KR20240058907A - Work measuring device and work measuring method - Google Patents

Abstract

The work measurement device includes a first light source that irradiates line light to the work, a second light source that irradiates normal illumination light to the work, an imaging unit of the work, a moving mechanism that moves the work, a control unit, and an image of the work based on the image acquired by the imaging unit. It is provided with a measurement unit that obtains two-dimensional data and three-dimensional data. The control unit causes the imaging unit to perform an imaging operation of the workpiece while moving the workpiece by the moving mechanism and turning on the first light source and the second light source simultaneously. The measurement unit extracts image data corresponding to the position of interest of the work from each of the sequentially captured images, and arranges the extracted image data in time series to generate a luminance distribution map of the position of interest, and generates a luminance distribution map of the position of interest. Based on this, two-dimensional data and three-dimensional data of the location of interest are derived.

Description

Work measuring device and work measuring method

The present invention relates to a work measurement device and measurement method for acquiring two-dimensional data and three-dimensional data of a workpiece to be measured.

The optical cutting method is known as a method for measuring the height of a workpiece non-contactly. In the optical cutting method, a workpiece irradiated with line light is scanned and imaged, and the height of the workpiece is determined from the captured image using the principle of triangulation. Patent Document 1 discloses a three-dimensional shape measuring device for a workpiece using an optical cutting method. In the measurement device of Patent Document 1, the luminance values of pixels of a point of interest in an image obtained by scanning are arranged in time series, and the change in luminance of the point of interest is determined.

Patent Document 2 discloses a device that generates a three-dimensional model of a workpiece from the three-dimensional shape of the workpiece and a two-dimensional texture image. In order to simultaneously acquire three-dimensional data and two-dimensional data of a workpiece, the measuring device of Patent Document 2 includes a first light source and a first light receiving unit for three-dimensional measurement, a second light source for two-dimensional measurement and a different wavelength from the first light source, and It is provided with a second light receiving unit.

However, when a measuring device that obtains only three-dimensional data of a workpiece is used, as in Patent Document 1, a separate measurement process for the workpiece is required to obtain two-dimensional data of the workpiece. On the other hand, according to the measurement device of Patent Document 2, a light source and a camera are required for three-dimensional measurement and two-dimensional measurement of the workpiece, respectively, making the device complicated.

Japanese Patent Publication No. 2015-105883 Japanese Patent Publication No. 2006-162386

The purpose of the present invention is to provide a work measuring device and measuring method that can measure two-dimensional data and three-dimensional data of a workpiece with good workability and without complicating the device.

A work measuring device according to one aspect of the present invention includes a first light source for irradiating line light to a workpiece to be measured, a second light source for irradiating normal illumination light to the workpiece, and irradiating the line light and the normal illumination light. an imaging unit capable of acquiring images of the workpiece and its surroundings, a moving mechanism that relatively moves the workpiece in a predetermined transport direction, and operations of the imaging unit, the first light source, the second light source, and the moving mechanism It has a control unit that controls and a measurement unit that obtains two-dimensional data and three-dimensional data about the workpiece based on the image acquired by the imaging unit, and the control unit moves the workpiece by the moving mechanism, while moving the first light source and the workpiece. With the second light source turned on simultaneously, the imaging unit is made to perform an imaging operation of the workpiece in units of a predetermined camera scale, and the measurement unit determines the position of interest of the workpiece from each of the sequentially captured images in units of the camera scale. In addition to extracting image data corresponding to Derive.

A work measurement method according to another aspect of the present invention is a work measurement method for acquiring two-dimensional data and three-dimensional data of a workpiece to be measured, wherein line light and normal illumination light are simultaneously irradiated on the workpiece while moving the workpiece, and the workpiece is irradiated at a predetermined level. Acquire images of the work in units of camera scale, extract image data corresponding to the position of interest in the work from each of the sequentially captured images in units of camera scale, and sort the extracted image data in time series. By listing the positions of interest, a luminance distribution map is generated, and based on the luminance distribution map, two-dimensional data and three-dimensional data of the positions of interest are derived.

1 is a schematic diagram briefly showing the hard configuration of a work measuring device according to an embodiment of the present invention.
Figure 2 is a block diagram showing the electrical configuration of the work measuring device.
3(A) to 3(C) are schematic diagrams showing a method of measuring the height of a workpiece by an optical cutting method.
FIG. 4A is a diagram showing an imaging situation for a position of interest on a workpiece.
FIG. 4B is a diagram showing an imaging situation for a position of interest on a workpiece.
FIG. 4C is a diagram showing an imaging situation for a position of interest on a workpiece.
FIG. 4D is a diagram showing an imaging situation for a position of interest on a workpiece.
FIG. 5(A) is a diagram showing an example of a luminance distribution map of the position of interest, and FIG. 5(B) is a graph showing luminance values along the line VB-VB in FIG. 5(A).
6(A) to 6(E) are diagrams for explaining the process of deriving two-dimensional and three-dimensional data of a work from the luminance distribution map.
Fig. 7 is a flowchart showing the derivation process of two-dimensional data and three-dimensional data of a workpiece using the workpiece measuring device of this embodiment.
8(A) to 8(D) are diagrams for explaining the process of deriving two-dimensional data and three-dimensional data of a work from a luminance distribution map according to a modified example.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings. The work measuring device according to the present invention can be widely applied to two-dimensional measurement and three-dimensional measurement of workpieces to be measured, such as various industrial products, semi-finished products, machine parts, electronic parts, food, agricultural products, etc. For example, when performing two-dimensional or three-dimensional measurement of a component mounted on a board as a workpiece, the workpiece measurement device of the present invention is preferable.

[Device Configuration]

1 is a schematic diagram schematically showing the hardware configuration of the work measuring device 1 according to the present embodiment. The work measuring device 1 includes a first light source 2, a second light source 3, a camera device 4 (imaging unit), a movement motor 5 (movement mechanism), and a control unit 6. The work measurement device 1 is a device that derives two-dimensional data (luminance measurement data) and three-dimensional data (height measurement data) of the work W on the base 51. Here, an example is shown in which the mouse as the work W is placed on the base 51. The surface of the base 51 becomes a reference height surface when measuring height. When the work W is a component on a mounting board, the base 51 becomes a board on which the component is mounted.

The first light source 2 is a light source that generates slit-shaped light, and radiates line light SL to the workpiece W to be measured. For example, as the first light source 2, a light source device including a laser light source and an optical component that converts the laser light emitted by the laser light source into slit light that spreads into a fan shape can be applied. This embodiment shows an example in which the first light source 2 is arranged to irradiate the line light SL from vertically above the work W.

The second light source 3 normally irradiates the workpiece W with illumination light TL. In FIG. 1, for the sake of simplification, the normal illumination light TL is shown in the form of diffused light widening in a cone shape, but in reality, the normal illumination light TL is an omnidirectional illumination light that can irradiate light from all directions with respect to the work W. The second light source 3 can be, for example, a light source device in which a substrate on which a plurality of LEDs are mounted in a matrix is arranged in an annular manner with different orientation directions. There are no particular restrictions on the arrangement of the second light source 3 as long as it is possible to irradiate the work W with non-directional illumination light.

The camera device 4 acquires images of the work W and its surroundings illuminated with line light SL and normal illumination light TL. The camera device 4 has an imaging optical axis AX inclined with respect to the vertical direction of the base 51. That is, the camera device 4 has an imaging optical axis AX inclined with respect to the projection axis of the line light SL. These axis arrangements are for measuring the three-dimensional shape of the work W by optical cutting. On the other hand, the imaging optical axis AX may be arranged in a vertical direction, and the projection axis of the line light SL may be arranged at an angle with respect to the imaging optical axis AX.

The movement motor 5 is a driving source of a movement mechanism that relatively moves the work W in the predetermined work transfer direction F. As a form of relative movement of the work W, the measuring systems of the first light source 2, the second light source 3, and the camera device 4 are set in a fixed arrangement, and the work W and the base 51 are moved in the work transfer direction. A form of moving in (F) and a form of scanning movement of the measuring system in the work transfer direction (F) with respect to the stationary work (W) and base 51 can be exemplified. In the former case, the movement motor 5 serves as a drive source such as a conveyor that moves the workpiece W and the base 51, and in the latter case, it becomes a drive source that moves the measuring system along a guide rail or the like.

The control unit 6 is made of a microcomputer, personal computer, etc., and controls the operations of the first light source 2, the second light source 3, the camera device 4, and the movement motor 5. Specifically, the control unit 6 performs the irradiation operation of the line light (SL) by the first light source 2, the irradiation operation of the normal illumination light (TL) by the second light source 3, and the work operation by the camera device 4. The imaging operation of the workpiece W and the transport operation of the workpiece W by the movement motor 5, that is, the scanning operation, etc. are controlled.

[Electrical configuration of work measuring device]

Figure 2 is a block diagram showing the electrical configuration of the work measuring device 1. The camera device 4 includes an imaging element 41, an image memory 42, a measurement unit 43, a settings storage unit 44, and an I/F unit 45. The imaging element 41 is a sensor in which pixels made of photoelectric conversion elements are arranged in a matrix. As the imaging device 41, it is desirable to use a CMOS sensor capable of specifying a ROI (Region of Interest) that determines the reading range of the pixel.

The image memory 42 temporarily stores image data acquired by the imaging element 41. The measurement unit 43 obtains two-dimensional data and three-dimensional data of the work W based on the image of the work W acquired through the imaging operation, that is, image data stored in the image memory 42. In this embodiment, an example is shown in which the measurement unit 43 is installed in the camera device 4, but the measurement unit 43 may be installed in the control unit 6 or another external device. The settings storage unit 44 stores various setting data and parameters related to the measurement operation of the measurement unit 43. Setting values regarding reference positions for dividing the 2D area and 3D area in the luminance distribution map M described later may be stored in the setting storage unit 44. The I/F unit 45 is an interface circuit for performing data communication with the control unit 6.

The measurement unit 43 functionally includes an image array unit 431, a height calculation unit 432, a luminance calculation unit 433, and an ROI setting unit 434. The image array unit 431 extracts image data corresponding to the position of interest on the work W from each of the images sequentially captured by the imaging device 41 in units of a predetermined camera scale. Additionally, the image arrangement unit 431 arranges the extracted image data in chronological order and generates a luminance distribution map M (FIG. 5) regarding the position of interest.

In order to derive three-dimensional data of the work W, the height calculation unit 432 performs processing to determine the height of each position of interest of the work W by an optical cutting method, based on the luminance distribution map M. . The luminance calculation unit 433 performs processing to determine the luminance of each position of interest based on the luminance distribution map M in order to derive two-dimensional data of the work W. The ROI setting unit 434 specifies the ROI of the imaging device 41. As the range in the work transfer direction (F) of the ROI, that is, the range in the profile direction, is widened, the height range of the work (W) to be measured is expanded, and three-dimensional measurement of a higher work (W) becomes possible.

The control unit 6 turns on the first light source 2 and the second light source 3 simultaneously while moving the work W in the work transfer direction F using a moving mechanism equipped with a moving motor 5. Thus, the camera device 4 is made to perform an imaging operation of the work W at a predetermined frame rate. That is, the control unit 6 causes the camera device 4 to perform an imaging operation for each pitch proportional to the size of the pixel column of the imaging element 41, in other words, in units of camera scale. The control unit 6 operates to functionally include a camera control unit 61, a light source control unit 62, a motor control unit 63, a data storage unit 64, and an I/F unit 65 by executing a predetermined program. do.

The camera control unit 61 controls the camera device 4 to capture images of the relatively moving work W in units of a predetermined camera scale. Through this imaging, multiple frame images of the work W are acquired and stored in the image memory 42. The camera scale unit is set so that the relative moving distance of the work W and the size of the pixel column of the imaging device 41 are proportional to each other.

The light source control unit 62 simultaneously turns on the first light source 2 and the second light source 3 when the work W is captured by the camera device 4. As a result, both the line light SL and the normal illumination light TL can be incident on the camera device 4 simultaneously. When imaging the work W by the camera device 4, the motor control unit 63 controls the movement motor 5 to move the work W and the base 51 by a predetermined amount in the work transfer direction F. Moves the opponent with speed. The data storage unit 64 stores two-dimensional data and three-dimensional data of the work W transmitted from the measurement unit 43 of the camera device 4. The I/F unit 65 is an interface circuit for performing data communication with the camera device 4.

[Height measurement by optical cutting method]

With reference to FIGS. 3(A) to 3(C), explanation will be added regarding three-dimensional measurement (height measurement) by the optical cutting method that can be performed in the work measuring device 1. As shown in FIG. 3(A), here, an example is shown in which a rectangular parallelepiped work W is mounted on the base 51 as the measurement object. For height measurement, the above-described camera device 4 and the first light source 2 that emits line light SL are used. Unlike FIG. 1, in FIG. 3(A), the camera device 4 is arranged so that the imaging optical axis AX is in a vertical direction, and the projection optical axis of the line light SL intersects the imaging optical axis AX by a predetermined amount. An example is shown in which the first light source 2 is arranged to have an angle θ.

FIG. 3(B) shows a frame image F01 acquired by the camera device 4 at an arbitrary scanning position where the line light SL is irradiated to the work W. When the line light SL is irradiated to the area including the work W, reflected light RL1 from the base 51 around the work W, that is, from the reference height, and from the upper surface of the work W The reflected light RL2 is imaged by the camera device 4. Since the line light SL is oblique light and the work W has a height, on the frame image F01, the reflected lights RL1 and RL2 are observed at different positions of the X coordinate. Specifically, the reflected light RL1 appears at the coordinate (x11), and the reflected light RL2 appears at the coordinate (x12) located upstream of the work transfer direction (F) from the coordinate (x11).

The case where the line light (SL) is irradiated to the point P0 in Fig. 3(A) is taken as the point of height = 0 in the calculation. Then, as shown in Fig. 3(C), from the principle of triangulation using the intersection angle θ, height data such as h1 as the height of the coordinate (x11) and h2 as the height of the coordinate (x12) can be obtained. Afterwards, subsequent frame images F02 and F03 are sequentially captured, and images of different positions of the work W are acquired. As a result, height data of coordinates (x21, x22) is acquired from the frame image F02, and height data of coordinates (x31, x32) is obtained from the frame image F03. Needless to say, actual camera scale units are much narrower pitch than the example shown.

By integrating a plurality of height data acquired through the above scan operation, three-dimensional data of the work W can be obtained. Additionally, the height data acquired from each frame image (F01, F02, F03) is based on the results of the reflected light (RL1, RL2) being irradiated at different X coordinate positions. For this reason, in data integration, for example, the height data of the coordinates (x12) obtained in the area of the work W in the frame image F01 and the coordinates (x12) obtained in the area of the base 51 at the subsequent scan position ) A height table that matches the height data may be created.

[Simultaneous acquisition of two-dimensional and three-dimensional data]

Next, simultaneous acquisition of two-dimensional data and three-dimensional data in the work measurement device 1 will be described. FIGS. 4A to 4D are diagrams showing an imaging situation for the position N of the work W of interest. 4A to 4D, a rectangular parallelepiped-shaped work W having a height h is moved relative to the imaging element 41 of the camera device 4 in the work transfer direction F, while moving the work W in a predetermined camera scale unit. This shows a state in which imaging of the work W is performed.

The work W is simultaneously illuminated with line light SL emitted by the first light source 2 and normal illumination light TL (not shown) emitted by the second light source 3. For this reason, the line reflected light RL, which is the reflected light of the line light SL irradiated to the work W, and the normal reflected light RT, which is the reflected light of the normal illumination light TL, simultaneously enter the imaging device 41. In addition, as the line reflected light RL, the line reflected light RL1 from the position of h=0 and the line reflected light RL2 from the height h are shown.

The work (W) indicates a point of interest (N) from which two-dimensional and three-dimensional data should be obtained. The size of the workpiece transfer direction F at the position of interest N corresponds to the distance the workpiece W moves between the imaging pitches of one frame image and the next frame image. The pixel columns L1 to L10 attached to the imaging element 41 are pixel columns having the number of pixels corresponding to the imaging pitch. While the position of interest (N) is moved in the workpiece transport direction (F), images are sequentially captured in each of the pixel columns (L1 to L10) in the 10 frame images (F1 to F10) that are continuously captured. Among these, Figures 4A to 4D show the imaging situation of the third to sixth frame images (F3 to F6). Additionally, the line reflected light RL1 at h=0 is set to be incident on the pixel column L4.

In the frame image F3 in Fig. 4A, the position of interest N has not yet reached the irradiation position of the line light SL. For this reason, the image data F3-L3 acquired from the pixel column L3 where the position of interest N in the frame image F3 is imaged is usually image data consisting only of the reflected light RT. The same applies to the frame images F1 and F2 that are captured before the frame image F3.

In the frame image F4 in FIG. 4B, the position N of interest is imaged in the pixel column L4 adjacent to the downstream side of the workpiece transport direction F of the pixel column L3. Also in the frame image F4, normal reflected light RT from the work W enters the pixel column L4. Additionally, the line reflected light RL1 from the area of h=0 at the same position in the position of interest N and the work transfer direction F also enters the pixel column L4. For this reason, the image data F4-L4 acquired from the pixel column L4 where the position of interest N in the frame image F4 is imaged is image data in which the line reflected light RL1 is superimposed on the normal reflected light RT. It becomes.

In the frame image F5 in FIG. 4C, the position N of interest is imaged in the pixel column L5. In the frame image F5 as well, the normal reflected light RT from the work W enters the pixel column L5, and the line reflected light RL2 from the area at the height h of the work W also enters the pixel column L5. It enters the pixel column (L5). Therefore, the image data F5-L5 acquired from the pixel column L5 where the position of interest N in the frame image F5 is imaged is image data in which the line reflected light RL2 is superimposed on the normal reflected light RT. do.

On the other hand, at the timing when the frame image F6 in FIG. 4D is captured, the position of interest N passes the irradiation position of the line light SL. For this reason, the image data F6-L6 acquired from the pixel column L6 where the position of interest N in the frame image F6 is imaged becomes image data only of the normal reflected light RT. Furthermore, although the line light SL is drawn as simple linear light in FIGS. 4A to 4D, the actual line light SL has a Gaussian light intensity distribution in the workpiece transport direction F. For this reason, there are cases where the image data F6-L6 is image data in which a part of the line reflected light RL2 is superimposed on the normal reflected light RT. The frame images F7 to F10 captured later than the frame image F6 are images in which only the reflected light RT is normally incident.

As described above, the frame images F1 to F10 including the image data F3-L3 to F6-L6 in FIGS. 4A to 4D are temporarily stored in the image memory 42 (FIG. 2). The image arrangement unit 431 of the measurement unit 43 extracts image data corresponding to the position N of interest from the frame images F1 to F10 stored in the image memory 42. Additionally, the image arrangement unit 431 arranges the extracted image data in time series to generate a luminance distribution map of the position of interest (N). The same process is repeated with another part of the work W as the position of interest N.

FIG. 5(A) is a diagram showing an example of a luminance distribution map (M) of a position (N) of interest. The x direction in the drawing is the direction in which image data is arranged in time series, and is the profile direction expressed by the height data of the work W. The y direction is the width direction of the workpiece W perpendicular to the workpiece transport direction F, and is the extension direction of the line light SL. FIG. 5(B) is a graph showing luminance values along the VB-VB line of FIG. 5(A).

The luminance distribution map M illustrated in FIG. 5(A) displays image data F1-L1 to F10-L10 acquired for the position of interest N in the x direction in each of the frame images F1 to F10. It is written by listing. That is, the luminance distribution map M represents the luminance change at one of the positions of interest (N) in the frame images F1 to F10.

As shown in Fig. 4B, the image data F4-L4 includes line reflected light RL1 from the region of h=0. Accordingly, luminance data D11 corresponding to the line reflected light RL1 is measured in the area F4-L4 of the luminance distribution map M. Additionally, as shown in FIG. 4C, the image data F5-L5 includes the line reflected light RL2 from the area at the height h of the work W. Accordingly, luminance data D12 corresponding to the line reflected light RL2 is measured in the area F5-L5 of the luminance distribution map M. Meanwhile, reflected light (RT) is usually included in all image data (F1-L1 to F10-L10). For this reason, as shown in Fig. 5(B), luminance data D12 corresponding to the normal reflected light RT is measured in the entire area of the luminance distribution map M. On the VB-VB line, the luminance data D12 of the line reflected light RL2 protrudes and shows a high luminance value. The reason why the luminance data D12 has the shape of a triangular wave rather than a square wave is because the line light SL has a Gaussian light intensity distribution, as described.

Based on the above-described luminance distribution map M, the height calculation unit 432 of the measurement unit 43 collects the height data of the position of interest (N), that is, three-dimensional data, and the luminance calculation unit 433 calculates the height data of the position of interest (N). luminance data, that is, two-dimensional data, is derived. Figures 6(A) to (E) are diagrams for explaining the process of deriving two-dimensional and three-dimensional data of a work from the luminance distribution map (M).

In deriving data, the image arrangement unit 431 divides the luminance distribution map M into a 2D area M1 for acquiring two-dimensional data and a 3D area M1 for acquiring three-dimensional data, as shown in FIG. 6(A). Set M2). The 3D area M2 is set as an area in the luminance distribution map M where the height information of the work W based on the line light SL appears, and the 2D area M1 is set as the other areas. In the luminance distribution map M illustrated in Fig. 5(A), height information appears in the area of the image data (F4-L4 to F10-L10), so this area is set as the 3D area M2. In this case, the 2D area M1 becomes an area of image data (F1-L1 to F3-L3).

The range of the 3D area M2 can be adjusted by the ROI designation range of the imaging device 41 by the ROI setting unit 434. The imaging element 41 has a large number of pixels arranged in a matrix, and the two-dimensional array range of these pixel groups becomes an image area where images can be acquired. The ROI setting unit 434 specifies the ROI that specifies the part to be used among the entire image area acquired by the imaging device 41. By specifying an ROI with a wide range in the work transfer direction (F), the height range of the work (W) that can be measured can be expanded. The ROI setting unit 434 specifies ROI with an appropriate range according to the type of work W. The setting values of the 2D area M1 and 3D area M2 based on ROI designation are stored in the setting storage unit 44.

As shown in Fig. 6(B), the luminance calculation unit 433 extracts a predetermined number of luminance data on the data acquisition line G1 arbitrarily set in the 2D area M1. The data acquisition line G1 may be one line or multiple lines. FIG. 6(C) is a graph showing luminance data extracted at an arbitrary pitch along the data acquisition line G1. The normal reflected light RT is reflected light of the non-directional normal illumination light TL, but a certain degree of deviation in the luminance value occurs in the luminance data on the data acquisition line G1. The luminance calculation unit 433 derives one luminance data by performing processing to obtain, for example, an average value, a maximum value, or a median value of the extracted luminance data group. This luminance data becomes two-dimensional data of the position of interest (N).

As shown in FIG. 6(D), the height calculation unit 432 has a data acquisition line ( In phase G2), a predetermined number of luminance data is extracted. FIG. 6(E) is a graph showing luminance data extracted at an arbitrary pitch along the data acquisition line G2. In the waveform of this luminance data, the peak value (TD) of the luminance data (D12), which is usually increased by the luminance component of the reflected light (RT), appears. The peak value (TD) is luminance data that accurately represents the height (h) of the work (W). The height calculation unit 432 calculates the peak value TD by, for example, center-of-gravity calculation or phase calculation, and sets it as the height position of the luminance data D12. Similarly, the peak value is obtained for the luminance data D11, and h=0 is set as the height reference position. Based on the respective peak values of the luminance data D11 and D12 obtained in this way, the height calculation unit 432 obtains three-dimensional data by obtaining the height of the position of interest N by an optical cutting method.

[Flow of data derivation processing]

Fig. 7 is a flowchart showing the derivation process of two-dimensional data and three-dimensional data of the workpiece W using the workpiece measuring device 1 of the present embodiment. At the start of measurement of the work W, the ROI setting unit 434 specifies the ROI of the imaging device 41 (step S1). When the height of the work W is assumed in advance, this ROI designation is connected to the settings of the 2D area M1 and 3D area M2 described above. The settings of the ranges of the 2D area M1 and the 3D area M2 may be stored in advance in the settings storage unit 44, and the settings may be read in step S1.

Next, scanning of the work W is performed (step S2). In scanning, the light source control unit 62 of the control unit 6 simultaneously turns on the first light source 2 and the second light source 3 to transmit the line light SL and the normal illumination light TL to the work W. Let them investigate. The motor control unit 63 operates the moving motor 5 to move the work W in the work transfer direction F at a predetermined speed. The camera control unit 61 controls the camera device 4 to continuously capture frame images of the work W in units of a predetermined camera scale. The acquired frame image data is temporarily stored in the image memory 42 (step S3).

After that, the measurement unit 43 reads image data from the image memory 42 and performs processing to derive measurement data of the work W. First, the measurement unit 43 sets the position of interest N with respect to the work W (step S4). N positions of interest (N) are set by subdividing the surface of the work (W). Next, the image arrangement unit 431 sets the counter to N = 1 and extracts the image data of the first position of interest (N) from each of the frame images in the image memory 42 (Step S5 ). This image data is, for example, the image data (F3-L3 to F6-L6) shown in Figs. 4A to 4D. Additionally, the image arrangement unit 431 arranges the extracted image data in chronological order and generates a luminance distribution map (M) of the position of interest (N) (step S6). A specific example of the luminance distribution map (M) is shown in Figure 5(A).

Subsequently, the height calculation unit 432 reads luminance data from the 3D area M2 of the luminance distribution map M (step S7). The 3D area M2 is as illustrated in the luminance distribution map M in Fig. 6(A), and reading of the luminance data corresponds to extraction of luminance data along the data acquisition line G2 in Fig. 6(D). do. Next, as illustrated in FIG. 6(E), the height calculation unit 432 obtains the peak value (TD) of the waveform of the extracted luminance data, thereby determining the level of the line light (SL) (line reflected light (RL)). Processing to determine the center position is performed (step S8). Thereby, the position of the height h of the work W is specified. Then, the height calculation unit 432 refers to the height reference position where h=0 and derives three-dimensional data corresponding to the height of the position of interest (N) by optical cutting (step S9).

Next, the luminance calculation unit 433 reads luminance data from the 2D area M1 of the luminance distribution map M (step S10). The 3D area M2 is as illustrated in the luminance distribution map M in Fig. 6(A), and reading of the luminance data corresponds to extraction of luminance data along the data acquisition line G1 in Fig. 6(B). do. Subsequently, the luminance calculation unit 433 derives two-dimensional data corresponding to the luminance of the position of interest (N) by calculating the average value of the extracted luminance data, etc. (Step S11). The three-dimensional data and two-dimensional data derived in step S9 and step S11, respectively, are transferred to the control unit 6 and stored in the data storage unit 64 (step S12).

Subsequently, the measurement unit 43 determines whether the counter indicating the number of processed positions N of interest has reached the number n set in step S4, that is, whether N = n is satisfied (step S13). If N = n (NO in step S13), the measurement unit 43 increments the counter as N = N + 1 (step S14), returns to step S5, and processes the same for the next position of interest (N). Run . On the other hand, if N=n (YES in step S13), the measurement unit 43 completes the processing.

As described above, according to the workpiece measuring device 1 of the present embodiment, the line light SL of the first light source 2 is irradiated onto the workpiece W to image the line reflected light RL, thereby performing the optical cutting method. Through this, three-dimensional data of the work W can be obtained. Additionally, by imaging the normal reflected light (RT) obtained by irradiating the normal illumination light TL from the second light source 3 to the work W, two-dimensional data of the work W can be obtained. The control unit 6 causes the camera device 4 to perform an imaging operation while moving the workpiece W and turning on the first light source 2 and the second light source 3 simultaneously. For this reason, the camera device 4 can acquire a frame image from which both two-dimensional and three-dimensional measurement data can be extracted.

The luminance distribution map (M) of the position of interest (N) created from the acquired frame image group is luminance information based on line reflected light (RL) and normal reflected light (RT), and is two-dimensional and three-dimensional regarding the position of interest (N). It becomes luminance distribution information containing information. Therefore, two-dimensional data and three-dimensional data of the position of interest (N) can be derived from the luminance distribution map (M). In this way, according to the work measurement device 1 according to the present embodiment, two-dimensional data and three-dimensional data of the work W can be acquired by a single scanning operation of the work W using one camera device 4. You can. Therefore, the workpiece W can be measured with good workability and without complicating the device.

[Variation example]

8(A) to 8(D) are diagrams for explaining the process of deriving two-dimensional data and three-dimensional data of the work W from the luminance distribution map MA according to a modified example. In a modified example, when the 3D area in the luminance distribution map (MA) is set to an area wider than a predetermined area width, the measurement unit 43 calculates the luminance average value of the luminance distribution map (MA) to obtain two-dimensional data. indicates.

As shown in FIG. 8(A), in the luminance distribution map MA according to the modified example, the range of the profile direction (x direction) of the 3D area is set to be wider than that of the 3D area in FIG. 6(A). The range of the 3D area can be expanded by the ROI setting unit 434 specifying a wide ROI in the work transfer direction (F). When the 3D area is expanded, the range of height measurement of the work W increases. Accordingly, with respect to the height-based luminance data D11, the luminance data D12A that appears at a significantly separated position on the luminance distribution map MA can be measured. In other words, it becomes possible to measure the height of the work W that is higher at the back.

In the case of a luminance distribution map (MA) in which the height range of the 3D area is sufficiently large, for example, when the range of the profile direction of the 3D area is set to about 2 to 5 times that of the 2D area, the camera device 4 The component of line light (SL) (line reflected light (RL)) in the image captured by this method becomes relatively small. Accordingly, the luminance average value of the luminance distribution map (MA) approximates luminance data corresponding to two-dimensional data.

Based on the above knowledge, in the modified example, as shown in FIG. 8(B), the measurement unit 43 collects the luminance data at an arbitrary pitch along the data acquisition line G3 that crosses the luminance data D12 in the x direction. Extract . Figure 8(C) is a graph showing the distribution of extracted luminance data in the x direction. The luminance calculation unit 433 calculates an average luminance value of a plurality of luminance data extracted along the data acquisition line G3. This luminance average value is treated as two-dimensional data approximately derived for the position of interest (N) of the work (W).

The height calculation unit 432 similarly uses a plurality of luminance data extracted along the data acquisition line G3 to create a graph representing the luminance data as shown in FIG. 8(D). Then, the height calculation unit 432 calculates the three-dimensional data by calculating the peak value TD of the luminance data D12 in the same manner as in the above-described embodiment and calculating the height of the position of interest N using the optical cutting method. acquire. According to this modification, two-dimensional data and three-dimensional data can be derived by extracting luminance data along one data acquisition line G3, so the measurement work can be simplified.

[Invention included in the above embodiment]

A work measuring device according to one aspect of the present invention includes a first light source for irradiating line light to a workpiece to be measured, a second light source for irradiating normal illumination light to the workpiece, and irradiating the line light and the normal illumination light. an imaging unit capable of acquiring images of the workpiece and its surroundings, a moving mechanism that relatively moves the workpiece in a predetermined transport direction, and operations of the imaging unit, the first light source, the second light source, and the moving mechanism It is provided with a control unit that controls and a measurement unit that obtains two-dimensional data and three-dimensional data for the workpiece based on the image acquired by the imaging unit, wherein the control unit moves the workpiece by the moving mechanism, and controls the first light source and the With the second light source turned on simultaneously, the imaging unit is made to perform an imaging operation of the workpiece in units of a predetermined camera scale, and the measurement unit determines the position of interest of the workpiece from each of the sequentially captured images in units of the camera scale. In addition to extracting image data corresponding to Derive.

A work measurement method according to another aspect of the present invention is a work measurement method for acquiring two-dimensional data and three-dimensional data of a workpiece to be measured, in a state in which line light and normal illumination light are simultaneously radiated onto the workpiece while moving the workpiece relatively, An image of the workpiece is acquired in units of a predetermined camera scale, image data corresponding to the position of interest of the workpiece is extracted from each of the images sequentially captured in the camera scale unit, and the extracted image data is arranged in chronological order. A luminance distribution map of the location of interest is generated, and based on the luminance distribution map, two-dimensional data and three-dimensional data of the location of interest are derived.

According to the above-described work measuring device or measuring method, three-dimensional data of the work can be obtained by an optical cutting method by having the line light of the first light source irradiate the work and the reflected light is captured by the imaging unit. Additionally, two-dimensional data of the work can be obtained by having the image pickup unit capture the reflected light from the normal illumination light from the second light source on the work. In addition, normal illumination light is non-directional illumination light that can irradiate light from all directions with respect to the work. Then, the control unit causes the imaging unit to perform an imaging operation with the first light source and the second light source turned on simultaneously. For this reason, the imaging unit can acquire images from which two-dimensional and three-dimensional measurement data can be extracted for each imaging along the camera scale unit.

Additionally, the measurement unit extracts image data corresponding to the position of interest of the work from each of the sequentially captured images while moving the work. By arranging the extracted image data in time series order, a luminance distribution map of the position of interest is generated. This luminance distribution map is luminance information based on the reflected light of the line light and normal illumination light, and becomes luminance distribution information including two-dimensional and three-dimensional information about a position of interest. Therefore, two-dimensional data and three-dimensional data of the position of interest can be derived from the luminance distribution map. In this way, according to the workpiece measurement device or measurement method according to the present invention, it is possible to acquire two-dimensional data and three-dimensional data of the workpiece through a single scan operation of the workpiece using one imaging unit. Therefore, the workpiece can be measured with good workability and without complicating the device.

In the work measurement device, the measurement unit determines, in the luminance distribution map, an area where height information based on the line light appears as a 3D area where the three-dimensional data is acquired, and another area is where the two-dimensional data is acquired. It is desirable to set it to a 2D area.

According to this work measurement device, since a 2D area is set in addition to the area where height information appears in the luminance distribution map, two-dimensional data and three-dimensional data can be reliably selected and acquired.

In the above work measurement device, the measurement unit obtains the three-dimensional data by obtaining the height of the position of interest by optical cutting based on the information of the 3D area, and obtains the position of interest based on the luminance data of the 2D area. It is desirable to acquire the two-dimensional data.

According to this work measurement device, it becomes possible to obtain the three-dimensional shape of the position of interest based on an optical cutting method and to obtain the color, shape, etc. of the position of interest based on luminance data.

In the above work measurement device, when the 3D area in the luminance distribution map is set to an area wider than a predetermined area width, the measurement unit calculates the luminance average value of the luminance distribution map to obtain the two-dimensional data. desirable.

When the height range of the 3D area is sufficiently large in the luminance distribution map, the component of line light in the captured image becomes relatively small. Therefore, the luminance average value of the luminance distribution map approximates luminance data corresponding to two-dimensional data. According to the above work measurement device, derivation of two-dimensional data can be simplified.

In the work measurement device described above, the imaging unit includes an imaging device in which pixels are arranged in a matrix, the measurement unit is capable of specifying an ROI that specifies a portion to be used among the entire image area acquired by the imaging device, and the 3D area is can be set based on the scope of ROI designation.

According to this work measurement device, three-dimensional data of the work can be accurately acquired by appropriately adjusting the ROI designation range according to the assumed height of the work, etc.

One; Work measuring device
2; first light source
3; second light source
4; Camera device (imaging unit)
41; imaging device
43; measuring department
431; image array unit
432; height calculation unit
433; Luminance calculation unit
434; ROI setting section
5; Movement motor (movement mechanism)
6; control unit
F; Work transfer direction
SL; line light
TL; normal lighting
RL; line reflection
RT; Normal reflected light
W; work
N; location of interest
M; Luminance distribution map

Claims (6)

a first light source that irradiates line light to the workpiece to be measured;
a second light source that radiates normal illumination light to the workpiece;
an imaging unit capable of acquiring images of the work and its surroundings irradiated with the line light and the normal illumination light;
a moving mechanism that relatively moves the workpiece in a predetermined transfer direction;
a control unit that controls operations of the imaging unit, the first light source, the second light source, and the moving mechanism;
A measurement unit that obtains two-dimensional data and three-dimensional data about the workpiece based on the image acquired by the imaging unit,
The control unit causes the imaging unit to perform an imaging operation of the workpiece in units of a predetermined camera scale while moving the workpiece by the moving mechanism and turning on the first light source and the second light source simultaneously,
The measuring unit,
Extracting image data corresponding to the position of interest of the work from each of the images sequentially captured in the camera scale unit, and arranging the extracted image data in time series to generate a luminance distribution map of the position of interest,
A work measurement device that derives two-dimensional data and three-dimensional data of the position of interest based on the luminance distribution map. According to claim 1,
The measurement unit sets, in the luminance distribution map, an area where height information based on the line light appears as a 3D area where the three-dimensional data is acquired, and sets other areas as a 2D area where the two-dimensional data is acquired. . According to claim 2,
The measurement unit obtains the three-dimensional data by obtaining the height of the position of interest by an optical cutting method based on the information of the 3D area, and acquires the two-dimensional data of the position of interest based on the luminance data of the 2D area. Measuring device. According to claim 2 or 3,
When the 3D area in the luminance distribution map is set to be wider than a predetermined area width, the measurement unit calculates a luminance average value of the luminance distribution map to obtain the two-dimensional data. According to any one of claims 2 to 4,
The imaging unit includes an imaging device in which pixels are arranged in a matrix,
The measurement unit is capable of specifying an ROI that specifies a portion to be used among the entire image area acquired by the imaging device,
A work measuring device in which the 3D area is set based on the ROI designation range. A work measurement method for acquiring two-dimensional data and three-dimensional data of a workpiece to be measured, comprising:
While moving the work relative to the work, line light and normal illumination light are simultaneously irradiated on the work, and an image of the work is acquired in units of a predetermined camera scale;
Extracting image data corresponding to the position of interest of the work from each of the images sequentially captured in the camera scale unit, and arranging the extracted image data in time series to generate a luminance distribution map of the position of interest,
A work measurement method for deriving two-dimensional data and three-dimensional data of the position of interest based on the luminance distribution map.