KR20240052574A - Electronic device including contact member - Google Patents

Abstract

An electronic device according to an embodiment may include a housing, a PCB including a first through hole, and a contact member disposed between the PCB and the housing. The contact member is a frame that forms the outer shape of the contact member, is arranged in the first through hole, and includes a second through hole penetrating one surface of the contact member in contact with the PCB, and is disposed on an outer surface of the frame. is disposed on a nose on the frame that contacts the inner surface of the housing, and a portion of the frame extending from the nose toward the one surface of the contact member through an internal space surrounded by the frame, the first through hole and the It may include a tail that can move inside the second through hole. Other embodiments are possible.

Description

Electronic device including a contact member {ELECTRONIC DEVICE INCLUDING CONTACT MEMBER}

Embodiments of the present disclosure relate to an electronic device including a contact member.

A printed circuit board can arrange a plurality of components for driving an electronic device. A printed circuit board disposed inside an electronic device is electrically connected to components of the electronic device through a contact member.

The contact member is interposed between the printed circuit board and the fixture of the electronic device. The contact member includes a structure capable of providing an elastic force to maintain an electrical connection between the printed circuit board and the fixture of the electronic device.

According to one embodiment, an electronic device may include a housing that forms at least a portion of the outer surface of the electronic device. The electronic device may include a PCB disposed within the housing and including a first through hole. The electronic device may include a contact member disposed between the PCB and the housing. According to one embodiment, the contact member has a frame that forms the outer shape of the contact member and includes a second through hole arranged in the first through hole and penetrating one surface of the contact member in contact with the PCB. It can be included. The contact member may be disposed on an outer surface of the frame and may further include a nose on the frame that contacts an inner surface of the housing. The contact member is disposed on a part of the frame extending from the nose toward the one surface of the contact member through an internal space surrounded by the frame, and has a tail movable inside the first through hole and the second through hole. may include. According to one embodiment, the frame may include a support plate extending from an edge of the one surface of the contact member toward the housing in a first direction perpendicular to the one surface. The frame extends toward the housing in the first direction from an edge different from the edge of the one surface, is bent to extend in a second direction perpendicular to the first direction, and further includes a contact portion on which the nose is disposed. It can be included.

According to one embodiment, an electronic device may include a housing that forms at least a portion of the outer surface of the electronic device. The electronic device may further include a PCB disposed within the housing and including a first through hole. The electronic device may further include a contact member disposed between the PCB and the housing. According to one embodiment, the contact member has a frame that forms the outer shape of the contact member and includes a second through hole arranged in the first through hole and penetrating one surface of the contact member in contact with the PCB. It can be included. The contact member may be disposed on an outer surface of the frame and may further include a nose on the frame that contacts an inner surface of the housing. The contact member is disposed on a part of the frame extending from the nose toward the one surface of the contact member through an internal space surrounded by the frame, and has a tail movable inside the first through hole and the second through hole. may include. According to one embodiment, the frame may further include a support plate extending from an edge of the one surface of the contact member toward the housing in a first direction perpendicular to the one surface. The frame includes a first region extending toward the housing in the first direction from another edge different from the edge of the one surface, and a second region bent to extend in a second direction perpendicular to the first direction and on which the nose is disposed. It may include a contact portion including an area. According to one embodiment, the nose may contact the inner surface of the housing facing the second area.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
FIG. 2 is a diagram illustrating an electronic device according to an embodiment.
Figure 3 is an exploded perspective view of an electronic device according to an embodiment.
Figure 4 is a perspective view showing the arrangement of a contact member inside an electronic device, according to one embodiment.
Figure 5 is an exploded view of a contact member, according to one embodiment.
Figure 6A is a perspective view of a contact member, according to one embodiment.
FIG. 6B is a cross-sectional view taken along line A-A' of FIG. 4 of the interior of an electronic device including a contact member, according to an embodiment.
Figure 7A is a perspective view of a modified contact member, according to one embodiment.
FIG. 7B is a cross-sectional view of the interior of an electronic device including a deformed contact member, according to one embodiment.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or ultra-reliable and low-latency (URLLC). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, connected to the plurality of antennas by the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 must perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2 is a diagram illustrating an electronic device according to an embodiment.

Referring to FIG. 2 , the electronic device 200 according to one embodiment may include a housing 210 that forms the exterior of the electronic device 200. For example, housing 210 surrounds a first side (or front) 200A, a second side (or back) 200B, and a space between the first side 200A and the second side 200B. may include a third side (or side) 200C. In one embodiment, housing 210 has a structure (e.g., the frame structure of FIG. 3 ) that forms at least a portion of first side 200A, second side 200B, and/or third side 200C. 240)).

The electronic device 200 according to one embodiment may include a substantially transparent front plate 202. In one embodiment, front plate 202 may form at least a portion of first side 200A. In one embodiment, the front plate 202 may include, but is not limited to, a glass plate including various coating layers, or a polymer plate, for example.

The electronic device 200 according to one embodiment may include a substantially opaque rear plate 211. In one embodiment, the rear plate 211 may form at least a portion of the second surface 200B. In one embodiment, back plate 211 may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can.

The electronic device 200 according to one embodiment may include a side bezel structure (or side member) 218 (eg, the side wall 241 of the frame structure 240 of FIG. 3). In one embodiment, side bezel structure 218 may be combined with front plate 202 and/or back plate 211 to form at least a portion of third side 200C of electronic device 200. For example, the side bezel structure 218 may entirely form the third side 200C of the electronic device 200, or in another example, the side bezel structure 218 may form the front plate 202 and/or Together with the back plate 211, the third side 200C of the electronic device 200 may be formed.

Unlike the illustrated embodiment, when the third side 200C of the electronic device 200 is partially formed by the front plate 202 and/or the rear plate 211, the front plate 202 and/or the rear plate 211 The plate 211 may include a region that is curved and extends seamlessly from its edge toward the rear plate 211 and/or the front plate 202 . The extended area of the front plate 202 and/or the rear plate 211 may be, for example, located at both ends of a long edge of the electronic device 200, but according to the above-described example, It is not limited.

In one embodiment, side bezel structure 218 may include metal and/or polymer. In one embodiment, the back plate 211 and the side bezel structure 218 may be formed integrally and may include the same material (eg, a metal material such as aluminum), but are not limited thereto. For example, the back plate 211 and the side bezel structures 218 may be formed of separate construction and/or may include different materials.

In one embodiment, the electronic device 200 includes a display 201, an audio module 203, 204, and 207, a sensor module (not shown), a camera module 205, 212, and 213, a key input device 217, It may include at least one of a light emitting device (not shown) and/or a connector hole 208. In one embodiment, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or the light emitting device (not shown)) or may additionally include other components.

In one embodiment, display 201 (e.g., display module 160 of Figure 2) may be visually exposed through a significant portion of front plate 202. For example, at least a portion of display 201 may be In one embodiment, the display 201 may be disposed on the back of the front plate 202, which forms the first side 200A.

In one embodiment, the outer shape of the display 201 may be substantially the same as the outer shape of the front plate 202 adjacent to the display 201. In one embodiment, in order to expand the area to which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.

In one embodiment, the display 201 (or the first side 200A of the electronic device 200) may include a screen display area 201A. In one embodiment, the display 201 may provide visual information to the user through the screen display area 201A. In the illustrated embodiment, when the first surface 200A is viewed from the front, the screen display area 201A is shown to be located inside the first surface 200A, spaced apart from the outer edge of the first surface 200A. However, it is not limited to this. In one embodiment, when the first side 200A is viewed from the front, at least a portion of an edge of the screen display area 201A substantially coincides with an edge of the first side 200A (or the front plate 202). It could be.

In one embodiment, the screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user. Here, the meaning of “the screen display area 201A includes the sensing area 201B” can be understood as at least a portion of the sensing area 201B being overlapped with the screen display area 201A. there is. For example, the sensing area 201B, like other areas of the screen display area 201A, can display visual information by the display 201 and can additionally acquire the user's biometric information (e.g., fingerprint). It can mean area. In one embodiment, the sensing area 201B may be formed in the key input device 217.

In one embodiment, the display 201 may include an area where the first camera module 205 (eg, the camera module 180 of FIG. 2) is located. In one embodiment, an opening is formed in the area of the display 201, and a first camera module 205 (e.g., a punch hole camera) is at least partially disposed within the opening to face the first side 200A. You can. For example, the screen display area 201A may surround at least a portion of an edge of the opening. In one embodiment, the first camera module 205 (eg, under display camera (UDC)) may be placed below the display 201 to overlap the area of the display 201. For example, the display 201 may provide visual information to the user through the area, and additionally, the first camera module 205 may be directed toward the first side 200A through the area of the display 201. You can obtain an image corresponding to .

In one embodiment, the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the strength (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. .

In one embodiment, the audio modules 203, 204, and 207 (e.g., audio module 170 in FIG. 2) may include microphone holes 203 and 204 and speaker holes 207.

In one embodiment, the microphone holes 203 and 204 include a first microphone hole 203 formed in a portion of the third side 200C and a second microphone hole 204 formed in a portion of the second side 200B. may include. Microphones (not shown) may be placed inside the microphone holes 203 and 204 to acquire external sounds. The microphone may include a plurality of microphones to detect the direction of sound.

In one embodiment, the second microphone hole 204 formed in a partial area of the second surface 200B may be disposed adjacent to the camera modules 205, 212, and 213. For example, the second microphone hole 204 may acquire sound according to the operation of the camera modules 205, 212, and 213. However, it is not limited to this.

In one embodiment, the speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for a call. The external speaker hole 207 may be formed in a portion of the third side 200C of the electronic device 200. In one embodiment, the external speaker hole 207 may be implemented as one hole with the microphone hole 203. Although not shown, a receiver hole (not shown) for a call may be formed in another part of the third side 200C. For example, the receiver hole for a call may be formed on the third side 200C opposite the external speaker hole 207. For example, based on the illustration in FIG. 2, the external speaker hole 207 is formed on the third side 200C corresponding to the lower part of the electronic device 200, and the receiver hole for a call is formed on the electronic device 200. It may be formed on the third side 200C corresponding to the upper end. However, it is not limited to this, and in one embodiment, the call receiver hole may be formed in a location other than the third surface 200C. For example, a receiver hole for a call may be formed by a spaced space between the front plate 202 (or display 201) and the side bezel structure 218.

In one embodiment, the electronic device 200 includes at least one speaker (not shown) configured to output sound to the outside of the housing 210 through the external speaker hole 207 and/or the call receiver hole (not shown). ) may include.

In one embodiment, a sensor module (not shown) (e.g., sensor module 176 in FIG. 2) generates an electrical signal or data value corresponding to the internal operating state of the electronic device 200 or the external environmental state. can be created. For example, the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.

In one embodiment, the camera modules 205, 212, and 213 (e.g., the camera module 180 in FIG. 2) are a first camera module disposed to face the first side 200A of the electronic device 200. 205), a second camera module 212 arranged to face the second surface 200B, and a flash 213.

In one embodiment, the second camera module 212 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera). However, the second camera module 212 is not necessarily limited to including a plurality of cameras and may include one camera.

In one embodiment, the first camera module 205 and the second camera module 212 may include one or more lenses, an image sensor, and/or an image signal processor.

In one embodiment, flash 213 may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 200.

In one embodiment, the key input device 217 (eg, input module 150 in FIG. 2) may be disposed on the third side 200C of the electronic device 200. In one embodiment, the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 that do not include other types of key input devices 217 may be displayed on the display 201, such as soft keys. It can be implemented as:

In one embodiment, the connector hole 208 may be formed on the third side 200C of the electronic device 200 to accommodate a connector of an external device. A connection terminal (eg, connection terminal 178 in FIG. 2) that is electrically connected to a connector of an external device may be disposed in the connector hole 208. The electronic device 200 according to one embodiment may include an interface module (eg, interface 177 in FIG. 2) for processing electrical signals transmitted and received through the connection terminal.

In one embodiment, the electronic device 200 may include a light emitting device (not shown). For example, the light emitting device (not shown) may be disposed on the first surface 200A of the housing 210. The light emitting device (not shown) may provide status information of the electronic device 200 in the form of light. In one embodiment, the light emitting device (not shown) may provide a light source linked to the operation of the first camera module 205. For example, the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.

Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

Hereinafter, overlapping descriptions of components having the same reference numerals as the above-described components will be omitted.

Referring to FIG. 3, the electronic device 200 according to one embodiment includes a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery. It may include (270).

In one embodiment, the frame structure 240 includes a side wall 241 that forms the exterior of the electronic device 200 (e.g., the third side 200C of FIG. 2) and extending inward from the side wall 241. It may include a support portion 243. In one embodiment, frame structure 240 may be disposed between display 201 and back plate 211. In one embodiment, sidewalls 241 of frame structure 240 may surround the space between rear plate 211 and front plate 202 (and/or display 201), and frame structure 240 The support portion 243 may extend from the side wall 241 within the space. According to one embodiment, the side wall 241 forming the side of the electronic device 200 (e.g., the side 200C in FIG. 2) is a speaker hole 207 connecting the inside and outside of the electronic device 200. may include. The speaker hole 207 may penetrate the side wall 241. An audio signal output from a speaker disposed inside the electronic device 200 may be transmitted to the outside of the electronic device 200 through the speaker hole 207.

In one embodiment, frame structure 240 may support or accommodate other components included in electronic device 200. For example, the display 201 may be disposed on one side of the frame structure 240 facing in one direction (e.g., +z direction), and the display 201 may be disposed on the support portion 243 of the frame structure 240. It can be supported by . For another example, a first printed circuit board 250, a second printed circuit board 252, and a battery 270 are provided on the other side of the frame structure 240 facing in a direction opposite to the one direction (e.g., -z direction). ), and the second camera module 212 may be disposed. The first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module 212 are attached to the side wall 241 and/or the support portion 243 of the frame structure 240. Each can be seated in a recess defined by

In one embodiment, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 may each be combined with the frame structure 240. For example, the first printed circuit board 250 and the second printed circuit board 252 may be fixed to the frame structure 240 through a coupling member such as a screw. For example, the battery 270 may be fixed to the frame structure 240 through an adhesive member (eg, double-sided tape). However, it is not limited to the above-described examples.

In one embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the back plate 211. In one embodiment, a cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on a side of the first printed circuit board 250 facing the -z direction.

In one embodiment, the cover plate 260 may at least partially overlap the first printed circuit board 250 about the z-axis. In one embodiment, the cover plate 260 may cover at least a portion of the first printed circuit board 250 . Through this, the cover plate 260 can protect the first printed circuit board 250 from physical shock, or prevent or reduce the separation of the connector coupled to the first printed circuit board 250.

In one embodiment, the cover plate 260 is fixedly disposed on the first printed circuit board 250 through a coupling member (e.g., a screw), or is coupled with the first printed circuit board 250 through the coupling member. Can be coupled to frame structure 240.

In one embodiment, display 201 may be disposed between frame structure 240 and front plate 202. For example, the front plate 202 may be disposed on one side (e.g., +z direction) of the display 201, and the frame structure 240 may be disposed on the other side (e.g., -z direction).

In one embodiment, front plate 202 may be coupled with display 201. For example, the front plate 202 and the display 201 may be adhered to each other through an optical adhesive member (eg, optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

In one embodiment, front plate 202 may be coupled with frame structure 240. For example, the front plate 202 may include an outer portion extending outside the display 201 when viewed in the z-axis direction, and the outer portion of the front plate 202 and the frame structure 240 ( For example, it may be adhered to the frame structure 240 through an adhesive member (eg, double-sided tape) disposed between the side walls 241). However, it is not limited to the above-mentioned example.

In one embodiment, the first printed circuit board 250 and/or the second printed circuit board 252 include a processor (e.g., processor 120 of FIG. 2) and a memory (e.g., memory 130 of FIG. 2). ), and/or an interface (e.g., interface 177 of FIG. 2) may be installed. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector. In one embodiment, the first printed circuit board 250 and the second printed circuit board 252 may be operatively or electrically connected to each other through a connecting member (eg, a flexible printed circuit board).

In one embodiment, battery 270 (e.g., battery 189 in FIG. 2) may supply power to at least one component of electronic device 200. For example, the battery 270 may include a rechargeable secondary battery or fuel cell. At least a portion of the battery 270 may be disposed on substantially the same plane as the first printed circuit board 250 and/or the second printed circuit board 252.

The electronic device 200 according to one embodiment may include an antenna module (not shown) (eg, the antenna module 197 of FIG. 2). In one embodiment, the antenna module may be disposed between the rear plate 211 and the battery 270. The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna module may perform short-distance communication with an external device or wirelessly transmit and receive power to and from an external device.

In one embodiment, the first camera module 205 (e.g., front camera) is framed so that the lens can receive external light through some area of the front plate 202 (e.g., front side 200A in FIG. 2). It may be disposed on at least a portion of structure 240 (eg, support portion 243).

In one embodiment, the second camera module 212 (e.g., a rear camera) may be disposed between the frame structure 240 and the rear plate 211. In one embodiment, the second camera module 212 may be electrically connected to the first printed circuit board 250 through a connection member (eg, connector). In one embodiment, the second camera module 212 may be positioned so that the lens can receive external light through the camera area 284 of the rear plate 211 of the electronic device 200.

In one embodiment, the camera area 284 may be formed on the surface of the back plate 211 (eg, the back side 200B in FIG. 2). In one embodiment, the camera area 284 may be formed to be at least partially transparent to allow external light to enter the lens of the second camera module 212. In one embodiment, at least a portion of the camera area 284 may protrude from the surface of the back plate 211 at a predetermined height. However, it is not limited to this, and in one embodiment, the camera area 284 may form substantially the same plane as the surface of the rear plate 211.

In one embodiment, the housing 210 of the electronic device 200 may refer to a configuration or structure that forms at least part of the exterior of the electronic device 200. In this regard, at least some of the front plate 202, frame structure 240, and/or back plate 211 that form the exterior of the electronic device 200 are referred to as the housing 210 of the electronic device 200. It can be.

According to one embodiment, the electronic device 200 may further include a contact member 251. The contact member 251 may be disposed on the first printed circuit board 250 . The contact member 251 may be soldered to the first printed circuit board 250. For example, the contact member 251 may be attached to the first printed circuit board 250 through surface-mount technology (SMT).

Figure 4 is a perspective view showing the arrangement of a contact member inside an electronic device, according to one embodiment.

Referring to FIG. 4, the electronic device 200 includes a printed circuit board 401 (e.g., the first printed circuit board 250 of FIG. 3 or the second printed circuit board 252 of FIG. 3) and a frame structure ( 240) and a contact member 251.

According to one embodiment, the frame structure 240 may be part of a housing (eg, housing 210 in FIG. 2). The frame structure 240 may form at least a portion of the outer surface of the electronic device 200. For example, the frame structure 240 may form a side surface (eg, the third side 200C of FIG. 2). For example, the frame structure 240 may include a support portion 243 extending from the side 200C of the electronic device 200 into the interior of the housing 210 .

According to one embodiment, the frame structure 240 may include a conductive portion 443a and a non-conductive portion 443b. The conductive portion 443a and the non-conductive portion 443b may be formed through a double injection process. The conductive portion 443a may be formed of a metal material. The non-conductive portion 443b may be formed of a polymer material. A portion of the conductive portion 443a may be used as a ground portion of the electronic device 200. Another portion of the conductive portion 443a may operate as an antenna radiator. For example, the conductive portion 443a disposed in the support portion 243 of the frame structure 240 may be used as a ground portion of the electronic device 200. Among the frame structures 240, the conductive portion 443a forming the side of the electronic device 200 (e.g., the third side 200C of FIG. 2) may be used as an antenna radiator. The conductive portion used as an antenna radiator and the conductive portion used as a ground portion may be separated by a non-conductive portion 400b.

According to one embodiment, the frame structure 240 may include a structure for the contact member 251. For example, the frame structure 240 may include a groove 440 for placement of the contact member 251 . The groove 440 may include a seating surface 441 in contact with the contact member 251 and a side surface 442 extending in a substantially vertical direction from the seating surface 441. The groove 440 may be disposed in the conductive portion 443a of the frame structure 240.

According to one embodiment, the printed circuit board 401 may be disposed within the housing 210. The printed circuit board 401 may be disposed on one side 240a of the frame structure 240. The printed circuit board 401 may be disposed between the frame structure 240 and a back plate (eg, back plate 211 in FIG. 2). For example, printed circuit board 401 may be supported on frame structure 240 . The printed circuit board 401 may be electrically connected to electronic components placed on the printed circuit board 401 or an antenna module connected to the printed circuit board 401. The printed circuit board 401 may include a first through hole 403 in one area.

According to one embodiment, the contact member 251 may include a conductive material. The contact member 251 may electrically connect the printed circuit board 401 and the frame structure 240.

According to one embodiment, the printed circuit board 401 may be electrically connected to the contact member 251. The contact member 251 may be electrically connected to the conductive pad 402 of the printed circuit board 401. The conductive pad 402 may be exposed to the outside of the printed circuit board 401. The conductive pad 402 may be connected to an internal conductive line of the printed circuit board 401. The conductive pad 402 may be formed of a metal such as copper. The conductive pad 402 may face the contact member 251 .

According to one embodiment, the conductive pad 402 may be electrically connected to the ground line of the printed circuit board 401. The conductive pad 402 may electrically connect electronic components disposed on the printed circuit board 401 to the ground portion. The conductive pad 402 may be electrically connected to the conductive portion 443a that operates as a ground portion. For example, the conductive pad 402 may be connected to the conductive portion 443a and the contact member 251.

According to one embodiment, the conductive pad 402 may be electrically connected to the power supply line of the printed circuit board 401. The conductive pad 402 may be electrically connected to a wireless communication circuit or a radio frequency front-end (RFFE) disposed on the printed circuit board 401. The conductive pad 402 may be electrically connected to the conductive portion 443a that operates as an antenna radiator. The wireless communication circuit can feed power to the antenna radiator through the conductive pad 402 and the contact member 251. For example, the conductive pad 402 may be connected to the conductive portion 443a and the contact member 251. A radio frequency (RF) signal transmitted through a wireless communication circuit may be transmitted to the conductive portion 443a operating as an antenna radiator through the conductive pad and contact member 251.

According to one embodiment, the contact member 251 is a conductive portion ( 443a). The contact member 251 may be configured to have elasticity. The elastic contact member 251 can maintain a contact point where it meets the frame structure 240 by applying pressure between the frame structure 240 and the substrate 401. The contact member 251 may include at least a portion of a leaf spring structure. The contact member 251 may maintain a contact point with the frame structure 240 through driving a leaf spring. The frame structure 240 must provide space for deformation of the contact member 251.

According to one embodiment, the contact member 251 may contact the conductive pad 402 of the printed circuit board 401. The contact member 251 may be bonded to the conductive pad 402. For example, the contact member 251 may be attached to the conductive pad 402 through an SMT process. The contact member 251 may be seated in the groove 440 of the frame structure 240. The contact member 251 may be electrically connected to the conductive portion 443a of the frame structure 240 through the seating surface 441. The contact member 251 may be at least partially surrounded by the side 442 of the groove 440.

According to one embodiment, the contact member 251 may be interposed between the printed circuit board 401 and the frame structure 240. The contact member 251 may be elastically deformed by the pressure of the printed circuit board 401 and the frame structure 240. The elastically deformed contact member 251 can transmit a repulsive force to the printed circuit board 401 and the frame structure 240. While the repulsive force is maintained, the contact member 251 may electrically connect the printed circuit board 401 and the frame structure 240.

The electronic device 200 according to the above-described embodiment may provide an electrical connection between the printed circuit board 401 and the frame structure 240 through the elastically deformable contact member 251. The electronic device 200 can reduce the space for the contact member 251 based on the contact member 251 having a movable elastic portion. For example, the contact member 251 according to one embodiment may be inserted into a narrow space formed in the housing 210 or the frame structure 240. The electronic device 200 according to one embodiment can reduce the space for the contact member 251, thereby increasing the space efficiency of the electronic device 200.

Figure 5 is an exploded view of a contact member, according to one embodiment.

Referring to FIG. 5 , the contact member 251 may include a frame 500, a nose 521, and a tail 540.

According to one embodiment, the frame 500 may form at least a portion of the outer shape of the contact member 251. The frame 500 may be configured to maintain the outer shape and shape of the contact member 251. The nose 521 may be electrically connected to the frame structure 240 (eg, the frame structure 240 of FIG. 4) or the support portion 243 (eg, the support portion 243 of FIG. 4). For example, contact member 251 may contact frame structure 240 or support portion 243 through nose 521 . The tail 540 is disposed on a part of the frame 500 extending from the nose 521 toward one surface of the contact member 251 through the internal space surrounded by the frame 500, and has a first through hole 403 ( Example: It may be possible to move inside the first through hole 403 and the second through hole 501 of FIG. 4.

According to one embodiment, while the printed circuit board 401 (e.g., printed circuit board 401 of FIG. 4) is assembled to the frame structure 240, the contact member 251 is connected to the frame through the nose 521. It may be in contact with the conductive portion 443a of the structure 240 or the support portion 243.

According to one embodiment, the frame 500 may include one surface 500a attached to the printed circuit board 401. One side 500a may be bonded to the conductive pad 402 of the printed circuit board 401. The frame 500 may include a second through hole 501 penetrating one surface 500a. The second through hole 501 may be aligned with the first through hole 403. The second through hole 501 may be connected to the first through hole 403. The first through hole 403 and the second through hole 501 may provide space for movement of the tail 540. For example, the tail 540 may move inside the first through hole 403 and the second through hole 501. As the tail 540 moves within the first through hole 403 and the second through hole 501, the space required for elastic movement of the contact member 251 can be reduced.

According to one embodiment, the frame 500 may further include a support plate 510, a contact portion 520, and an elastic portion 530. The support plate 510 may support the contact member 251 from the frame structure 240 . The support plate 510 may include a plurality of surfaces 510a, 510b, and 510c. The support plate 510 may form at least a portion of the outer shape of the contact member 251. For example, the support plate 510 may form the side surface of the contact member 251. For example, the support plate 510 includes a first side 510a in contact with the printed circuit board 401, a second side 510b disposed at one edge of the first side 510a, and a second side 510b. ) may include a third side (510c) facing. The first side 510a may be disposed between the second side 510b and the third side 510c.

According to one embodiment, the contact member 251 may include bending areas 581, 582, 583, 584, 585, 586, 587, 588, 589, or 590. The bending areas 581, 582, 583, 584, 585, 586, 587, 588, 589, or 590 can fold the contact member 251. The plurality of bending areas 581, 582, 583, 584, 585, 586, 587, 588, 589, or 590 may be bent into a structure to provide the shape and elasticity of the contact member 251.

According to one embodiment, the contact member 251 may include a first bending area 581, a second bending area 582, and a third bending area 583. The first bending area 581 may be disposed between the support plate 510 and one surface 500a. The support plate 510 can be folded with respect to one side 500a through the first bending area 581. The second bending area 582 may be disposed between the first side 510a and the second side 510b of the support plate 510. The third bending area 583 may be disposed between the first side 510a and the third side 510c of the support plate 510.

According to one embodiment, the second side 510b may be folded substantially vertically with respect to the first side 510a through the second bending area 582. The third side 510c may be folded substantially vertically with respect to the second side 510b through the third bending area 583. The second side 510b and the third side 510c, which are folded with respect to the first side 510a, may face each other.

According to one embodiment, the first side 510a, the second side 510b, and the third side 510c may be arranged perpendicular to one side 500a of the frame 500. One side 500a, the first side 510a, the second side 510b, and the third side of the frame 500 form at least a portion of the outer surface of the frame 500 and at least the inside of the frame 500. Some of it can be wrapped.

According to one embodiment, each of the second side 510b and the third side 510c may include a guide hole 511. The guide hole 511 may be configured to allow the tail 540 to move in a designated direction within the second through hole 501. For example, the guide hole 511 may provide a path for guiding the movement of the protrusion 531 adjacent to the tail 540.

According to one embodiment, the contact portion 520 may be deformed by pressing the printed circuit board 401 and the housing 210 while the printed circuit board 401 is in contact with the housing 210. The nose 251 may contact the housing 210 based on deformation of the contact portion 520. The contact portion 520 may extend from the edge of one surface 500a. The contact portion 520 may face the support plate 510 with respect to one surface 500a. The nose 521 may protrude from the surface of the contact portion 520. The nose 521 may provide the contact member 251 with an electrical contact point that contacts the frame structure 240 . The nose 521 protruding from the contact portion 520 may contact the frame structure 240. For example, the nose 521 may contact a portion of the groove 440 formed in the frame structure 240. The nose 521 may contact the seating surface 441 or the side surface 442 of the groove 440. The contact portion 520 may include a plurality of bending areas 584, 585, 589, and 590. The contact portion 520 extends in one direction from the edge of one surface 500a, and may extend in another direction distinct from the one direction by one of the plurality of bending areas 584, 585, 589, and 590. there is.

According to one embodiment, the elastic portion 530 may be in contact with the contact portion 520. Elastic portion 530 may extend from contact portion 520 . The elastic portion 530 is compressed when the printed circuit board 401 is assembled to the frame structure 240 and is compressed before the printed circuit board 401 is assembled to the frame structure 240 or after it is disassembled. may be cancelled. The elastic portion 530 may transmit a repulsive force to the frame structure 240 as the printed circuit board 401 is compressed by the frame structure 240 . Based on the repulsive force, the elastic portion 530 can maintain the electrical contact between the nose 251 and the frame structure 240.

According to one embodiment, the elastic portion 530 and the contact portion 520 may be deformed through pressurization of the frame structure 240 and the printed circuit board 401. For example, the contact portion 520 may be deformed to contact the groove 440 in the frame structure 240 by pressing the frame structure 240 and the printed circuit board 401. The elastic portion 530 may be deformed to be inserted into the space inside the groove 440 by pressing the frame structure 240 and the printed circuit board 401. For example, due to deformation of the elastic portion 530 due to pressure of the frame structure 240 and the printed circuit board 401, the height of the contact member 251 may be reduced. The height of the modified contact member 251 may be determined by the gap between the frame structure 240 and the printed circuit board 401.

According to one embodiment, the tail 540 may be connected to the elastic portion 530. The tail 540 can move inside the first through hole 403 and the second through hole 501. The elastic portion 530 connected to the tail 540 can move along the tail 540. For example, in the state of the contact member 251 before being pressed by the frame structure 240 and the printed circuit board 401, the tail 540 may be inserted into a portion of the second through hole 501. . By pressing the frame structure 240 and the printed circuit board 401, the tail 540 may penetrate the second through hole 501 and be disposed in at least a portion of the first through hole 403. By pressing the frame structure 240 and the printed circuit board 401, a portion of the tail 540 located within the frame structure 240 is pushed into the first through hole 403 and the second through hole 501. You can move. When the printed circuit board 401 and the frame structure 240 are assembled or disassembled, the deformation space of the contact member 251 may be reduced by the movement of the tail 540.

According to one embodiment, the type of the contact member 251 may be determined according to the position of the nose 521 and the arrangement of the plurality of bending areas 584, 585, 589, and 590 of the contact portion 520.

According to one embodiment, the contact member 251 includes a fourth bending area 584, a fifth bending area 585, and a nose 521a among the plurality of bending areas 584, 585, 589, and 590. can do. The elastic portion 530 may include a sixth bending area 586, a seventh bending area 587, and an eighth bending area 588. The contact member 251 including the fourth bending area 584 and the fifth bending area 585 and the nose 521a will be described based on FIGS. 6A and 6B.

Figure 6A is a perspective view of a contact member, according to one embodiment. FIG. 6B is a cross-sectional view taken along line A-A' of FIG. 4 of the interior of an electronic device including a contact member, according to an embodiment.

Referring to FIGS. 6A and 6B , the contact member 251 may include a support plate 510, a contact portion 520, an elastic portion 530, and a tail 540.

According to one embodiment, the support plate 510 is folded by the first bending area 581 (e.g., the first bending area 581 in FIG. 5) and is bent in a direction substantially perpendicular to the one surface 500a. It may include a disposed first side 510a (eg, first side 510a of FIG. 5). The second side 510b (e.g., the second side 510b in FIG. 5) is folded by the second bending area 582 (e.g., the second bending area 582 in FIG. 5), so that the first side It may extend in a substantially vertical direction from 510a. The third side 510c may be folded by the third bending area 583 (e.g., the third bending area 583 in FIG. 5) and extend in a substantially vertical direction from the first side 510a. there is. The third side 510c may be substantially parallel to the second side 510b. The third side 510c may face the second side 510b.

According to one embodiment, the first side 510a, second side 510b, and third side 510c of the support plate 510 may form the internal space of the contact member 205. The internal space may accommodate a portion of the elastic portion 530 and a portion of the contact portion 520.

According to one embodiment, the contact portion 520 is connected to the surface 500a at the rotation point R and contacts a portion of the contact portion 520 extending from the rotation point R along an imaginary line a. It may include the remaining portion of portion 520. A portion of the contact portion 520 is inclined from one side 500a and extends toward the frame structure 240 according to the bending of the fourth bending region 584 (e.g., the fourth bending region 584 in FIG. 5). It can be. For example, a portion of the contact portion 520 may extend along an imaginary line (a) inclined with respect to the rotation point (R) and with respect to one surface (500a). Another portion of the contact portion 520 may extend substantially parallel to the frame structure 240 according to the bending of the fifth bending region 585 (e.g., the fifth bending region 585 in FIG. 5 ). . For example, another part of the contact portion 520 may extend parallel to one surface 500a.

According to one embodiment, the nose 521a may be disposed on the other part of the contact portion 520. The nose 521a may face the seating surface 441 of the groove 440 of the frame structure 240 as the frame structure 240 and the printed circuit board 401 are pressed. The nose 521a is directed in a direction perpendicular to the printed circuit board 401, and the connection point of the frame structure 240 and the contact member 521 is on the side perpendicular to the printed circuit board 401, the contact member 521 can be referred to as a vertical contact type C-Clip.

According to one embodiment, the elastic portion 530 includes a sixth bending area 586 (e.g., the sixth bending area 586 in FIG. 5), a seventh bending area (e.g., the seventh bending area in FIG. 5), 587)) and an eighth bending area 588 (eg, the eighth bending area 588 in FIG. 5). A portion of the elastic portion 530 may be bent through the sixth bending region 586 and have an inclination toward the contact portion 520 . A portion of the elastic portion 530 may extend from the contact portion 520 . The elastic portion 530 is bent by the seventh bending region 587 and the eighth bending region 588, so that the protrusion 531 is disposed to penetrate the guide hole 531, and the tail 540 is formed by the second bending region 588. It may be placed within the through hole 501.

According to one embodiment, the protrusion 531 may protrude in a direction perpendicular to the first direction d1, which is the direction in which the elastic portion 530 extends. For example, the protrusion 531 may protrude toward the guide hole 531. The protrusion 531 may move inside the guide hole 511 along the first direction d1, which is the longitudinal direction of the guide hole 511. The tail 540 may move inside the second through hole 501 and the first through hole 403 along the first direction d1.

According to one embodiment, the contact member 251 may change from the first state 601 to the second state 602 by applying external force of the contact member 251. The first state 601 may be a state in which no external force is applied to the contact member 251 . For example, the first state 601 may be a state before the printed circuit board 401 on which the contact member 251 is disposed is disposed on the frame structure 240 .

According to one embodiment, in the first state, the nose 521a may protrude toward the frame structure 240 from the internal space surrounded by the support plate 510 of the frame 500. Within the first state 601, the nose 521a may be spaced apart from the frame structure 240. The protrusion 531 may be located at one end of the guide hole 511 facing the frame structure 240. As the protrusion 531 is located at one end of the guide hole 511, the elastic portion 530 may be biased toward the frame structure 240. The remaining portion of the contact portion 520 may be disposed outside the frame 500 .

According to one embodiment, in the second state, the nose 521a may protrude toward the frame structure 240 from the internal space surrounded by the support plate 510 of the frame 500. The nose 521a may contact the frame structure 240. The distance between the nose 521a and the support plate 510 in the first state 601 may be longer than the distance between the nose 521a and the support plate 510 in the second state 602. The protrusion 531 may be located at the other end of the guide hole 511 facing the printed circuit board 401 . As the protrusion 531 is located at the other end of the guide hole 511, the elastic portion 530 can move toward the printed circuit board 401.

According to one embodiment, while the contact member 251 changes from the first state 601 to the second state 602, the contact member 251 may be pressed by the frame structure 240 . While changing from the first state 601 to the second state 602, the nose 521a may contact the seating surface 441 of the groove 440 formed in the frame structure 240. The nose 521a in contact with the seating surface 441 may be pressed by the seating surface 441 as the distance between the seating surface 441 and the printed circuit board 401 decreases. The nose 521a in contact with the seating surface 441 may move toward the printed circuit board 401 as the distance between the seating surface 441 and the printed circuit board 401 decreases. One side 500a of the frame 500 may be fixed to the printed circuit board 401.

According to one embodiment, the nose 521a may move toward the internal space of the frame 500 through pressure of the seating surface 441. Even while changing between the first state 601 and the second state 602, the distance between the nose 521a and the rotation point R may be kept constant. The rotation point R may be located at a point where the contact portion 520 and one surface 500a meet. The nose 521a may be rotatable about the rotation point R. As the distance between the nose 521a and the rotation point (R) is maintained constant, a portion of the contact portion 520 extending along the imaginary line (a) from the rotation point (R) is located at the rotation point (R). It may rotate in a second direction (d2) clockwise based on . The nose 521a contacting a portion of the contact portion 520 may move in the third direction d3 while the contact member 251 changes from the first state 601 to the second state 602.

According to one embodiment, as the nose 521a rotates, the elastic portion 530 may change elastically. The elastic portion 530 may be moved in the first direction d1 based on the nose 521a moving in the third direction d3. The elastic portion 530 can move in the first direction d1 because the protrusion 531 moves along the guide groove 511. The first through hole 403 may be aligned with the second through hole 501. For example, the first through hole 403 may be disposed on the second through hole 501 in the first direction d1. The tail 540 disposed in the second through hole 501 in the first state 601 changes to the second state 602 and penetrates the second through hole 501 into the first through hole ( 403) Can be moved inside. For example, the tail 540 may be moved inside the first through hole 403 along the first direction d1.

According to one embodiment, the lower end of the contact member 251 (eg, the portion where the nose 521a is located) may be pressed against the frame structure 240. The frame structure 240 formed of the conductive portion 443a and the contact member 251 may be electrically connected. The tail 540 of the contact member 251 may move in a direction toward the printed circuit board 401 . A portion of the tail 540 may move inside the first through hole 403 and the second through hole 501. When using a printed circuit board and a contact member that does not have the first through hole 403 and the second through hole 501, when the contact member is pressed, the outside of the frame 500 is damaged due to deformation of the elastic member and the contact member. Separate space may be required. When using a printed circuit board and a contact member that does not have the first through hole 403 and the second through hole 501, the groove 440 must be expanded to accommodate the deformed elastic member and a portion of the contact member. do. According to one embodiment, in response to deformation of the elastic portion 530, the tail 540 of the contact member 251 moves into the inner space of the first through hole 403 and the second through hole 501. , the space of the groove 440 accommodating the contact member 251 may be reduced. According to one embodiment, the contact member 251 is provided with a contact portion 520 based on the rotation point R in order to move the nose 521a in contact with the frame structure 240 at one point in the third direction d3. ) may rotate in the second direction d2, and the elastic portion 530 may move in the first direction d1. The contact member 251 may perform elastic rotation while variably changing the length of the tail 540 within the contact member 251. Based on the change in the length of the tail 540 disposed in the internal space of the frame 500, the space for placing the contact member 251 may be reduced.

According to one embodiment, the support surface 610a of the support plate 510 facing the seating surface 441 of the groove 440 is in the second state 602 to distribute the pressure applied to the contact member 251. ) can be in contact with the seating surface 441.

According to one embodiment, the support plate 510 is in contact with the inner surface of the housing 210 and is electrically disconnected from the conductive portion 443a of the housing 210, and the nose 521 is connected to the inner surface of the housing 210. It may be in contact with the inner surface of 210 (e.g., groove 440) and electrically connected to the housing 201. Areas of the contact member 251 other than the area where the nose 521a is in contact with the frame structure 240 may be electrically disconnected from the frame structure 240 . For example, the frame 500 may include an insulating material disposed in areas in contact with the inner surface of the housing 210 that are different from the area where the nose 521a is disposed. The support surface 610a may include an insulating material to electrically disconnect from the frame structure 240. For example, the insulating material may be applied to the support surface 610a.

According to one embodiment, the support plate 510 is spaced apart from the inner surface of the housing 210 and extends from the edge of the one surface 500a of the contact member 251 in a direction perpendicular to the one surface 500a. It may extend toward the housing 210. The support surface 610a of the support plate 510 may be spaced apart from the housing 210 or the frame structure 240 in order to be electrically disconnected from the frame structure 240.

According to one embodiment, the side surfaces 510a, 510b, and 510c of the support plate 510 may be configured to apply pressure to the nose 251a within a specified pressure. For example, the amount of compression of the nose 521a may be determined based on the distance between the support plate 510 and the seating surface 441. The amount of pressing may be the distance the nose 521a moves in the first direction while changing from the first state 601 to the second state 602. As the distance between the support plate 510 and the seating surface 441 in the first state 601 increases, the amount of compression of the nose 521a in the second state 602 may increase. The moving distance of the nose 521a in the first direction d1 that occurs while changing from the first state 601 to the second state 602 is related to the length of the guide hole 511. If the length of the guide hole 511 is smaller than the distance between the support surface 610a and the nose 521a in the first state 601, the nose 521a moves in the first direction (d1) by the length of the guide hole 511. ) can be moved to . If the length of the guide hole 511 is greater than the distance between the support surface 610a and the nose 521a in the first state 601, the support surface 610a is attached to the seating surface 441 in the second state 602. You can access it. The nose 521a may no longer be restricted from moving in the first direction d1 by the support surface 610a in contact with the seating surface 441.

According to the above-described embodiment, the contact member 251 may include an elastic portion 530 and a contact portion 520 configured to provide elastic rotation. The elastic portion 530 and the contact portion 520 may be disposed in the internal space of the frame 500 in the second state, so that the driving space of the contact member 251 may be reduced. According to one embodiment, the contact member 251 can variably form the overall length of the clip by moving the tail 540 toward the printed circuit board 401. The contact member 251 may provide a repulsive force to maintain the electrical connection between the frame structure 240 and the printed circuit board 401 even within a narrow space (eg, groove 440). The status of the contact members 251 can be identified without separating the printed circuit board 401 from the frame structure 240 . Through the tail 540 visible to the outside of the printed circuit board 401 through the first through hole 403, whether the contact member 251 is poorly assembled, damaged, or misassembled can be identified.

Referring again to FIG. 5, according to one embodiment, according to the position of the nose 521 and the arrangement of the plurality of bending areas 584, 585, 589, and 590 of the contact portion 520, the contact member 251 The type can be determined.

According to one embodiment, the contact member 251 includes a fourth bending area 584, a fifth bending area 585, and a ninth bending area 589 among the plurality of bending areas 584, 585, 589, and 590. ) and a tenth bending area 590 and a nose 521b. The elastic portion 530 may include a sixth bending area 586, a seventh bending area 587, and an eighth bending area 588. The contact member 251 including the fourth bending area 584, the fifth bending area 585, the ninth bending area 589, and the tenth bending area 590 and the nose 521a is shown in FIGS. 7A and 7A. The explanation is based on 7b.

Figure 7A is a perspective view of a modified contact member, according to one embodiment. FIG. 7B is a cross-sectional view of the interior of an electronic device including a deformed contact member, according to one embodiment.

Referring to FIGS. 7A and 7B , the contact member 251 may include a support plate 510, a contact portion 520, an elastic portion 530, and a tail 540.

According to one embodiment, the support plate 510 is folded by the first bending area 581 (e.g., the first bending area 581 in FIG. 5) and is bent in a direction substantially perpendicular to the one surface 500a. It may include a disposed first side 510a (eg, first side 510a of FIG. 5). The second side 510b (e.g., the second side 510b in FIG. 5) is folded by the second bending area 582 (e.g., the second bending area 582 in FIG. 5), so that the first side It may extend in a substantially vertical direction from 510a. The third side 510c may be folded by the third bending area 583 (e.g., the third bending area 583 in FIG. 5) and extend in a substantially vertical direction from the first side 510a. there is. The third side 510c may be substantially parallel to the second side 510b. The third side 510c may face the second side 510b.

According to one embodiment, the first side 510a, the second side 510b, and the third side 510c of the support plate 510 include a portion of the elastic portion 530 and a portion of the contact portion 520. An acceptable internal space of the contact member 205 can be formed. The contact portion 520 may extend toward the frame structure 240 at an angle from one surface 500a according to the bending of the fourth bending area 584 (e.g., the fourth bending area 584 in FIG. 5). there is. For example, the contact portion 520 is connected to the one surface 500a at the first rotation point R1, and the contact portion extending from the first rotation point R1 along the first imaginary line a1 ( 520) and a remaining part of the contact portion 520 extending to the second rotation point R2 along the second imaginary line a2. The contact member 251 may include a nose 521b. The nose 521b is located in an area in contact with a portion of the contact portion 520 extending along the first imaginary line a1 and the remaining portion of the contact portion 520 disposed along the second imaginary line a2. can be placed. The nose 521b may face the side 442 of the groove 440 of the frame structure 240. According to one embodiment, the nose 521b may protrude toward the side 442 of the groove 440 by the bending areas 585 and 589 disposed on both sides of the nose 521b. A portion of the contact portion 520 may be bent toward the side surface 442 at the ninth bending region 589 adjacent to the nose 521b. The remaining part of the contact portion 520 may extend from the second rotation point R2 and be bent toward the side surface 442 at the fifth bending region 585 adjacent to the nose 521b. The nose 521b may be directed toward the side 442 of the groove 440 of the frame structure 240 as the frame structure 240 and the printed circuit board 401 are pressed. The nose 521b is directed from the contact portion 520 in a direction parallel to the printed circuit board 401, and the connection point of the frame structure 240 and the contact member 521 is horizontal to the printed circuit board 401, The contact member 521 may be referred to as a horizontal contact type C-Clip.

According to one embodiment, the contact portion 520 may include a tenth bending area 590. The tenth bending region 590 may bend the elastic portion 530 extending from the contact portion 520. For example, the tenth bending area 590 may be disposed between the contact part 520 and the elastic part 530. The elastic portion 530 may have an inclination based on the contact portion 520 through bending of the tenth bending region 590 . The elastic portion 530 may extend in a direction parallel to the seating surface 441 by bending the tenth bending region 590.

According to one embodiment, the elastic portion 530 includes a sixth bending area 586 (e.g., the sixth bending area 586 in FIG. 5), a seventh bending area (e.g., the seventh bending area in FIG. 5), 587)) and an eighth bending area 588 (eg, the eighth bending area 588 in FIG. 5). A portion of the elastic portion 530 may be bent through the sixth bending region 586 and extend into the internal space of the frame 510. The elastic portion 530 is bent by the seventh bending region 587 and the eighth bending region 588, so that the protrusion 531 is disposed to penetrate the guide hole 531, and the tail 540 is formed by the second bending region 588. It may be placed within the through hole 501.

According to one embodiment, the protrusion 531 may move inside the guide hole 511 along the first direction d1, which is the longitudinal direction of the guide hole 511. The guide hole 511 may guide the movement of the protrusion 531 and/or the tail 540. The tail 540 may move inside the second through hole 501 and the first through hole 403 along the first direction d1.

According to one embodiment, the contact member 251 may change from the first state 701 to the second state 702 by applying external force of the contact member 251. The first state 701 may be a state in which no external force is applied to the contact member 251 . For example, the first state 701 may be a state before the printed circuit board 401 on which the contact member 251 is disposed is disposed on the frame structure 240 .

According to one embodiment, in the first state 701, the nose 521b may protrude toward the frame structure 240 from the internal space surrounded by the support plate 510 of the frame 500. For example, nose 521b may protrude from contact portion 520 toward frame structure 240 . The nose 521b may protrude toward the side 442 of the groove 440. Within the first state 701, the nose 521b may be spaced apart from the frame structure 240. The protrusion 531 may be located at one end of the guide hole 511 facing the frame structure 240. As the protrusion 531 is located at one end of the guide hole 511, the elastic portion 530 may be biased toward the frame structure 240. The remaining portion of the contact portion 520 may be disposed outside the frame 500 .

According to one embodiment, within the second state 702, the nose 521b may move toward the frame structure 240 from the internal space surrounded by the support plate 510 of the frame 500. The nose 521b may be in contact with the frame structure 240.

According to one embodiment, the distance between the nose 521b and the support plate 510 in the first state 701 is the distance between the nose 521a and the support plate 510 in the second state 702. It can be shorter. For example, the distance between the nose 521b and the first side 510a of the support plate 510 in the first state 701 is the distance between the nose 521a and the support plate (521b) in the second state 702. It may be shorter than the distance between the first sides 510a of 510). Within the second state 702, the protrusion 531 may be located at the other end of the guide hole 511 facing the printed circuit board 401. As the protrusion 531 is located at the other end of the guide hole 511, the elastic portion 530 can move toward the printed circuit board 401.

According to one embodiment, while the contact member 251 changes from the first state 701 to the second state 702, the contact member 251 may be pressed by the frame structure 240. One side 500a of the frame 500 may be fixed to the printed circuit board 401. While changing from the first state 701 to the second state 702, the nose 521b may contact the side 442 of the groove 440 formed in the frame structure 240. The nose 521b in contact with the side surface 442 may move toward the side surface 442 as the seating surface 441 presses the elastic portion 530. For example, the portion 710a of the elastic portion 530 facing the seating surface may be pressed by the seating surface 441 as the distance between the seating surface 441 and the printed circuit board 401 decreases. . The area 710a in contact with the seating surface 441 may move toward the printed circuit board 401 as the distance between the seating surface 441 and the printed circuit board 401 decreases.

According to one embodiment, through pressure of the seating surface 441, the region 710a may move in the first direction d1 toward the printed circuit board 401. The nose 521b may move from the frame 500 toward the side 442 of the groove 440 through movement of the seating surface 441. Even while changing between the first state 701 and the second state 702, the gap between the nose 521b and the first rotation point R1 remains constant, and the distance between the nose 521b and the second rotation point ( The spacing between R2) can be kept constant. Based on the movement of the seating surface 441, the distance between the nose 521b and the first rotation point (R1) and the distance between the nose 521b and the second rotation point (R2) are maintained constant. ) can move toward the side 442. For example, as the seating surface 441 moves toward the first direction d1, the angle between the first imaginary line a1 and the second imaginary line a2 changes to the first state 701. It may be reduced from the angle Θ1 to the angle Θ2 in the second state 702. For example, as the distance between the nose 521b and the first rotation point R1 and the distance between the nose 521b and the second rotation point R2 are kept constant, the second state 702 changes. Meanwhile, a portion of the contact portion 520 extending from the first rotation point R1 along the first imaginary line a1 may rotate clockwise with respect to the first rotation point R1. As the distance between the nose 521b and the first rotation point R1 and the distance between the nose 521b and the second rotation point R2 are kept constant, while changing to the second state 702, the second state 702 A portion of the contact portion 520 extending from the rotation point R2 along the second imaginary line a2 may rotate counterclockwise with respect to the second rotation point R2. The gap or angle between the part of the contact portion 520 and the other part of the contact portion 520 may be reduced through the rotations. The nose 521b may move in the fourth direction d4 by reducing the gap or the included angle.

According to one embodiment, as the region 710a of the elastic portion 530 moves, the elastic portion 530 may change elastically. The elastic portion 530 may move in the first direction d1 based on the region 710 moving in the first direction d1. Since the protrusion 531 moves along the guide groove 511, the elastic portion 530 may be moved in the first direction d1 by the protrusion 531 in the first direction d1. The first through hole 403 may be aligned with the second through hole 501. For example, the first through hole 403 may be disposed on the second through hole 501 in the first direction d1. The tail 540 disposed in the second through hole 501 in the first state 601 changes to the second state 602 and penetrates the second through hole 501 to form the first through hole ( 403) Can be moved inside. For example, the tail 540 may be moved inside the first through hole 403 along the first direction d1.

According to one embodiment, region 710a of contact member 251 may be pressed against frame structure 240 . In the second state 702, the contact member 251 may be electrically connected to the frame structure 240 formed of the conductive portion 443a through the nose 521b. In the second state 702, the area 710a may be in contact with the seating surface 441 of the groove 440, but may be electrically disconnected.

According to one embodiment, the support surface 710b of the support plate 510 facing the seating surface 441 of the groove 440 is in the second state 702 to distribute the pressure applied to the contact member 251. ) can be in contact with the seating surface 441. Areas of the contact member 251 other than the area where the nose 521b contacts the frame structure 240 may be electrically disconnected from the frame structure 240 . For example, the frame 500 may include an insulating material disposed in areas in contact with the inner surface of the housing 210 that are different from the area where the nose 521b is disposed. The area 710a and the support surface 710b may include an insulating material to electrically disconnect from the frame structure 240. For example, the insulating material may be applied to area 710a and support surface 710b.

According to the above-described embodiment, the contact member 251 may include an elastic portion 530 and a contact portion 520 configured to provide elastic rotation. The elastic portion 530 may be disposed in the internal space of the frame 500 in the second state, so that the driving space of the contact member 251 may be reduced. The contact portion 520 may be electrically connected to the frame structure 240 by protruding from the frame 500 toward the side 442 of the groove 440 in the second state. According to one embodiment, the contact member 251 can variably form the overall length of the clip by moving the tail 540 toward the printed circuit board 401. The contact member 251 may provide a repulsive force to maintain the electrical connection between the frame structure 240 and the printed circuit board 401 even within a narrow space (eg, groove 440). The status of the contact members 251 can be identified without separating the printed circuit board 401 from the frame structure 240 . Through the tail 540 visible to the outside of the printed circuit board 401 through the first through hole 403, whether the contact member 251 is poorly assembled, damaged, or misassembled can be identified.

According to the above-described embodiment, an electronic device (e.g., electronic device 200 in FIG. 4) may include a housing (e.g., housing 210 in FIG. 2) that forms at least a portion of the outer surface of the electronic device. there is. According to one embodiment, the electronic device is disposed in the housing and includes a PCB (e.g., the first printed circuit board 250 of FIG. 3, the second printed circuit board 252 of FIG. 3) including a first through hole. ) or the printed circuit board 401 of FIG. 4). According to one embodiment, the electronic device may include a contact member (eg, contact member 251 in FIG. 4) disposed between the PCB and the housing.

According to one embodiment, the contact member is a frame ( Example: may include frame 500 of FIG. 5). The contact member may be disposed on an outer surface of the frame and include a nose on the frame (eg, noses 521a and 521b in FIG. 5 ) that contact the inner surface of the housing. According to one embodiment, the electronic device is disposed on a portion of the frame extending from the nose toward the one surface of the contact member through an internal space surrounded by the frame, and the first through hole and the second It may include a tail (eg, tail 540 in FIG. 5) inserted into the through hole.

According to one embodiment, the frame extends toward the housing in the first direction from an edge of the one surface, is bent to extend in a second direction different from the first direction, and has a contact portion on which the nose is disposed ( For example, it may include a contact portion 520 of FIG. 5).

According to the above-described embodiment, the electronic device can provide an electrical connection between the printed circuit board and the frame structure through an elastically deformable contact member. An electronic device can reduce the space for a contact member based on a contact member having a movable structure of an elastic portion. For example, a contact member according to an embodiment may be inserted into a narrow space formed in a housing or frame structure. An electronic device according to an embodiment can reduce the space for a contact member, thereby increasing space efficiency of the electronic device.

According to one embodiment, the contact member includes a conductive material and may electrically connect the housing and the PCB.

According to the above-described embodiment, the contact member including a conductive material can maintain an electrical connection between the conductive portion of the housing and the PCB. The contact member may utilize the conductive portion of the housing as a ground portion.

According to one embodiment, the contact portion may be deformed by pressure between the housing and the PCB while the PCB is in contact with the housing. According to one embodiment, the nose may press the housing based on deformation of the contact portion.

According to the above-described embodiment, the nose may maintain electrical contact with the conductive portion of the housing based on elastic deformation of the contact portion.

According to one embodiment, the frame includes a support plate (e.g., support plate 510 in FIG. 5) extending from an edge of the one surface of the contact member toward the housing in a first direction perpendicular to the one surface. can do.

According to one embodiment, the frame extends from the nose to the inside of the frame and includes an elastic portion (e.g., protrusion 531 in FIG. 5) that protrudes in a direction perpendicular to the extending direction. Example: It may include the elastic portion 530 of FIG. 5 .

According to one embodiment, the support plate may include a guide hole (eg, guide hole 511 in FIG. 5) into which the protrusion is inserted and guides the movement of the tail.

According to the above-described embodiment, the contact member can be transformed into a designated shape through a tail that moves along the guide hole. For example, the contact member may move the elastic portion of the contact member based on the movement of the tail.

According to one embodiment, the nose may rotate about a point where the contact portion and the one surface meet.

According to one embodiment, the angle between the direction from one end of the contact portion to the nose and the direction from the other end of the contact portion to the nose may be changed by compression of the frame by the housing. .

According to the above-described embodiment, the nose of the contact member may be deformed based on compression by the frame structure. The modified nose may provide a repulsive force to the frame structure to maintain a contact point between the frame structure and the nose.

According to one embodiment, the frame further includes a support plate (e.g., support plate 510 in FIG. 5) extending from an edge of the one surface of the contact member toward the housing in a first direction perpendicular to the one surface. It can be included. According to one embodiment, the support plate may be in contact with the inner surface of the housing and electrically disconnected from the housing. According to one embodiment, the nose may be in contact with the inner surface of the housing and electrically connected to the housing.

The frame may further include a support plate (eg, support plate 510 in FIG. 5 ) extending from an edge of the one surface of the contact member toward the housing in a first direction perpendicular to the one surface. According to one embodiment, the support plate may be in contact with the inner surface of the housing and electrically disconnected from the housing. The nose may be in contact with another inner surface extending toward the PCB based on the inner surface of the housing, and may be electrically connected to the housing.

According to one embodiment, the contact member provides only one electrical connection point with the housing or frame structure, thereby reducing electrical connection at multiple points. Both vertical type contact elements or horizontal type contact elements can maintain a single point of contact.

According to one embodiment, the frame is spaced apart from the inner surface of the housing and extends from an edge of the one surface of the contact member toward the housing in a first direction perpendicular to the one surface. It may further include a support plate. . According to one embodiment, the nose may contact the inner surface of the housing.

According to one embodiment, the first through hole may be aligned with and connected to the second through hole. According to one embodiment, the tail may be inserted into the first through hole and the second through hole by applying pressure between the housing and the PCB.

According to the above-described embodiment, as the tail moves in the space formed by the first through hole and the second through hole according to the change in state, the space for the contact member can be reduced. An electronic device including the contact member can increase space efficiency.

According to one embodiment, the nose may contact the inner surface of the housing facing the one surface.

According to one embodiment, the nose may contact the inner surface of the housing perpendicular to the one surface.

According to the above-described embodiment, through the nose, the contact member can maintain electrical connection with the conductive portion of the housing.

According to one embodiment, the nose may protrude from the one surface in a direction toward the housing.

According to the above-described embodiment, the nose may contact the seating surface 441 of the groove (eg, groove 440 in FIG. 4), which is a structure of the housing.

According to one embodiment, the nose may protrude in a direction perpendicular to the one surface.

According to the above-described embodiment, the nose may contact the side surface 442 of a groove (eg, groove 440 in FIG. 4), which is a structure of the housing.

According to one embodiment, the frame may include an elastic part (eg, elastic part 530 in FIG. 5) extending from the nose to the inside of the frame. According to one embodiment, the elastic portion may move into the inside of the frame by pressure of the housing.

According to the above-described embodiment, in the second state, the space efficiency of the contact member can be increased by storing the elastic portion in the inner space of the frame.

According to one embodiment, the frame may include an insulating material disposed in areas that contact the inner surface of the housing that are different from the area where the nose is disposed.

According to the above-described embodiment, the contact member may be electrically connected to the frame structure or housing through the nose through the insulating material, and may be electrically disconnected from the frame structure or housing through an area other than the nose.

According to one embodiment, the housing may include a side member (eg, the side member 218 in FIG. 2) that forms at least a portion of the outer surface of the electronic device. The housing may include a support portion (eg, support portion 243 in FIG. 2 or frame structure 240 in FIG. 2) extending inward from the side member. The support part may include a conductive part (eg, the conductive part 443a in FIG. 4) in contact with the contact member.

According to the above-described embodiment, the frame structure, which is the mechanical structure of the electronic device, can be used as a ground portion. For example, the conductive portion of the frame structure is electrically connected through a contact member, so that the conductive portion can operate as a ground portion.

According to one embodiment, an electronic device (e.g., the electronic device 200 of FIG. 4) according to the above-described embodiment includes a housing (e.g., a second housing 210) that forms at least a portion of the outer surface of the electronic device. ))) may be included. According to one embodiment, the electronic device is disposed in the housing and includes a PCB (e.g., the first printed circuit board 250 of FIG. 3, the second printed circuit board 252 of FIG. 3) including a first through hole. ) or the printed circuit board 401 of FIG. 4). According to one embodiment, the electronic device may include a contact member (eg, contact member 251 in FIG. 4) disposed between the PCB and the housing.

According to one embodiment, the contact member is a frame ( Example: may include frame 500 of FIG. 5).

According to one embodiment, the contact member is disposed on the outer surface of the frame and may include a nose on the frame (eg, noses 521a and 521b in FIG. 5) that contact the inner surface of the housing.

According to one embodiment, the electronic device is disposed on a portion of the frame extending from the nose toward the one surface of the contact member through an internal space surrounded by the frame, and the first through hole and the second It may include a tail (eg, tail 540 in FIG. 5) inserted into the through hole.

According to one embodiment, the frame includes a support plate (e.g., support plate 510 in FIG. 5) extending from an edge of the one surface of the contact member toward the housing in a first direction perpendicular to the one surface. can do.

According to one embodiment, the frame extends toward the housing in the first direction from an edge of the one surface, is bent to extend in a second direction different from the first direction, and has a contact portion on which the nose is disposed ( For example, it may include a contact portion 520 of FIG. 5).

According to one embodiment, the nose may contact the inner surface of the housing facing the second area.

According to the above-described embodiment, the electronic device can provide an electrical connection between the printed circuit board and the frame structure through an elastically deformable contact member. An electronic device can reduce the space for a contact member based on a contact member having a movable structure of an elastic portion. For example, a contact member according to an embodiment may be inserted into a narrow space formed in a housing or frame structure. An electronic device according to an embodiment can reduce the space for a contact member, thereby increasing space efficiency of the electronic device.

According to the above-described embodiments, the contact member may include a contact portion and an elastic portion configured to provide elastic rotation. The elastic portion and the contact portion may be disposed in the internal space of the frame in the second state, so that the driving space of the contact member may be reduced. According to one embodiment, the contact member can variably form the overall length of the clip by moving the tail toward the printed circuit board. The contact member can provide a repulsive force to maintain the electrical connection between the frame structure and the printed circuit board even in a narrow space. The status of the contact members can be identified without separating the printed circuit board from the frame structure. Through the tail visible to the outside of the printed circuit board through the first through hole, whether the contact member is poorly assembled, damaged, or misassembled can be identified.

According to one embodiment, the frame extends from the nose into the inside of the frame in a direction opposite to the first direction and has a protrusion (e.g., a protrusion in FIG. 5) protruding in a direction perpendicular to the extending direction. 531)), and may include an elastic portion (eg, the elastic portion 530 of FIG. 5).

According to one embodiment, the support plate may include a guide hole (eg, guide hole 511 in FIG. 5) into which the protrusion is inserted and guides the movement of the tail.

According to the above-described embodiment, the contact member can be transformed into a designated shape through a tail that moves along the guide hole. For example, the contact member may move the elastic portion of the contact member based on the movement of the tail.

According to one embodiment, the contact portion may be deformed by pressure between the housing and the PCB while the PCB is in contact with the housing. The nose may contact the housing based on deformation of the contact portion.

According to one embodiment, the nose may be rotatable around a point where the contact portion and the one surface meet.

According to the above-described embodiment, the nose of the contact member may be deformed based on compression by the frame structure. The modified nose may provide a repulsive force to the frame structure to maintain a contact point between the frame structure and the nose.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to those components in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims (20)

In the electronic device (101; 200),
a housing (210) forming at least a portion of the outer surface of the electronic device (101; 200);
a PCB (250; 252; 401) disposed within the housing 210 and including a first through hole 403; and
a contact member 251 disposed between the PCB (250; 252; 401) and the housing 210; Including,
The contact member 251 is,
A second through hole forms the outer shape of the contact member 251, is arranged in the first through hole 403, and penetrates one surface of the contact member 251 that is in contact with the PCB (250; 252; 401). Frame 500 including 501;
A nose (521; 521a; 521b) on the frame 500 disposed on the outer surface of the frame 500 and in contact with the inner surface of the housing 210; and
It is disposed on a part of the frame 500 extending from the nose (521; 521a; 521b) toward the one surface of the contact member 251 through an internal space surrounded by the frame 500, and the first through hole (403) and a tail 540 movable inside the second through hole 501,
The frame 500 is,
A contact portion extending from the edge of the one surface toward the housing 210 in the first direction, bent to extend in a second direction different from the first direction, and on which the nose 521; 521a; 521b is disposed ( 520); Including,
Electronic devices (101; 200).
According to paragraph 1,
The contact member 251 is,
Comprising a conductive material and electrically connecting the housing 210 and the PCB (250; 252; 401),
Electronic devices (101; 200).
According to claim 1 or 2,
The contact portion 520 is,
While the PCB (250; 252; 401) is in contact with the housing 210, the housing 210 and the PCB (250; 252; 401) are deformed by pressure,
The nose (521; 521a; 521b) is,
Based on the deformation of the contact portion 520, which contacts the housing 210,
Electronic devices (101; 200).
According to any one of claims 1 to 3,
The frame 500 is,
a support plate 510 extending from an edge of the one surface of the contact member 251 toward the housing 210 in a first direction perpendicular to the one surface; and
an elastic portion 530 extending from the nose 521; 521a; 521b into the inside of the frame 500 and including a protrusion 531 protruding in a direction perpendicular to the extending direction; Including,
The support plate 510 is,
The protrusion 531 is inserted and includes a guide hole 511 that guides the movement of the tail 540,
Electronic devices (101; 200).
According to any one of claims 1 to 4,
The nose (521; 521a; 521b) is,
Rotatable about the point where the contact portion 520 and the one surface meet,
Electronic devices (101; 200).
According to any one of claims 1 to 5,
The angle between the direction from one end of the contact portion 520 to the nose (521; 521a; 521b) and the direction from the other end of the contact portion 520 to the nose (521; 521a; 521b) is,
Changed by compression of the frame 500 by the housing 210,
Electronic devices (101; 200).
According to any one of claims 1 to 6,
The frame 500 is,
It further includes a support plate 510 extending from an edge of the one surface of the contact member 251 toward the housing 210 in a first direction perpendicular to the one surface,
The support plate 510 is,
Contacting the inner surface of the housing 210 and electrically disconnected from the housing 210,
The nose (521; 521a; 521b) is,
Contacting the inner surface of the housing 210 and electrically connected to the housing 210,
Electronic devices (101; 200).
According to any one of claims 1 to 7,
The frame 500 is,
It further includes a support plate 510 extending from an edge of the one surface of the contact member 251 toward the housing 210 in a first direction perpendicular to the one surface,
The support plate 510 is in contact with the inner surface of the housing 210 and is electrically disconnected from the housing 210,
The nose (521; 521a; 521b) is in contact with another inner surface extending toward the PCB (250; 252; 401) based on the inner surface of the housing 210, and is electrically connected to the housing 210.
Electronic devices (101; 200).
According to any one of claims 1 to 8,
The frame 500 is,
It further includes a support plate 510 that is spaced apart from the inner surface of the housing 210 and extends from an edge of the one surface of the contact member 251 toward the housing 210 in a first direction perpendicular to the one surface. ,
The nose (521; 521a; 521b) is,
Contacting the inner surface of the housing 210,
Electronic devices (101; 200).
According to any one of claims 1 to 9,
The first through hole 403 is,
Aligned with the second through hole 501 and connected to the second through hole 501,
The tail 540 is,
Inserted into the first through hole 403 and the second through hole 501 by pressurizing the housing 210 and the PCB (250; 252; 401),
Electronic devices (101; 200).
According to any one of claims 1 to 10,
The nose (521; 521a; 521b) is,
Contacting the inner surface of the housing 210 facing the one surface,
Electronic devices (101; 200).
According to any one of claims 1 to 11,
The nose (521; 521a; 521b) is,
Contacting the inner surface of the housing 210 perpendicular to the one surface,
Electronic devices (101; 200).
According to any one of claims 1 to 12,
The nose (521; 521a; 521b) is,
Protruding from the one surface in a direction toward the housing 210,
Electronic devices (101; 200).
According to any one of claims 1 to 13,
The nose (521; 521a; 521b) is,
Protruding in a direction perpendicular to the one surface,
Electronic devices (101; 200).
According to any one of claims 1 to 14,
The frame 500 is,
It includes an elastic portion 530 extending from the nose 521; 521a; 521b to the inside of the frame 500,
The elastic portion 530 is,
Moves into the inside of the frame 500 by pressure of the housing 210,
Electronic devices (101; 200).
According to any one of claims 1 to 15,
The frame 500 is,
Comprising an insulating material disposed in areas in contact with the inner surface of the housing 210 that are different from the area where the nose (521; 521a; 521b) is disposed,
Electronic devices (101; 200).
According to any one of claims 1 to 16,
The housing 210 is,
a side member forming at least a portion of the outer surface of the electronic device (101; 200); and
It includes a support portion extending inward from the side member,
The support part is,
Comprising a conductive portion in contact with the contact member 251,
Electronic devices (101; 200).
In the electronic device (101; 200),
a housing (210) forming at least a portion of the outer surface of the electronic device (101; 200);
a PCB (250; 252; 401) disposed within the housing 210 and including a first through hole 403; and
a contact member 251 disposed between the PCB (250; 252; 401) and the housing 210; Including,
The contact member 251 is,
A second through hole forms the outer shape of the contact member 251, is arranged in the first through hole 403, and penetrates one surface of the contact member 251 that is in contact with the PCB (250; 252; 401). Frame 500 including 501;
A nose (521; 521a; 521b) on the frame 500 disposed on the outer surface of the frame 500 and in contact with the inner surface of the housing 210; and
It is disposed on a part of the frame 500 extending from the nose (521; 521a; 521b) toward the one surface of the contact member 251 through an internal space surrounded by the frame 500, and the first through hole (403) and a tail 540 movable inside the second through hole 501,
The frame 500 is,
a support plate 510 extending from an edge of the one surface of the contact member 251 toward the housing 210 in a first direction perpendicular to the one surface; and
A first area extending from another edge different from the edge of the one surface toward the housing 210 in the first direction and bent to extend in a second direction perpendicular to the first direction and the nose 521; 521a; 521b ) a contact portion 520 including a second area where ) is disposed; Including,
The nose (521; 521a; 521b) is,
Adjacent to the inner surface of the housing 210 facing the second area,
Electronic devices (101; 200).
According to clause 18,
The frame 500 is,
An elastic portion extending from the nose (521; 521a; 521b) into the frame 500 in a direction opposite to the first direction and including a protrusion 531 protruding toward the support plate 510 ( 530),
The support plate 510 is,
The protrusion 531 is inserted and includes a guide hole 511 that guides the movement of the tail 540,
Electronic devices (101; 200).
According to claim 18 or 19,
The contact portion 520 is,
While the PCB (250; 252; 401) is in contact with the housing 210, the housing 210 and the PCB (250; 252; 401) are deformed by pressure,
The nose (521; 521a; 521b) is,
Based on the deformation of the contact portion 520, which contacts the housing 210,
Electronic devices (101; 200).

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