KR20240050196A - Electronic device including speaker module - Google Patents

Abstract

An electronic device according to an embodiment includes a housing; a circuit board disposed inside the housing, including a first side and a second side opposite the first side, at least one electronic component disposed on the first side and the second side of the circuit board; a speaker module disposed inside a first opening formed in the circuit board so as to be surrounded by the circuit board; and a first shield can disposed on the second side of the circuit board and covering the speaker module and the at least one electronic component disposed on the second side. One or more ventilation holes may be formed in the first shield can, and a mesh member may be disposed to cover the ventilation holes. In addition to this, various embodiments identified through the specification are possible.

Description

Electronic device including a speaker module {ELECTRONIC DEVICE INCLUDING SPEAKER MODULE}

Embodiments disclosed in this document relate to an electronic device including a speaker module, and specifically relate to a structure for mounting the speaker module inside a shield can.

The electronic device may include one or more speaker modules. Electronic devices can output sound to the outside through a speaker module. The speaker module may be configured to convert electrical signals into audio signals. For example, a speaker module can generate and transmit audio signals by vibrating air based on electrical signals. The speaker module may be placed inside the electronic device as a single piece, or may be placed inside the electronic device while accommodated in a speaker enclosure. The electronic device may include a mounting structure to secure a resonance space for the speaker module.

An electronic device according to an embodiment disclosed in this document includes a housing; a circuit board disposed inside the housing, including a first side and a second side opposite the first side, at least one electronic component disposed on the first side and the second side of the circuit board; a speaker module disposed inside a first opening formed in the circuit board so as to be surrounded by the circuit board; and a first shield can disposed on the second side of the circuit board and covering the speaker module and the at least one electronic component disposed on the second side. One or more ventilation holes may be formed in the first shield can, and a mesh member may be disposed to cover the ventilation holes.

1 is a block diagram of an electronic device in a network environment according to an embodiment.
Figure 2A is a front perspective view of an electronic device according to an embodiment.
Figure 2b is a rear perspective view of an electronic device according to an embodiment.
Figure 3 is an exploded perspective view of an electronic device according to an embodiment.
FIG. 4A is a plan view of an electronic device according to an embodiment.
Figure 4b is a cross-sectional view of an electronic device according to one embodiment.
Figure 5 is a cross-sectional view of an electronic device according to an embodiment.
FIG. 6 is a diagram illustrating a mesh member of an electronic device according to an embodiment.
FIG. 7 is a diagram illustrating a shield can and a mesh member of an electronic device according to an embodiment.
8A is a cross-sectional view of an electronic device according to an embodiment.
8B is a cross-sectional view of an electronic device according to an embodiment.
9 is a cross-sectional view of an electronic device according to an embodiment.
10A is a cross-sectional view of an electronic device according to an embodiment.
10B is a cross-sectional view of an electronic device according to an embodiment.
11 is a graph showing heat dissipation performance of an electronic device according to an embodiment.
In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components.

Hereinafter, various embodiments of the present invention are described with reference to the attached drawings. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include various modifications, equivalents, and/or alternatives to the embodiments of the present invention.

FIG. 1 is a block diagram of an electronic device 101 in a network environment according to an embodiment.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.

According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted, or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or operations can be performed. According to one embodiment, as at least part of data processing or computation, processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a auxiliary processor 123, the auxiliary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, the co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band), for example, to achieve a high data rate. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Figure 2A is a front perspective view of an electronic device according to an embodiment. Figure 2b is a rear perspective view of an electronic device according to an embodiment.

Referring to FIGS. 2A and 2B, the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to an embodiment has a first side (or front) 210A, a second side (or , rear) (210B), and a housing (210) including a third surface (or side) (210C) surrounding the space between the first surface (210A) and the second surface (210B). . In various embodiments, the housing 210 may refer to a structure that forms part of the first side 210A, the second side 210B, and the third side 210C.

The first surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate). The second surface 210B may be formed by a substantially opaque rear plate 211. The back plate 211 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be. The third surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure (or side member) 218 including metal and/or polymer. In various embodiments, the back plate 211 and the side bezel structure 218 may be formed integrally and may include the same material (eg, a metallic material such as aluminum).

The front plate 202 may include two first regions 210D that are curved and seamlessly extended from a portion of the first surface 210A toward the rear plate 211 . The first areas 210D may be located at both ends of the long edge of the front plate 202.

The rear plate 211 may include two second regions 210E that are curved and extend seamlessly from a portion of the second surface 210B toward the front plate 202 . The second areas 210E may be included at both ends of the long edges of the rear plate 211.

In various embodiments, the front plate 202 (or the back plate 211) may include only one of the first areas 210D (or the second areas 210E). Additionally, in various embodiments, the front plate 202 (or rear plate 211) may not include some of the first areas 210D (or second areas 210E).

The electronic device 200 includes a display 201 (e.g., display module 160 in FIG. 1), audio modules 203, 204, and 207 (e.g., audio module 170 in FIG. 1), and a sensor module (not shown). ) (e.g., sensor module 176 in FIG. 1), camera modules 205, 212, 213 (e.g., camera module 180 in FIG. 1), key input device 217 (e.g., input device in FIG. 1) (150)), a light emitting element (not shown), and a connector hole 208 (eg, the connection terminal 178 in FIG. 1). In various embodiments, the electronic device 200 may omit at least one of the above components (e.g., key input device 217 or a light emitting device (not shown)) or may additionally include other components.

The display 201 may be visually exposed through a significant portion of the front plate 202 . For example, at least a portion of the display 201 may be visually exposed through the front plate 202 including the first area 210D of the first side 210A and the third side 210C. The display 201 may be disposed on the back of the front plate 202.

The edges of the display 201 may be formed to be substantially the same as the adjacent outer shape of the front plate 202. In various embodiments, in order to expand the area to which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.

The surface of the housing 210 (or the front plate 202) may include a screen display area formed as the display 201 is visually exposed. For example, the screen display area may include a first surface 210A and first areas 210D on the sides.

In various embodiments, the screen display areas 210A and 210D may include a sensing area (not shown) configured to obtain the user's biometric information. Here, “the screen display areas 210A and 210D include a sensing area” may be understood as meaning that at least a portion of the sensing area may overlap the screen display areas 210A and 210D. For example, the sensing area (not shown) may display visual information by the display 201 like other areas of the screen display areas 210A and 210D, and may additionally display the user's biometric information (e.g., fingerprint). It may mean an area that can be acquired.

The screen display areas 210A and 210D of the display 201 may include an area where the first camera module 205 (eg, a punch hole camera) is visually exposed. For example, at least a portion of an edge of the area where the first camera module 205 is visually exposed may be surrounded by the screen display areas 210A and 210D.

In various embodiments, the display 201 includes an audio module (not shown), a sensor module (not shown), a camera module (e.g., a first camera module 205) on the back of the screen display areas 210A and 210D, and a light emitting device (not shown) may be configured to be disposed. For example, the electronic device 200 may include a first camera module 205 (e.g., an under-display camera (UDC) on the rear side (e.g., the side facing the -z-axis direction) of the first side 210A (e.g., the front). ; under display camera) may be configured to be disposed toward the first surface 210A. For example, the first camera module 205 may be disposed below the display 201 and may not be visually exposed to the screen display areas 210A and 210D.

In various embodiments, when the first camera module 205 is configured as an under-display camera, the display 201 has an area facing the first camera module 205 as part of a display area that displays content, and has a specified transmittance. It may be formed as a transmission area having. For example, the transparent area may be formed to have a transmittance ranging from about 5% to about 50%. This transmission area may include an area overlapping with an effective area (eg, field of view (FOV) area) of the first camera module 205 through which light for forming an image by imaging the image sensor passes. For example, the transparent area of the display 201 may include an area with a lower pixel density and/or wiring density than the surrounding area.

The display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen.

The audio modules 203, 204, and 207 may include microphone holes 203 and 204 and speaker holes 207.

The microphone holes 203 and 204 may include a first microphone hole 203 formed in a portion of the third side 210C and a second microphone hole 204 formed in a portion of the second side 210B. . Microphones (not shown) may be placed inside the microphone holes 203 and 204 to acquire external sounds. The microphone may include a plurality of microphones to detect the direction of sound.

The second microphone hole 204 formed in a partial area of the second surface 210B may be arranged adjacent to the camera modules 205, 212, and 213. For example, the second microphone hole 204 may acquire sound when the camera modules 205, 212, and 213 are executed, or may acquire sound when other functions are executed.

The speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for a call. The external speaker hole 207 may be formed in a portion of the third side 210C of the electronic device 200. In another embodiment, the external speaker hole 207 and the microphone hole 203 may be implemented as one hole. Although not shown, a receiver hole (not shown) for a call may be formed in another part of the third side 210C. For example, the receiver hole for a call is a part of the third side 210C where the external speaker hole 207 is formed (e.g., a part facing the -y-axis direction) and another part of the third side 210C (e.g., a part facing the -y-axis direction). : It can be formed in the part facing the +y-axis direction. According to various embodiments, the receiver hole for a call is not formed in a portion of the third side 210C, but is formed in a space (e.g., a space between the front plate 202 (or display 201)) and the side bezel structure 218. : It may be formed by the separation space (H) in FIG. 5).

The electronic device 200 may include at least one speaker (not shown) configured to output sound to the outside of the housing 210 through the external speaker hole 207 or the call receiver hole (not shown). According to various embodiments, the speaker may include a piezo speaker with the speaker hole 207 omitted.

A sensor module (not shown) may generate an electrical signal or data value corresponding to the internal operating state of the electronic device 200 or the external environmental state. For example, the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.

The camera modules 205, 212, and 213 include a first camera module 205 exposed to the first side 210A of the electronic device 200, and a second camera module 212 exposed to the second side 210B. , and/or a flash 213. Each of the first camera module 205 and the second camera module 212 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp.

The first camera module 205 may be visually exposed through a portion of the screen display areas 210A and 210D of the display 201. For example, the first camera module 205 (e.g., a punch hole camera) may be visually exposed to some areas of the screen display areas 210A and 210D through an opening (not shown) formed in a portion of the display 201. You can. In various embodiments, the first camera module 205 (eg, an under-display camera) may be disposed on the back of the display 201 and may not be visually exposed to the screen display areas 210A and 210D.

The second camera module 212 may include a plurality of camera devices (eg, a dual camera, a triple camera, or a quad camera). However, the second camera module 212 is not necessarily limited to including a plurality of camera devices and may include only one camera device.

The key input device 217 may be disposed on the third side 210C of the housing 210. In various embodiments, the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 that are not included may be displayed in the form of soft keys on the display 201. It can be implemented.

Connector hole 208 can accommodate a connector. The connector hole 208 may be disposed on the third side 210C of the housing 210. For example, the connector hole 208 may be disposed on the third surface 210C to be adjacent to at least a portion of the audio module (eg, the microphone hole 203 and the speaker hole 207). In various embodiments, the electronic device 200 includes a first connector hole 208 that can accommodate a connector (e.g., a USB connector) for transmitting/receiving power and/or data with an external electronic device and/or an external electronic device. It may include a second connector hole (not shown) that can accommodate a connector (eg, an earphone jack) for transmitting/receiving audio signals to and from the device.

The electronic device 200 may include a light emitting device (not shown). For example, the light emitting device (not shown) may be disposed on the first surface 210A of the housing 210. The light emitting device (not shown) may provide status information of the electronic device 200 in the form of light. In various embodiments, the light emitting device (not shown) may provide a light source linked to the operation of the first camera module 205. For example, the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.

Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

FIG. 3 is a diagram showing the electronic device in an exploded state based on the rear perspective view of FIG. 2B.

Referring to FIG. 3, the electronic device 200 according to an embodiment includes a front plate 220 (e.g., front plate 202 in FIG. 2A) and a display 230 (e.g., display 201 in FIG. 2A). ), side member 240 (e.g., side bezel structure 218 in Figure 2A), printed circuit board 250, rear case 260, battery 270, rear plate 280 (e.g., in Figure 2B) It may include a rear plate 211), camera modules 291 and 292, a speaker module 293, and an antenna (not shown). In various embodiments, the electronic device 200 may omit at least some of the above components or may additionally include other components.

At least some of the components of the electronic device 200 shown in FIG. 3 may be the same or similar to the components of the electronic device 200 shown in FIGS. 2A and 2B, and overlapping descriptions will be omitted below. .

The front plate 220, the side members 240, and the rear plate 280 may form a housing (eg, the housing 210 in FIGS. 2A and 2B) of the electronic device 200. For example, the housing 210 of the electronic device 200 may refer to a structure in which a front plate 220, a side member 240, and a rear plate 280 are combined to form or define a predetermined accommodation space therein. You can.

The front plate 220 and the display 230 may be coupled to the side member 240. For example, with reference to FIG. 3 , the front plate 220 and the display 230 may be disposed below the side member 240. The front plate 220 and the display 230 may be located in the +z-axis direction from the side member 240. For example, the display 230 may be coupled below the side member 240, and the front plate 220 may be coupled below the display 230. The front plate 220 may form part of the outer surface (or exterior) of the electronic device 200. The display 230 may be disposed between the front plate 220 and the side member 240 to be located inside the electronic device 200.

The side member 240 may be disposed between the display 230 and the rear plate 280. For example, the side member 240 may be configured to surround the space between the rear plate 280 and the display 230.

The side member 240 includes a frame structure 241 that forms part of the side of the electronic device 200 (e.g., the third side 210C in FIG. 2A) and a plate structure extending inward from the frame structure 241 ( 242) may be included.

Plate structure 242 may be placed inside frame structure 241 so that it is surrounded by frame structure 241 . The plate structure 242 may be connected to the frame structure 241 or may be formed integrally with the frame structure 241. The plate structure 242 may be formed of a metallic material and/or a non-metallic (eg, polymer) material. In one embodiment, plate structure 242 may support other components included in electronic device 200. For example, at least one of the display 230, the printed circuit board 250, the rear case 260, and the battery 270 may be disposed on the plate structure 242. For example, the plate structure 242 has the display 230 coupled to one side (e.g., the side facing the +z-axis direction), and the side facing opposite to the one side (e.g., the side facing the -z-axis direction). A printed circuit board 250 may be coupled to the.

The printed circuit board 250 includes a processor (e.g., processor 120 in FIG. 1), a memory (e.g., memory 130 in FIG. 1), and/or an interface (e.g., interface 177 in FIG. 1). Can be installed. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.

Rear case 260 may be disposed between rear plate 280 and plate structure 242. The rear case 260 may be coupled to the side member 240 so as to overlap at least a portion of the printed circuit board 250. For example, the rear case 260 may face the plate structure 242 with the printed circuit board 250 therebetween.

Battery 270 (eg, battery 189 in FIG. 1 ) may supply power to at least one component of electronic device 200 . For example, the battery 270 may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 270 may be disposed on substantially the same plane as the printed circuit board 250 . The battery 270 may be placed integrally within the electronic device 200, or may be placed to be detachable from the electronic device 200.

The rear plate 280 may be coupled to the side member 240. The rear plate 280 may include a rear camera area 281 to support the function/operation of the rear camera (eg, the second camera module 292). The rear camera area 281 may be formed on the surface of the rear plate 280 (eg, the rear surface 210B in FIG. 2B). The camera area 281 may be formed to be at least partially transparent so that external light enters the lens of the second camera module 292. At least a portion of the camera area 281 may protrude from the surface of the rear plate 280 at a predetermined height. However, the present invention is not limited to this, and the camera area 281 may form substantially the same plane as the surface of the rear plate 280.

The first camera module 291 (e.g., the first camera module 205 in FIG. 2A) has a lens that receives external light through a portion of the front plate 220 (e.g., the front 210A in FIG. 2A). It may be disposed on the side member 240 (e.g., plate structure 242) so that the For example, the lens of the first camera module 291 may be visually exposed through a partial area of the front plate 220. A front camera area 231 (eg, an opening area or a light transmitting area) corresponding to the first camera module 291 may be formed in the display 230.

The second camera module 292 (e.g., the second camera module 212 in FIG. 2B) has a lens positioned in the rear camera area of the back plate 280 of the electronic device 200 (e.g., the back side 210B in FIG. 2B). It may be placed on the printed circuit board 250 to receive external light through 281. For example, the lens of the second camera module 212 may be visually exposed to the camera area 281. The second camera module 292 may be disposed in at least a portion of the internal space formed in the housing of the electronic device 200 (e.g., the housing 210 in FIGS. 2A and 2B) and may use a connection member (e.g., connector). It can be electrically connected to the printed circuit board 250 through.

The speaker module 293 (e.g., the sound output module 155 of FIG. 1) may be electrically connected to the printed circuit board 250. Speaker module 293 may be supported by plate structure 242 of side member 240 and may be surrounded by printed circuit board 250 . For example, an opening in which the speaker module 293 is disposed (e.g., the opening 253 in Figure 4b) is formed in the printed circuit board 250, and the speaker module 293 is positioned within the opening and has a plate structure ( 242). The arrangement structure of the speaker module 293 will be described in detail below with reference to FIGS. 4A and 4B.

An antenna (not shown) (eg, antenna module 197 in FIG. 1) may be disposed between the rear plate 280 and the battery 270. Antennas (not shown) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, an antenna (not shown) can perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.

FIG. 4A is a plan view of an electronic device according to an embodiment. Figure 4b is a cross-sectional view of an electronic device according to one embodiment.

FIG. 4B is a diagram illustrating a cross section taken along line A-A' of the electronic device shown in FIG. 4A.

4A and 4B, an electronic device (e.g., electronic device 200 of FIG. 3) according to an embodiment includes a front plate 220, a display 230, a side member 240, and a printed circuit board. It may include (250), a speaker module (293), and a shield can (294).

FIGS. 4A and 4B are diagrams showing the arrangement structure between the speaker module 293, the side member 240, and the printed circuit board 250 when the electronic device 200 shown in FIG. 3 is assembled. For example, FIGS. 4A and 4B may be diagrams in which the rear plate (eg, rear plate 280 of FIG. 3 ) and the rear case (eg, rear case 260 of FIG. 3 ) are omitted.

The side member 240 extends from the plate structure 242 supporting the display 230, the printed circuit board 250, and the speaker module 293, and from the edge of the plate structure 242 and covers the side of the electronic device 200. It may include a frame structure 242 that forms or defines. For example, the display 230 may be disposed on one side (eg, the side facing the +z-axis direction) of the plate structure 242. A printed circuit board 250 and a speaker module 293 may be disposed on the other side of the plate structure 242 (e.g., the side facing the -z-axis direction) facing opposite to the one side.

Printed circuit board 250 may be disposed on plate structure 242 of side member 240 . One or more electronic components and/or electrical elements may be disposed (or mounted) on the printed circuit board 250. The printed circuit board 250 has a first side 251 facing the display 230 and/or plate structure 242 (e.g., a side facing the +z axis direction) and a first side facing away from the first side 251. It may include two sides 252 (e.g., a side facing the -z-axis direction). For example, second side 252 may face back plate 280. One or more electronic components may be disposed on each of the first side 251 and the second side 252 of the printed circuit board 250. A shield can 294 may be disposed (or combined) on the printed circuit board 250. For example, a shield can 294 may be disposed on the second side 252 of the printed circuit board 250, and the shield can 294 may be disposed on the second side 252 to shield electrical noise. Can cover electronic components.

The printed circuit board 250 may surround the speaker module 293. For example, an opening 253 may be formed in a portion of the printed circuit board 250, and a speaker module 293 may be disposed (or accommodated) inside the opening 253. The opening 253 may be formed to have a size corresponding to the speaker module 293 (or a size larger than the speaker module 293). The opening 253 may vertically penetrate the first side 251 and the second side 252 of the printed circuit board 250.

The speaker module 293 may be disposed inside the housing of the electronic device 200 (eg, the housing 210 in FIGS. 2A and 2B). The speaker module 293 can convert electrical signals into sound signals. The speaker module 293 can output sound to the outside of the electronic device 200. Although not shown, the speaker module 293 may include a magnet, a voice coil, a diaphragm (eg, a diaphragm), a yoke, and/or a protector (eg, a cover). For example, the speaker module 293 is configured to generate a sound corresponding to the applied signal as the diaphragm vibrates due to the interaction between the magnetic field generated by the voice coil and the magnetic field of the magnet as an electrical signal is applied. It can be. In various embodiments, the speaker module 293 may omit at least one of the above components or may additionally include other components.

The speaker module 293 may be surrounded by a printed circuit board 250. For example, the speaker module 293 may penetrate a portion of the printed circuit board 250. The speaker module 293 may be received within the opening 253 of the printed circuit board 250 and may be supported by the plate structure 242 of the side member 240. For example, the speaker module 293 is partially located in the space between the first side 251 of the printed circuit board 250 and the plate structure 242, and the other portion is located on the second side of the printed circuit board 250. It may be disposed through the opening 253 of the printed circuit board 250 to be located in the space (eg, internal space C1) between the surface 252 and the shield can 294.

The speaker module 293 may be arranged so that the side from which sound is output faces the plate structure 242 and/or the display 230. For example, the speaker module 293 may output sound toward the space between the first surface 251 of the printed circuit board 250 and the plate structure 242. The speaker module 293 uses the internal space C1 formed or defined by the second surface 252 of the printed circuit board 250 and the shield can 294 to cause sound generated from the speaker module 293 to vibrate (or It can be used as a resonance space (e.g., back volume) that can resonate. As the rear volume is secured by the shield can 294, the sound quality and volume of the sound output from the speaker module 293 toward the front of the electronic device 200 can be improved. In general, the rear volume of the speaker module 293 is an important factor in improving the low-frequency characteristics of the speaker module 293, and the larger the rear volume for resonance, the improved low-frequency characteristics of the speaker module 293 (electronic device ( 200) can be provided.

The speaker module 293 may include various types of speakers depending on audio frequency characteristics (eg, sound range). In various embodiments, the speaker module 293 may include a woofer speaker for low-pitched sounds and/or a tweeter speaker for high-pitched sounds. For example, a woofer speaker can reproduce low sounds in the range of approximately 100Hz to 299Hz, and a tweeter speaker can reproduce high sounds in the range of approximately 3KHz to 6.9KHz. However, the type of speaker module 293 included in the electronic device 200 is not limited to the above description. According to various embodiments, the speaker module 293 may be a sub-woofer speaker, a mid-range speaker (e.g., a squawker speaker), or a super tweeter speaker. ), may include a full range speaker or receiver.

A shield can 294 may be placed on the printed circuit board 250 . For example, the shield can 294 may be disposed on the first side 251 and/or the second side 252 of the printed circuit board 250. The shield can 294 is a shielding member and can cover electronic components to block or shield electromagnetic interference (EMI) generated by electronic components disposed on the printed circuit board 250. As the shield can 294 is coupled to the printed circuit board 250, a shielding space (e.g., internal space C1) is formed (or defined) between the shield can 294 and the printed circuit board 250. It can be configured. For example, the shield can 294 may include a base portion 294a and a side wall portion 294b extending from the base portion 294a to form an interior space C1. The internal space C1 may be defined as a space formed by the base portion 294a, the side wall portion 294b, and the printed circuit board 250. The shield can 294 can accommodate the electronic components in the shielding space C1 by being placed on the printed circuit board 250 to cover the electronic components, thereby blocking radio interference and protecting the electronic components from external shock. It can be protected.

The shield can 294 is disposed on the second side 252 of the printed circuit board 250 and may cover a portion of the speaker module 293. Although not shown, at least some of the electronic components disposed on the second surface 252 may be covered by the shield can 294. For example, as the shield can 294 is coupled to the second side 252 of the printed circuit board 250, a portion of the second side 252 and the internal space C1 surrounded by the shield can 294 ) (e.g., a shielding space) may be formed or defined, and a portion of the electronic components mounted on the second surface 252 and the speaker module 293 may be located inside the internal space C1. The internal space C1 may be used as a resonance space in relation to the function/operation of the speaker module 293. According to the illustrated embodiment, one shield can 294 may be disposed in a partial area of the second side 252 of the printed circuit board 250, but this is an example and the number of shield cans 294 and /Or the location is not limited to the illustrated embodiment. According to various embodiments, the shield can 294 may be additionally disposed on other areas of the second side 252 of the printed circuit board 250 and/or on the first side 251 of the printed circuit board 250. .

At least one ventilation hole 294h may be formed in the shield can 294. The ventilation hole 294h may penetrate at least a portion of the shield can 294. For example, the ventilation hole 294h may connect (or provide fluid communication) the interior and exterior of the shield can 294 to allow air to flow between the interior space C1 and the exterior of the shield can 294. . The ventilation hole 294h may provide or form a path for moving heat generated in the internal space C1 of the shield can 294 to the outside of the shield can 294. For example, heat generated by electronic components accommodated inside the shield can 294 may be emitted to the outside of the shield can 294 through the ventilation hole 294h. Heat can be released through the ventilation hole 294h, but in order to prevent the shielding performance of the shield can 294 from being affected, the shield can 294 is provided with a mesh member (e.g., a mesh member) to cover the ventilation hole 294h. 5, mesh member 380 of FIGS. 6 and 7) may be attached. The mesh member will be described in detail below with reference to FIGS. 5, 6, and 7.

The shield can 294 may be made of a conductive material, a ferromagnetic material, or a metal material. For example, the shield can 294 may be formed using a cold rolled steel plate (SPCC) or stainless steel (e.g., steel type stainless (STS) or stainless use steel (SUS)). However, it is not limited to this.

Figure 5 is a cross-sectional view of an electronic device according to an embodiment. FIG. 6 is a diagram illustrating a mesh member of an electronic device according to an embodiment. FIG. 7 is a diagram illustrating a shield can and a mesh member of an electronic device according to an embodiment.

FIG. 5 is a cross-sectional view of a portion of the electronic device where a speaker module is disposed. For example, FIG. 5 may be a diagram schematically showing a portion corresponding to the cross section of the electronic device shown in FIG. 4B.

Figure 6 is a diagram showing a top view and a cross-sectional view of a mesh member. For example, the cross-sectional view of Figure 6 shows the section B-B' in plan view.

Referring to FIGS. 5, 6, and 7, the electronic device 300 (e.g., the electronic device 200 of FIG. 3) according to an embodiment includes a display 310 (e.g., the display of FIGS. 3 and 4b). (230)), front plate 320 (e.g., front plate 220 in FIGS. 3 and 4B), rear plate 330 (e.g., rear plate 280 in FIG. 3), side member 340 ( Example: side member 240 in FIGS. 3, 4A, and 4B), circuit board 350 (e.g., printed circuit board 250 in FIGS. 3, 4A, and 4B), speaker module 360 (e.g. : Speaker module 293 in FIGS. 3, 4A and 4B), shield can 370 (e.g., shield can 294 in FIGS. 4A and 4B), mesh member 380, rear case 391 ( It may include, for example, the rear case 260 of FIG. 3) and a battery 392 (e.g., the battery 270 of FIG. 3).

At least some of the components of the electronic device 300 shown in FIG. 5 are the same as or the same as the components of the electronic device 200 described above with reference to FIGS. 2A, 2B, 3, 4A, and 4B. They may be similar, and overlapping descriptions will be omitted below.

The front plate 320 may be combined with the display 310. For example, the display 310 may be attached to the back of the front plate 320 (eg, the side facing the -z-axis direction). The display 310 may be visually exposed to the outside of the electronic device 300 through the front plate 320. The front plate 320 and the display 310 may be coupled to the side member 340. In various embodiments, a single component provided with the display 310 and the front plate 320 attached may be referred to as a display module.

The side member 340 has a frame structure 342 that forms at least a portion of a side of the electronic device 300 (e.g., side 210C in FIG. 2A) and extends from the frame structure 342 to the interior of the electronic device 300. It may include an extending plate structure 341. A display 310, a circuit board 350, a speaker module 360, and a battery 392 may be disposed on the plate structure 341. For example, the display 310 combined with the front plate 320 may be attached to one side (eg, the side facing the +z-axis direction) of the plate structure 341. The circuit board 350, speaker module 360, and battery 392 may be seated or supported on the other side of the plate structure 341 (e.g., the side facing the -z-axis direction).

At least a portion of the side member 340 may be spaced apart from the display 310 and/or the front plate 320 so that the internal space of the electronic device 300 is in fluid communication with the outside of the electronic device 300. For example, fluid communication may mean connected (e.g., fluidly connected) to allow movement of fluid (or sound) between the internal space of the electronic device 300 and the outside of the electronic device 300. The inner surface of the frame structure 342 may be spaced apart from one end of the front plate 320 and the display 310 at a specified distance. ) may be spaced apart from the rear side of the display 310 (e.g., the side facing the -z-axis direction) at a specified interval, for example, a space between the frame structure 342 and the front plate 320. The speaker hole (H) may be formed or defined and connected to the speaker hole (H) through the space between the frame structure 342 and the display 310 and the plate structure 341 and the display 310. A first pipe (P1) that is in fluid communication (or fluid communication) may be formed or defined.

A second pipe (P2) connected to the first pipe (P1) may be formed in the plate structure 341. The second pipe (P2) may penetrate at least a portion of the plate structure 341 to be in fluid communication with the first pipe (P1). For example, the second pipe (P2) may extend from a portion of the plate structure 341 adjacent to the speaker module 360 toward the first pipe (P1). The second pipe (P2) may provide a passage for the sound output through the speaker module 360 to pass through the second pipe (P2) and move to the first pipe (P1). The sound output from the speaker module 360 may be moved (or emitted) to the outside of the electronic device 300 by sequentially passing through the second pipe (P2), the first pipe (P1), and the speaker hole (H). there is.

The circuit board 350 has a first side 351 facing the plate structure 341 (e.g., first side 251 in FIG. 4B) and a second side 353 facing away from the first side 351. (e.g., the second side 252 of FIG. 4B). For example, the first side 351 of the circuit board 350 faces the display 310 and the front plate 320, and the second side 353 of the circuit board 350 faces the back plate 330. You can. The first surface 351 of the circuit board 350 may face the same direction as the surface of the speaker module 360 from which sound is output. A first opening 355 (eg, opening 253 in FIG. 4B) through which the speaker module 360 is disposed may be formed in at least a portion of the circuit board 350. The first opening 355 may penetrate the first surface 351 and the second surface 353 of the circuit board 350 in a perpendicular direction. The first opening 355 may be formed to be larger than the speaker module 360 so that the circuit board 350 is spaced apart from the speaker module 360, but is not limited to this. A plurality of electronic components 397 may be disposed on the first side 351 and the second side 353 of the circuit board 350. A shield can 370 covering the plurality of electronic components 397 and the speaker module 360 may be disposed on the second surface 353 of the circuit board 350.

The circuit board 350 may be disposed on one side (eg, a side facing the -z-axis direction) of the plate structure 341. For example, the circuit board 350 may be seated on the plate structure 341 by having at least a portion of the second surface 353 contact at least a portion of the plate structure 341 . A first sealing member 393 may be disposed between the plate structure 341 and an area surrounding the edge of the first opening 355 of the second surface 353 of the circuit board 350. The first sealing member 393 seals the gap between the circuit board 350 and the plate structure 341 to prevent the sound output from the speaker module 360 from leaking between the circuit board 350 and the plate structure 341. It can be minimized or prevented. The first sealing member 393 may be formed of a material having ductility and/or elasticity to enable compression between the second surface 353 of the circuit board 350 and the plate structure 341. For example, the first sealing member 393 may include at least one of poron, sponge, rubber, silicone, and tape, but is not limited thereto.

The speaker module 360 may be electrically connected to the circuit board 350. The speaker module 360 may be disposed inside the first opening 355 of the circuit board 350 and seated on the plate structure 341. The speaker module 360 may be disposed to penetrate a portion of the circuit board 350 through the first opening 355. For example, with respect to the circuit board 350, part of the speaker module 360 may be located in the direction of the first side 351, and another part of the speaker module 360 may be located in the direction of the second side 353. there is. When the second surface 353 of the circuit board 350 is viewed from above, the speaker module 360 overlaps the first opening 355 and may be exposed to a portion of the second surface 353.

A second sealing member 394 may be disposed between the speaker module 360 and the plate structure 341. For example, the second sealing member 394 is connected to the sound radiation surface of the speaker module 360 (e.g., the side facing the +z-axis direction) and one side of the plate structure 341 (e.g., the side facing the -z-axis direction). can be placed in some areas between the sides). The second sealing member 394 seals the space between the speaker module 360 and the plate structure 341 to prevent the sound output from the speaker module 360 from leaking between the speaker module 360 and the plate structure 341. can be minimized or prevented. For example, as the space between the speaker module 360 and the plate structure 341 is sealed by the second sealing member 394, most of the sound output from the speaker module 360 is transmitted to other spaces (e.g. It may flow into the second pipe (P2) without leaking into the first opening (355) and/or the first space (C1). The material of the second sealing member 394 may be substantially the same or similar to that of the first sealing member 393.

A portion of the speaker module 360 may be covered by the shield can 370. For example, when the second side 353 of the circuit board 350 is viewed from above, the speaker module 360 includes a shield can 370 along with a plurality of electronic components 397 disposed on the second side 353. ) can be overlapped. A portion of the speaker module 360 exposed on the second surface 353 of the circuit board 350 may protrude from the second surface 353 at a predetermined height. A portion of the speaker module 360 protruding from the second surface 353 of the circuit board 350 may be covered by the shield can 370 .

The speaker module 360 is spaced apart from the shield can 370 at a certain distance, and a buffer member 395 may be disposed between the shield can 370 and the speaker module 360. The buffer member 395 can buffer the vibration of the speaker module 360 and prevent or minimize the vibration of the speaker module 360 from being transmitted to the shield can 370. The buffer member 395 may be formed of a flexible material so that it can be placed by pressing between the base portion 371 of the shield can 370 and the speaker module 360. For example, the cushioning member 395 may include at least one of poron, sponge, rubber, and silicone, but is not limited thereto.

As the speaker module 360 is accommodated inside the shield can 370, the first space C1 formed or defined by the second surface 353 of the circuit board 350 and the shield can 370 is called the speaker module. It can be provided to be used as a resonance space for the sound output from (360). The speaker module 360 may be arranged so that the sound output surface (eg, sound radiation surface) faces the plate structure 341 or the display 310. For example, the speaker module 360 may be referred to as a top speaker located at the top of the electronic device 300 and emitting sound in the front direction (eg, +z-axis direction) of the electronic device 300. However, the arrangement structure of the speaker module 360 and the shield can 370 shown in FIG. 5 is not limited to being applied to the upper speaker, and according to various embodiments, the structure shown is applied to the lower speaker of the electronic device 300. It can also be applied.

The shield can 370 may be disposed on the second surface 353 of the circuit board 350 to cover the speaker module 360 and the plurality of electronic components 397. For example, the shield can 370 is disposed on the second side 353 of the circuit board 350, and is mounted on a portion of the speaker module 360 and the second side 353 together with the circuit board 350. A first space C1 may be formed in which the plurality of electronic components 397 are accommodated. The first space C1 may refer to a space formed or defined by the second surface 353 of the circuit board 350 and the shield can 370. For example, the first space C1 may be a shielded space that is electromagnetically shielded by the shield can 370 so that it is not affected by an external electromagnetic field or an electromagnetic field generated internally does not affect the outside.

The shield can 370 has a base portion 371 (e.g., base portion 294a in FIG. 4B) and a side wall portion 373 extending from the base portion 371 (e.g., side wall portion 294b in FIG. 4B). It can be included. For example, side wall portion 373 may extend substantially perpendicularly from an edge of base portion 371. The shield can 370 may have an empty space open in one direction formed inside the base portion 371 and the side wall portion 373. The shield can 370 is circuitry such that the side wall portion 373 is supported on the second surface 353 of the circuit board 350 and the base portion 371 is spaced apart from the second surface 353 of the circuit board 350. It may be placed on the substrate 350. Each of the base portion 371 and the side wall portion 373 may include an inner surface 370b and an outer surface 370a. For example, the inner surface 370b may face the internal space (eg, first space C1) of the shield can 370, and the outer surface 370a may face the opposite of the inner space 370b. The inner surface 370b of the base portion 371 and the side wall portion 373 may form the inner surface of the shield can 370, and the outer surface 370a of the base portion 371 and the side wall portion 373 may form the shield can. The outer surface of (370) may be formed.

The shield can 370 may have a ventilation hole 375 (eg, ventilation hole 294h in FIG. 4B) formed in a portion of the shield can 370 that penetrates the shield can 370. The ventilation hole 375 may be formed open in the base portion 371 of the shield can 370. For example, the ventilation hole 375 may be formed by penetrating a portion of the base portion 371 from the inner surface 370b to the outer surface 370a. The ventilation hole 375 is for heat dissipation inside the shield can 370, and heat generated from the plurality of electronic components 397 accommodated in the first space C1 passes through the ventilation hole 375 into the shield can ( 370) It can escape to the outside (e.g., the space between the rear case 391 and the shield can 370). The ventilation hole 375 may be composed of one or more considering heat dissipation performance. In the illustrated embodiment, there are two ventilation holes 375, but this is an example and the number of vent holes 375 is not limited to the illustrated embodiment.

The shield can 370 may be configured so that the ventilation hole 375 is located at a long distance from the speaker module 360. The ventilation hole 375 may be formed in a position that does not overlap the speaker module 360 based on the direction perpendicular to the base portion 371. For example, the ventilation hole 375 may be formed in a portion of the base portion 371 that does not overlap the speaker module 360. When the outer surface 370a of the base portion 371 is viewed from above, the ventilation hole 375 does not overlap the speaker module 360, but may partially overlap the plurality of electronic components 397. The ventilation hole 375 can improve the heat dissipation effect by being located adjacent to a plurality of electronic components 397 that generate heat at a relatively high temperature. Since the ventilation hole 375 is located far away from the speaker module 360, it interacts with the hole formed in the speaker module 360 to generate partial vibration in the diaphragm of the speaker module 360 or to affect the function of the speaker module 360. Deterioration can be prevented. According to various embodiments, the ventilation hole 375 may be formed adjacent to the edge of the base portion 371 located at a long distance from the speaker module 360.

In the shield can 370, a mesh member 380 covering the ventilation hole 375 may be disposed at a position corresponding to the ventilation hole 375. For example, the mesh member 380 may be attached to the base portion 371 to cover the ventilation hole 375. The mesh member 380 may be attached to the outer surface 370a and/or the inner surface 370b of the shield can 370 so as to face the ventilation hole 375. The mesh member 380 may overlap the ventilation hole 375 based on a direction perpendicular to the base portion 371. For example, when the outer surface 370a of the base portion 371 is viewed from above, the ventilation hole 375 may entirely overlap the mesh member 380. According to the embodiment shown in FIG. 5, the mesh member 380 may be attached to the inner surface 370b of the base portion 371, and when looking at the outer surface 370a of the base portion 371, the mesh member 380 ) (e.g., ventilation sheet 381) may be exposed through the ventilation hole 375. According to the embodiment shown in FIG. 7, the mesh member 380 may be attached to the outer surface 370a of the base portion 371, and when looking at the inner surface 370b of the base portion 371, the mesh member ( A portion of 380 (eg, ventilation sheet 381) may be exposed through ventilation hole 375. According to various embodiments, the mesh member 380 may be attached to the inner surface 370b and the outer surface 370a of the shield can 370, and may partially face each other with the ventilation hole 375 interposed.

The mesh member 380 may include a ventilation sheet 381 that allows air to pass through and an adhesive sheet 383 attached to the ventilation sheet 381. The mesh member 380 may be attached to the shield can 370 through an adhesive sheet 383. The ventilation sheet 381 may be formed of a material that is permeable to air so that heat in the first space C1 can pass through the ventilation sheet 381 and the ventilation hole 375 and be discharged to the outside of the shield can 370. You can. For example, the ventilation sheet 381 may be a mesh member or mesh structure in which a plurality of holes are formed. The adhesive sheet 383 may be disposed between the ventilation sheet 381 and the shield can 370 and attached to the shield can 370. For example, the adhesive sheet 383 may be a double-sided tape with adhesive strength on both sides, and the ventilation sheet 381 may be attached to one side and the other side may be attached to the shield can 370. An opening 383h that overlaps the ventilation hole 375 may be formed in the adhesive sheet 383. The opening 383h of the adhesive sheet 383 may be aligned in a direction perpendicular to the ventilation hole 375 and the base portion 371. For example, the opening 383h of the adhesive sheet 383 may be connected (or in fluid communication) with the ventilation hole 375.

The mesh member 380 may include a conductive material in consideration of the electromagnetic wave shielding function of the shield can 370. The mesh member 380 may be formed of a conductive material to prevent or minimize the ventilation hole 375 formed in the shield can 370 from affecting the shielding function of the shield can 370. For example, the adhesive sheet 383 may be formed of a conductive adhesive, a conductive adhesive tape, or a conductive double-faced tape. For example, the ventilation sheet 381 may be a metal mesh or a fabric made of conductive fiber. However, the type and/or material of the adhesive sheet 383 and the ventilation sheet 381 are not limited to the above-described examples, and may be provided using various conductive materials.

The rear case 391 may be disposed between the rear plate 330 and the plate structure 341. The rear case 391 may face the plate structure 341 with the circuit board 350 interposed therebetween. The rear case 391 may support the circuit board 350. According to various embodiments, the electronic device 300 may not include the rear case 391.

According to the illustrated embodiment, a portion of the speaker module 360 may be accommodated inside the shield can 370 along with a plurality of electronic components 397. A ventilation hole 375 is formed in the shield can 370, and the first space C1 defined by the shield can 370 and the circuit board 350 can be used as a resonance space for the speaker module 360. . The air contained within the first space (C1) may vibrate due to vibration occurring in the process of outputting sound by the speaker module 360, and accordingly, the flow or flow of air within the first space (C1) This may occur. The flow of air generated in the first space C1 may increase the diffusion of heat within the first space C1, and thus the heat dissipation performance inside the shield can 370 may be improved.

According to the illustrated embodiment, the larger the shield can 370, the larger the first space C1, so that a large resonance space can be secured and the performance of the speaker module 360 can be improved. When the size of the shield can 370 increases, many electronic components 397 are placed inside the shield can 370, and the temperature inside the shield can 370 may increase due to the heat generated from the electronic components 397. . The electronic device 300 according to an embodiment disclosed in this document is a resonance space of the speaker module 360 through a shield can 370 with a ventilation hole 375 and a mesh member 380 covering the ventilation hole 375. It is possible to significantly secure and improve heat dissipation performance.

8A is a cross-sectional view of an electronic device according to an embodiment. Figure 8b is a cross-sectional view of an electronic device according to one embodiment.

8A and 8B, the electronic device 300 according to one embodiment includes a front plate 320, a display 310, a rear plate 330, a circuit board 350, a speaker module 360, It may include a shield can 370, a mesh member 380, and a heat dissipation member 396. Side member 340 may include a frame structure 342 and a plate structure 341. The shield can 370 may include a base portion 371 and a side wall portion 373. The mesh member 380 may include a ventilation sheet 381 and an adhesive sheet 383.

FIGS. 8A and 8B are diagrams of an embodiment in which a heat dissipation member 396 is additionally included in the electronic device 300 shown in FIG. 5 . At least some of the components of the electronic device 300 shown in FIGS. 8A and 8B may be the same or similar to the components of the electronic device 200 shown in FIG. 5, and duplicate descriptions will be omitted below. , the description will focus on the heat dissipation member 396, which is an added component.

The circuit board 350 has a first surface 351 facing the same direction as the sound output surface of the speaker module 360 and a second surface facing opposite to the first surface 351 and on which the shield can 370 is disposed. It may include cotton 353. A plurality of electronic components 397 may be disposed (or mounted) on each of the first side 351 and the second side 353 of the circuit board 350. The plurality of electronic components 397 may include a heating component 398 disposed on the second surface 353 of the circuit board 350. The heating component (or heating element) 398 may refer to a component that is the main heat source among the plurality of electronic components 397, and may be connected to other electronic components 397 excluding the heating component 398. This does not mean there is no fever. For example, the heat-generating component 398 may be a component that generates heat at a relatively high temperature among the plurality of electronic components 397.

Heating component 398 may include one or more components and may generate heat along with current consumption. For example, the heating component 398 may be an application processor (AP) (e.g., the processor 120 of FIG. 1), a power management integrated circuit (PMIC) (e.g., the power management module of FIG. 1), (188)) and a communication module responsible for communication with an external device (e.g., the communication module 190 of FIG. 1). However, the heating component 398 is not limited to the above-described examples and may further include other components according to various embodiments. The heating component 398 may be composed of an IC chip or chipset.

The heat dissipation member 396 may be disposed between the heating component 398 and the shield can 370. For example, the heat dissipation member 396 may be disposed between the base portion 371 of the shield can 370 and the heating component 398. The heat dissipation member 396 may contact the heating component 398 and the shield can 370, respectively. For example, the heat dissipation member 396 may contact the inner surface 370b of the base portion 371 and the heating component 398. The heat dissipation member 396 may be in contact with the shield can 370 and the heat generating component 398 on both sides to enable thermal conduction between the heating component 398 and the shield can 370. In the illustrated embodiment, the heat dissipating member 396 may be located between the ventilation hole 375 and/or the mesh member 380, but this is an example and the position of the heat dissipating member 396 is as shown in the illustrated embodiment. It is not limited.

The heat dissipation member 396 may receive heat generated from the heating component 398. The heat dissipation member 396 may transfer heat generated from the heating component 398 to the shield can 370. The heat dissipation member 396 may have higher thermal conductivity (or thermal conductivity) than the air contained in the gap between the shield can 370 and the heating component 398. For example, as the heat dissipation member 396 is disposed between the shield can 370 and the heating component 398, the amount of heat transferred from the heating component 398 to the shield can 370 can be increased. The heat dissipation member 396 may include various types of thermal interface material (TIM) or heat transfer material. For example, the heat dissipation member 396 may be provided in the form of adhesive, tape, pad, grease, gel, or liquid.

According to the embodiment shown in FIG. 8A, the heat dissipation member 396 is formed in the form of a tape, sheet, or pad, and may be disposed between the base portion 371 of the shield can 370 and the heating component 398. In this case, the heat dissipation member 396 is disposed on any one of the shield can 370 and the heating component 398, and as the shield can 370 is assembled to the circuit board 350, the heating component 398 and the shield The can 370 may be contacted.

According to the embodiment shown in FIG. 8B, the heat dissipation member 396 may be formed in the form of a liquid having a predetermined viscosity. When the heat dissipation member 396 is made of liquid, a hole 377 for injecting the liquid heat dissipation member 396 may be formed in the shield can 370. The hole 377 may be formed in a portion of the base portion 371 to face the heating component 398. For example, the liquid heat dissipation member 396 is injected through the hole 377 while the plurality of electronic components 397 and the shield can 370 are assembled (or combined) on the circuit board 350, It may be disposed between the base portion 371 and the heating part 398. Although not shown, according to various embodiments, the mesh member 380 covering the ventilation hole 375 may also be added at a position covering the hole 377 for injecting the heat dissipation member 396.

According to the embodiment shown in FIGS. 8A and 8B, the ventilation hole 375 is formed in the shield can 370 and the heat dissipation member 396 is added between the shield can 370 and the heating component 398. The effect of improving heat dissipation performance can be increased.

9 is a cross-sectional view of an electronic device according to an embodiment.

Referring to FIG. 9, the electronic device 300 according to one embodiment includes a front plate 320, a display 310, a rear plate 330, a circuit board 350, a speaker module 360, and a shield can ( 370), a mesh member 380, and a plurality of electronic components 397. Side member 340 may include a frame structure 342 and a plate structure 341.

FIG. 9 is a diagram of an embodiment in which the positions of the ventilation hole 375 and the mesh member 380 in the electronic device 300 shown in FIG. 5 are changed. At least some of the components of the electronic device 300 shown in FIG. 9 may be the same or similar to the components of the electronic device 200 shown in FIG. 5, and redundant description will be omitted below, and the changed contents will be described below. The explanation is centered on .

The shield can 370 may include a base portion 371 and a side wall portion 373. The shield can 370 may have a ventilation hole 375 formed in the side wall portion 373. For example, the ventilation hole 375 may be formed open in the side wall portion 373 of the shield can 370. The ventilation hole 375 may be formed by penetrating a portion of the side wall portion 373 from the inner surface 370b to the outer surface 370a. The ventilation hole 375 may be formed in a side wall portion 373 of the shield can 370 located at a relatively long distance from the speaker module 360.

A mesh member 380 may be disposed on the side wall portion 373 where the ventilation hole 375 is formed. The mesh member 380 includes an adhesive sheet 383 and a ventilation sheet 381, and may be attached to the side wall portion 373 through the adhesive sheet 383. The mesh member 380 may cover the ventilation hole 375. For example, the mesh member 380 may be attached to the outer surface 370a of the side wall portion 373 so as to face the ventilation hole 375. However, it is not limited to the illustrated embodiment, and the mesh member 380 may be attached to the inner surface of the side wall portion 373.

10A is a cross-sectional view of an electronic device according to an embodiment. 10B is a cross-sectional view of an electronic device according to an embodiment.

10A and 10B, the electronic device 300 according to an embodiment includes a front plate 320, a display 310, a rear plate 330, a circuit board 350, a speaker module 360, It may include a first shield can 370-1 (e.g., shield can 370 in FIG. 5), a second shield can 370-2, a mesh member 380, and a plurality of electronic components 397. there is. Side member 340 may include a frame structure 342 and a plate structure 341. The mesh member 380 may include a ventilation sheet 381 and an adhesive sheet 383.

FIGS. 10A and 10B are diagrams of an embodiment in which a second shield can 370-2 disposed on the first surface 351 of the circuit board 350 is added to the electronic device 300 shown in FIG. 5. am. At least some of the components of the electronic device 300 shown in FIGS. 10A and 10B may be the same or similar to the components of the electronic device 200 shown in FIG. 5, and redundant description will be omitted below. , the description will focus on the second shield can 370-2, which is an added component.

The circuit board 350 may include a first side 351 facing toward the display 310 and a second side 353 facing away from the first side 351 . A first opening 355 and a second opening 357 may be formed in a portion of the circuit board 350. A speaker module 360 may be disposed inside the first opening 355. The second opening 357 connects the first space C1 between the first shield can 370-1 and the second surface 353 to the space between the second shield can 370-2 and the first surface 351. It can be connected (or in fluid communication) to the second space C2. For example, the first opening 355 may be covered by the first shield can 370-1, and the second opening 357 may be covered by the first shield can 370-1 and the second shield can 370-1. 2) can be covered by. The first opening 355 is not covered by the second shield can 370-2. When the second side 353 of the circuit board 350 is viewed from above, the first opening 355 overlaps the first shield can 370-1, but does not overlap the second shield can 370-2. and the second opening 357 may overlap both the first shield can 370-1 and the second shield can 370-2. The second opening 357 may be smaller than the first opening 355, but is not limited thereto.

The shield can 370 includes a first shield can 370-1 disposed on the second side 353 of the circuit board 350 and a second shield can disposed on the first side 351 of the circuit board 350. May include (370-2). The first shield can 370-1 may cover a portion of the plurality of electronic components 397 disposed on the second surface 353 and a portion of the speaker module 360. The second shield can 370-2 may cover some of the plurality of electronic components 397 disposed on the first surface 351. The first shield can 370-1 may cover the first opening 355 and the second opening 357 formed in the circuit board 350. The second shield can 370-2 may cover the second opening 357 formed in the circuit board 350. The first shield can 370-1 may be formed to have a larger size than the second shield can 370-2, but is not limited thereto.

As the first shield can 370-1 is disposed on the second surface 353 of the circuit board 350, it is mounted on a portion of the speaker module 360 and the second surface 353 together with the circuit board 350. A first space C1 may be formed in which the plurality of electronic components 397 are accommodated. The first space C1 may refer to a space formed or defined by the second surface 353 of the circuit board 350 and the first shield can 370-1. As the second shield can 370-2 is disposed on the first surface 351 of the circuit board 350, a plurality of electronic components 397 are mounted on the first surface 351 together with the circuit board 350. ) may form a second space (C2) in which the space is accommodated. The second space C2 may refer to a space formed or defined by the first surface 351 of the circuit board 350 and the second shield can 370-2. The first space C1 and the second space C2 may be connected (or in fluid communication) through the second opening 357 of the circuit board 350.

The first shield can 370-1 and the second shield can 370-2 may include a base portion 371 and a side wall portion 373 extending from the base portion 371, respectively. One or more ventilation holes 375 may be formed in the first shield can 370-1 and the second shield can 370-2, and a mesh member 380 may be disposed to cover the one or more ventilation holes 375. It can be. According to the embodiment shown in FIG. 10A, two ventilation holes 375 are formed in the base portion 371 of the first shield can 370-1, and the base portion of the second shield can 370-2 ( One ventilation hole 375 may be formed in 371, and the mesh member 380 may cover each ventilation hole 375. According to the embodiment shown in Figure 10b, two ventilation holes 375 are formed in the base portion 371 of the first shield can 370-1, and the base portion of the second shield can 370-2 ( One ventilation hole 375 may be formed in 371), one ventilation hole 375 may be formed in the side wall portion 373 of the first shield can 370-1, and the mesh members 380 may each be The ventilation hole 375 can be covered. 10A and 10B are exemplary, and the number and/or location of the ventilation holes 375 are not limited to the illustrated embodiment and may change according to various embodiments.

According to the embodiment shown in FIGS. 10A and 10B, part of the speaker module 360 may be accommodated inside the first shield can 370-1 along with a plurality of electronic components 397. A ventilation hole 375 is formed in the first shield can 370-1 and the second shield can 370-2, and the first shield can 370-1 and the circuit board 350 define the first shield can 370-1 and the second shield can 370-2. The space C1 and the second space C2 defined by the second shield can 370-2 and the circuit board 350 are connected through the second opening 357 and are connected to the resonance space of the speaker module 360. It can be utilized. The air contained within the first space (C1) and the second space (C2) may vibrate due to vibration generated in the process of outputting sound by the speaker module 360, and accordingly, the first space (C1) A flow or flow of air may occur inside the second space C2. The flow of air generated in the first space (C1) and the second space (C2) can increase the diffusion of heat within the first space (C1) and the second space (C2), and accordingly, the first shield can ( Heat dissipation performance inside the 370-1) and the second shield can 370-2 can be improved.

According to the embodiment shown in FIGS. 10A and 10B, when compared to the embodiment including only the first shield can 370-1 (e.g., the embodiment of FIGS. 5, 8A, 8B, and 9), the Since the resonance space of the speaker module 360 can be designed to be larger through the first space (C1) and the second space (C2), the effect of improving the sound quality and/or volume of the sound output from the speaker module 360 can be increased. You can.

11 is a graph showing heat dissipation performance of an electronic device according to an embodiment.

The first graph 1101 of FIG. 11 is a graph showing the heat dissipation performance of an electronic device (e.g., the electronic device 300 of FIG. 5) according to an embodiment of the present invention. ), the speaker module 360 is accommodated inside the shield can 370, and a ventilation hole 375 may be formed in the shield can 370.

The second graph 1102 of FIG. 11 is a graph showing the heat dissipation performance of an electronic device according to a comparative example. Unlike the electronic device 300 according to an embodiment, the electronic device according to the comparative example has a speaker module 360. ) is accommodated inside the shield can 370, but the ventilation hole 375 may not be formed in the shield can 370.

The first graph 1101 and the second graph 1102 of FIG. 11 show that the electronic device 300 according to an embodiment and the electronic device according to the comparative example are under substantially the same ambient conditions (e.g., temperature). , This is a graph showing the maximum and average temperature changes over time when running the same application with the same screen brightness and the same speaker volume. The temperature shown by the first graph 1101 and the second graph 1102 may be the temperature of a portion of the electronic device adjacent to the main heat source (eg, the heat generating component 398 in FIGS. 8A and 8B).

Referring to FIG. 11, it can be seen that the heat dissipation performance of the electronic device 300 according to one embodiment is improved compared to the electronic device according to the comparative example as the ventilation hole 375 is formed in the shield can 370. For example, the maximum temperature and average temperature of the area where the heat source is located in the electronic device according to the embodiment may be lower than the maximum temperature and average temperature of the area where the heat source is located in the electronic device according to the comparative example.

Electronic devices require the design of an appropriate resonance space of the speaker module in relation to the sound quality and/or volume of the speaker module. The electronic device may be provided with a structure that utilizes the internal space of a shield can placed on a circuit board to shield electrical noise as a resonance space for a speaker module. For example, a speaker module can be accommodated in the inner space of a shield can along with other electronic components, and the space formed by the circuit board and the shield can can be used as a resonance space for the speaker module. If a speaker module and a plurality of electronic components are accommodated inside the shield can, the temperature inside the shield can increases and the heat generation of the electronic device may become severe.

Embodiments disclosed in this document are intended to provide an electronic device that can improve heat dissipation performance by forming a ventilation hole in the shield can in a structure that secures a resonance space by mounting the speaker module inside the shield can.

The electronic device 300 according to embodiments disclosed in this document includes housings 320, 330, and 340; A circuit board 350 disposed inside the housing 320, 330, 340 and including a first side 351 and a second side 353 opposite the first side, the circuit board 350 At least one electronic component 397 is disposed on the first surface 351 and the second surface 353; a speaker module 360 disposed inside the first opening 355 formed in the circuit board 350 so as to be surrounded by the circuit board 350; and a first shield disposed on the second surface 353 of the circuit board 350 and covering the speaker module 360 and the at least one electronic component 397 disposed on the second surface 353. Can (shield can) (370; 370-1); One or more ventilation holes 375 may be formed in the first shield can 370 (370-1), and a mesh member 380 may be disposed to cover the ventilation holes 375.

In various embodiments, the electronic device 300 may further include a display 310 disposed inside the housings 320, 330, and 340. The first side 351 of the circuit board 350 may face the display 310. The speaker module 360 may be configured to output sound in a direction toward the display 310.

In various embodiments, the first shield can 370 (370-1) has a base portion 371 facing the second surface 353 of the circuit board 350 and a base portion 371 facing the second surface 353 of the circuit board 350. It may include a side wall portion 373 extending to the second surface 353. The ventilation hole 375 may be formed in at least one of the base portion 371 and the side wall portion 373.

In various embodiments, the ventilation hole 375 may be formed in a position that does not overlap the speaker module 360 based on the direction perpendicular to the circuit board 350.

In various embodiments, the mesh member 380 may at least partially include a conductive material.

In various embodiments, the mesh member 380 may include a ventilation sheet 381 made of a conductive material and an adhesive sheet 383 attached to the ventilation sheet 381 and made of a conductive material. The adhesive sheet 383 is attached to the first shield can 370 (370-1), and a through hole 383h connected to the ventilation hole 375 is formed in a portion of the adhesive sheet 383. You can.

In various embodiments, the at least one electronic component 397 may include a heating component 398. The electronic device 300 may further include a heat dissipation member 396 disposed between the heating component 398 and the first shield can 370 (370-1).

In various embodiments, the second surface 353 of the circuit board 350 and the first shield can 370 (370-1) may form a first space C1. The first space C1 may define a resonance space of the speaker module 360.

In various embodiments, the first space C1 may be used as a resonance space of the speaker module 360, and the resonance space may be a back volume.

In various embodiments, the electronic device 300 is disposed on the first surface 351 of the circuit board 350 and includes the at least one electronic component 397 disposed on the first surface 351. It may further include a second shield can (370-2) covering it. A second opening 357 may be formed in the circuit board 350 and spaced apart from the first opening 355. The second opening 357 may be covered by the first shield can (370; 370-1) and the second shield can (370-2).

In various embodiments, the first surface 351 of the circuit board 350 and the second shield can 370-2 may form a second space C2. The second opening 357 may connect the first space C1 and the second space C2. The first space (C1) and the second space (C2) may define a resonance space of the speaker module 360.

In various embodiments, the first space C1 and the second space C2 may be used as a resonance space of the speaker module 360, and the resonance space may be a back volume.

In various embodiments, one or more ventilation holes 375 may be formed in the second shield can 370-2, and a mesh member 380 may be disposed to cover the ventilation holes 375. The mesh member 380 may at least partially include a conductive material.

The electronic device according to embodiments disclosed in this document can improve the sound quality/volume of the speaker module by utilizing the internal space of the shield can as a resonance space of the speaker module, and can improve the sound quality/volume of the speaker module through the ventilation hole formed in the shield can. Heat can be easily diffused.

Additionally, the electronic device according to the embodiment disclosed in this document may not interfere with the shielding function of the shield can by covering the ventilation hole formed in the shield can with a mesh member made of a conductive material.

In addition, various effects that can be directly or indirectly identified through this document may be provided.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to those components in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play Store ^™ ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. . According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Claims (10)

In the electronic device 300,
housing (320, 330, 340);
A circuit board 350 disposed inside the housing 320, 330, 340 and including a first side 351 and a second side 353 opposite the first side, the circuit board 350 At least one electronic component 397 is disposed on the first surface 351 and the second surface 353;
a speaker module 360 disposed inside the first opening 355 formed in the circuit board 350 so as to be surrounded by the circuit board 350; and
A first shield can disposed on the second surface 353 of the circuit board 350 and covering the speaker module 360 and the at least one electronic component 397 disposed on the second surface 353. (shield can)(370; 370-1);
An electronic device in which one or more ventilation holes 375 are formed in the first shield can (370; 370-1), and a mesh member 380 is disposed to cover the ventilation holes 375. In claim 1,
It further includes a display 310 disposed inside the housing 320, 330, 340,
The first side 351 of the circuit board 350 faces the display 310,
The speaker module 360 is configured to output sound in a direction toward the display 310. In claim 1 or claim 2,
The first shield can (370; 370-1) is,
It includes a base portion 371 facing the second surface 353 of the circuit board 350 and a side wall portion 373 extending from the base portion 371 to the second surface 353,
The ventilation hole 375 is formed in at least one of the base portion 371 and the side wall portion 373. The method according to any one of claims 1 to 3,
The ventilation hole 375 is,
An electronic device formed at a position that does not overlap with the speaker module 360 based on a direction perpendicular to the circuit board 350. The method according to any one of claims 1 to 4,
The mesh member 380 includes at least partially a conductive material. The method according to any one of claims 1 to 5,
The mesh member 380 is,
It includes a ventilation sheet 381 made of a conductive material and an adhesive sheet 383 attached to the ventilation sheet 381 and made of a conductive material,
The adhesive sheet 383 is attached to the first shield can 370 (370-1), and a through hole 383h connected to the ventilation hole 375 is formed in a portion of the adhesive sheet 383. , electronic devices. The method according to any one of claims 1 to 6,
The second surface 353 of the circuit board 350 and the first shield can 370 (370-1) form a first space C1,
The first space C1 defines a resonance space of the speaker module 360. In claim 7,
a second shield can 370-2 disposed on the first surface 351 of the circuit board 350 and covering the at least one electronic component 397 disposed on the first surface 351; Contains more,
A second opening 357 is formed in the circuit board 350 and is spaced apart from the first opening 355,
The second opening (357) is covered by the first shield can (370; 370-1) and the second shield can (370-2). In claim 1,
The first surface 351 of the circuit board 350 and the second shield can 370-2 form a second space C2,
The second opening 357 connects the first space C1 and the second space C2,
The first space (C1) and the second space (C2) define a resonance space of the speaker module 360. In claim 8 or claim 9,
In the second shield can (370-2),
One or more ventilation holes 375 are formed, and a mesh member 380 is disposed to cover the ventilation holes 375,
The mesh member 380 includes at least partially a conductive material.

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