KR20240055644A - Exposure method, exposure device, and article manufacturing method - Google Patents

Abstract

A first layer exposure process of exposing a pattern of the original to a first layer on the substrate while scanning the relative positions of the original and the substrate in the scanning direction, and exposing the pattern of the original to the first layer while scanning the relative positions in the scanning direction. An exposure method comprising a second layer exposure process of exposing a second layer on a first layer, wherein the first layer exposure process is performed in the scan direction with respect to a pattern formation area in the original plate and the pattern formation area. A first step of transferring a first effective area including a light-shielding area provided at a spaced apart position and an alignment mark to a first shot area in the substrate, a part of the pattern forming area, and a part of the alignment mark. and a second step of transferring the included second effective area to a second shot area in the substrate so that it overlaps an area corresponding to the light-shielding area in the first shot area.

Description

Exposure method, exposure device, and article manufacturing method {EXPOSURE METHOD, EXPOSURE DEVICE, AND ARTICLE MANUFACTURING METHOD}

The present invention relates to exposure methods, exposure apparatus, and article manufacturing methods.

In the manufacture of flat panel displays (FPDs) such as liquid crystal displays and organic EL displays, and semiconductor devices, an exposure device is used to transfer the pattern of an original plate such as a mask to a substrate such as a glass plate or wafer coated with a photosensitive material. . In such an exposure apparatus, it is required to align the original pattern with high precision in the pattern area on the substrate. In general, by forming an alignment mark for positional alignment on the lower layer and measuring the alignment mark formed on the lower layer during exposure of the upper layer, the pattern can be transferred to the upper layer by superimposing it on the pattern formed on the lower layer with high precision.

Additionally, in the exposure process using an exposure apparatus, it is also required to reduce production costs by optimizing the panel layout and using the substrate without waste. When optimizing the panel layout, the size of the original plate can be a limitation. For example, when transferring the pattern 16 of the original plate 3 as shown in FIG. 18(a) to the substrate 6 in FIG. 18(b), the pattern 16 shown in FIG. 18(b) It has a bar-like panel layout. In Figure 18(b), unnecessary space is created in the area 52 where panels cannot be produced.

Patent Document 1 discloses a full shot exposure (also referred to as first exposure) that transfers the entire pattern of the original plate, and a half shot exposure (also referred to as second exposure) that transfers a part (for example, half) of the pattern of the original plate while being shielded from light. A method of combining) is disclosed. By combining full-shot exposure and half-shot exposure, it becomes possible to produce a panel with a panel layout as shown in (c) of FIG. 18, and the panel layout can be optimized to avoid generating unnecessary space.

Japanese Patent Publication No. 2010-85793

In Patent Document 1, optimization of the panel layout can be realized by performing full shot exposure and half shot exposure in a direction (X direction) orthogonal to the scanning direction of exposure. Similarly, there is a risk of waste space occurring in the exposure scanning direction (Y direction), so it may be required to optimize the panel layout as in the X direction. If a pattern is formed by simply shielding a portion of the original plate 3, an alignment mark cannot be formed at a desired location, which may be disadvantageous in terms of pattern formation precision or throughput.

Therefore, the purpose of the present invention is to provide an exposure method that is advantageous in optimizing the panel layout.

In order to achieve the above object, an exposure method as one aspect of the present invention includes a first layer exposure process of exposing a pattern of the original plate to a first layer on the substrate while scanning the relative positions of the original plate and the substrate in the scanning direction; An exposure method comprising a second layer exposure process of exposing a pattern of the original plate to a second layer on the first layer while scanning the relative position in the scanning direction, wherein the first layer exposure process includes: A first process of transferring a first effective area including a pattern formation area, a light-shielding area provided at a position spaced apart from the pattern formation area in the scanning direction, and an alignment mark to a first shot area in the substrate. and a second effective area on the substrate such that a second effective area including a part of the pattern formation area and a part of the alignment mark overlaps with an area corresponding to the light-shielding area in the first shot area. It is characterized by comprising a second process of transferring to the shot area.

Additional features of the invention will become apparent from the following description of exemplary embodiments (with reference to the accompanying drawings).

Figure 1 is a diagram showing a layout with different numbers of panels in the Y direction.
Figure 2 is a diagram showing the positional relationship between the alignment mark and the measurement unit.
Figure 3 is a diagram showing Comparative Example 1.
Figure 4 is a diagram showing Comparative Example 2.
FIG. 5 is a diagram showing the configuration of the exposure apparatus viewed from the X direction.
FIG. 6 is a diagram showing the configuration of the exposure apparatus viewed from the Y direction.
Fig. 7 is a diagram showing the original plate and substrate in the first embodiment.
Fig. 8 is a flowchart of exposure in the first embodiment.
Fig. 9 is a diagram showing a method for exposing the base layer in the first embodiment.
Fig. 10 is a diagram showing a method for exposing the upper paper layer in the first embodiment.
Fig. 11 is a diagram showing an exposure method when the number of shots increases in the first embodiment.
Fig. 12 is a diagram showing the original plate and substrate in the second embodiment.
Fig. 13 is a flowchart of exposure in the second embodiment.
Fig. 14 is a diagram showing an exposure area in the second embodiment.
Fig. 15 is a diagram showing the positional relationship between left and right shots in the second embodiment.
Fig. 16 is a diagram showing the positional relationship between upper and lower shots in the second embodiment.
17 is a flow chart of a method for manufacturing an article.
Figure 18 is a diagram showing a layout with different numbers of panels in the X direction.

Below, preferred embodiments of the present invention will be described in detail based on the attached drawings. In addition, in each drawing, the same reference numbers are attached to the same members, and duplicate descriptions are omitted.

<First embodiment>

(Configuration of exposure device)

FIG. 5 is a schematic diagram showing the configuration of the exposure apparatus 100. The exposure apparatus in this embodiment is an apparatus used in a lithography process when manufacturing devices such as semiconductor devices and flat panel displays (FPD). The exposure device transfers the pattern of the original plate (mask) to a substrate coated with resist, forming a latent image pattern in the pattern area of the substrate. The exposure apparatus in this embodiment is a so-called step-and-scan scanning exposure apparatus that transfers the pattern of the original plate to a plurality of pattern areas on the substrate through a projection optical system.

In this embodiment, the plane parallel to the substrate support surface of the substrate stage 7 is expressed as an XYZ coordinate system with the XY plane. The scanning direction of the substrate is the Y direction, the direction parallel to the substrate support surface and perpendicular to the Y direction is the X direction, and the direction perpendicular to the X and Y directions is the Z direction. Additionally, the rotation around the Z direction is set to θ, the rotation around the X direction is set to Pitch, and the rotation around the Y direction is set to Roll. FIG. 5 shows the exposure apparatus in the YZ plane viewed from the X direction. Fig. 6 is a schematic diagram showing the exposure apparatus in the XZ plane viewed from the Y direction.

The exposure apparatus 100 includes an original plate stage 4 on which the original plate 3 is mounted, a substrate stage 7 on which the substrate 6 is mounted, an illumination optical system 1 that illuminates the original plate 3, and an original plate ( It includes a projection optical system 5 that projects the pattern of 3) onto the substrate 6. The original plate 3 and the substrate 6 are disposed through the projection optical system 5 at optically almost conjugate positions (object plane and image plane of the projection optical system 5). The alignment measurement unit 2 (first measurement unit) measures the mark group 22 on the original plate and the mark group 23 on the substrate. The off-axis measurement unit 9 (second measurement unit) measures the mark group 23 on the substrate. The control unit 12 determines and controls the drive amount of each drive mechanism of the exposure apparatus 100.

The illumination optical system 1 is composed of a light source such as an ultra-high pressure mercury lamp (not shown), a wavelength selection filter, a lens group, a shutter, etc. The illumination optical system 1 irradiates the original plate 3 with light of a wavelength suitable for exposure. The disc stage 4 on which the disc 3 is mounted is scanned in the Y direction by a drive mechanism (not shown) under control by the control unit 12. A reflector, not shown, is disposed on the disc stage 4, and reflects measurement light from a laser interferometer, not shown, placed outside the disc stage 4. The laser interferometer receives the reflected measurement light and constantly monitors and measures the position of the disk stage 4. The control unit 12 controls the position and speed of the original stage 4 based on the measurement results by the laser interferometer.

The projection optical system 5 has a mirror and lens (not shown) and reflects and refracts the exposure light to project the pattern formed on the original plate 3 onto the substrate 6. Additionally, the mirror and lens are driven in the Z, pitch, and roll directions by a drive mechanism (not shown) under control by the control unit 12, and generate arbitrary magnification, shift, and focus. The projection optical system 5 has a predetermined projection magnification (for example, equal magnification, 1/2 magnification, 2 magnification, etc.) and projects the pattern formed on the original plate 3 onto the substrate 6 .

The substrate stage 7 on which the substrate 6 is mounted is driven in the X, Y, Z, θ, Pitch, and Roll directions by a drive mechanism (not shown) under the control of the control unit 12. A plurality of reflectors, not shown, are arranged on the substrate stage 7 and reflect measurement light from a laser interferometer, not shown, placed outside the substrate stage 7. The laser interferometer receives the reflected measurement light and constantly monitors and measures the position of the substrate stage 7. The control unit 12 controls the position and speed of the substrate stage 7 based on the measurement results by the laser interferometer.

The light blocking plates 8a and 8b block exposure light to expose only a specific effective area of the original plate 3 on the substrate 6. The light blocking plate 8a has a drive mechanism (not shown) and is driven in the Y direction to limit the effective area in the Y direction on the original plate 3. The light blocking plate 8b has a drive mechanism (not shown) and is driven in the X direction to limit the effective area in the X direction on the disk 3.

The alignment measurement unit 2 has a drive mechanism (not shown) and is driven in the XY direction. It also has a focus adjustment mechanism, and measures the mark group 22 on the original plate and the mark group 23 on the substrate. When measuring the mark group 23 on the substrate, it is measured through the projection optical system 5. The off-axis measurement unit 9 has a drive mechanism (not shown) and is driven in the X direction to measure the mark group 23 on the substrate. The exposure apparatus 100 can measure a plurality of marks simultaneously by matching the respective positions of the alignment measurement unit 2 and the off-axis measurement unit 9 to the mark group formed on the substrate 6. A light source (non-exposure light) having a different wavelength from the exposure light may be used in the alignment measurement unit 2 and the off-axis measurement unit 9.

The control unit 12 functions as a processing unit that determines the drive amount of each drive mechanism during exposure based on the mark position information measured by the alignment measurement unit 2 and the off-axis measurement unit 9. The control unit 12 is composed of a data holding unit 13, a drive amount calculation unit 14, and a drive instruction unit 15. The data holding unit 13 holds layout information, mark position information measured by the alignment measuring unit 2 and the off-axis measuring unit 9, driving parameters such as driving offsets and sensitivities of various driving axes, and various measurement data acquired from the exposure device. do. The drive amount calculation unit 14 calculates various correction components such as shift, rotation, and magnification in the X and Y directions using general statistical methods from the data held in the data holding unit 13. Additionally, the drive amount calculation unit 14 determines drive instruction amounts for various drive shafts based on the drive parameters and calculated correction components. The drive instruction unit 15 uses the drive instruction amount for each drive mechanism determined by the drive amount calculation unit 14 to output a drive instruction for each drive mechanism. Additionally, the control unit 12 has its hardware configuration and is configured, for example, by a computer device including a CPU (central processing unit) and memory. In this case, the data holding unit 13 is realized by memory, and the drive amount calculation unit 14 and drive instruction unit 15 are realized by CPU.

In addition, in Figures 1, 3, 4, 7, and 12 described below, (a) is a diagram showing the panel layout of the original plate 3, and (b) is a diagram showing the layout of the pattern formed on the substrate 6. This is a drawing showing .

(Comparative Example 1)

As Comparative Example 1 of this embodiment, the same case as in FIG. 1 is assumed. While 4 rows of panel parts 16 can be arranged in the Y direction of the original plate 3 as shown in Figure 1 (a), there are 7 rows of panel parts 16 in the Y direction of the substrate 6 as shown in Figure 1 (b). There is space to produce rows of panels. Therefore, exposure of shots 19 of 4 rows of panel portion 16 in the Y direction (first exposure), and exposure of shots 20 of 3 rows of panel portion 16 in the Y direction (second exposure) It is desirable from the viewpoint of productivity to optimize the panel layout by performing . Additionally, in the second exposure, the exposure is made possible by shielding one row of panels from light using a light blocking mechanism or the like.

Here, as shown in Fig. 2(a), the alignment measurement unit 2 drives on the circular arc-shaped broken line part r1, and the off-axis measurement units 9a and 9b perform the linear drive in the X direction and the linear drive in the Y direction. It is assumed that the area r2 is driven by combination, and the linear broken line part r3 is driven. As shown in FIG. 2(b), in order to measure the shape of the shot with high precision, the alignment mark 10 is arranged outside the area of the panel portion 16 and is aligned so as to be arranged near the outer periphery of the exposure shot 21. The positions of the marks 10a to 10f may be determined. Once the positions X of the alignment marks 10a to 10f are determined, the driving positions Then, when the driving position Additionally, the driving position Y of the off-axis measurement units 9a and 9b is the distance between the alignment marks 10a and 10e (or 10b and 10f) and the distance between the off-axis measurement units 9a and 9c (or 9b and 9d). The distance is determined to be the same.

When the first exposure and the second exposure are performed to achieve the panel layout of FIG. 1(b), exposure is performed as shown in FIG. 3(b). Additionally, as shown in Fig. 3(a), in addition to the alignment marks 10a to 10f, other alignment marks 10g and 10h are provided on the original plate 3. In order to simultaneously measure the alignment mark of the shot 20 by the alignment measurement unit 2 and the off-axis measurement unit 9, it is necessary to drive the off-axis measurement unit 9 to a predetermined position where simultaneous measurement can be performed.

In this embodiment, “simultaneous measurement” means measuring a plurality of alignment marks in the alignment measurement unit 2 and the off-axis measurement unit 9 without driving the alignment measurement unit 2, the off-axis measurement unit 9, or the substrate 6. ) refers to measurement by . That is, even when the measurement timing or measurement period by each measurement unit is not completely the same, if a plurality of alignment marks are measured without driving each unit, it is defined as being within the range of simultaneous measurement.

In measurement of the off-axis measurement unit 9, it is necessary to calculate the mark position using the relative distance (base line) with the alignment measurement unit 2, but the baseline changes each time the off-axis measurement unit 9 is driven. I do it. Therefore, it is necessary to obtain a baseline every time the off-axis measurement unit 9 is driven, which is a factor in deteriorating throughput. In addition, the fact that the off-axis measurement unit 9 is driven at a lower speed than the substrate stage 7 is also a factor in deteriorating the throughput. Therefore, the alignment of the shot 20 is performed by measuring the alignment marks 10c, 10d, 10e, and 10f in the alignment measurement unit 2 and the off-axis measurement unit 9, and then driving the substrate stage to measure the alignment marks 10c, 10d, 10e, and 10f in the alignment measurement unit 2. Measure the alignment mark (10g, 10h). This method cannot perform simultaneous measurement when measuring the alignment of the shot 20, resulting in a decrease in throughput.

(Comparative Example 2)

Comparative Example 2 for this embodiment will be described. Figure 4 is a diagram for explaining Comparative Example 2. In Comparative Example 2, a pattern and alignment marks on the original plate were formed as shown in FIG. 4(a). Additionally, the result of forming a pattern on the substrate 6 using the original plate 3 shown in FIG. 4(a) is shown in FIG. 4(b). In Figure 4(b), when the shot 20 is aligned only with the alignment marks 10c, 10d, 10e, and 10f, the overlap accuracy deteriorates compared to the case where there is an alignment mark at the outer edge of the shot. . This calculates correction components such as shift, rotation, and magnification of the shot from the alignment results. However, when calculating components proportional to distance, such as rotation and magnification, measurement reproducibility is affected as the alignment mark is spaced from the outer end of the shot. Because it is thrown away.

(Exposure processing in this embodiment)

The exposure method in a layout with different shot sizes in the Y direction (scanning direction) as shown in FIG. 1 will be described with reference to the flowchart in FIG. 8. In this embodiment, the layout with the number of panels in the Y direction per shot is 4 and 3 as an example, but the same procedure can be performed even if the number of panels in the Y direction is changed to another number, such as a layout with 3 and 2 panels.

First, the exposure method of the underlying layer (first layer) (steps S101 to S103 in FIG. 8, also referred to as the first layer exposure process) will be described. The original plate 3 for exposing the underlying layer has the same configuration as (a) in FIG. 7. The original plate 3 has panel portions 16 (pattern formation areas) arranged in four rows in the It has an area 11a. For the light blocking area 11a, a light blocking film such as chrome may be used. Alignment marks 22a to 22f on the original plate 3 are disposed on the outer end portion and the outer periphery of the original plate 3. In addition, the alignment marks 23c, 23d, 23g, 23h measured by the alignment measurement unit 2 are also referred to as first marks, and the alignment marks 23a, 23b, 23e, 23f, 23i, measured by the off-axis measurement unit 9. 23j) is also called the second mark.

In addition, as shown in FIG. 7(a), a light-shielding area 11b (second light-shielding area) is formed at a position spaced apart from the alignment marks 22a and 22b on the original plate 3 in the Y direction (scanning direction). It is prepared. The light-shielding area 11b is necessary to expose a portion of the shot area to overlap in order to form a layout as shown in FIG. 7(b) on the substrate 6 using the original plate 3.

In step S101, as shown in FIG. 9(a), the light blocking plate 8 is driven, the entire area (first effective area) of the original plate 3 is exposed, and the shot 19 (first effective area) of the substrate 6 is taken. (transfer to the shot area). Step S101 is also called the first process.

In step S102, the light blocking plate 8 is driven as shown in Fig. 9(b), and an area (second effective area) including the three rows and four columns of panel portions 16 and the alignment marks 22a to 22d on the original plate is selected. ) is exposed and transferred to the shot 20 (second shot area) of the substrate 6. At this time, exposure is performed so that the top of the light blocking area 11a of the shot 19 coincides with the top of the shot 20. Since the alignment marks 22e and 22f on the original plate formed by the shot 19 are within the exposure area of the shot 20, a light-shielding area (shading area) is formed on the original plate 3 in the shot 20 to block the exposure light. 11b) needs to be provided. Step S102 is also called the second process.

In step S103, the substrate 6 is transported and developed, and the alignment marks 23a to 23j on the substrate 6 are made observable. After completion of exposure of the underlying layer, panel portions 16 in 7 rows and 4 columns and alignment marks 23a to 23j on the substrate are formed on the substrate 6, as shown in FIG. 9(c). The alignment marks 23a to 23f on the substrate 6 are marks exposed with the shot 19, and the alignment marks 23g to 23j on the substrate 6 are marks exposed with the shot 20.

Next, the exposure method for the upper layer (second layer) will be explained (steps S104 to S107, also referred to as the second layer exposure process). The configuration of the original plate 3 is almost the same as that of the original plate used to expose the underlying layer, but the light-shielding areas 11a and 11b are unnecessary. In step S104, the shots 19 are aligned as shown in FIG. 10(a). The alignment marks 22a to 22f on the original plate 3 and the alignment marks 23a to 23f on the substrate 6 are respectively corresponding marks. In this embodiment, the alignment marks 23c and 23d are measured by the alignment measurement unit 2, and the alignment marks 23a, 23b, 23e and 23f are measured by the off-axis measurement unit 9. Furthermore, using the measurement results of the above-described alignment marks, the control unit 12 calculates various correction amounts when exposing the shot 19 and drive instruction amounts for various drive shafts calculated from the correction amounts.

In step S105, the shots 20 are aligned as shown in FIG. 10(b). The alignment marks 22a to 22d on the original plate 3 and the alignment marks 23g to 23j on the substrate 6 are respectively corresponding marks. In this embodiment, the alignment marks 23g and 23h are measured by the alignment measurement unit 2, and the alignment marks 23i and 23j are measured by the off-axis measurement unit 9. Additionally, using the measurement results of the alignment marks, the control unit 12 calculates various correction amounts when exposing the shot 20 and drive instruction amounts for various drive shafts calculated from the correction amounts. That is, in steps S104 and S105, correction amounts for the position and shape of the shot area to be exposed in the next process are calculated.

In step S106, the light blocking plate 8 is driven as shown in FIG. 10(c), and the area including the panel portion 16 in 4 rows and 4 columns is exposed using the drive instruction amount calculated in step 104. The shot 19 is transferred onto the substrate 6. At this time, whether or not the alignment marks 22a to 22d on the original plate 3 are exposed is optional. In step S107, the light shielding plate 8 is driven as shown in Fig. 10(d), and the area including the panel portion 16 in 3 rows and 4 columns is exposed using the drive instruction amount calculated in step 105. The shot 20 is transferred onto the substrate 6. At this time, whether or not the alignment marks 22a to 22d on the original plate 3 are exposed is optional. Additionally, step S106 and step S107 may be interchanged in order, and steps S105 and step S106 may also be interchanged in order.

Although the case where 2 shots are exposed on the substrate 6 in the Y direction has been described above, the same procedure can also be performed for the case where n shots (n is an integer of 3 or more) are exposed in the Y direction. When 4 rows of panel parts 16 can be arranged on the original plate 3 and (4 × n-1) rows of panel parts 16 can be arranged on the substrate 6, the shot 19 is (n-1) shots are exposed, and shots 20 are exposed for 1 shot. The original plate 3 may have the same configuration as (a) in FIG. 7 and may be completely the same.

When exposing the underlying layer, the shot 19 exposes the area shown in (a) of FIG. 9, and the shot 20 exposes the area shown in (b) of FIG. 9. At this time, the light-shielding area portion 11a of the shot 19 is exposed to overlap, and the overlapping exposure areas are (n-1). When exposing the upper limb layer, the shots 19 and 20 are aligned as shown in FIG. 11. The method of performing alignment is the same as that shown in FIG. 8 . The shot 19 exposes the area shown in (c) of FIG. 10, and the shot 20 exposes the area shown in (d) of FIG. 10.

When the number of rows of the panel on the substrate is (4 In the exposure, overlapping exposure areas occur at (n-m) locations.

From the above, in this embodiment, it is possible to optimize the panel layout in the Y direction of the substrate 6. As a result, even when the number of panel layouts in the Y direction is odd, for example, the utilization efficiency of the substrate can be improved.

<Second Embodiment>

In the first embodiment, an example of an exposure method in a layout having different shot sizes in the Y direction was described. In this embodiment, an example of an exposure method in a layout having different shot sizes not only in the Y direction but also in the X direction will be described with reference to FIG. 13. In addition, since the structure of the exposure apparatus 100 is the same as that of the first embodiment, description is omitted. Additionally, matters not mentioned in this embodiment will follow the first embodiment.

In this embodiment, an example of producing a panel layout in which 4 rows and 4 columns are arranged on the original plate 3 and 7 rows and 10 columns on the substrate 6 is explained as shown in FIG. 12. In this case, there are four types of shot sizes shown in FIG. 14: shots 27 in 4 rows and 2 columns, shots 28 in 4 rows and 2 columns, shots 29 in 3 rows and 4 columns, and shots 30 in 3 rows and 2 columns. Use and expose.

The original plate 3 for exposing the underlying layer has the same configuration as Fig. 12(a), and the layout shown in Fig. 12(b) is formed on the substrate 6 using the original plate 3. . Here, the original plate 3 is provided with relative position misalignment mark main chucks 24a to 24c and relative position misalignment mark sub chucks 25a to 25c, and is different from the first embodiment in this respect. The panel portion 16 is arranged in four columns in the As shown in FIG. 12(a), the light-shielding area 11a is provided between alignment marks 22e-22i and 22i-22f on the disk spaced apart in the Y direction with respect to the panel portion 16. . Additionally, as shown in Fig. 12(a), the light blocking area 11b (second light blocking area) is provided at a position spaced apart in the Y direction with respect to the alignment marks 22a and 22b on the original plate.

The relative position misalignment mark main chucks 24a to 24c are respectively arranged in the vicinity of the alignment marks 22g to i on the original plate 3, and the relative position misalignment mark sub-chucks 25a to 25c are respectively disposed near the alignment marks 22g to i on the original plate 3. It is placed near (22b, 25d, 25f). Here, the relative distances of each mark (between 24a-22g, between 24b-22h, between 24c-22i, between 25a-22b, between 25b-22d, between 25c-22f) are all the same.

First, the exposure method for the underlying layer (first layer) will be described (steps S201 to S202, also referred to as the first layer exposure process). In step S201, the shots 27 to 30 in FIG. 14 are exposed to form an underlying layer. The shots 27 to 30 transfer the area shown in FIG. 14 onto the substrate 6 using the light blocking plate 8. Additionally, the positional relationship of shots during exposure will be explained using FIGS. 15 and 16. As shown in FIG. 15(a), the top of the shot 29 and the top of the light blocking area 11a of the shot 27 are exposed to overlap, and are transferred onto the substrate 6 as shown in FIG. 15(b). The light-shielding areas 11a and 11b are necessary because exposure overlaps with other shots. Shots 30 and 28 are also exposed in the same positional relationship. Additionally, as shown in Figure 16 (a), the relative position misalignment mark subscale 25 of the shot 27 is exposed so that the relative position misalignment mark main scale 24 of the shot 28 overlaps, and as shown in Figure 16(b) Relative position misalignment marks 26a to 26c are formed on the substrate 6 as shown. In the shot 28, the alignment marks 22g to i on the original plate are shielded from light, thereby preventing double exposure of the alignment marks on the substrate. Additionally, the exposure order of the shots 27 to 30 is arbitrary. In step S202, the substrate 6 is transported and developed, and the alignment mark 23 on the substrate is made observable.

Next, a method for exposing the upper layer (the second layer on the first layer) will be described (steps S203 to S205, also referred to as the second layer exposure process). The configuration of the original plate 3 is almost the same as that of the original plate used to expose the underlying layer, but the light-shielding area 11 is unnecessary. In step S203, the shots 27 to 30 are aligned. The shots 27 and 29 are aligned with respect to the alignment marks 23 on the substrate as shown in Fig. 15(b) formed in step S201, as in Example 1. The alignment of the shot 28 corresponds to the alignment marks 22a to f on the original plate shown in Fig. 12(a) and the alignment marks 23a to 23f on the substrate shown in Fig. 16(b), respectively. . The alignment marks 23a, 23c, and 23e on the substrate are marks formed by transferring the alignment marks 22g to i (see FIG. 12) on the original plate when exposing the shot 27 in step S201. That is, the alignment of the shot 28 uses a mark formed by exposing another shot. Therefore, the relative position deviation between the shot 27 and the shot 28 is incorrectly detected as magnification or rotation in the alignment of the shot 28. Therefore, in step S204, the processing unit 12 performs processing to measure the relative position misalignment mark 26 and subtract the relative position misalignment between shots. The relative position misalignment of the shot 27 and the shot 28 is detected by simultaneously measuring the relative position misalignment marks 26a to c by the off-axis measurement unit 9, alignment measurement unit 2, and off-axis measurement unit 9, respectively. do. Additionally, the relative position misalignment marks 26d and e are simultaneously measured by the off-axis measurement unit 9 and the alignment measurement unit 2, respectively, to detect the relative position misalignment of the shot 29 and the shot 30. However, when measuring the relative position misalignment mark 26 by the alignment measurement unit 2, it is necessary to drive the original stage 4 to the position of the area where there is no pattern on the original plate 3. In step S205, the correction amount for each shot detected in steps S203 and 204 is applied, and shots 27 to 30 are exposed. At this time, the exposure order of the shots is arbitrary.

From the above, in this embodiment, it is possible to optimize the panel layout in the Y direction and the X direction of the substrate 6. As a result, even when the number of panel layouts in the Y direction and the X direction is odd, for example, the utilization efficiency of the substrate can be improved.

<Embodiment of product manufacturing method>

The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as, for example, a flat panel display (FPD), a semiconductor device, a sensor, or an optical element. 17 is a flow chart of a method for manufacturing an article. The article manufacturing method of this embodiment includes a step (exposure step, step S11) of forming a latent image pattern on a photosensitive material applied on a substrate by exposure using the exposure apparatus 100 and obtaining an exposed substrate. It also includes a step (development step, step S12) of developing the substrate conveyed in this step and obtaining a developed substrate. After the development process, it is determined whether to form the next layer. If formation is necessary, the process returns to step S11. If formation is not necessary (all layer formation is completed), the process proceeds to step S14. Additionally, this manufacturing method includes other well-known processes (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.) (processing process, step S14). The product manufacturing method in this embodiment is advantageous compared to the conventional method in at least one of product performance, quality, productivity, and production cost.

Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist.

3: disc
6: substrate
11a: Shading area
19: Shot (first shot area)
20: Shot (second shot area)
23a to 23j: Alignment marks
100: exposure device

Claims (9)

A first layer exposure process of exposing a pattern of the original to a first layer on the substrate while scanning the relative positions of the original and the substrate in the scanning direction, and exposing the pattern of the original to the first layer while scanning the relative positions in the scanning direction. An exposure method comprising a second layer exposure process of exposing a second layer on a first layer,
The first layer exposure process is,
Transferring a first effective area including a pattern formation area on the original plate, a light-shielding area provided at a position spaced apart from the pattern formation area in the scanning direction, and an alignment mark to a first shot area on the substrate. A first process to do,
A second shot area in the substrate such that a second effective area including a part of the pattern formation area and a part of the alignment mark overlaps an area corresponding to the light-shielding area in the first shot area. Including a second process of transferring to,
An exposure method characterized by: According to paragraph 1,
The second layer exposure process includes an alignment mark formed on the substrate in the first process,
An exposure method characterized by correcting the position and shape of the shot area transferred to the second layer to overlap the first shot area and the second shot area based on the alignment mark formed on the substrate in the second process. . According to paragraph 1,
The alignment mark includes a first mark and a second mark,
The first mark is a mark measured through a projection optical system of an exposure apparatus that performs exposure by the exposure method,
An exposure method, wherein the second mark is a mark measured without passing through a projection optical system of the exposure apparatus. According to paragraph 3,
The first mark and the second mark are formed to enable simultaneous measurement so that the first measurement unit for measuring the first mark and the second measurement unit for measuring the second mark are not driven during measurement. method. According to paragraph 1,
An exposure method characterized by exposing the first shot area and the second shot area so that shot sizes are different in the scanning direction. According to clause 5,
An exposure method characterized by exposing the first shot area and the second shot area so that shot sizes are different in a direction orthogonal to the scanning direction. According to paragraph 3,
An exposure method, characterized in that a second light blocking area is provided at a position spaced apart from the second mark in the scanning direction. An exposure apparatus comprising exposing a substrate using the exposure method according to any one of claims 1 to 7. An exposure step of exposing a substrate using the exposure method according to any one of claims 1 to 7 to obtain an exposed substrate;
A developing process of developing the exposed substrate and obtaining a developed substrate,
A method of manufacturing an article, characterized in that the article is manufactured from the developing substrate.

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