KR20240047023A - Deposition Apparatus - Google Patents

Abstract

A deposition apparatus is started. The deposition apparatus according to the present invention has a heating space into which source gas flows, a process chamber that is loaded on a tray and performs a deposition process on a deposition object located in the heating space, and is connected to the process chamber. It includes a heating part that heats the heating space of the process chamber, and a transfer part that is connected to the process chamber and transports the tray, and the tray can stir the loaded deposition object.

Description

Deposition Apparatus

The present invention relates to a deposition apparatus, and more specifically, to a deposition apparatus capable of coating carbon with a coating material on a deposition object.

Secondary cells, which are used in electric vehicles (EV) or energy storage systems (ESS), which have recently been in the spotlight, generally convert chemical energy into electrical energy to provide power to external circuits. It refers to a battery that can store electricity by converting electrical energy into chemical energy by receiving external power when discharged. Such secondary batteries are also commonly called capacitors.

Among these secondary batteries, the electrode process for manufacturing electrodes for lithium-ion secondary batteries is a process of attaching positive and negative electrode materials to aluminum and copper foil electrode plates, respectively, and is subdivided into mixing, coating & drying, rolling, slitting, and vacuum drying processes. can do.

Here, as a method of producing a negative electrode material to improve the performance of a lithium ion secondary battery, a method of coating carbon (C) on a negative electrode active material (powder state) can be used.

There are several methods for coating carbon (C) in this way. One of the methods is using a source gas containing carbon (C) and hydrogen (H), such as methane (CH4) and ethylene. When a source gas such as (C2H4) or acetylene (C2H2) is introduced into the chamber where the deposition object is placed and high temperature heat is applied to reach a temperature where the molecules are decomposed, carbon (C) among the decomposed molecules is converted to the deposition material. It can be selectively coated on a desired deposition target.

This method is done by heating the specific material used as the source gas from the temperature at which it thermally decomposes to the temperature at which the material breaks down into molecules. In this case, as a way to reduce the temperature, if the atmospheric pressure is lowered and a vacuum is created, the thermal decomposition reaction temperature is lowered. It is advantageous because it is lower.

At this time, in coating or depositing the pyrolyzed material, appropriate temperature and pressure control is important, but controlling the flow direction of the source gas in the chamber and controlling the flow amount of the deposition material according to the flow direction is important to ensure that the deposition material is Since it helps to react uniformly across the entire reaction area, it can be an important goal for optimizing the deposition process to increase reaction efficiency and deposit more efficiently.

Figure 1 schematically shows the flow direction (a) of the deposition material flowing inside the chamber along the horizontal direction and the flow direction (b) of the deposition material flowing inside the chamber along the vertical direction in a conventional deposition apparatus. It is a drawing.

In a conventional deposition apparatus, as shown in (a) of FIG. 1, in the supply of source gas, a tray (S) containing the deposition material is moved from one side of the chamber (1) to the opposite side based on the horizontal Use the moving method. This conventional method has the problem that coating efficiency is low because the reaction occurs only on the upper surface of the deposition material.

In addition, as shown in (b) of FIG. 1, a method of dispersing and supplying the source gas through the injection device 2 over a large area was used in the past for mass deposition. This method was used for deposition in powder form. This is a method in which a reaction occurs through diffusion of the source gas while the material is at rest. In this case, since the depth to which the source gas spreads is limited depending on the loading height of the deposition material, a large amount of deposition material cannot be coated, which reduces productivity.

Republic of Korea Patent No. 10-1016021, (2011.02.23.)

The problem to be solved by the present invention is to provide a deposition apparatus that can increase productivity by performing a deposition process on a large amount of deposition objects.

According to one aspect of the present invention, a process chamber is formed inside a heating space into which a source gas flows, and is loaded on a tray and performs a deposition process on a deposition object located in the heating space; a heating unit connected to the process chamber and heating the heating space of the process chamber; and a transfer unit connected to the process chamber and transporting the tray, wherein the tray is capable of stirring the deposited object.

The tray includes a base portion connected to the transfer unit; a flange part coupled to the base part and forming a loading space in which the deposition object is loaded; a rotating shaft for stirring rotatably coupled to the base; And it is coupled to the rotating shaft for stirring, and may include a stirring part for stirring the deposition target.

A plurality of stirring units may be provided, and the plurality of stirring units may be arranged to be radially spaced apart from each other based on the rotating shaft for stirring.

The stirring unit includes a connecting rod coupled to the rotating shaft for stirring; and a stirring blade connected to the connecting rod and in contact with the deposition target.

The stirring blade includes a horizontal plate coupled to the connecting rod; And it may include an inclined plate connected to the horizontal plate and disposed in a diagonal direction.

The stirring blades of each of the plurality of stirring units may be positioned at different positions based on the stirring rotation shaft unit.

The stirring blades of each of the plurality of stirring units may have different viewing directions depending on the difference in distance from the stirring rotation shaft unit.

Among the plurality of stirring units, the inclined plate disposed at a position closer to the flange than the stirring rotation shaft is such that an edge closer to the flange is positioned forward in the rotation direction than an edge closer to the stirring rotation shaft. can be placed.

Among the plurality of stirring units, the inclined plate disposed at a position closer to the rotation shaft for stirring than the flange portion has an edge closer to the rotation shaft for stirring positioned forward in the direction of rotation than an edge closer to the flange portion. can be placed.

It may further include a rotation drive unit connected to the stirring rotation shaft unit to rotate the stirring rotation shaft unit.

The tray includes a base portion connected to the transfer unit; a flange part coupled to the base part and forming a loading space in which the deposition object is loaded; a rotating shaft for stirring rotatably coupled to the flange; And it is coupled to the rotating shaft for stirring, and may include a stirring part for stirring the deposition target.

The stirring unit may include a stirring blade that is in contact with the deposition target and is bent in a spiral shape.

It is connected to the transfer unit to receive driving force, and may further include a rotation drive unit connected to the stirring rotation shaft unit to rotate the stirring rotation shaft unit.

A front-end buffer chamber connected to the process chamber and maintaining its interior in a vacuum state;

A load lock chamber connected to the front buffer chamber and converted into an atmospheric pressure state and a vacuum state; a rear buffer chamber connected to the process chamber and maintaining the interior in a vacuum state; And it is connected to the rear buffer chamber and may further include an unload lock chamber whose interior is converted into an atmospheric pressure state and a vacuum state.

In an embodiment of the present invention, by providing a tray capable of stirring the loaded deposition object, a deposition process can be performed on a large amount of deposition objects, thereby increasing productivity.

Figure 1 schematically shows the flow direction (a) of the deposition material flowing inside the chamber along the horizontal direction and the flow direction (b) of the deposition material flowing inside the chamber along the vertical direction in a conventional deposition apparatus. It is a drawing.
Figure 2 is a plan view showing a deposition apparatus according to a first embodiment of the present invention.
FIG. 3 is a cross-sectional view taken along line AA of FIG. 2.
FIG. 4 is a cross-sectional view taken along line BB of FIG. 2.
Figure 5 is a plan view showing the tray of Figure 3.
Figure 6 is an enlarged view of the stirring part of Figure 5.
Figure 7 is a cross-sectional view of a tray of a deposition apparatus according to a second embodiment of the present invention.
Figure 8 is a plan view showing a deposition apparatus according to a third embodiment of the present invention.
Figure 9 is a plan view showing a deposition apparatus according to a fourth embodiment of the present invention.
FIG. 10 is a cross-sectional view taken along line CC of FIG. 9.
FIG. 11 is a diagram illustrating a rotation driving unit provided in the deposition apparatus of FIG. 9.

In order to fully understand the present invention, its operational advantages, and the objectives achieved by practicing the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. However, in explaining the present invention, descriptions of already known functions or configurations will be omitted to make the gist of the present invention clear.

FIG. 2 is a plan view showing a deposition apparatus according to a first embodiment of the present invention, FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2, and FIG. 4 is a cross-sectional view taken along line B-B of FIG. 2. This is a drawing, and Figure 5 is a plan view showing the tray of Figure 3. Figure 6 is an enlarged view of the stirring part of Figure 5.

As shown in FIGS. 2 to 6, the deposition apparatus according to this embodiment includes a process chamber 110, heating units 120a and 120b, a terminal block unit 130, an auxiliary chamber 140, and a transfer unit 150. ), a tray 170, a rotation driver 180, a front buffer chamber (PBC), a load lock chamber (LLC), a rear buffer chamber (BBC), an unload lock chamber (ULC), and a gate valve (G).

A heating space M into which source gas flows is formed inside the process chamber 110. This process chamber 110 performs a deposition process on a deposition target (not shown) located in the heating space (M).

The deposition target (not shown) is placed in the tray 170 and passes through the inside of the process chamber 110, the front buffer chamber (PBC), the load lock chamber (LLC), the back buffer chamber (BBC), and the unload lock chamber (ULC). do.

In this embodiment, the deposition target is a silicon cathode material. Silicon anode materials may include silicon oxide (SiOx) series, silicon carbon (Si/C) series, and silicon carbide (SiC or porous Si or porous Carbon) series. This deposition object is in powder form.

The deposition process performed inside the process chamber 110 is a process in which carbon is coated on a silicon anode material, and gases such as acetylene, ethylene, and methane may be used as the source gas.

As shown in FIGS. 2 to 4, the process chamber 110 according to this embodiment includes a chamber body 111 for the process chamber having a hollow interior, and a chamber body 111 for the process chamber. It is disposed inside and includes an insulating portion 112 that forms a heating space (M).

The chamber body portion 111 for the process chamber is formed in the shape of a square box with a hollow interior. The chamber body portion 111 for the process chamber is connected to a source gas supply unit (not shown) disposed externally.

The insulation portion 112 is disposed inside the chamber body portion 111 for the process chamber. This insulation portion 112 forms a heating space (M).

As shown in FIGS. 3 and 4, in the heat insulating portion 112 according to this embodiment, a flow pipe 113 for source gas is formed that communicates with the heating space M and through which the source gas flows. The source gas supplied from the source gas supply unit (not shown) flows into the heating space (M) through the source gas flow pipe 113. In addition, an empty space in which the rotation drive unit 180 can be placed is formed in the heat insulating part 112.

Additionally, the insulation unit 112 of this embodiment may be formed by combining a plurality of unit insulation units 112 with each other. This unit insulation unit 112 may be made of an insulation block made of ceramic material.

In this way, the deposition apparatus according to this embodiment can block heat loss inside the process chamber 110 by providing a heating space M formed by the insulation portion 112, thereby increasing thermal efficiency. There is an advantage.

Additionally, a vacuum pump (not shown) is connected to the process chamber 110 to create a vacuum atmosphere in the heating space M. In this way, by forming the heating space M of the process chamber 110 into a vacuum atmosphere, the reaction temperature for thermal decomposition can be lowered according to the ideal gas law (PV = nRT). As the reaction temperature can be lowered in this way, the process is possible at a low temperature relatively lower than atmospheric pressure. At this time, in coating the pyrolyzed material, the reaction efficiency can be optimized by adjusting the appropriate temperature, pressure, and gas flow in the heating space (M), depending on the type of source gas. Additionally, because it is in a vacuum state, the oxygen concentration can be lowered and the risk of fire can be prevented.

Heating units 120a and 120b are connected to the process chamber 110. These heating units 120a and 120b heat the heating space M of the process chamber 110.

The heating units 120a and 120b according to the present embodiment are arranged to be spaced apart from the upper heater 120a, which is located in the upper region of the deposition target, as shown in FIGS. 3 and 4. and includes a lower heater 120b located in the lower area of the deposition target.

As shown in FIG. 4, the upper heater 120a and the lower heater 120b are each formed in plural numbers and arranged to be spaced apart from each other in the left and right direction (X-axis direction) of FIG. 4.

In this embodiment, the upper heater 120a and the lower heater 120b each receive power and emit heat. At least a portion of each of the upper heater 120a and the lower heater 120b is exposed to the heating space M.

A deposition object is loaded on the tray 170. The tray 170 according to this embodiment can stir the loaded deposition object. In this way, the deposition apparatus according to this embodiment can mix the loaded deposition objects by stirring them. Therefore, the tray 170 according to this embodiment can coat a large amount of deposition material at once by increasing the depth at which the source gas spreads to the loaded deposition object, thereby increasing productivity.

As shown in FIGS. 3, 4, 5, and 6, this tray 170 has a base portion 171 connected to the transfer unit, and a loading space coupled to the base portion 171 where the deposition object is loaded. A flange portion 172 forming (H), a rotating shaft portion 173 for stirring rotatably coupled to the base portion 171, and a stirring portion coupled to the rotating shaft portion 173 for stirring and stirring the deposition target. Includes (174).

The base portion 171 is connected to the transfer unit and supported on the transfer unit. This base portion 171 is formed in a square plate shape.

The flange portion 172 is coupled to the upper surface of the base portion 171. This flange portion 172 is formed in a circular ring shape, and forms a loading space H in which the deposition object is loaded.

The rotating shaft portion 173 for stirring is rotatably coupled to the base portion 171. This stirring rotation shaft unit 173 is connected to the rotation drive unit 180 and receives rotational force.

The stirring unit 174 is coupled to the rotating shaft unit 173 for stirring. This stirring unit 174 stirs the deposition target. As shown in FIGS. 5 and 6, the stirring unit 174 according to the present embodiment is connected to a connecting rod 175 coupled to the rotating shaft unit 173 for stirring, and is connected to the connecting rod 175 and is connected to the deposition target. It includes a stirring blade 176 that is in contact with.

In this embodiment, a plurality of stirring units 174 are provided. As shown in FIG. 5 , the plurality of stirring units 174 are arranged to be radially spaced apart from each other based on the rotating shaft unit 173 for stirring.

In addition, as shown in FIG. 5, the stirring blades 176 of each of the plurality of stirring units 174 are positioned at different positions based on the rotating shaft unit 173 for stirring. Therefore, as shown in FIG. 5, each of the four connecting rods 175 may have different lengths.

In this way, the stirring blades 176 are positioned at different positions based on the stirring rotation shaft unit 173, so that the deposition object can be moved almost entirely according to the rotation of the stirring unit 174.

As shown in FIGS. 5 and 6, the stirring blade 176 includes a horizontal plate (P) coupled to the connecting rod 175, and an inclined plate (P) connected to the horizontal plate (P) and disposed diagonally. Includes Q).

The inclined plate (Q) is connected to the horizontal plate (P). This inclined plate Q is disposed diagonally as shown in FIG. 6 to move the lower deposition object upward according to the rotation of the stirring unit 174 and mix the deposition object in the vertical direction.

Meanwhile, as shown in FIG. 5, the stirring blades 176 of each of the plurality of stirring units 174 may face different directions depending on the difference in distance to the rotating shaft unit 173 for stirring.

Among the plurality of stirring parts 174, the inclined plates Q1 and Q2 disposed in a position closer to the flange part 172 than the rotating shaft part 173 for stirring have an edge closer to the flange part 172 than the rotating shaft part for stirring ( 173) and is positioned forward in the direction of rotation (clockwise) from the edge adjacent to the edge.

In this way, the inclined plates (Q1, Q2) disposed at a position closer to the flange portion 172 than the rotating shaft portion 173 for stirring have an edge closer to the flange portion 172 than an edge closer to the rotating shaft portion 173 for stirring. By being positioned forward with respect to the direction of rotation, the deposition object moves inward during the rotation of the stirring unit 174 and does not exceed the wall surface of the flange unit 172.

In addition, among the plurality of stirring parts 174, the inclined plates Q3 and Q4 disposed in a position closer to the rotating shaft part 173 for stirring than the flange part 172 have corners closer to the rotating shaft part 173 for stirring. It is arranged to be located forward in the direction of rotation than the edge adjacent to the branch 172.

In this way, the inclined plates (Q3, Q4) disposed at a position closer to the rotating shaft portion 173 for stirring than the flange portion 172 have an edge closer to the rotating shaft portion 173 for stirring than an edge closer to the flange portion 172. By being positioned forward with respect to the direction of rotation, the deposition object moves outward during the rotation of the stirring unit 174 and does not gather in the direction of the stirring rotation shaft unit 173.

In this way, the stirring blades 176 of each of the plurality of stirring parts 174 are arranged to face different directions according to the difference in the distance to the rotating shaft part 173 for stirring, so that during the rotation of the stirring part 174 It is possible to prevent the deposition target from being tilted to one side.

Meanwhile, the rotation drive unit 180 is connected to the rotation shaft unit 173 for stirring. This rotation drive unit 180 rotates the stirring rotation shaft unit 173 with the third axis direction (Z) as the rotation axis center. The rotation driver 180 according to this embodiment can move in the vertical direction. This rotation drive unit 180 rises upward when the tray 170 is located in the heating space and is connected to the lower surface of the rotation shaft unit 173 for stirring to rotate the rotation shaft unit 173 for stirring.

The terminal block 130 is connected to the heating units 120a and 120b and supplies power to the heating units 120a and 120b. This terminal block 130 is connected to a separate power source (not shown) through a wire (not shown).

The terminal block 130 according to this embodiment is disposed outside the heating space M and outside the process chamber 110, as shown in FIG. 3.

The auxiliary chamber 140 is connected to the process chamber 110. This auxiliary chamber 140 shields the terminal block 130 so that the terminal block 130 is not exposed to source gas.

As shown in FIGS. 2 to 4, the auxiliary chamber 140 according to the present embodiment is coupled to the outer wall of the process chamber 110 and has an isolation space (N) in which at least a portion of the terminal block 130 is located. ) is formed, the chamber body portion 141 for the auxiliary chamber is coupled to the chamber body portion 141 for the auxiliary chamber, and inert gas is introduced into the isolation space (N) of the chamber body portion 141 for the auxiliary chamber. It includes an inlet 142 for inert gas.

The chamber body portion 141 for the auxiliary chamber is formed in the shape of a square box with a hollow interior. The chamber body portion 141 for this auxiliary chamber is coupled to the outer wall of the process chamber 110.

An isolation space N in which at least a portion of the terminal block 130 is located is formed inside the chamber body for the auxiliary chamber according to this embodiment.

The inlet portion 142 for the inert gas is coupled to the chamber body portion 141 for the auxiliary chamber. Inert gas is introduced into the isolation space (N) of the chamber body portion 141 for this auxiliary chamber.

The inert gas inlet 142 in this embodiment is connected to a separate inert gas supply (not shown) that supplies the inert gas. In this embodiment, argon (Ar) or nitrogen (N2) may be used as the inert gas.

In this embodiment, the internal pressure of the isolation space (N) into which the inert gas flows is formed to be higher than the internal pressure of the heating space (M) into which the source gas flows.

As the internal pressure of the isolation space (N) into which the inert gas flows is formed to be higher than the internal pressure of the heating space (M) into which the source gas flows, the source gas from the heating space (M) flows into the isolation space (N). This cannot be done, and as a result, the terminal block 130 is not exposed to the source gas.

Meanwhile, the transfer unit 150 is connected to the process chamber 110. This transfer unit 150 transfers the deposition object.

The transfer unit 150 according to this embodiment includes a transfer roller 151 connected to the deposition target, a transmission member 152 that is connected to the transfer roller 151 and transmits rotational force to the transfer roller 151, and a transmission member. It is connected to (152) and includes a roller actuator (153) that supplies rotational force to the transmission member (152).

The transfer roller 151 is connected to the lower surface of the tray 170 containing the deposition object. This transfer roller 151 is formed in a circular roller shape.

The transmission member 152 is connected to the transfer roller 151 and transmits rotational force to the transfer roller 151. In this embodiment, the transmission member 152 may be made of a rod-shaped transmission shaft.

The roller actuator 153 is connected to the transmission member 152 and supplies rotational force to the transmission member 152. In this embodiment, the actuator 153 for the roller may be an electric motor.

A shear buffer chamber (PBC) is connected to the process chamber 110, as shown in FIG. 2. The interior of this shear buffer chamber (PBC) is maintained in a vacuum state. As the interior of the pre-buffer chamber (PBC) is maintained in a vacuum state, oxygen can be prevented from flowing into the process chamber 110 through the pre-buffer chamber (PBC).

The front buffer chamber (PBC) is equipped with a transfer module (not shown) that transfers the tray 170 containing the deposition object. This transfer module (not shown) has almost the same structure as the transfer unit 150 described above, For convenience of explanation, the description of the transfer module (not shown) is omitted.

A gate valve (G) is disposed between the front buffer chamber (PBC) and the process chamber 110. The gate valve (G) communicates or does not communicate with the interior of the chambers arranged on both sides, and this gate valve (G ) is obvious to those skilled in the art, so for convenience of explanation, the configuration of the gate valve (G) is omitted.

The load lock chamber (LLC) is connected to the front buffer chamber (PBC). The internal pressure of this load lock chamber (LLC) is converted to atmospheric pressure and vacuum. A gate valve (G) is disposed between the front buffer chamber (PBC) and the load lock chamber (LLC).

The load lock chamber (LLC) is equipped with a transfer module (not shown) that transfers the tray 170 containing the deposition object. This transfer module (not shown) has almost the same structure as the transfer unit 150 described above, For convenience of explanation, the description of the transfer module (not shown) is omitted.

The rear buffer chamber (BBC) is connected to the process chamber 110. This rear buffer chamber (BBC) maintains its interior in a vacuum state. As the interior of the rear buffer chamber (BBC) is maintained in a vacuum state, oxygen can be prevented from flowing into the process chamber 110 through the rear buffer chamber (BBC).

A gate valve (G) is disposed between the rear buffer chamber (BBC) and the process chamber 110. The rear buffer chamber (BBC) is equipped with a transfer module (not shown) that transfers the tray 170 containing the deposition object. This transfer module (not shown) has almost the same structure as the transfer unit 150 described above, For convenience of explanation, the description of the transfer module (not shown) is omitted.

The unload lock chamber (ULC) is connected to the downstream buffer chamber (BBC). The interior of this unload lock chamber (ULC) is converted to atmospheric pressure and vacuum. A gate valve (G) is disposed between the rear buffer chamber (BBC) and the unload lock chamber (ULC).

The unload lock chamber (ULC) is equipped with a transfer module (not shown) that transfers the tray 170 containing the deposition object. This transfer module (not shown) has almost the same structure as the transfer unit 150 described above, For convenience of explanation, the description of the transfer module (not shown) is omitted.

Hereinafter, the operation of the deposition apparatus according to this embodiment will be described with reference to FIGS. 2 to 6.

The tray 170 containing the deposition object passes through the inside of the load lock chamber (LLC) and the front buffer chamber (PBC) and is delivered to the process chamber 110.

The tray 170 containing the deposition object delivered to the process chamber 110 is placed in the heating space (M), and a deposition (coating) process on the deposition object is performed by the source gas flowing into the heating space (M).

At this time, the tray 170 according to this embodiment can mix the loaded deposition objects by stirring them. Therefore, the tray 170 according to this embodiment can coat a large amount of deposition material at once by deepening the depth at which the source gas spreads to the loaded deposition object, thereby increasing productivity.

Additionally, the terminal block 130 that supplies power to the heating units 120a and 120b is disposed inside the auxiliary chamber 140, so that the terminal block 130 is not exposed to the source gas.

After the deposition (coating) process, the tray 170 containing the deposition object is moved to the unload lock chamber (ULC) through the rear buffer chamber (BBC).

As such, the deposition apparatus according to this embodiment is equipped with a tray 170 capable of stirring the loaded deposition object, thereby enabling a deposition process to be performed on a large amount of deposition objects, thereby increasing productivity.

In addition, the deposition apparatus according to this embodiment includes an auxiliary chamber 140 that shields the terminal block 130 so that the terminal block 130 is not exposed to the source gas, thereby preventing the terminal block 130 from being exposed to the source gas. This can be prevented, and thus the occurrence of fire can be prevented.

Figure 7 is a cross-sectional view of a tray of a deposition apparatus according to a second embodiment of the present invention.

Compared to the first embodiment, the present embodiment differs only in the configuration of the tray 270, and other configurations are the same as those of the first embodiment of FIGS. 2 to 6. Therefore, the tray 270 of the present embodiment will be described below. ) will only be explained.

The tray 270 according to this embodiment includes a base portion 171 connected to the transfer unit, a flange portion 172 coupled to the base portion 171 and forming a loading space (H) on which the deposition object is loaded, It includes a rotating shaft portion 273 for stirring that is rotatably coupled to the flange portion 172, and a stirring portion 274 that is coupled to the rotating shaft portion for stirring 273 and stirs the deposition target.

In this embodiment, the stirring unit 274 is in contact with the deposition target and consists of a stirring blade 276 bent in a spiral shape.

In this embodiment, the rotation drive unit 280 is connected to the transfer unit and receives driving force. This rotation drive unit 280 is connected to the rotation shaft unit 273 for stirring and rotates the rotation shaft unit 273 for stirring. In this embodiment, the rotation drive unit is provided with gears for interlocking each other and transmits the rotational force received from the transfer unit to the rotation shaft unit 173 for stirring.

As such, the deposition apparatus according to this embodiment is equipped with a tray 170 capable of stirring the loaded deposition object, thereby enabling a deposition process to be performed on a large amount of deposition objects, thereby increasing productivity.

Figure 8 is a plan view showing a deposition apparatus according to a third embodiment of the present invention.

Compared to the first embodiment, this embodiment differs only in that it is formed of a plurality of process chambers 210a, 210b, and 210c and is configured as a batch type, and in other configurations, it is similar to that shown in FIGS. 2 to 2. Since the configuration is the same as that of the first embodiment of Figure 6, only the configuration of the process chambers 210a, 210b, and 210c of this embodiment will be described below.

The deposition apparatus of this embodiment includes a plurality of unit process chambers 210a, 210b, and 210c arranged to be spaced apart from each other. A gate valve (G) is disposed between these unit process chambers (210a, 210b, and 210c).

Each of the unit process chambers 210a, 210b, and 210c of this embodiment has a substantially identical structure to the process chamber 110 of the first embodiment. A gate valve (G) is disposed between the unit process chambers 210a, 210b, and 210c in this embodiment.

Additionally, the internal pressure and internal temperature of the heating space M formed in each of the unit process chambers 210a, 210b, and 210c of this embodiment may be different from each other.

In this way, the internal pressure and internal temperature of the heating space M formed in each of the unit process chambers 210a, 210b, and 210c are adjusted differently, so that the deposition (coating) process can be performed in various ways.

FIG. 9 is a plan view showing a deposition apparatus according to a fourth embodiment of the present invention, FIG. 10 is a cross-sectional view taken along line C-C of FIG. 9, and FIG. 11 is a rotation driving unit provided in the deposition apparatus of FIG. 9. This is the drawing shown. In Figure 10, the rotation driving part is omitted for convenience of illustration.

Compared to the first embodiment, this embodiment differs only in that the deposition apparatus is configured in an in-line manner, but other configurations are the same as those of the first embodiment of FIGS. 2 to 6, Hereinafter, only the configuration of the process chamber 310 of this embodiment will be described.

The deposition device of this embodiment is formed in an in-line manner. Accordingly, in this embodiment, a plurality of flow pipes 113 for source gas are formed, and the plurality of flow pipes 113 for source gas are arranged to be spaced apart from each other in the left and right direction (X-axis direction) of FIG. 10.

The rotation drive unit 380 according to this embodiment includes a pinion gear 381 coupled to the rotation shaft unit 173 for stirring, and a rack gear 382 engaged with the pinion gear 381.

By forming a plurality of source gas flow pipes 113 arranged to be spaced apart from each other in the process chamber 110, the deposition device can be formed in-line, thereby increasing productivity. .

Although this embodiment has been described in detail with reference to the drawings, the scope of this embodiment is not limited to the drawings and description.

As such, the present invention is not limited to the described embodiments, and it is obvious to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the present invention. Accordingly, such modifications or variations should be considered to fall within the scope of the claims of the present invention.

110, 310: Process chamber 111: Chamber body for process chamber
112: insulation part 113: flow pipe for source gas
120a: upper heater 120b: lower heater
130: terminal block 140: auxiliary chamber
141: Chamber body portion for auxiliary chamber 142: Inlet portion for inert gas
150: Transfer unit 151: Transfer roller
152: Electric member 153: Actuator for roller
170: tray 171: base part
172: Flange portion 173: Rotating shaft portion for stirring
174: stirring unit 175: connecting rod
176: Blade for stirring 180: Rotating drive unit
P: horizontal plate Q: inclined plate
M: Heating space N: Isolation space
PBC: Shear Buffer Chamber LLC: Loadlock Chamber
BBC: Downstream buffer chamber ULC: Unloadlock chamber

Claims (14)

A process chamber in which a heating space into which a source gas flows is formed and which performs a deposition process on a deposition object placed on a tray and located in the heating space;
a heating unit connected to the process chamber and heating the heating space of the process chamber; and
It is connected to the process chamber and includes a transfer unit that transfers the tray,
A deposition device characterized in that the tray is capable of agitating the loaded deposition object. According to paragraph 1,
The tray is,
A base portion connected to the transfer unit;
a flange part coupled to the base part and forming a loading space in which the deposition object is loaded;
a rotating shaft for stirring rotatably coupled to the base; and
A deposition apparatus coupled to the rotating shaft for stirring and including a stirring unit for stirring the deposition target. According to paragraph 2,
A deposition apparatus wherein a plurality of stirring units are provided, and the plurality of stirring units are arranged radially spaced apart from each other with respect to the rotating shaft for stirring. According to paragraph 3,
The stirring part,
A connecting rod coupled to the rotating shaft for stirring; and
A deposition device connected to the connecting rod and including a stirring blade in contact with the deposition target. According to paragraph 4,
The stirring blade is,
a horizontal plate coupled to the connecting rod; and
A deposition apparatus comprising an inclined plate connected to the horizontal plate and disposed in a diagonal direction. According to clause 5,
A deposition apparatus, characterized in that the stirring blades of each of the plurality of stirring units are positioned at mutually different positions with respect to the rotating shaft unit for stirring. According to clause 6,
A deposition apparatus, wherein the stirring blades of each of the plurality of stirring units have mutually different viewing directions depending on the difference in distance to the rotating shaft for stirring. In clause 7,
Among the plurality of stirring units, the inclined plate disposed at a position closer to the flange than the stirring rotation shaft is such that an edge closer to the flange is positioned forward in the rotation direction than an edge closer to the stirring rotation shaft. A deposition device characterized in that it is arranged. In clause 7,
Among the plurality of stirring units, the inclined plate disposed at a position closer to the rotation shaft for stirring than the flange portion has an edge closer to the rotation shaft for stirring positioned forward in the direction of rotation than an edge closer to the flange portion. A deposition device characterized in that it is arranged. According to paragraph 2,
A deposition apparatus further comprising a rotation drive unit connected to the stirring rotation shaft unit to rotate the stirring rotation shaft unit. According to paragraph 1,
The tray is,
A base part connected to the transfer unit;
a flange part coupled to the base part and forming a loading space in which the deposition object is loaded;
a rotating shaft for stirring rotatably coupled to the flange; and
A deposition device coupled to the rotating shaft for stirring and including a stirring unit for stirring the deposition target. According to clause 11,
The stirring unit is in contact with the deposition target and includes a stirring blade bent into a spiral shape. According to clause 11,
The deposition apparatus further includes a rotation driving unit connected to the transfer unit to receive driving force and connected to the stirring rotation shaft unit to rotate the stirring rotation shaft unit. According to paragraph 1,
A front-end buffer chamber connected to the process chamber and maintaining its interior in a vacuum state;
A load lock chamber connected to the front buffer chamber and converted into an atmospheric pressure state and a vacuum state;
a rear buffer chamber connected to the process chamber and maintaining the interior in a vacuum state; and
The deposition apparatus is connected to the rear buffer chamber and further includes an unload lock chamber whose interior is converted into an atmospheric pressure state and a vacuum state.

Images