KR20240056091A - Novel Acrylic Compound and Composition of Low Dielectric Coating Solution Containing the Same - Google Patents
Novel Acrylic Compound and Composition of Low Dielectric Coating Solution Containing the Same Download PDFInfo
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- KR20240056091A KR20240056091A KR1020220136295A KR20220136295A KR20240056091A KR 20240056091 A KR20240056091 A KR 20240056091A KR 1020220136295 A KR1020220136295 A KR 1020220136295A KR 20220136295 A KR20220136295 A KR 20220136295A KR 20240056091 A KR20240056091 A KR 20240056091A
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- South Korea
- Prior art keywords
- acrylate
- meth
- compound
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- substituted
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- -1 Acrylic Compound Chemical class 0.000 title claims abstract description 120
- 239000000203 mixture Substances 0.000 title claims abstract description 87
- 238000000576 coating method Methods 0.000 title claims abstract description 79
- 239000011248 coating agent Substances 0.000 title claims abstract description 75
- 239000007788 liquid Substances 0.000 claims abstract description 62
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 144
- 150000001875 compounds Chemical class 0.000 claims description 62
- 125000000217 alkyl group Chemical group 0.000 claims description 46
- 125000001424 substituent group Chemical group 0.000 claims description 41
- 239000000178 monomer Substances 0.000 claims description 32
- 125000003118 aryl group Chemical group 0.000 claims description 31
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 23
- 239000003505 polymerization initiator Substances 0.000 claims description 19
- 238000001723 curing Methods 0.000 claims description 18
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 16
- 229910052805 deuterium Inorganic materials 0.000 claims description 16
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- 239000001257 hydrogen Substances 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 12
- 150000002431 hydrogen Chemical class 0.000 claims description 11
- 239000003999 initiator Substances 0.000 claims description 11
- 239000012044 organic layer Substances 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 10
- 229910052717 sulfur Inorganic materials 0.000 claims description 10
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 9
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 8
- 238000000016 photochemical curing Methods 0.000 claims description 8
- 125000005842 heteroatom Chemical group 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 claims description 6
- GHYOCDFICYLMRF-UTIIJYGPSA-N (2S,3R)-N-[(2S)-3-(cyclopenten-1-yl)-1-[(2R)-2-methyloxiran-2-yl]-1-oxopropan-2-yl]-3-hydroxy-3-(4-methoxyphenyl)-2-[[(2S)-2-[(2-morpholin-4-ylacetyl)amino]propanoyl]amino]propanamide Chemical compound C1(=CCCC1)C[C@@H](C(=O)[C@@]1(OC1)C)NC([C@H]([C@@H](C1=CC=C(C=C1)OC)O)NC([C@H](C)NC(CN1CCOCC1)=O)=O)=O GHYOCDFICYLMRF-UTIIJYGPSA-N 0.000 claims description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 6
- XRWSZZJLZRKHHD-WVWIJVSJSA-N asunaprevir Chemical compound O=C([C@@H]1C[C@H](CN1C(=O)[C@@H](NC(=O)OC(C)(C)C)C(C)(C)C)OC1=NC=C(C2=CC=C(Cl)C=C21)OC)N[C@]1(C(=O)NS(=O)(=O)C2CC2)C[C@H]1C=C XRWSZZJLZRKHHD-WVWIJVSJSA-N 0.000 claims description 6
- 229940125797 compound 12 Drugs 0.000 claims description 6
- 229940126543 compound 14 Drugs 0.000 claims description 6
- 229940125961 compound 24 Drugs 0.000 claims description 6
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 5
- UDQTXCHQKHIQMH-KYGLGHNPSA-N (3ar,5s,6s,7r,7ar)-5-(difluoromethyl)-2-(ethylamino)-5,6,7,7a-tetrahydro-3ah-pyrano[3,2-d][1,3]thiazole-6,7-diol Chemical compound S1C(NCC)=N[C@H]2[C@@H]1O[C@H](C(F)F)[C@@H](O)[C@@H]2O UDQTXCHQKHIQMH-KYGLGHNPSA-N 0.000 claims description 5
- ONBQEOIKXPHGMB-VBSBHUPXSA-N 1-[2-[(2s,3r,4s,5r)-3,4-dihydroxy-5-(hydroxymethyl)oxolan-2-yl]oxy-4,6-dihydroxyphenyl]-3-(4-hydroxyphenyl)propan-1-one Chemical compound O[C@@H]1[C@H](O)[C@@H](CO)O[C@H]1OC1=CC(O)=CC(O)=C1C(=O)CCC1=CC=C(O)C=C1 ONBQEOIKXPHGMB-VBSBHUPXSA-N 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 5
- PSLUFJFHTBIXMW-WYEYVKMPSA-N [(3r,4ar,5s,6s,6as,10s,10ar,10bs)-3-ethenyl-10,10b-dihydroxy-3,4a,7,7,10a-pentamethyl-1-oxo-6-(2-pyridin-2-ylethylcarbamoyloxy)-5,6,6a,8,9,10-hexahydro-2h-benzo[f]chromen-5-yl] acetate Chemical compound O([C@@H]1[C@@H]([C@]2(O[C@](C)(CC(=O)[C@]2(O)[C@@]2(C)[C@@H](O)CCC(C)(C)[C@@H]21)C=C)C)OC(=O)C)C(=O)NCCC1=CC=CC=N1 PSLUFJFHTBIXMW-WYEYVKMPSA-N 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 5
- 229940126142 compound 16 Drugs 0.000 claims description 5
- 229940125936 compound 42 Drugs 0.000 claims description 5
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 5
- 125000005843 halogen group Chemical group 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 238000006467 substitution reaction Methods 0.000 claims description 5
- HUWSZNZAROKDRZ-RRLWZMAJSA-N (3r,4r)-3-azaniumyl-5-[[(2s,3r)-1-[(2s)-2,3-dicarboxypyrrolidin-1-yl]-3-methyl-1-oxopentan-2-yl]amino]-5-oxo-4-sulfanylpentane-1-sulfonate Chemical compound OS(=O)(=O)CC[C@@H](N)[C@@H](S)C(=O)N[C@@H]([C@H](C)CC)C(=O)N1CCC(C(O)=O)[C@H]1C(O)=O HUWSZNZAROKDRZ-RRLWZMAJSA-N 0.000 claims description 4
- TVTJUIAKQFIXCE-HUKYDQBMSA-N 2-amino-9-[(2R,3S,4S,5R)-4-fluoro-3-hydroxy-5-(hydroxymethyl)oxolan-2-yl]-7-prop-2-ynyl-1H-purine-6,8-dione Chemical compound NC=1NC(C=2N(C(N(C=2N=1)[C@@H]1O[C@@H]([C@H]([C@H]1O)F)CO)=O)CC#C)=O TVTJUIAKQFIXCE-HUKYDQBMSA-N 0.000 claims description 4
- QBWKPGNFQQJGFY-QLFBSQMISA-N 3-[(1r)-1-[(2r,6s)-2,6-dimethylmorpholin-4-yl]ethyl]-n-[6-methyl-3-(1h-pyrazol-4-yl)imidazo[1,2-a]pyrazin-8-yl]-1,2-thiazol-5-amine Chemical compound N1([C@H](C)C2=NSC(NC=3C4=NC=C(N4C=C(C)N=3)C3=CNN=C3)=C2)C[C@H](C)O[C@H](C)C1 QBWKPGNFQQJGFY-QLFBSQMISA-N 0.000 claims description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 4
- OPFJDXRVMFKJJO-ZHHKINOHSA-N N-{[3-(2-benzamido-4-methyl-1,3-thiazol-5-yl)-pyrazol-5-yl]carbonyl}-G-dR-G-dD-dD-dD-NH2 Chemical compound S1C(C=2NN=C(C=2)C(=O)NCC(=O)N[C@H](CCCN=C(N)N)C(=O)NCC(=O)N[C@H](CC(O)=O)C(=O)N[C@H](CC(O)=O)C(=O)N[C@H](CC(O)=O)C(N)=O)=C(C)N=C1NC(=O)C1=CC=CC=C1 OPFJDXRVMFKJJO-ZHHKINOHSA-N 0.000 claims description 4
- 125000003282 alkyl amino group Chemical group 0.000 claims description 4
- 125000005103 alkyl silyl group Chemical group 0.000 claims description 4
- KGNDCEVUMONOKF-UGPLYTSKSA-N benzyl n-[(2r)-1-[(2s,4r)-2-[[(2s)-6-amino-1-(1,3-benzoxazol-2-yl)-1,1-dihydroxyhexan-2-yl]carbamoyl]-4-[(4-methylphenyl)methoxy]pyrrolidin-1-yl]-1-oxo-4-phenylbutan-2-yl]carbamate Chemical compound C1=CC(C)=CC=C1CO[C@H]1CN(C(=O)[C@@H](CCC=2C=CC=CC=2)NC(=O)OCC=2C=CC=CC=2)[C@H](C(=O)N[C@@H](CCCCN)C(O)(O)C=2OC3=CC=CC=C3N=2)C1 KGNDCEVUMONOKF-UGPLYTSKSA-N 0.000 claims description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 4
- 229940126086 compound 21 Drugs 0.000 claims description 4
- 229940125833 compound 23 Drugs 0.000 claims description 4
- 229940125846 compound 25 Drugs 0.000 claims description 4
- 229940125851 compound 27 Drugs 0.000 claims description 4
- 229940126214 compound 3 Drugs 0.000 claims description 4
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 claims description 4
- 125000004404 heteroalkyl group Chemical group 0.000 claims description 4
- GJBXIPOYHVMPQJ-UHFFFAOYSA-N hexadecane-1,16-diol Chemical compound OCCCCCCCCCCCCCCCCO GJBXIPOYHVMPQJ-UHFFFAOYSA-N 0.000 claims description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 claims description 4
- YQOLEILXOBUDMU-KRWDZBQOSA-N (4R)-5-[(6-bromo-3-methyl-2-pyrrolidin-1-ylquinoline-4-carbonyl)amino]-4-(2-chlorophenyl)pentanoic acid Chemical compound CC1=C(C2=C(C=CC(=C2)Br)N=C1N3CCCC3)C(=O)NC[C@H](CCC(=O)O)C4=CC=CC=C4Cl YQOLEILXOBUDMU-KRWDZBQOSA-N 0.000 claims description 3
- 125000000027 (C1-C10) alkoxy group Chemical group 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 claims description 3
- 125000005865 C2-C10alkynyl group Chemical group 0.000 claims description 3
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 125000001769 aryl amino group Chemical group 0.000 claims description 3
- 125000005104 aryl silyl group Chemical group 0.000 claims description 3
- 229940125904 compound 1 Drugs 0.000 claims description 3
- 229940125758 compound 15 Drugs 0.000 claims description 3
- 229940125844 compound 46 Drugs 0.000 claims description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 3
- 125000001624 naphthyl group Chemical group 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 claims description 3
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- XLKZJJVNBQCVIX-UHFFFAOYSA-N tetradecane-1,14-diol Chemical compound OCCCCCCCCCCCCCCO XLKZJJVNBQCVIX-UHFFFAOYSA-N 0.000 claims description 3
- ASGMFNBUXDJWJJ-JLCFBVMHSA-N (1R,3R)-3-[[3-bromo-1-[4-(5-methyl-1,3,4-thiadiazol-2-yl)phenyl]pyrazolo[3,4-d]pyrimidin-6-yl]amino]-N,1-dimethylcyclopentane-1-carboxamide Chemical compound BrC1=NN(C2=NC(=NC=C21)N[C@H]1C[C@@](CC1)(C(=O)NC)C)C1=CC=C(C=C1)C=1SC(=NN=1)C ASGMFNBUXDJWJJ-JLCFBVMHSA-N 0.000 claims description 2
- UAOUIVVJBYDFKD-XKCDOFEDSA-N (1R,9R,10S,11R,12R,15S,18S,21R)-10,11,21-trihydroxy-8,8-dimethyl-14-methylidene-4-(prop-2-enylamino)-20-oxa-5-thia-3-azahexacyclo[9.7.2.112,15.01,9.02,6.012,18]henicosa-2(6),3-dien-13-one Chemical compound C([C@@H]1[C@@H](O)[C@@]23C(C1=C)=O)C[C@H]2[C@]12C(N=C(NCC=C)S4)=C4CC(C)(C)[C@H]1[C@H](O)[C@]3(O)OC2 UAOUIVVJBYDFKD-XKCDOFEDSA-N 0.000 claims description 2
- AOSZTAHDEDLTLQ-AZKQZHLXSA-N (1S,2S,4R,8S,9S,11S,12R,13S,19S)-6-[(3-chlorophenyl)methyl]-12,19-difluoro-11-hydroxy-8-(2-hydroxyacetyl)-9,13-dimethyl-6-azapentacyclo[10.8.0.02,9.04,8.013,18]icosa-14,17-dien-16-one Chemical compound C([C@@H]1C[C@H]2[C@H]3[C@]([C@]4(C=CC(=O)C=C4[C@@H](F)C3)C)(F)[C@@H](O)C[C@@]2([C@@]1(C1)C(=O)CO)C)N1CC1=CC=CC(Cl)=C1 AOSZTAHDEDLTLQ-AZKQZHLXSA-N 0.000 claims description 2
- IUSARDYWEPUTPN-OZBXUNDUSA-N (2r)-n-[(2s,3r)-4-[[(4s)-6-(2,2-dimethylpropyl)spiro[3,4-dihydropyrano[2,3-b]pyridine-2,1'-cyclobutane]-4-yl]amino]-3-hydroxy-1-[3-(1,3-thiazol-2-yl)phenyl]butan-2-yl]-2-methoxypropanamide Chemical compound C([C@H](NC(=O)[C@@H](C)OC)[C@H](O)CN[C@@H]1C2=CC(CC(C)(C)C)=CN=C2OC2(CCC2)C1)C(C=1)=CC=CC=1C1=NC=CS1 IUSARDYWEPUTPN-OZBXUNDUSA-N 0.000 claims description 2
- WWTBZEKOSBFBEM-SPWPXUSOSA-N (2s)-2-[[2-benzyl-3-[hydroxy-[(1r)-2-phenyl-1-(phenylmethoxycarbonylamino)ethyl]phosphoryl]propanoyl]amino]-3-(1h-indol-3-yl)propanoic acid Chemical compound N([C@@H](CC=1C2=CC=CC=C2NC=1)C(=O)O)C(=O)C(CP(O)(=O)[C@H](CC=1C=CC=CC=1)NC(=O)OCC=1C=CC=CC=1)CC1=CC=CC=C1 WWTBZEKOSBFBEM-SPWPXUSOSA-N 0.000 claims description 2
- STBLNCCBQMHSRC-BATDWUPUSA-N (2s)-n-[(3s,4s)-5-acetyl-7-cyano-4-methyl-1-[(2-methylnaphthalen-1-yl)methyl]-2-oxo-3,4-dihydro-1,5-benzodiazepin-3-yl]-2-(methylamino)propanamide Chemical compound O=C1[C@@H](NC(=O)[C@H](C)NC)[C@H](C)N(C(C)=O)C2=CC(C#N)=CC=C2N1CC1=C(C)C=CC2=CC=CC=C12 STBLNCCBQMHSRC-BATDWUPUSA-N 0.000 claims description 2
- QFLWZFQWSBQYPS-AWRAUJHKSA-N (3S)-3-[[(2S)-2-[[(2S)-2-[5-[(3aS,6aR)-2-oxo-1,3,3a,4,6,6a-hexahydrothieno[3,4-d]imidazol-4-yl]pentanoylamino]-3-methylbutanoyl]amino]-3-(4-hydroxyphenyl)propanoyl]amino]-4-[1-bis(4-chlorophenoxy)phosphorylbutylamino]-4-oxobutanoic acid Chemical compound CCCC(NC(=O)[C@H](CC(O)=O)NC(=O)[C@H](Cc1ccc(O)cc1)NC(=O)[C@@H](NC(=O)CCCCC1SC[C@@H]2NC(=O)N[C@H]12)C(C)C)P(=O)(Oc1ccc(Cl)cc1)Oc1ccc(Cl)cc1 QFLWZFQWSBQYPS-AWRAUJHKSA-N 0.000 claims description 2
- IWZSHWBGHQBIML-ZGGLMWTQSA-N (3S,8S,10R,13S,14S,17S)-17-isoquinolin-7-yl-N,N,10,13-tetramethyl-2,3,4,7,8,9,11,12,14,15,16,17-dodecahydro-1H-cyclopenta[a]phenanthren-3-amine Chemical compound CN(C)[C@H]1CC[C@]2(C)C3CC[C@@]4(C)[C@@H](CC[C@@H]4c4ccc5ccncc5c4)[C@@H]3CC=C2C1 IWZSHWBGHQBIML-ZGGLMWTQSA-N 0.000 claims description 2
- OMBVEVHRIQULKW-DNQXCXABSA-M (3r,5r)-7-[3-(4-fluorophenyl)-8-oxo-7-phenyl-1-propan-2-yl-5,6-dihydro-4h-pyrrolo[2,3-c]azepin-2-yl]-3,5-dihydroxyheptanoate Chemical compound O=C1C=2N(C(C)C)C(CC[C@@H](O)C[C@@H](O)CC([O-])=O)=C(C=3C=CC(F)=CC=3)C=2CCCN1C1=CC=CC=C1 OMBVEVHRIQULKW-DNQXCXABSA-M 0.000 claims description 2
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- KQZLRWGGWXJPOS-NLFPWZOASA-N 1-[(1R)-1-(2,4-dichlorophenyl)ethyl]-6-[(4S,5R)-4-[(2S)-2-(hydroxymethyl)pyrrolidin-1-yl]-5-methylcyclohexen-1-yl]pyrazolo[3,4-b]pyrazine-3-carbonitrile Chemical compound ClC1=C(C=CC(=C1)Cl)[C@@H](C)N1N=C(C=2C1=NC(=CN=2)C1=CC[C@@H]([C@@H](C1)C)N1[C@@H](CCC1)CO)C#N KQZLRWGGWXJPOS-NLFPWZOASA-N 0.000 claims description 2
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- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
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- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
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- 125000004998 naphthylethyl group Chemical group C1(=CC=CC2=CC=CC=C12)CC* 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
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- 239000012788 optical film Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 229930184652 p-Terphenyl Chemical group 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
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- 229920000728 polyester Polymers 0.000 description 1
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- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- 125000000542 sulfonic acid group Chemical group 0.000 description 1
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- 229910052714 tellurium Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 125000001935 tetracenyl group Chemical group C1(=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C12)* 0.000 description 1
- 125000001712 tetrahydronaphthyl group Chemical group C1(CCCC2=CC=CC=C12)* 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
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- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C233/00—Carboxylic acid amides
- C07C233/01—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms
- C07C233/02—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having nitrogen atoms of carboxamide groups bound to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals
- C07C233/11—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having nitrogen atoms of carboxamide groups bound to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals with carbon atoms of carboxamide groups bound to carbon atoms of an unsaturated carbon skeleton containing six-membered aromatic rings
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C255/00—Carboxylic acid nitriles
- C07C255/49—Carboxylic acid nitriles having cyano groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
- C07C255/55—Carboxylic acid nitriles having cyano groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing cyano groups and esterified hydroxy groups bound to the carbon skeleton
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C327/00—Thiocarboxylic acids
- C07C327/02—Monothiocarboxylic acids
- C07C327/04—Monothiocarboxylic acids having carbon atoms of thiocarboxyl groups bound to hydrogen atoms or to acyclic carbon atoms
- C07C327/12—Monothiocarboxylic acids having carbon atoms of thiocarboxyl groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of an unsaturated carbon skeleton containing rings
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
- C07C69/73—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of unsaturated acids
- C07C69/734—Ethers
- C07C69/736—Ethers the hydroxy group of the ester being etherified with a hydroxy compound having the hydroxy group bound to a carbon atom of a six-membered aromatic ring
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09D135/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D135/02—Homopolymers or copolymers of esters
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- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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Abstract
본 발명은 방향족 치환기 및 지방족 치환기를 동시에 포함하는 아크릴 화합물 및 이를 포함하는 코팅용 조성물에 관한 것으로, 보다 상세하게는 낮은 유전율을 가지고 있음과 동시에, OLED소자 봉지공정에서 사용하는 플라즈마에 대한 강한 내성을 갖고, 낮은 경화 수축율을 나타내는 유기 코팅막을 제공할 수 있는 코팅액 조성물에 관한 것이다.The present invention relates to an acrylic compound containing both an aromatic substituent and an aliphatic substituent and a coating composition containing the same. More specifically, it has a low dielectric constant and has strong resistance to plasma used in the OLED device encapsulation process. It relates to a coating liquid composition that can provide an organic coating film that has a low cure shrinkage rate.
Description
본 발명은 신규한 지방족 아크릴계 단량체 및 이를 포함하는 저유전 코팅액 조성물에 관한 것으로, 보다 상세하게는 낮은 유전율을 가지고 있음과 동시에, OLED소자 봉지공정에서 사용하는 플라즈마에 대한 강한 내성을 갖고, 낮은 경화 수축율을 나타내는 유기 코팅막을 제공할 수 있는 코팅액 조성물에 관한 것이다. The present invention relates to a novel aliphatic acrylic monomer and a low-dielectric coating liquid composition containing the same. More specifically, it has a low dielectric constant, has strong resistance to plasma used in the OLED device encapsulation process, and has a low cure shrinkage rate. It relates to a coating liquid composition that can provide an organic coating film representing.
아크릴레이트 또는 메타아크릴레이트는 단독으로 중합되거나 다른 단량체와의 공중합되어 각종 성능이 우수한 폴리머를 제공하는 유용한 단량체 성분으로서, 이들을 이용하여 제조된 폴리머는 일반적으로 내후성 및 투명성이 우수하다는 특징이 있고, 또한, 에스테르 치환기의 종류에 따라 다양한 성능의 폴리머를 제조할 수 있고, 특히 밀봉용 또는 디스플레이 용도의 코팅용 조성물로서 응용될 수 있다.Acrylates or methacrylates are useful monomer components that are polymerized alone or copolymerized with other monomers to provide polymers with excellent performance. Polymers manufactured using them are generally characterized by excellent weather resistance and transparency. Depending on the type of ester substituent, polymers with various performances can be produced, and in particular, they can be applied as coating compositions for sealing or display purposes.
그러나 종래기술에 따른 터치패널, TFT-LCD, 또는 유기발광소자(OLED)용 코팅액을 위하여 기존에 제시된 지환식 탄화수소 골격을 가지는 (메타)아크릴레이트 단량체의 경우 끓는점이 낮아 공정에 활용하는데 제한이 있으며, 또한 비교적 높은 경화 수축율을 가져 터치감도가 낮고 제조된 코팅막의 물리적 특성이 부족한 한계를 가지고 있으며, 또한, 이러한 조건을 비교적 갖추었더라도 보다 얇은 두께의 디스플레이 제작 및 TSP 감도 향상을 위해서는 다관능성 모노머단량체의 유전율을 보다 낮추어야 할 필요성이 있다. However, in the case of (meth)acrylate monomers with an alicyclic hydrocarbon skeleton previously proposed for coating solutions for touch panels, TFT-LCDs, or organic light emitting devices (OLEDs) according to the prior art, their use in the process is limited due to their low boiling point. In addition, it has a limitation of having a relatively high curing shrinkage rate, low touch sensitivity, and insufficient physical properties of the manufactured coating film. In addition, even if these conditions are relatively satisfied, multifunctional monomer monomers are needed to produce thinner displays and improve TSP sensitivity. There is a need to lower the dielectric constant.
이러한 밀봉용 또는 디스플레이 용도의 코팅용 조성물에 관한 종래 기술로서, 한국공개특허공보 제10-2016-0030077호(2016.03.16)에서는 유기 EL 소자 밀봉용 수지 조성물 및 그 경화물에 관한 기술이 기재되어 있고, 한국공개특허공보 제10-2019-0065896호 (2019.06.26)에서는 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치에 관할 기술이 기재되어 있으며, 한국공개특허공보 제 10-2016-0053751호(2016.05.13)에서는 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치에 관한 기술을 제시하고 있다.As a prior art regarding such a coating composition for sealing or display purposes, Korean Patent Publication No. 10-2016-0030077 (2016.03.16) describes a resin composition for sealing organic EL devices and its cured product. In Korea Patent Publication No. 10-2019-0065896 (2019.06.26), the relevant technology is described in the composition for encapsulating organic light-emitting devices and the organic light-emitting device display device manufactured therefrom, and in Korean Patent Publication No. 10- No. 2016-0053751 (2016.05.13) presents technology regarding a composition for display sealing material, an organic protective layer containing the same, and a display device containing the same.
그러나, 상기 선행기술들을 포함하는 종래기술에도 불구하고, 밀봉용 또는 디스플레이 용도의 코팅용 조성물로서, 연속적으로 주행하는 기재 상에 수지층을 제막하는 프로세스에 적합하고, 낮은 유전율을 가지고 있음과 동시에, 높은 드라이에칭 내성을 가지므로 코팅액 조성물의 봉지공정에 있어서의 플라스마 데미지를 억제할 수 있어, 코팅 공정 또는 경화시 코팅막의 공정 신뢰성을 개선할 수 있는, 신규한 코팅액 조성물의 개발 필요성은 지속적으로 요구되고 있다.However, despite the prior art including the above prior art, as a coating composition for sealing or display purposes, it is suitable for the process of forming a resin layer on a continuously running substrate and has a low dielectric constant, Since it has high dry etching resistance, it is possible to suppress plasma damage during the encapsulation process of the coating composition, and the need to develop a new coating composition that can improve the process reliability of the coating film during the coating process or curing is continuously required. there is.
본 발명은 앞서 기재된 종래 기술에 따른 문제점을 해결하기 위해, 낮은 유전율을 가지고 있음과 동시에, 접착성, 경화성, 가공성이 우수하며, 특히 터치패널의 두 전극 사이의 절연층, OCR(Optically clear resin), 오버코트, OLED 소자 봉지공정에서 사용하는 플라즈마에 대한 강한 내성을 갖고, 낮은 유전율을 가지고 있음과 동시에, 낮은 경화 수축율을 나타냄으로써, 코팅 공정 또는 경화시 코팅막의 공정 신뢰성을 확보할 수 있는 신규한 아크릴레이트 단량체 및 이를 포함하는 코팅액 조성물을 제공하는 것을 발명의 목적으로 하며, 특히, 유기 발광 소자(OLED) 봉지공정 등의 용도를 위하여, 연속적으로 주행하는 기재 상에 수지층을 제막하는 프로세스에 적합한 코팅액 조성물을 위한 신규한 아크릴레이트 단량체 및 이를 포함하는 코팅액을 제공하는 것을 발명의 목적으로 한다. In order to solve the problems caused by the prior art described above, the present invention has a low dielectric constant and is excellent in adhesion, curability, and processability, and in particular, the insulating layer between the two electrodes of the touch panel, OCR (Optically Clear Resin) , overcoat, a novel acrylic that has strong resistance to plasma used in the OLED device encapsulation process, has a low dielectric constant, and exhibits low curing shrinkage, thereby ensuring process reliability of the coating film during the coating process or curing. The purpose of the invention is to provide a rate monomer and a coating liquid composition containing the same, and in particular, a coating liquid suitable for the process of forming a resin layer on a continuously running substrate for use such as an organic light emitting device (OLED) encapsulation process. The purpose of the invention is to provide a novel acrylate monomer for a composition and a coating solution containing the same.
상기 과제를 해결하기 위해 본 발명은, 하기 [화학식 1]로 표시되는 단관능성 아크릴 화합물(A)을 포함하는 코팅액 조성물을 광경화 또는 열경화시킨 경화물이 낮은 유전율과 수축률, 높은 내플라즈마성과 접착력을 구현할 수 있음과 동시에, 앞서 기재된 종래 기술의 문제점을 해결할 수 있음을 발견하고, 본 발명에 이르게 되었다. In order to solve the above problems, the present invention provides a cured product obtained by photo-curing or heat-curing a coating liquid composition containing a monofunctional acrylic compound (A) represented by the following [Chemical Formula 1], which has low dielectric constant and shrinkage, high plasma resistance and adhesion. It was discovered that it was possible to implement and at the same time solve the problems of the prior art described above, leading to the present invention.
보다 상세하게는, 본 발명은 하기 [화학식 1]로 표시되는, 방향족 치환기 및 지방족 치환기를 동시에 포함하는 아크릴 화합물을 제공한다. More specifically, the present invention provides an acrylic compound simultaneously containing an aromatic substituent and an aliphatic substituent, represented by the following [Chemical Formula 1].
[화학식 1] [Formula 1]
상기 [화학식 1]에서, In [Formula 1] above,
상기 R1은 수소, 중수소, 치환 또는 비치환된 C1~C10의 알킬기 중에서 선택되는 어느 하나이고, R 1 is any one selected from hydrogen, deuterium, and a substituted or unsubstituted C1 to C10 alkyl group,
상기 X는 산소(O), 황(S) 또는 -NR'- 중에서 선택되는 어느 하나이고, The X is any one selected from oxygen (O), sulfur (S), or -NR'-,
상기 R'및 R2는 각각 동일하거나 상이하며, 서로 독립적으로 수소, 중수소, 치환 또는 비치환된 C1~C30의 알킬기, 치환 또는 비치환된 C1~C30의 할로겐화된 알킬기, 치환 또는 비치환된 C6~C24의 아릴기, 치환 또는 비치환되고 이종 원자로 O, N 또는 S를 1 내지 2개 포함하는 C4~C24의 헤테로아릴기 중에서 선택되는 어느 하나이고, R' and R2 are each the same or different, and are independently hydrogen, deuterium, a substituted or unsubstituted C1~C30 alkyl group, a substituted or unsubstituted C1~C30 halogenated alkyl group, or a substituted or unsubstituted C6~ Any one selected from a C24 aryl group, a C4 to C24 heteroaryl group that is substituted or unsubstituted and contains 1 to 2 O, N or S as heteroatoms,
상기 R3는 치환 또는 비치환된 C6~C30의 알킬기 및 치환 또는 비치환된 C6~C30의 할로겐화된 알킬기 중에서 선택되는 어느 하나이고, R3 is any one selected from a substituted or unsubstituted C6~C30 alkyl group and a substituted or unsubstituted C6~C30 halogenated alkyl group,
상기 Ar1은 치환 또는 비치환된 C6~C24의 아릴기 및 치환 또는 비치환되고 이종 원자로 O, N 또는 S를 1 내지 2개 포함하는 C4~C24의 헤테로아릴기 중에서 선택되는 어느 하나이고, Ar1 is any one selected from a substituted or unsubstituted C6 to C24 aryl group and a substituted or unsubstituted C4 to C24 heteroaryl group containing 1 to 2 heteroatoms O, N or S,
상기 화학식 1에서의 '치환 또는 비치환된'에서의'치환'은 중수소, 시아노기, 할로겐기, 히드록시기, 니트로기, C1-C10의 알킬기, C1-C10의 할로겐화된 알킬기, C2-C10의 알케닐기, C2-C10의 알키닐기, C1-C10의 헤테로알킬기, C6-C18의 아릴기, C7-C19의 아릴알킬기, C7-C19의 알킬아릴기, C1-C10의 알콕시기, C1-C10 알킬티오닐기, C1-C10의 알킬아미노기, C6-C18의 아릴아미노기, C1-C10의 알킬실릴기, C6-C12의 아릴실릴기, C6-C12의 아릴옥시기로 이루어진 군에서 선택된 어느 하나의 치환기로 치환되는 것을 의미한다. In Formula 1, 'substitution' in 'substituted or unsubstituted' means deuterium, cyano group, halogen group, hydroxy group, nitro group, C1-C10 alkyl group, C1-C10 halogenated alkyl group, C2-C10 alkenyl group, C2-C10 alkynyl group, C1-C10 heteroalkyl group, C6-C18 aryl group, C7-C19 arylalkyl group, C7-C19 alkylaryl group, C1-C10 alkoxy group, Any selected from the group consisting of C1-C10 alkylthionyl group, C1-C10 alkylamino group, C6-C18 arylamino group, C1-C10 alkylsilyl group, C6-C12 arylsilyl group, and C6-C12 aryloxy group. It means being substituted with one substituent.
또한, 본 발명은 상기 아크릴 화합물(A) 1 내지 80 중량%; 상기 아크릴 화합물(A)과 중합가능한 다관능성 아크릴 화합물(B) 19 내지 80 중량%; 및 중합개시제(D) 0.1 내지 20 중량%;를 포함하는 것을 특징으로 하는 코팅액 조성물을 제공한다. In addition, the present invention relates to 1 to 80% by weight of the acrylic compound (A); 19 to 80% by weight of a multifunctional acrylic compound (B) polymerizable with the acrylic compound (A); and 0.1 to 20% by weight of a polymerization initiator (D).
또한, 본 발명은 상기 코팅액 조성물을 열 경화 또는 광 경화시켜 제조되는 것을 특징으로 하는 광경화 또는 열경화된 유기 코팅막을 제공한다. In addition, the present invention provides a photo-cured or thermo-cured organic coating film, which is manufactured by thermally or photo-curing the coating liquid composition.
본 발명에 따른 아크릴 화합물(A)은 하나의 분자내 (메타)아크릴기 등의 중합가능한 치환기, 지방족 치환기 및 방향족 치환기를 동시에 포함하되, 분자내 하나의 탄소원자에 분자량이 큰 지방족 치환기 및 방향족 치환기가 동시에 치환된 구조를 가짐으로써, 전자가 고르게 분포하여 극성이 낮고, 낮은 유전율을 가질 수 있으며, 동시에 플라즈마 내성이 우수하고 코팅 공정 중에 발생하는 아웃가스를 최소화 할 수 있으며, 특히 경화 수축률이 낮아 LCD나 OLED 디스플레이용 코팅액 조성물을 제공할 수 있다.The acrylic compound (A) according to the present invention simultaneously contains a polymerizable substituent such as a (meth)acrylic group, an aliphatic substituent, and an aromatic substituent in one molecule, and includes an aliphatic substituent and an aromatic substituent with a large molecular weight on one carbon atom in the molecule. By having a structure in which electrons are substituted at the same time, electrons are distributed evenly, resulting in low polarity and low dielectric constant. At the same time, it has excellent plasma resistance and can minimize outgassing during the coating process. In particular, the curing shrinkage rate is low, making it possible for LCD A coating liquid composition for OLED displays can be provided.
또한, 본 발명에 따른 아크릴 화합물(A)은 상기 분자량이 큰 지방족 치환기 및 방향족 치환기를 동시에 포함함으로써, 분자량 대비 높은 끊는점 및 낮은 기화량을 보여주고 있으며, 이로 인하여 공정 안정성에 문제가 되고 오염으로 인한 유기발광소자(OLED) 등의 수명 단축의 문제를 발생시키는 아웃개싱 발생이 적어, 코팅 공정 또는 경화시 코팅막의 공정 신뢰성을 확보할 수 있다. In addition, the acrylic compound (A) according to the present invention simultaneously contains an aliphatic substituent and an aromatic substituent with a large molecular weight, thereby showing a high boiling point and low vaporization amount compared to the molecular weight, which causes problems in process stability and causes contamination. There is less outgassing that causes problems such as shortening the lifespan of organic light-emitting devices (OLEDs), etc., and the process reliability of the coating film can be secured during the coating process or curing.
또한, 본 발명에서의 따른 아크릴 화합물(A)과 중합가능한 다관능성 아크릴 화합물(B)을 포함하는 코팅액 조성물은 접착력, 특히 무기층에 대한 접착력이 우수하고, 경화 수축률이 낮아 플렉시블 기판에 사용하는 것이 용이하여 플렉시블 또는 폴더블 디스플레이에 적용이 가능하다. In addition, the coating liquid composition containing the acrylic compound (A) and the polymerizable multifunctional acrylic compound (B) according to the present invention has excellent adhesion, especially to inorganic layers, and has a low cure shrinkage rate, making it suitable for use on flexible substrates. It is easy to apply to flexible or foldable displays.
본 출원의 구체적인 예들을 보다 상세하게 설명하고자 한다. 그러나 본 출원에 기술된 내용은 본 출원의 사상을 전달될 수 있도록 제공되는 것이며 본 출원의 내용이 이에 한정하지 않는다.Specific examples of this application will be described in more detail. However, the content described in this application is provided to convey the idea of this application, and the content of this application is not limited thereto.
본 발명은 하기 [화학식 1]로 표시되는, 방향족 치환기 및 지방족 치환기를 동시에 포함하는 아크릴 화합물을 제공한다. The present invention provides an acrylic compound simultaneously containing an aromatic substituent and an aliphatic substituent, represented by the following [Chemical Formula 1].
[화학식 1] [Formula 1]
상기 [화학식 1]에서, In [Formula 1] above,
상기 R1은 수소, 중수소, 치환 또는 비치환된 C1~C10의 알킬기 중에서 선택되는 어느 하나이고, R 1 is any one selected from hydrogen, deuterium, and a substituted or unsubstituted C1 to C10 alkyl group,
상기 X는 산소(O), 황(S) 또는 -NR'- 중에서 선택되는 어느 하나이고, The X is any one selected from oxygen (O), sulfur (S), or -NR'-,
상기 R'및 R2는 각각 동일하거나 상이하며, 서로 독립적으로 수소, 중수소, 치환 또는 비치환된 C1~C30의 알킬기, 치환 또는 비치환된 C1~C30의 할로겐화된 알킬기, 치환 또는 비치환된 C6~C24의 아릴기, 치환 또는 비치환되고 이종 원자로 O, N 또는 S를 1 내지 2개 포함하는 C4~C24의 헤테로아릴기 중에서 선택되는 어느 하나이고,R' and R 2 are each the same or different, and are independently hydrogen, deuterium, a substituted or unsubstituted C1~C30 alkyl group, a substituted or unsubstituted C1~C30 halogenated alkyl group, or a substituted or unsubstituted C6. Any one selected from ~C24 aryl group, substituted or unsubstituted C4~C24 heteroaryl group containing 1 to 2 O, N or S as heteroatoms,
상기 R3는 치환 또는 비치환된 C6~C30의 알킬기 및 치환 또는 비치환된 C6~C30의 할로겐화된 알킬기 중에서 선택되는 어느 하나이고, R 3 is any one selected from a substituted or unsubstituted C6~C30 alkyl group and a substituted or unsubstituted C6~C30 halogenated alkyl group,
상기 Ar1은 치환 또는 비치환된 C6~C24의 아릴기 및 치환 또는 비치환되고 이종 원자로 O, N 또는 S를 1 내지 2개 포함하는 C4~C24의 헤테로아릴기 중에서 선택되는 어느 하나이고, Ar 1 is any one selected from a substituted or unsubstituted C6 to C24 aryl group and a substituted or unsubstituted C4 to C24 heteroaryl group containing 1 to 2 heteroatoms O, N or S,
상기 화학식 1에서의 '치환 또는 비치환된'에서의'치환'은 중수소, 시아노기, 할로겐기, 히드록시기, 니트로기, C1-C10의 알킬기, C1-C10의 할로겐화된 알킬기, C2-C10의 알케닐기, C2-C10의 알키닐기, C1-C10의 헤테로알킬기, C6-C18의 아릴기, C7-C19의 아릴알킬기, C7-C19의 알킬아릴기, C1-C10의 알콕시기, C1-C10 알킬티오닐기, C1-C10의 알킬아미노기, C6-C18의 아릴아미노기, C1-C10의 알킬실릴기, C6-C18의 아릴실릴기, C6-C12의 아릴옥시기로 이루어진 군에서 선택된 어느 하나의 치환기로 치환되는 것을 의미한다.In Formula 1, 'substitution' in 'substituted or unsubstituted' means deuterium, cyano group, halogen group, hydroxy group, nitro group, C1-C10 alkyl group, C1-C10 halogenated alkyl group, C2-C10 alkene. Nyl group, C2-C10 alkynyl group, C1-C10 heteroalkyl group, C6-C18 aryl group, C7-C19 arylalkyl group, C7-C19 alkylaryl group, C1-C10 alkoxy group, C1-C10 alkyl group Substituted with any one substituent selected from the group consisting of oneyl group, C1-C10 alkylamino group, C6-C18 arylamino group, C1-C10 alkylsilyl group, C6-C18 arylsilyl group, and C6-C12 aryloxy group. It means becoming.
한편, 본 발명에서의 상기 "치환 또는 비치환된 C1-C20의 알킬기", "치환 또는 비치환된 C6-C50의 아릴기" 등에서의 상기 알킬기 또는 아릴기의 범위를 고려하여 보면, 상기 C1-C20의 알킬기 및 C6-C50의 아릴기의 탄소수의 범위는 각각 상기 치환기가 치환된 부분을 고려하지 않고 비치환된 것으로 보았을 때의 알킬 부분 또는 아릴 부분을 구성하는 전체 탄소수를 의미하는 것이다. 예컨대, 파라위치에 부틸기가 치환된 페닐기는 C4의 부틸기로 치환된 C6의 아릴기에 해당하는 것으로 보아야 한다. Meanwhile, considering the range of the alkyl group or aryl group in the “substituted or unsubstituted C 1 -C 20 alkyl group” and “substituted or unsubstituted C 6 -C 50 aryl group” in the present invention, , the range of the carbon number of the C 1 -C 20 alkyl group and the C 6 -C 50 aryl group is the entire alkyl portion or aryl portion when viewed as unsubstituted without considering the portion on which the substituent is substituted. It means carbon number. For example, a phenyl group substituted with a butyl group at the para position should be viewed as corresponding to an aryl group at C 6 substituted with a butyl group at C 4 .
본 발명의 화합물에서 사용되는 치환기인 아릴기는 하나의 수소 제거에 의해서 방향족 탄화수소로부터 유도된 유기 라디칼로, 5 내지 7원, 바람직하게는 5 또는 6원을 포함하는 단일 또는 융합고리계를 포함하며, 또한 상기 아릴기에 치환기가 있는 경우 이웃하는 치환기와 서로 융합 (fused)되어 고리를 추가로 형성할 수 있다.The aryl group, which is a substituent used in the compound of the present invention, is an organic radical derived from an aromatic hydrocarbon by removal of one hydrogen, and contains a single or fused ring system containing 5 to 7 members, preferably 5 or 6 members, Additionally, if the aryl group has a substituent, it may be fused with neighboring substituents to further form a ring.
상기 아릴기의 구체적인 예로는 페닐기, o-비페닐기, m-비페닐기, p-비페닐기, 터페닐기(바람직하게는 o-터페닐기, m-터페닐기, p-터페닐기), 나프틸기, 안트릴기, 페난트릴기, 피레닐기, 인데닐, 플루오레닐기, 테트라히드로나프틸기, 페릴렌일, 크라이세닐, 나프타세닐, 플루오란텐일등과 같은 방향족 그룹을 들 수 있고, 상기 아릴기 중 하나 이상의 수소 원자는 중수소 원자, 할로겐 원자, 히드록시기, 니트로기, 시아노기, 실릴기, 아미노기 (-NH2, -NH(R), -N(R')(R''), R'과 R"은 서로 독립적으로 C1-C10의 알킬기이며, 이 경우 "알킬아미노기"라 함), 아미디노기, 히드라진기, 히드라존기, 카르복실기, 술폰산기, 인산기, C1-C24의 알킬기, C1-C24의 할로겐화된 알킬기, C2-C24의 알케닐기, C2-C24의 알키닐기, C1-C24의 헤테로알킬기, C6-C24의 아릴기, C7-C24의 아릴알킬기, C2-C24의 헤테로아릴기 또는 C2-C24의 헤테로아릴알킬기로 치환될 수 있다.Specific examples of the aryl group include phenyl group, o-biphenyl group, m-biphenyl group, p-biphenyl group, terphenyl group (preferably o-terphenyl group, m-terphenyl group, p-terphenyl group), naphthyl group, and aromatic groups such as toryl group, phenanthryl group, pyrenyl group, indenyl, fluorenyl group, tetrahydronaphthyl group, perylenyl, chrysenyl, naphthacenyl, fluoranthenyl, etc., and one or more of the aryl groups above. The hydrogen atom is a deuterium atom, a halogen atom, a hydroxy group, a nitro group, a cyano group, a silyl group, an amino group (-NH2, -NH(R), -N(R')(R''), R' and R" are each other. Independently an alkyl group of C 1 -C 10 , in this case referred to as “alkylamino group”), amidino group, hydrazine group, hydrazone group, carboxyl group, sulfonic acid group, phosphoric acid group, alkyl group of C 1 -C 24 , C 1 -C 24 halogenated alkyl group, C 2 -C 24 alkenyl group, C 2 -C 24 alkynyl group, C 1 -C 24 heteroalkyl group, C 6 -C 24 aryl group, C 7 -C 24 arylalkyl group , may be substituted with a C 2 -C 24 heteroaryl group or a C 2 -C 24 heteroarylalkyl group.
본 발명의 화합물에서 사용되는 치환기인 헤테로아릴기는 아릴기에서 N, O, P, Si, S, Ge, Se, Te 중에서 선택된 1, 2 또는 3개의 헤테로원자를 포함하고, 나머지 고리 원자가 탄소인 탄소수 2 내지 50, 바람직하게는 2 내지 24의 고리 방향족 시스템을 의미하며, 상기 고리들은 융합(fused)되어 고리를 형성할 수 있다. 그리고 상기 헤테로아릴기 중 하나 이상의 수소 원자는 상기 아릴기의 경우와 마찬가지의 치환기로 치환가능하다.The heteroaryl group, which is a substituent used in the compound of the present invention, contains 1, 2, or 3 heteroatoms selected from N, O, P, Si, S, Ge, Se, and Te in the aryl group, and the remaining ring atom is carbon. It refers to an aromatic system with 2 to 50 rings, preferably 2 to 24 rings, and the rings can be fused to form a ring. And one or more hydrogen atoms of the heteroaryl group may be replaced with the same substituent as that of the aryl group.
또한 본 발명에서 사용되는 치환기인 알킬기는 알칸(alkane)으로부터 수소 하나가 제거된 치환기로서, 직쇄형 알킬기, 분지형 알킬기 또는 고리형 알킬기를 모두 포함하며, 또한 상기 직쇄형 알킬기와 고리형 알킬기가 혼합된 알킬기; 및 분지형 알킬기와 고리형 알킬기가 혼합된 알킬기;를 모두 포함하는 것으로 해석되어야 하며, 이의 구체적인 예로는 메틸, 에틸, 프로필, 이소프로필, 이소부틸, sec-부틸, tert-부틸, 펜틸, iso-아밀, 헥실, 시클로프로필, 시클로부틸, 시클로펜틸, 시클로헥실, 메틸시클로펜틸, 메틸시클로헥실, 에틸시클로펜틸, 에틸시클로헥실, 아다만틸, 디시클로펜타디에닐, 데카히드로나프틸, 노보닐, 보닐, 아이소보닐 등을 들 수 있고, 상기 알킬기 중 하나 이상의 수소 원자는 원자는 상기 아릴기의 경우와 마찬가지의 치환기로 치환가능하다.In addition, the alkyl group, which is a substituent used in the present invention, is a substituent in which one hydrogen is removed from an alkane, and includes all of a straight-chain alkyl group, a branched alkyl group, or a cyclic alkyl group, and a mixture of the linear alkyl group and the cyclic alkyl group. alkyl group; and an alkyl group that is a mixture of a branched alkyl group and a cyclic alkyl group; specific examples thereof include methyl, ethyl, propyl, isopropyl, isobutyl, sec-butyl, tert-butyl, pentyl, iso- Amyl, hexyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, methylcyclopentyl, methylcyclohexyl, ethylcyclopentyl, ethylcyclohexyl, adamantyl, dicyclopentadienyl, decahydronaphthyl, norbornyl, Bornyl, isobornyl, etc. may be mentioned, and at least one hydrogen atom of the alkyl group may be replaced with the same substituent as that of the aryl group.
본 발명의 화합물에서 사용되는 치환기인 알콕시기는 알칸(alkane)의 마지막 탄소위치에 산소원자가 결합된 치환기로서, 직쇄형 알킬기, 분지형 알킬기 또는 고리형 알킬기에 각각 산소원자가 결합된 경우 를 모두 포함하며, 또한 상기 직쇄형 알킬기와 고리형 알킬기가 혼합된 알킬기에 각각 산소원자가 결합된 경우; 및 분지형 알킬기와 고리형 알킬기가 혼합된 알킬기에 각각 산소원자가 결합된 경우;를 모두 포함하는 것으로 해석되어야 하며, 이의 구체적인 예로는 메톡시, 에톡시, 프로폭시, 이소부틸옥시, sec-부틸옥시, 펜틸옥시, iso-아밀옥시, 헥실옥시, 아다만탄옥시, 디시클로펜탄옥시, 보닐옥시 등을 들 수 있고, 상기 알콕시기 중 하나 이상의 수소 원자는 상기 아릴기의 경우와 마찬가지의 치환기로 치환가능하다.The alkoxy group, which is a substituent used in the compound of the present invention, is a substituent in which an oxygen atom is bonded to the last carbon position of an alkane, and includes cases where an oxygen atom is bonded to a straight-chain alkyl group, a branched alkyl group, or a cyclic alkyl group, respectively. In addition, when oxygen atoms are each bonded to the alkyl group that is a mixture of the linear alkyl group and the cyclic alkyl group; and a case where an oxygen atom is bonded to an alkyl group that is a mixture of a branched alkyl group and a cyclic alkyl group; specific examples thereof include methoxy, ethoxy, propoxy, isobutyloxy, and sec-butyloxy. , pentyloxy, iso-amyloxy, hexyloxy, adamantaneoxy, dicyclopentaneoxy, bornyloxy, etc., and at least one hydrogen atom of the alkoxy group is the same as the substituent as in the case of the aryl group. Substitution is possible.
본 발명의 화합물에서 사용되는 치환기인 아릴알킬기의 구체적인 예로는 페닐메틸(벤질), 페닐에틸, 페닐프로필, 나프틸메틸 및 나프틸에틸 등을 들 수 있고, 상기 아릴알킬기 중 하나 이상의 수소 원자는 상기 아릴기의 경우와 마찬가지의 치환기로 치환가능하다.Specific examples of the arylalkyl group as a substituent used in the compound of the present invention include phenylmethyl (benzyl), phenylethyl, phenylpropyl, naphthylmethyl, and naphthylethyl, and at least one hydrogen atom of the arylalkyl group is as described above. It can be substituted with the same substituent as in the case of an aryl group.
본 발명의 화합물에서 사용되는 치환기인 알킬아릴기의 구체적인 예로는 에틸페닐, 프로필페닐, 메틸나프틸 및 에틸나프틸 등을 들 수 있고, 상기 알킬아릴기 중 하나 이상의 수소 원자는 상기 아릴기의 경우와 마찬가지의 치환기로 치환가능하다.Specific examples of the alkylaryl group as a substituent used in the compound of the present invention include ethylphenyl, propylphenyl, methylnaphthyl, and ethylnaphthyl, and at least one hydrogen atom of the alkylaryl group is in the case of the aryl group. It can be substituted with the same substituent.
본 발명의 화합물에서 사용되는 치환기인 실릴기의 구체적인 예로는 트리메틸실릴, 트리에틸실릴, 트리페닐실릴, 트리메톡시실릴, 디메톡시페닐실릴, 디페닐메틸실릴, 디페닐비닐실릴, 메틸사이클로뷰틸실릴, 디메틸퓨릴실릴 등을 들 수 있고, 상기 실릴기 중 하나 이상의 수소 원자는 상기 아릴기의 경우와 마찬가지의 치환기로 치환가능하다.Specific examples of the silyl group as a substituent used in the compound of the present invention include trimethylsilyl, triethylsilyl, triphenylsilyl, trimethoxysilyl, dimethoxyphenylsilyl, diphenylmethylsilyl, diphenylvinylsilyl, and methylcyclobutylsilyl. , dimethylfurylsilyl, etc., and one or more hydrogen atoms of the silyl group may be replaced with the same substituent as that of the aryl group.
또한, 본 발명에서 알케닐(alkenyl)기는 두 개의 탄소원자에 의해 이루어지는 하나의 탄소-탄소 이중 결합을 포함하는 알킬 치환기를 의미하며, 또한 알키닐(alkynyl)기는 두 개의 탄소원자에 의해 이루어지는 하나의 탄소-탄소 삼중 결합을 포함하는 치환기를 의미한다.In addition, in the present invention, an alkenyl group refers to an alkyl substituent containing one carbon-carbon double bond made up of two carbon atoms, and an alkynyl group means one made up of two carbon atoms. It refers to a substituent containing a carbon-carbon triple bond.
또한, 본 발명에서 사용되는 알킬렌(alkylene)기는 직쇄형 또는 분지형 형태의 포화탄화수소인 알칸(alkane) 분자내 두 개의 수소 제거에 의하여 유도된 유기 라디칼로, 상기 알킬렌기의 구체적인 예로는 메틸렌기, 에틸렌기, 프로필렌기, 이소프로필렌기, 이소부틸렌기, sec-부틸렌기, tert-부틸렌기, 펜틸렌기, iso-아밀렌기, 헥실렌기 등을 들 수 있고, 상기 알킬렌기 중 하나 이상의 수소 원자는 원자는 상기 아릴기의 경우와 마찬가지의 치환기로 치환가능하다.In addition, the alkylene group used in the present invention is an organic radical derived by removing two hydrogens in an alkane molecule, which is a straight-chain or branched saturated hydrocarbon. Specific examples of the alkylene group include methylene group. , ethylene group, propylene group, isopropylene group, isobutylene group, sec-butylene group, tert-butylene group, pentylene group, iso-amylene group, hexylene group, etc., and hydrogen at least one of the alkylene groups Atoms can be substituted with the same substituents as in the case of the aryl group above.
또한, 본 발명에서 사용되는 (메타)아크릴기, (메타)아크릴레이트, (메타)아크릴아미드 등에서의 "(메타)아크릴" 은 "아크릴(acryl) 및/또는 메타아크릴(methacryl)"을 의미한다. In addition, “(meth)acryl” in the (meth)acrylic group, (meth)acrylate, (meth)acrylamide, etc. used in the present invention means “acryl and/or methacryl”. .
한편, 상기 [화학식 1]에서의 '치환 또는 비치환된'에서의 '치환'에 대한 보다 바람직한 예로서, 중수소, 시아노기, 할로겐기, 히드록시기, 니트로기, C1-C6의 알킬기, C1-C6의 할로겐화된 알킬기, C2-C6의 알케닐기, C2-C6의 알키닐기, C1-C6의 헤테로알킬기, C6-C12의 아릴기, C7-C14의 아릴알킬기, C7-C14의 알킬아릴기, C1-C6의 알콕시기, C1-C6알킬티오닐기, C1-C6의 알킬아미노기, C6-C12의 아릴아미노기, C1-C10의 알킬실릴기, C6-C18의 아릴실릴기, C6-C12의 아릴옥시기로 이루어진 군에서 선택된 어느 하나의 치환기로 치환되는 것을 의미할 수 있다.Meanwhile, more preferable examples of 'substitution' in 'substituted or unsubstituted' in [Formula 1] include deuterium, cyano group, halogen group, hydroxy group, nitro group, C1-C6 alkyl group, C1-C6 Halogenated alkyl group, C2-C6 alkenyl group, C2-C6 alkynyl group, C1-C6 heteroalkyl group, C6-C12 aryl group, C7-C14 arylalkyl group, C7-C14 alkylaryl group, C1- C6 alkoxy group, C1-C6 alkylthionyl group, C1-C6 alkylamino group, C6-C12 arylamino group, C1-C10 alkylsilyl group, C6-C18 arylsilyl group, C6-C12 aryloxy group. It may mean being substituted with any one substituent selected from the group consisting of
한편, 본 발명에 따른 [화학식 1]로 표시되는 아크릴 화합물은 분자내 X와 연결된 탄소원자에 방향족 치환기인 Ar1이 결합되고, 또한 일정 정도 사슬길이가 긴 지방족 탄화수소(예컨대 적어도 6개 이상, 바람직하게는 7개 이상의 탄소원자를 가지는 사슬)인 R3가 결합된 것을 기술적 특징으로 하며, 이를 통하여 전자의 분포가 고루 퍼지게 만들어줄 수 있고, 종래 기술에 따른 모노머 화합물보다 낮은 유전율을 가지며, 높은 드라이에칭 내성을 가지므로 코팅액 조성물의 봉지공정에 있어서의 플라스마 데미지를 억제할 있으며 박막디스플레이 소자의 신뢰성을 향상시킬 수 있다. On the other hand, the acrylic compound represented by [Formula 1] according to the present invention has Ar1, an aromatic substituent, bonded to the carbon atom connected to Its technical feature is that R3, which is a chain with 7 or more carbon atoms, is bonded, and through this, it can make the distribution of electrons evenly spread, has a lower dielectric constant than the monomer compound according to the prior art, and has high dry etching resistance. Therefore, plasma damage during the encapsulation process of the coating composition can be suppressed and the reliability of the thin film display device can be improved.
즉, 종래의 코팅액 조성물로서 사용하는 '단관능성' 아크릴레이트 화합물은 관능기가 적음으로써 기인하는, 수분이 흡착이 적으며, 낮은 유전율 및 우수한 접착력 등의 장점을 가지는 반면, 이에 반하여 코팅용 조성물내 단관능성 아크릴레이트 화합물의 비중이 높아지는 경우에 무기물 코팅시 CVD 공정 단계에서 Haze가 발생하는 등의 문제가 발생하는 문제점을 가지고 있다. In other words, the 'monofunctional' acrylate compound used as a conventional coating liquid composition has advantages such as low moisture adsorption, low dielectric constant, and excellent adhesion due to the small number of functional groups, whereas the monofunctional acrylate compound in the coating composition has advantages such as low dielectric constant and excellent adhesion. When the specific gravity of the functional acrylate compound increases, problems such as haze occurring in the CVD process stage during inorganic coating occur.
따라서, 이러한 관점하에서, 본 발명은 코팅용 조성물에 사용할 수 있는 모노머 화합물로서, 상기 [화학식 1]로 표시되는 아크릴 화합물내 상기 X와 연결된 탄소원자에 일정 정도 사슬길이가 긴 지방족 탄화수소(예컨대 적어도 6개 이상, 바람직하게는 7개 이상의 탄소원자를 가지는 사슬) 치환기인 R3를 도입시키도록 분자구조를 디자인하여, 기존의 이관능성 화합물에 비하여 코팅액 조성물로 사용하는 경우에 낮은 유전율을 나타내며, 높은 드라이에칭 내성을 나타낼 수 있어 OLED 등의 봉지공정에 있어서의 플라스마 데미지를 억제할 수 있는 특성을 가지도록 하는 아크릴 화합물을 제공할 수 있다. Therefore, from this point of view, the present invention is a monomer compound that can be used in a coating composition, which contains an aliphatic hydrocarbon with a chain length to a certain extent (for example, at least 6) to the carbon atom connected to the The molecular structure is designed to introduce R 3 , a substituent (chain having at least 7 carbon atoms, preferably at least 7 carbon atoms), and has a low dielectric constant when used as a coating composition compared to existing bifunctional compounds, and has high dry etching properties. It is possible to provide an acrylic compound that can exhibit resistance and has properties that can suppress plasma damage in the encapsulation process of OLED, etc.
즉, 본 발명에 따른 상기 [화학식 1]로 표시되는 아크릴 화합물은 치환기 R3 가 적어도 6개 이상의 탄소원자를 포함하는 치환기일 수 있으며, 바람직하게는 7개 이상의 탄소원자를 포함하는 치환기일 수 있고, 상기 치환기 R3 의 구체적 예로서, 이는 치환 또는 비치환된 C6~C30의 알킬기 및 치환 또는 비치환된 C6~C30의 할로겐화된 알킬기 중에서 선택되는 어느 하나의 치환기 일 수 있다. That is, the acrylic compound represented by [Formula 1] according to the present invention has a substituent R 3 It may be a substituent containing at least 6 carbon atoms, and preferably may be a substituent containing 7 or more carbon atoms. As a specific example of the substituent R 3 , it is a substituted or unsubstituted alkyl group of C6 to C30 and a substituted Alternatively, it may be any one substituent selected from unsubstituted C6~C30 halogenated alkyl groups.
한편, 상기 치환기 R3의 탄소수가 6개 미만의 경우에는 짧은 체인에 따른 낮은 분자량에 의해 유전율의 증가 경향 및 단단해지는 성상을 보이며 접착력이 크게 떨어지는 문제가 발생할 수 있다. 따라서, 본 발명은 원하는 유전율을 얻기 위해서는 상기 R3 구조의 치환기에서의 최소한 6 개이상, 바람직하게는 7 개이상의 탄소 체인을 가지고 있는 경우 앞서의 문제점을 해결할 수 있으며, 다만 너무 긴 탄소체인을 가진 경우 분자량의 증가로 유전율은 낮아 질 수 있고, 상대적으로 열적 불안정에 따른 CVD 공정단계에서 문제가 발생할 수 있어 30개 이하, 바람직하게는 24개 이하 더욱 바람직하게는 20개 이하의 적절한 길이를 가지고 있어야 한다. On the other hand, when the number of carbon atoms of the substituent R 3 is less than 6, the dielectric constant tends to increase and hardening due to the low molecular weight due to the short chain, and adhesive strength may be greatly reduced. Therefore, in order to obtain the desired dielectric constant, the present invention can solve the above problem when the substituent of the R 3 structure has at least 6 or more carbon chains, preferably 7 or more carbon chains, but has a carbon chain that is too long. In this case, the dielectric constant may be lowered due to an increase in molecular weight, and problems may occur in the CVD process stage due to relative thermal instability, so it must have an appropriate length of 30 or less, preferably 24 or less, and more preferably 20 or less. do.
또한, 상기 [화학식 1]로 표시되는 아크릴 화합물내 X와 결합하는 탄소원자내 결합된 치환기 Ar1 의 구체적 예로서, 이는 치환 또는 비치환된 C6~C24의 아릴기 및 치환 또는 비치환되고 이종 원자로 O, N 또는 S를 1 내지 2개 포함하는 C4~C24의 헤테로아릴기 중에서 선택되는 어느 하나의 치환기 일 수 있다. In addition, as a specific example of the substituent Ar 1 bonded to the carbon atom bonded to It may be any one substituent selected from C4 to C24 heteroaryl groups containing 1 to 2 O, N, or S.
따라서, 상기 [화학식 1]로 표시되는 아크릴 화합물은 상기 치환기 R3 및 Ar1의 도입을 통해, 분자량을 증가시켜 유전율 및 열안정성을 향상시킬 수 있으며, 전자가 고르게 분포하여 극성이 낮으며, 종래기술에 따른 (메타)아크릴기를 포함하는 이관능성 모노머 화합물보다 낮은 유전율을 나타낼 수 있다. Therefore, the acrylic compound represented by [Formula 1] can improve dielectric constant and thermal stability by increasing the molecular weight through the introduction of the substituents R 3 and Ar 1 , has low polarity due to even distribution of electrons, and has a low polarity compared to the conventional It can exhibit a lower dielectric constant than a difunctional monomer compound containing a (meth)acrylic group according to the technology.
본 발명에 따른 일 실시예로서, 상기 치환기 R1은 바람직하게는 수소, 중수소 또는 C1~C5의 비치환된 알킬기 중에서 선택되는 어느 하나일 수 있다.As an example according to the present invention, the substituent R 1 may preferably be any one selected from hydrogen, deuterium, or an unsubstituted alkyl group of C1 to C5.
또한, 본 발명에 따른 일 실시예로서, 상기 치환기 R'및 R2는 바람직하게는 상기 R'및 R2는 각각 동일하거나 상이하며, 서로 독립적으로 수소, 중수소, 치환 또는 비치환된 C1~C10의 알킬기, 치환 또는 비치환된 C6~C18의 아릴기, 중에서 선택되는 어느 하나일 수 있으며, 더욱 바람직하게는 수소 또는 중수소일 수 있다.In addition, as an embodiment of the present invention, the substituents R' and R 2 are preferably the same or different from each other, and are independently hydrogen, deuterium, substituted or unsubstituted C1 to C10. It may be any one selected from an alkyl group, a substituted or unsubstituted C6 to C18 aryl group, and more preferably hydrogen or deuterium.
또한, 본 발명에 따른 상기 치환기 R3는 더욱 바람직하게는, 치환 또는 비치환된 C7~C20의 알킬기일 수 있다. In addition, the substituent R 3 according to the present invention may be a substituted or unsubstituted C7 to C20 alkyl group.
또한, 본 발명에 따른 상기 연결기 X 의 구체적 예로서, 이는 산소(O)일 수 있다. Additionally, as a specific example of the linking group X according to the present invention, it may be oxygen (O).
또한, 본 발명에 따른 상기 치환기 Ar1의 구체적 예로서, 이는 치환 또는 비치환된 페닐기 또는 치환 또는 비치환된 나프틸기일 수 있다.Additionally, as a specific example of the substituent Ar1 according to the present invention, it may be a substituted or unsubstituted phenyl group or a substituted or unsubstituted naphthyl group.
한편, 본 발명에 따른 상기 화학식 1로 표시되는 아크릴 화합물의 구체적 예로서, 이는 하기 화합물 1 내지 화합물 46 중에서 선택되는 어느 하나일 수 있으나 이에 제한되지 않는다. Meanwhile, as a specific example of the acrylic compound represented by Formula 1 according to the present invention, it may be any one selected from Compound 1 to Compound 46 below, but is not limited thereto.
<화합물 1> <화합물 2> <화합물 3><Compound 1> <Compound 2> <Compound 3>
<화합물 4> <화합물 5> <화합물 6><Compound 4> <Compound 5> <Compound 6>
<화합물 7> <화합물 8> <화합물 9><Compound 7> <Compound 8> <Compound 9>
<화합물 10> <화합물 11> <화합물 12><Compound 10> <Compound 11> <Compound 12>
<화합물 13> <화합물 14> <화합물 15><Compound 13> <Compound 14> <Compound 15>
<화합물 16> <화합물 17> <화합물 18><Compound 16> <Compound 17> <Compound 18>
<화합물 19> <화합물 20> <화합물 21><Compound 19> <Compound 20> <Compound 21>
<화합물 22> <화합물 23> <화합물 24><Compound 22> <Compound 23> <Compound 24>
<화합물 25> <화합물 26> <화합물 27><Compound 25> <Compound 26> <Compound 27>
<화합물 28> <화합물 29> <화합물 30><Compound 28> <Compound 29> <Compound 30>
<화합물 31> <화합물 32> <화합물 33><Compound 31> <Compound 32> <Compound 33>
<화합물 34> <화합물 35> <화합물 36><Compound 34> <Compound 35> <Compound 36>
<화합물 37> <화합물 38> <화합물 39><Compound 37> <Compound 38> <Compound 39>
<화합물 40> <화합물 41> <화합물 42><Compound 40> <Compound 41> <Compound 42>
<화합물 43> <화합물 44> <화합물 45><Compound 43> <Compound 44> <Compound 45>
<화합물 46> <Compound 46>
또한, 본 발명은 상기 [화학식 1] 로 표시되는 (방향족 치환기 및 지방족 치환기를 동시에 포함하는)아크릴 화합물을 포함하는 코팅액 조성물을 제공한다.In addition, the present invention provides a coating liquid composition containing an acrylic compound (containing both an aromatic substituent and an aliphatic substituent) represented by the above [Formula 1].
여기서 상기 코팅액 조성물의 구체적 예시로서, 이는 상기 [화학식 1] 로 표시되는 아크릴 화합물(A) 1 ~ 80 중량(wt)%; 상기 아크릴 화합물(A)과 중합가능한 다관능성 아크릴 모노머 화합물(B) 19 ~ 80 중량(wt)%; 및 중합개시제(D) 0.1 ~ 20 중량(wt)%를 포함할 수 있다. Here, as a specific example of the coating liquid composition, it includes 1 to 80% by weight (wt) of the acrylic compound (A) represented by [Formula 1]; 19 to 80% by weight (wt) of a multifunctional acrylic monomer compound (B) polymerizable with the acrylic compound (A); And it may include 0.1 to 20 weight (wt)% of a polymerization initiator (D).
한편, 본 발명에 따른 코팅액 조성물내 상기 [화학식 1]로 표시되는 특정한 구조를 가지는 아크릴 화합물(A)의 성분은 상기 [화학식 1]로 표시되는 1종, 또는 상기 [화학식 1]로 표시되는 2종 이상의 화합물들의 혼합성분을 포함하는 혼합물을 의미한다. 즉, 본 발명의 명세서내 상기 [화학식 1]로 표시되는 아크릴 화합물(A) '1 내지 80 wt%'는 '[상기 화학식 1]로 표시되는 아크릴 화합물 또는 [화학식 1]로 표시되는 복수의 아크릴 화합물들의 혼합성분'이 '1 내지 80 wt%' 임을 의미하여, 바람직하게는 [화학식 1]로 표시되는 아크릴 화합물 단독 또는 [화학식 1]로 표시되는 2 내지 5종의 아크릴 화합물들의 혼합성분'이 사용될 수 있고, 이는 이하에서 상술되는 '다관능성 아크릴 화합물(B)'의 성분에서도 마찬가지로 해석된다. Meanwhile, the component of the acrylic compound (A) having a specific structure represented by [Formula 1] in the coating liquid composition according to the present invention is one type represented by [Formula 1], or 2 represented by [Formula 1]. It refers to a mixture containing a mixture of more than one type of compound. That is, in the specification of the present invention, the acrylic compound (A) represented by [Formula 1] '1 to 80 wt%' refers to 'an acrylic compound represented by [Formula 1] or a plurality of acrylics represented by [Formula 1]. This means that the 'mixed component of compounds' is '1 to 80 wt%', preferably the acrylic compound represented by [Formula 1] alone or the mixed component of 2 to 5 types of acrylic compounds represented by [Formula 1]. It can be used, and this is interpreted similarly to the components of the 'multifunctional acrylic compound (B)' described in detail below.
여기서, 상기 다관능성 아크릴 화합물(B)는 분자내 두 개 이상의, 중합가능한 아크릴기 또는 메타아크릴기를 포함하는 화합물로서, 최종적으로 생성한 피막의 가교 속도를 높이는 효과를 얻을 수 있고 피막의 경도, 인성을 높일 수 있다. Here, the multifunctional acrylic compound (B) is a compound containing two or more polymerizable acrylic or methacrylic groups in the molecule, and has the effect of increasing the crosslinking speed of the final film produced and improving the hardness and toughness of the film. can increase.
따라서, 상기 다관능성 아크릴 화합물(B)을 본 발명에 따른 코팅액 조성물에 적절한 비율로 포함시키는 경우에, 코팅액 조성물의 광경화율을 높일 수 있으며, 생성된 피막의 신뢰성을 높여 무기층 코팅시 발생할 수 있는 haze 현상을 방지할 수 있어 플렉시블 기판에 특히, 유용하며 유기 박막 디스플레이의 코팅액 조성물로서 사용될 수 있다. Therefore, when the multifunctional acrylic compound (B) is included in an appropriate ratio in the coating liquid composition according to the present invention, the photocuring rate of the coating liquid composition can be increased, and the reliability of the resulting film can be increased to reduce the risk that may occur during inorganic layer coating. It is particularly useful for flexible substrates because it can prevent the haze phenomenon, and can be used as a coating liquid composition for organic thin film displays.
여기서, 상기 코팅액 조성물에 있어, 상기 아크릴 화합물(A)과 중합가능한 다관능성 아크릴 화합물(B)는 상기 아크릴 화합물(A)와 중합이 가능하여 고분자 또는 올리고머를 형성할 수 있는 2개 이상의, 아크릴기 또는 메타아크릴기를 가진 화합물이면 종류에 제한되지 않고 사용될 수 있다. Here, in the coating liquid composition, the multifunctional acrylic compound (B) polymerizable with the acrylic compound (A) is composed of two or more acrylic groups that can be polymerized with the acrylic compound (A) to form a polymer or oligomer. Alternatively, any compound having a methacrylic group can be used without limitation in type.
본 발명에서, 상기 중합 가능한 다관능성 아크릴 화합물(B)의 보다 바람직한 구조로서 이는, 2개의 (메타)아크릴기를 갖는 디(메타)아크릴레이트, 분자 내에 3개 이상의 (메타)아크릴 기를 갖는 다관능성 (메타)아크릴레이트, 우레탄(메타)아크릴레이트, 에폭시(메타)아크릴레이트, 폴리에스테르(메타)아크릴레이트 등의 다관능 화합물 중에서 선택된 어느 하나 이상을 포함하는 모노머 화합물일 수 있다. In the present invention, a more preferable structure of the polymerizable multifunctional acrylic compound (B) is di(meth)acrylate having two (meth)acrylic groups, polyfunctional having three or more (meth)acrylic groups in the molecule ( It may be a monomer compound containing at least one selected from polyfunctional compounds such as meta)acrylate, urethane (meth)acrylate, epoxy (meth)acrylate, and polyester (meth)acrylate.
보다 구체적으로, 상기 다관능성 아크릴 화합물(B)은 1,4-부탄디올디(메타)아크릴레이트, 1,6-헥산디올디(메타)아크릴레이트, 1,9-노난디올디(메타)아크릴레이트, 1,10-데칸디올디(메타)아크릴레이트, 1,12-도데칸디올디(메타)아크릴레이트, 1,14-테트라데칸디올디(메타)아크릴레이트, 1,14-테트라데칸디올디(메타)아크릴레이트, 1,16-헥사데칸디올디(메타) 아크릴레이트, 폴리테트라메틸렌글리콜디(메타)아크릴레이트 등의 직쇄상 메틸렌 구조를 갖는 알칸디올에 두개의 (메타)아크릴기가 치환된 구조, 폴리에틸렌글리콜디(메타)아크릴레이트, 폴리프로필렌글리콜디(메타)아크릴레이트 등 폴리에틸렌그리콜, 폴리프로필렌글리콜에 두개의 (메타)아크릴기가 치환된 구조, 트리시클로데칸디메탄올디아크릴레이트, 아다만탄-1,2-디닐다아크릴레이트 등의 환상 구조를 갖는 (메타)아크릴레이트, 펜타에리스리톨트리(메타)아크릴레이트, 펜타에리스리톨(폴리)에톡시트리(메타)아크릴레이트, 펜타에리스리톨(폴리)프로폭시트리(메타)아크릴레이트, 펜타에리스리톨테트라(메타)아크릴레이트, 펜타에리스리톨(폴리)에톡시테트라(메타)아크릴레이트, 펜타에리스리톨(폴리)프로폭시테트라(메타)아크릴레이트, 디펜타에리스리톨펜타(메타)아크릴레이트, 디펜타에리스리톨(폴리)카프로락톤펜타(메타)아크릴레이트, 디펜타에리스리톨(폴리)에톡시펜타(메타)아크릴레이트, 디펜타에리스리톨(폴리)프로폭시펜타(메타)아크릴레이트, 디펜타에리스리톨헥사(메타)아크릴레이트, 디펜타에리스리톨(폴리)카프로락톤헥사(메타)아크릴레이트, 디펜타에리스리톨(폴리)에톡시헥사(메타)아크릴레이트, 디펜타에리스리톨(폴리)프로폭시헥사(메타)아크릴레이트, 폴리펜타에리스리톨폴리(메타)아크릴레이트, 트리메틸롤프로판트리(메타)아크릴레이트, 트리메틸롤프로판(폴리)에톡시트리(메타)아크릴레이트, 트리메틸롤프로판(폴리)프로폭시트리(메타)아크릴레이트, 디메틸롤프로판테트라(메타)아크릴레이트, 글리세롤트리(메타)아크릴레이트 등의 다가 알코올의 다관능 (메타)아크릴레이트, 2,2,2-트리스아크릴옥시메틸숙신산등의 산변성된 다관능 (메타)아크릴레이트, 실리콘헥사(메타)아크릴레이트 등의 실리콘 골격을 갖는 다관능 (메타)아크릴레이트 등을 들 수 있다.More specifically, the multifunctional acrylic compound (B) is 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and 1,9-nonanediol di(meth)acrylate. , 1,10-decanediol di(meth)acrylate, 1,12-dodecane diol di(meth)acrylate, 1,14-tetradecanediol di(meth)acrylate, 1,14-tetradecanediol diol ( A structure in which two (meth)acrylic groups are substituted for an alkanediol with a linear methylene structure, such as meta)acrylate, 1,16-hexadecanediol di(meth)acrylate, and polytetramethylene glycol di(meth)acrylate. , polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, etc. Polyethylene glycol, structure in which two (meth)acrylic groups are substituted in polypropylene glycol, tricyclodecane dimethanol diacrylate, adaman (meth)acrylates with cyclic structures such as tan-1,2-dinyldiacrylate, pentaerythritol tri(meth)acrylate, pentaerythritol (poly)ethoxytri(meth)acrylate, pentaerythritol (poly) Propoxytri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol(poly)ethoxytetra(meth)acrylate, pentaerythritol(poly)propoxytetra(meth)acrylate, dipentaerythritol penta (meth)acrylate, dipentaerythritol (poly)caprolactone penta(meth)acrylate, dipentaerythritol (poly)ethoxypenta(meth)acrylate, dipentaerythritol (poly)propoxy penta(meth)acrylate , dipentaerythritol hexa(meth)acrylate, dipentaerythritol(poly)caprolactone hexa(meth)acrylate, dipentaerythritol(poly)ethoxyhexa(meth)acrylate, dipentaerythritol(poly)propoxyhexa(meth)acrylate (meth)acrylate, polypentaerythritol poly(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane(poly)ethoxytri(meth)acrylate, trimethylolpropane(poly)propoxytri (meth)acrylate, dimethylolpropane tetra(meth)acrylate, polyfunctional (meth)acrylate of polyhydric alcohol such as glycerol tri(meth)acrylate, acid such as 2,2,2-trisacryloxymethylsuccinic acid Polyfunctional (meth)acrylates having a silicone skeleton such as modified polyfunctional (meth)acrylate and silicon hexa(meth)acrylate can be mentioned.
여기서, 본 발명의 상기 [화학식 1]로 표시되는 아크릴 화합물(A)의 함유량은 전체 조성물을 기준으로, 1 내지 80 중량%을 포함할 수 있으며, 바람직하게는 10 ~ 74 중량 %을 포함할 수 있고, 더욱 바람직하게는 13 ~ 70 중량%을 포함할 수 있다. Here, the content of the acrylic compound (A) represented by [Formula 1] of the present invention may include 1 to 80% by weight, preferably 10 to 74% by weight, based on the total composition. and, more preferably, may contain 13 to 70% by weight.
또한, 상기 다관능성 아크릴 화합물(B)의 함유량은 전체 조성물을 기준으로, 19 ~ 80 중량 %을 포함할 수 있으며, 바람직하게는 25 ~ 80 중량 %을 포함할 수 있고, 더욱 바람직하게는 28 ~ 80 중량%을 포함할 수 있다. In addition, the content of the multifunctional acrylic compound (B) may include 19 to 80% by weight, preferably 25 to 80% by weight, and more preferably 28 to 80% by weight, based on the total composition. It may contain 80% by weight.
또한 본 발명에서 상기 다관능성 아크릴 화합물(B)로 인해 생성된 피막은 금속과의 접착력이 우수하고, 경화 수축율이 낮은 특성을 나타내어 다관능성 아크릴 화합물(B)이 포함된 조성물이 신뢰성 있는 박막을 형성할 수 있다. In addition, the film produced from the multifunctional acrylic compound (B) in the present invention has excellent adhesion to metal and low curing shrinkage, so that the composition containing the multifunctional acrylic compound (B) forms a reliable thin film. can do.
또한, 본 발명에 따른 코팅액 조성물이 상기 다관능성 아크릴 화합물(B)을 포함하는 경우에, 이는 단독 혹은 2 내지 5종을 혼합하여 사용할 수 있다. Additionally, when the coating liquid composition according to the present invention includes the multifunctional acrylic compound (B), it can be used alone or in a mixture of 2 to 5 types.
또한, 본 발명에 따른 일 실시예로서, 상기 코팅액 조성물내 중합 가능한 성분은 화학식 1로 표시되는 아크릴 화합물(A) 및 상기 아크릴 화합물(A)와 중합가능한 다관능성 아크릴 화합물(B) 만으로만 이루어질 수 있다. In addition, as an embodiment according to the present invention, the polymerizable component in the coating liquid composition may consist only of an acrylic compound (A) represented by Chemical Formula 1 and a multifunctional acrylic compound (B) polymerizable with the acrylic compound (A). there is.
또한, 본 발명에 따른 코팅액 조성물은 [화학식 1]로 표시되는 아크릴 화합물(A); 상기 [화학식 1]로 표시되는 아크릴 화합물(A)과 중합가능한 다관능성 아크릴 화합물(B); 및 중합개시제(D); 성분에 추가 모노머로서, 단관능성 아크릴 모노머(C)을 코팅액 조성물 100 중량%에 대하여 0 ~ 50 중량%를 선택적으로 포함할 수 있다.In addition, the coating liquid composition according to the present invention includes an acrylic compound (A) represented by [Formula 1]; A multifunctional acrylic compound (B) polymerizable with the acrylic compound (A) represented by the above [Formula 1]; and polymerization initiator (D); As an additional monomer in the component, a monofunctional acrylic monomer (C) may be optionally included in an amount of 0 to 50% by weight based on 100% by weight of the coating liquid composition.
본 발명에서의 상기 단관능성 아크릴 모노머(C)는 본 발명의 코팅액 조성물에 추가적으로 포함되는 경우에, 코팅액 조성물의 물리적 특성을 개선할 수 있다. When the monofunctional acrylic monomer (C) in the present invention is additionally included in the coating liquid composition of the present invention, the physical properties of the coating liquid composition can be improved.
즉, 본 발명의 코팅용 조성물은 최종적으로 얻어지는 수지 조성물의 물리적 특성인 (점도, 유전율, 접착력, 열안정성) 등을 고려하여 상기 화학식 1로 표시되는 아크릴 화합물(A); 상기 화학식 1로 표시되는 아크릴 화합물(A)와 중합가능한 다관능성 아크릴 화합물(B); 및 중합개시제(D);와 더불어, 물성조절에 사용하는 단관능성 화합물(C)를 추가적으로 포함할 수 있으며, 이의 함량은 전체 조성물을 기준으로, 상기 단관능성 화합물(C)의 함량은 0 내지 50 중량%(wt%)의 범위 일 수 있고, 바람직하게는 1 내지 40 중량%(wt%)의 범위일 수 있고, 더욱 바람직하게는 2 내지 30 중량%(wt%) 의 범위일 수 있다. That is, the coating composition of the present invention takes into account the physical properties (viscosity, dielectric constant, adhesion, thermal stability) of the finally obtained resin composition, and includes an acrylic compound (A) represented by Formula 1; A multifunctional acrylic compound (B) polymerizable with the acrylic compound (A) represented by the above formula (1); In addition to the polymerization initiator (D), it may additionally include a monofunctional compound (C) used to control physical properties, and the content of the monofunctional compound (C) is 0 to 50, based on the entire composition. It may be in the range of weight% (wt%), preferably in the range of 1 to 40 weight% (wt%), and more preferably in the range of 2 to 30 weight% (wt%).
또한, 본 발명에 따른 코팅액 조성물이 상기 물성조절에 사용하는 단관능성 화합물(C)을 추가적으로 포함하는 경우에, 상기 단관능성 화합물(C)는 아크릴 화합물(A) 및 아크릴 화합물(B)와 중합이 가능하여 고분자 또는 올리고머를 형성할 수 있는 아크릴기 또는 메타아크릴기를 1개 포함하는 화합물이면 종류에 제한되지 않고 사용될 수 있으며, 이때, 상기 단관능성 화합물(C)는 전체 조성물에 상기 범위 내에서 단독 혹은 2 내지 5종을 혼합하여 사용할 수 있다. In addition, when the coating liquid composition according to the present invention additionally includes a monofunctional compound (C) used for controlling the physical properties, the monofunctional compound (C) polymerizes with the acrylic compound (A) and the acrylic compound (B). Any compound containing one acrylic group or methacrylic group capable of forming a polymer or oligomer can be used without limitation in type. In this case, the monofunctional compound (C) can be used alone or within the above range in the entire composition. 2 to 5 types can be mixed and used.
여기서, 상기 물성조절에 사용하는 단관능성 화합물(C)의 보다 바람직한 예로서 이는, 치환 또는 비치환된 C1~C30 알킬기, 치환 또는 비치환된 C4~C25의 시클로알킬기, 치환 또는 비치환된 C9~C35의 지방족 다환시클로알킬기, 치환 또는 비치환된 C4~C25 알케닐기, 치환 또는 비치환된 C6~C50의 아릴기, 치환 또는 비치환된 C7~C50의 아릴알킬기 중에서 선택되는 어느 하나이상의 치환기를 포함하는, 단관능성(메타)아크릴 단량체일 수 있고, 바람직하게는 탄소수 1 내지 30의 알킬기를 포함하는 (메타)아크릴레이트, 탄소수 6 내지 25의 시클로알킬기를 포함하는 메타)아크릴레이트, 탄소수 10 내지 30의 지방족 다환시클로알킬기를 포함하는 (메타)아크릴레이트, 탄소수 6 내지 18의 아릴기를 포함하는 (메타)아크릴레이트 중에서 선택된 어느 하나 이상을 포함하는 모노머 화합물일 수 있지만, 이에 한정되지 않는다. Here, more preferable examples of the monofunctional compound (C) used for controlling the physical properties include a substituted or unsubstituted C 1 to C 30 alkyl group, a substituted or unsubstituted C 4 to C 25 cycloalkyl group, or a substituted or unsubstituted C 4 to C 25 alkyl group. Substituted C 9 ~ C 35 aliphatic polycyclic cycloalkyl group, substituted or unsubstituted C 4 ~ C 25 alkenyl group, substituted or unsubstituted C 6 ~ C 50 aryl group, substituted or unsubstituted C 7 ~ C 50 It may be a monofunctional (meth)acrylic monomer containing at least one substituent selected from arylalkyl groups, preferably a (meth)acrylate containing an alkyl group having 1 to 30 carbon atoms, and a cycloalkyl group having 6 to 25 carbon atoms. meth)acrylate containing, (meth)acrylate containing an aliphatic polycyclic cycloalkyl group having 10 to 30 carbon atoms, (meth)acrylate containing an aryl group having 6 to 18 carbon atoms. It may be a monomer compound containing one or more selected from among, but is not limited to this.
상기 물성조절에 사용하는 단관능성 단관능성 화합물(C)의 구체적 예로서, 이는 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 프로필(메타)아크릴레이트, 부틸(메타)아크릴레이트, 헥실(메타)아크릴레이트, 옥틸(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트, 데실(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 도데실(메타)아크릴레이트 및 헥사데실(메타)아크릴레이트, 이소보닐(메타)아크릴레이트, 아다만틸(메타)아크릴레이트, 디시클로펜타닐(메타)아크릴레이트, 벤질(메타)아크릴레이트, 페녹시벤질(메타)아크릴레이트, 2-메톡시에틸(메타)아크릴레이트, 2-에톡시에틸(메타)아크릴레이트, 아크릴산, 메타아크릴산, 글리시딜아크릴레이트, 글리시딜 메타아크릴레이트, 3,4-에폭시부틸(메타)아크릴레이트,2,3-에폭시시클로헥실(메타)아크릴레이트,3,4-에폭시시클로헥실메틸(메타)아크릴레이트, 3-에틸옥세탄-3-메틸(메타)아크릴레이트, (메타)아크릴아미드 모노머 중에서 선택되는 1 내지 5의 화합물을 사용할 수 있다.Specific examples of the monofunctional monofunctional compound (C) used to control the physical properties include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, hexyl ( Meth)acrylate, octyl (meth)acrylate, cyclohexyl (meth)acrylate, decyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate and hexadecyl (meth)acrylate. , isobornyl (meth)acrylate, adamantyl (meth)acrylate, dicyclofentanyl (meth)acrylate, benzyl (meth)acrylate, phenoxybenzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate ) Acrylate, 2-ethoxyethyl (meth)acrylate, acrylic acid, methacrylic acid, glycidyl acrylate, glycidyl methacrylate, 3,4-epoxybutyl (meth)acrylate, 2,3-epoxy 1 to 5 selected from cyclohexyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, 3-ethyloxetane-3-methyl (meth)acrylate, and (meth)acrylamide monomer Compounds can be used.
한편, 본 발명에 따른 상기 코팅액 조성물은 패턴 특성 조절과 내열성 등의 박막물성을 부여하기 위하여 아크릴 중합체 또는 측쇄에 아크릴 불포화 결합을 갖는 아크릴 중합체 등을 선택적으로 사용할 수 있다. Meanwhile, the coating liquid composition according to the present invention may optionally use an acrylic polymer or an acrylic polymer having an acrylic unsaturated bond in the side chain in order to control pattern characteristics and provide thin film properties such as heat resistance.
상기 아크릴 중합체로는 하기에 기재된 단량체들을 포함하는 단량체들의 공중합체로서 단량체의 예로는, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 프로필(메타)아크릴레이트, 부틸(메타)아크릴레이트, 헥실(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트, 데실(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 도데실(메타)아크릴레이트 및 헥사데실(메타)아크릴레이트,이소보닐(메타)아크릴레이트, 다만틸(메타)아크릴레이트, 디시클로펜타닐(메타)아크릴레이트, 벤질(메타)아크릴레이트, 2-메톡시에틸(메타)아크릴레이트, 2-에톡시에틸(메타)아크릴레이트, 아크릴산, 메타아크릴산, 스틸렌, 아세톡시스틸렌, 글리시딜아크릴레이트, 글리시딜 메타아크릴레이트, 이타코닉산, 말레익산무수물, 말레익산모노알킬 에스터, 모노알킬 퓨말레이트, 3,4-에폭시부틸(메타)아크릴레이트,2,3-에폭시시클로헥실(메타)아크릴레이트,3,4-에폭시시클로헥실메틸(메타)아크릴레이트, 3-에틸옥세탄-3-메틸(메타)아크릴레이트, N-메틸말레이미드, N-부틸말레이미드, N-페닐말레이미드, (메타)아크릴아미드 등을 들 수 있으며, 이들을 각각 단독으로 또는 2종 이상을 중합하여 사용할 수 있으며, 여기서, 상기 아크릴중합체의 함량은 용매를 포함하는 경우에 상기 코팅액 조성물 100 중량%를 기준으로 0 내지 40 중량%를 포함하는 것이 바람직하다.The acrylic polymer is a copolymer of monomers containing the monomers described below. Examples of the monomers include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, Hexyl (meth)acrylate, cyclohexyl (meth)acrylate, decyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate and hexadecyl (meth)acrylate, isobornyl (meth)acrylate ) Acrylate, damantyl (meth)acrylate, dicyclofentanyl (meth)acrylate, benzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, Acrylic acid, methacrylic acid, styrene, acetoxystyrene, glycidyl acrylate, glycidyl methacrylate, itaconic acid, maleic acid anhydride, maleic acid monoalkyl ester, monoalkyl fumarate, 3,4-epoxybutyl ( Meth)acrylate, 2,3-epoxycyclohexyl(meth)acrylate, 3,4-epoxycyclohexylmethyl(meth)acrylate, 3-ethyloxetane-3-methyl(meth)acrylate, N-methyl Maleimide, N-butylmaleimide, N-phenylmaleimide, (meth)acrylamide, etc. can be mentioned, and these can be used individually or by polymerizing two or more types, where the content of the acrylic polymer is determined by the solvent. When containing, it is preferable to include 0 to 40% by weight based on 100% by weight of the coating liquid composition.
또한, 상기 코팅액 조성물은 추가적으로, 중합개시제: 또는 광중합성 모노머;를 선택적으로 포함할 수 있으며, 보다 구체적으로 상기 중합개시제(D)는 광경화성 반응을 수행할 수 있는 광중합 개시제 또는 열개시제를 사용할 수 있다. In addition, the coating liquid composition may additionally optionally include a polymerization initiator: or a photopolymerizable monomer. More specifically, the polymerization initiator (D) may be a photopolymerization initiator or a thermal initiator capable of performing a photocuring reaction. there is.
본 발명의 상기 중합개시제(D)의 함유량은 코팅액 조성물의 총량 100 중량%에 대하여 0.1 ~ 20 중량%가 바람직하고, 보다 바람직하게는 0.1 ~ 10 중량%, 더욱 바람직하게는 0.5 ~ 7 중량%를 사용할 수 있다. The content of the polymerization initiator (D) of the present invention is preferably 0.1 to 20% by weight, more preferably 0.1 to 10% by weight, and even more preferably 0.5 to 7% by weight, based on 100% by weight of the total amount of the coating liquid composition. You can use it.
상기 열중합 개시제로는 아조계, 퍼옥시계 등을 사용할 수 있으며, 광중합 개시제는 벤조인계, 트리아진계, 아세토페논계, 벤조페논계, 안트라쿠논계, 케탈계, 티오크산톤계, 벤조페논계, 포스핀옥시드계 및 옥심계 중에서 선택되는 어느 하나를 단독으로 사용해도 좋고, 또는 2종 이상 혼합하여 사용해도 좋다. The thermal polymerization initiator may be azo-based, peroxy-based, etc., and the photopolymerization initiator may be benzoin-based, triazine-based, acetophenone-based, benzophenone-based, anthraquinone-based, ketal-based, thioxanthone-based, benzophenone-based, Any one selected from the phosphine oxide type and the oxime type may be used alone, or two or more types may be mixed.
상기 열개시제는 유기과산화물 또는 히드로과산화물, 아조화합물, 산화-환원계 화합물 등을 나타낼 수 있고 이중 선택되는 어느 하나를 단독으로 사용해도 좋고, 또는 2종이상 혼합하여 사용해도 좋다. 또한 광중합 개시제 및 열개시제를 혼합하여 사용할 수 있다. The thermal initiator may represent an organic peroxide or hydroperoxide, an azo compound, an oxidation-reduction compound, etc., and any one of these may be used alone, or two or more types may be mixed. Additionally, a photopolymerization initiator and a thermal initiator can be mixed and used.
여기서, 상기 중합개시제(D)의 구체적인 예로서는 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인프로필에테르, 벤조인이소부틸에테르 등의 벤조인류; 아세토페논, 2,2-디에톡시-2-페닐아세토페논, 2,2-디에톡시-2-페닐아세토페논, 1,1-디클로로아세토페논, 2-히드록시-2-메틸-페닐프로판-1-온, 디에톡시아세토페논,1-히드록시시클로헥실-페닐케톤, 2-메틸-1-[4-(메틸티오)페닐]-2-모르폴리노프로판-1-온, 올리고[2-히드록시-2-메틸-1-[4-(1-메틸비닐)페닐]프로판온] 등의 아세토페논류; 2-에틸안트라퀴논, 2-tert-부틸안트라퀴논, 2-클로로안트라퀴논, 2-아밀안트라퀴논 등의 안트라퀴논류; 2,4-디에틸티오크산톤, 2-이소프로필티오크산톤, 2-클로로티오크산톤 등의 티오크산톤류; 아세토페논디메틸케탈, 벤질디메틸케탈 등의 케탈류; 벤조페논, 4-벤조일-4'-메틸디페닐술피드, 4,4'-비스메틸아미노벤조페논 등의 벤조페논류; 2,4,6-트리메틸벤조일디페닐포스핀옥시드, 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥시드, 디페닐-(2,4,6-트리메틸벤조일)포스핀옥시드 등의 포스핀옥시드류 등을 들 수 있으며 상기 중합개시제 중에서 선택되는 하나 이상의 개시제를 단독 혹은 2개이상을 혼합하여 사용할 수 있으나, 상기 중합개시제에 한정하지 않는다. Here, specific examples of the polymerization initiator (D) include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, and benzoin isobutyl ether; Acetophenone, 2,2-diethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy-2-methyl-phenylpropane-1 -one, diethoxyacetophenone, 1-hydroxycyclohexyl-phenylketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, oligo[2-hydride Acetophenones such as oxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone]; Anthraquinones such as 2-ethylanthraquinone, 2-tert-butylanthraquinone, 2-chloroanthraquinone, and 2-amylanthraquinone; Thioxanthone such as 2,4-diethylthioxanthone, 2-isopropylthioxanthone, and 2-chlorothioxanthone; Ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; Benzophenones, such as benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, and 4,4'-bismethylaminobenzophenone; Phosphorus such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and diphenyl-(2,4,6-trimethylbenzoyl)phosphine oxide. Examples include pinoxides, and one or more initiators selected from the above polymerization initiators may be used alone or in a mixture of two or more, but are not limited to the above polymerization initiators.
한편, 본 코팅액 조성물은 용제를 포함하지 않는 무용제 타입으로 형성할 수 있고, 상기 코팅액 조성물이 무용제 타입인 경우, 각각의 조성물의 성분들의 함량(wt%)은 상기 화학식 1로 표시되는 아크릴 화합물(A), 상기 아크릴 화합물(A)와 중합가능한 다관능성 아크릴 화합물(B), 중합개시제(D) 및 추가적으로 포함될 수 있는 성분들의 총합에 따른 조성물의 총중량에 기초하여 각 성분들의 함량이 중량%로서 설정될 수 있다.On the other hand, this coating liquid composition can be formed as a solvent-free type that does not contain a solvent, and when the coating liquid composition is a solvent-free type, the content (wt%) of the components of each composition is the acrylic compound (A) represented by the formula (1) ), the content of each component will be set as weight percent based on the total weight of the composition according to the total of the acrylic compound (A), the polymerizable multifunctional acrylic compound (B), the polymerization initiator (D), and the total of components that may be additionally included. You can.
또한, 본 발명의 코팅용 조성물은 각 성분을 혼합 용해함으로써 조제할 수 있다. 예를 들면, 교반 장치, 온도계가 구비된 둥근 바닥 플라스크에 각 성분을 주입하여 20 ~ 80 ℃, 바람직하게는 40 ~ 80 ℃에서 진공상태에서 0.5 ~ 6시간을 교반하여 수분 및 불필요한 용매를 제거 함으로써 순수한 조성물을 수득할 수 있다. Additionally, the coating composition of the present invention can be prepared by mixing and dissolving each component. For example, inject each ingredient into a round bottom flask equipped with a stirring device and a thermometer and stir for 0.5 to 6 hours in a vacuum at 20 to 80 ℃, preferably 40 to 80 ℃ to remove moisture and unnecessary solvents. A pure composition can be obtained.
또한, 본 발명에 따른 코팅액 조성물은 점도가 높은 경우 용제를 포함하는 조성으로 제조가 가능하며, 상기 유기발광소자 조성물이 용제를 포함하는 경우, 코팅액 조성물의 성분들의 함량(중량%)는 상기 화학식 1로 표시되는 아크릴 화합물(A), 상기 아크릴 화합물(A)와 중합가능한 다관능성 모노머 화합물(B), 중합개시제(D)를 포함하되, 상기 용매의 함량은 상기 화학식 1로 표시되는 아크릴 화합물(A), 상기 화합물(A)와 중합가능한 다관능성 아크릴 화합물(B), 중합개시제(D) 및 추가 모노머 성분(C)의 함량을 계산함에 있어 감안하지 않는다. 즉, 본 발명에 따른 코팅액 조성물에서의 각각의 함량을 계산함에 있어, 용매의 함량은 전체 조성물을 기준으로 하였을 때 이를 반영하지 않고 나머지 성분들의 총합에 따른 조성물의 총중량에 기초하여 전체 조성물을 기준한다. In addition, the coating liquid composition according to the present invention can be manufactured as a composition containing a solvent when the viscosity is high, and when the organic light emitting device composition contains a solvent, the content (% by weight) of the components of the coating liquid composition is expressed in the formula 1 An acrylic compound (A) represented by, a multifunctional monomer compound (B) polymerizable with the acrylic compound (A), and a polymerization initiator (D), wherein the content of the solvent is the acrylic compound (A) represented by Formula 1. ), the multifunctional acrylic compound (B) polymerizable with the compound (A), the polymerization initiator (D), and the additional monomer component (C) are not taken into account when calculating the content. That is, when calculating each content in the coating liquid composition according to the present invention, the content of the solvent is not reflected based on the entire composition, but is based on the total composition based on the total weight of the composition according to the sum of the remaining components. .
한편 본 발명에서 용매를 사용하는 경우에 코팅액 조성물의 점도를 조절할 수 있을 뿐만 아니라, 우수한 코팅성과 투명한 박막을 얻을 수 있으며, 통상적으로 유기용매를 사용하는 것이 바람직하다. Meanwhile, when using a solvent in the present invention, not only can the viscosity of the coating composition be adjusted, but also excellent coating properties and a transparent thin film can be obtained, and it is generally preferable to use an organic solvent.
상기 유기용매로서, 바람직하게는 에틸아세테이트, 부틸아세테이트, 디에틸렌글리콜 디메틸에테르, 디에틸렌글리콜 디메틸에틸에테르, 메틸메톡시 프로피오네이트, 에틸에톡시 프로피오네이트(EEP), 에틸락테이트, 프로필렌글리콜 메틸에테르 아세테이트(PGMEA), 프로필렌글리콜 메틸에테르, 프로필렌글리콜 프로필에테르, 메틸셀로솔브아세테이트, 에틸셀로솔브아세테이트, 디에틸렌글리콜 메틸아세테이트, 디에틸렌글리콜 에틸아세테이트, 아세톤, 메틸이소부틸케톤, 시클로헥사논, 디메틸포름아미드(DMF), N,N-디메틸아세트아미드(DMAc), N-메틸-2-피롤리돈(NMP), γ-부티로락톤, 디에틸에테르, 에틸렌글리콜 디메틸에테르, 다이글라임(Diglyme), 테트라하이드로퓨란(THF), 메탄올, 에탄올, 프로판올, 이소-프로판올, 메틸셀로솔브, 에틸셀로솔브, 디에틸렌글리콜 메틸에테르, 디에틸렌글리콜 에틸에테르, 디프로필렌글리콜 메틸에테르, 톨루엔, 크실렌, 헥산, 헵탄 및 옥탄 중에서 선택된 1종 이상을 사용할 수 있으며, 여기서 상기 용매의 함량은 상기 코팅액 조성물 100 중량%(용매포함)를 기준으로 5 내지 70 중량 %를 포함하는 것이 바람직하다.The organic solvent is preferably ethyl acetate, butyl acetate, diethylene glycol dimethyl ether, diethylene glycol dimethyl ethyl ether, methyl methoxy propionate, ethyl ethoxy propionate (EEP), ethyl lactate, and propylene glycol. Methyl ether acetate (PGMEA), propylene glycol methyl ether, propylene glycol propyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol methyl acetate, diethylene glycol ethyl acetate, acetone, methyl isobutyl ketone, cyclohexamethylene Rice paddy, dimethylformamide (DMF), N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidone (NMP), γ-butyrolactone, diethyl ether, ethylene glycol dimethyl ether, Daigle Diglyme, tetrahydrofuran (THF), methanol, ethanol, propanol, iso-propanol, methyl cellosolve, ethyl cellosolve, diethylene glycol methyl ether, diethylene glycol ethyl ether, dipropylene glycol methyl ether, One or more types selected from toluene, xylene, hexane, heptane, and octane may be used, where the content of the solvent is preferably 5 to 70% by weight based on 100% by weight (including solvent) of the coating liquid composition.
본 발명의 코팅액 조성물을 기판 상에 퇴적시키는 방법으로서는 잉크젯 방식, 롤코트 방식, 스핀코트 방식, 다이코트 방식, 증착 방식 등이 사용될 수 있다.As a method for depositing the coating liquid composition of the present invention on a substrate, an inkjet method, roll coat method, spin coat method, die coat method, vapor deposition method, etc. may be used.
또한, 퇴적시킨 코팅액 조성물을 경화시키는 스텝을 행하는 수단에서는 경화시키는 광원으로는 자외선, 가시광선, 적외선, X선, 감마선, 레이저광선 등의 전자파, 알파선, 베타선, 전자선 등의 입자선 등을 들 수 있다. 본 발명에 있어서는 이들 중 자외선, 레이저광선, 가시광선 또는 전자선이 바람직하다. 특히 바람직하게는 자외선 또는 가시광선이며, 광원의 종류로서는 고압 수은등, 메탈할라이드 램프, LED 램프를 들수 있다. In addition, in the means for performing the step of curing the deposited coating composition, the light source for curing includes electromagnetic waves such as ultraviolet rays, visible rays, infrared rays, there is. In the present invention, among these, ultraviolet rays, laser rays, visible rays or electron beams are preferred. Particularly preferably, ultraviolet rays or visible rays are used, and types of light sources include high-pressure mercury lamps, metal halide lamps, and LED lamps.
구체적으로, 다른 재료로의 데미지를 최소한으로 억제하는 목적으로 광경화를 행하는 광원으로 LED 램프를 사용하는 경우가 있다. 일반적으로 LED 램프는 고압 수은등이나 메탈할라이드램프와 비교하여 조사 에너지가 약하다고 되어 있다. LED 램프에 의한 경화가 행해질 경우, 발광 파장은 315 ~ 550nm의 범위에서 사용가능하며, 예컨대 365㎚, 385㎚, 390㎚, 395㎚, 405㎚ 등이 시판품으로서 있지만, 어느 램프도 가시광에 가깝기 때문에 비교적 장파장측에 흡수대를 갖는 광중합 개시제를 선택할 필요가 있고, 그 경우에는 포스핀옥시드류의 광중합 개시제가 바람직하고, 그 중에서도 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥시드를 단독으로 사용해도 좋고, 또는 2종 이상 혼합하여 사용해도 좋다. Specifically, an LED lamp may be used as a light source for photocuring for the purpose of minimizing damage to other materials. In general, LED lamps are said to have weaker irradiation energy compared to high-pressure mercury lamps or metal halide lamps. When curing is performed with an LED lamp, the emission wavelength can be used in the range of 315 to 550 nm. For example, 365 nm, 385 nm, 390 nm, 395 nm, and 405 nm are available as commercial products, but all lamps are close to visible light. It is necessary to select a photopolymerization initiator having an absorption band on the relatively long wavelength side, and in that case, a photopolymerization initiator of phosphine oxides is preferable, and among them, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide is used alone. You may use it, or you may mix two or more types.
또한, 혼합 개시제로써 디페닐(2,4,6-트리메틸벤조일)포스핀 옥시드, 벤질(디페닐)포스핀 옥시드 또는 이들의 혼합물을 사용할 수 있다. Additionally, diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, benzyl (diphenyl) phosphine oxide, or a mixture thereof can be used as a mixing initiator.
또한, 본 발명은 상기 화학식 1로 표시되는 아크릴 화합물(A), 상기 아크릴 화합물(A)와 중합가능한 다관능성 아크릴 화합물(B) 및 중합개시제(D)를 포함하는 코팅용 조성물을 열 경화 또는 광 경화시켜 제조되는 광경화 또는 열경화된 유기코팅막을 제공한다. In addition, the present invention provides a coating composition comprising an acrylic compound (A) represented by Formula 1, a multifunctional acrylic compound (B) polymerizable with the acrylic compound (A), and a polymerization initiator (D) by heat curing or light curing. Provided is a photocured or heat-cured organic coating film manufactured by curing.
상기 코팅용 조성물은 열경화 또는 광경화율이 85% 이상, 보다 바람직하게는 90% 내지 99%, 더욱 바람직하게는 91% 내지 97%의 범위로 경화될 수 있으며, 상기 범위에서, 경화 후 경화 수축 응력이 낮아 쉬프트가 발생되지 않은 층을 구현하여 봉지 용도로 사용하는데 적합하다. The coating composition can be cured to a heat or light cure rate of 85% or more, more preferably 90% to 99%, and even more preferably 91% to 97%, and within this range, curing shrinkage after curing. It is suitable for use in encapsulation purposes as it creates a layer with low stress and no shift.
본 발명에 있어서 코팅용 조성물이 성막되는 기재로서 특별히 한정은 없고, PET(폴리에틸렌테레프탈레이트), PBT(폴리부틸렌테레프탈레이트), PEN(폴리에틸렌나프탈레이트), TAC(트리아세틸셀룰로오스), PC(폴리카보네이트), PI(폴리이미드), PMMA(폴리메틸메타크릴레이트) 등의 각종 수지 필름, 알루미늄 시트 등의 각종 금속 시트, 유리 기판 등 단량체층의 성막이 가능한 것이면 가스 배리어 필름, 광학 필름, 보호 필름 등의 각종 기능성 필름에 이용되는 각종 베이스 필름이 이용 가능하다. 유기 발광소자(유기 EL 디스플레이) 용도에서는 유리 기판을 사용하는 경우가 많다. 플렉시블한 유기 발광소자(유기 EL 디스플레이)를 제작하기 위해서는 기재도 플렉시블한 것이 아니면 안되고, 또한 높은 치수 안정성과 내열성이 요구되기 때문에 박막 유리 기재, PEN, PI 또는 그들의 복합 재료가 사용되는 경우가 많다. In the present invention, the substrate on which the coating composition is formed is not particularly limited and includes PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PEN (polyethylene naphthalate), TAC (triacetylcellulose), and PC (polymethylene terephthalate). Carbonate), PI (polyimide), various resin films such as PMMA (polymethyl methacrylate), various metal sheets such as aluminum sheets, glass substrates, etc., if a monomer layer can be formed, gas barrier film, optical film, protective film Various base films used in various functional films such as these are available. Glass substrates are often used in organic light-emitting devices (organic EL displays). In order to manufacture a flexible organic light emitting device (organic EL display), the substrate must be flexible, and since high dimensional stability and heat resistance are required, thin-film glass substrates, PEN, PI, or their composite materials are often used.
한편, 본 발명에 따른 상기 유기코팅막은 유기층 또는 무기층을 추가적으로 더 포함할 수 있다. Meanwhile, the organic coating film according to the present invention may additionally include an organic layer or an inorganic layer.
상기 무기층은 금속, 금속 산화물, 금속 불화물, 금속 질화물, 금속 산질화물, 금속 붕소화물, 금속 산붕소화물, 금속 실리사이드에서 선택되는 1종 이상을 포함하고, 상기 금속은 실리콘(Si), 인듐(In), 게르마늄(Ge), 주석(Sn), 알루미늄(Al), 셀레늄(Se), 아연(Zn), 안티몬(Sb), 비스무트(Bi), 전이금속 및 란탄족 금속 중에서 선택되는 어느 하나 이상을 포함할 수 있다. The inorganic layer includes at least one selected from metal, metal oxide, metal fluoride, metal nitride, metal oxynitride, metal boride, metal oxyboride, and metal silicide, and the metal is silicon (Si), indium (In ), germanium (Ge), tin (Sn), aluminum (Al), selenium (Se), zinc (Zn), antimony (Sb), bismuth (Bi), transition metals, and lanthanide metals. It can be included.
또한, 본 발명에 따른 코팅용 조성물은 경화 후 광투과율이 95% 이상, 구체적으로 95% 내지 99%가 될 수 있고, 상기 범위에서 코팅막으로 사용하였을 때 시인성을 높일 수 있다. In addition, the coating composition according to the present invention may have a light transmittance of 95% or more, specifically 95% to 99%, after curing, and can increase visibility when used as a coating film within this range.
또한, 본 발명에 따른 코팅액 조성물은 유기발광소자, 전기변색장치, 광변색장치, 태양전지, 조명장치, 집적회로, LCD 소자, 발광다이오드, 봉지재로부터 선택된 어느 하나에 사용될 수 있다. Additionally, the coating liquid composition according to the present invention can be used in any one selected from organic light-emitting devices, electrochromic devices, photochromic devices, solar cells, lighting devices, integrated circuits, LCD devices, light-emitting diodes, and encapsulants.
또한, 본 발명은 상기 코팅용 조성물을 열 경화 또는 광 경화시켜 제조되는, 광경화 또는 열경화된 유기 코팅막을 포함하는 봉지화된 장치를 제공할 수 있으며, 이때 상기 봉지화된 장치는 유기발광소자, 전기변색장치, 광변색장치, 태양전지, 조명장치, 집적회로, LCD 소자, 발광다이오드로부터 선택된 어느 하나로서 사용될 수 있다. In addition, the present invention can provide an encapsulated device comprising a photo-cured or thermo-cured organic coating film prepared by thermally or photo-curing the coating composition, wherein the encapsulated device is an organic light-emitting device. , can be used as any one selected from electrochromic devices, photochromic devices, solar cells, lighting devices, integrated circuits, LCD devices, and light-emitting diodes.
이하, 바람직한 실시예를 들어 본 발명을 더욱 상세하게 설명한다. 그러나, 이들 실시예는 본 발명을 보다 구체적으로 설명하기 위한 것으로, 본 발명의 범위가 이에 의하여 제한되지 않는다는 것은 당업계의 통상의 지식을 가진 자에게 자명할 것이다. Hereinafter, the present invention will be described in more detail with reference to preferred embodiments. However, these examples are for illustrating the present invention in more detail, and it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto.
제조예 : 화학식 1로 표시되는 아크릴레이트 화합물(A)의 제조Preparation example: Preparation of acrylate compound (A) represented by Formula 1
합성예 1: 화합물 3의 합성Synthesis Example 1: Synthesis of Compound 3
합성예 1-1: 화합물 3의 합성Synthesis Example 1-1: Synthesis of Compound 3
3L 반응기에 화합물 3-1 113.6g(489mmol)를 넣고 에탄올 1L에 녹인 후 내부온도를 0℃로 냉각한 뒤 수소화붕소나트륨 11.1g(294mmol)을 천천히 적가 후 실온으로 승온하여 6시간동안 교반한다. 반응혼합액을 감압증류하여 에탄올을 제거한 후 에틸아세테이트 1L를 첨가하고 염화나트륨 수용액을 이용하여 추출하고 유기층을 무수황산마그네슘으로 건조한 뒤 농축하여 얻은 유기물에 디클로로메탄 1L에 녹인 후 내부온도를 0℃로 냉각한 뒤 트리에틸아민 99.1g(979mmol), 아크릴클로라이드 53.2g(587mmol)을 천천히 적가하고 온도를 유지하면서 2시간 동안 교반한다. 반응 혼합액을 Celite를 충진한 여과기에 여과하고 생성된 염을 제거한 뒤 여과액에 증류수 1L를 투입하여 세척한 뒤 유기층을 무수황산마그네슘으로 건저한 뒤 농축하여 얻은 유기물을 에틸아세테이트, 노르말헥산 혼합액으로 컬럼진행하여 투명한 액체의 목적화합물 3을 100.1g(수율:71%)을 수득하였다.Add 113.6 g (489 mmol) of Compound 3-1 to a 3L reactor, dissolve in 1 L of ethanol, cool the internal temperature to 0°C, and slowly add 11.1 g (294 mmol) of sodium borohydride dropwise, raise the temperature to room temperature, and stir for 6 hours. The reaction mixture was distilled under reduced pressure to remove ethanol, then 1L of ethyl acetate was added, extracted using an aqueous sodium chloride solution, the organic layer was dried with anhydrous magnesium sulfate, concentrated, and the obtained organic matter was dissolved in 1L of dichloromethane and cooled to an internal temperature of 0°C. Then, 99.1 g (979 mmol) of triethylamine and 53.2 g (587 mmol) of acrylic chloride were slowly added dropwise and stirred for 2 hours while maintaining the temperature. The reaction mixture was filtered through a filter filled with Celite, the produced salts were removed, the filtrate was washed with 1L of distilled water, the organic layer was dried with anhydrous magnesium sulfate, and the obtained organic matter was concentrated and filtered through a column with a mixture of ethyl acetate and normal hexane. Proceeding to obtain 100.1g (yield: 71%) of target compound 3 as a clear liquid.
1H NMR (δ ppm; DMSO-d 6 ): 7.28~7.26 (m, 5H), 6.17(m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.14(m, 1H), 1.54(m, 2H), 1.21~1.15(m, 10H), 0.78(m, 3H) 1H NMR (δ ppm; DMSO - d6 ): 7.28~7.26 (m, 5H), 6.17(m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.14(m, 1H), 1.54(m) , 2H), 1.21~1.15(m, 10H), 0.78(m, 3H)
MS(m/e) : 260.2 MS( m/e ): 260.2
합성예 2: 화합물 6의 합성Synthesis Example 2: Synthesis of Compound 6
합성예 2-1: 화합물 6의 합성Synthesis Example 2-1: Synthesis of Compound 6
합성예 1-1과 동일한 방법으로 화합물 6-1 100.0g(347mmol), 수소화붕소나트륨 7.9g(208mmol), 트리에틸아민 70.2g(693mmol), 아크릴클로라이드 37.7g(416mmol), 에탄올 1L, 디클로로메탄 1L를 이용하여 투명한 액체의 목적화합물 6을 82.4g(수율:69%)을 수득하였다.In the same manner as Synthesis Example 1-1, 100.0 g (347 mmol) of compound 6-1, 7.9 g (208 mmol) of sodium borohydride, 70.2 g (693 mmol) of triethylamine, 37.7 g (416 mmol) of acrylic chloride, 1 L of ethanol, dichloromethane. Using 1L, 82.4g (yield: 69%) of target compound 6 as a clear liquid was obtained.
1H NMR (δ ppm; DMSO-d 6 ): 7.28~7.26 (m, 5H), 6.17(m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.14(m, 1H), 1.54(m, 2H), 1.21~1.15(m, 22H), 0.78(m, 3H) 1H NMR (δ ppm; DMSO - d6 ): 7.28~7.26 (m, 5H), 6.17(m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.14(m, 1H), 1.54(m) , 2H), 1.21~1.15(m, 22H), 0.78(m, 3H)
MS(m/e) : 344.3 MS( m/e ): 344.3
합성예 3: 화합물 12의 합성Synthesis Example 3: Synthesis of Compound 12
합성예 3-1 화합물 12의 합성Synthesis Example 3-1 Synthesis of Compound 12
합성예 1-1과 동일한 방법으로 화합물 12-1 100.0g(384mmol), 수소화붕소나트륨 8.7g(230mmol), 트리에틸아민 77.7g(768mmol), 메타아크릴클로라이드 48.2g(461mmol), 에탄올 1L, 디클로로메탄 1L를 이용하여 투명한 액체의 목적화합물 12을 91.4g(수율:72%)을 수득하였다.In the same manner as Synthesis Example 1-1, 100.0 g (384 mmol) of compound 12-1, 8.7 g (230 mmol) of sodium borohydride, 77.7 g (768 mmol) of triethylamine, 48.2 g (461 mmol) of methacrylic chloride, 1 L of ethanol, and dichloride were added. Using 1L of methane, 91.4g (yield: 72%) of target compound 12 as a transparent liquid was obtained.
1H NMR (δ ppm; DMSO-d 6 ): 7.28~7.26 (m, 5H), 6.38 (m, 1H), 6.30(m, 1H), 5.14(m, 1H), 1.91(m, 3H), 1.54(m, 2H), 1.21~1.15(m, 18H), 0.78(m, 3H) 1H NMR (δ ppm; DMSO - d6 ): 7.28~7.26 (m, 5H), 6.38 (m, 1H), 6.30(m, 1H), 5.14(m, 1H), 1.91(m, 3H), 1.54(m) , 2H), 1.21~1.15(m, 18H), 0.78(m, 3H)
MS(m/e) : 330.3 MS( m/e ): 330.3
합성예 4: 화합물 14의 합성Synthesis Example 4: Synthesis of Compound 14
합성예 4-1: 화합물 14의 합성Synthesis Example 4-1: Synthesis of Compound 14
합성예 1-1과 동일한 방법으로 화합물 14-1 100.0g(316mmol), 수소화붕소나트륨 7.2g(190mmol), 트리에틸아민 63.9g(632mmol), 메타아크릴클로라이드 39.6g(379mmol), 에탄올 1L, 디클로로메탄 1L를 이용하여 투명한 액체의 목적화합물 14를 78.2g(수율:64%)을 수득하였다.In the same manner as Synthesis Example 1-1, 100.0 g (316 mmol) of compound 14-1, 7.2 g (190 mmol) of sodium borohydride, 63.9 g (632 mmol) of triethylamine, 39.6 g (379 mmol) of methacrylic chloride, 1 L of ethanol, and dichloride were added. Using 1L of methane, 78.2g (yield: 64%) of the target compound 14 as a transparent liquid was obtained.
1H NMR (δ ppm; DMSO-d 6 ): 7.28~7.26 (m, 5H), 6.38 (m, 1H), 6.30(m, 1H), 5.14(m, 1H), 1.91(m, 3H), 1.54(m, 2H), 1.21~1.15(m, 26H), 0.78(m, 3H) 1H NMR (δ ppm; DMSO - d6 ): 7.28~7.26 (m, 5H), 6.38 (m, 1H), 6.30(m, 1H), 5.14(m, 1H), 1.91(m, 3H), 1.54(m) , 2H), 1.21~1.15(m, 26H), 0.78(m, 3H)
MS(m/e) : 386.3 MS( m/e ): 386.3
합성예 5: 화합물 16의 합성Synthesis Example 5: Synthesis of Compound 16
합성예 5-1: 화합물 16의 합성Synthesis Example 5-1: Synthesis of Compound 16
합성예 1-1과 동일한 방법으로 화합물 16-1 100.0g(384mmol), 수소화붕소나트륨 8.7g(230mmol), 트리에틸아민 77.7g(768mmol), 아크릴클로라이드 41.7g(461mmol), 에탄올 1L, 디클로로메탄 1L를 이용하여 투명한 액체의 목적화합물 16을 81.9g(수율:67%)을 수득하였다.In the same manner as Synthesis Example 1-1, 100.0 g (384 mmol) of Compound 16-1, 8.7 g (230 mmol) of sodium borohydride, 77.7 g (768 mmol) of triethylamine, 41.7 g (461 mmol) of acrylic chloride, 1 L of ethanol, and dichloromethane. Using 1L, 81.9g (yield: 67%) of target compound 16 as a clear liquid was obtained.
1H NMR (δ ppm; DMSO-d 6 ): 7.28~7.26 (m, 5H), 6.17 (m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.13(m, 1H), 2.35(m, 1H), 1.21~1.15(m, 16H), 0.80~0.78(m, 6H) 1H NMR (δ ppm; DMSO - d6 ): 7.28~7.26 (m, 5H), 6.17 (m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.13(m, 1H), 2.35(m) , 1H), 1.21~1.15(m, 16H), 0.80~0.78(m, 6H)
MS(m/e) : 316.2 MS( m/e ): 316.2
합성예 6: 화합물 23의 합성Synthesis Example 6: Synthesis of Compound 23
합성예 6-1: 화합물 21의 합성Synthesis Example 6-1: Synthesis of Compound 21
합성예 1-1과 동일한 방법으로 화합물 23-1 100.0g(290mmol), 수소화붕소나트륨 6.6g(174mmol), 트리에틸아민 58.7g(580mmol), 아크릴클로라이드 31.5g(348mmol), 에탄올 1L, 디클로로메탄 1L를 이용하여 투명한 액체의 목적화합물 23을 54.5g(수율:59%)을 수득하였다.In the same manner as Synthesis Example 1-1, 100.0 g (290 mmol) of compound 23-1, 6.6 g (174 mmol) of sodium borohydride, 58.7 g (580 mmol) of triethylamine, 31.5 g (348 mmol) of acrylic chloride, 1 L of ethanol, dichloromethane. Using 1L, 54.5g (yield: 59%) of the target compound 23 as a clear liquid was obtained.
1H NMR (δ ppm; DMSO-d 6 ): 7.02(d, 1H), 6.93(s, 1H), 6.87(d, 1H), 6.17(m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.14(m, 1H), 2.24(m, 6H), 1.54(m, 2H), 1.21~1.15(m, 26H), 0.78(m, 3H) 1H NMR (δ ppm; DMSO- d 6 ): 7.02 (d, 1H), 6.93 (s, 1H), 6.87 (d, 1H), 6.17 (m, 1H), 5.95 (m, 1H), 5.49 (m, 1H) ), 5.14(m, 1H), 2.24(m, 6H), 1.54(m, 2H), 1.21~1.15(m, 26H), 0.78(m, 3H)
MS(m/e) : 400.3 MS( m/e ): 400.3
합성예 7: 화합물 24의 합성Synthesis Example 7: Synthesis of Compound 24
합성예 7-1: 화합물 24의 합성Synthesis Example 7-1: Synthesis of Compound 24
합성예 1-1과 동일한 방법으로 화합물 24-1 110.0g(357mmol), 수소화붕소나트륨 8.1g(214mmol), 트리에틸아민 72.2g(713mmol), 아크릴클로라이드 38.7g(428mmol), 에탄올 1L, 디클로로메탄 1L를 이용하여 투명한 액체의 목적화합물 24를 88.4g(수율:68%)을 수득하였다.In the same manner as Synthesis Example 1-1, 110.0 g (357 mmol) of compound 24-1, 8.1 g (214 mmol) of sodium borohydride, 72.2 g (713 mmol) of triethylamine, 38.7 g (428 mmol) of acrylic chloride, 1 L of ethanol, dichloromethane. Using 1L, 88.4g (yield: 68%) of the target compound 24 as a clear liquid was obtained.
1H NMR (δ ppm; DMSO-d 6 ): 7.42~7.28 (m, 9H), 6.17(m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.14(m, 1H), 1.54(m, 2H), 1.21~1.15(m, 14H), 0.78(m, 3H) 1H NMR (δ ppm; DMSO - d6 ): 7.42~7.28 (m, 9H), 6.17(m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.14(m, 1H), 1.54(m) , 2H), 1.21~1.15(m, 14H), 0.78(m, 3H)
MS(m/e) : 336.2 MS( m/e ): 336.2
합성예 8: 화합물 27의 합성Synthesis Example 8: Synthesis of Compound 27
합성예 8-1: 화합물 27의 합성Synthesis Example 8-1: Synthesis of Compound 27
3L 반응기에 화합물 27-1 100.0g(403mmol)을 디클로로메탄 1L에 녹인 후 내부온도를 0℃로 냉각한 뒤 트리에틸아민 81.5g(805mmol), 아크릴클로라이드 43.7g(483mmol)을 천천히 적가하고 온도를 유지하면서 2시간 동안 교반한다. 반응 혼합액을 Celite를 충진한 여과기에 여과하고 생성된 염을 제거한 뒤 여과액에 증류수 1L를 투입하여 세척한 뒤 유기층을 무수황산마그네슘으로 건저한 뒤 농축하여 얻은 유기물을 에틸아세테이트, 노르말헥산 혼합액으로 컬럼진행하여 투명한 액체의 목적화합물 25을 92.1g(수율:68%)을 수득하였다.In a 3L reactor, 100.0g (403mmol) of Compound 27-1 was dissolved in 1L of dichloromethane, the internal temperature was cooled to 0°C, then 81.5g (805mmol) of triethylamine and 43.7g (483mmol) of acrylic chloride were slowly added dropwise and the temperature was adjusted to Maintain stirring for 2 hours. The reaction mixture was filtered through a filter filled with Celite, the salts produced were removed, the filtrate was washed with 1L of distilled water, the organic layer was dried with anhydrous magnesium sulfate, and the obtained organic matter was concentrated and filtered through a column with a mixture of ethyl acetate and normal hexane. Proceeding to obtain 92.1g (yield: 68%) of the target compound 25 as a transparent liquid.
1H NMR (δ ppm; DMSO-d 6 ): 7.14(d, 2H), 7.06(d, 2H), 6.17(m, 1H), 5.95(m, 1H), 5.49(m, 1H), 2.24(m, 3H), 1.76~1.72 (m, 4H), 1.21~1.15(m, 10H), 0.80~0.78(m, 6H) 1H NMR (δ ppm; DMSO- d 6 ): 7.14 (d, 2H), 7.06 (d, 2H), 6.17 (m, 1H), 5.95 (m, 1H), 5.49 (m, 1H), 2.24 (m, 3H) ), 1.76~1.72 (m, 4H), 1.21~1.15(m, 10H), 0.80~0.78(m, 6H)
MS(m/e) : 302.2 MS( m/e ): 302.2
합성예 9: 화합물 42의 합성Synthesis Example 9: Synthesis of Compound 42
합성예 9-1: 화합물 [42-2]의 합성Synthesis Example 9-1: Synthesis of compound [42-2]
3L 반응기에 화합물 42-1 100.0g(430mmol)를 넣고 포름아미드 475g(10,329mmol)에 녹인 후 포름산 99.1g(2,152mmol)을 첨가한 후 내부온도를 190℃로 승온하여 6시간동안 교반한다. 반응혼합액에 포름산 79.2g(1,721mmol)을 더 첨가 후 실온까지 냉각시키며 6시간 동안 교반한다. 반응혼합액에 증류수 1.5L를 첨가 하고 에틸아세테이트 1.5L를 첨가하고 염화나트륨 수용액을 이용하여 추출하고 유기층을 무수황산마그네슘으로 건조한 뒤 농축하여 얻은 유기물에 에탄올 1L와 증류수 1.5L에 희석 후 35% 염산을 1,366.6g(8,607mmol)을 넣고 8시간동안 교반한다. 그 후 감압증류 하여 에탄올과 염산을 제거 하고 0℃까지 냉각한 뒤 암모늄 수용액을 이용하여 pH가 10이 될때까지 적가한다. 그리고 에틸이서를 1L첨가 후 염화나트륨 수용액을 이용하여 추출하고 유기층을 무수황산마그네슘으로 건조한 뒤 농축하여 얻은 유기기물을 메틸렌클로라이드, 에틸하세테이트, 메탄올, 트리에틸아민을 혼합액을 이용 컬럼진행하여 투명한 액체의 중간체 화합물 [42-2]을 81.4g(수율:81%)을 수득하였다.Add 100.0 g (430 mmol) of Compound 42-1 to a 3L reactor, dissolve it in 475 g (10,329 mmol) of formamide, add 99.1 g (2,152 mmol) of formic acid, raise the internal temperature to 190°C, and stir for 6 hours. Add 79.2 g (1,721 mmol) of formic acid to the reaction mixture, cool to room temperature, and stir for 6 hours. Add 1.5 L of distilled water to the reaction mixture, add 1.5 L of ethyl acetate, extract using aqueous sodium chloride solution, dry the organic layer with anhydrous magnesium sulfate, and then concentrate. The resulting organic material was diluted with 1 L of ethanol and 1.5 L of distilled water, and then added with 35% hydrochloric acid to 1,366.6 m. Add g (8,607 mmol) and stir for 8 hours. Afterwards, ethanol and hydrochloric acid are removed through reduced pressure distillation, cooled to 0°C, and ammonium aqueous solution is added dropwise until the pH reaches 10. Then, after adding 1 L of ethyl iser, extraction was performed using an aqueous sodium chloride solution, the organic layer was dried with anhydrous magnesium sulfate, and then concentrated. The obtained organic material was column-processed using a mixture of methylene chloride, ethyl hacetate, methanol, and triethylamine to produce a clear liquid. 81.4 g (yield: 81%) of intermediate compound [42-2] was obtained.
합성예 9-2: 화합물 42의 합성Synthesis Example 9-2: Synthesis of Compound 42
합성예 8-1과 동일한 방법으로 화합물 42-1 81.4g(349mmol), 트리에틸아민 70.6g(697mmol), 메타아크릴클로라이드 43.7g(418mmol), 디클로로메탄 1L를 이용하여 투명한 액체의 목적화합물 42을 59.9g(수율:57%)을 수득하였다.In the same manner as Synthesis Example 8-1, the target compound 42 as a transparent liquid was prepared using 81.4 g (349 mmol) of compound 42-1, 70.6 g (697 mmol) of triethylamine, 43.7 g (418 mmol) of methacrylic chloride, and 1 L of dichloromethane. 59.9g (yield: 57%) was obtained.
1H NMR (δ ppm; DMSO-d 6 ): 7.93(s, 1H), 7.30(m, 2H), 7.19~7.17(m, 3H), 5.89(m, 1H), 5.60(m, 1H), 4.77(m, 1H), 1.88(s, 3H), 1.74(m, 2H), 1.21~1.15(m, 14H), 0.78(m, 3H) 1H NMR (δ ppm; DMSO- d 6 ): 7.93 (s, 1H), 7.30 (m, 2H), 7.19-7.17 (m, 3H), 5.89 (m, 1H), 5.60 (m, 1H), 4.77 (m , 1H), 1.88(s, 3H), 1.74(m, 2H), 1.21~1.15(m, 14H), 0.78(m, 3H)
MS(m/e) : 301.2 MS( m/e ): 301.2
합성예 10: 화합물 45의 합성Synthesis Example 10: Synthesis of Compound 45
합성예 10-1: 화합물 45의 합성Synthesis Example 10-1: Synthesis of Compound 45
합성예 1-1과 동일한 방법으로 화합물 45-1 100.0g(399mmol), 수소화붕소나트륨 9.1g(240mmol), 트리에틸아민 80.8g(799mmol), 아크릴클로라이드 43.4g(479mmol), 에탄올 1L, 디클로로메탄 1L를 이용하여 투명한 액체의 목적화합물 45을 88.1g(수율:72%)을 수득하였다.In the same manner as Synthesis Example 1-1, 100.0 g (399 mmol) of compound 45-1, 9.1 g (240 mmol) of sodium borohydride, 80.8 g (799 mmol) of triethylamine, 43.4 g (479 mmol) of acrylic chloride, 1 L of ethanol, dichloromethane. Using 1L, 88.1g (yield: 72%) of the target compound 45 as a transparent liquid was obtained.
1H NMR (δ ppm; DMSO-d 6 ): 7.24(m, 2H), 7.07(m, 2H), 6.17(m, 1H), 5.95(m, 1H), 5.49(m, 1H), 5.14(m, 1H), 1.54(m, 2H), 1.21~1.15(m, 14H), 0.78(m, 3H) 1H NMR (δ ppm; DMSO- d 6 ): 7.24 (m, 2H), 7.07 (m, 2H), 6.17 (m, 1H), 5.95 (m, 1H), 5.49 (m, 1H), 5.14 (m, 1H) ), 1.54(m, 2H), 1.21~1.15(m, 14H), 0.78(m, 3H)
MS(m/e) : 306.2 MS( m/e ): 306.2
상기 합성예 1 내지 10는 구체적인 예를 기술한 것이며, 합성법을 한정하는 것이 아니라는 것은 당업자라면 자명한 것이다. It is obvious to those skilled in the art that Synthesis Examples 1 to 10 describe specific examples and do not limit the synthesis method.
코팅액 조성물 물성평가Physical property evaluation of coating liquid composition
실시예 1 내지 15 및 비교예 1 내지 6에서 사용한 코팅액 조성물의 구성성분을 아래에 나타내었다.The components of the coating liquid composition used in Examples 1 to 15 and Comparative Examples 1 to 6 are shown below.
(A) 화학식 1로 표시되는 아크릴레이트 화합물(A)(A) Acrylate compound (A) represented by Formula 1
(A-1) 1-페닐-1-데실아크릴레이트 (화합물 3)(A-1) 1-phenyl-1-decyl acrylate (Compound 3)
(A-2) 1-페닐-1-테트라데실아크릴레이트 (화합물 6)(A-2) 1-phenyl-1-tetradecylacrylate (Compound 6)
(A-3) 1-페닐-1-도데실메타아크릴레이트 (화합물 12)(A-3) 1-phenyl-1-dodecyl methacrylate (Compound 12)
(A-4) 1-페닐 -1-헥사데실메타아크릴레이트 (화합물 14) (A-4) 1-phenyl-1-hexadecyl methacrylate (Compound 14)
(A-5) 1-페닐-2-부틸-1-옥틸아크릴레이트 (화합물 15) (A-5) 1-phenyl-2-butyl-1-octylacrylate (Compound 15)
(A-6) 1-(2,4-디메틸페닐)-1-헥사데셀아크릴레이트 (화합물 21)(A-6) 1-(2,4-dimethylphenyl)-1-hexadecel acrylate (Compound 21)
(A-7) 4-바이페닐-1-데실아크릴레이트 (화합물 24)(A-7) 4-Biphenyl-1-decyl acrylate (Compound 24)
(A-8) 4-메틸페닐-1-에틸-1-옥틸아크릴레이트 (화합물 25)(A-8) 4-methylphenyl-1-ethyl-1-octylacrylate (Compound 25)
(A-9) 1-페닐-1-데실아크릴아미드 (화합물 40)(A-9) 1-phenyl-1-decylacrylamide (Compound 40)
(A-10) 1-(4-플루오로페닐)-1-테트라데실아크릴레이트 (화합물 40)(A-10) 1-(4-fluorophenyl)-1-tetradecylacrylate (Compound 40)
(B) 화학식 1로 표시되는 아크릴레이트 화합물(A)과 중합 가능한 다관능성 아크릴 화합물(B)(B) A multifunctional acrylic compound (B) polymerizable with the acrylate compound (A) represented by Formula 1
(B-1) 1,10-데칸디올디아크릴레이트(B-1) 1,10-decanediol diacrylate
(B-2) 1,12-도데칸디올디아크릴레이트(B-2) 1,12-dodecanediol diacrylate
(B-3) 1,8-옥탄디올디아크릴레이트(B-3) 1,8-octanediol diacrylate
(B-4) 트리시클로데칸디메탄올디메타아크릴레이트(B-4) Tricyclodecane dimethanol dimethacrylate
(B-5) 트리메틸올프로판트리아크릴레이트(B-5) Trimethylolpropane triacrylate
(C) 추가적으로 포함되는 단관능성 아크릴 화합물(C)(C) Additional monofunctional acrylic compound (C)
(C-1) 옥틸메타아크릴레이트(C-1) Octyl methacrylate
(C-2) 라우릴아크릴레이트(C-2) Lauryl acrylate
(C-3) 디사이클로펜타닐 메타아크릴레이트(C-3) dicyclofentanyl methacrylate
(D) 광개시제(D) Photoinitiator
(D-1) 인계 광개시제 (Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide)(D-1) Phosphorus photoinitiator (Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide)
(D-1: Darocur TPO) (D-1: Darocur TPO)
(D-2) 옥심계 광개시제((E)-2-((benzoyloxy)imino)-1-(4-(phenylthio)phenyl) octan-1-one) (D-2) Oxime-based photoinitiator ((E)-2-((benzoyloxy)imino)-1-(4-(phenylthio)phenyl) octan-1-one)
(D-2: Irgacure OXE-01) (D-2: Irgacure OXE-01)
(E) 비교예로서 사용되는 단관능성 아크릴화합물(E) Monofunctional acrylic compound used as a comparative example
(E-1) 1-페닐-1-펜틸메타아크릴레이트(E-1) 1-phenyl-1-pentyl methacrylate
(E-2) 페녹시에틸메타아크릴레이트(E-2) Phenoxyethyl methacrylate
(E-3) 페녹시벤질아크릴레이트(E-3) Phenoxybenzyl acrylate
(E-4) o-페닐페녹시에틸아크릴레이트(E-4) o-phenylphenoxyethyl acrylate
또한, 실시예 1 내지 15 및 비교예 1 내지 6에서 사용한 코팅액 조성물의 구성성분 각각에 대한 함량을 아래 표 1에 나타내었다.In addition, the contents of each component of the coating liquid composition used in Examples 1 to 15 and Comparative Examples 1 to 6 are shown in Table 1 below.
단관능성 화합물
(C)additionally available
monofunctional compounds
(C)
실험평가예 1 : 비유전율 Experimental evaluation example 1: relative dielectric constant
상기 실시예 및 비교예에 따라 제조된 코팅액 조성물을 30mm × 30mm × 1T의 구리 전극에 막 두께 200ㅅm로 도포하여 UV 처리 하여 경화시킨 후 유전율 측정기(MaterialsLab XM : Solartron Co ., Ltd.제)를 사용하여 측정하였다. The coating composition prepared according to the above Examples and Comparative Examples was applied to a copper electrode of 30 mm It was measured using .
실험평가예 2 : 플라즈마 식각률 평가Experimental Evaluation Example 2: Plasma etch rate evaluation
실리콘 웨이퍼에 상기 표 1에서 제조한 밀봉재 조성물을 도포한 후 광경화시키고, 유기층의 막두께를 측정하였다(T1: ㎛). 보다 구체적으로 유기층에 ICP CVD를 이용하여 유도결합 플라즈마를 처리한 후 유기층의 막두께를 측정하여 하기의 식 1)으로 식각률을 계산하였다. The sealing material composition prepared in Table 1 was applied to a silicon wafer and then photocured, and the film thickness of the organic layer was measured (T1: ㎛). More specifically, after treating the organic layer with inductively coupled plasma using ICP CVD, the film thickness of the organic layer was measured and the etch rate was calculated using Equation 1) below.
식 1) 식각률(%): (T1-T2)/T1×100Equation 1) Etching rate (%): (T1-T2)/T1×100
실험평가예 3 : 크로스컷 테잎테스트(접착력 측정)Experimental evaluation example 3: Crosscut tape test (adhesion measurement)
실리콘 웨이퍼에 상기 표 1에서 제조한 밀봉재용 코팅액 조성물을 10 ㎛ 두께로 도포한 후 광경화시킨 후, 크로스컷 테잎테스트용 나이프를 이용하여 1 mm 간격으로 7×7로 유기층을 절단한뒤 절단면을 부드러운 붓으로 정리한다.After applying the coating liquid composition for sealing material prepared in Table 1 to a silicon wafer to a thickness of 10 ㎛ and photocuring, the organic layer was cut into 7×7 pieces at 1 mm intervals using a crosscut tape test knife, and the cut surface was Clean it up with a soft brush.
부착력 테이프(25mm, 4.3N)을 부착한 후 90±30초 이내에 180도의 각도로 잡아 당겨 테이프를 제거한 후 하기 표 2에 제시된 기준으로 0B 내지 5B의 등급에 따라 분류하여 측정하였다.After attaching the adhesive tape (25 mm, 4.3 N), the tape was removed by pulling at an angle of 180 degrees within 90 ± 30 seconds, and the adhesive was classified and measured according to the grades of 0B to 5B based on the standards shown in Table 2 below.
격자 면적의 5%미만Small pieces of coating separate at the intersection.
Less than 5% of grid area
격자 면적의 1~15%Small pieces of the coating separate along edges and at cut intersections.
1-15% of grid area
격자 면적의 15~35%The cut edge of the coating and part of the square are separated.
15-35% of grid area
격자면적의 35~65%The coating peeled off significantly along the edges of the cut and the squares separated.
35~65% of grid area
격자 면적의 65%이상More deprived and separated than 1B
More than 65% of grid area
실험예 4: 수축율 측정Experimental Example 4: Measurement of shrinkage rate
수축율 조성물의 경화전 후의 부피차를 이용해 측정하며, 내경 5 mm 유리관에 조성물을 일정높이(H1) 주입하고, U.V에 노광시켜 경화시킨후의 높이(H2), 식 2)으로 수축율을 계산하였다.Shrinkage rate was measured using the volume difference before and after curing of the composition, and the shrinkage rate was calculated by injecting the composition at a certain height (H1) into a glass tube with an inner diameter of 5 mm and using the height (H2) after curing by exposure to UV, Equation 2).
식 2) 수축율(%): (H1-H2)/H1×100Equation 2) Shrinkage rate (%): (H1-H2)/H1×100
상기 실험예 1 내지 4에서 측정된 평가결과는 하기 표 3에 기재하였다.The evaluation results measured in Experimental Examples 1 to 4 are shown in Table 3 below.
테스트cross cut tape
test
(%)shrinkage rate
(%)
상기 표 3에 나타난 바와 같이, 본 발명의 실시예 1 내지 15의 밀봉재 조성물은 비교예 1 내지 6의 조성물에 비해 유전율, 내플라즈마성능, 접착력 및 수축률 특성에서 우수한 성능을 나타내었다. As shown in Table 3, the sealing material compositions of Examples 1 to 15 of the present invention showed excellent performance in dielectric constant, plasma resistance, adhesion, and shrinkage characteristics compared to the compositions of Comparative Examples 1 to 6.
이를 보다 상세하게 설명하자면 실시예 1 ~ 15에서 R3가 탄소수 6개 이상인 알킬기를 사용한 경우 비교예 1과 비교예 5에서 R3가 탄소수 5인 펜틸을 사용한 경우보다 유전율과 접착력이 우수함을 알 수 있다. To explain this in more detail, it can be seen that in Examples 1 to 15, when R 3 used an alkyl group having 6 or more carbon atoms, the dielectric constant and adhesive strength were superior to those when R 3 used pentyl with 5 carbon atoms in Comparative Examples 1 and 5. there is.
또한 비교예 6에서는 물성조절을 위한 모노머를 첨가하였고 이는 실시예13 내지 15와 대비되는 것으로 볼 수 있으나, 방향족 단관능성 모노머로 E-4를 사용하여 가교한 경우 단관능 모노머를 첨가하더라도 전자들의 분극화로 유전율이 높아지고 박막이 단단해져 접착력이 실시예보다 양호하지 못한 결과를 나타냄을 알 수 있다.In addition, in Comparative Example 6, a monomer was added to adjust the physical properties, which can be seen as a contrast to Examples 13 to 15. However, when crosslinking was performed using E-4 as an aromatic monofunctional monomer, even if a monofunctional monomer was added, electrons were polarized. It can be seen that the dielectric constant increases and the thin film becomes hard, resulting in less good adhesion than in the example.
또한 비교예에서는 관능기가 많고, 방향족 고리 화합물들이 들어간 예들은 내플라즈마성능에서 차이를 보이지 않으나 가장 중요한 항목인 유전율 부분에서 본 발명에 따른 실시예들에 비해 큰 차이를 보이고 있으며, 또한 접착력에서 낮은 성능을 보여주고 있음을 알 수 있고, 이는 관능기가 많고 방향족 고리 화합물들이 들어가 전자들의 분극화가 일어나 유전율에 크나큰 영향을 주고 있는 것으로 추정된다.In addition, in the comparative examples, examples containing many functional groups and aromatic ring compounds show no difference in plasma resistance, but show a large difference in dielectric constant, which is the most important item, compared to the examples according to the present invention, and also show low performance in adhesive strength. It can be seen that it shows, and it is presumed that the presence of many functional groups and aromatic ring compounds causes polarization of electrons, greatly affecting the dielectric constant.
이상에서 본 발명의 바람직한 실시예들에 대하여 상세하게 설명하였지만 본 발명의 권리 범위는 이에 한정되는 것은 아니고 다음의 청구 범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리 범위에 속하는 것이다.Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements can be made by those skilled in the art using the basic concept of the present invention as defined in the following claims. It falls within the scope of invention rights.
Claims (18)
[화학식 1]
상기 [화학식 1]에서,
상기 R1은 수소, 중수소, 치환 또는 비치환된 C1~C10의 알킬기 중에서 선택되는 어느 하나이고,
상기 X는 산소(O), 황(S) 또는 -NR'- 중에서 선택되는 어느 하나이고,
상기 R'및 R2는 각각 동일하거나 상이하며, 서로 독립적으로 수소, 중수소, 치환 또는 비치환된 C1~C30의 알킬기, 치환 또는 비치환된 C1~C30의 할로겐화된 알킬기, 치환 또는 비치환된 C6~C24의 아릴기, 치환 또는 비치환되고 이종 원자로 O, N 또는 S를 1 내지 2개 포함하는 C4~C24의 헤테로아릴기 중에서 선택되는 어느 하나이고,
상기 R3는 치환 또는 비치환된 C6~C30의 알킬기 상기 R3는 치환 또는 비치환된 C6~C30의 알킬기 및 치환 또는 비치환된 C6~C30의 할로겐화된 알킬기 중에서 선택되는 어느 하나이고,
및 치환 또는 비치환된 C6~C30의 할로겐화된 알킬기 중에서 선택되는 어느 하나이고,
상기 Ar1은 치환 또는 비치환된 C6~C24의 아릴기 및 치환 또는 비치환되고 이종 원자로 O, N 또는 S를 1 내지 2개 포함하는 C4~C24의 헤테로아릴기 중에서 선택되는 어느 하나이고,
상기 화학식 1에서의 '치환 또는 비치환된'에서의'치환'은 중수소, 시아노기, 할로겐기, 히드록시기, 니트로기, C1-C10의 알킬기, C1-C10의 할로겐화된 알킬기, C2-C10의 알케닐기, C2-C10의 알키닐기, C1-C10의 헤테로알킬기, C6-C18의 아릴기, C7-C19의 아릴알킬기, C7-C19의 알킬아릴기, C1-C10의 알콕시기, C1-C10 알킬티오닐기, C1-C10의 알킬아미노기, C6-C18의 아릴아미노기, C1-C10의 알킬실릴기, C6-C18의 아릴실릴기, C6-C12의 아릴옥시기로 이루어진 군에서 선택된 어느 하나의 치환기로 치환되는 것을 의미한다.
An acrylic compound containing both an aromatic substituent and an aliphatic substituent, represented by the following [Chemical Formula 1].
[Formula 1]
In [Formula 1] above,
R 1 is any one selected from hydrogen, deuterium, and a substituted or unsubstituted C1 to C10 alkyl group,
The X is any one selected from oxygen (O), sulfur (S), or -NR'-,
R' and R 2 are each the same or different, and are independently hydrogen, deuterium, a substituted or unsubstituted C1~C30 alkyl group, a substituted or unsubstituted C1~C30 halogenated alkyl group, or a substituted or unsubstituted C6. Any one selected from ~C24 aryl group, substituted or unsubstituted C4~C24 heteroaryl group containing 1 to 2 O, N or S as heteroatoms,
R 3 is a substituted or unsubstituted C6 to C30 alkyl group. R 3 is a substituted or unsubstituted C6 to C30 alkyl group and a substituted or unsubstituted C6 to C30 halogenated alkyl group,
and a substituted or unsubstituted C6~C30 halogenated alkyl group,
Ar 1 is any one selected from a substituted or unsubstituted C6 to C24 aryl group and a substituted or unsubstituted C4 to C24 heteroaryl group containing 1 to 2 heteroatoms O, N or S,
In Formula 1, 'substitution' in 'substituted or unsubstituted' means deuterium, cyano group, halogen group, hydroxy group, nitro group, C1-C10 alkyl group, C1-C10 halogenated alkyl group, C2-C10 alkene. Nyl group, C2-C10 alkynyl group, C1-C10 heteroalkyl group, C6-C18 aryl group, C7-C19 arylalkyl group, C7-C19 alkylaryl group, C1-C10 alkoxy group, C1-C10 alkyl group Substituted with any one substituent selected from the group consisting of oneyl group, C1-C10 alkylamino group, C6-C18 arylamino group, C1-C10 alkylsilyl group, C6-C18 arylsilyl group, and C6-C12 aryloxy group. It means becoming.
상기 R1은 수소, 중수소 또는 C1~C5의 비치환된 알킬기 중에서 선택되는 어느 하나인 것을 특징으로 하는 아크릴 화합물.
According to paragraph 1,
An acrylic compound wherein R 1 is selected from hydrogen, deuterium, or an unsubstituted alkyl group of C1 to C5.
상기 R'및 R2는 각각 동일하거나 상이하며, 서로 독립적으로 수소, 중수소, 치환 또는 비치환된 C1~C10의 알킬기, 치환 또는 비치환된 C6~C18의 아릴기, 중에서 선택되는 어느 하나인 것을 특징으로 하는 아크릴 화합물.
According to paragraph 1,
R' and R 2 are each the same or different, and are independently selected from hydrogen, deuterium, a substituted or unsubstituted C1 to C10 alkyl group, or a substituted or unsubstituted C6 to C18 aryl group. Characterized by acrylic compounds.
상기 R3는 치환 또는 비치환된 C7~C20의 알킬기인 것을 특징으로 하는 아크릴 화합물.
According to paragraph 1,
An acrylic compound wherein R 3 is a substituted or unsubstituted C7 to C20 alkyl group.
상기 X는 산소(O) 인 것을 특징으로 하는 아크릴 화합물.
According to paragraph 1,
An acrylic compound, wherein X is oxygen (O).
상기 Ar1은 치환 또는 비치환된 페닐기 또는 치환 또는 비치환된 나프틸기 인 것을 특징으로 하는 아크릴 화합물.
According to paragraph 1,
The acrylic compound is characterized in that Ar1 is a substituted or unsubstituted phenyl group or a substituted or unsubstituted naphthyl group.
상기 화학식 1로 표시되는 아크릴 화합물은 아래 화합물 1 내지 화합물 46 중에서 선택되는 어느 하나인 것을 특징으로 하는 아크릴 화합물.
<화합물 1> <화합물 2> <화합물 3>
<화합물 4> <화합물 5> <화합물 6>
<화합물 7> <화합물 8> <화합물 9>
<화합물 10> <화합물 11> <화합물 12>
<화합물 13> <화합물 14> <화합물 15>
<화합물 16> <화합물 17> <화합물 18>
<화합물 19> <화합물 20> <화합물 21>
<화합물 22> <화합물 23> <화합물 24>
<화합물 25> <화합물 26> <화합물 27>
<화합물 28> <화합물 29> <화합물 30>
<화합물 31> <화합물 32> <화합물 33>
<화합물 34> <화합물 35> <화합물 36>
<화합물 37> <화합물 38> <화합물 39>
<화합물 40> <화합물 41> <화합물 42>
<화합물 43> <화합물 44> <화합물 45>
<화합물 46>
According to paragraph 1,
The acrylic compound represented by Formula 1 is an acrylic compound selected from compounds 1 to 46 below.
<Compound 1><Compound2><Compound3>
<Compound 4><Compound5><Compound6>
<Compound 7><Compound8><Compound9>
<Compound 10><Compound11><Compound12>
<Compound 13><Compound14><Compound15>
<Compound 16><Compound17><Compound18>
<Compound 19><Compound20><Compound21>
<Compound 22><Compound23><Compound24>
<Compound 25><Compound26><Compound27>
<Compound 28><Compound29><Compound30>
<Compound 31><Compound32><Compound33>
<Compound 34><Compound35><Compound36>
<Compound 37><Compound38><Compound39>
<Compound 40><Compound41><Compound42>
<Compound 43><Compound44><Compound45>
<Compound 46>
A coating liquid composition comprising the acrylic compound according to any one of claims 1 to 7.
상기 코팅액 조성물은 추가적으로, 중합개시제: 또는 광중합성 모노머;를 선택적으로 포함하는 것을 특징으로 하는 코팅액 조성물.
According to clause 8,
The coating liquid composition further optionally includes a polymerization initiator: or a photopolymerizable monomer.
1 to 80% by weight of the acrylic compound (A) according to any one of claims 1 to 7; 19 to 80% by weight of a multifunctional acrylic compound (B) polymerizable with the acrylic compound (A); and 0.1 to 20% by weight of a polymerization initiator (D).
상기 다관능성 화합물(B)는 1,4-부탄디올디(메타)아크릴레이트, 1,6-헥산디올디(메타)아크릴레이트, 1,9-노난디올디(메타)아크릴레이트, 1,10-데칸디올디(메타)아크릴레이트, 1,12-도데칸디올디(메타)아크릴레이트, 1,14-테트라데칸디올디(메타)아크릴레이트, 1,14-테트라데칸디올디(메타)아크릴레이트, 1,16-헥사데칸디올디(메타)아크릴레이트, 폴리에틸렌글리콜디(메타)아크릴레이트, 폴리프로필렌글리콜디(메타)아크릴레이트, 트리시클로데칸디메탄올디아크릴레이트, 아다만탄-1,2-디닐다아크릴레이트, 펜타에리스리톨트리(메타)아크릴레이트, 펜타에리스리톨(폴리)에톡시트리(메타)아크릴레이트, 펜타에리스리톨(폴리)프로폭시트리(메타)아크릴레이트, 펜타에리스리톨테트라(메타)아크릴레이트, 펜타에리스리톨(폴리)에톡시테트라(메타)아크릴레이트, 펜타에리스리톨(폴리)프로폭시테트라(메타)아크릴레이트, 디펜타에리스리톨펜타(메타)아크릴레이트, 디펜타에리스리톨(폴리)카프로락톤펜타(메타)아크릴레이트, 디펜타에리스리톨(폴리)에톡시펜타(메타)아크릴레이트, 디펜타에리스리톨(폴리)프로폭시펜타(메타)아크릴레이트, 디펜타에리스리톨헥사(메타)아크릴레이트, 디펜타에리스리톨(폴리)카프로락톤헥사(메타)아크릴레이트, 디펜타에리스리톨(폴리)에톡시헥사(메타)아크릴레이트, 디펜타에리스리톨(폴리)프로폭시헥사(메타)아크릴레이트, 폴리펜타에리스리톨폴리(메타)아크릴레이트, 트리메틸롤프로판트리(메타)아크릴레이트, 트리메틸롤프로판(폴리)에톡시트리(메타)아크릴레이트, 트리메틸롤프로판(폴리)프로폭시트리(메타)아크릴레이트, 디메틸롤프로판테트라(메타)아크릴레이트, 글리세롤트리(메타)아크릴레이트, 2,2,2-트리스아크릴옥시메틸숙신산, 실리콘헥사(메타)아크릴레이트 중에서 선택된 1 내지 5의 화합물이 사용되는 것을 특징으로 하는 코팅액 조성물.
According to clause 10,
The multifunctional compound (B) is 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10- Decanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, 1,14-tetradecanediol di(meth)acrylate, 1,14-tetradecanediol di(meth)acrylate, 1,16-Hexadecanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, tricyclodecane dimethanol diacrylate, adamantane-1,2- Dinyldiacrylate, pentaerythritol tri(meth)acrylate, pentaerythritol(poly)ethoxytri(meth)acrylate, pentaerythritol(poly)propoxytri(meth)acrylate, pentaerythritol tetra(meth)acrylate , pentaerythritol (poly) ethoxytetra (meth)acrylate, pentaerythritol (poly) propoxy tetra (meth)acrylate, dipentaerythritol penta (meth)acrylate, dipentaerythritol (poly) caprolactone penta (meth) ) Acrylate, dipentaerythritol (poly)ethoxypenta (meth)acrylate, dipentaerythritol (poly)propoxypenta (meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol (poly) Caprolactone hexa(meth)acrylate, dipentaerythritol (poly)ethoxyhexa(meth)acrylate, dipentaerythritol (poly)propoxy hexa(meth)acrylate, polypentaerythritol poly(meth)acrylate, trimethyl Rollpropane tri(meth)acrylate, trimethylolpropane(poly)ethoxytri(meth)acrylate, trimethylolpropane(poly)propoxytri(meth)acrylate, dimethylolpropane tetra(meth)acrylate, glycerol A coating liquid composition characterized in that compounds 1 to 5 selected from tri(meth)acrylate, 2,2,2-trisacryloxymethylsuccinic acid, and silicon hexa(meth)acrylate are used.
상기 코팅액 조성물은 [화학식 1]로 표시되는 화합물(A); 상기 화합물(A)와 중합가능한 다관능성 화합물(B); 이외에 추가적으로 단관능성 아크릴 모노머(C)를 0 내지 50 중량%; 포함하는 것을 특징으로 하는 코팅액 조성물.
According to clause 10,
The coating liquid composition includes compound (A) represented by [Formula 1]; A multifunctional compound (B) polymerizable with the compound (A); In addition, 0 to 50% by weight of monofunctional acrylic monomer (C); A coating liquid composition comprising:
상기 단관능성 아크릴 모노머(C)는 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 프로필(메타)아크릴레이트, 부틸(메타)아크릴레이트, 헥실(메타)아크릴레이트, 옥틸(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트, 데실(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 도데실(메타)아크릴레이트 및 헥사데실(메타)아크릴레이트, 이소보닐(메타)아크릴레이트, 아다만틸(메타)아크릴레이트, 디시클로펜타닐(메타)아크릴레이트, 벤질(메타)아크릴레이트, 페녹시벤질(메타)아크릴레이트, 2-메톡시에틸(메타)아크릴레이트, 2-에톡시에틸(메타)아크릴레이트, 아크릴산, 메타아크릴산, 글리시딜아크릴레이트, 글리시딜 메타아크릴레이트, 3,4-에폭시부틸(메타)아크릴레이트,2,3-에폭시시클로헥실(메타)아크릴레이트,3,4-에폭시시클로헥실메틸(메타)아크릴레이트, 3-에틸옥세탄-3-메틸(메타)아크릴레이트, (메타)아크릴아미드 모노머 중에서 선택된 1 내지 5의 화합물이 사용되는 것을 특징으로 하는 코팅액 조성물.
According to clause 12,
The monofunctional acrylic monomer (C) is methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, hexyl (meth)acrylate, and octyl (meth)acrylate. , cyclohexyl (meth)acrylate, decyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate and hexadecyl (meth)acrylate, isobornyl (meth)acrylate, adaman Til (meth)acrylate, dicyclofentanyl (meth)acrylate, benzyl (meth)acrylate, phenoxybenzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate ) Acrylate, acrylic acid, methacrylic acid, glycidyl acrylate, glycidyl methacrylate, 3,4-epoxybutyl (meth)acrylate, 2,3-epoxycyclohexyl (meth)acrylate, 3,4 - A coating liquid composition characterized in that 1 to 5 compounds selected from epoxycyclohexylmethyl (meth)acrylate, 3-ethyloxetane-3-methyl (meth)acrylate, and (meth)acrylamide monomer are used.
상기 중합개시제(D)는 광중합 개시제인 것을 특징으로 하는 코팅액 조성물.
According to clause 9,
A coating liquid composition, characterized in that the polymerization initiator (D) is a photopolymerization initiator.
상기 코팅액 조성물은 전체 조성물의 총량을 기준으로, 유기용매를 5 내지 70 중량부를 추가로 포함하는 것을 특징으로 하는 코팅액 조성물.
According to clause 10,
The coating liquid composition is characterized in that it additionally contains 5 to 70 parts by weight of an organic solvent, based on the total amount of the entire composition.
A photo-cured or thermo-cured organic coating film, characterized in that it is manufactured by thermally curing or photo-curing the coating liquid composition according to any one of claims 8 to 15.
상기 유기 코팅막은 유기층 또는 무기층을 추가적으로 더 포함하는 것을 특징으로 하는 유기코팅막.
According to clause 16,
The organic coating film is characterized in that the organic coating film additionally includes an organic layer or an inorganic layer.
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KR20160030077A (en) | 2013-05-23 | 2016-03-16 | 닛뽄 가야쿠 가부시키가이샤 | Resin composition for sealing organic el element, and cured product thereof |
KR20160053751A (en) | 2014-10-29 | 2016-05-13 | 삼성에스디아이 주식회사 | Sealant composition for display, organic protective layer comprising the same, and display apparatus comprising the same |
KR20190065896A (en) | 2017-12-04 | 2019-06-12 | 삼성에스디아이 주식회사 | Composition for encapsulating organic light emitting diode device and organic light emitting diode display using prepared the same |
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KR20160030077A (en) | 2013-05-23 | 2016-03-16 | 닛뽄 가야쿠 가부시키가이샤 | Resin composition for sealing organic el element, and cured product thereof |
KR20160053751A (en) | 2014-10-29 | 2016-05-13 | 삼성에스디아이 주식회사 | Sealant composition for display, organic protective layer comprising the same, and display apparatus comprising the same |
KR20190065896A (en) | 2017-12-04 | 2019-06-12 | 삼성에스디아이 주식회사 | Composition for encapsulating organic light emitting diode device and organic light emitting diode display using prepared the same |
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