KR20240029593A - Display panel and manufacturing method thereof - Google Patents

Abstract

A display panel according to an aspect of the present invention includes a base layer including a display area and a non-display area, first color light emitting elements disposed on the base layer, and second color light emitting elements overlapping the display area. , and third color light emitting elements, disposed on the base layer, overlapping the non-display area, and including a reference mark and a plurality of first groups of marks aligned with the reference mark in a first direction. , and disposed on the base layer, overlapping the non-display area, and including inspection organic patterns disposed to correspond to the plurality of first group marks, the plurality of first group marks, and The spacing between two adjacent marks among the reference marks is N/4 times the spacing between two adjacent first color light emitting devices in the first direction among the first color light emitting devices, where N may be a natural number. .

Description

Display panel and its manufacturing method {DISPLAY PANEL AND MANUFACTURING METHOD THEREOF}

The present invention relates to a display panel and a method of manufacturing the same, and more specifically, to a display panel including a light emitting device in which a plurality of organic patterns are stacked and a plurality of organic patterns for inspection, and a method of manufacturing the same.

An organic light emitting device is a display device that has a light emitting layer made of organic material between an anode electrode and a cathode electrode. Holes provided from the anode electrode and electrons provided from the cathode electrode combine in the light-emitting layer to form excitons, and then light corresponding to the energy between the holes and electrons is generated from the excitons.

Tandem organic light emitting devices have a structure consisting of two or more stacks of hole transport layer/light emitting layer/electron transport layer between the anode electrode and cathode electrode, and a charge generation layer (charge generation layer) that helps the generation and movement of charges between each stack. Charge Generation layer) exists.

In order to solve the above problem, the purpose of the present invention is to provide a display panel that can check the offset value of a mask using a plurality of inspection organic patterns formed when forming a plurality of organic patterns.

The purpose of the present invention is to provide a method of manufacturing a display panel capable of forming the plurality of stacked organic patterns and a plurality of inspection organic patterns spaced apart from each other using a single mask.

A display panel according to an embodiment of the present invention includes a base layer, first color light emitting elements, second color light emitting elements, third color light emitting elements, a mark, and organic patterns for inspection. The base layer includes a display area and a non-display area. First color light emitting devices, second color light emitting devices, and third color light emitting devices are disposed on the base layer and overlap the display area. The mark is disposed on the base layer, overlaps the non-display area, and includes a reference mark and a plurality of first groups of marks aligned with the reference mark in a first direction. The organic patterns for inspection are disposed on the base layer, overlap the non-display area, and are disposed to correspond to the plurality of marks of the first group.

The spacing between two adjacent marks among the plurality of first group marks and the reference mark is N / the spacing between two adjacent first color light emitting devices in the first direction among the first color light emitting devices. 4 times, where N can be a natural number.

The mark is disposed on the base layer, overlaps the non-display area, and may further include a plurality of second groups of marks aligned with the reference mark in a second direction.

The spacing between adjacent marks among the plurality of second group marks and the reference mark is N/2 times the spacing between two adjacent first color light emitting devices in the second direction among the first color light emitting devices. , where N may be a natural number.

The organic patterns for inspection may be arranged to correspond to the plurality of marks of the second group.

The first color light emitting device may include at least one organic layer.

The at least one organic layer may include a first light-emitting layer, a charge generation layer disposed on the first light-emitting layer, and a second light-emitting layer disposed on the charge generation layer.

The first light-emitting layer may include the same organic material as one of the organic inspection patterns, and the charge generation layer may include the same organic material as another one of the inspection organic patterns.

The distance between one organic pattern for inspection and the other organic pattern for inspection may be substantially four times the distance between the two adjacent marks.

Each of the first color light emitting devices includes a first light emitting area and each of the second color light emitting devices includes a second light emitting area, and the first light emitting area and the second light emitting area may be different.

The non-display area includes a first area adjacent to the display area and a second area in which a portion of the area is further away from the display area than the first area, and the display panel is a dummy organic device disposed in the first area. It may further include patterns, and the dummy organic patterns may have substantially the same shape on a plane as the light emitting layer of the first color light emitting devices.

The dummy organic patterns may include at least one organic layer.

The dummy organic patterns include a plurality of dummy organic pattern groups, and the number of organic layers may be different between the dummy organic pattern groups.

The first color light emitting device includes a first light emitting layer, a charge generation layer disposed on the first light emitting layer, and a second light emitting layer disposed on the charge generation layer, and the dummy organic pattern is larger than the first color light emitting device. It includes a small number of organic layers, and the organic layer of the dummy organic pattern may include the same material as any one of the first light-emitting layer, the charge generation layer, and the second light-emitting layer.

A display panel manufacturing method according to an aspect of the present invention includes preparing a plurality of masks of a first group, each of which has a plurality of pattern holes and at least one inspection pattern hole defined, an active area and A first organic layer is applied to the active area using a first mask among the plurality of first group masks on a working substrate including a non-active area in which first marks and second marks are formed adjacent to each other and arranged in the first direction. forming a first inspection organic pattern in the pattern and the non-active area, using a second mask among the plurality of first group masks based on the state in which the first mask is aligned with respect to the work substrate; Aligning by shifting along a first direction, and using the second mask to create a second organic pattern overlapping the first organic pattern in the active area and spaced apart from the first organic pattern for inspection in the non-active area. Forming a second organic pattern for inspection, wherein the first organic pattern for inspection may be arranged to correspond to the first mark, and the second organic pattern for inspection may be arranged to correspond to the second mark. there is.

A method of manufacturing a display panel according to an aspect of the present invention includes comparing a position of the first mark and a position of the first organic pattern for inspection in the first direction, and comparing the position of the first organic pattern for inspection in the first direction. 2 The step of comparing the position of the mark and the position of the second organic pattern for inspection may be further included.

The working substrate may further include a reference mark aligned with the first mark and the second mark in the first direction within the non-active area and a third mark aligned with the reference mark in the second direction. there is.

A display panel manufacturing method according to an aspect of the present invention includes shifting a third mask among the plurality of first group masks along the second direction based on the alignment of the second mask with respect to the work substrate. aligning a third organic pattern overlapping the second organic pattern in the active area and a third organic pattern for inspection spaced apart from the second organic pattern in the non-active area using the third mask. The method may further include forming, and the third organic pattern for inspection may be arranged to correspond to the third mark.

The display panel manufacturing method according to one aspect of the present invention may further include comparing the positions of the third mark and the third organic pattern for inspection.

In the method of manufacturing a display panel according to an aspect of the present invention, the working substrate further includes the first mark and a third mark and a fourth mark arranged in the first direction, each of which has a plurality of pattern holes and at least one Preparing a plurality of masks of a second group in which holes for inspection patterns are defined, spaced apart from the first organic pattern in the active area using a first mask of the plurality of masks of the second group on the work substrate. forming a third organic pattern for inspection in the non-active area and the third organic pattern, applying a second mask of the plurality of second groups of masks to the work substrate; shifting and aligning the first mask along the first direction based on the aligned state, and forming the third organic pattern in the active area using the second mask among the plurality of second groups of masks. forming a fourth organic pattern overlapping with a fourth organic pattern for inspection and a fourth organic inspection pattern spaced apart from the third organic pattern in the non-active area, wherein the third organic pattern for inspection corresponds to the third mark. and the fourth organic pattern for inspection may be arranged to correspond to the fourth mark.

The first organic pattern and the third organic pattern may be in contact with a common layer.

According to the above, organic patterns for inspection can be formed when forming the first color light emitting devices, the second color light emitting devices, and the third color light emitting devices. The offset value of the mask with respect to the working substrate can be confirmed using the formed inspection organic patterns and marks.

A mask is used to form a plurality of organic patterns for inspection spaced apart from each other with first color light emitting elements, second color light emitting elements, and third light emitting elements overlapping in the display area, tandem organic light emission. It can also be applied when two or more stacks are stacked, such as devices.

1 is a plan view of a display panel according to an embodiment of the present invention.
Figure 2 is a cross-sectional view corresponding to line Ⅰ-Ⅰ' in Figure 1.
FIG. 3 is a cross-sectional view of the dummy organic patterns of FIG. 1.
Figure 4 is an enlarged plan view of the non-display area of Figure 1.
Figures 5a and 5b show the relationship between the spacing of light emitting elements and the spacing of marks.
Figure 6 is a cross-sectional view of a deposition facility according to an embodiment of the present invention.
Figure 7 is an exploded perspective view of the mask assembly of Figure 6.
Figure 8 is a plan view of the mask assembly of Figure 6.
FIG. 9A is an enlarged plan view showing the cell area of the first group of masks according to an embodiment of the present invention.
Figure 9b is an enlarged plan view showing the cell area of the second group of masks according to an embodiment of the present invention.
Figure 9c is an enlarged plan view showing the cell area of the third group of masks according to an embodiment of the present invention.
Figure 10 is a diagram showing first to third deposition processes according to an embodiment of the present invention.
FIG. 11 is a diagram showing a working substrate including organic patterns formed according to first to third deposition processes using masks of the first group according to an embodiment of the present invention.
FIG. 12 is a diagram illustrating a working substrate including organic patterns formed according to first to third deposition processes using masks of the second group according to an embodiment of the present invention.
FIG. 13 is a diagram illustrating a working substrate including organic patterns formed according to first to third deposition processes using masks of the third group according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification, when a component (or region, layer, part, etc.) is referred to as being “on,” “connected to,” or “coupled to” another component, it is directly connected/connected to another component. This means that they can be combined or a third component can be placed between them.

Like reference numerals refer to like elements. Additionally, in the drawings, the thickness, proportions, and dimensions of components are exaggerated for effective explanation of technical content. “And/or” includes all combinations of one or more that the associated configurations may define.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

Additionally, terms such as “below,” “on the lower side,” “above,” and “on the upper side” are used to describe the relationship between the components shown in the drawings. The above terms are relative concepts and are explained based on the direction indicated in the drawings.

Terms such as “include” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but do not include one or more other features, numbers, or steps. , it should be understood that it does not exclude in advance the possibility of the existence or addition of operations, components, parts, or combinations thereof.

Hereinafter, the display panel DP according to an embodiment of the present invention will be described.

1 is a front view of a display panel DP according to an embodiment of the present invention.

Referring to FIG. 1, the display panel DP includes a display area DP-DA and a non-display area DP-NDA disposed outside the display area DP-DA. Pixels (PX-B, PX-G, PX-R) are arranged in the display area (DP-DA). Pixels (PX-B, PX-G, PX-R) are not placed in the non-display area (DP-NDA).

The pixels (PX-B, PX-G, PX-R) include first color pixels (PX-B), second color pixels (PX-G), and third color pixels (PX-R). can do. The first color pixels (PX-B), the second color pixels (PX-G), and the third color pixels (PX-R) may have different surface areas where light is emitted.

The non-display area (DP-NDA) includes the first area (NDA1) where the dummy organic patterns (DM-B, DM-G, DM-R) are arranged and the dummy organic patterns (DM-B, DM-G, DM). -R) may include a non-placed second region (NDA2). Some areas of the second area NDA2 are farther away from the display area DP-DA than the first area NDA1. FIG. 1 exemplarily shows a first area NDA1 including a portion extending in the second direction DR2 and a portion extending in the first direction DR1.

Here, each of the dummy organic patterns (DM-B, DM-G, DM-R) is formed when forming an organic layer of the corresponding pixel among the pixels (PX-B, PX-G, PX-R). Each of the patterns (DM-B, DM-G, and DM-R) may have the same area on the plane as the organic layer of the corresponding pixel. In Figure 1, the area of the pixels (PX-B, PX-G, and PX-R) refers to the area of the organic layer.

Marks M and inspection organic patterns CO may be disposed in the second area NDA2. The marks M may include a first group of marks M_1, a reference mark M_2, and a second group of marks M_3. The marks M can be used to check whether the mask MSK and the working substrate WS are properly aligned by comparing their positions with the organic patterns CO for inspection.

The first group of marks M_1 may be aligned with the reference mark M_2 in the first direction DR1. The first group of marks M_1 are located on the right side of the reference mark M_2 and the 1-1 group of marks M_11 located on the left side of the reference mark M_2 in the first direction DR1. It may include marks (M_12) of the 1st-2nd group.

The second group of marks M_3 may be aligned with the reference mark M_2 in the second direction DR2. The second group of marks (M_3) include the 2-1 group mark (M_31) disposed below the reference mark (M_2) and the 2-2 group mark (M_32) disposed above the reference mark (M_2). ) may include.

The organic patterns CO_1 for inspection may include organic patterns CO_1 for first-step inspection, organic patterns CO_2 for second-step inspection, and organic patterns CO_3 for third-step inspection.

Each of the first-stage inspection organic patterns CO_1, the second-stage inspection organic patterns CO_2, and the third-stage inspection organic patterns CO_3 is a mark of the first group in the second direction DR2. is substantially aligned with the corresponding mark among the fields (M_1). The arrangement relationship between the inspection organic patterns CO and the marks M will be described later with reference to FIG. 4 .

The first direction pixel pitch PP1 may be the gap between two adjacent first color pixels PX-B in the first direction DR1. The second direction pixel pitch PP2 may be the gap between two adjacent first color pixels PX-B in the second direction DR2. The gap between adjacent pixels can be defined as the distance between the centers of pixels.

FIG. 2 is a cross-sectional view corresponding to the first color pixel (PX-B) of FIG. 1.

Referring to FIG. 2, the display panel may include a base layer (BS), a circuit layer (DP-CL), and a device layer (DP-ED).

The base layer BS may be a base surface on which the device layer DP-ED is disposed. The base layer (BS) may be a glass substrate, a metal substrate, or a plastic substrate. However, the base layer (BS) is not limited to this and various substrates can be used.

The circuit layer (DP-CL) includes a buffer layer (BFL), a first gate insulating layer (GI1), a second gate insulating layer (GI2), an interlayer insulating layer (ILD), an upper insulating layer (VIA1), and a plurality of patterns. a semiconductor pattern (ACP), a first conductive layer (CLP1) including a plurality of patterns, a second conductive layer (CLP2) including a plurality of patterns, and a third conductive layer (CLP3) including a plurality of patterns. It can be included.

The buffer layer (BFL) may be disposed on the base layer (BS). The buffer layer (BFL) prevents impurities present in the base layer (BS) from entering the pixel. In particular, it prevents impurities from diffusing into the semiconductor pattern (ACP) of the transistors (T1 and T2) constituting the pixel (PX).

The first gate insulating layer GI1 is disposed on the buffer layer BFL and may cover the semiconductor pattern ACP. The first conductive layer CLP1 may be disposed on the first gate insulating layer GI1. The gate G1 of the first transistor T1 and the gate G2 of the second transistor T2 are shown in the first conductive layer CLP1. Although not separately shown, in one embodiment of the present invention, the first conductive layer CLP1 may include one of two electrodes constituting the capacitor of the pixel PX.

Each of the first gate insulating layer GI1, the second gate insulating layer GI2, and the interlayer insulating layer ILD includes an organic layer and/or an inorganic layer. Each of the first gate insulating layer GI1, the second gate insulating layer GI2, and the interlayer insulating layer ILD may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

Here, the first conductive layer CLP1 may include a first gate metal pattern, the second conductive layer CLP2 may include a second gate metal pattern, and the third conductive layer CLP3 may include a first data metal pattern.

Each of the first conductive layer (CLP1) and the second conductive layer (CLP2) may include molybdenum (Mo), but is not limited thereto.

The third conductive layer CLP3 may include at least one of aluminum (Al) and titanium (Ti), but is not limited thereto. In one embodiment of the present invention, the third conductive layer CLP3 may have a structure in which titanium, aluminum, and titanium are stacked in that order.

Impurities may be introduced from the outside or may be generated by thermal decomposition of the base layer (BS). The impurity may be gas or sodium released from the base layer (BS). Additionally, the buffer layer (BFL) can block moisture flowing into the pixel from the outside.

A semiconductor pattern (ACP) is disposed on the buffer layer (BFL). In one embodiment of the present invention, the semiconductor pattern (ACP) may be disposed on the buffer layer (BFL).

The semiconductor pattern (ACP) may constitute each of the transistors (T1 and T2). The semiconductor pattern (ACP) may include polysilicon, amorphous silicon, or metal oxide semiconductor. In Figure 2, the semiconductor pattern constituting the source (S1), active (C1), and drain (D1) of the first transistor (T1) and the source (S2), active (C2), and drain (D2) of the second transistor (T2). ) shows the semiconductor pattern that constitutes.

The second gate insulating layer GI2 is disposed on the first gate insulating layer GI1 and may cover the first conductive layer CLP1. The second conductive layer CLP2 may be disposed on the second gate insulating layer GI2. In one embodiment of the present invention, the second conductive layer CLP2 may be the other one of two electrodes constituting the capacitor of the pixel PX. The upper electrode (UE) is shown as a second conductive layer (CLP2).

The interlayer insulating layer (ILD) may be disposed on the second gate insulating layer (GI2) and cover the second conductive layer (CLP2). The first connection electrodes CNE-D1 of the third conductive layer CLP3 may be connected to the source S2 of the second transistor T2. The upper insulating layer (VIA1) is disposed on the interlayer insulating layer (ILD) and may cover the third conductive layer (CLP3).

The device layer (DP-ED) may include a pixel defining layer (PDL), a first color light emitting device (ED-1), a capping layer (CPL), and an encapsulation layer (TFE). The device layer (DP-ED) includes a first color light emitting device (ED-1) disposed between the pixel defining layers (PDL), a capping layer (CPL) disposed on the first color light emitting device (ED-1), and It may include an encapsulation layer (TFE).

The first color light emitting device (ED-1) is disposed on the base layer (BS) and may overlap the display area (DP-DA). That is, the first color light emitting devices ED-1 may be formed by overlapping at least one organic layer.

The first color light emitting device ED-1 may include a plurality of organic layers. The at least one organic layer may include a first emitting layer (EML1), a charge generating layer (CGL) disposed on the first emitting layer (EML1), and a second emitting layer (EML2) disposed on the charge generating layer (CGL). there is.

That is, each of the first color light emitting devices (ED-1) includes a first electrode (EL1), a second electrode (EL2) facing the first electrode (EL1), the first electrode (EL1), and the second electrode (EL2). It may include a hole transport region (HTR), at least one organic layer, and an electron transport region (ETR) sequentially disposed therebetween.

The first color light emitting element (ED-1) is disposed between the first electrode (EL1), the second electrode (EL2) facing the first electrode (EL1), and the first electrode (EL1) and the second electrode (EL2). It may include a plurality of organic layers. The plurality of organic layers may include a first emitting layer (EML1), a charge generating layer (CGL) disposed on the first emitting layer (EML1), and a second emitting layer (EML2) disposed on the charge generating layer (CGL). . A hole transport region (HTR) is disposed between the first electrode (EL1) and the first emitting layer (EML1), and an electron transport region (ETR) is further disposed between the second emitting layer (EML2) and the second electrode (EL2). You can. Although not shown, an intermediate electron transport region that transports electrons generated from the charge generation layer (CGL) to the first emitting layer (EML1) and a middle electron transport region that transports holes generated from the charge generation layer (CGL) to the second emitting layer (EML) An intermediate hole transport region may be further disposed.

The first color light emitting device ED-1 may emit light from the first electrode EL1 to the second electrode EL2. The first color light emitting devices (ED-1) have a hole transport region (HTR) disposed below the first light emitting layer (EML1) based on the direction in which light is emitted, and an electron transport region (ETR) located in the second light emitting layer (EML1). The structure disposed on the upper part of the EML2) is shown as an example, but is not limited thereto, and based on the direction of emitting light, the electron transport region (ETR) is disposed at the lower part of the first light emitting layer (EML1) and the hole transport region (EML1) HTR) may have an inverted device structure disposed on top of the second light emitting layer (EML2).

The first emission layer (EML1) and the second emission layer (EML2) of the first color light emitting elements (ED-1) may be disposed in the opening (OH1) defined in the pixel defining layer (PDL). The charge generation layer (CGL) disposed between the first emitting layer (EML1) and the second emitting layer (EML2) may also be disposed in the opening (OH1). The hole transport region (HTR), the electron transport region (ETR), and the second electrode EL2 may be provided as common layers in the second color light emitting devices and the third color light emitting devices. However, the embodiment is not limited to this, and the electron transport region (ETR) and the hole transport region (HTR) may be respectively patterned and provided inside the opening (OH1) defined in the pixel defining layer (PDL).

Here, the first light emitting layer (EML1) may include the same organic material as any one of the organic inspection patterns (CO) of FIG. 1. The charge generation layer (CGL) may include the same organic material as another one of the organic patterns (CO) for inspection. The second light emitting layer (EML2) may include the same organic material as another one of the organic patterns (CO) for inspection.

The second color light emitting device of the second color pixel (PX-G) in FIG. 1 and the third color light emitting device of the third color pixel (PX-R) in FIG. 1 differ only in the organic materials on which they are laminated, and the first color light emitting device It has the same structure as the light emitting device (ED-1).

The capping layer (CPL) may be disposed on the second electrode (EL2) of the first color light emitting device (ED-1). The capping layer (CPL) may include multiple layers or a single layer. The capping layer (CPL) may be an organic layer or an inorganic layer. For example, when the capping layer (CPL) includes an inorganic material, the inorganic material may include an alkali metal compound such as LiF, an alkaline earth metal compound such as MgF2, _SiON , _SiN

The encapsulation layer (TFE) may be disposed on the second electrode (EL2) and fill a portion of the opening (OH1). The encapsulation layer (TFE) may cover the first color light emitting device (ED-1). The encapsulation layer (TFE) may seal the device layer (DP-ED). The encapsulation layer (TFE) may be a thin film encapsulation layer. The encapsulation layer (TFE) may be one layer or a stack of multiple layers. The encapsulation layer (TFE) may include at least one insulating layer. The encapsulation layer (TFE) according to one embodiment may include at least one inorganic layer (hereinafter referred to as an inorganic encapsulation layer). Additionally, the encapsulation layer (TFE) according to one embodiment may include at least one organic layer (hereinafter referred to as encapsulation organic layer) and at least one encapsulation inorganic layer.

Figure 3 is a cross-sectional view showing the stacked structure of the dummy organic patterns (DM-B). FIG. 3 shows dummy organic patterns (DM-B) generated during the formation of the first color pixel (PX-B) of FIG. 1, that is, generated during the formation of the first color light emitting device (ED-1) of FIG. 2. Only the dummy organic patterns (DM-B) are shown. However, it is not limited thereto, and the dummy organic patterns (DM-G, DM-R) generated in the process of forming the second color pixel (PX-G) and the third color pixel (PX-R) in FIG. It can be further placed in the display area (DP-NDA). The description of the dummy organic patterns DM-B, which will be described later, can be equally applied to the dummy organic patterns DM-G and DM-R, which are not shown.

The dummy organic patterns DM-B may be disposed inside the device layer DP-ED. The dummy organic patterns DM-B may be disposed between the hole transport region HTR and the electron transport region ETR.

Unlike the display area DP-DA of FIG. 2, pixel driving circuits such as the first transistor T1 and the second transistor T2 are not disposed in the non-display area DP-NDA. This is because, unlike the display area (DP-DA) of FIG. 2, the first color light emitting element (ED-1) is not disposed in the non-display area (DP-NDA). Dummy organic patterns (DM-B) formed simultaneously during the formation process of the first color light emitting device (ED-1) are disposed in the non-display area (DP-NDA).

The dummy organic pattern DM-B may be disposed on the hole transport region HTR of the device layer DP-ED. The dummy organic patterns DM-B may include a single organic layer or two layers of organic layers depending on the location. The dummy organic pattern (DM-B) is connected to any one of the first light-emitting layer (EML-1), the charge generation layer (CGL), and the second light-emitting layer (EML2) of the first color light-emitting devices (ED-1) of FIG. 2. It may contain the same substance. The dummy organic pattern DM-B may include fewer organic layers than the first color light emitting devices ED-1 of FIG. 2 .

Figure 4 is an enlarged plan view of the second area (NDA2) of the non-display area (DP-NDA).

Referring to FIG. 4 , marks M and inspection organic patterns CO may be disposed in the second area NDA2 of the non-display area DP-NDA. An area where the marks (M) and inspection organic patterns (CO) are dense may be defined as an inspection area.

The marks M_11 of the 1-1 group may be used for position comparison with the organic patterns CO_1 for the first stage inspection using the mask MSK. The marks M_12 of the 1-2 group may be used for position comparison with the organic patterns CO_2 for second-stage inspection.

The first group of marks M_1 may be a plurality of marks aligned with a reference mark M_2, which will be described later, in the first direction DR1. The first group of marks M_1 are shown in the form of a plurality of thin rectangles, but the shape of the first group of marks M_1 is not limited to this and may have various shapes.

The first mark spacing d1, which is the spacing between two adjacent marks among the plurality of first group marks M_1 and the reference mark M_2, is N/4 times the first direction pixel pitch PP1, where N may be a natural number. Here, in order to prevent the inspection organic patterns CO from overlapping, the first mark spacing d1 may be 40 μm or more.

The reference mark (M_2) may be located in the center of the plurality of first group marks (M_1) and the plurality of second group marks (M_3). The reference mark (M_2) is shown as a cross shape with a certain thickness, but the shape of the reference mark (M_2) is not limited to this and may have various shapes.

The second group of marks (M_3) include the 2-1 group mark (M_31) disposed below the reference mark (M_2) and the 2-2 group mark (M_32) disposed above the reference mark (M_2). ) may include. The mark (M_31) of the 2-1 group can be used for position comparison with the organic patterns (CO_3) for third-stage inspection. The second group of marks M_3 may be a plurality of marks aligned with the reference mark M_2 and the second direction DR2. The second group of marks M_3 are shown in a thin rectangular shape, but are not limited to this and may have various shapes.

The second mark spacing d2, which is the spacing between adjacent marks among the plurality of second group marks M_3 and the reference mark M_2, is N/2 times the second direction pixel pitch PP2, where N is It can be a natural number. Here, in order to prevent the inspection organic patterns CO from overlapping, the second mark spacing d2 may be 20 μm or more.

The organic patterns CO for inspection may be arranged to correspond to the plurality of first group marks M_1 or the plurality of second group marks M_3. That is, the inspection organic patterns CO may be disposed at positions where the first group of marks M_1 are formed in the first direction DR1. The inspection organic patterns CO may be disposed at positions where the second group of marks M_3 are formed in the second direction.

The organic patterns for inspection (CO) are offset within the first direction (DR1) between the first center line (CL1) of the marks (M_1) of the first group and the center point (CP) of the organic patterns for inspection (CO). It can be used to check whether the mask (MSK) and the working substrate (WS) are properly aligned by measuring the (off-set).

When the mask MSK and the working substrate WS are properly aligned, the center point CP of the inspection organic patterns CO is aligned with the first center line CL1 and the second group of marks M_1. It is located on the second center line CL2 of the marks M_3 of the group. Here, only the first center line CL1 and the second center line CL2 are shown, but the first center line CL1 extends in the second direction DR2 passing through the center of the first group of marks M_1. The center line is collectively referred to as the center line, and the second center line CL2 is a general name for the center line extending in the first direction DR1 passing through the center of the second group of marks M_3.

If the alignment is not done properly, the center point CP of the organic patterns CO for inspection is the first center line CL1 of the first group of marks M_1 and the second center line of the second group of marks M_3. 2 It is located somewhat away from the center line (CL2). Here, the center point CP of the inspection organic patterns CO is the first center line CL1 of the first group of marks M_1 and the second center line CL2 of the second group of marks M_3. The distance away from is called offset. Based on the measured offset, when the same deposition process is performed next time, the mask (MSK) can be shifted to remove the offset.

The organic patterns for inspection (CO) have an offset in the second direction (DR2) between the second center line (CL2) of the marks (M_3) of the second group and the center point (CP) of the organic patterns for inspection (CO). It can be used to measure whether the mask (MSK) and the working substrate (WS) are properly aligned.

The first stage inspection organic patterns CO_1 are the first stage inspection organic patterns CO_1B of the first color formed in the light emitting device forming step of the first color pixel PX-B of FIG. 1, and the first stage inspection organic patterns CO_1B of FIG. The first-stage inspection organic pattern (CO_1G) of the second color formed in the light-emitting device formation step of the two-color pixel (PX-G) and the light-emitting device formation step of the third color pixel (PX-R) in FIG. It may include an organic pattern (CO_1R) for first-stage inspection of a third color. The organic patterns CO_1 for first-stage inspection may be located above the marks M_11 of the 1-1 group and to the left of the marks M_32 of the 2-2 group.

The second-stage inspection organic patterns (CO_2) are the first-color second-stage inspection organic patterns (CO_2B) formed in the light-emitting device forming step of the first color pixel (PX-B) of FIG. 1. The second color organic pattern for inspection (CO_2G) formed in the light emitting device forming step of the color pixel (PX-G) and the third color formed in the light emitting device forming step of the third color pixel (PX-R) in FIG. It may include an organic pattern (CO_2R) for second-stage color inspection. The organic patterns CO_2 for second-stage inspection may be located above the 1-2 group marks M_12 and to the right of the 2-2 group marks M_32. The spacing between the organic patterns CO_1 for first stage inspection and the organic patterns CO_2 for second stage inspection may be substantially four times the spacing between two adjacent marks M. However, the spacing between the organic patterns CO_1 for first stage inspection and the organic patterns CO_2 for second stage inspection is not exactly 4 times the spacing between two adjacent marks M, but is substantially longer than that including the offset. It could be four times that.

The third-stage inspection organic patterns (CO_3) are the third-stage inspection organic patterns (CO_3B) of the first color formed in the light-emitting device forming step of the first color pixel (PX-B) of FIG. 1. The third step inspection organic pattern (CO_3G) of the second color formed in the light emitting device forming step of the color pixel (PX-G) and the third color formed in the light emitting device forming step of the third color pixel (PX-R) of FIG. 1 It may include an organic pattern (CO_3R) for third-stage color inspection. The organic patterns CO_3 for third-stage inspection may be located below the marks M_12 of the 1-2 group and to the right of the marks M_31 of the 2-1 group.

5A and 5B show the relationship between the spacing of the pixels (PX-B, PX-G, and PX-R) and the spacing of the marks (M). The spacing of the pixels (PX-B, PX-G, and PX-R) may be the same as the spacing of the light emitting elements of the pixels (PX-B, PX-G, and PX-R).

Referring to FIGS. 5A and 5B , when the pixel pitch PP1 in the first direction increases or decreases, the spacing between adjacent marks can be adjusted. The explanation will be centered on the first direction pixel pitch PP1, but the distance between the first direction pixel pitch PP1 and the adjacent marks M in the first direction DR1, which will be described later, is the second direction pixel shown in FIG. The same may be applied to the pitch PP2 and the spacing between adjacent marks M in the second direction DR2. As shown in FIG. 5A, when the number of pixels per inch (PPI) or resolution is small, the pixel pitch PP1 in the first direction may be large. In this case, if the spacing between adjacent marks (M) is a constant multiple of the pixel pitch (PP1) in the first direction, the spacing between the marks (M) increases, so that the first stage inspection of the marks (M) and the first color is performed. The area of the inspection area where the organic pattern (CO_1B) is placed increases. Accordingly, if the area of the inspection area increases, a situation may occur that exceeds the effective inspection performance of the vision inspection device. In other words, the vision inspection device has a determined (limited) measurement area area to secure a standard resolution or higher. However, if the inspection area is outside the measurement area, the accuracy of the offset inspection decreases. Therefore, as shown in FIG. 5A, the area of the inspection area can be reduced by adjusting the spacing between adjacent marks M to a small value such as 1/4 times the pixel pitch PP1 in the first direction.

As shown in FIG. 5B, when the number of pixels per inch (PPI) is large, the pixel pitch PP1 in the first direction may become small. In this case, if the spacing between adjacent marks (M) is a constant multiple of the pixel pitch (PP1) in the first direction, the spacing between marks (M) is excessively reduced, and the organic pattern (CO_1B) for first stage inspection of the first color is This second color overlaps with the first stage inspection organic pattern (CO_1G), which may lower the reliability of offset measurement. Therefore, as shown in FIG. 5B, the spacing between adjacent marks M can be adjusted to a large value, such as twice the pixel pitch PP1 in the first direction, so that the organic patterns CO for inspection do not overlap.

Hereinafter, the deposition equipment (EDA) and a method of manufacturing the display panel (DP) using the deposition equipment (EDA) according to an embodiment of the present invention will be described.

Figure 6 is a cross-sectional view of an deposition equipment (EDA) according to an embodiment of the present invention.

Referring to FIG. 6, the deposition equipment (EDA) according to an embodiment of the present invention includes an deposition chamber (CB), a fixing member (CM), a deposition source (DS) disposed inside the deposition chamber (CB), and a mask assembly (MSA) disposed inside the deposition chamber (CB). Although not separately shown, the deposition equipment (EDA) may further include additional mechanical devices to implement an in-line system.

The deposition chamber (CB) can be set to vacuum deposition conditions. The deposition chamber (CB) may include a bottom surface, a ceiling surface, and side walls. The bottom surface of the deposition chamber CB is parallel to the plane defined by the first direction DR1 and the second direction DR2. The normal direction of the bottom surface of the deposition chamber CB is indicated by the third direction DR3.

The fixing member (CM) is disposed inside the deposition chamber (CB), is disposed on the deposition source (DS), and fixes the mask assembly (MSA). The fixing member (CM) may be installed on the ceiling of the deposition chamber (CB). The fixing member (CM) may include a jig or robot arm that holds the mask assembly (MSA).

The fixing member (CM) includes a body portion (BD) and magnetic materials (MM) coupled to the body portion (BD). The body portion (BD) may include a plate as a basic structure for fixing the mask assembly (MSA), but is not limited thereto. The magnetic materials MM may be placed inside or outside the body portion BD. The magnetic materials (MM) can secure the mask assembly (MSA) with magnetic force.

The deposition source DS may evaporate the deposition material, such as a light-emitting material, and eject it as deposition vapor. The deposition vapor passes through the mask assembly (MSA) and is deposited on the working substrate (WS) in a predetermined pattern. The working substrate (WS) is defined as an intermediate substrate for manufacturing the display panel (DP).

The mask assembly (MSA) is disposed inside the deposition chamber (CB), is disposed on the deposition source (DS), and supports the working substrate (WS). The working substrate (WS) may include a glass substrate or a plastic substrate. The working substrate WS may include a polymer layer disposed on a base substrate.

The mask assembly (MSA) may include a frame (FM), a plurality of sticks (ST), and a plurality of masks (MSK). In this embodiment, the mask assembly (MSA) is shown including one type of sticks (ST) extending in the same direction. However, in one embodiment of the present invention, the mask assembly (MSA) includes different types of sticks (ST) extending in different directions. Additional sticks may be included.

FIG. 7 is an exploded perspective view of the mask assembly (MSA) of FIG. 6, and FIG. 8 is a plan view of the mask assembly (MSA) of FIG. 6. The mask assembly (MSA) used to form the first color light emitting device (ED-1) of FIG. 2 is exemplarily shown in FIGS. 7 and 8.

Referring to FIG. 7, a first opening OP-F is defined on the inside of the frame FM. The frame FM may have a rectangular shape on a plane. The frame FM may have a first length in the first direction DR1 and a second length in the second direction DR2 that is different from the first length. In this embodiment, the first length is longer than the second length.

Referring to FIGS. 7 and 8 , the frame FM may be made of a metal material. For example, it may include Invar, which has a relatively small thermal expansion coefficient. The frame FM may include, for example, nickel (Ni), nickel-cobalt alloy, nickel-iron alloy, etc. The frame (FM) may include four parts. The frame FM may include a first extension part FM-1 and a second extension part FM-2 facing each other in the first direction DR1. The frame FM has third and fourth extension parts (FM-3) facing in the second direction (DR2) and each connecting the first extension part (FM-1) and the second extension part (FM-2). May include an extension portion (FM-4). The first to fourth extension parts FM-1 to FM-4 may be joined by welding or may have an integrated shape.

A plurality of coupling grooves may be defined in the frame FM. For example, coupling grooves CGV to which the sticks ST are coupled may be defined in each of the first extension part FM-1 and the second extension part FM-2. The sticks ST are coupled to the frame FM so as to overlap the first opening OP-F. Parts on both sides of each stick (ST) are coupled to coupling grooves (CGV).

The mask MSK may be placed on the frame FM, and the first group mask MSK_B may be used as the mask MSK. The first group of masks (MSK_B) are disposed on the frame (FM) and the sticks (ST), extend in the second direction (DR2), and may be arranged in the first direction (DR1). The first group mask (MSK_B) may include Invar with a small thermal expansion coefficient as its material. The first group of masks (MSK_B) may include, for example, nickel (Ni), nickel-cobalt alloy, nickel-iron alloy, etc. Each of the first group of masks (MSK_B) may include a plurality of unit cells (C-B) extending in the second direction.

The first group of masks (MSK_B) may be coupled to the frame (FM) by welding. In the process of manufacturing the mask assembly (MSA), the first group of masks (MSK_B) are welded to the frame FM while each of the first group of masks (MSK_B) is tensioned in the second direction (DR2).

The sticks ST may extend in the first direction DR1 and be aligned in the second direction DR2. The sticks (ST) have a weak bonding force to the magnetic materials (MM) compared to the frame (FM) and/or the first group mask (MSK_B). The sticks ST may include a material that does not respond to magnetic force, such as stainless steel.

In Figure 7, three sticks (ST1 to ST3) are shown as examples. The shape of the sticks ST may be linear to reduce thermal deformation of the mask assembly MSA. The width W1 of the area overlapping the first opening OP-F of the sticks ST in the second direction DR2 may have a constant value. This shape can minimize thermal deformation of the sticks ST and control the deformation of the sticks ST so that uniform deformation occurs regardless of area. As a result, deformation of the sticks ST can be suppressed, and deformation of the frame FM can also be suppressed.

The mask assembly (MSA) according to this embodiment can be used in the deposition process of the working substrate (WS).

FIG. 9A is an enlarged plan view of the cell area (C_B) of the first group mask (MSK_B) according to an embodiment of the present invention, and FIG. 9B is an enlarged plan view of the second group mask (MSK_G) according to an embodiment of the present invention. ) is an enlarged plan view of the cell area (C_G), and FIG. 9C is an enlarged plan view of the cell area (C_R) of the third group mask (MSK_R) according to an embodiment of the present invention.

The mask assembly (MSA) described in FIGS. 7 and 8 is described as including the mask (MSK_B) in FIG. 9A. The mask assembly (MSA) in which the first group mask (MSK_B) of FIG. 9A is changed to the masks (MSK_G, MSK_R) of FIG. 9B or 9C emits light in a different color from the first color light emitting device (ED-1) of FIG. 2. It can be used in the manufacture of devices. That is, the mask assembly MSA including the masks MSK_G and MSK_R of FIG. 9B or 9C emits light from the light emitting device of the second color pixels PX-G or the third color pixels PX-R. Used to form devices.

The first group of masks (MSK_B), the second group of masks (MSK_G), and the third group of masks (MSK_R) may be utilized to deposit deposition materials of different materials on the working substrate WS of FIG. 6. You can. For example, the first group of masks MSK_B may be used to deposit an organic material for a first color light emitting device on the working substrate WS of FIG. 6 . The second group of masks (MSK_G) can be used to deposit an organic material for a second color light emitting device on the working substrate (WS) of FIG. 6. The third group of masks (MSK_R) can be used to deposit an organic material for a third color light emitting device on the working substrate (WS) of FIG. 6.

The first unit cell (C-B) of the first group of masks (MSK_B) may include a first inspection pattern hole (PH_1) and first pattern holes (H_1).

The first group of masks (MSK_B) applies at least one organic layer constituting the first color light emitting devices (ED-1) of FIG. 2 and the inspection organic patterns (CO) of FIG. 1 to the working substrate of FIG. 6 ( It can be used to deposit on WS). The deposition material that has passed through the first pattern holes (H_1) of the first group of masks (MSK_B) is applied to the first light emitting layer (EML1) and the charge generation layer (EML1) of the first color light emitting devices (ED-1) of FIG. 2 CGL) and a second light emitting layer (EML2) can be formed. The deposition material that has passed through the first inspection pattern hole (PH_1) of the first group of masks (MSK_B) is the first stage inspection organic patterns (CO_1) and the second stage inspection organic patterns (CO_2) of FIG. ) and organic patterns (CO_3) for third-stage inspection.

The first inspection pattern hole PH_1 may be a hole located on the top of the first unit cell C-B of the first group of masks MSK_B. The hole for the first inspection pattern (PH_1) is connected to the first unit cell (C-B) of the first group of masks (MSK_B) and the second unit cell (C-G) of the second group of masks (MSK_G) of FIG. 9B, which will be described later. When aligned at the same position, it may be formed at a position that does not overlap with the second inspection pattern hole (PH_2). The first inspection pattern hole PH_1 may be formed at a position spaced a first distance a1 from the left side of the first unit cell C-B of the first group of masks MSK_B.

The first pattern holes H_1 may be disposed at equal intervals in the dummy area DM and the display area DA of the first unit cell C-B. Here, the dummy area (DM) is a partial area of the non-display area (DP-NDA) arranged on the left and a partial area of the non-display area (DP-NDA) arranged on the upper side of the display area (DA) in FIG. The display area DA may be an area corresponding to the display area DP-DA of FIG. 1 .

Meanwhile, the dummy area DM and the display area DA are defined only to compare the area where the first pattern holes H_1 are formed with the area of the display area DP-DA in FIG. 1, and the first group In the masks MSK_B, the dummy area DM and the display area DA are not distinguished externally or structurally. The distinction between the dummy area DM and the display area DA may vary depending on the alignment state of the first group of masks MSK_B with respect to the working substrate WS. For a detailed description, refer to FIGS. 10 and 11.

The first pattern holes H_1 are expressed as a thin rectangular hole shape, but the shape of the first pattern holes H_1 can be changed depending on the required pixels and image quality of the display panel DP. The first pattern holes (H_1) have a first direction pixel pitch where the spacing between the two adjacent first pattern holes (H_1) is the spacing in the first direction (DR1) between the first color pixels (PX-B) in FIG. It may be the same as (PP1).

The deposition material passing through the first pattern holes H_1 disposed in the dummy region DM may form the organic patterns DM-B of FIGS. 1 and 3 . The deposition material that passes through the first pattern holes H_1 disposed in the display area DA may form an organic layer of the first color light emitting devices ED-1 of FIG. 2.

Referring to FIG. 9B , the second unit cell (C-G) of the second group of masks (MSK_G) may include a second inspection pattern hole (PH_2) and second pattern holes (H_2).

The second group of masks (MSK_G) can be used to deposit at least one organic layer constituting the second color light emitting devices and the inspection organic patterns (CO) of FIG. 1 on the working substrate (WS) of FIG. 6. there is. The deposition material that passed through the second pattern holes (H_2) of the second group of masks (MSK_G) is the first light emitting layer (EML1), charge generation layer (CGL), and second light emitting layer of the second color light emitting devices of FIG. 2. (EML2) can be configured. The deposition material that passed through the second inspection pattern hole (PH_2) of the second group of masks (MSK_G) is the first stage inspection organic patterns (CO_1) and the second stage inspection organic patterns (CO_2) of FIG. ) and organic patterns (CO_3) for third-stage inspection.

The hole for the second inspection pattern (PH_2) may be a hole located on the top of the second unit cell (C-G) of the masks (MSK_G) of the second group. The hole for the second inspection pattern (PH_2) is connected to the second unit cell (C-G) of the second group of masks (MSK_G) and the third unit cell (C-R) of the third group of masks (MSK_R) of FIG. 9C, which will be described later. When aligned at the same position, it can be formed at a position that does not overlap with the third inspection pattern hole (PH_3). The second inspection pattern hole PH_2 may be formed at a location spaced apart from the left side of the second group of masks MSK_G by a second distance a2. Here, the first distance a1 and the second distance a2 are different. The second pattern holes H_2 may be disposed at equal intervals in the dummy area DM and the display area DA of the second unit cell C-G.

The second pattern holes H_2 are expressed as rectangular hole shapes, but the shape of the second pattern holes H_2 may be changed depending on the required pixels and image quality of the display panel DP. The second pattern holes (H_2) have a first direction pixel pitch where the spacing between the two adjacent second pattern holes (H_2) is the spacing in the first direction (DR1) between the second color pixels (PX-G) in FIG. It may be the same as (PP1).

The deposition material that passes through the second pattern holes H_2 disposed in the dummy region DM may form dummy organic patterns DM-G. The deposition material that passes through the second pattern holes H_2 disposed in the display area DA may form an organic layer of the second color light emitting devices ED-2.

Referring to FIG. 9C, the third unit cell (C-R) of the third group of masks (MSK_R) may include a third inspection pattern hole (PH_3) and third pattern holes (H_3).

The third group of masks (MSK_R) can be used to deposit at least one organic layer constituting the third color light emitting devices and the inspection organic patterns (CO) of FIG. 1 on the working substrate (WS) of FIG. 6. there is. The deposition material that passed through the third pattern holes (H_3) of the third group of masks (MSK_R) is the first light emitting layer (EML1), charge generation layer (CGL), and second light emitting layer of the third color light emitting devices of FIG. 2. (EML2) can be configured. The deposition material that passed through the third inspection pattern hole (PH_3) of the third group of masks (MSK_R) is the first stage inspection organic patterns (CO_1) and the second stage inspection organic patterns (CO_2) of FIG. ) and organic patterns (CO_3) for third-stage inspection.

The third inspection pattern hole PH_3 may be a hole located on the top of the third unit cell C-R of the third group of masks MSK_R. The third inspection pattern hole (PH_3) has the same third unit cell (C-R) of the third group of masks (MSK_R) and the first unit cell (C-B) of the first group of masks (MSK_B) of FIG. 9A. When aligned, it may be formed in a position that does not overlap with the first inspection pattern hole (PH_1). The third inspection pattern hole PH_3 may be formed at a location spaced apart by a third distance a3 from the left side of the third group of masks MSK_R. Here, the third distance a3 is different from the first distance a1 and the second distance a2.

The third pattern holes H_3 may be disposed at equal intervals in the dummy area DM and the display area DA of the third unit cell C-R.

The third pattern holes H_3 are expressed as rectangular hole shapes, but the shape of the third pattern holes H_3 may be changed depending on the required pixels and image quality of the display panel DP. The third pattern holes (H_3) have a first direction pixel pitch (PP1) where the spacing between two adjacent third pattern holes (H_3) is the spacing in the first direction (DR1) between the third color pixels (PX-R). may be the same as

The deposition material that passes through the third pattern holes H_3 disposed in the dummy region DM may form dummy organic patterns DM-R. The deposition material that passes through the third pattern holes H_3 disposed in the display area DA may form an organic layer of the third color light emitting devices ED-3.

Hereinafter, a method of manufacturing a display panel (DP) according to an embodiment of the present invention will be described.

Figure 10 is a diagram showing the first to third deposition processes (DDP1, DDP2, and DDP3) according to an embodiment of the present invention. 11 shows a working substrate WS including organic patterns formed according to first to third deposition processes (DDP1, DDP2, DDP3) using the first group of masks (MSK_B) according to an embodiment of the present invention. This is the drawing shown. Figure 12 shows a working substrate WS including organic patterns formed according to the first to third deposition processes (DDP1, DDP2, DDP3) using the second group of masks (MSK_G) according to an embodiment of the present invention. This is the drawing shown. FIG. 13 is a diagram illustrating a working substrate WS including organic patterns formed according to first to third deposition processes using masks of the third group according to an embodiment of the present invention.

10 shows first color pixels (PX-B) and second color pixels using the first mask assembly (MSK-1), the second mask assembly (MSK-2), and the third mask assembly (MSK-3). A deposition process for forming light emitting elements of pixels (PX-G) and third color pixels (PX-R) is shown. The first mask assembly (MSK-1) corresponds to the mask assembly (MSA) described in FIGS. 7 and 8, and includes masks (MSK_B, hereinafter referred to as 1 group of masks). The second mask assembly MSK-2 includes masks MSK_G (hereinafter referred to as second group masks) including the second unit cells C-G described with reference to FIG. 9B. The third mask assembly MSK-3 includes masks MSK_R (hereinafter referred to as third group masks) including the third unit cell C-R described with reference to FIG. 9C.

In more detail, FIGS. 10 and 11 show the formation of the first light emitting layer (EML1), charge generation layer (CGL), and second light emitting layer (EML2) shown in FIG. 2 using the first mask assembly (MSK-1). A first deposition process (DPP1), a second deposition process (DPP2), and a third deposition process (DPP3) are shown. The first deposition process (DPP1), the second deposition process (DPP2), and the third deposition process (DPP3) may be performed continuously. However, it is not limited to this, and an additional deposition process is performed between the first deposition process (DPP1) and the second deposition process (DPP2), or an additional deposition process is performed between the second deposition process (DPP2) and the third deposition process (DPP3). This can proceed.

First, first organic patterns (P_1) and a first-stage inspection organic pattern (CO_1B) of the first color are formed in the unit area (UA) of the working substrate (WS) through the first deposition process (DPP1) ( A). Here, the unit area UA is an area corresponding to the first unit cell C-B shown in FIG. 9A of the working substrate WS. The working substrate WS shown in FIG. 10 includes a plurality of unit areas UA, and the working substrate WS includes the first unit cell C-B of the mask assembly MSA shown in FIGS. 7 and 8. It may include a number of unit areas (UA) corresponding to the number of .

The first deposition process (DPP1) may include an alignment step of the first mask assembly (MSK-1) and the working substrate (WS) and a first organic material deposition step. First, after preparing the first mask assembly (MSK-1) including one of the plurality of first group masks (MSK_B, see FIG. 9A), the first mask assembly (MSK-1) is placed on the working substrate (WS) in the first aligned state. MSK-1). After the first mask assembly (MSK-1) is moved to the deposition chamber (CB, see FIG. 6), the deposition source (DS, see FIG. 6) evaporates the first organic material. The evaporated first organic material passes through the first mask assembly (MSK-1) and is deposited on the unit area (UA). The organic patterns formed through the first unit cell (C-B) described with reference to FIG. 9A are shown as the first organic patterns (P_1) of FIG. 11 and the first stage inspection organic pattern (CO_1B) of the first color. A plurality of first organic patterns P_1 are formed in the first active area AA1, and a first color organic pattern CO_1B for first stage inspection is formed in the non-active area NA. The first stage inspection organic pattern (CO_1B) of the first color is the mark disposed at the leftmost position among the marks (M_11) of the 1-1 group arranged in the first direction (DR1) in the non-active area (NA). It can be arranged accordingly.

The first active area AA1 includes an active first area AAA1 corresponding to the display area DP-DA in FIG. 1 and a first area NDA1 disposed on the left side of the display area DP-DA in FIG. 1. and an active second area AAA2 corresponding to a partial area of the first area NDA1 disposed above the display area DP-DA of FIG. 1 .

The first organic patterns P_1 formed in the active first area AAA1 may be the first emission layer EML1 shown in FIG. 2 . Here, the first organic patterns P_1 formed in the active second area AAA2 correspond to the dummy organic pattern DM-B shown in FIG. 3 and include the same material as the material of the first emitting layer EML1. .

The method of manufacturing a display panel according to this embodiment is to form a first-stage inspection organic pattern (CO_1B) of the first color and the marks (M_11) of the 1-1 group on the leftmost side after the first deposition process (DDP1). A step of comparing the position with the placed mark may be further included. The center point (CP) of the first stage inspection organic pattern (CO_1B) of the first color is the first center line (CL1) and the 2-2th mark disposed on the leftmost side among the marks (M_11) of the 1-1 group. The degree to which the group mark (M_32) is offset from the second center line (CL2) can be measured (see FIG. 4). The offset can be removed by using the measured offset to adjust the position of the mask of the first mask assembly (MSK-1) during the next first deposition process (DDP1).

After the first deposition process (DDP1), second organic patterns (P_2) and a second-stage inspection organic pattern of the first color are formed in the unit area (UA) of the working substrate (WS) through the second deposition process (DDP2). (CO_2B) forms (B).

The second deposition process DPP2 may include shifting and aligning the first mask assembly MSK-1 with respect to the working substrate WS and depositing a second organic material. First, prepare another first mask assembly (MSK-1) including another mask that was not used in the first deposition process (DDP1) among the plurality of first group masks (MSK_B, see FIG. 9A) and then work on it. The substrate WS is loaded into the first mask assembly MSK-1 in a second alignment state. Here, the second alignment state is a state in which the mask of the first mask assembly (MSK-1) is shifted aligned in the first direction (DR1) compared to the first alignment state.

After the first mask assembly (MSK-1) is moved to the deposition chamber (CB, see FIG. 6), the deposition source (DS, see FIG. 6) evaporates the second organic material. The evaporated second organic material passes through the first mask assembly (MSK-1) and is deposited on the unit area (UA). The organic patterns formed through the first unit cell (C-B) described with reference to FIG. 9A are shown as the second organic pattern (P_2) and the first color organic pattern (CO_2B) for second stage inspection in FIG. 11.

A plurality of second organic patterns P_2 are formed in the second active area AA2 of the working substrate WS, and a first color organic pattern CO_2B for second stage inspection is formed in the non-active area NA. is formed in The second-stage inspection organic pattern (CO_2B) of the first color is the leftmost mark among the marks (M_12) of the 1-2 group arranged in the first direction (DR1) in the non-active area (NA). It can be placed correspondingly. Here, the second organic patterns P_2 may overlap the first organic patterns P_1 formed through the first deposition process DDP1. The organic pattern CO_2B for the second stage inspection of the first color may be spaced apart from the organic pattern CO_1B for the first stage inspection of the first color.

The second active area AA2 includes an active first area AAA1 corresponding to the display area DP-DA in FIG. 1 and a first area NDA1 disposed above the display area DP-DA in FIG. 1. It may include an active third area (AAA3) corresponding to a partial area of and a partial area of the first area (NDA1) disposed on the right side of the display area (DP-DA) of FIG. 1. Organic patterns are formed in the same active first area AAA1 during the first deposition process DDP1 and the second deposition process DDP2. While going through the first deposition process (DDP1) and the second deposition process (DDP2), the first area (NDA1) of FIG. 1 gradually widens.

The second organic patterns P_2 formed in the active first area AAA1 may be the charge generation layer CGL shown in FIG. 2 . Here, the second organic patterns P_2 formed in the active third area AAA3 correspond to the dummy organic pattern DM-B shown in FIG. 3 and include the same material as the material of the charge generation layer CGL. do. The second organic patterns P_2 formed in the overlapping area of the active second area AAA2 and the active third area AAA3 overlap the first organic patterns P_1 formed in the first deposition process DDP1. A two-layer dummy organic pattern (DM-B) can be formed.

The method of manufacturing a display panel according to this embodiment is to place the second stage inspection organic pattern (CO_2B) of the first color and the marks (M_12) of the 1-2 group on the leftmost side after the second deposition process (DDP2). A step of comparing the position with the marked mark may be further included. The center point (CP) of the organic pattern (CO_2B) for the second stage inspection of the first color is the first center line (CL1) and the 2-2nd center line of the mark disposed on the leftmost side among the marks (M_12) of the 1-2 group. The degree of offset from the second center line CL2 of the group mark M_32 can be measured (see FIG. 4). Using the measured offset, the offset can be removed by adjusting the position of the mask of the first mask assembly (MSK-1) during the next second deposition process (DDP2).

After the second deposition process (DDP2), third organic patterns (P_3) and a third step inspection organic pattern (P_3) of the first color are deposited on the unit area (UA) of the working substrate (WS) through the third deposition process (DDP3). CO_3B) forms (C).

The third deposition process DPP3 may include a step of aligning the first mask assembly MSK-1 with respect to the working substrate WS and a third organic material deposition step. First, a first mask assembly (MSK-1) including a mask not used in the first deposition process (DDP1) and the second deposition process (DDP2) among the plurality of first group masks (MSK_B, see FIG. 9A). After preparing, the working substrate (WS) is loaded onto the first mask assembly (MSK-1) in a third alignment state. Here, the third alignment state is a state in which the mask of the first mask assembly (MSK-1) is shifted aligned in the second direction (DR2) compared to the second alignment state. After the first mask assembly (MSK-1) is moved to the deposition chamber (CB, see FIG. 6), the deposition source (DS, see FIG. 6) evaporates the third organic material. The evaporated third organic material passes through the first mask assembly (MSK-1) and is deposited on the unit area (UA).

The organic patterns formed through the first unit cell (C-B) described with reference to FIG. 9A are shown as the third organic patterns (P_3) and the first color organic pattern (CO_3B) for third stage inspection in FIG. 11. A plurality of third organic patterns P_3 are formed in the third active area AA3, and a third level inspection organic pattern CO_3B of a first color is formed in the non-active area NA.

The third level inspection organic pattern CO_3B of the first color may be disposed in the non-active area NA to correspond to the 2-1 group of marks M_31 arranged in the second direction DR2. Here, the third organic patterns P_3 may overlap the second organic patterns P_2 formed through the second deposition process DDP2. The third-stage inspection organic pattern CO_3B of the first color may be spaced apart from the second-stage inspection organic pattern CO_2B of the first color.

The third active area AA3 includes an active first area AAA1 corresponding to the display area DP-DA in FIG. 1 and a first area NDA1 disposed on the right side of the display area DP-DA in FIG. 1. and an active fourth area AAA4 corresponding to a partial area of the first area NDA1 disposed below the display area DP-DA of FIG. 1 .

The third organic patterns P_3 formed in the active first area AAA1 may be the second light emitting layer EML2 shown in FIG. 2 . Here, the third organic patterns P_3 formed in the active fourth area AAA4 correspond to the dummy organic pattern DM-B shown in FIG. 3 and include the same material as the material of the second light emitting layer EML2. do. The third organic patterns P_3 formed in the overlapping area between the active fourth area AAA4 and the active third area AAA3 overlap the second organic patterns P_2 formed in the second deposition process DDP2. A two-layer dummy organic pattern (DM-B) can be formed.

The method of manufacturing a display panel according to this embodiment includes the step of comparing the positions of the third stage inspection organic pattern (CO_3B) of the first color and the mark (M_31) of the 2-1 group after the third deposition process (DDP3). may further include. The center point (CP) of the third stage inspection organic pattern (CO_3B) of the first color is located between the second center line (CL2) of the mark (M_31) of the 2-1 group and the marks (M_12) of the 1-2 group. The degree of offset from the first center line CL1 of the leftmost mark can be measured (see FIG. 4). Using the measured offset, the offset can be removed by adjusting the position of the mask of the first mask assembly (MSK-1) during the next third deposition process (DDP3).

A first organic pattern is formed in the active areas (AA1, AA2, and AA3) through the first deposition process (DDP1), second deposition process (DDP2), and third deposition process (DDP3) using the first mask assembly (MSK-1). An organic layer is formed by stacking the first organic patterns P_1, the second organic patterns P_2, and the third organic patterns P_3 in that order, and the organic layer is a stack of only some of the first to third organic patterns P_1, P_2, and P_3. It can be.

In the non-active area (NA), a first-stage inspection organic pattern (CO_1B) of the first color is provided, and the first color organic pattern (CO_1B) for first-stage inspection is spaced apart from the first color in the first direction (DR1). A second-stage inspection organic pattern (CO_2B) and a first-color second-stage inspection organic pattern (CO_2B) and a first-color third-stage inspection organic pattern (CO_3B) spaced apart in the second direction (DR2) This can be formed.

10 and 12 show the first deposition of forming the first light-emitting layer, the charge generation layer, and the second light-emitting layer of the light-emitting elements of the second color pixels (PX-G) using the second mask assembly (MSK-2). The process (DPP1), the second deposition process (DPP2), and the third deposition process (DPP3) are described. The first light-emitting layer, the charge generation layer, and the second light-emitting layer of the light-emitting devices of the second color pixels (PX-G) are the first light-emitting layer (EML1) and the charge generation layer (CGL) shown in FIG. 2. , and the second light emitting layer (EML2) may be different from the material, but may have the same stacked structure. Hereinafter, the same reference numerals will be referred to.

First, the fourth organic patterns (P_4) and the first-stage inspection organic pattern (CO_1G) of the second color are formed in the unit area (UA) of the working substrate (WS) through the first deposition process (DPP1) ( A). Here, the unit area (UA) is an area corresponding to the second unit cell (C-G) shown in FIG. 9B.

The first deposition process (DPP1) may include an alignment step of the second mask assembly (MSK-2) and the working substrate (WS) and a fourth organic material deposition step. Compared to the first deposition process (DDP1) of FIG. 11, the first deposition process (DDP1) includes a second mask assembly (MSK-2) including one of a plurality of second groups of masks (MSK_G, see FIG. 9B). is utilized, and the fourth organic material is evaporated to deposit the fourth organic patterns (P_4) and the first stage inspection organic pattern (CO_1G) of the second color in the unit area (UA) in the same manner. It can be done.

The fourth organic patterns P_4 may be formed at positions spaced apart from the first organic patterns P_1 on a plane. Both the fourth organic patterns P_4 and the first organic patterns P_1 are formed in the first deposition process DDP1 and are first formed on the top of the common layer, so they can contact the common layer.

The first active area AA1 includes an active first area AAA1 corresponding to the display area DP-DA in FIG. 1 and a first area NDA1 disposed on the left side of the display area DP-DA in FIG. 1. and an active second area AAA2 corresponding to a partial area of the first area NDA1 disposed above the display area DP-DA of FIG. 1 .

The fourth organic patterns P_4 formed in the active first area AAA1 may be the first emission layer EML1 shown in FIG. 2 . Here, the fourth organic patterns P_4 formed in the active second area AAA2 correspond to the dummy organic pattern DM-G and include the same material as the material of the first emission layer EML1.

The method of manufacturing a display panel according to this embodiment is a method of manufacturing a display panel disposed in the middle among the first stage inspection organic pattern (CO_1G) of the second color and the marks (M_11) of the 1-1 group after the first deposition process (DDP1). A step of comparing the mark and position may be further included. The center point (CP) of the first stage inspection organic pattern (CO_1G) of the second color is the first center line (CL1) of the mark disposed in the middle of the marks (M_11) of the 1-1 group and the 2-2 group. The degree of offset from the second center line CL2 of the mark M_32 can be measured (see FIG. 4). The offset can be removed by using the measured offset to adjust the position of the mask of the second mask assembly (MSK-2) during the next first deposition process (DDP1).

After the first deposition process (DDP1), the fifth organic patterns (P_5) and the second stage inspection organic pattern (P_5) of the second color are formed in the unit area (UA) of the working substrate (WS) through the second deposition process (DDP2). CO_2G) forms (B).

The second deposition process (DPP2) may include a step of shifting and aligning the second mask assembly (MSK-2) to the working substrate (WS) and a fifth organic material deposition step. The second deposition process (DDP2) uses a second mask assembly (MSK-2) including a mask not used in the first deposition process (DDP1) among the plurality of second group masks (MSK_G, see FIG. 9B). and may be performed in the same manner as the second deposition process (DDP2) of FIG. 11, except that the fifth organic material is deposited. The organic patterns formed through the second unit cells (C-G) described with reference to FIG. 9B are shown as the fifth organic patterns (P_5) of FIG. 12 and the organic pattern (CO_2G) for the second stage inspection of the second color.

A plurality of fifth organic patterns P_5 are formed in the second active area AA2, and a second color organic pattern CO_2G for second stage inspection is formed in the non-active area NA. The organic pattern (CO_2G) for second stage inspection of the second color corresponds to the mark disposed in the middle of the marks (M_12) of the 1st and 2nd groups arranged in the first direction (DR1) in the non-active area (NA). It can be placed like this.

Here, the fifth organic patterns P_5 may overlap the fourth organic patterns P_4 formed through the first deposition process DDP1. The organic pattern for second stage inspection (CO_2G) of the second color may be spaced apart from the organic pattern for first stage inspection (CO_1G) of the second color.

The second active area AA2 includes an active first area AAA1 corresponding to the display area DP-DA in FIG. 1 and a first area NDA1 disposed above the display area DP-DA in FIG. 1. It may include an active third area (AAA3) corresponding to a partial area of and a partial area of the first area (NDA1) disposed on the right side of the display area (DP-DA) of FIG. 1.

The fifth organic patterns P_5 formed in the active first area AAA1 may be the charge generation layer CGL shown in FIG. 2 . Here, the fifth organic patterns P_5 formed in the active third area AAA3 correspond to the dummy organic pattern DM-G and include the same material as the material of the charge generation layer CGL. The fifth organic patterns P_5 formed in the overlapping area of the active third area AAA3 and the active second area AAA2 overlap with the fourth organic patterns P_4 formed through the first deposition process DDP1. A two-layer dummy organic pattern can be formed.

The display panel manufacturing method according to this embodiment is a mark disposed in the middle among the second color organic pattern (CO_2G) for second stage inspection and the marks (M_12) of the 1-2 group after the second deposition process (DDP2). It may further include a step of comparing positions with . The center point (CP) of the second-stage inspection organic pattern (CO_2G) of the second color is the first center line (CL1) of the mark disposed in the middle of the marks (M_12) of the 1-2 group and the 2-2 group. The degree of offset from the second center line CL2 of the mark M_32 can be measured (see FIG. 4). Using the measured offset, the offset can be removed by adjusting the position of the mask of the second mask assembly (MSK-2) during the next second deposition process (DDP2).

After the second deposition process (DDP2), the sixth organic patterns (P_6) and the third step inspection organic pattern of the second color ( CO_3G) forms (C).

The third deposition process (DPP3) may include a step of shifting and aligning the second mask assembly (MSK-2) to the working substrate (WS) and a sixth organic material deposition step. The third deposition process (DDP3) is a second mask including a mask not used in the first deposition process (DDP1) and the second deposition process (DDP2) among the plurality of second group masks (MSK_G, see FIG. 9B). Except that the assembly (MSK-2) is utilized and the sixth organic material is evaporated to deposit the sixth organic patterns (P_6) and the third step inspection organic pattern (CO_3G) of the second color in the unit area (UA). And it can be done in the same way.

The organic patterns formed through the second unit cells (C-G) described with reference to FIG. 9B are shown as the sixth organic patterns (P_6) of FIG. 12 and the second color organic pattern (CO_3G) for third stage inspection.

A plurality of sixth organic patterns P_6 are formed in the third active area AA3, and a third level inspection organic pattern CO_3G of a second color is formed in the non-active area NA. The third-stage inspection organic pattern CO_3G of the second color may be disposed in the non-active area NA to correspond to the marks M_31 of the 2-1 group arranged in the second direction DR2.

Here, the sixth organic patterns P_6 may overlap the fifth organic patterns P_5 formed through the second deposition process DDP2. The third organic pattern for inspection (CO_3G) of the second color may be spaced apart from the organic pattern (CO_2G) for second color inspection.

The third active area AA3 includes an active first area AAA1 corresponding to the display area DP-DA in FIG. 1 and a first area NDA1 disposed on the right side of the display area DP-DA in FIG. 1. and an active fourth area AAA4 corresponding to a partial area of the first area NDA1 disposed below the display area DP-DA of FIG. 1 .

The sixth organic patterns P_6 formed in the active first area AAA1 may be the second light emitting layer EML2 shown in FIG. 2 . Here, the sixth organic patterns P_6 formed in the active fourth area AAA4 correspond to the dummy organic pattern DM-G and include the same material as the material of the second emission layer EML2. The sixth organic patterns P_6 formed in the overlapping area of the active fourth area AAA4 and the active third area AAA3 overlap with the fifth organic patterns P_5 formed through the second deposition process DDP2. A two-layer dummy organic pattern can be formed.

After the third deposition process (DDP3) according to this embodiment, a step of comparing the positions of the third stage inspection organic pattern (CO_3G) of the second color and the mark (M_31) of the 2-1 group may be further included. The center point (CP) of the third-stage inspection organic pattern (CO_3G) of the second color is the first center line (CL1) of the mark disposed in the middle of the marks (M_12) of the 1-2 group and the 2-1 group. The degree of offset from the second center line CL2 of the mark M_31 can be measured (see FIG. 4). Using the measured offset, the offset can be removed by adjusting the position of the mask of the second mask assembly (MSK-2) during the next third deposition process (DDP3).

A fourth organic pattern is formed in the active areas (AA1, AA2, AA3) through the first deposition process (DDP1), second deposition process (DDP2), and third deposition process (DDP3) using the second mask assembly (MSK-2). An organic layer is formed by stacking the organic patterns P_4, the fifth organic patterns P_5, and the sixth organic patterns P_6 in that order, and an organic layer is formed by stacking only some of the fourth to sixth organic patterns P_4, P_5, and P_6. It can be.

The non-active area (NA) includes a first-stage inspection organic pattern (CO_1G) of a second color, and a second color spaced apart from the first-stage inspection organic pattern (CO_1G) of the second color in the first direction (DR1). The organic pattern for the second stage inspection (CO_2G) and the organic pattern for the second stage inspection (CO_2G) of the second color and the organic pattern for the third stage inspection of the second color (CO_3G) spaced apart in the second direction (DR2) This can be formed.

10 and 13 show the first light emitting layer (EML1), charge generation layer (CGL), and second light emitting layer of the light emitting elements of the third color pixels (PX-R) using the third mask assembly (MSK-3). The first deposition process (DPP1), the second deposition process (DPP2), and the third deposition process (DPP3) forming (EML2) will be described.

The third mask assembly (MSK-3) corresponds to the mask assembly (MSA) described in FIGS. 7 and 8, and includes masks (MSK_R, hereinafter referred to as the third unit cells C-R) described with reference to FIG. 9C. 3 groups of masks).

First, the seventh organic patterns P_7 and the first stage inspection organic pattern CO_1R of the third color are formed in the unit area UA of the working substrate WS through the first deposition process DPP1 ( A). Here, the unit area (UA) is an area corresponding to the third unit cell (C-R) shown in FIG. 9C.

The first deposition process (DPP1) may include an alignment step of the third mask assembly (MSK-3) and the working substrate (WS) and a seventh organic material deposition step. The first deposition process (DDP1) utilizes a third mask assembly (MSK-3) including a plurality of third groups of masks (MSK_R, see FIG. 9C) and evaporates the seventh organic material to deposit it in the unit area (UA). It may be performed in the same manner as the first deposition process (DDP1) of FIG. 11, except that the seventh organic patterns (P_7) and the first stage inspection organic pattern (CO_1R) of the third color are deposited.

The organic patterns formed through the second unit cell (C-G) described with reference to FIG. 9C are shown as the seventh organic patterns (P_7) and the third color first stage inspection organic pattern (CO_1R) in FIG. 13.

A plurality of seventh organic patterns P_7 are formed in the first active area AA1, and a third color first stage inspection organic pattern CO_1R is formed in the non-active area NA. The seventh organic patterns P_7 may be formed at positions spaced apart from the fourth organic patterns P_4 on a plane. Both the seventh organic patterns P_7 and the fourth organic patterns P_4 are formed in the first deposition process DDP1 and are formed first on the common layer, so they can contact the common layer. The first stage inspection organic pattern (CO_1R) of the third color is the rightmost mark among the marks (M_11) of the 1-1 group arranged in the first direction (DR1) in the non-active area (NA). It can be placed correspondingly.

The first active area AA1 includes an active first area AAA1 corresponding to the display area DP-DA in FIG. 1 and a first area NDA1 disposed on the left side of the display area DP-DA in FIG. 1. and an active second area AAA2 corresponding to a partial area of the first area NDA1 disposed above the display area DP-DA of FIG. 1 .

The seventh organic patterns P_7 formed in the active first area AAA1 may be the first light emitting layer EML1 shown in FIG. 2 . Here, the seventh organic patterns P_7 formed in the active second area AAA2 correspond to the dummy organic pattern DM-R and include the same material as the material of the first emission layer EML1. Example of this embodiment The following display panel manufacturing method compares the position of the first stage inspection organic pattern (CO_1R) of the third color after the first deposition process (DDP1) with the mark placed on the far right among the marks (M_11) of the 1-1 group. Additional steps may be included. The center point (CP) of the first stage inspection organic pattern (CO_1R) of the third color is the first center line (CL1) and 2-2 of the mark disposed on the rightmost side among the marks (M_11) of the 1-1 group. The degree of offset from the second center line CL2 of the group mark M_32 can be measured (see FIG. 4). The offset can be removed by using the measured offset to adjust the position of the mask of the third mask assembly (MSK-3) during the next first deposition process (DDP1).

After the first deposition process (DDP1), the eighth organic patterns (P_8) and the third color second-stage inspection organic pattern ( CO_2R) forms (B).

The second deposition process (DPP2) may include a step of shifting and aligning the third mask assembly (MSK-3) to the working substrate (WS) and an eighth organic material deposition step. The second deposition process (DDP2) utilizes a third mask assembly (MSK-3) including a mask not used in the first deposition process (DDP1) among the plurality of third group masks (MSK_R, see FIG. 9C). It can be performed in the same manner as the second deposition process (DDP2) of FIG. 11, except that the eighth organic material is deposited.

The organic patterns formed through the third unit cell (C-R) described with reference to FIG. 9C are shown as the eighth organic patterns (P_8) and the third color organic pattern (CO_2R) for second stage inspection in FIG. 13. A plurality of eighth organic patterns P_8 are formed in the second active area AA2, and a third color organic pattern CO_2R for second stage inspection is formed in the non-active area NA. The second-stage inspection organic pattern (CO_2R) of the third color is located on the rightmost mark among the marks (M_12) of the 1st and 2nd groups listed in the first direction (DR1) in the non-active area (NA). It can be arranged accordingly.

Here, the eighth organic patterns P_8 may overlap with the seventh organic patterns P_7 formed through the first deposition process DDP1. The second-stage inspection organic pattern CO_2R of the third color may be spaced apart from the first-stage inspection organic pattern CO_1R of the third color.

The second active area AA2 includes an active first area AAA1 corresponding to the display area DP-DA in FIG. 1 and a first area NDA1 disposed above the display area DP-DA in FIG. 1. It may include an active third area (AAA3) corresponding to a partial area of and a partial area of the first area (NDA1) disposed on the right side of the display area (DP-DA) of FIG. 1.

The eighth organic patterns P_8 formed in the first area AA1 may be the charge generation layer CGL shown in FIG. 2 . Here, the eighth organic patterns P_8 formed in the second area AA2 correspond to the dummy organic pattern DM-R and include the same material as the material of the charge generation layer CGL. The eighth organic patterns P_8 formed in the overlapping area of the active third area AAA3 and the active second area AAA2 overlap with the seventh organic patterns P_7 formed through the first deposition process DDP1. A two-layer dummy organic pattern can be formed.

The display panel manufacturing method according to the present embodiment is a second deposition process (DDP2), and the second stage inspection organic pattern (CO_2R) of the third color and the marks (M_12) of the 1-2 group are placed on the rightmost side. A step of comparing the mark and position may be further included. The center point (CP) of the second-stage inspection organic pattern (CO_2R) of the third color is the first center line (CL1) and the 2-2nd center line of the mark disposed on the rightmost side among the marks (M_12) of the 1-2 group. The degree of offset from the second center line CL2 of the group mark M_32 can be measured (see FIG. 4). The offset can be removed by using the measured offset to adjust the position of the mask of the third mask assembly (MSK-3) during the next second deposition process (DDP2).

After the second deposition process (DDP2), the ninth organic patterns (P_9) and the third-stage inspection organic pattern (P_9) of the third color are formed in the unit area (UA) of the working substrate (WS) through the third deposition process (DDP3). CO_3R) forms (C).

The third deposition process (DPP3) may include a step of shifting and aligning the third mask assembly (MSK-3) to the working substrate (WS) and a ninth organic material deposition step. The third deposition process (DDP3) includes a mask that was not used in the first deposition process (DDP1) and the second deposition process (DDP2) among the plurality of third group masks (MSK_R, see FIG. 9C). 11, except that the assembly (MSK-3) is utilized and the ninth organic material is evaporated to deposit the ninth organic patterns (P_9) and the third color organic pattern (CO_3R) for third stage inspection. It may be performed in the same manner as the third deposition process (DDP3).

The organic patterns formed through the third unit cell (C-R) described with reference to FIG. 9C are shown as the ninth organic patterns (P_9) and the third stage inspection organic pattern (CO_3R) of the third color in FIG. 13.

A plurality of ninth organic patterns P_9 are formed in the third active area AA3, and a third level inspection organic pattern CO_3R of a third color is formed in the non-active area NA. The third-stage inspection organic pattern CO_3R of the third color may be disposed in the non-active area NA to correspond to the marks M_31 of the 2-1 group arranged in the second direction DR2.

Here, the ninth organic patterns P_9 may overlap the eighth organic patterns P_8 formed through the second deposition process DDP2. The organic pattern (CO_3R) for third-stage inspection of the third color may be spaced apart from the organic pattern (CO_2R) for second-stage inspection of the third color.

The third active area AA3 includes an active first area AAA1 corresponding to the display area DP-DA in FIG. 1 and a first area NDA1 disposed on the right side of the display area DP-DA in FIG. 1. and an active fourth area AAA4 corresponding to a partial area of the first area NDA1 disposed below the display area DP-DA of FIG. 1 .

The ninth organic patterns P_9 formed in the active first area AAA1 may be the second light emitting layer EML2 shown in FIG. 2 . Here, the ninth organic patterns P_9 formed in the active fourth area AAA4 correspond to the dummy organic pattern DM-R and include the same material as the material of the second emission layer EML2. The ninth organic patterns P_9 formed in the overlapping area of the active fourth area AAA4 and the active third area AAA3 overlap with the eighth organic patterns P_8 formed in the second deposition process DDP2, forming 2 A dummy organic pattern of layers can be formed.

The display panel manufacturing method according to this embodiment further includes the step of comparing the positions of the third-stage inspection organic pattern (CO_3R) of the third color and the mark (M_31) of the 2-1 group after the third deposition process (DDP3). It can be included. The center point (CP) of the third-stage inspection organic pattern (CO_3R) of the third color is the first center line (CL1) and the 2-1st center line of the mark disposed on the rightmost side among the marks (M_12) of the 1-2 group. The degree of offset from the second center line CL2 of the group mark M_31 can be measured (see FIG. 4). Using the measured offset, the offset can be removed by adjusting the position of the mask of the third mask assembly (MSK-3) during the next third deposition process (DDP3).

A seventh organic pattern is formed in the active areas (AA1, AA2, AA3) through the first deposition process (DDP1), second deposition process (DDP2), and third deposition process (DDP3) using the third mask assembly (MSK-3). An organic layer stacked in the order of the organic patterns P_7, the eighth organic patterns P_8, and the ninth organic patterns P_9 and an organic layer formed by stacking only some of the seventh to ninth organic patterns P_7, P_8, and P_9 are formed. It can be.

In the non-active area (NA), there is a third color organic pattern for first stage inspection (CO_1R), a third color organic pattern for first stage inspection (CO_1R) and a third color spaced apart in the first direction (DR1). The organic pattern for the second stage inspection (CO_2R) and the organic pattern for the third stage inspection (CO_2R) of the third color and the organic pattern for the third stage inspection (CO_3R) of the third color spaced apart in the second direction (DR2) This can be formed.

After the process of FIG. 13, the electron transport region (ETR) and the second electrode (EL2) may be formed as a common layer. After the second electrode EL2 is formed, a capping layer CPL may be further disposed on the second electrode EL2. After the capping layer (CPL) is formed, an encapsulation layer (TFE) may be disposed to cover the light emitting devices.

Referring to FIGS. 11 to 13 , when the charge generation layer (CGL) of FIG. 2 is formed as a common layer, the display panel is formed through only two deposition processes among the first deposition process (DDP1) to the third deposition process (DDP3). can be manufactured. For example, if a step of forming a charge generation layer (CGL) as a common layer is performed after forming the first light emitting layer (EML1) in the first deposition process (DDP1) of FIG. 11, the first deposition layer (CGL) is formed in the second deposition process (DDP2). 2 A light emitting layer (EML2) can be formed. In this way, a display panel having a light emitting device in which the charge generation layer (CGL) is a common layer can be manufactured by using only two processes selected from among the first to third deposition processes (DDP1, DDP2, and DDP3).

Referring to FIGS. 10 to 13, light emitting elements of first color pixels (PX-B), second color pixels (PX-G), and third color pixels (PX-R) are formed on one work substrate. The process was explained. The above measurement when performing the process of forming light emitting elements of the first color pixels (PX-B), second color pixels (PX-G), and third color pixels (PX-R) on another work substrate. The process can be performed by shift aligning the mask so that the offset is removed using the offset values.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or have ordinary knowledge in the relevant technical field will understand that it does not deviate from the spirit and technical scope of the present invention as set forth in the claims to be described later. It will be understood that various modifications and changes can be made to the present invention within the scope. Therefore, the technical scope of the present invention should not be limited to what is described in the detailed description of the specification, but should be defined by the claims.

DP display panel
BS base layer
DA display area
NDA non-display area
CA cathode area
ED-1 first color light emitting devices
M mark
PX-B primary color pixels
PX-G secondary color pixels
PX-R third color pixels
DM-B, DM-G, DM-R dummy organic patterns
WS work board
MSK Mask

Claims (20)

A base layer including a display area and a non-display area;
first color light emitting elements, second color light emitting elements, and third color light emitting elements disposed on the base layer and overlapping the display area;
a mark disposed on the base layer, overlapping the non-display area, and including a reference mark and a plurality of first groups of marks aligned with the reference mark in a first direction; and
disposed on the base layer, overlapping the non-display area, and including organic patterns for inspection arranged to correspond to the plurality of first group marks;
The spacing between two adjacent marks among the plurality of first group marks and the reference mark is N / the spacing between two adjacent first color light emitting devices in the first direction among the first color light emitting devices. The display panel is 4 times larger, where N is a natural number. According to claim 1,
The above mark is,
The display panel is disposed on the base layer, overlaps the non-display area, and further includes a plurality of second groups of marks aligned with the reference mark in a second direction. According to clause 2,
The spacing between adjacent marks among the plurality of second group marks and the reference mark is N/2 times the spacing between two adjacent first color light emitting devices in the second direction among the first color light emitting devices. , where N is a natural number for the display panel. According to clause 2,
The organic patterns for inspection are,
A display panel arranged to correspond to the plurality of second group marks. According to claim 1,
A display panel wherein the first color light emitting device includes at least one organic layer. According to clause 5,
The at least one organic layer is,
A display panel including a first light-emitting layer, a charge generation layer disposed on the first light-emitting layer, and a second light-emitting layer disposed on the charge generation layer. According to clause 6,
One of the organic patterns for inspection includes the same organic material as the first light-emitting layer,
Another one of the organic patterns for inspection is a display panel including the same organic material as the charge generation layer. According to clause 7,
A display panel wherein an interval between one organic pattern for inspection and the other organic pattern for inspection is substantially four times the interval between the two adjacent marks. According to claim 1,
Each of the first color light emitting devices includes a first light emitting area and each of the second color light emitting devices includes a second light emitting area,
The display panel wherein the first light emitting area and the second light emitting area are different. According to claim 1,
The non-display area is
A first area adjacent to the display area and a second area in which a partial area is spaced further away from the display area than the first area,
The display panel is
The display panel further includes dummy organic patterns disposed in the first area, wherein the dummy organic patterns have substantially the same shape on a plane as the light emitting layer of the first color light emitting devices. According to claim 10,
A display panel wherein the dummy organic patterns include at least one organic layer. According to claim 11,
The dummy organic patterns include a plurality of dummy organic pattern groups,
A display panel in which the number of organic layers is different between the dummy organic pattern groups. According to claim 10,
The first color light emitting device includes a first light emitting layer, a charge generation layer disposed on the first light emitting layer, and a second light emitting layer disposed on the charge generation layer,
The dummy organic patterns include fewer organic layers than the first color light emitting device,
The display panel wherein the organic layer of the dummy organic patterns includes the same material as any one of the first light-emitting layer, the charge generation layer, and the second light-emitting layer. Preparing a plurality of first group masks, each of which has a plurality of pattern holes and at least one inspection pattern hole defined;
Using a first mask among the plurality of first group masks on a working substrate including an active area and a non-active area adjacent to the active area and having first marks and second marks arranged in a first direction. forming a first organic pattern in the active area and a first organic pattern for inspection in the non-active area;
Aligning a second mask among the plurality of masks in the first group by shifting along the first direction based on the alignment of the first mask with respect to the work substrate; and
Forming a second organic pattern overlapping the first organic pattern in the active area and a second organic inspection pattern spaced apart from the first organic pattern in the non-active area using the second mask. Contains,
The first organic pattern for inspection is arranged to correspond to the first mark, and the second organic pattern for inspection is arranged to correspond to the second mark. According to claim 14,
Comparing the position of the first mark and the position of the first organic pattern for inspection in the first direction, and
A display panel manufacturing method further comprising comparing a position of the second mark and a position of the second organic pattern for inspection in the first direction. According to claim 14,
The working substrate further includes a reference mark aligned with the first mark and the second mark in the first direction and a third mark aligned with the reference mark in the second direction in the non-active area. Panel manufacturing method. According to claim 16,
Aligning a third mask among the plurality of masks in the first group by shifting along the second direction based on the alignment of the second mask with respect to the work substrate; and
Forming a third organic pattern overlapping the second organic pattern in the active area and a third organic pattern for inspection spaced apart from the second organic pattern in the non-active area using the third mask. Contains more,
The third organic pattern for inspection is arranged to correspond to the third mark. According to claim 17,
A display panel manufacturing method further comprising comparing the positions of the third mark and the third organic pattern for inspection. According to claim 14,
The working substrate further includes the first mark and a third mark and a fourth mark arranged in the first direction,
preparing a plurality of second group masks, each of which has a plurality of pattern holes and at least one inspection pattern hole defined;
A third organic pattern spaced apart from the first organic pattern in the active area and a third organic pattern for inspection in the non-active area are formed on the working substrate using a first mask among the plurality of second group masks. forming step;
Shifting and aligning a second mask among the plurality of second group masks along the first direction based on the aligned state of the first mask among the plurality of second group masks with respect to the work substrate. step; and
Among the plurality of second group masks, a fourth organic pattern overlapping the third organic pattern in the active area using the second mask and a fourth organic pattern spaced apart from the third organic pattern for inspection in the non-active area are formed. 4 Including the step of forming an organic pattern for inspection,
The third organic pattern for inspection is arranged to correspond to the third mark, and the fourth organic pattern for inspection is arranged to correspond to the fourth mark. According to clause 19,
The first organic pattern and the third organic pattern are in contact with a common layer.

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