KR20240031920A - Substrate processing device and substrate processing method - Google Patents

Abstract

(Problem) By monitoring the pressure on the primary side, it is possible to prevent inappropriate cleaning treatment from being performed on the substrate.
(Solution means) The control unit 161 manipulates the input signal to the pressing actuator 89 to adjust the pressing pressure and causes the brush 99 to act on the upper surface of the substrate W through the pressing mechanism. Since the control unit 161 monitors the primary side pressure gauge 155 and the secondary side pressure gauge 159, it can determine that an abnormality has occurred in the primary side pressure. The control unit 161 may determine that a situation has occurred in which the pressure of the brush 99 cannot be adjusted to a desired value. As a result, it is possible to prevent continuous inappropriate cleaning treatment for the new substrate W.

Description

Substrate processing device and substrate processing method {SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD}

The present invention provides a cleaning treatment by applying a brush to a substrate such as a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display or an organic EL (Electroluminescence) display device, a glass substrate for a photomask, and a substrate for an optical disk. It relates to a substrate processing apparatus and substrate processing method.

Conventionally, this type of device includes a rotation holding unit, a nozzle, an arm, an air supply pipe, an electro-pneumatic regulator, a pressure gauge, an air cylinder, a load cell, and a brush. There is (for example, see Patent Document 1).

The rotation holding portion holds the cleaning surface of the substrate in an upward position. The nozzle supplies the processing liquid to the upper surface of the substrate. The arm holds the brush at its tip. The arm rotates the brush and applies pressure to reach the target load, pressing the brush against the substrate to act on the substrate. This results in a cleaning treatment.

Air pipes, etc. are built into the arm. One end of the air supply pipe is connected to the air supply source of the utility provided in the clean room. The other end of the air supply pipe is connected to an air cylinder. To the air supply pipe, a pneumatic regulator, a pressure gauge, and an air cylinder are connected in that order from the upstream side close to the air supply section.

The opening degree of the electropneumatic regulator is adjusted according to the input signal. The electro-pneumatic regulator adjusts the pressure of air from the primary side, which is the air source side, and supplies it to the secondary side, which is the downstream side of the electro-pneumatic regulator. The pressure gauge detects the pressure on the secondary side of the pneumatic regulator. In an air cylinder, the rod expands and contracts depending on the pressure on the secondary side of the air. As a result, the air cylinder applies pressure to the brush. The load cell, whose correspondence with the pressure of the brush has been corrected, outputs an output signal according to the pressure of the brush. According to the output signal from the load cell, the input signal to the electropneumatic regulator is adjusted, and the pressure of the brush is adjusted to the target load. After adjusting the pressing pressure according to the output signal from the load cell, a cleaning process using a brush is performed on the substrate while maintaining the input signal to the electropneumatic regulator during adjustment.

Japanese Patent Publication No. 2020-109862

However, in the case of the conventional example having this configuration, there is the following problem.

In other words, if the conventional device can supply air at a sufficiently high pressure from an air supply source, no problem occurs. However, since the air supply source is a clean room utility, it also supplies air to other devices, etc. Therefore, supply timing may overlap for many devices, etc. Then, the pressure on the primary side of the air supply pipe decreases. In this state, while maintaining the input signal to the pneumatic regulator during adjustment, the pressing pressure falls below the target load. Also, in this state, even if the opening degree of the electropneumatic regulator is adjusted to be large, the pressure on the secondary side will not rise above the predetermined value.

Therefore, after adjusting the pressure by adjusting the input signal to the electropneumatic regulator according to the output signal from the load cell, if the pressure on the primary side decreases, the pressure of the brush falls below the target load. In other words, there is a risk that the pressure of the brush may not be adjusted to the target load. As a result, there are cases where processing with inappropriate pressure is performed on the substrate.

The present invention has been made in view of these circumstances, and its purpose is to provide a substrate processing apparatus and a substrate processing method that can prevent inappropriate cleaning processing on a substrate by monitoring the pressure on the primary side. .

In order to achieve this object, the present invention adopts the following configuration.

That is, the invention described in claim 1 is a substrate processing apparatus that performs a cleaning process by applying a brush to a substrate, comprising: a rotation holding portion that holds the substrate in a horizontal position and rotates the substrate; and the rotation holding portion holds the substrate. A brush that acts on the upper surface of the substrate, a pressing mechanism that elastically presses the brush toward the substrate by supplying air, one end of which is connected in communication with an air supply source, and the other end of which is connected in communication with the pressing mechanism. a supply pipe; a pneumatic regulator that adjusts an opening degree according to an input signal to adjust the pressure of air in the air supply pipe; and, in the air supply pipe, it is disposed between the air supply source and the pneumatic regulator, and the primary of the pneumatic regulator is a primary side pressure gauge that detects the pressure on the side as the primary side pressure, and a secondary side pressure gauge disposed between the pneumatic regulator and the pressure mechanism in the air supply pipe and detecting the pressure on the secondary side of the pneumatic regulator as the secondary pressure. In addition to manipulating the input signal, it is characterized by a control unit that monitors the primary side pressure gauge and the secondary side pressure gauge.

[Action/Effect] According to the invention described in claim 1, the control unit manipulates the input signal to adjust the pressure and causes the brush to act on the upper surface of the substrate through the pressure mechanism. Since the control unit monitors the primary side pressure gauge and the secondary side pressure gauge, it can determine that an abnormality has occurred in the primary side pressure. Accordingly, the control unit may determine that a situation has occurred in which the pressure of the brush cannot be adjusted to a desired value. As a result, it is possible to prevent inappropriate cleaning treatment from being performed on the substrate.

Additionally, in the present invention, the control unit preferably issues an alarm when the primary side pressure is below a predetermined value (claim 2).

The control unit issues an alarm when the primary side pressure is below a predetermined value. Accordingly, the operator of the device can take measures such as stopping processing. As a result, it is possible to prevent inappropriate cleaning treatment from being performed on the substrate.

In addition, in the present invention, if the primary side pressure is below a predetermined value, the control unit preferably stops the processing at the point when the cleaning process for the substrate held in the rotation holding unit is completed (Claim 3) .

If the primary side pressure is below the predetermined value, the control unit stops the process at the point when the cleaning process for the substrate being cleaned is completed. Therefore, although there is a high possibility that the cleaning process is performed while the pressing pressure does not reach the target load, the process is stopped after performing the same process as for other substrates treated with the pressing pressure of the target load. As a result, the processing history can be matched to that of other substrates. In addition, since it is stopped after rinsing or drying, damage to the substrate can be reduced compared to stopping immediately without going through these processes.

In addition, in the present invention, the control unit, in a state where the electronic balance is placed at the position where the substrate is placed in the rotation holding unit, actually measures the opening degree of the pneumatic regulator obtained in advance and the measured value of the electronic balance. From the opening degree of the electropneumatic regulator obtained from the correspondence relationship between the load correspondence relationship, the target load to be applied to the substrate and the actual measured load based on the correspondence relationship between the opening degree of the electropneumatic regulator and the secondary pressure, the secondary pressure gauge It is preferable to adjust the pressure of the brush to the target load by adjusting the input signal so that the secondary pressure corresponds to the opening degree (claim 4).

Based on the correspondence relationship between the actual load obtained in advance and the opening degree of the electropneumatic regulator and the secondary pressure, the opening degree of the electropneumatic regulator is obtained from the correspondence relationship between the target load to be applied to the substrate and the actual load. An input signal is applied to the secondary pressure gauge so that the secondary pressure corresponds to the opening degree, and the pressure of the brush is adjusted to the target load. In a state where the primary side pressure is not below a predetermined value, the relationship between the opening degree of the electropneumatic regulator and the secondary side pressure is maintained. Therefore, if the input signal is adjusted so that the secondary pressure gauge becomes the secondary pressure corresponding to the opening degree, the pressure becomes the target load. Therefore, the cleaning process can be accurately performed with a pressure of the target load.

In addition, in the present invention, the pressing mechanism is configured to be able to swing using a fulcrum member as a fulcrum, and has a force point portion on one side with respect to the fulcrum and an action fulcrum portion on the other side with respect to the fulcrum. It is provided with a seesaw member and a pressing actuator that applies a driving force based on air to the force point and swings the seesaw member around the point, thereby applying pressure to press the brush to the upper surface of the substrate. It is desirable to have it (Claim 5). dot

The operation of the pressing actuator is imparted to the action point portion through the force point portion of the seesaw member. Therefore, by providing the seesaw member, the degree of freedom in arranging the pressing actuator can be increased. Therefore, the height of the substrate processing device can be suppressed. As a result, an arrangement in which substrate processing devices are stacked in multiple stages can be easily realized.

In addition, in the present invention, the pressing mechanism includes a brush moving member that is elastically pressed at one end according to the pressure and moves the brush at the other end, and supports upper and lower surfaces of the brush moving member, and moves in the longitudinal direction. A support member that allows the brush, the brush is mounted at the bottom, a bracket disposed on the other end of the brush moving member, and a rod that advances and retreats by supplying air according to pressure, and moves the brush at the tip of the rod. and a pressing actuator that moves the brush moving member by contacting one end of the member, wherein the rod has a rod inclined surface at which the distal end is inclined with respect to a longitudinal axis, and the brush moving member has one end The second end is inclined with respect to the longitudinal axis and has a first inclined surface inclined along the rod inclined surface, and the other end has a second inclined surface inclined with respect to the longitudinal axis, and the bracket has an upper portion inclined with the second inclined surface. It is preferable that the bracket be provided with an inclined surface inclined along the inclined surface, and that the brush moving member advances and retreats in the longitudinal direction as the rod advances and retreats (Claim 6).

When the rod of the pressing actuator advances and retreats, the rod inclined surface advances and retreats and translates. Accordingly, the first inclined surface and the second inclined surface of the brush moving member supported by the support member are translated in the longitudinal direction. Additionally, the bracket inclined surface translates in the longitudinal direction of the bracket. Therefore, the brush moves as the rod advances and retreats. Since the brush moving member is supported by a support member, the self-weight of the brush moving member is canceled when viewed from the pressing actuator. Therefore, even if the rod of the pressing actuator makes a slight advance or retreat, the brush moving member can be moved according to the slight advance or retreat. As a result, even if a small amount of pressure is applied, the pressure can be applied accurately.

In addition, the invention described in claim 7 is a substrate processing method in which a cleaning process is performed by applying a brush to a substrate, wherein the process of applying pressure to the brush through a pressing mechanism is carried out on the upper surface of the substrate held in the rotation holding unit. At this time, the primary side pressure between the air supply pipe and the pneumatic regulator that adjusts the pressure of air in the air supply pipe is detected among the air supply pipes whose one end is connected in communication with the air supply source and the other end is connected in communication with the pressing mechanism. This process is characterized by carrying out a process of issuing an alarm when the primary side pressure is below a predetermined value.

[Action/Effect] According to the invention described in claim 7, the process of detecting the primary side pressure throughout the process of applying pressure to the upper surface of the substrate through the brush mechanism, and when the primary side pressure is below a predetermined value. In this case, the process of issuing an alarm is performed. Accordingly, it can be determined that a situation has occurred in which the pressure of the brush cannot be adjusted to a desired value. As a result, it is possible to prevent inappropriate cleaning treatment from being performed on the substrate.

According to the substrate processing apparatus according to the present invention, the control unit manipulates the input signal to adjust the pressure and causes the brush to act on the upper surface of the substrate through the pressure mechanism. Since the control unit monitors the primary side pressure gauge and the secondary side pressure gauge, it can determine that an abnormality has occurred in the primary side pressure. Accordingly, the control unit may determine that a situation has occurred in which the pressure of the brush cannot be adjusted to a desired value. As a result, it is possible to prevent inappropriate cleaning treatment from being performed on the substrate.

1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment.
FIG. 2 is a view of the substrate processing apparatus of FIG. 1 as seen from the rear (X).
Figure 3 is a plan view showing a schematic configuration of a back surface cleaning unit according to an embodiment.
Fig. 4 is a side view showing the schematic configuration of the back surface cleaning unit.
Figure 5 is a longitudinal cross-sectional view of the cleaning arm.
Figure 6 is a block diagram showing the control system of the back surface cleaning unit.
Figure 7 is a flow chart showing preprocessing performed in advance.
Figure 8 (a) shows the relationship between the opening degree of the pneumatic regulator and the load of the electronic balance, (b) shows the relationship between the secondary side pressure of the pneumatic regulator and the opening degree, and (c) shows the load of the actuator for pressing. This is a graph showing the relationship between the pressure on the secondary side of the electropneumatic regulator.
Figure 9 is a flow chart showing the cleaning process.
Fig. 10 is a longitudinal cross-sectional view of a cleaning arm according to a modification.
Fig. 11 is a diagram illustrating the operation of a cleaning arm according to a modified example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a view of the substrate processing apparatus of FIG. 1 as seen from the rear (X).

<1. Overall composition>

The substrate processing apparatus 1 includes an loading/unloading block 3, an indexer block 5, and a processing block 7.

The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 performs a cleaning process on the substrate W, for example. The substrate processing apparatus 1 processes the substrate W in a single-wafer process in the processing block 7 . In the single wafer type, one substrate W is processed one by one in a horizontal position.

In this specification, for convenience, the direction in which the loading/unloading block 3, the indexer block 5, and the processing block 7 are lined up is called the “front-back direction (X).” The front-to-back direction (X) is horizontal. Among the front-back directions (X), the direction from the processing block 7 toward the loading/unloading block 3 is called "forward." The direction opposite to the front is called “backward.” The horizontal direction orthogonal to the front-back direction (X) is called the “width direction (Y).” One direction of the “width direction (Y)” is appropriately called “right direction”. The direction opposite to the right direction is called “left direction.” The direction perpendicular to the horizontal direction is called the “vertical direction (Z).” In each drawing, the front, back, right, left, top, and bottom are shown appropriately for reference.

＜2. Import/exit block>

The loading/unloading block 3 is provided with an input portion 9 and a discharging portion 11. The input portion 9 and the output portion 11 are arranged in the width direction (Y). A plurality of substrates W (for example, 25 sheets) are stacked and stored in a horizontal position at regular intervals in one carrier C. The carrier C containing the unprocessed substrate W is placed in the input section 9. The input unit 9 is provided with two mounting tables 13 on which the carrier C is placed, for example. In the carrier C, the surfaces of the substrate W are spaced apart from each other, and a plurality of grooves (not shown) are formed to accommodate the substrate W one by one. The carrier C accommodates the substrate W, for example, in an attitude with the surface facing upward. As the carrier C, there is, for example, FOUP (Front Opening Unify Pod). FOUP is a closed container. The carrier C may be an open container and may be of any type.

The output portion 11 is disposed on the opposite side of the input portion 9 across the central portion in the width direction Y of the substrate processing apparatus 1. The dispensing portion 11 is disposed on the left side (Y) of the input portion 9. The dispensing unit 11 stores the processed substrates W in carriers C and dispenses them from each carrier C. The dispensing portion 11 functioning in this way, like the input portion 9, is provided with two mounting tables 13 for placing the carrier C, for example. The input portion 9 and the output portion 11 are also called load ports.

＜3. Indexer block>

The indexer block 5 is disposed adjacent to the rear (X) of the loading/unloading block 3 in the substrate processing apparatus 1. The indexer block 5 is provided with an indexer robot (IR) and a water supply unit (15).

The indexer robot (IR) is configured to be rotatable around the vertical direction (Z). The indexer robot IR is configured to be movable in the width direction (Y). The indexer robot (IR) is equipped with a first hand (19) and a second hand (21). In Fig. 1, due to illustrative purposes, only one hand is shown. The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to independently advance and retreat in the forward and backward directions (X). The indexer robot (IR) moves in the width direction (Y) and rotates around the vertical direction (Z), and advances and retreats the first hand 19 and the second hand 21 to move between the respective cassettes C. Remove the substrate (W) from . Similarly, the indexer robot IR transfers the substrate W to and from the transfer unit 15 .

The water supply unit 15 is disposed at the border of the indexer block 5 and the processing block 7 . The water supply portion 15 is disposed, for example, at the central portion in the width direction (Y). As shown in FIG. 2, the water supply portion 15 is formed to be long in the vertical direction Z.

The conduit portion 15 includes a first inversion unit 23, a pass portion 25, a pass portion 27, and a second inversion unit 29 from downward to upward in the vertical direction Z. It is available.

The first inversion unit 23 inverts the top and bottom of the substrate W received from the indexer block 5 . The first inversion unit 23 inverts the horizontal posture of the substrate W. Specifically, the first inversion unit 23 converts the substrate W with the surface facing upward into an attitude with the surface facing downward. In other words, the posture of the substrate W is changed so that the back side is facing upward.

The second inversion unit 29 performs the opposite operation. That is, the second inversion unit 29 inverts the top and bottom of the substrate W received from the processing block 7 . The second inversion unit 29 converts the substrate W with the surface facing downward to an attitude with the surface facing upward. In other words, the posture of the substrate W is changed so that the back side faces downward.

The inversion directions of the first inversion unit 23 and the second inversion unit 29 may be opposite to each other. That is, the first inversion unit 23 changes the posture of the substrate W so that the surface is in an upward-facing posture. The second inversion unit 29 changes the orientation of the substrate W so that the back surface is facing upward.

The pass portions 25 and 27 are used to transfer the substrate W between the indexer block 5 and the processing block 7. The pass portion 25 is used to transport the substrate W from the processing block 7 to the indexer block 5, for example. The pass portion 27 is used to transport the substrate W from the indexer block 5 to the processing block 7, for example. Additionally, the transport directions of the substrate W in the pass portions 25 and 27 may be opposite to each other.

＜4. Processing block>

The processing block 7 performs a cleaning process on the substrate W, for example. The cleaning treatment is, for example, a treatment using a brush in addition to the treatment liquid. As shown in FIG. 1, the processing block 7 is divided into a first row R1, a second row R2, and a third row R3 in the width direction Y, for example. Lose. In detail, the first row R1 is located on the left side (Y). The second row R2 is arranged in the central part of the width direction Y. In other words, the second row R2 is arranged to the right (Y) of the first row R1. The third row R3 is arranged to the right (Y) of the second row R2.

<4-1. 1st row>

The first row R1 of the processing block 7 is provided with a plurality of processing units 31. The first row R1 is provided with four processing units 31, for example. In the first row R1, four processing units 31 are stacked in the vertical direction Z. Each processing unit 31 will be described in detail later. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit cleans the substrate W. The cleaning unit includes a surface cleaning unit that cleans the surface of the substrate W, and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back side cleaning unit (SSR) is used as the processing unit 31 as an example.

<4-2. 2nd row>

The second row R2 of the processing block 7 is equipped with a center robot CR. The center robot CR is configured to be rotatable around the vertical direction Z. The center robot CR is configured to be capable of going up and down in the vertical direction Z. The center robot CR is provided with a first hand 33 and a second hand 35, for example. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are configured to independently advance and retreat in the front-back direction (X) and the width direction (Y).

<4-3. 3rd row>

The third row R3 of the processing block 7 has the same configuration as the first row R1. That is, the third row R3 is provided with a plurality of processing units 31. The third row R3 is provided with four processing units 31, for example. The third row R3 is arranged with four processing units 31 stacked in the vertical direction Z. Each processing unit 31 in the first row R1 and each processing unit 31 in the third row R3 are arranged to face each other in the width direction Y. For this reason, the center robot CR can access each opposing processing unit 31 in the first row R1 and the third row R3 at the same height in the vertical direction Z.

The processing block 7 is configured as described above. Here, an operation example of the center robot (CR) will be briefly described. Center robot CR receives the substrate W from the first inversion unit 23, for example. The center robot CR transfers the substrate W to the backside cleaning unit SSR in either the first row R1 or the third row R3 and performs a cleaning treatment on the backside of the substrate W. . The center robot CR receives the substrate W on which the cleaning process has been performed in the back surface cleaning unit SSR in either the first row R1 or the third row R3. Center robot CR conveys the substrate W to the second inversion unit 29.

<4-4. Processing unit>

Here, with reference to FIGS. 3 to 5, the back side cleaning unit (SSR) (processing unit 31) will be described. Figure 3 is a plan view showing a schematic configuration of a back surface cleaning unit according to an embodiment. Fig. 4 is a side view showing the schematic configuration of the back surface cleaning unit. Figure 5 is a longitudinal cross-sectional view of the cleaning arm.

In addition, here, the back side cleaning unit (SSR) provided in the first row (R1) is explained as an example. The back surface cleaning unit (SSR) in the third row (R3) has a configuration in which the arrangement in the width direction (Y) is changed.

The back surface cleaning unit (SSR) includes a rotation holding portion 37, a guard 39, a first treatment liquid arm 41, a second treatment liquid arm 43, a cleaning arm 45, and a standby liquid arm 45. It is equipped with a port (47).

＜4-4-1. Rotation holding part>

The rotation holding portion 37 is disposed approximately at the center of the back side cleaning unit (SSR) when viewed from the top. The rotation holding portion 37 rotates the substrate W in a horizontal plane while maintaining the substrate W in a horizontal position. The rotation holding portion 37 includes an electric motor 49, a rotation shaft 51, a spin chuck 53, and a support pin 55.

The electric motor 49 is arranged with the rotation axis 51 facing in the vertical direction Z. The rotation shaft 51 has a spin chuck 53 mounted on its upper end. The spin chuck 53 has a diameter slightly larger than the diameter of the substrate W. The spin chuck 53 is a circular plate-shaped member. The spin chuck 53 is equipped with a plurality of support pins 55. In this embodiment, for example, six support pins 55 are provided. The six support pins 55 come into contact with the outer periphery of the substrate W and support the substrate W in a horizontal position. As long as the plurality of support pins 55 can stably support the substrate W in a horizontal position, the number of support pins 55 is not limited to six. Six support pins 55 are installed standing near the outer periphery of the substrate W in the spin chuck 53. The six support pins 55 release the hold on the periphery of the substrate W when loading the substrate W into the spin chuck 53 and when unloading the substrate W from the spin chuck 53. do. Therefore, each support pin 55 is configured to be rotatable around the vertical direction Z. Description of the specific configuration for performing the operation will be omitted. When the rotation holding portion 37 rotates the electric motor 49, the spin chuck 53 rotates around the rotation center P1. The rotation center P1 is in the vertical direction Z.

＜4-4-2. Guard>

The guard 39 is arranged to surround the rotation holding portion 37 when viewed from the top. In detail, the guard 39 includes a cylindrical body portion 57 and an inclined portion 59. The guard 39 is configured to be capable of being raised and lowered in the vertical direction (Z). The guard 39 can be raised and lowered to a lowered standby position and a processing position above the standby position. Description of the specific configuration for raising and lowering the guard 39 will be omitted.

The body portion 57 of the guard 39 has a cylindrical shape. The body portion 57 is arranged so that its inner peripheral surface is spaced outward from the outer peripheral side of the rotation holding portion 37 . The inclined portion 59 is narrowed from the upper part of the body portion 57 to get closer to the rotation axis 51 side. The inclined portion 59 has an opening 61 at the top. The opening 61 is formed in the central portion of the inclined portion 59. The opening 61 is larger than the diameter of the substrate W. The opening 61 is larger than the diameter of the spin chuck 53. When loading and unloading the substrate W, the guard 39 is lowered in the vertical direction Z to a position where the spin chuck 53 protrudes upward from the opening 61. During the cleaning process of the substrate W, the guard 39 has an inclined portion 59 positioned near the height of the substrate W held by the spin chuck 53. The inclined portion 59 guides the processing liquid, etc. that have splashed from the substrate W to the surroundings below the guard 39 on the inclined inner peripheral surface.

＜4-4-3. First treatment liquid arm>

The first processing liquid arm 41 is disposed at the rear (X) of the rotation holding portion 37 in plan view. The first treatment liquid arm 41 is provided with an electric motor 42 at its proximal end. The first treatment liquid arm 41 is swung around the rotation center P2 on the proximal end side by the electric motor 42 . The rotation center P2 is in the vertical direction Z. The first processing liquid arm 41 is equipped with one nozzle 63. The nozzle 63 has a discharge port below. The nozzle 63 discharges the processing liquid. The first processing liquid arm 41 is configured so that the tip of the nozzle 63 can swing between the standby position shown in FIG. 3 and the supply position near the rotation center P1. When the first processing liquid arm 41 supplies the processing liquid to the substrate W, the tip of the nozzle 63 is moved to the supply position. When the first processing liquid arm 41 does not supply the processing liquid to the substrate W, the tip of the nozzle 63 is moved to the standby position. The first processing liquid arm 41 may swing the nozzle 63 above the substrate W so as not to interfere with the cleaning arm 45 when supplying the processing liquid to the substrate W.

Examples of the processing liquid discharged from the nozzle 63 include rinse liquid. Examples of the rinse liquid include pure water, carbonated water, electrolyzed ion water, hydrogen water, and ozone water.

＜4-4-4. Second treatment liquid arm>

The second processing liquid arm 43 is disposed on the left side (Y) of the rotation holding portion 37 when viewed from the top. The second treatment liquid arm 43 is provided with an electric motor 44 on its proximal end side. The second treatment liquid arm is swung around the rotation center P3 on the proximal end side by the electric motor 44 . The rotation center P3 is in the vertical direction Z. The second processing liquid arm 43 is provided with three nozzles 65, 67, and 69. Each nozzle 65, 67, and 69 has a discharge port below. The nozzles 65, 67, and 69 discharge the processing liquid. The second processing liquid arm 43 is configured to be able to swing between the standby position where the tip portions of the nozzles 65, 67, and 69 are shown in FIG. 3 and the supply position near the rotation center P1. When the second processing liquid arm 43 supplies the processing liquid to the substrate W, the tip portions of the nozzles 65, 67, and 69 are moved to the supply position. When the second processing liquid arm 43 does not supply the processing liquid to the substrate W, the tip portions of the nozzles 65, 67, and 69 are moved to the standby position. The second processing liquid arm 43 swings the nozzles 65, 67, and 69 above the substrate W so as not to interfere with the cleaning arm 45 when supplying the processing liquid to the substrate W. You can do it.

Examples of the processing liquid discharged from the nozzles 65, 67, and 69 include chemical liquid. Examples of the chemical solution include at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, and aqueous hydrogen peroxide. As a more specific chemical solution, for example, SC-1, which is a mixed solution of ammonia water and hydrogen peroxide water, can be used.

＜4-4-5. Cleaning arm>

The cleaning arm 45 is configured as follows.

The cleaning arm 45 is provided with a rotating lifting mechanism 71, a support 73, a housing 75, and a cleaning unit 77.

The rotary lifting mechanism 71 is configured to enable the support 73, the housing 75, and the cleaning unit 77 to be raised and lowered in the vertical direction Z. The rotary lifting mechanism 71 is configured to swing the support 73, the housing 75, and the cleaning part 77 around the rotation center P4. Specifically, the rotary lifting mechanism 71 is configured by combining an electric motor and an air cylinder, for example. The rotary lifting mechanism 71 raises the cleaning unit 77 from the standby port 47 in the vertical direction Z in the standby position. The rotary lifting mechanism 71 swings the cleaning part 77 in a horizontal plane so that it passes near the rotation center P1.

The support 73 has a cylindrical shape. The lower part of the support pole 73 is connected to the rotary lifting mechanism 71 . The upper part of the support 73 is connected to one lower part of the housing 75. The housing 75 has its long axis in a horizontal plane. The housing 75 is provided with a cleaning portion 77 on the other lower side. The cleaning unit 77 is rotated around the rotation center P5. The rotation center P5 is in the vertical direction Z.

The housing 75 includes a lower housing 75a and an upper housing 75b. The lower housing 75a constitutes the lower part of the housing 75. The upper housing 75b constitutes the upper part of the housing 75. The upper housing 75b and lower housing 75a are connected to each other.

The housing 75 is equipped with a pressing mechanism 81 and a rotation mechanism 83. Specifically, the lower housing 75a is equipped with a pressing mechanism 81 and a rotation mechanism 83.

The pressing mechanism 81 includes a fulcrum member 85, a seesaw member 87, a pressing actuator 89, and a support mechanism 91.

The fulcrum member 85 is mounted on the upper surface of the lower housing 75a. The support member 85 is erected and installed at substantially the center of the lower housing 75a in the front-back direction (X). The fulcrum member 85 has a swing shaft 85a at its upper part. The rocking shaft 85a is rotatable around the width direction (Y). The central portion 87c of the seesaw member 87 is rotatably mounted on a support member 85 via a swing shaft 85a. The seesaw member 87 can be raised and lowered alternately at both ends of one side 87l (action point portion) and the other side 87r (reverse point portion) in the vertical direction Z. As for the seesaw member 87, the swing axis 85a serves as a fulcrum.

As for the pressing actuator 89, the operating axis 89a is arranged toward the vertical direction Z. The pressing actuator 89 raises one side 87l of the seesaw member 87 by extending the operating shaft 89a. The actuator 89 for pressing is preferably, for example, an air bearing actuator.

In the air bearing actuator, the operating shaft 89a is supported by air so that it can advance and retreat with a small gap. Therefore, in theory, the slide resistance of the operating shaft 89a becomes zero and friction does not occur. Therefore, compared to a normal air cylinder, the air bearing actuator can advance and retreat the operating shaft 89a even with a very small amount of air pressure. Therefore, it is possible to advance and retreat linearly according to air pressure. However, as the pressing actuator 89, a normal air cylinder can also be used.

In the front-back direction The support mechanism 91 supports the cleaning unit 77 . The support mechanism 91 suspends and supports the cleaning part 77 below the housing 75.

The support mechanism 91 includes a holding member 93, an elastic pressing portion 95, and a guide portion 97.

The support mechanism 91 suspends and supports the cleaning unit 77 . The cleaning unit 77 is provided with a brush 99 and a brush holder 101. The brush 99 acts on the substrate W to clean it. The brush holder 101 holds the brush 99. The brush holder 101 holds the brush 99 removably. The brush holder 101 has a rotation axis 103 mounted at its center when viewed from the top. The rotation axis 103 extends from the brush holder 101 in the vertical direction (Z).

The holding member 93 maintains the rotation shaft 103 freely. The rotation shaft 103 is configured as a spline shaft, for example. The rotating shaft 103 is attached to the holding member 93 via a spline nut 103a. The rotation axis 103 is movable in the vertical direction (Z) with respect to the spline nut 103a. The holding member 93 holds the spline nut 103a in a rotatable state around the vertical direction Z. The spline nut 103a is mounted on the holding member 93 via a bearing not shown. The rotation axis 103 can rotate around the rotation center P5. A pulley 105 is attached to the spline nut 103a protruding from the upper part of the holding member 93. The pulley 105 is fixed to the outer peripheral surface of the spline nut 103a. When the pulley 105 rotates, the spline nut 103a rotates, and the rotation shaft 103 also rotates in the same direction.

An elastic pressing portion 95 is disposed on the upper part of the pulley 105. The elastic pressing portion 95 includes an upper holding portion 107, a lower holding portion 109, and a coil spring 111. The upper holding portion 107 is mounted on the upper side of the rotating shaft 103 via a bearing (not shown). In other words, the upper holding portion 107 remains stationary even if the rotation shaft 103 rotates. The lower holding part 109 is arranged to be spaced apart from the upper holding part 107. The lower holding portion 109 is below the upper holding portion 107 and is disposed above the pulley 105. The lower holding portion 109 is below the upper holding portion 107 and is disposed above the pulley 105. The lower holding portion 109 is arranged so that its inner peripheral surface is spaced apart from the outer peripheral surface of the rotating shaft 103. Accordingly, the lower holding portion 109 remains stationary even when the rotating shaft 103 rotates. Additionally, the lower holding portion 109 is mounted on the upper surface of the pulley 105 via a bearing. Therefore, the lower holding portion 109 is not affected by the rotation of the pulley 105.

The coil spring 111 is mounted on the upper holding portion 107 and the lower holding portion 109. The upper end of the coil spring 111 is fixed to the upper holding portion 107. The lower end of the coil spring 111 is fixed to the lower holding portion 109. The coil spring 111 has a cylindrical shape, for example. The coil spring 111 is a compression coil spring. Accordingly, the upper holding portion 107 is elastically pressed upward from the upper surface and lower holding portion 109 of the pulley 105. As a result, the rotation axis 103 is elastically pressed upward in the vertical direction Z. Therefore, in a normal state in which the pressing actuator 89 is not operating, the brush 99 is maintained at a constant height from the lower surface of the lower housing 75a. In other words, in normal conditions, the load due to the brush 99 is zero.

The support mechanism 91 supports the rotation shaft 103 that moves up and down in the vertical direction Z. The support mechanism 91 includes a linear guide 113 and a shaft holding portion 115. The linear guide 113 is arranged adjacent to the holding member 93. The linear guide 113 is installed standing upright in the vertical direction (Z). The linear guide 113 is provided with a rail 113a and a carriage 113b. The rail 113a is arranged longitudinally in the vertical direction (Z). The carriage 113b is mounted on the rail 113a so that it can move in the vertical direction (Z). The carriage 113b is disposed below the other side 87r of the seesaw member 87. The carriage 113b is disposed at a position where it comes into contact with the other side 87r of the seesaw member 87 when it descends.

The shaft holding portion 115 holds the upper part of the rotating shaft 103. The shaft holding portion 115 maintains the rotation shaft 103 in a state that allows it to rotate. The shaft holding portion 115 holds the rotating shaft 103 through, for example, a bearing (not shown). The carriage 113b is connected to the shaft holding portion 115. When the pressing actuator 89 raises the operating shaft 89a with a driving force stronger than the elastic pressing force of the coil spring 111, one side 87l (action point portion) rises. When one side 87l rises, the other side 87r (reverse point portion) falls. At this time, the other side 87r lowers the carriage 113b together with the shaft holding portion 115. Then, the rotation axis 103 descends, and the brush 99 moves downward from a predetermined position. When the pressing actuator 89 is driven in this way, pressing pressure according to the driving force of the pressing actuator 89 is applied to the brush 99.

A rotation mechanism 83 is disposed adjacent to the support mechanism 91. The rotation mechanism 83 is disposed on the support member 85 side. The rotation mechanism 83 includes an installation member 117 and an electric motor 119. The installation member 117 arranges the electric motor 119 upwardly and spaced apart from the bottom of the lower housing 75a. The electric motor 119 has its rotation axis disposed downward in the vertical direction Z. The electric motor 119 rotates the rotation shaft around the rotation center P6. The rotation center P6 is substantially parallel to the rotation center P5 in the vertical direction Z. The electric motor 119 has a pulley 121 mounted on a rotating shaft. A timing belt 123 is stretched between the pulley 121 and the pulley 105. Accordingly, when the electric motor 119 rotates, the rotation axis 103 rotates around the rotation center P5 through the timing belt 123, pulleys 105 and 121, and spline nut 103a. Even if the rotation shaft 103 is rotated in this way, the rotation shaft 103 can be raised and lowered in the vertical direction (Z).

As described above, the cleaning arm 45 is configured. That is, the operation of the pressing actuator 89 is applied to the other side 87r (action point portion) of the seesaw member 87 through one side 87l (reverse point portion). Therefore, by providing the seesaw member 87, the degree of freedom in arranging the pressing actuator 89 can be increased. Therefore, the height of the substrate processing device 1 can be suppressed. As a result, an arrangement in which the substrate processing apparatus 1 is stacked in multiple stages can be easily realized.

<4-5. Control system>

Please refer to Figure 6 here. Figure 6 is a block diagram showing the control system of the back surface cleaning unit.

One end of the pipe 125 is connected in communication with the nozzle 63 described above. The other end of the pipe 125 is connected in communication with the rinse liquid supply source 127. The rinse liquid supply source 127 supplies the rinse liquid described above. The pipe 125 is equipped with a flow control valve 129. The flow control valve 129 controls the flow rate of the rinse liquid in the pipe 125.

One end of the pipe 131 is connected in communication with the nozzle 65 described above. The other end of the pipe 131 is connected in communication with the processing liquid supply source 133. The processing liquid supply source 133 supplies any one of the various chemical liquids described above. The pipe 131 is equipped with a flow control valve 135. The flow control valve 135 controls the flow rate of the chemical liquid in the pipe 131.

One end of the pipe 137 is connected in communication with the nozzle 67 described above. The other end of the pipe 137 is connected in communication with the processing liquid supply source 139. The processing liquid supply source 139 supplies any one of the various chemical liquids described above. The pipe 137 is equipped with a flow control valve 141. The flow control valve 141 controls the flow rate of the chemical solution in the pipe 139.

One end of the pipe 143 is connected in communication with the nozzle 69 described above. The other end of the pipe 143 is connected in communication with the processing liquid supply source 145. The processing liquid supply source 145 supplies any one of the various chemical liquids described above. The pipe 143 is equipped with a flow control valve 147. The flow control valve 147 controls the flow rate of the chemical liquid in the pipe 143.

One end of the air supply pipe 149 is connected in communication with the above-mentioned pressure actuator 89. In addition, air for supporting the actuating shaft 89a with a small gap is supplied to the pressing actuator 89, but this piping and the like are omitted. An air supply source 151 is connected to the other end of the air supply pipe 149 in communication. The air supply source 151 supplies air, for example. The air is preferably dry air. The air supply source 151 is connected in communication with other devices. The supply pressure of the air supply source 151 is affected by the operating status of other devices. In other words, when the operation rate of other devices increases, the supply pressure may decrease. Starting from the air supply source 151 side, it is provided with an on-off valve 153, a primary side pressure gauge 155, a pneumatic regulator 157, and a secondary side pressure gauge 159.

The open/close valve 153 allows or blocks the flow of air in the air supply pipe 149. The primary side pressure gauge 155 measures the air pressure on the upstream side of the pneumatic regulator 157. The electropneumatic regulator 157 adjusts the opening degree of the built-in valve according to the input signal. For this reason, the electropneumatic regulator 157 adjusts the air pressure in the air supply pipe 149. In detail, the electropneumatic regulator 157 adjusts the valve opening degree according to a given input signal to reduce the primary side pressure to the secondary side pressure in the air supply pipe 149. The electropneumatic regulator 157 cannot adjust the secondary pressure to a higher pressure than the primary pressure in the air supply pipe 149. The electropneumatic regulator 157 adjusts the secondary side pressure to be lower than the primary side pressure of the air supply pipe 149. The electropneumatic regulator 157 can adjust the secondary pressure within a range of a predetermined value or less when the primary side pressure exceeds a predetermined value. In other words, a situation may occur in which the electropneumatic regulator 157 cannot accurately adjust the secondary pressure to a certain value or more when the primary side pressure is below a certain value.

The control unit 161 comprehensively controls each of the above-described parts. Specifically, the control unit 161 controls the transfer operation of the input unit 9 and the dispensing unit 11, the transfer operation of the indexer robot IR, the first reversal unit 23, and the second reversal unit 29. )'s reversal operation, the transfer operation of the center robot (CR), etc. The control unit 161 controls the rotation of the electric motor 49 in the back surface cleaning unit (SSR) (processing unit 31), raises and lowers the guard 39, and supports the support pins in the spin chuck 53. 55), the swinging motion of the electric motors 42 and 44, the opening and closing motion of the flow control valves 129, 135, 141, and 147, the swinging and lifting motion of the rotary lifting mechanism 71, and the electric motor 119. The rotation operation, the opening and closing operation of the on-off valve 153, and the opening and closing operation of the pneumatic regulator 157 are operated as control objects.

The control unit 161 includes a CPU and memory, not shown. An indicating unit 163 is connected to the control unit 161. The instruction unit 163 is operated by the operator of the substrate processing apparatus 1. The instruction unit 163 is used by the operator to instruct a recipe that specifies the contents of processing of the substrate W, etc., and the start or stop of processing. A notification unit 165 is connected to the control unit 161. The notification unit 165 generates an alarm when a problem occurs in the substrate processing apparatus 1 and notifies the operator of the occurrence of the problem. The notification unit 165 is, for example, a display device, lamp, buzzer, speaker, etc. It is desirable that the notification unit 165 be able to confirm the type of problem that has occurred. The control unit 161 is provided with an input port (IP). Data from various electronic devices is input into the input port (IP). Data input from the input port (IP) is processed or stored in the control unit 161.

The control unit 161 receives measured values from the primary side pressure gauge 155 and the secondary side pressure gauge 159. The control unit 161 provides an input signal for the opening operation of the valve of the pneumatic regulator 157. According to this input signal, the pressure applied to the substrate W by the brush 99 is determined.

In addition, the above-described back side cleaning unit (SSR) (processing unit 31) corresponds to the “substrate processing device” in the present invention.

＜5. Pretreatment in the processing unit>

With reference to FIGS. 7 and 8, preprocessing in the above-described back side cleaning unit (SSR) will be described. Figure 7 is a flow chart showing preprocessing performed in advance. Figure 8(a) shows the relationship between the opening degree of the electropneumatic regulator and the load of the electronic balance, Figure 8(b) shows the relationship between the secondary side pressure and the opening degree of the electropneumatic regulator, and Figure 8(c) shows , This is a graph showing the relationship between the load of the pressure actuator and the secondary pressure of the pneumatic regulator.

The operator of the substrate processing apparatus 1 operates the instruction unit 163 to instruct pre-processing for one back surface cleaning unit (SSR).

Step S1

Place the electronic balance. Specifically, an electronic balance (not shown) is placed on the rotation holding portion 37. An electronic balance is a device that measures load. The electronic balance preferably has a data output terminal. In the electronic balance, a data output terminal is connected to an input port (IP). The electronic balance outputs measured values from a data output terminal. The measured value is, for example, load (g).

Step S2

Measure the load. Specifically, for example, the control unit 161 changes the input signal to the electropneumatic regulator 157 in a state in which the on-off valve 153 is opened, and the load X of the electronic balance for each input signal at that time ( g) is measured. In addition, the operator instructs from the indicating unit 163 some load (target load The input signal to the electropneumatic regulator 157 may be varied as much as possible to obtain an input signal corresponding to each target load X(g) at that time. At this time, the control unit 161 receives the secondary pressure, which is the measured value of the secondary pressure gauge 159 for each load.

Step S3

Remember the correspondence between the actual measured loads. Through the measurement in step S2, the control unit 161 determines the relationship between the opening degree (input signal) of the pneumatic regulator 157 and the load (target load Obtain the relationship between the secondary pressure and opening degree of the pneumatic regulator 157 as in (b) of 8. The control unit 161 stores in memory the relationship between the load of the pressure actuator 89 and the secondary pressure of the pneumatic regulator 157 as shown in FIG. 8(c), along with the above relationship.

Step S4

The operator of the substrate processing apparatus 1 operates the instruction unit 163 to instruct one back side cleaning unit (SSR) to complete the preprocessing. The operator of the substrate processing apparatus 1 removes the electronic balance from the rotation holding unit 37 . If necessary, the same pretreatment is performed on other backside cleaning units (SSRs).

＜6. Cleaning processing in the processing unit>

Next, with reference to FIG. 9, the cleaning process will be explained. Figure 9 is a flow chart showing the cleaning process.

Step S11

The operator instructs processing to begin. Specifically, a recipe including the target load X(g) is also indicated. Then, the substrate W is conveyed from the indexer block 5 to the transfer unit 15, and its orientation is changed in the first inversion unit 23 so that the back surface is facing upward.

Step S12

The substrate W with the back surface facing upward is conveyed to one back surface cleaning unit (SSR) by the center robot CR. The back surface cleaning unit (SSR) starts the cleaning process. Specifically, the control unit 161 determines that the secondary pressure of the secondary pressure gauge 159 is the secondary pressure corresponding to the target load Adjust the input signal to the electropneumatic regulator 157 so that the pressure is Z (Pa). For this reason, air is supplied from the pneumatic regulator 157 to the pressing actuator 89, and cleaning is performed with a target load X(g) applied to the substrate W from the brush 99. At this time, the first processing liquid arm 41 is rocked, and pure water is supplied to the entire surface of the substrate W at a position that does not interfere with the cleaning arm 45 . At this time, the brush 99 acts on the back surface of the substrate W to perform a cleaning process. The control unit 161 operates the rotation lifting mechanism 71 to move the cleaning arm within the diameter of the substrate W so that the brush 99 passes the rotation center P1 and is reversed at both end surfaces of the substrate W. (45) is shaken.

In the above example, the input signal to the pneumatic regulator 157 is adjusted according to the deviation of the secondary pressure so that the secondary pressure Z (Pa) corresponds to the target load X (g). In other words, since feedback is performed, the stability and responsiveness of pressure control of the brush 99 can be improved.

In addition, the above step S12 corresponds to the “process of applying pressure to the brush” in the present invention.

Step S13

Determine whether the primary side pressure is below a predetermined value. The control unit 161 always monitors the measured value of the primary side pressure gauge 155. The control unit 161 monitors the primary side pressure of the air supply pipe 149. If the primary side pressure exceeds the predetermined value, the control unit 161 proceeds to step S14. Additionally, step S13 is performed even while the next step S14 is being processed. That is, while the cleaning process using the brush 99 is being performed, the process of step S13 is being performed. Step S13 is performed during the cleaning process at predetermined intervals by interrupt processing.

In addition, the above step S13 corresponds to the “process of detecting the primary side pressure” in the present invention.

Here, first of all, explanation is made on the assumption that the primary side pressure exceeds the predetermined value.

Step S14

Continue processing. After supply of pure water for a predetermined period of time, the second treatment liquid arm 43 is shaken in place of the first treatment liquid arm 41 . For this reason, the chemical liquid is supplied to the entire surface of the substrate W at a position that does not interfere with the cleaning arm 45. At this time, the brush 99 is applied to the back surface of the substrate W. After supplying the chemical solution for a predetermined period of time, the first treatment liquid arm 41 is again rocked in place of the second treatment liquid arm 43, and the chemical liquid is replaced with pure water. At this time, the brush 99 is applied to the back surface of the substrate W. After that, the first processing liquid arm 41, the second processing liquid arm 43, and the cleaning arm 45 are moved to the standby position. Then, the control unit 161 dries the substrate W. Specifically, the control unit 161 rotates the electric motor 49 at high speed to shake off pure water adhering to the substrate W and dry it.

Step S15

The processing is completed and the substrate W is taken out. The control unit 161 lowers the guard 39 to the standby position. The center robot CR carries out the substrate W after completion of the drying process from the backside cleaning unit SSR. The unloaded substrate W is inverted in the second inversion unit 29 with the surface facing upward. The substrate W with the surface facing upward is carried out to the dispensing section 11 by the indexer robot IR.

Step S16

The process moves on to the next substrate (W). The control unit 161 performs a cleaning process on the next substrate W loaded by the center robot CR. That is, it returns to step S12.

Here, in step S13 described above, a case where the primary side pressure is below a predetermined value will be described. That is, an example of processing when the primary side pressure falls below a predetermined value during processing of the substrate W by the brush 99 will be described.

Step S17

Issue an alarm. When the primary side pressure is below a predetermined value, the control unit 161 operates the notification unit 165 to issue an alarm. For this reason, the operator of the substrate processing apparatus 1 can know that processing has been performed in a state in which the load of the brush 99 in the back surface cleaning unit SSR is different from the target load.

If the primary side pressure is below the predetermined value, the secondary side pressure may not be adjusted to the secondary pressure Z (Pa) corresponding to the target load X (g) even if the input signal of the pneumatic regulator 157 is manipulated. In other words, if the primary pressure is insufficient, it cannot be raised to the secondary pressure corresponding to the target load. For that reason, an alarm is issued.

Additionally, the above step S17 corresponds to the “process of issuing an alarm” in the present invention.

Step S18

Continue processing. After issuing an alarm, the control unit 161 continues processing without stopping. That is, as in step S14 described above, brush chemical cleaning using the brush 99 while supplying the chemical solution, brush pure water cleaning using the brush 99 while supplying pure water, and shake-off drying treatment are performed.

Step S19

As in step S15 described above, the processing is completed and the substrate W is unloaded.

Step S20

Stop processing. The control unit 161 stops the process after the rough cleaning process for the substrate W is completed. In other words, the process is not stopped in the middle of the cleaning process, but is stopped when the process for the substrate W is completed. This method of stopping is also called cycle stopping.

If it is determined in step S13 that the primary side pressure is below the predetermined value, there is a high possibility that the cleaning process is being performed while the pressure does not reach the target load. However, instead of stopping immediately, the same process as for the other substrate W treated with the target load is performed and then the processing is stopped. As a result, it is possible to match the processing history with that of other substrates W. In addition, since it is stopped after rinsing or drying, damage to the substrate W can be reduced compared to stopping immediately without going through these processes.

According to this embodiment, the control unit 161 manipulates the input signal to the pressing actuator 89 to adjust the pressing pressure, and applies the brush 99 to the upper surface of the substrate W through the pressing mechanism 81. I order it. Since the control unit 161 monitors the primary side pressure gauge 155 and the secondary side pressure gauge 159, it can determine that an abnormality has occurred in the primary side pressure. Accordingly, the control unit 161 can determine that the pressure of the brush 99 cannot be adjusted to a desired value. As a result, it is possible to prevent continuous inappropriate cleaning treatment for the new substrate W.

In this embodiment, in step S17, the control unit 161 issues an alarm when the primary side pressure is below a predetermined value. Accordingly, the operator of the substrate processing apparatus 1 can take measures such as stopping the processing in step S17. As a result, it is possible to prevent inappropriate cleaning treatment from being performed on the substrate W.

In this embodiment, the control unit 161 adjusts the load on the brush 99 based on the above-mentioned relationship (FIG. 8 (a) to (c)) obtained in advance. In this way, the opening degree of the pneumatic regulator 157 is obtained from the correspondence relationship between the target load and the actual load, based on the correspondence relationship between the previously acquired actual load and the opening degree of the electropneumatic regulator and the secondary pressure. The control unit 161 provides an input signal to adjust the pressure of the brush 99 to the target load so that the secondary pressure gauge 159 has a secondary pressure corresponding to the opening degree. In a state where the primary side pressure is not below the predetermined value, the relationship between the opening degree of the pneumatic regulator 157 and the secondary side pressure is maintained. Therefore, if the input signal is adjusted so that the secondary pressure gauge 159 becomes the secondary pressure corresponding to the opening degree, the pressure becomes the target load. Therefore, the cleaning process can be accurately performed with a pressure of the target load.

＜Modification example＞

With reference to Fig. 10, modifications to this embodiment will be described. Fig. 10 is a longitudinal cross-sectional view of a cleaning arm according to a modification. In addition, the same components as the cleaning arm 45 in the above-described embodiment are given the same reference numerals and detailed descriptions are omitted.

The cleaning arm 45A has a different configuration of the pressing mechanism 81A. Specifically, the pressing mechanism 81A includes a support table 171, a lower support roller 173, an upper support roller 175, a brush moving member 177, a rod 179, and a lifting member ( 181) is different in that it is provided.

The support stand 171 is provided with a lower support roller 173 and an upper support roller 175. The support stand 171 is equipped with a lower support roller 173 and an upper support roller 175 on its side. The lower support roller 173 and the upper support roller 175 are rotatably mounted around the width direction (Y). The lower support roller 173 and the upper support roller 175 clamp the upper and lower surfaces of the brush moving member 177. The brush moving member 177 is elastically pressed at one end in response to pressure, and indirectly moves the brush 99 at the other end. The brush moving member 177 has a lower support roller 173 and an upper support roller 175 in contact with each other on its upper and lower surfaces. The movement of the brush moving member 177 in the vertical direction Z is restricted by the lower support roller 173 and the upper support roller 175. The brush moving member 177 is supported to be movable in the front-back direction (X) by the lower support roller 173 and the upper support roller 175.

The brush moving member 177 has a first inclined surface 177a whose one end is inclined with respect to the longitudinal axis of the front-back direction (X). The brush moving member 177 has a second inclined surface 177b whose other end is inclined with respect to the longitudinal axis of the front-back direction (X). The first inclined surface 177a and the second inclined surface 177b have an inclination of approximately 45° with respect to the vertical direction Z. The first inclined surface 177a and the second inclined surface 177b have inclined surfaces in opposite directions to each other. The first slope 177a is a downward slope, and the surface goes down from the front (X) to the back (X). The second inclined surface 177b is a downward inclined surface, and the surface goes down from the rear (X) toward the front (X).

The rod 179 is mounted on the operating shaft 89a of the pressing actuator 89. The rod 179 is installed standing on the upper part of the operating shaft 89a. The rod 179 has a rod inclined surface 179a at its upper end. The tip of the rod inclined surface 179a is inclined with respect to the longitudinal axis of the rod 179. The rod inclined surface 179a has an inclined surface parallel to the first inclined surface 177a. The rod inclined surface 179a is formed at the same angle as the first inclined surface 177a.

The lifting member 181 is mounted on the carriage 113b of the linear guide 113. The lifting member 181 is installed standing upright on the upper part of the carriage 113b. The lifting member 181 extends in the vertical direction (Z). The lifting member 181 is connected to the brush 99 via the carriage 113b, the shaft holding portion 115, the rotation shaft 103, and the brush holder 101. In other words, the lifting member 181 has a brush 99 attached to its lower part. The lifting member 181 is disposed at the other end of the brush moving member 177. The lifting member 181 has an inclined surface 181a formed at its upper part. The inclined surface 181a faces forward (X). The inclined surface 181a is parallel to the second inclined surface 177b. The inclined surface 181a is formed at the same angle as the second inclined surface. The inclined surface 181a is an upward inclined surface, and the surface goes down from the rear (X) toward the front (X).

In addition, the above-mentioned lifting member 181 corresponds to the “bracket” in the present invention. The above-mentioned inclined surface 181a corresponds to the “bracket inclined surface” in the present invention.

The cleaning arm 45A of this configuration operates as follows. Here, refer to FIG. 11. Fig. 11 is a diagram illustrating the operation of a cleaning arm according to a modified example.

In the cleaning arm 45A, the pressure actuator 89 operates in response to pressure. For example, the rod 179 rises as the operating shaft 89a rises. At this time, the rod slope 179a rises and translates. Accordingly, the first inclined surface 177a and the second inclined surface 177b of the brush moving member 177 are translated rearward (X). That is, the first inclined surface 177a and the second inclined surface 177b move backward (X). Additionally, the inclined surface 181 of the lifting member 181 is translated and lowered in the vertical direction (Z). Accordingly, as the rod 179 rises, the brush 99 descends. Additionally, when the operating shaft 89a descends, the rod 179 descends, and the rod inclined surface 179a descends and translates. Accordingly, the lifting member 181 is raised by the elastic pressure of the coil spring 111, and the inclined surface 181a rises and translates. Additionally, the first inclined surface 177a and the second inclined surface 177b of the brush moving member 177 are translated forward (X). Even with this configuration, the pressure of the brush 99 can be adjusted as in the above-described embodiment.

In this modification, the brush moving member 177 is supported by the upper support roller 175 and the lower support roller 173, so when viewed from the pressing actuator 89, the self-weight of the brush moving member 177 cancels. do. Accordingly, even when the rod 179 of the pressing actuator 89 makes a slight advance or retreat, the brush moving member 177 can be moved according to the slight advance or retreat. As a result, even if a small amount of pressure is applied, the pressure can be applied accurately.

The present invention is not limited to the above-described embodiments and can be modified and implemented as follows.

(1) In the above-described embodiment, a backside cleaning unit (SSR) was used as an example as a substrate processing device. However, the present invention is not limited to the backside cleaning unit (SSR). For example, it can be applied even if it is a surface cleaning unit that cleans the surface of the substrate with a brush 99.

(2) In the above-described embodiment, the back side cleaning unit (SSR) (processing unit 31) as a substrate processing device is attached to the substrate processing device 1 provided with the loading/unloading block 3, the indexer block 5, etc. The provided configuration was explained as an example. However, the present invention is not limited to this configuration. For example, it may be comprised only of the back side cleaning unit (SSR) (processing unit 31).

(3) In the above-described embodiment, the cleaning arm 45 is not provided with a mechanism for detecting the load applied to the brush 99. However, the present invention is not limited to this configuration. For example, it may be configured to detect the force applied to the carriage 113b using a load cell and detect the degree of agreement with the target load.

(4) In the above-described embodiment, when the primary side pressure is below a predetermined value, an alarm is generated and the cycle is stopped. However, the present invention is not limited to this configuration. For example, in addition to generating an alarm, the processing for the substrate W currently being processed may be stopped immediately.

(5) In the above-described embodiment, based on the correspondence between the actual load obtained in advance and the correspondence between the opening degree of the pneumatic regulator 157 and the secondary pressure, an input signal is applied to set the pressure of the brush 99 to the target load. Feedback is performed so that the secondary side pressure gauge 159 becomes the secondary pressure corresponding to the opening degree, and the input signal is adjusted to set the pressure as the target load. However, the present invention does not require such feedback.

(6) In the above-described embodiment, the back surface cleaning unit (SSR) is provided with a first processing liquid arm 41 and a second processing liquid arm 43 in addition to the cleaning arm 45. However, the present invention does not require these. For example, the first processing liquid arm 41 or the second processing liquid arm 43 may be omitted, and the cleaning arm 45 may be provided with a processing liquid supply system.

(7) In the above-described embodiments and modifications, the cleaning arm 45 is provided with a seesaw member 87 and a brush moving member 177, and a configuration is adopted in which the power point portion and the action point portion are spaced apart in the anteroposterior direction (X). I'm doing it. However, the present invention is not limited to this configuration. In other words, the configuration may be such that the power point portion and the action point portion are provided at approximately the same position in the front-back direction (X).

1: Substrate processing device 3: Carry-in/out block
5: Indexer block 7: Processing block
W: Substrate C: Carrier
IR: Indexer Robot 15: Water Department
23: first inversion unit 25, 27: pass unit
29: second inversion unit 31: processing unit
SSR: Backside cleaning unit CR: Center robot
37: rotation holding part 39: guard
41: first treatment liquid arm 42: electric motor
43: second treatment liquid arm 45: cleaning arm
47: standby port 53: spin chuck
71: Rotating lifting mechanism 75: Housing
77: cleaning unit 81: pressing mechanism
83: rotation mechanism 85: branch member
87: Seesaw member 87c: Central part
87l: one side 87r: other side
89: Actuator for pressing 91: Support mechanism
93: holding member 95: elastic pressing portion
97: Guide part 99: Brush
101: brush holder 103: rotation axis
111: coil spring 113: linear guide
149: air supply pipe 151: air source
155: Primary side pressure gauge 157: Pneumatic regulator
159: Secondary side pressure gauge 161: Control unit
163: Instruction unit 165: Notification unit

Claims (7)

In a substrate processing apparatus that performs a cleaning process by applying a brush to a substrate,
a rotation holding unit that holds the substrate in a horizontal position and rotates the substrate;
a brush that acts on the upper surface of the substrate held in the rotation holding unit;
a pressing mechanism that elastically presses the brush toward the substrate by supplying air;
an air supply pipe having one end connected in communication with an air supply source and the other end connected in communication with the pressing mechanism;
an electro-pneumatic regulator that adjusts the opening degree according to an input signal to adjust the air pressure in the air supply pipe;
A primary side pressure gauge disposed between the air supply source and the pneumatic regulator in the air supply pipe, and detecting the pressure on the primary side of the pneumatic regulator as the primary side pressure;
A secondary side pressure gauge disposed in the air supply pipe between the pneumatic regulator and the pressure mechanism, and detecting the pressure on the secondary side of the pneumatic regulator as the secondary pressure;
A control unit that operates the input signal and monitors the primary pressure gauge and the secondary pressure gauge.
A substrate processing device comprising: In claim 1,
A substrate processing apparatus, wherein the control unit issues an alarm when the primary side pressure is below a predetermined value. In claim 2,
The substrate processing apparatus, wherein the control unit stops processing when the cleaning process for the substrate held by the rotation holding unit is completed when the primary side pressure is below a predetermined value. The method according to any one of claims 1 to 3,
The control unit, in a state where the electronic balance is placed at the position where the substrate is placed on the rotation holding unit, determines a correspondence relationship between the opening degree of the electropneumatic regulator obtained in advance and the actual load measured by the electronic balance, Based on the correspondence relationship between the opening degree of the electropneumatic regulator and the secondary pressure, from the opening degree of the electropneumatic regulator obtained from the correspondence relationship between the target load to be applied to the substrate and the actual measured load, the secondary pressure gauge corresponds to the opening degree. A substrate processing device characterized in that the pressure of the brush is adjusted to the target load by adjusting the input signal to become the secondary pressure. The method according to any one of claims 1 to 3,
The pressing mechanism is,
A seesaw member configured to be able to swing using a fulcrum as a fulcrum, having a force point on one side with respect to the fulcrum, and an action fulcrum on the other side with respect to the fulcrum;
and a pressure actuator that applies a driving force based on air to the pressure point and swings the seesaw member around the point, thereby applying pressure to press the brush to the upper surface of the substrate. Substrate processing equipment. The method according to any one of claims 1 to 3,
The pressing mechanism is,
a brush moving member that is elastically pressed at one end in response to pressure and moves the brush at the other end;
a support member supporting upper and lower surfaces of the brush moving member and allowing movement in the longitudinal direction;
a bracket on which the brush is mounted at a lower portion and disposed on the other end of the brush moving member;
An actuator for pressure, which has a rod that advances and retreats by supplying air according to pressure, and moves the brush moving member by bringing the tip of the rod into contact with one end of the brush moving member.
Equipped with
The rod has a rod inclined surface at which the distal end is inclined with respect to a longitudinal axis,
The brush moving member has a first inclined surface inclined at one end with respect to the longitudinal axis and inclined along the rod inclined surface, and a second inclined surface at the other end inclined with respect to the longitudinal axis,
The bracket has an upper portion of the bracket inclined surface inclined along the second inclined surface,
A substrate processing apparatus, wherein the brush moving member advances and retreats in the longitudinal direction as the rod advances and retreats. In a substrate processing method in which a cleaning treatment is performed by applying a brush to a substrate,
When carrying out the process of applying pressure to the upper surface of the substrate held in the rotation holding unit by applying a brush through a pressing mechanism,
A process of detecting the primary side pressure between the air supply source and a pneumatic regulator that adjusts the pressure of air in the air supply pipe among the air supply pipes whose ends are connected in communication with the air supply source and the other end with the pressure mechanism. class,
If the primary side pressure is below a predetermined value, the process of issuing an alarm
A substrate processing method characterized by carrying out.