel of the second touch electrode and the plurality of sub-pixels may have at least one hole in an area corresponding to the light-emitting area.

Specific details of other embodiments are included in the detailed description and drawings.

According to an embodiment of the present specification, the luminance of the display device can be improved by lowering the thickness of the inorganic protective layer in the light-emitting area applied to the display device, and thus the performance of the display device can be improved.

According to an embodiment of the present specification, the inorganic protective layer on the light emitting device is configured to have a low flow rate ratio, thereby protecting the touch portion and providing a display device with improved reliability.

According to an embodiment of the present specification, a display device that improves reliability and prevents a decrease in transmittance by utilizing an existing process without adding an additional process by changing the mask can be provided.

The effects of the present specification are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

Since the content of the invention described in the problem to be solved, the means for solving the problem, and the effect described above do not specify the essential features of the claim, the scope of the claim is not limited by the matters described in the content of the invention.

1 is a diagram showing a display device according to an embodiment of the present specification.
Figure 2 is an exploded perspective view showing a display device according to an embodiment of the present specification.
Figure 3 is a plan view of a display device according to an embodiment of the present specification.
FIG. 4 is a cross-sectional view taken along line II' of FIG. 3.
Figure 5 is an enlarged plan view of an example of a touch unit according to an embodiment of the present specification.
Figure 6 is a diagram showing transmittance according to an experimental example of the present specification.
FIG. 7 is a cross-sectional view of the display device taken along line II-II′ of FIG. 3 according to an embodiment of the present specification.
FIG. 8 is a cross-sectional view of a display device taken along line II-II′ of FIG. 3 according to another embodiment of the present specification.

The advantages and features of the present specification and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present specification is not limited to the embodiments disclosed below and will be implemented in various different forms, but the present embodiments only serve to ensure that the disclosure of the present specification is complete, and are common knowledge in the technical field to which the present specification pertains. It is provided to fully inform those who have the scope of the invention, and this specification is only defined by the scope of the claims.

The shape, size, ratio, angle, number, etc. disclosed in the drawings for explaining the embodiments of the present specification are illustrative, and the present specification is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present specification, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present specification, the detailed description will be omitted. When “includes,” “has,” “consists of,” etc. mentioned in the specification are used, other parts may be added unless “only” is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When analyzing a component, the error range is interpreted to include the error range even if there is no separate explicit description of the error range.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as “on top,” “at the top,” “at the bottom,” “next to,” etc., for example, “right away.” Alternatively, there may be one or more other parts between the two parts, unless "directly" is used.

In the case of a description of a temporal relationship, if a temporal relationship is described with words such as “after,” “successfully,” “next,” “before,” etc., unless “immediately” or “directly” is used, they are not consecutive. Cases may also be included.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical idea of the present specification.

In describing the components of this specification, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, order, or number of the components are not limited by the term. When a component is described as being “connected,” “coupled,” or “connected” to another component, that component may be connected or connected to that other component directly, but indirectly, unless specifically stated otherwise. It should be understood that other components may be “interposed” between each component that is connected or capable of being connected.

“At least one” should be understood to include any combination of one or more of the associated elements. For example, “at least one of the first, second, and third components” means not only the first, second, or third component, but also two of the first, second, and third components. It can be said to include a combination of all or more components.

In this specification, “display device” refers to a liquid crystal module (LCM), an organic light emitting module (OLED module), and a quantum dot module including a display panel and a driver for driving the display panel. It may include a display device. Also, it includes laptop computers, televisions, computer monitors, automotive display apparatus, or other types of vehicles that are complete products or final products, including LCM, OLED modules, and QD modules. It may also include a set electronic apparatus or set apparatus, such as an equipment display apparatus, a mobile electronic apparatus such as a smartphone or an electronic pad.

Accordingly, the display device in this specification includes the display device itself in a narrow sense, such as an LCM, an OLED module, and a QD module, and a set device that is an application product or end-consumer device including an LCM, an OLED module, and a QD module. You can.

In some cases, the LCM, OLED module, and QD module consisting of a display panel and driving unit are expressed as a "display device" in the narrow sense, and the electronic device as a finished product including the LCM, OLED module, and QD module is a "set device." It can also be expressed separately. For example, a display device in the narrow sense includes a display panel of liquid crystal (LCD), organic light emitting (OLED), or quantum dot (Quantum Dot), and a source PCB that is a control unit for driving the display panel, and the set device is connected to the source PCB. It may further include a set PCB, which is a set control unit that is electrically connected and controls the entire set device.

Display panels used in the embodiments of the present specification include liquid crystal display panels, organic light emitting diode (OLED) display panels, quantum dot (QD) display panels, and electroluminescent display panels. Any type of display panel can be used. The display panel of this embodiment is not limited to a specific display panel capable of bezel bending using a flexible substrate for an organic electroluminescence (OLED) display panel and a support structure of a lower support member. Also, the shape or size of the display panel used in the display device according to the embodiment of the present specification is not limited.

For example, if the display panel is an organic electroluminescence (OLED) display panel, it may include a plurality of gate lines, data lines, and pixels formed in intersection areas of the gate lines and/or data lines. . And, an array including a thin film transistor (T), which is an element for selectively applying voltage to each pixel, a light-emitting device layer on the array, and an encapsulation substrate or encapsulation layer disposed on the array to cover the light-emitting device layer ( Encapsulation), etc. The encapsulation layer protects the thin film transistor (T) and the light emitting device layer from external shock, and can prevent moisture or oxygen from penetrating into the light emitting device layer. Additionally, the layer formed on the array may include an inorganic light emitting layer, for example, a nano-sized material layer or quantum dots.

Each feature of the various embodiments of the present specification can be combined or combined with each other, partially or entirely, and various technological interconnections and operations are possible, and each embodiment may be implemented independently of each other or together in a related relationship. It may be possible.

Hereinafter, embodiments of the present specification will be examined through the attached drawings and examples. The scale of the components shown in the drawings is different from the actual scale for convenience of explanation, and is therefore not limited to the scale shown in the drawings.

1 is a diagram illustrating an example of the interior of a vehicle equipped with a display device according to an embodiment of the present specification.

The display device 1 may be placed on at least a portion of the vehicle's dashboard. The dashboard of a vehicle includes a component disposed in front of the front seats (eg, driver's seat, passenger seat) of the vehicle. For example, a vehicle's dashboard may have input configurations for operating various functions inside the vehicle (e.g., air conditioning, audio system, navigation system).

In an embodiment, the display device 1 may be disposed on a dashboard of a vehicle and operate as an input unit for operating at least some of the vehicle's various functions. The display device 1 displays various information related to the vehicle, such as vehicle operation information (e.g., current speed of the vehicle, remaining fuel amount, driving distance), and information about parts of the vehicle (e.g., damage to vehicle tires). can be provided.

In an embodiment, the display device 1 may be arranged across the driver's seat and passenger seat placed on the front seat of the vehicle. Users of the display device 1 may include the driver of the vehicle and a passenger riding in the passenger seat. Both the driver and passengers of the vehicle can use the display device 1.

In an embodiment, the display device 1 shown in FIG. 1 may only be partially shown. The display device 1 shown in FIG. 1 may represent a display panel among various components included in the display device 1. Among the components of the display device 1, components other than those shown in FIG. 1 may be mounted inside (or at least part of) the vehicle.

A display device mounted on a vehicle is an example for explaining the present specification, and embodiments of the present specification are not limited thereto.

Figure 2 is an exploded perspective view showing a display device according to an embodiment of the present specification.

For example, a display device according to an embodiment of the present specification may be mounted in the cockpit of a vehicle to provide the driver and passengers of the vehicle with images or images necessary for driving. However, it is not limited to this and may be used while carried by the user rather than mounted on a vehicle. Below, for example, a display device mounted on a vehicle will be described. A display device mounted on a vehicle is an example for explaining the present specification, and embodiments of the present specification are not limited thereto.

A display device according to an embodiment of the present specification may include a display panel 100, a guide panel 200, a printed circuit board 300, and a chip on film (COF) 400.

Images or images can be played on the display panel 100. The video or image that is played may be navigation information necessary for driving, video captured by a camera mounted on the vehicle, or various other contents needed by the driver or passengers.

The guide panel 200 may be disposed behind the display panel 100. The guide panel 200 may be disposed at the rearmost part of the display device. Various components of a display device including the display panel 100 may be mounted on the guide panel 200. Additionally, the guide panel 200 may be mounted in the cockpit area of a vehicle, and for this purpose, the guide panel 200 may be provided with necessary coupling structures such as screw holes.

The printed circuit board 300 may be electrically connected to the display panel 100. The printed circuit board 300 may be equipped with a device for communicating with external devices such as a camera or a vehicle's main control module, a device for driving the display panel 100 so that the display panel 100 reproduces an image or image, etc. , circuits may be provided, and various other active and passive elements may be provided.

One side of the chip-on-film 400 may be electrically connected to the display panel 100, and the other side may be electrically connected to the printed circuit board 300. A portion of the chip-on film 400 may be bent to surround the guide panel 200. Figure 2 shows a view of the chip-on-film 400 in an unfolded state.

The chip-on film 400 may be thin and made of a flexible material to enable bending. The chip-on-film 400 can electrically connect the display panel 100 and the printed circuit board 300. The chip-on-film 400 may be equipped with various active and passive elements, and may be equipped with a driving circuit that drives the display panel 100.

The driving circuit that drives the display panel 100 may be provided to be distributed on the printed circuit board 300 and the chip-on-film 400, respectively. The chip-on-film 400 may be provided with a driving chip that forms at least a portion of the driving circuit of the display panel 100. The chip-on-film 400 may be provided in plural numbers. Each chip-on-film 400 may be arranged to be spaced apart from each other.

The display device according to the embodiment of the present specification may further include a cover glass 10, a first adhesive layer 20, a functional film 30, a second adhesive layer 40, a support member 50, and a plate 60. You can. These components can be formed in a thin shape to produce a slim display panel.

The cover glass 10 may be disposed in front of the display panel 100 to protect the display panel 100. The cover glass 10 is made of a transparent material, so that light emitted from the cover glass 10 can pass through the cover glass 10.

The functional film 30 may include a wide angle adjustment structure to adjust the viewing range of the image displayed on the display panel 100. The wide angle adjustment structure may be provided in the functional film 30 in a trapezoidal pattern with the angle adjusted to suit the desired viewing range. The trapezoid-shaped pattern may be formed of a light-blocking material, and the embodiments of the present specification are not limited thereto. Additionally, the functional film may include a polarizer that controls display characteristics (e.g., external light reflection, color accuracy, brightness, etc.). In some cases, the functional film 30 may or may not be included in a pattern on the uppermost side of the display panel 100 or the inner surface of the cover member 20 without being separately configured. The embodiments of this specification are not limited thereto. The first adhesive layer 20 may be disposed between the cover glass 10 and the functional film 30. One side of the first adhesive layer 20 is adhered to the cover glass 10 and the other side is adhered to the functional film 30, so that the functional film 30 can be adhered to the cover glass 10.

The second adhesive layer 40 may be disposed between the functional film 30 and the display panel 100. One side of the second adhesive layer 40 is adhered to the functional film 30 and the other side is adhered to the display panel 100, so that the functional film 30 can be adhered to the display panel.

The first adhesive layer 20 and the second adhesive layer 40 have good adhesive strength and may be made of a transparent material, for example, OCA (Optically Clear Adhesive). The embodiments of this specification are not limited thereto.

The support member 50 may be disposed at the rear of the display panel 100 . The support member 50 is attached to the rear of the display panel 100 to prevent the display panel 100 from being bent and damaged. For example, the support member 50 can reinforce the rigidity of the display panel 100.

The support member 50 may be provided, for example, in the form of a film and attached to the display panel 100 . However, it is not limited to this.

The plate 60 may be disposed behind the support member 50 and in front of the guide panel 200. The plate 60 may be placed in contact with the back of the support member 50 and may function as a heat sink that cools the display panel 100 by dissipating heat generated in the display panel 100 to the outside.

The plate 60 is easy to manufacture through sheet metal processing, has a high heat transfer rate, and can be made of a material with excellent resistance, such as aluminum. The embodiments of this specification are not limited thereto.

Figure 3 is a plan view of a display device according to an embodiment of the present specification.

The display device 1 and the display panel 100 may include a display area (AA) and a non-display area (NA). The display area AA may be an area that includes a plurality of sub-pixels SP and displays an image.

The non-display area (NA) may include a pad area (PA) where pads are formed and a dam 130 . In this case, the dam 130 may be formed in plural, and separate dams 130 may be formed on different floors.

FIG. 4 is a cross-sectional view showing a portion of the display panel 100 included in the display device 1 according to an embodiment of the present specification.

FIG. 4 is a cross-sectional view taken along line II' of FIG. 3.

Figure 5 is an enlarged plan view of an example of a touch unit according to an embodiment of the present specification. For convenience of explanation, only the first touch electrode 164 and the second touch electrode 165 among the various components of the display device 100 are shown in FIG. 5 .

Referring to FIG. 4, the display device 100 according to an embodiment of the present specification includes a substrate 101, a thin film transistor (T), a planarization layer 107, a light emitting device 120, a bank 110, and a pad portion. It includes 140, dam 130, sealing part 150, and touch part 160.

A thin film transistor (T) is disposed on the substrate 101. The thin film transistor (T) transmits data voltage to a plurality of sub-pixels.

The substrate 101 supports various components of the display panel 100. The substrate 101 may be formed of a transparent insulating material, such as glass or plastic. When the substrate 101 is made of plastic, it may be referred to as a plastic film or a plastic substrate. For example, the substrate 101 may be in the form of a film containing one of polyimide-based polymer, polyester-based polymer, silicon-based polymer, acrylic polymer, polyolefin-based polymer, and copolymers thereof. Among these materials, polyimide is widely used as a plastic substrate because it can be applied to high-temperature processes and can be coated. The substrate (array substrate) includes elements and functional layers formed on the substrate 101, such as a switching TFT, a driving TFT connected to the switching TFT, a light emitting element 120 connected to the driving TFT, an encapsulation unit 150, etc. It is also referred to as a concept.

A buffer layer may be located on the substrate 101. The buffer layer is a functional layer to protect the thin film transistor (TFT) from impurities such as alkali ions leaking from the substrate 101 or lower layers. The buffer layer may be made of silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof, but embodiments of the present specification are not limited thereto.

A thin film transistor (T) may be disposed on the substrate 101 or the buffer layer. The thin film transistor (T) may include an active layer 102, a gate insulating layer 103, a gate electrode 104, an interlayer insulating layer 105, a source electrode 106, and a drain electrode 108. The active layer 102 is located on the substrate 101 or the buffer layer. The active layer 102 may be made of polysilicon (p-Si), in which case a predetermined area may be doped with impurities. Additionally, the active layer 102 may be made of amorphous silicon (a-Si) or various organic semiconductor materials such as pentacene. The active layer 102 may be made of oxide.

Depending on the structure of the thin film transistor T, the gate electrode 104 may be disposed on or below the active layer 102. The gate electrode 104 is made of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or these. It may be formed of an alloy, etc. The embodiments of this specification are not limited thereto.

A gate insulating layer 103 may be disposed between the active layer 102 and the gate electrode 104. The gate insulating layer 103 is a layer for insulating the gate electrode 104 and the active layer 102, and may be made of an insulating material. For example, the gate insulating layer 103 may be composed of a single or double layer of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

A source electrode 106 and a drain electrode 108 that are electrically connected to the active layer 102 and are spaced apart from each other may be disposed on the interlayer insulating layer 105. The source electrode 106 and the drain electrode 108 may be made of a conductive material, for example, copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or an alloy thereof. Not limited.

Depending on the structure of the transistor T, in order to insulate the gate electrode 104, the source electrode 106, and the drain electrode 108, between the gate electrode 104, the source electrode 106, and the drain electrode 108. An interlayer insulating layer 105, etc. may be further disposed, but is not limited thereto.

The planarization layer 107 may be located on the thin film transistor (T). The planarization layer 107 protects the thin film transistor (T) and flattens the top of the thin film transistor (T). The planarization layer 107 may be disposed in the display area AA, and the planarization layer 107 may not be disposed in all or part of the non-display area NA. The planarization layer 107 may be configured in various forms. The planarization layer 107 may be formed of an organic insulating film such as BCB (Benzocyclobutene) or acryl, or an inorganic insulating film such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be formed as a single layer or a double or multi-layer. Various modifications are possible, such as it may be composed of . The embodiments of this specification are not limited thereto. The planarization layer 107 may include a contact hole (CH) for electrically connecting the thin film transistor (T) and the light emitting device 120.

The light emitting element 120 is disposed on the planarization layer 107. A light-emitting device is a self-luminous device that emits light, and can be driven by receiving voltage from a transistor or the like. The light emitting device 120 may include a first electrode 112, a light emitting layer 114, and a second electrode 116.

For example, the light emitting device 120 includes a first electrode 112 formed on the planarization layer 107, a light emitting layer 114 located on the first electrode 112, and a second electrode located on the light emitting layer 114 ( 116). For example, the light-emitting device 120 is a self-luminous device that emits light, and can be driven by receiving voltage from a thin film transistor (T) or the like.

The first electrode 112 is electrically connected to the drain electrode 108 of the driving thin film transistor (T) through the contact hole (CH). The first electrode 112 may be made of a conductive material capable of supplying holes to the light emitting layer 114. When the display panel 100 is a top emission type, the first electrode 112 may be made of an opaque conductive material with high reflectivity. For example, the first electrode 112 may be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof. . The embodiments of this specification are not limited thereto.

A bank 110 is disposed on the first electrode 112 and the planarization layer 107. The bank 110 is an insulating layer that separates adjacent sub-pixels from each other. The bank 110 may be disposed to open a portion of the first electrode 112, and the bank 110 may be an organic insulating material disposed to cover an edge of the first electrode 112.

The bank 110 is formed in the remaining area excluding the light emitting area EA. Accordingly, the bank 110 may have a bank hole that exposes the first electrode 112 corresponding to the light emitting area. The bank 110 may be made of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), or an organic insulating material such as BCB, acrylic resin, or imide resin.

The light emitting layer 114 is disposed on the first electrode 112 exposed by the bank 110. The light-emitting layer 114 may include a light-emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer. The light-emitting layer may be composed of a single light-emitting layer structure that emits a single light, or may be composed of a plurality of light-emitting layers and emit white light by mixing the light emitted from the plurality of light-emitting layers.

Referring to FIG. 4, the light emitting layer 114 disposed in each sub-pixel is shown as being disposed separately for each sub-pixel, but is not limited thereto. For example, all or part of the light emitting layer 114 may be formed as one layer across a plurality of sub-pixels.

The second electrode 116 may be disposed on the light emitting layer 114. The second electrode 116 is made of a conductive material capable of supplying electrons to the light emitting layer 114. For example, the second electrode 116 is made of indium tin zinc oxide (ITZO), zinc oxide (ZnO), and tin oxide (Tin oxide (TO)) series of transparent conductive oxides or ytterbium (Yb). ) may be made of an alloy, and the embodiments of the present specification are not limited thereto. The second electrode 116 may be made of a very thin metal material, but is not limited thereto. When the display panel 100 is a top emission type, the second electrode 116 is made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or By being made of a transflective metal alloy such as MgAg alloy, light generated in the light emitting layer 114 can be emitted to the upper part of the second electrode 116.

Referring to FIG. 4, the second electrodes 116 disposed in each sub-pixel are shown as connected to each other, but, like the first electrode 112, they may be disposed separately for each sub-pixel, but are not limited thereto.

The light-emitting layer 114 may be an organic light-emitting layer made of organic material, but is not limited thereto. For example, the light emitting layer 114 may be a quantum dot light emitting layer or a micro LED.

The display area AA may include a plurality of emission areas EA and a non-emission area NEA between the plurality of emission areas EA.

The area where each of the plurality of light-emitting devices 120 is disposed may be a plurality of light-emitting areas EA. Each of the plurality of light emitting areas EA is an area capable of independently emitting light of one color, may be an area corresponding to a plurality of sub-pixels, and may be an area in which the bank 110 is not disposed. For example, the plurality of light-emitting areas EA may include, but are not limited to, a red light-emitting area, a green light-emitting area, and a blue light-emitting area. The plurality of light emitting areas EA may be arranged to be spaced apart from each other, for example, may be arranged in a grid shape arranged in row and column directions, but is not limited thereto.

An area in which the plurality of light-emitting devices 120 are not disposed may be a non-emission area (NEA). The non-emission area (NEA) is an area disposed between the plurality of emitting areas (EA) and may be an area where the bank 110 is disposed. Since the non-emission area (NEA) is arranged to surround the plurality of light-emitting areas (EA), it may be formed in a mesh form.

A dam 130 is placed in the non-display area (NA). For example, the dam 130 may be disposed on the substrate 101 in the non-display area (NA). The dam 130 is disposed to control the spread of the organic encapsulation layer 152 in the encapsulation portion 150 disposed to cover the display area AA. For example, the dam 130 may suppress overflow of the organic encapsulation layer 152 of the encapsulation portion 150. One or more dams 130 may be configured, and the number of dams deployed is not limited.

The pad portion 140 is disposed in the non-display area (NA). The pad portion 140 may be disposed outside the dam 130. A signal can be input to the circuit part or driver IC formed on the substrate 101 through the pad part 140. For example, the pad unit 140 may supply signals supplied from the outside to the circuit unit of the substrate 101, a driving IC, etc. For example, the pad unit 140 may supply a signal for driving the touch unit 160 to the touch unit 160 and receive a signal for a user's touch input from the touch unit 160.

An encapsulation portion 150 is disposed on the light emitting device 120. The encapsulation unit 150 is a sealing member that protects the light emitting material and electrode material of the light emitting device 120 from external moisture, oxygen, shock, etc. in order to prevent oxidation. The encapsulation portion 150 may be arranged to cover the entire display area AA where the light emitting device 120 is disposed, and the encapsulation portion 150 may be a portion of the non-display area NA extending from the display area AA. It can be arranged to cover up to. The encapsulation portion 150 is disposed on the first inorganic encapsulation layer 151 and the first inorganic encapsulation layer 151 made of an inorganic material, and on the organic encapsulation layer 152 and the organic encapsulation layer 152 made of an organic material. It may include a second inorganic encapsulation layer 153.

The first inorganic encapsulation layer 151 seals the display area AA and protects the light emitting device 120 from oxygen and moisture penetrating into the display area AA. The first inorganic encapsulation layer 151 may be disposed not only in the display area (AA) but also in the non-display area (NA) extending from the display area (AA), and may form a dam 130, etc. in the non-display area (NA). It can be arranged to cover. The first inorganic encapsulation layer 151 may be made of an inorganic material, for example, silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), etc., but is not limited thereto.

The organic encapsulation layer 152 is disposed on the first inorganic encapsulation layer 151. The organic encapsulation layer 152 is a layer for flattening the upper part of the first inorganic encapsulation layer 151, filling cracks that may occur in the first inorganic encapsulation layer 151, and forming a layer on the first inorganic encapsulation layer 151. If foreign matter is formed, the top of the foreign matter can be flattened. The organic encapsulation layer 152 may be disposed in the display area AA and a portion of the non-display area NA extending from the display area AA, and may be disposed inside the dam 130 . The organic encapsulation layer 152 may be made of an epoxy-based or acryl-based polymer, but is not limited thereto.

A second inorganic encapsulation layer 153 is disposed on the organic encapsulation layer 152. The second inorganic encapsulation layer 153 may seal the organic encapsulation layer 152 together with the first inorganic encapsulation layer 151 in a manner that contacts the first inorganic encapsulation layer 151 at the outer portion of the display device 100. there is. The second inorganic encapsulation layer 153 may be disposed to a portion of the non-display area (NA) extending from the display area (AA), and the second inorganic encapsulation layer 153 may be disposed on the first inorganic encapsulation layer (153) disposed in the non-display area (NA). It may be placed in contact with the inorganic encapsulation layer 151. The second inorganic encapsulation layer 153 may be made of an inorganic material, for example, silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), etc., but is not limited thereto.

In Figure 4, the encapsulation part 150 is shown as including a first inorganic encapsulation layer 151, an organic encapsulation layer 152, and a second inorganic encapsulation layer 153. However, the inorganic encapsulation included in the encapsulation part 150 The number of layers 151 and 153 and the number of organic encapsulation layers 152 are not limited thereto.

The touch unit 160 is disposed on the sealing unit 150. The touch unit 160 may be disposed in the display area AA including the light emitting device 120 to sense a touch input. The touch unit 160 can detect external touch information using the user's finger or a touch pen. The touch unit 160 includes a first protective layer 161, a second protective layer 162, a third protective layer 166, an organic insulating layer 167, a first touch electrode 164, and a second touch electrode ( 165) may be included.

A first protective layer 161 may be disposed on the sealing portion 150. The first protective layer 161 may be in contact with the second inorganic encapsulation layer 153 of the encapsulation portion 150. The first protective layer 161 may be made of an inorganic material. For example, it may be made of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiONx), and the embodiments of the present specification are not limited thereto.

The first touch electrode 164 is disposed on the first protective layer 161. The first touch electrode 164 is disposed on the first protective layer 161 in the non-emission area (NEA). Each of the first touch electrodes 164 may be spaced apart from each other and arranged in the X-axis direction and the Y-axis direction. For example, the first touch electrode 164 may include a plurality of patterns spaced apart from each other and arranged in the X-axis direction and a plurality of patterns arranged in the Y-axis direction. The first touch electrode 164 supplies a touch driving signal to drive the touch unit 160. Additionally, the first touch electrode 164 can transmit touch information detected by the touch unit 160 to the driving IC. The first touch electrode 164 may be formed in a mesh shape, but is not limited thereto. The first touch electrode 164 may be made of a metal material, but is not limited thereto.

A second protective layer 162 may be disposed on the first touch electrode 164 and the first protective layer 161. The second protective layer 162 can prevent short circuit of the first touch electrode 164 disposed adjacently.

A second touch electrode 165 may be disposed on the second protective layer 162. A third protective layer 166 may be disposed on the second protective layer 162 and the second touch electrode 165. The third protective layer 166 may be disposed to protect the touch unit 160, for example, the second touch electrode 165, and to provide a reliable display device. For example, in environments exposed to high temperatures, such as automotive display devices, a robust structure may be required for reliability. The second protective layer 162 and the third protective layer 166 may be made of an inorganic material. For example, it may be made of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiONx), but is not limited thereto.

The refractive index of the first protective layer 161, the refractive index of the second protective layer 162, and the refractive index of the third protective layer 166 are the refractive index of the first inorganic encapsulation layer 151 and the refractive index of the second inorganic encapsulation layer 153. It may be greater than the refractive index. For example, the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153 are formed with the flow rate of ammonia gas (NH3) set to 100%, and the first protective layer 161 and the second protective layer ( 162), the third protective layer 166 may be formed by setting the flow rate of ammonia gas (NH3) to 30%. Since the first protective layer 161 and the second protective layer 162 are disposed above the sealing portion 150, they are vulnerable to cracks and the flow rate of ammonia gas (NH3) can be configured to be small. In this way, when the inorganic protective layer is constructed by setting the flow rate of ammonia gas (NH3) differently, the physical properties of the inorganic protective layer may change depending on the flow rate of ammonia gas (NH3). For example, the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153 and the first protective layer 161 and the second protective layer 162 may have different refractive indices. For example, the refractive index of the first inorganic encapsulation layer 151 and the refractive index of the second inorganic encapsulation layer 153 may be about 1.85 to 1.86, and the refractive index of the first protective layer 161 and the refractive index of the second protective layer 162 ) may have a refractive index of about 1.97 to 1.99. Accordingly, when forming an inorganic protective layer by setting the flow rate of ammonia gas (NH3) differently, the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153, and the first protective layer 161 and the second protective layer Even if the material making up layer 162 is the same, the refractive index may be different.

Referring to FIGS. 4 and 5 , the second touch electrode 165 is disposed on the first touch electrode 164 and the second protective layer 162. The second touch electrode 165 may electrically connect disconnected portions of the first touch electrode 164 extending in the same direction. For example, referring to FIG. 5, among the first touch electrodes 164, the first touch electrode 164 extending in the X-axis direction has no disconnected portion, but the first touch electrode 164 extending in the Y-axis direction There is a disconnected portion for electrical insulation from the first touch electrode 164 extending in the X-axis direction. Accordingly, the second touch electrode 165 is disposed in the Y-axis direction and can electrically extend the disconnected first touch electrode 164. In FIG. 4, the second touch electrode 165 is shown as being disposed on the first touch electrode 164, but the present invention is not limited thereto. For example, the first touch electrode 164 may be disposed on the second touch electrode 165.

The second touch electrode 165 disposed at the outermost portion of the display area AA may extend to the pad portion 140 of the non-display area NA and be electrically connected to the pad portion 140. The second touch electrode 165 can detect the touch position on the display area AA, and can transmit touch information including the touch position to the pad unit 140. The embodiments of this specification are not limited thereto. For example, the touch unit 160 may be electrically connected to the pad unit 140 through a part other than the first touch electrode 164 and the second touch electrode 165, and the first touch electrode 164 It may be electrically connected to this pad portion 140.

Referring to FIGS. 2 and 4 , the printed circuit board 300 may be electrically connected to the display panel 100 through the chip-on-film 400 . The chip-on-film 400 can electrically connect the second touch electrode 165 and the pad portion 140. The chip-on-film 400 may be disposed on the second touch electrode 165. The chip-on film 400 may be disposed on the pad portion 140.

A conductive adhesive layer 395 may be disposed on the second touch electrode 165. A conductive adhesive layer 395 may be disposed on the pad portion 140.

The conductive adhesive layer 395 has adhesive properties and may include, for example, an anisotropic conductive film (ACF). An anisotropic conductive film may be a thin film made of resin containing conductive balls to provide electrical conductivity and adhesion between the top and bottom. The anisotropic conductive film has dispersed malleable particles, so it can play a role in passing electric current, and the resin can be hardened by heat and pressure to maintain adhesion.

The pad portion 140 and the second touch electrode 165 may be electrically connected to the chip-on-film 400 through the conductive adhesive layer 395. Accordingly, the third protective layer 166 and the organic insulating layer 167 may have an open area P on the pad portion 140.

A third protective layer 166 may be disposed on the second touch electrode 165 and the second protective layer 162. The third protective layer 166 may be disposed to protect the second touch electrode 165 and provide a reliable display device. For example, in environments exposed to high temperatures, such as automotive display devices, a robust structure may be required for reliability. An organic insulating layer 167 may be disposed on the third protective layer 166. The organic insulating layer 167 may protect components below the organic insulating layer 167. The organic insulating layer 167 may be made of an epoxy-based or acryl-based polymer, but is not limited thereto.

A polarizing plate may be further disposed on the touch unit 160. The polarizer is disposed on the touch unit 160 to reduce reflection of external light incident on the display device 100. Additionally, various optical films or protective films may be further disposed on the touch unit 160.

Figure 6 is a diagram showing transmittance according to an experimental example of the present specification. In Figure 6, the horizontal axis represents the wavelength, and the vertical axis represents the transmittance (%) for each wavelength. The inventor of this specification conducted an experiment by placing a silicon nitride (SiNx) inorganic unit film on a glass substrate and placing a photo acryl organic unit film on the silicon nitride (SiNx) inorganic unit film. In Experimental Examples A, B, and C, the flow rate of ammonia gas (NH ₃ ) of the silicon nitride (SiNx) inorganic unit film was set to 30%, 55%, and 70%, respectively, and then the transmittance for each wavelength was measured. Referring to FIG. 6, it was confirmed that as the flow rate of ammonia gas (NH ₃ ) of the silicon nitride (SiNx) inorganic unit film decreased, the transmittance in the blue wavelength region (454 nm) decreased. For example, in the case of Experimental Example A in which the flow rate of ammonia gas (NH ₃ ) of the silicon nitride (SiNx) inorganic unit film was 30%, the transmittance in the blue wavelength region (454 nm) decreased, resulting in a decrease in overall transmittance. You can check it. The more the first, second, and third protective layers 161, 162, and 166 contain less ammonia gas (NH ₃ ), the more robust they can be in terms of reliability. Considering the transmittance of the light emitting area, for example, luminous efficiency, the inorganic film protective layer can be minimized in the light emitting area.

FIG. 7 is a cross-sectional view of the display device taken along line II-II′ of FIG. 3 according to an embodiment of the present specification.

Hereinafter, description will be omitted for content that overlaps with the display device according to an embodiment of the present specification previously described with reference to FIGS. 4 and 5, and the description will focus on differences. Contents omitted in the following description may be directly applied to the embodiment of the present specification described with reference to FIGS. 4 and 5.

The display device of FIG. 7 is different from the display device of FIG. 4 only in the touch unit 170, and other structures are substantially the same, so duplicate description will be omitted.

Referring to FIG. 7, the first protective layer 171, the second protective layer 172, and the third protective layer 173 of the display device according to an embodiment of the present specification are areas that overlap the light emitting area EA. may include at least one open area 155. The open area 155 can be expressed as a hole or an opening. The first protective layer 171, the second protective layer 172, and the third protective layer 173 may be at least one protective layer 175. At least one protective layer 175 in at least one sub-pixel among the plurality of sub-pixels may have at least one hole in an area corresponding to the emission area EA. At least one protective layer 175 may include at least one open area 155. At least one protective layer 175 may include at least one or more of the first protective layer 171, the second protective layer 173, and the third protective layer 173. For example, at least one protective layer 175 may include all of the first protective layer 171, the second protective layer 172, and the third protective layer 173. For example, at least one protective layer 175 may include a first protective layer 171 and a second protective layer 172. The first protective layer 171, the second protective layer 172, and the third protective layer 173 may be made of an inorganic material. For example, it may be made of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), etc., but the embodiments of the present specification are not limited thereto.

The open area 155 of at least one protective layer 175 may be disposed in an area overlapping the light emitting area EA. The open area 155 of the at least one protective layer 175 may expose a portion of the structure disposed below the at least one protective layer 175 in an area overlapping the light emitting area EA. For example, at least one open area 155 of at least one protective layer 175 may expose a portion of the sealing portion 150.

An organic insulating layer 177 may be disposed on at least one protective layer 175 and the encapsulation portion 150. The organic insulating layer 177 may protect components below the organic insulating layer 177. For example, it may cover the touch part 170 of the non-emission area (NEA) and the encapsulation part 150 of the emissive area (EA). The organic insulating layer 177 may be made of an epoxy-based or acryl-based polymer, but is not limited thereto.

The area of at least one open area 155 of at least one protective layer 175 may be equal to or larger than the area of the light emitting area EA. For example, the end of the open area 155 of at least one protective layer 175 may be the same as the end of the light-emitting area EA, or may be disposed in the non-emission area NEA adjacent to the light-emitting area EA. there is. Accordingly, the area of the second inorganic encapsulation layer 153 exposed by the at least one open area 155 of the at least one protective layer 175 may also be equal to or larger than the area of the light emitting area EA.

The open area 155 of at least one protective layer 175 is disposed in the emission area EA of at least one sub-pixel among the plurality of sub-pixels. For example, the open area 155 of the at least one protective layer 175 is blue among the emission areas EA_R of the red sub-pixel, the emission area EA_G of the green sub-pixel, and the emission area EA_B of the blue sub-pixel. It may be placed in the emission area (EA_B) of the sub-pixel. Accordingly, the extraction efficiency of light emitted from the emission area (EA_B) of the blue sub-pixel can be improved.

Referring to FIG. 7, the second touch electrode 165 is disposed on the first touch electrode 164 and the second protective layer 172. The second touch electrode 165 may electrically connect disconnected portions of the first touch electrode 164 extending in the same direction.

Referring to FIG. 7 , at least one protective layer 175 of the touch unit 170 includes at least one open area 155. At least one open area 155 of at least one protective layer 175 according to an embodiment of the present specification may be disposed in each of a plurality of sub-pixels. For example, at least one open area 155 of the at least one protective layer 175 includes an emission area EA_R of the red sub-pixel, an emission area EA_G of the green sub-pixel, and an emission area EA_B of the blue sub-pixel. ) can be arranged to overlap each. Accordingly, at least one open area 155 of at least one protective layer 175 may expose a portion of the encapsulation portion 150 in each of the plurality of sub-pixels.

In a display device according to another embodiment of the present specification, by removing at least one protective layer 175 from each of a plurality of sub-pixels, a decrease in transmittance and viewing angle of each of the plurality of sub-pixels can be reduced. For example, at least one open area 155 of the at least one protective layer 175 includes an emission area EA_R of the red sub-pixel, an emission area EA_G of the green sub-pixel, and an emission area EA_B of the blue sub-pixel. ) can each be placed in an area that overlaps. Accordingly, the thickness of the inorganic insulating layer that changes the path of light emitted from the plurality of sub-pixels, for example, at least one protective layer 175, may be reduced. Accordingly, by disposing at least one open area 155 of at least one protective layer 175 in an area overlapping the light emitting area of each of the plurality of sub-pixels, the decrease in transmittance and viewing angle in the plurality of sub-pixels can be reduced. there is.

In the display device according to an embodiment of the present specification, at least one protective layer 175 is removed from the blue sub-pixel, thereby reducing transmittance and viewing angle deterioration in the blue sub-pixel. For example, the open area 155 of at least one protective layer 175 is disposed in an area overlapping with the emission area EA_B of the blue sub-pixel. The total thickness of the inorganic protective layer formed at a low flow rate of ammonia gas (NH3), for example, the third protective layer 173, may be reduced. Accordingly, the thickness of the inorganic protective layer that changes the path of light emitted from the blue sub-pixel can be reduced. Accordingly, by disposing the open area 155 of at least one protective layer 175 in an area overlapping with the emission area EA_B of the blue sub-pixel, it is possible to reduce transmittance and viewing angle deterioration in the blue sub-pixel.

Although the structure of the touch unit 170 has been described as being disposed on a flat part of the substrate 101, the touch unit 170 can also be applied to a bending area of the substrate 101. For example, in a display device having a bending area, at least one protective layer 175 may be formed by lowering the flow rate of ammonia gas (NH ₃ ) to reduce cracks and moisture permeation in the bending area. In this case, the physical properties and refractive index of at least one protective layer 175 may change. For example, compared to the case where the flow rate ratio of ammonia gas (NH ₃ ) is set to 100% to form at least one protective layer 175, the flow rate ratio of ammonia gas (NH ₃ ) is set to 30% to form at least one protective layer 175. When forming the protective layer 175, the refractive index of at least one protective layer 175 may increase. Accordingly, due to the characteristics of the at least one protective layer 175 and the characteristics of the blue wavelength, some of the light emitted from the blue sub-pixel may pass through the at least one protective layer 175 and the light path may change. Accordingly, the transmittance and viewing angle of the blue sub-pixel may decrease.

In some embodiments, when the display device is made of a flexible display device, the structure of the touch unit 170 described above may be applied to the entire area of the substrate 101. A flexible display device is a display device that can be freely bent or folded, and any area of the substrate 101 can be a bending area. Accordingly, by applying the structure of the touch unit 170 according to an embodiment of the present specification to the entire area of the substrate 101, stress occurring in the bending area can be reduced and reliability of the bending area can be improved.

Additionally, in some embodiments, when the display device is made of a foldable display device, the structure of the touch unit 170 described above may be applied to the folding area. A foldable display device is a display device that can be folded, and the folding area where the display device is folded can be a bending area. Accordingly, by applying the structure of the touch unit 170 of the present invention to the folding area of the substrate 101, stress occurring in the folding area can be reduced.

FIG. 8 is a cross-sectional view of a display device taken along line II-II′ of FIG. 3 according to another embodiment of the present specification.

Hereinafter, description will be omitted for content that overlaps with the display device according to an embodiment of the present specification previously described with reference to FIGS. 4, 5, and 7, and the description will focus on differences. Contents omitted in the following description may be directly applied to an embodiment of the present specification described with reference to FIGS. 4, 5, and 7. The display device of FIG. 7 has a different touch unit 190 compared to the display device of FIGS. 4 and 7 and other configurations are substantially the same, so duplicate description will be omitted.

Referring to FIG. 8, the open area 157 of at least one protective layer 185 and the open area 159 of the organic insulating layer 187 may be disposed in a plurality of sub-pixels. At least one protective layer 185 may include at least one of the first protective layer 181, the second protective layer 182, and the third protective layer 183. For example, at least one open area 157 of the at least one protective layer 185 and the open area 159 of the organic insulating layer 187 are the emission area EA_R of the red sub-pixel and the emission area EA_R of the green sub-pixel. It may be arranged to overlap each of the area EA_G and the emission area EA_B of the blue sub-pixel.

At least one protective layer 185 and the organic insulating layer 187 may be disposed in the non-emissive area (NEA), and each open area may be disposed in the emissive area (EA). Since the non-emissive area (NEA) is arranged to surround the plurality of light-emitting areas (EA), at least one protective layer 185 and the organic insulating layer 187 may have a mesh structure.

Referring to FIG. 8 , at least one open area 157 of at least one protective layer 185 may be disposed in an area that overlaps the open area 159 of the organic insulating layer 187 . For example, at least one open area 157 of at least one protective layer 185 is an area that overlaps the light emitting area EA and the open area 159 of the organic insulating layer 187 in each of the plurality of sub-pixels. can be placed in Accordingly, at least one open area 157 of at least one protective layer 185 may expose a portion of the structure disposed below the at least one protective layer 185. For example, at least one open area 157 of at least one protective layer 185 may expose a portion of the encapsulation portion 150 in each of the plurality of sub-pixels.

At least one open area 157 of at least one protective layer 185 may be disposed in a plurality of sub-pixels. For example, at least one open area 157 of the at least one protective layer 185 includes an emission area EA_R of the red sub-pixel, an emission area EA_G of the green sub-pixel, and an emission area EA_B of the blue sub-pixel. ) can be placed respectively. Accordingly, the extraction efficiency of light emitted from the emission areas of the red sub-pixel, green sub-pixel, and blue sub-pixel can be improved.

A display device according to another embodiment of the present specification removes at least one protective layer 185 and an organic insulating layer 187 from an area corresponding to the emission area EA of each of a plurality of sub-pixels, thereby forming a plurality of sub-pixels. Deterioration in transmittance and viewing angle can be reduced in each case. For example, at least one open area 157 of the at least one protective layer 185 and the open area 159 of the organic insulating layer 187 are the light emission area EA_R of the red sub-pixel and the light emission area EA_R of the green sub-pixel. It may be disposed in an area overlapping with the area EA_G and the emission area EA_B of the blue sub-pixel, respectively. Accordingly, the thickness of the inorganic insulating layer that changes the path of light emitted from the plurality of sub-pixels, for example, at least one protective layer 185, may be reduced. Accordingly, at least one open area 157 of the at least one protective layer 185 and the open area 159 of the organic insulating layer 187 are respectively disposed in an area overlapping the emission area of each of the plurality of sub-pixels, Deterioration in transmittance and viewing angle in a plurality of sub-pixels can be reduced.

Referring to FIGS. 4 and 8 , according to an embodiment of the present specification, the extraction efficiency of light emitted from the light emitting area can be improved by utilizing an existing process without an additional process.

Referring to FIG. 4, an open area (P) in which the first protective layer 161, the second protective layer 162, the third protective layer 166, and the organic insulating layer 167 are not disposed on the pad portion 140. ) can be. This may be because in order to attach the chip on film 400 (COF) of FIG. 2, the uppermost metal electrode must be exposed. The pad portion 140 and the second touch electrode 165 may be electrically connected to the chip-on-film 400 through the conductive adhesive layer 395. Accordingly, the third protective layer 183 and the organic insulating layer 187 may have an open area P on the pad portion 140.

At least one open area 157 of the at least one protective layer 185 and the open area 159 of the organic insulating layer 187 in the area overlapping the light emitting area of each of the plurality of sub-pixels include a pad portion 140, For example, it may be formed through a process of forming the open area P of the pad portion 140. For example, it can be configured by an open area (P) process of the pad portion 140 without a separate additional process. According to an embodiment of the present specification, an emission area (EA) may be additionally configured on the mask. According to an embodiment of the present specification, after constructing the organic insulating layer 187, if the entire dry etching process is performed, the pad portion 140 and the light emitting area excluding the area where the organic insulating layer 187 is disposed (EA) can have an open area. Extraction efficiency of light emitted from the light emitting area (EA) by removing at least one protective layer 185 or organic insulating layer 187 that may cause a decrease in transmittance in the light emitting area (EA) using an existing process without an additional process can be improved.

Display devices according to embodiments of the present specification include mobile devices, video phones, smart watches, watch phones, wearable apparatus, foldable apparatus, and rollable devices. apparatus, bendable apparatus, flexible apparatus, curved apparatus, sliding apparatus, variable apparatus, electronic notebook, e-book, PMP (portable multimedia) player, PDA (personal digital assistant), MP3 player, mobile medical device, desktop PC, laptop PC, netbook computer, workstation, navigation, car navigation, car It can be applied to display devices, vehicle devices, theater devices, theater display devices, televisions, wallpaper devices, signage devices, game devices, laptops, monitors, cameras, camcorders, and home appliances. Additionally, the display device of this specification can be applied to an organic light emitting lighting device or an inorganic light emitting lighting device.

A display device according to an embodiment of the present specification can be described as follows.

A display device according to an embodiment of the present specification includes a substrate including a display area and a non-display area, a plurality of sub-pixels disposed in the display area and including an emission area and a non-emission area, a thin film transistor on the substrate, and a thin film transistor. A plurality of light emitting elements on the plurality of light emitting elements, an encapsulation part on the plurality of light emitting elements, at least one protective layer disposed on the encapsulation part, a first touch electrode on the encapsulation part, and a second touch on the first touch electrode. It includes an organic insulating layer on the electrode and the second touch electrode. In at least one sub-pixel among the plurality of sub-pixels, at least one protective layer and an organic insulating layer may have at least one open area in an area corresponding to the light-emitting area.

According to some embodiments of the present specification, the at least one protective layer may include a first protective layer, a second protective layer, and a third protective layer. The first touch electrode is on the first protective layer, the second protective layer is on the first touch electrode, the second touch electrode is on the second protective layer, and the third protective layer is on the second touch electrode. It may be on the table.

According to some embodiments of the present specification, at least one protective layer may include silicon nitride (SiNx).

According to some embodiments of the present specification, the non-display area further includes a pad portion,

The third protective layer and the organic insulating layer have an open area on the pad portion,

The pad portion and the second touch electrode may be electrically connected to the chip-on-film through a conductive adhesive layer.

According to some embodiments of the present specification, the area of the open area of the at least one protective layer and the organic insulating layer may be equal to or larger than the area of the light emitting area.

According to some embodiments of the present specification, at least one protective layer and at least one organic insulating layer may be disposed in each of a plurality of sub-pixels.

According to some embodiments of the present specification, at least one protective layer and an organic insulating layer may be configured in a mesh structure.

According to some embodiments of the present specification, the sub-pixel in which the open area of at least one protective layer and the organic insulating layer is disposed may be a blue sub-pixel.

A display device according to an embodiment of the present specification includes a substrate including a display area and a non-display area, a plurality of sub-pixels disposed in the display area and including an emission area and a non-emission area, a thin film transistor on the substrate, and a thin film transistor. A plurality of light-emitting devices on the image, an encapsulation portion disposed on the plurality of light-emitting devices, at least one protective layer disposed on the encapsulation portion, a first touch electrode disposed on the encapsulation portion, and an encapsulation portion disposed on the first touch electrode. At least one protective layer in at least one sub-pixel of the second touch electrode and the plurality of sub-pixels may have at least one hole in an area corresponding to the light-emitting area.

According to some embodiments of the present specification, the at least one protective layer is disposed in a non-emissive area, the at least one protective layer includes a first protective layer, a second protective layer, and a third protective layer, and the first touch An electrode may be disposed on the first protective layer, a second touch electrode may be disposed on the second protective layer, and the second touch electrode and the third protective layer may be disposed on the second touch electrode.

According to some embodiments of the present specification, the area of the hole in at least one protective layer may be equal to or larger than the area of the light emitting area.

According to some embodiments of the present specification, at least one protective layer may be disposed in each of a plurality of sub-pixels.

According to some embodiments of the present specification, at least one protective layer may have a mesh structure.

According to some embodiments of the present specification, the sub-pixel in which at least one hole of the protective layer is disposed may be a blue sub-pixel.

A display device according to an embodiment of the present specification includes a substrate including a display area and a non-display area, a plurality of sub-pixels disposed in the display area and including a light-emitting area and a non-light-emitting area, and a plurality of light-emitting elements disposed on the substrate. , at least one protective layer disposed on the top of the plurality of light-emitting devices, a touch portion disposed in a non-emission area on the top of the plurality of light-emitting devices, and at least an area corresponding to the light-emitting area of at least one sub-pixel among the plurality of sub-pixels. It has one open area, and the open area may be formed in the at least one protective layer.

According to some embodiments of the present specification, the touch unit may include a first touch electrode and a second touch electrode disposed on the first touch electrode.

According to some embodiments of the present specification, it further includes an organic insulating layer formed on the second touch electrode, and the open area may be included in the organic insulating layer.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

1: display device
100: display panel
101: substrate
111: Flattening layer
110: bank
120: light emitting element
130: Dam
140: Pad part
150: Encapsulation part
160,170,190: Touch part
161,171,181: first protective layer
162,172,182: second protective layer
166,173,183: Third protective layer
167,177: Organic insulating layer
164: first touch electrode
165: second touch electrode
AA: display area
NA: Non-display area
EA: luminous area
NEA: Non-emissive area
TFT: thin film transistor
CH: Contact hole

Claims (19)

A substrate including a display area and a non-display area;
a plurality of sub-pixels disposed in the display area and including an emission area and a non-emission area;
a thin film transistor on the substrate;
a plurality of light emitting elements on the thin film transistor;
an encapsulation portion on the plurality of light emitting elements;
at least one protective layer disposed on the sealing portion;
a first touch electrode on the sealing portion;
a second touch electrode on the first touch electrode; and
Comprising an organic insulating layer on the second touch electrode,
In at least one sub-pixel of the plurality of sub-pixels, the at least one protective layer and the organic insulating layer have at least one open area in a region corresponding to the light-emitting area.
According to claim 1,
The at least one protective layer includes a first protective layer, a second protective layer, and a third protective layer,
The first touch electrode is on the first protective layer,
The second protective layer is on the first touch electrode,
The second touch electrode is on the second protective layer,
The third protective layer is on the second touch electrode.
According to claim 1,
The display device wherein the at least one protective layer includes silicon nitride (SiNx).
According to claim 2,
The non-display area further includes a pad portion,
The third protective layer and the organic insulating layer have the open area on the pad portion,
The display device wherein the pad portion and the second touch electrode are electrically connected to the chip-on-film through a conductive adhesive layer.
According to claim 1,
An area of the open area of the at least one protective layer and the organic insulating layer is equal to or greater than an area of the light emitting area.
According to claim 1,
The display device wherein the at least one protective layer and the organic insulating layer are disposed in each of the plurality of sub-pixels.
According to claim 1,
The display device wherein the at least one protective layer and the organic insulating layer have a mesh structure.
According to claim 1,
A sub-pixel in which the at least one protective layer and the open area of the organic insulating layer are disposed is a blue sub-pixel.
A substrate including a display area and a non-display area;
a plurality of sub-pixels disposed in the display area and including an emission area and a non-emission area;
a thin film transistor on the substrate;
a plurality of light emitting elements on the thin film transistor;
an encapsulation portion disposed on the plurality of light emitting devices;
at least one protective layer disposed on the sealing portion;
a first touch electrode disposed on the sealing portion;
a second touch electrode disposed on the first touch electrode; and
In at least one sub-pixel of the plurality of sub-pixels, the at least one protective layer has at least one hole in a region corresponding to the light-emitting region.
According to clause 9,
The at least one protective layer is disposed in a non-emissive area,
The at least one protective layer includes a first protective layer, a second protective layer, and a third protective layer,
The first touch electrode is disposed on the first protective layer,
The second touch electrode is disposed on the second protective layer and includes: a second touch electrode; and
The third protective layer is disposed on the second touch electrode.
According to clause 9,
The display device wherein the at least one protective layer includes silicon nitride (SiNx).
According to claim 10,
The non-display area further includes a pad portion,
The third protective layer and the organic insulating layer have an open area on the pad portion,
The display device wherein the pad portion and the second touch electrode are electrically connected to the chip-on-film through a conductive adhesive layer.
According to claim 10,
The display device wherein the area of the hole in the at least one protective layer is equal to or larger than the area of the light emitting area.
According to claim 10,
The display device wherein the at least one protective layer is disposed in each of the plurality of sub-pixels.
According to claim 10,
The display device wherein the at least one protective layer has a mesh structure.
According to claim 10,
The sub-pixel in which the hole of the at least one protective layer is disposed is a blue sub-pixel.
A substrate including a display area and a non-display area;
a plurality of sub-pixels disposed in the display area and including an emission area and a non-emission area;
a plurality of light emitting devices disposed on the substrate;
at least one protective layer disposed on top of the plurality of light emitting devices;
a touch unit disposed in a non-emission area on top of the plurality of light emitting devices; and
having at least one open area in an area corresponding to a light emitting area of at least one sub-pixel among the plurality of sub-pixels,
The display device wherein the open area is formed in the at least one protective layer.
According to claim 17,
The touch unit includes a first touch electrode; and
A display device comprising a second touch electrode disposed on the first touch electrode.
According to claim 18,
Further comprising an organic insulating layer formed on the second touch electrode,
The display device wherein the open area is formed in the organic insulating layer.