KR20240022371A - Electronic device comprising flexible printed circuit board - Google Patents

Abstract

An electronic device according to an embodiment disclosed in this document may include a display, a rear cover facing the front cover, and/or a housing surrounding an internal space formed between the display and the rear cover. The housing may include a first plate portion at least partially facing the display and a first side wall surrounding an edge of the first plate portion. The housing may include a second housing including a second plate portion to which the rear cover is coupled, and a second side wall surrounding an edge of the second plate portion and spaced apart from at least a portion of the first side wall. there is. A gap extending from the separation space between the first side wall and the second side wall may be formed between the first housing and the second housing. The first side wall may include a conduit extending concavely along the circumferential direction of the electronic device with an upper portion open to the gap.

Description

Electronic device comprising a waterproof structure {ELECTRONIC DEVICE COMPRISING FLEXIBLE PRINTED CIRCUIT BOARD}

This document relates to a waterproof structure provided in a portion of a housing and an electronic device including the same.

Electronic devices refer to devices that perform specific functions according to installed programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, or vehicle navigation devices. It can mean. For example, these electronic devices can output stored information as sound or video. As the demand for mobile communication increases and the degree of integration of electronic devices increases, various technologies are being developed to improve the portability of electronic devices and user convenience in using multimedia functions.

An electronic device according to an embodiment disclosed in this document may include a display, a rear cover facing the front cover, and/or a housing surrounding an internal space formed between the display and the rear cover. The housing may include a first plate portion at least partially facing the display and a first side wall surrounding an edge of the first plate portion. The housing may include a second housing including a second plate portion to which the rear cover is coupled, and a second side wall surrounding an edge of the second plate portion and spaced apart from at least a portion of the first side wall. there is. A gap extending from the separation space between the first side wall and the second side wall may be formed between the first housing and the second housing. The first side wall may include a conduit extending concavely along the circumferential direction of the electronic device with an upper portion open to the gap.

1 is a block diagram of an electronic device in a network environment, according to an embodiment disclosed in this document.
Figure 2 is a front perspective view of an electronic device, according to an embodiment disclosed in this document.
3 is a rear perspective view of an electronic device, according to an embodiment disclosed in this document.
Figure 4 is an exploded perspective view of an electronic device, according to an embodiment disclosed in this document.
FIG. 5 is a diagram for explaining a waterproof structure of an electronic device according to an embodiment disclosed in this document.
Figure 6 is an enlarged view of part a of Figure 5.
Figure 7 is a cross-sectional view taken along line AA' of Figure 5.
Figure 8 is a cross-sectional view taken along line BB' in Figure 5.
Figure 9 is a cross-sectional view taken along line CC' of Figure 5.
FIG. 10 is a diagram showing a first housing and a conduit of an electronic device according to an embodiment disclosed in this document.
Figure 11 is a detailed view of part b of Figure 9.
FIG. 12 is a diagram showing a portion of a second housing and a rib of an electronic device according to an embodiment disclosed in this document.
Figure 13 is a detailed view of part c of Figure 12.
FIG. 14 is a diagram showing a first housing, a second housing, and a waterproof structure of an electronic device according to an embodiment disclosed in this document.
Figure 15 is an enlarged view of part e of Figure 14.
Figure 16 is a cross-sectional view taken along line DD' in Figure 15.
Figure 17 is an enlarged view of portion f of Figure 14.
Figure 18 is a cross-sectional view taken along line EE' in Figure 17.
FIG. 19 is a cross-sectional view taken along line FF' of FIG. 18.

1 is a block diagram of an electronic device in a network environment, according to an embodiment disclosed in this document.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In one embodiment, at least one of these components (eg, the connection terminal 178) may be omitted, or one or more other components may be added to the electronic device 101. In one embodiment, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hall area programmable device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to one embodiment, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to one embodiment, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second surface (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

In the detailed description below, the length direction, width direction and/or thickness direction of the electronic device may be mentioned, with the length direction being the 'Y axis direction', the width direction being the 'X axis direction', and/or the thickness direction. can be defined as 'Z-axis direction'. In one embodiment, the direction in which a component faces may be referred to as 'yin/yang (-/+)' in addition to the orthogonal coordinate system illustrated in the drawing. For example, the front of an electronic device or housing can be defined as a 'side facing the +Z direction', and the back side can be defined as a 'side facing the -Z direction'. In one embodiment, the side of the electronic device or housing may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and/or an area facing the -Y direction. Also, in one embodiment, 'X-axis direction' may mean including both '-X direction' and '+X direction'. Please note that this is based on the Cartesian coordinate system described in the drawings for brevity of explanation, and that the description of directions or components does not limit the embodiment disclosed in this document. For example, the direction in which the front or rear faces are different depending on whether the electronic device is unfolded or folded, and the direction mentioned above may be interpreted differently depending on the user's holding habits.

The configuration of the electronic device 200 of FIGS. 2 and 3 may be the same in whole or in part as the configuration of the electronic device 101 of FIG. 1 .

Figure 2 is a front perspective view of an electronic device, according to an embodiment disclosed in this document. 3 is a rear perspective view of an electronic device, according to an embodiment disclosed in this document.

Referring to Figures 2 and 3, the electronic device 101 according to one embodiment has a front side (210A), a back side (210B), and a side (210C) surrounding the space between the front side (210A) and the back side (210B). ) may include a housing 210 including. In one embodiment (not shown), the housing 210 may refer to a structure that forms part of the front 210A of FIG. 2, the rear 210B, and the side 210C of FIG. 3. According to one embodiment, the front surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate). The rear 210B may be formed by the rear cover 211. The rear cover 211 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. The side 210C combines with the front plate 202 and the rear cover 211 and may be formed by a side bezel structure (or “side wall”) 218 comprising metal and/or polymer. In one embodiment, the back cover 211 and the side bezel structure 218 may be integrally formed and include the same material (eg, glass, a metallic material such as aluminum, or ceramic).

Referring to FIG. 2, according to one embodiment, the front plate 202 has two first edge regions 210D that are bent and seamlessly extended from the front surface 210A toward the rear cover 211. These may be included at both ends of the long edges of the front plate 202. Referring to FIG. 3, according to one embodiment, the back cover 211 is curved from the back side 210B toward the front plate 202 and has two second edge regions 210E that extend seamlessly and have long edges. It can be included at both ends. In one embodiment, the front plate 202 (or the rear cover 211) may include only one of the first edge areas 210D (or the second edge areas 210E). In one embodiment, some of the first edge areas 210D or the second edge areas 210E may not be included. For example, when viewed from the side of the electronic device 101, the side bezel structure 218 has a side bezel structure 218 that does not include the first edge regions 210D or the second edge regions 210E. It may have a first thickness (or width). For example, when viewed from the side of the electronic device 101, the side bezel structure 218 has the first thickness on the side including the first edge regions 210D or second edge regions 210E. It may have a thinner second thickness.

According to one embodiment, the electronic device 101 includes a display 201, audio modules 203, 207, and 214 (e.g., the audio module 170 in FIG. 1), and a sensor module (e.g., the sensor module in FIG. 1). (176)), camera modules 205, 212, and 213 (e.g., camera module 180 in FIG. 1), key input device 217 (e.g., input module 150 in FIG. 1), and connector hole ( It may include at least one of 208 and 209) (e.g., the connection terminal 178 of FIG. 1). In one embodiment, the electronic device 101 may omit at least one of the components (eg, the connector hole 209) or may additionally include another component.

According to one embodiment, the display 201 may be visually exposed, for example, through a significant portion of the front plate 202. In one embodiment, at least a portion of the display 201 may be visually exposed through the front plate 202 forming the front surface 210A and the first edge areas 210D. In one embodiment, the edges of the display 201 may be formed to be substantially the same as the adjacent outer shape of the front plate 202. In one embodiment (not shown), in order to expand the area to which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.

According to one embodiment, the surface of the housing 210 (or the front plate 202) may include a screen display area formed as the display 201 is visually exposed. For example, the screen display area may include a front surface 210A and first edge areas 210D.

In one embodiment (not shown), a recess or opening is formed in a portion of the screen display area (e.g., front surface 210A, first edge area 210D) of the display 201, and the recess Alternatively, it may include at least one of an audio module 214, a sensor module (not shown), a light emitting element (not shown), and a camera module 205 that are aligned with the opening. According to one embodiment (not shown), on the back of the screen display area of the display 201, an audio module 214, a sensor module (not shown), a camera module 205, a fingerprint sensor (not shown), and a light emitting device are provided. It may include at least one element (not shown). According to one embodiment (not shown), the display 201 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. It can be placed like this. According to one embodiment, at least a portion of the key input device 217 may be disposed in the first edge areas 210D and/or the second edge areas 210E.

According to one embodiment, the audio modules 203, 207, and 214 may include, for example, a microphone hole 203 and speaker holes 207 and 214. A microphone for acquiring external sounds may be placed inside the microphone hole 203, and in one embodiment, a plurality of microphones may be placed to detect the direction of the sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for calls. In one embodiment, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or a speaker may be included without the speaker holes 207 and 214 (e.g., piezo speaker). The audio modules 203, 207, and 214 are not limited to the above structure, and can be designed in various ways, such as installing only some audio modules or adding new audio modules, depending on the structure of the electronic device 101.

According to one embodiment, a sensor module (not shown) may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (e.g., proximity sensor) and/or a second sensor module (e.g., fingerprint sensor) disposed on the front 210A of the housing 210, and/ Alternatively, it may include a third sensor module (eg, HRM sensor) and/or a fourth sensor module (eg, fingerprint sensor) disposed on the rear surface (210B) of the housing 210. In one embodiment (not shown), the fingerprint sensor may be disposed on the front 210A (eg, display 201) as well as the rear 210B of the housing 210. The electronic device 101 includes sensor modules not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor. The sensor module is not limited to the above structure, and can be designed in various ways, such as installing only some sensor modules or adding a new sensor module, depending on the structure of the electronic device 101.

According to one embodiment, the camera modules 205, 212, and 213 include, for example, a front camera module 205 disposed on the front 210A of the electronic device 101, and a rear camera module 205 disposed on the rear 210B. It may include a camera module 212 and/or a flash 213. The camera modules 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (an infrared camera, a wide-angle and a telephoto lens) and image sensors may be placed on one side of the electronic device 101. The camera modules 205, 212, and 213 are not limited to the above structure, and can be designed in various ways, such as installing only some camera modules or adding new camera modules, depending on the structure of the electronic device 101.

According to one embodiment, the electronic device 101 may include a plurality of camera modules (e.g., a dual camera or a triple camera) each having different properties (e.g., angle of view) or functions. For example, a plurality of camera modules 205 and 212 including lenses with different angles of view may be configured, and the electronic device 101 may perform a camera operation in the electronic device 101 based on the user's selection. The angle of view of the modules 205 and 212 can be controlled to change. For example, at least one of the plurality of camera modules 205 and 212 may be a wide-angle camera, and at least another one may be a telephoto camera. Similarly, at least one of the plurality of camera modules 205 and 212 may be a front camera, and at least another one may be a rear camera. Additionally, the plurality of camera modules 205 and 212 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (eg, a time of flight (TOF) camera or a structured light camera). According to one embodiment, the IR camera may operate as at least part of the sensor module. For example, the TOF camera may operate as at least part of a sensor module (not shown) to detect the distance to the subject.

According to one embodiment, the key input device 217 may be disposed on the side 210C of the housing 210. In one embodiment, the electronic device 101 may not include some or all of the key input devices 217 mentioned above and the key input devices 217 not included may be displayed on the display 201, such as soft keys. It can be implemented in different forms. In one embodiment, the key input device may include a sensor module 216 disposed on the rear 210B of the housing 210.

According to one embodiment, a light emitting device (not shown) may be disposed, for example, on the front surface 210A of the housing 210. For example, a light emitting device (not shown) may provide status information of the electronic device 101 in the form of light. In one embodiment, a light emitting device (not shown) may provide a light source that is linked to the operation of the front camera module 205, for example. Light-emitting devices (not shown) may include, for example, LEDs, IR LEDs, and/or xenon lamps.

According to one embodiment, the connector holes 208 and 209 are, for example, a first connector hole that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device. (208), and/or may include a second connector hole (eg, earphone jack) 209 that can accommodate a connector for transmitting and receiving audio signals to and from an external electronic device.

According to one embodiment, some camera modules 205 among the camera modules 205 and 212, and/or some sensor modules among the sensor modules (not shown) are exposed to the outside through at least a portion of the display 201. can be placed. For example, the camera module 205 may include a punch hole camera disposed inside a hole or recess formed on the back of the display 201. According to one embodiment, the camera module 212 may be disposed inside the housing 210 so that the lens is exposed to the rear 210B of the electronic device 101. For example, the camera module 212 may be placed on a printed circuit board (eg, printed circuit board 240 in FIG. 4).

According to one embodiment, the camera module 205 and/or the sensor module are configured to be in contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 202 of the display 201. can be placed. Additionally, some sensor modules 204 may be arranged to perform their functions without being visually exposed through the front plate 202 in the internal space of the electronic device.

Figure 4 is an exploded perspective view of the electronic device 101, according to an embodiment disclosed in this document.

Referring to FIG. 4, an electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 3) according to an embodiment includes a display 220 (e.g., the display 201 of FIG. 2 and a front plate). (202)), first housing 230 (e.g., bracket), printed circuit board 240 (e.g., PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), battery (not shown) (e.g. : Battery 189 in FIG. 1), second housing 250 (e.g., rear structure (W)), antenna (not shown) (e.g., antenna module 197 in FIG. 1), rear cover 260 ( Example: back cover 211 in Figure 2), waterproof structure 270, key assembly 281 (eg, key input device 217 in Figures 2 and 3) and tray 282 for storage media. may include. The electronic device 101 may further include a camera module (eg, camera modules 205, 212, and 213).

In one embodiment, the electronic device 101 may omit at least one of the components or may additionally include another component. The configuration of the electronic device 101 in FIG. 4 may be the same or similar to all or part of the configuration of the electronic device 101 in FIG. 2 and/or 3, and overlapping descriptions will be omitted below.

In one embodiment, the first housing 230 may include a first side wall 231 and a first plate portion 232. As an example, referring to FIG. 7 , the first side wall 231 and the first plate portion 232 may be separated by a dotted line area shown in FIG. 7 for convenience. According to one embodiment, the first side wall 231 may form at least a portion of the exterior of the electronic device 101 (eg, the side surface 210C in FIGS. 2 and 3 ). For example, the configuration of the first side wall 231 may be partially the same as or similar to the configuration of the side bezel structure 218 of FIG. 2 . For example, the first housing 230 may be formed of a metallic material and/or a non-metallic (eg, polymer) material. According to one embodiment, the first side wall 231 is formed between the first plate part 232 and the second plate part 252 along with the second side wall 251 of the second housing 250, which will be described later. It may surround the internal space of the device 101. For example, components including electrical components and/or electronic components (eg, printed circuit board 240 and/or battery (not shown)) may be disposed in the internal space. According to one embodiment, the first side wall 231 may be formed along the perimeter (or edge) of the first plate portion 232. According to one embodiment, the first side wall 231 is a 1-1 side wall 231a (+Y direction side wall) disposed at the top of the electronic device (forming a part of the top), and the first side wall 231a (+Y direction side wall) is disposed at the bottom of the electronic device. (forming part of the bottom) 1-2 side wall 231b (-Y direction side wall), 1-3 side wall 231c (-X direction side wall) and/or fourth side wall 231d (+X direction side wall) side walls).

According to one embodiment, the first plate portion 232 may be disposed inside the electronic device 101, and the first plate portion 232 may be connected to the first side wall 231 or the first side wall ( 231) and can be formed integrally. According to one embodiment, one side (eg, the front side or the +Z direction side) of the first plate portion 232 may at least partially face the display 220 . For example, the display 220 may be coupled to the first side wall 231 and/or the first plate portion 232. According to one embodiment, a printed circuit board 240 may be disposed on the other side of the first plate portion 232 facing in the opposite direction from one side on which the display 220 is disposed.

According to one embodiment, the printed circuit board 240 includes a processor (e.g., processor 120 of FIG. 1), memory (e.g., memory 130 of FIG. 1), and/or an interface (e.g., interface 177). ) can be installed. The processor may include, for example, at least one of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to one embodiment, the printed circuit board 240 may include a flexible printed circuit board type radio frequency cable (FRC). For example, the printed circuit board 240 may be disposed on at least a portion of the first plate portion 232, and may include an antenna module (e.g., the antenna module 197 in FIG. 1) and a communication module (e.g., the antenna module 197 in FIG. 1). It may be electrically connected to the communication module 190).

According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, connect the electronic device 101 to an external electronic device 101 electrically or physically and may include a USB connector, SD card/MMC connector, or audio connector. .

According to one embodiment, a battery (not shown) is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or May include a fuel cell. At least a portion of the battery (not shown) may be, for example, disposed on substantially the same plane as the printed circuit board 240. The battery (not shown) may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101.

In one embodiment, the second housing 250 may include a second side wall 251 and a second plate portion 252. In one embodiment, the second side wall 251 and the second plate portion 252 may be formed integrally. As an example, referring to FIG. 7 , the second side wall 251 and the second plate portion 252 may be referred to separately by the dotted line area shown in FIG. 7 for convenience. For example, the second plate portion 252 may be disposed inside the electronic device 101. According to one embodiment, the second housing 250 may be disposed between the printed circuit board 240 and an antenna (not shown). For example, a printed circuit board 240 and/or a battery (not shown) may be disposed on one side (e.g., the front, +Z direction side) of the second plate portion 252, and the other side (e.g., An antenna (not shown) may be placed on the rear (-Z direction surface). For example, the second housing 250 may be made of a metallic material and/or a non-metallic (eg, polymer) material.

According to one embodiment, the second side wall 251 may be disposed along the perimeter (or edge) of the second plate portion 252. For example, the configuration of the second side wall 251 may be the same or similar to some of the configuration of the side bezel structure 218 of FIG. 2 . In one embodiment, the second side wall 251 is formed between the first plate portion 232 and the second plate portion 252 together with the first side wall 231 of the first housing 230. ) can surround the internal space of the. For example, the second side wall 251 and the first side wall 231 may form the exterior of the electronic device 101 (eg, the side surface 210C in FIGS. 2 and 3 ). For example, a gap may be formed between the second side wall 251 and the first side wall 231 (e.g., gap G1 in FIG. 6), but the sides are substantially connected in appearance (e.g., FIG. 2 and The side 210C of FIG. 3) can be formed. According to one embodiment, the second side wall 251 is a 2-1 side wall 251a (+Y direction side wall) disposed at the top of the electronic device (forming a part of the top), and the second side wall 251a (+Y direction side wall) is disposed at the bottom of the electronic device. It may include a 2-2 side wall 251b (-Y direction side wall), a 2-3 side wall 251c (-X direction side wall), and/or a 2-4 side wall 251d (+X direction side wall). there is.

In one embodiment, key assembly 281 (e.g., key input device 217 of FIGS. 2 and 3) and/or tray 282 for storage media is positioned on the side of electronic device 101 (e.g., key input device 217 of FIGS. 2 and 3 ). It may be placed on the side (210C) of FIG. 3). For example, the key assembly 281 and/or the storage medium tray 282 are located on the inside of the left and right (X direction) sides (e.g., side 210C of FIGS. 2 and 3) of the electronic device 101. can be placed in

In one embodiment, the key assembly 281 is disposed on the inside of one side (e.g., the right side or the +X direction side) of the electronic device 101 (e.g., side 210C in FIGS. 2 and 3). You can. According to one embodiment, the 1-4 side wall 231d and/or the 2-4 side wall 251d may include a partially deleted or pierced receiving area (not shown) to accommodate the key assembly 281. You can. For example, a portion of the key assembly 281 (e.g., the key input device 271 in FIGS. 2 and 3) may be exposed to the outside of the electronic device 101, closing the receiving area (not shown). and may form part of the exterior of the electronic device 101 together with the second-fourth sidewall 251d. The remaining portion of the key assembly 281 may be disposed inside the second-fourth side wall 251d.

According to one embodiment, the storage medium tray 282 is located on one side (e.g., the left side or the -X direction side) of the side (e.g., the side 210C in FIGS. 2 and 3) of the electronic device 101. It can be placed on the inside. For example, a storage medium may be placed in the tray 282 for a storage medium. 'Storage medium' may include a memory card such as an SD card (eg, external memory 138 in FIG. 1) or a subscriber identification module (SIM) card. According to one embodiment, the 1-3 side wall 231c and/or the 2-3 side wall 251c have a mounting area (not shown) partially deleted or penetrated to accommodate the tray 282 for a storage medium. It can be included. For example, a portion of the storage medium tray 282 may form part of the exterior of the electronic device 101 together with the second-third side walls 251c while closing the mounting area (not shown). Storage medium The remaining portion of the tray 282 may be disposed inside the second-third side wall 251c through the mounting area (not shown).

According to one embodiment, an antenna (not shown) may be disposed between the rear cover 260 and a battery (not shown). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna can perform short-distance communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, an antenna structure may be formed by a portion or a combination of the first side wall 231 and/or the first plate portion 232.

According to one embodiment, the back cover 260 may form at least a portion of the back of the electronic device 101 (eg, the back 210B in FIG. 3).

FIG. 5 is a diagram for explaining a waterproof structure of an electronic device according to an embodiment disclosed in this document. Figure 6 is an enlarged view of part a of Figure 5. FIG. 7 is a cross-sectional view taken along line A-A' in FIG. 5. Figure 8 is a cross-sectional view taken along line B-B' in Figure 5. Figure 9 is a cross-sectional view taken along line C-C' in Figure 5.

5 to 9, in one embodiment, the first housing 230 and the second housing 250 include a first plate portion (e.g., the first plate portion 232 in FIG. 4) and a second housing. The plate portions (eg, the second plate portion 252 in FIG. 4) may be arranged to at least partially face each other. According to one embodiment, the first housing 230 and the second housing 250 are the internal space (or the inside of the electronic device) formed between the display (e.g., the display 220 in FIG. 4) and the rear cover 260. space) can be surrounded. For example, in the 'internal space', various internal components such as electrical components and/or electronic components (eg, printed circuit board 240 and/or battery (not shown)) may be disposed.

In one embodiment, the first housing 230 and the second housing 250 may be formed separately and combined to form a housing assembly. For example, a portion of the first housing 230 and/or the second housing 250 including the side walls 231 and 251 may correspond to a coupling area between the two housings. According to one embodiment, the first housing 230 and the second housing 250 have side walls 231 and 251 and a portion of the plate portions 232 and 252 extending from the side walls 231 and 251 have an air gap ( It can be placed with an air gap in between. For example, the air gap may be referred to as 'gap (G1)' (eg, assembly gap (G1)). For example, the 'gap G1' may be formed by the first side wall 231, the first plate portion 232, the second side wall 251, and/or the second plate portion 252. For example, the gap G1 may be formed along all or part of the perimeter of the electronic device 101 (or the perimeter of the first housing 230 and/or the second housing 250). For example, the 'gap G1' refers to the space between the two side walls 231 and 251 through which external fluid (e.g., water W) of the electronic device 101 first flows into the electronic device 101. A path leading to an internal space can be formed. For example, the internal space of the electronic device 101 may be fluidly connected to the outside of the electronic device 101 through the gap G1. For example, gap G1 may function as part of an air-vent. For example, the gap G1 is a microphone hole (e.g., microphone hole 203 in FIGS. 2 and 3), a speaker hole (e.g., speaker holes 207 and 214 in FIG. 2), and a connector hole (e.g., FIG. A first side wall 231 and/or a second side wall, such as the connector holes 208 and 209 of FIGS. 2 and 3) and/or through holes in which the key assembly 281 or the tray 282 for storage media are received. 251) may be connected to a penetrating or recessed area. However, the configuration of the housings 230 and 250 and the gap G1 is not limited to the above-described configuration. For example, the first housing 230 and the second housing 250 may be a single housing member formed integrally, and the 'gap G1' is a gap G1 disposed between the housing member and the display 220. ) can refer to.

Referring to FIGS. 5 and 6 , in one embodiment, the two side walls 231 and 251 may at least partially overlap each other. For example, the two side walls 231 and 251 may at least partially overlap each other when viewed in the longitudinal direction (Y-axis direction) of the electronic device 101. According to one embodiment, a portion of the first side wall 231 may have a surface that forms part of the exterior of the electronic device 101 together with the second side wall 251, and another portion may form a portion of the exterior of the electronic device 101. Can be placed inside. For example, the other part of the first side wall 231 may overlap with at least a part of the second side wall 251 and may be disposed below the second side wall 251 (-Z direction).

In one embodiment, the electronic device 101 may include an audio hole 291 on one side. For example, the audio hole 291 is a microphone hole (e.g., the microphone hole 203 in FIGS. 2 and 3), an external speaker hole (e.g., the external speaker hole 207 in FIGS. 2 and 3), or an external receiver. It may be a hole (e.g., the call receiver hole 214 in FIGS. 2 and 3). According to one embodiment, the audio hole 291 may be formed through the first side wall 231 and/or the second side wall 251.

Referring to Figure 5, in one embodiment, the waterproof structure 270 of the electronic device 101 (e.g., the electronic device 101 of Figures 1, 2, and 3 and/or 4) includes a first housing. It may include at least one conduit (271, 272) disposed in (230) and at least one rib (276, 277) disposed in the first housing (230) and/or the second housing (250).

In one embodiment, at least one conduit 271 or 272 may be provided in the first housing 230 (eg, the first housing 230 in FIG. 4). According to one embodiment, at least one rib 276 or 277 may be provided in the first housing 230 and/or the second housing 250 (eg, the second housing 250 in FIG. 4).

In one embodiment, a state of the electronic device 101 that is used frequently may be referred to as a 'default state' of the electronic device 101. For example, the 'default state' is when the top sidewall (the first-first sidewall 231a and/or the second-first sidewall 251a) of the electronic device 101 is substantially upward and the display 220 is substantially upward. It can mean the state of facing forward. For example, external water W may flow into the gap G1 formed in the circumferential direction of the electronic device 101. In the basic state of the electronic device 101, the upper side wall (1-1 side wall 231a and/or 2-1 side wall 251a) of the electronic device 101 among the portions of the gap G1 is the electronic device 101. The possibility of contact with water (W) outside of (101) may be greatest. For example, in the basic state of the electronic device 101, water (W) falling in the direction of gravity, such as rainwater, is in the gap (G1) between the 1-1 side wall 231a and the 2-1 side wall 251a. ) can flow into the

5 to 9, according to one embodiment, the conduits 271 and 272 are disposed on the 1-1 side wall 231a of the first housing 230 (e.g., the first side wall 231). You can. In one embodiment, the conduits 271 and 272 are first conduits 271 spaced apart from each other on the surface of the 1-1 side wall 231a of the first housing 230 (e.g., the first side wall 231). And it may include a second conduit (272). In one embodiment, the pipes 271 and 272 may be grooves or recesses formed to be recessed in the surface of the first side wall 231. In one embodiment, the conduits 271 and 272 are open to the gap G1 and may be connected to the gap G1. For example, the conduits 271 and 272 may refer to a surface recessed in the first side wall 231 and a space surrounded by the surface. According to one embodiment, the conduits 271 and 272 may substantially face the surface of the second side wall 251 located at the top (+Y direction). In one embodiment, the conduits 271 and 272 may be disposed in the second housing 250 (eg, the second side wall 251). For example, the conduits 271 and 272 may be formed in the first side wall 231 and/or the second side wall 251. For example, when the pipes 271 and 272 are formed on the second side wall 251. It may be referred to as the recessed surface of the second side wall 251 and the space surrounded by the surface.

Referring to FIG. 6, the pipes 271 and 272 may change the flow of water (W) toward the internal space of the electronic device 101 to the circumferential direction of the electronic device 101. Referring to FIGS. 7 to 9 , the air resistance of the gap G1 may be greater at the portion leading to the internal space of the electronic device 101 through the conduits 271 and 272 than at the location of the conduits 271 and 272. . For example, water W flowing in from the outside of the electronic device 101 flows through the gap G1 and reaches the pipes 271 and 272, passes through the pipes 271 and 272, and enters the electronic device 101. Rather than continuing to move into the internal space, it can be guided to flow along the pipes 271 and 272, which have relatively lower air resistance. For example, all of the introduced water W may flow into the pipes 271 and 272, or only a portion of it may flow into the pipes 271 and 272. For example, water W moving toward the internal space without entering the pipes 271 and 272 may be blocked by the ribs 276 and 277, which will be described later.

Referring to FIGS. 5 and 6, according to one embodiment, the first pipe 271 extends along the surface of the 1-1 side wall 231a, but is curved or curved by the structure of the first side wall 231. It can be. For example, at least a portion of the first conduit 271 may extend in the width direction (X-axis direction) of the electronic device 101. For example, the first pipe 271 may be partially interrupted by a first penetration area 235 formed through the 1-1 side wall 231a. For example, the water (W) flowing into the first penetration area 235 or the peripheral gap G1 of the first penetration area 235 is a first pipe connected to one side of the first penetration area 235 ( 271) and can flow in one direction (e.g., +X direction). For example, the water W flowing into the first penetration area 235 or the gap G1 adjacent to the first penetration area 235 is directed in a direction opposite to the one side of the first penetration area 235. It may flow in the opposite direction (eg, -X direction) along the first pipe 271 connected to the other side.

According to one embodiment, the second pipe 272 may be disposed on the surface of the 1-1 side wall 231a and may be spaced apart from the first pipe 271. Referring to FIG. 9, in one embodiment, the first side wall 231 may be formed so that some areas around the audio hole 291 are lower (in the -Y direction) than other areas (e.g., see FIG. 8). You can. In one embodiment, the 1-1 side wall 231a around the audio hole 291 may have a step shape (e.g., step shape), and the step closer to the rear cover 260 is lower (-Y direction). ) can be formed. For example, the gap G1 between the 1-1 side wall 231a and the second side wall 251 around the audio hole 291 (or the gap G1 around the audio hole 291) is the overall internal space. It can be formed slanted toward. Accordingly, the gap G1 around the audio hole 291 is less inclined or is submerged compared to the gap G1 in other parts that are formed substantially parallel to the thickness direction (Z-axis direction) of the electronic device 101. may be more vulnerable to

According to one embodiment, a first pipe 271 and a second pipe 272 to supplement the water blocking function of the first pipe 271 are provided on the surface of the first side wall 231 around the audio hole 291. It can be. For example, the end of the 1-1 side wall 231a where the second pipe 272 is formed may be located lower (closer to the -Y direction) than the end where the first pipe 271 is formed. For example, the second conduit 272 may be formed to be closer to the inside of the electronic device 101 than the first conduit 271 in the gap G1. For example, the second conduit 272 may be disposed closer to the second plate portion 252 and the rear cover 260 of the second housing 250 than the first conduit 271. For example, in terms of the length of the path leading to the internal space of the electronic device 101 along the gap G1, the path may be shorter in the second conduit 272 than in the first conduit 271. For example, the second conduit 272 may be closer to the internal space of the electronic device 101 than the first conduit 271. However, the location, shape, and/or number of the pipes 271 and 272 are not limited to the disclosure of this document including the drawings, and for example, the structure of the housings 230 and 250 and the internal configuration disposed in the internal space Depending on the relationship, the position and/or shape may be changed, and the housing 230, 250 (e.g., the first side wall 231, the first plate portion 232, the second side wall 251 and/or It may be additionally provided in the second plate portion 252).

According to one embodiment, at least a portion of the water W flowing into the first pipe 271 may move toward the inside of the electronic device 101 along the gap G1 around the audio hole 291. It may be partially or completely blocked by the second rib 277, which will be described later, located between the first pipe 271 and the second pipe 272. A portion of the water W that is not blocked by the second rib 277 may be completely or partially blocked by the second pipe 272.

Referring to FIG. 5, the second pipe 272 extends along the surface of the 1-1 side wall 231a, and may be curved or curved depending on the structure of the first side wall 231. For example, at least a portion of the second conduit 272 may extend in the width direction (X-axis direction) of the electronic device 101 and/or parallel to (e.g., substantially parallel to) the first conduit 271. there is. For example, the second conduit 272 may be curved to avoid the audio hole 291. For example, the width of the second conduit 272 in the thickness direction (Z-axis direction) of at least some areas of the electronic device 101 may be larger than that of the first conduit 271 .

In one embodiment, the ribs 276 and 277 include at least one first rib 276 disposed on the first side wall 231 of the first housing 230 and a second side wall of the second housing 250. It may include at least one second rib 277 disposed at 251.

In one embodiment, the ribs 276 and 277 may protrude from the first side wall 231 or the second side wall 251 and block at least a portion of the gap G1. For example, in terms of the length of the path along the gap G1 to the internal space of the electronic device 101, the path is shorter in the ribs 276 and 277 than in the first conduit 271, and the rib It may be shorter in the second conduit (272) than in (276, 277). For example, the ribs 276 and 277 are disposed closer to the internal space of the electronic device 101 than the first conduit 271 and further away from the internal space of the electronic device 101 than the second conduit 272. It can be.

For example, the ribs 276 and 277 may be disposed between the internal space of the electronic device 101 and the first conduit 271. For example, the ribs 276 and 277 may additionally block water W that has not yet flowed into the first pipe 271 to prevent or reduce flooding of the internal space of the electronic device 101.

FIG. 10 is a diagram showing a first housing and a conduit of an electronic device according to an embodiment disclosed in this document. Figure 11 is a detailed view of part b of Figure 9. FIG. 12 is a diagram showing a portion of a second housing and a rib of an electronic device according to an embodiment disclosed in this document. Figure 13 is a detailed view of part c of Figure 12.

The first housing 230 of FIGS. 10 and 11 may be referred to as the first housing 230 of FIGS. 5 to 9 . The second housing 250 of FIGS. 12 and 13 may be referred to as the second housing 250 of FIGS. 5 to 9 . The first conduit 271 of FIGS. 10 and 11 may be referred to as the first conduit 271 of FIGS. 5 to 9 . The second conduit 272 of FIGS. 10 and 11 may be referred to as the second conduit 272 of FIGS. 5 and 9 . The first rib 276 of FIG. 11 may be referred to as the first rib 276 of FIG. 5 . The second rib 277 of FIG. 12 may be referred to as the second rib 277 of FIGS. 5 and 7 to 9.

Referring to FIG. 10, in one embodiment, the waterproof structure 270 includes a first pipe 271 and a second pipe 272 disposed in the central portion of the 1-1 side wall 231a of the first side wall 231. may include. However, the shape and arrangement of the first pipe 271 and the second pipe 272 are not limited to the above-described contents. For example, the first conduit 271 and/or the second conduit 272 is directed from the central portion of the surface of the 1-1 side wall 231a toward the width direction (e.g., X-axis direction) of the electronic device 101. It may be extended further. For example, the first pipe 271 and/or the second pipe 272 include the 1-1 side wall 231a, the 1-2 side wall 231b, the 1-3 side wall 231c, and/or the 1-3 side wall 231b. 1-4 may be formed on the surface of the side wall 231d. For example, the first conduit 271 may extend from the central portion of the 1-1 side wall 231a to a portion of the 1-3 side wall 231c and/or the 1-4 side wall. all. However, the location, shape, and/or number of the pipes 271 and 272 are not limited to the disclosure of this document including the drawings, and for example, the structure of the housings 230 and 250 and the internal configuration disposed in the internal space Depending on the relationship, the position and/or shape may be changed, and the housing 230, 250 (e.g., the first side wall 231, the first plate portion 232, the second side wall 251 and/or It may be additionally provided in the second plate portion 252).

According to one embodiment, in the basic state of the electronic device 101 where the upper side walls (the 1-1 side wall 231a and the 2-1 side wall 251a) of the electronic device 101 face upward, the gap G1 ) At least a portion of the water (W) flowing into the first pipe 271 and/or the second pipe 272 may flow into the water W. For example, water (W) flowing into the first pipe 271 may flow in the circumferential direction of the electronic device 101. For example, the water (W) flowing into the first pipe 271 and/or the second pipe 272 is stagnant in the first pipe 271 and then evaporates or flows through the gap G1 to a random path. It can be released again. For example, the water (W) flowing into the first pipe 271 flows along the first pipe 271, and the 1-3 side walls 231c and 2-3 connected to the first pipe 271. It may flow down along the gap G1 between the three side walls 251c and/or the gap G1 between the first to fourth side walls 231d and the second to fourth side walls 251d. For example, in the basic state of the electronic device 101, water (W) flowing through the gap (G1) of the left and right side walls (231c, 231d, 251c, 251d) is directed in the direction of gravity (-Y direction). Therefore, internal components such as a printed circuit board (e.g., printed circuit board 240 of FIG. 4) may not penetrate into the internal space of the electronic device 101 where it is placed.

Referring to FIG. 11, in one embodiment, the first rib (eg, the first rib 276 in FIGS. 5 and 8) may be formed to protrude on a portion of the 1-1 side wall 231a. For example, the first rib 276 may be formed on a portion (eg, +Z direction surface) of the first side wall 231 facing the core region 253 of the second side wall 251, which will be described later. According to one embodiment, the first rib 276 may be disposed closer to the second plate portion 252 and/or the rear cover compared to the first conduit 271 and/or the second conduit 272. . For example, when looking at the length of the path along the gap G1 to the internal space of the electronic device 101, the path is further along the first rib than in the first conduit 271 and/or the second conduit 272. It can be shorter at (276). For example, the first rib 276 may be closer to the internal space of the electronic device 101 than the first conduit 271 and/or the second conduit 272. For example, the first rib 276 may protrude toward the second housing 250 (eg, the second plate portion 252). For example, the first rib 276 may block at least a portion of the gap G1 between the first side wall 231 and the second housing 250 (e.g., the second plate portion 252) facing each other. You can. For example, the first rib 276 may be in substantially contact with the facing second plate portion 252 or may be protruded to be slightly spaced apart.

Referring to FIG. 13 , in one embodiment, the second side wall 251 may include a core region 253 that is undercut in the center of the 2-1 side wall 251a. For example, the core region 253 may be recessed in the surface (eg, -Y direction surface) facing the 1-1 side wall 231a of the 2-1 side wall 251a. For example, the core region 253 may be formed to have a thinner average thickness (thickness in the Z-axis direction) than other regions of the second side wall 251. For example, components of the electronic device 101 may be disposed in the core area 253. For example, the core area 253 may include audio modules (e.g., audio modules 203, 207, 214 in FIGS. 2 and 3) and/or camera modules (e.g., camera modules 205 in FIGS. 2 and 3). Components of the electronic device 101, such as 212 and 213), may be at least partially disposed. For example, in the core area 253, a receiver for a call (e.g., the audio module 170 in FIG. 1) connected to an audio hole (e.g., the audio hole 291 in FIGS. 5 and 9) will be placed. According to one embodiment, it may be difficult to form a rib (ㅇ: second rib 277) in the core region 253 as the components of the electronic device 101 are disposed. For example, the core region 253 A first rib 276 (eg, the first rib 276 in FIGS. 5 and 8) may be formed in a portion of the 1-1 side wall 231a facing the region 253.

12 and 13, in one embodiment, the second rib 277 (e.g., the second rib 277 in FIGS. 5 and 7 to 9) is a part of the 2-1 side wall 251a. may be formed to protrude. According to one embodiment, the second rib 277 may be disposed on the surface (eg, -Y direction surface) of the 2-1 side wall 251a facing the 1-1 side wall 231a. In one embodiment, the second rib 277 extends along the 2-1 side wall 251a, but may be interrupted in some areas depending on the structure of the 2-1 side wall 251a. For example, the second rib 277 may be disposed on both sides of the core region 253 excluding the core region 253 of the 2-1 side wall 251a.

The location, shape, and/or number of the ribs 276 and 277 of the above-described embodiments are not limited to the disclosure of this document, including the drawings, and are, for example, disposed in the structure and internal space of the housings 230 and 250. Depending on the relationship with the internal configuration, the position and/or shape may be changed, housing 230, 250 (e.g., first side wall 231, first plate portion 232, second side wall 251) and/or may be additionally provided in the second plate portion 252).

FIG. 14 is a diagram showing the first housing 230, the second housing 250, and the waterproof structure of the electronic device 101 according to an embodiment disclosed in this document. Figure 15 is an enlarged view of part e of Figure 14. FIG. 16 is a cross-sectional view taken along line D-D' in FIG. 15. Figure 17 is an enlarged view of portion f of Figure 14. FIG. 18 is a cross-sectional view taken along line E-E' of FIG. 17. FIG. 19 is a cross-sectional view taken along line F-F' of FIG. 18.

The configuration of the first housing 230 of FIGS. 14 to 19 may be entirely or partially the same as the configuration of the first housing 230 of FIGS. 5 to 9 and/or FIGS. 10 and 11 . The configuration of the second housing 250 of FIGS. 14 to 19 may be entirely or partially the same as the configuration of the second housing 250 of FIGS. 5 to 9 and/or FIGS. 12 and 13 . The configuration of the waterproof structure 270 of FIG. 14 may be completely or partially the same as the configuration of the waterproof structure 270 of FIG. 5 . The configuration of the first conduit 271 of FIGS. 14 to 19 may be entirely or partially the same as the configuration of the first conduit 271 of FIGS. 5 to 9 and/or FIGS. 10 and 11. The configuration of the second pipe 272 in FIGS. 14 and 17 is completely or partially the same as the second pipe 272 in FIGS. 5 and 9 and/or the second pipe 272 in FIGS. 12 and 13. may be the same. The configuration of the first rib 276 of FIGS. 14, 15, and 17 is completely or partially the same as the configuration of the first rib 276 of FIGS. 5 and 8 and/or the first rib 276 of FIG. 11. may be the same. The configuration of the second rib 277 in FIGS. 14 to 16 may be the same in whole or in part as the configuration of the second rib 277 in FIGS. 5, 7 to 9 and/or FIGS. 12 and 13. .

14 to 19, the first pipe 271 of the waterproof structure 270 is 1-1 of the first side wall 231 (e.g., the first side wall 231 of FIGS. 10 and 11). It may be formed throughout the electronic device 101 (e.g., the electronic device 101 in FIG. 4) on the side wall 231a (e.g., the 1-1 side wall 231a in FIGS. 10 and 11). For example, at least a portion of the first conduit 271 may extend concavely in the width direction (eg, X-axis direction) from the 1-1 side wall 231a.

According to one embodiment, the gap G1 formed between the first housing 230 and the second housing 250 is formed around the perimeter (or the first housing 230 and/or the second housing 250) of the electronic device 101. ) may be formed over all or part of the perimeter of ). For example, the gap G1 formed between the 1-1 side wall 231a and the 2-1 side wall 251a (or the second plate portion 252) (e.g., the gap G1 in FIGS. 6 to 9 )) is between the 1-3 side wall 231c and the 2-3 side wall 251c (or the second plate portion 252) and/or the 1-4 side wall 231d and the 2-4 side wall ( It may extend between 251d) (or the second plate portion 252).

Referring to FIGS. 14 to 19, in one embodiment, the second rib 277 is formed from the 2-1 sidewall 251a (e.g., the 2-1 sidewall 251a of FIG. 12) to the 2-3 sidewall. (251c) (e.g., the 2-3 side wall 251c of FIG. 12) and/or extending to at least a portion of the 2-4 side wall 251d (e.g., the 2-4 side wall 251d of FIG. 12). It can be. In one embodiment, the first conduit 271 may extend concavely between both ends (ends in the X-axis direction) of the 1-3 side wall 231c along the length of the 1-3 side wall 231c. According to one embodiment, the first pipe 271 is connected from the 1-1 side wall 231a of the first side wall 231 to the 1-3 side wall 231c (e.g., the 1-3 side wall 231c of FIG. 10). )) and/or may extend to at least a portion of the 1-4 side wall 231d (e.g., the 1-4 side wall 231d of FIG. 10).

15 and 16, in one embodiment, the 1-3 side wall 231c of the first housing 230 and the 2-3 side wall 251c of the second housing 250 overlap each other, It may include a mounting area that is partially deleted or penetrated to accommodate the tray 282 for the storage medium. For example, the mounting area may be connected to gap G1. Referring to FIG. 15, the 1-3 side wall 231c and the 2-3 side wall 251c may not overlap each other around the mounting area where the storage medium tray 282 is disposed. For example, the peripheral portion of the mounting area may have a short path leading to the internal space of the electronic device 101 along the gap G1 and may be relatively vulnerable to flooding. For example, at least one pipe (e.g., first pipe 271) and a rib (e.g., second rib 277) that supplements the water flow function of the pipe may be disposed around the mounting area. However, the location, shape, and/or number of the first pipe 271, the first rib 276, and/or the second rib 277 are not limited to those described above. For example, the first-third side wall 231c may further include a first rib 276 (not shown) in a portion forming the mounting area.

17 to 19, in one embodiment, the 1-4 side wall 231d of the first housing 230 and the 2-4 side wall 251d of the second housing 250 overlap each other, It may include a partially obliterated or pierced receiving area to receive the key assembly 281. For example, the receiving area may be connected to the gap G1. 18 and 19, the 1-4th side wall 231d and the 2-4th side wall 251d may not overlap each other around the receiving area where the key assembly 281 is disposed, for example. , the peripheral portion of the receiving area (e.g., FIG. 19) may have a shorter path leading to the internal space of the electronic device 101 along the gap G1 than other portions (e.g., FIG. 18). For example, the side wall may further include at least one rib (not shown) extending parallel to the first conduit 271 around the receiving area. For example, the 2-3 side wall 251c may further include a second rib 277 (not shown) in a portion forming the receiving area. For example, the first-third side wall 231c may further include a first rib 276 (not shown) in a portion forming the receiving area.

The electronic device including a waterproof structure (e.g., pipe, rib) and/or housing according to the embodiments disclosed in this document described above is not limited to the above-described embodiments and drawings, but is disclosed in this document. It will be clear to those skilled in the art that various substitutions, modifications and changes are possible within the technical scope.

The location, shape and/or number of the conduits 271 and 272 described above with reference to FIGS. 5 to 19 are not limited to the disclosure of this document including the drawings, and are, for example, the structure of the housings 230 and 250 and Depending on the relationship with the internal configuration disposed in the internal space, its position and/or shape may be changed, and the housing 230, 250 (e.g., the first side wall 231, the first plate portion 232, the first 2 It may be additionally provided on the side wall 251 and/or the second plate portion 252). For example, the conduits 271 and 272 may be designed to avoid some structures or internal configurations of the first and second side walls 231 and 251. For example, the conduits 271 and 272 are positioned and/or shaped (e.g., width, depth, length) to enhance the ordering function for some structures or internal configurations of the first and second side walls 231 and 251. may be changed or additionally prepared.

The position, shape and/or number of the ribs 276 and 277 described above with reference to FIGS. 5 to 19 are not limited to the disclosure of this document including the drawings, and are, for example, the structure of the housings 230 and 250 and Depending on the relationship with the internal configuration disposed in the internal space, its position and/or shape may be changed, and the housing 230, 250 (e.g., the first side wall 231, the first plate portion 232, the first 2 It may be additionally provided on the side wall 251 and/or the second plate portion 252). For example, the ribs 276 and 277 may be designed to avoid some structures or internal configurations of the first and second side walls 231 and 251. For example, the ribs 276, 277 may be positioned and/or shaped (e.g., width, depth, length) to enhance the ordering function for some structures or internal configurations of the first and second side walls 231, 251. may be changed or additionally provided.

A housing of an electronic device may generally be made of a plurality of members assembled together, such as front and rear housings. In general, a lifting phenomenon may occur or an assembly gap may be formed between the assembled front and rear housings. For example, the assembly gap may extend from the external surface of the electronic device to the interior space of the electronic device enclosed in the housing. Accordingly, external fluid (e.g., water) of the electronic device may penetrate into the internal space of the electronic device through the assembly gap. Since electronic components that are vulnerable to flooding, such as printed circuit boards, are placed in the internal space of electronic devices, it is necessary to implement a waterproof structure in the housing that closes the gap. In general, a method of arranging a strip-shaped shielding member (eg, a sponge) in the circumferential direction on the inside of the rear housing facing the front housing may be applied. However, the method of attaching a separate shielding member to the housing increases the number of members and requires additional processes such as attachment and compression of the shielding member, which may increase overall cost.

Embodiments disclosed in this document integrally form a waterproof structure in each of the joint areas of the two housings, thereby forming an electronic device without a separate process of attaching a waterproof member such as a sponge to the gap formed along the joint area between the two housings. The flood prevention function of the internal structure can be implemented. In one embodiment, a waterproof structure may be integrally formed in the coupling area of the two housings, and a waterproof member such as a sponge may be attached to a gap formed along the coupling area between the two housings.

The problems to be solved by the embodiments disclosed in this document are not limited to the above-described content, and may be expanded in various ways without departing from the spirit and scope disclosed in this document.

The electronic device 101 according to an embodiment disclosed in this document includes a display (201 in FIG. 2 and/or 220 in FIGS. 4, 7, and 8), a rear cover (FIGS. 4, 7, and 8) facing the front cover. 260), and/or may include a housing surrounding an internal space formed between the display and the rear cover. The housing includes a first plate portion (232 in FIGS. 4, 7, 8, 10, and 11) at least partially facing the display and a first side wall (231 in FIGS. 4 and 10) surrounding an edge of the first plate portion. ) may include a first housing (230 in FIGS. 4, 10, and 14) including. The housing surrounds a second plate portion (252 in FIGS. 4, 7, 8, 12, and 13) to which the rear cover is coupled, and surrounds an edge of the second plate portion and is spaced apart from the outside of at least a portion of the first side wall. It may include a second housing (250 in FIGS. 4, 12, and 14) including a second side wall (251 in FIGS. 4 and 12). A gap extending from the separation space between the first side wall and the second side wall may be formed between the first housing and the second housing. The first side wall may include a conduit (271 in FIGS. 14-19, 272 in FIGS. 5, 9, and 11) that extends concavely along the circumferential direction of the electronic device with its upper portion open to the gap. there is.

In one embodiment, the conduit may be formed concavely on a portion of the surface of the first side wall facing the second side wall.

In one embodiment, the air resistance of the gap may be greater in another area closer to the internal space than the pipe, compared to an area where the pipe is located.

In one embodiment, the conduit may be curved to avoid at least one penetration area formed in a portion of the first side wall.

In one embodiment, there are a plurality of pipes, and the plurality of pipes include a first pipe (271 in FIGS. 14-19) and a second pipe disposed closer to the internal space than the first pipe (FIGS. 5 and 9 , 272 in FIG. 11).

In one embodiment, the second conduit may be formed in an area where the path length between the spaced space and the internal space on the first side wall is relatively short compared to other areas.

In one embodiment, the second conduit may extend at least partially parallel to the first conduit.

In one embodiment, at least one of the first side wall or the second side wall may include at least one rib 276 or 277 that protrudes into the gap and extends along a circumferential direction of the electronic device.

In one embodiment, the rib may be disposed closer to the internal space than the conduit.

In one embodiment, the conduit and the rib may extend parallel to each other in at least a portion of the circumference of the electronic device.

In one embodiment, there are a plurality of pipes, and the plurality of pipes may include a first pipe and a second pipe disposed closer to the internal space than the first pipe. The second conduit may be disposed between the first conduit and the rib.

In one embodiment, the at least one conduit may be formed on a surface of the first side wall, and the at least one rib may be formed on a surface of the second side wall facing the one surface of the first side wall. You can.

In one embodiment, the first side wall may include a first rib spaced apart from the conduit, and the second side wall may include a plurality of second ribs.

In one embodiment, the first rib and the second rib may each extend parallel to at least a portion of the conduit and may not overlap each other in at least some areas.

In one embodiment, the electronic device may further include a printed circuit board 240 disposed in the internal space.

The electronic device 101 according to an embodiment disclosed in this document includes a display (201 in FIG. 2 and/or 220 in FIGS. 4, 7, and 8), a rear cover (FIGS. 4, 7, and 8) facing the front cover. 260), and/or may include a housing surrounding an internal space formed between the display and the rear cover. The housing includes a first housing (230 in FIGS. 4, 10, 14), at least a portion of which includes a first side wall (231 in FIGS. 4, 10) that at least partially faces the display and forms a part of the side wall. It can be included. The housing is a second housing (Fig. 4, 12, 14, 250) may be included. A gap extending from the separation space between the first side wall and the second side wall may be formed between the first housing and the second housing. The first side wall may include a conduit (271 in FIGS. 14-19, 272 in FIGS. 5, 9, and 11) that extends concavely along the circumferential direction of the electronic device with its upper portion open to the gap. there is.

In one embodiment, the conduit may be formed concavely on a portion of the surface of the first side wall facing the second side wall.

In one embodiment, at least one of the first side wall or the second side wall may include at least one rib 276 or 277 that protrudes into the gap and extends along a circumferential direction of the electronic device.

In one embodiment, the conduit and the rib may extend parallel to each other in at least a portion of the circumference of the electronic device.

In one embodiment, there are a plurality of pipes, and the plurality of pipes may include a first pipe and a second pipe disposed closer to the internal space than the first pipe. The second conduit may be disposed between the first conduit and the rib.

According to the embodiment disclosed in this document, in addition to the process of assembling the housing, an additional process of attaching or pressing the waterproof member to the housing is not required, so compared to the general method of separately attaching the waterproof member to the housing, the component of the electronic device The number can be reduced and the assembly process can be simplified, thereby reducing overall costs.

Effects derived from the embodiments disclosed in this document are not limited to the effects described above, and may be expanded in various ways without departing from the spirit and scope disclosed in this document.

An electronic device according to an embodiment disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

An embodiment of this document and the terms used herein are not intended to limit the technical features described in this document to a specific embodiment, and should be understood to include various changes, equivalents, or substitutes for the embodiment. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

One embodiment of the present document is one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, a method according to an embodiment disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store ^TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to one embodiment, each component (e.g., module or program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately placed in other components. . According to one embodiment, one or more of the above-described corresponding components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to one embodiment, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Claims (20)

In electronic devices,
Display (201 in Figure 2; 220 in Figures 4, 7, and 8);
a rear cover 260 facing the display; and
A housing surrounding the internal space formed between the display and the rear cover (210 in FIGS. 2 and 3; 230 in FIGS. 4-9, 10, 11, 14-19, and 250 in FIGS. 4-9 and 12-19) It includes, and the housing includes,
A first housing (230) including a first plate portion (232) at least partially facing the display and a first side wall (231) surrounding an edge of the first plate portion; and
A second housing including a second plate portion 252 to which the rear cover is coupled, and a second side wall 251 surrounding an edge of the second plate portion and spaced apart from at least a portion of the first side wall. 250),
A gap G1 is formed between the first housing and the second housing, extending from the space between the first side wall and the second side wall,
The first side wall is connected to the gap and includes conduits (271, 272) extending concavely along the circumferential direction of the electronic device.
According to claim 1,
The electronic device is wherein the conduit is concavely formed on a portion of a surface of the first side wall facing the second side wall.
According to claim 1 or 2,
The electronic device wherein the air resistance of the gap is greater in another area closer to the internal space than the conduit compared to one area where the conduit is located.
According to any one of claims 1 to 3,
The electronic device wherein the conduit is formed to be curved to avoid at least one penetration area formed in a portion of the first side wall.
According to any one of claims 1 to 4,
The electronic device includes a plurality of pipes, and the plurality of pipes includes a first pipe 271 and a second pipe 272 disposed closer to the internal space than the first pipe.
According to clause 5,
The second conduit is formed in an area of the first side wall where the path length between the spaced space and the internal space is relatively short compared to other areas.
According to claim 5 or 6,
The second conduit extends at least partially parallel to the first conduit.
The method according to any one of claims 1 to 7,
At least one of the first side wall and the second side wall includes at least one rib (276, 277) protruding into the gap and extending along a circumferential direction of the electronic device.
According to clause 8,
The electronic device, wherein the rib is disposed closer to the internal space than the conduit.
According to claim 8 or 9,
The electronic device wherein the conduit and the rib extend parallel to each other in at least a portion of a circumference of the electronic device.
The method according to any one of claims 8 to 10,
There are a plurality of pipes, and the plurality of pipes include a first pipe and a second pipe disposed closer to the interior space than the first pipe,
The second conduit is disposed between the first conduit and the rib. Electronic devices.
The method according to any one of claims 8 to 11,
At least one conduit is formed on a surface of the first side wall, and at least one rib is formed on a surface of the second side wall facing the one surface of the first side wall.
The method according to any one of claims 8 to 12,
The first side wall includes a first rib spaced apart from the conduit, and the second side wall includes a plurality of second ribs.
According to claim 13,
The first rib and the second rib each extend parallel to at least a portion of the conduit and do not overlap each other in at least some areas.
The method according to any one of claims 1 to 14,
An electronic device further comprising a printed circuit board 240 disposed in the internal space.
In electronic devices,
Display (201 in Figure 2; 220 in Figures 4, 7, and 8);
a rear cover 260 facing the display; and
A housing including a side wall surrounding the internal space formed between the display and the rear cover (210 in FIGS. 2 and 3; 230 in FIGS. 4-9, 10, 11, 14-19 and FIGS. 4-9, 12- 250 of 19), and the housing includes,
a first housing (230), at least a portion of which includes a first side wall (231) that at least partially faces the display and forms part of the side wall; and
A second housing (250) including a second side wall (251) at least partially facing the rear cover, forming the remaining part of the side wall, and spaced apart from the first side wall,
A gap G1 is formed between the first housing and the second housing, extending from the space between the first side wall and the second side wall,
The first side wall is connected to the gap and includes conduits (271, 272) extending concavely along the circumferential direction of the electronic device.
According to claim 16,
The electronic device is wherein the conduit is concavely formed on a portion of a surface of the first side wall facing the second side wall.
The method of claim 16 or 17,
At least one of the first side wall and the second side wall includes at least one rib (276, 277) protruding into the gap and extending along a circumferential direction of the electronic device.
According to clause 18,
The ribs are disposed closer to the internal space than the conduit and extend parallel to each other in at least a portion of the circumference of the electronic device.
The method of claim 18 or 19,
There are a plurality of pipes, and the plurality of pipes include a first pipe and a second pipe disposed closer to the interior space than the first pipe,
The second conduit is disposed between the first conduit and the rib. Electronic devices.

Images