KR20240022004A - Unit for supplying liquid and apparatus for treating a substrate - Google Patents

Abstract

The present invention includes a cup that provides a processing space therein, a support unit that supports a substrate in the processing space and rotates the substrate, a nozzle that supplies a processing liquid to the substrate, and a liquid supply that supplies the processing liquid to the nozzle. A unit, wherein the liquid supply unit includes a tank for storing a processing liquid, the tank having a housing having a space therein for storing the processing liquid, and a circulation coupled to the housing to circulate the stored processing liquid. line and an exhaust line for exhausting the atmosphere inside the tank to the outside, wherein the circulation line includes a heater for heating the treatment liquid; and a spray pipe that extends to the inside of the housing and sprays the heated processing liquid into the housing, wherein the spray pipe has a plurality of holes formed on a side surface along the longitudinal direction. The purpose is to
According to the present invention as described above, there is an effect of shortening the time required to adjust the concentration of the treatment liquid in a tank structure in which the concentration of the treatment liquid is adjusted by evaporation of water.

Description

Liquid supply unit and substrate processing device having the same {UNIT FOR SUPPLYING LIQUID AND APPARATUS FOR TREATING A SUBSTRATE}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus including a liquid supply unit for supplying a processing liquid to a substrate.

The semiconductor process includes a process of cleaning thin films, foreign substances, particles, etc. on a substrate. These processes are performed by placing the substrate on a spin head with the pattern side facing up or down, supplying a processing liquid onto the substrate while rotating the spin head, and then drying the wafer.

Recently, high temperature liquids such as phosphoric acid aqueous solution are used as treatment liquids. For example, an aqueous phosphoric acid solution contains phosphoric acid and water. The liquid supply unit has a supply tank, a liquid supply line, and a nozzle. The supply tank is adjusted so that the temperature and concentration of phosphoric acid aqueous solution suit the process conditions. For example, the temperature of the aqueous phosphoric acid solution supplied to the substrate may be about 150°C to 180°C, and the concentration of phosphoric acid in the aqueous phosphoric acid solution may be about 85% to 95%. The phosphoric acid aqueous solution whose concentration and temperature are controlled is supplied from the supply tank to the nozzle through the liquid supply line.

1 is a diagram schematically showing an example of a supply tank. Referring to Figure 1, supply tank 900 has a housing 910 and a circulation line 940. In addition, the housing 910 includes a phosphoric acid supply line 920 that supplies phosphoric acid to the housing 910 from the outside, a water supply line 930 that supplies water, and a waste liquid discharge line 950 that discharges the waste liquid in the housing 910. ), a liquid supply line 980 that supplies liquid to the substrate, and a vent line 970 that exhausts water vapor evaporated within the housing 910 are connected.

A pump 942 and a heater 944 are installed in the circulation line 940. The phosphoric acid aqueous solution in the housing 910 flows along the circulation line 940 and is heated by the heater 944. The temperature of the phosphoric acid aqueous solution is adjusted to the set temperature by heating the heater 944. Additionally, the concentration of phosphoric acid in the phosphoric acid aqueous solution is adjusted by evaporating water by heating by the heater 944.

As time passes, the amount of water evaporated from the processing liquid heated in the housing 910 increases, causing the concentration of the processing liquid to become higher than the process concentration. Therefore, the concentration of the processing liquid is adjusted by supplementing phosphoric acid or water.

However, if phosphoric acid or water whose temperature or concentration is not controlled is separately replenished, a problem occurs in which the temperature and concentration of the processing solution in the housing 910 change rapidly, and the concentration of the phosphoric acid aqueous solution in the housing 910 is set. It takes a lot of time and energy to adjust concentration and temperature.

An object of the present invention is to provide a substrate processing apparatus and method that can prevent the concentration fluctuation of the processing liquid from increasing in a tank structure in which the concentration of the processing liquid is adjusted by evaporation of water.

Another object of the present invention is to provide a substrate processing apparatus and method that can shorten the time required to control the concentration of the processing liquid in the tank.

The object of the present invention is not limited here, and other objects not mentioned will be clearly understood by those skilled in the art from the description below.

A substrate processing apparatus according to an embodiment of the present invention includes a cup providing a processing space therein, a support unit supporting the substrate in the processing space and rotating the substrate, a nozzle supplying a processing liquid to the substrate, and the nozzle. A liquid supply unit for supplying the treatment liquid, wherein the liquid supply unit includes a tank for storing a treatment liquid mixed with phosphoric acid and water, and the tank has a housing having a space therein for storing the treatment liquid. And a circulation line coupled to the housing to circulate the processing liquid inside the housing, a concentration measuring unit for measuring the concentration of the phosphoric acid in the processing liquid, and a processing liquid replenishment unit for replenishing the housing with new processing liquid. You can.

According to one embodiment, the treatment liquid replenishment unit includes a mixing tank, a phosphoric acid replenishment line for replenishing phosphoric acid in the mixing tank, a water replenishment line for replenishing water in the mixing tank, and mixing of the phosphoric acid and the water in the mixing tank. A replenishment line may be provided to replenish the housing with the new treatment liquid generated by .

According to one embodiment, the treatment liquid replenishment unit is connected to a phosphoric acid replenishment line for replenishing phosphoric acid and a water replenishment line for replenishing water, and has a replenishment line for replenishing the new treatment liquid into the housing, wherein the replenishment The line may be installed with an in-line mixer that mixes the phosphoric acid and the water in-line to produce the new treatment liquid.

According to one embodiment, it further includes a controller that controls the processing liquid replenishment unit based on the value measured by the concentration measuring unit, wherein the controller determines that the concentration measured by the concentration measuring unit is lower than a preset concentration. The processing liquid replenishment unit may be controlled so that the new processing liquid is replenished into the housing.

According to one embodiment, the processing liquid replenishment unit may replenish the housing with the new processing liquid at a temperature higher than room temperature.

According to one embodiment, the tank further includes a temperature measurement unit that measures the temperature of the processing liquid, and the controller is based on the concentration measurement value measured when the temperature measured by the temperature measurement unit is above the set temperature. Thus, the processing liquid replenishment unit can be controlled.

According to one embodiment, the controller may set the set temperature to 140°C or higher.

According to one embodiment, the processing liquid replenished from the processing liquid replenishment unit may be provided at a lower concentration than the processing liquid in the housing.

Additionally, the present invention provides a liquid supply unit for supplying an aqueous phosphoric acid solution on a substrate.

A liquid supply unit according to an embodiment of the present invention includes a housing having a space inside which an aqueous phosphoric acid solution is stored, a circulation line coupled to the housing to circulate the aqueous phosphoric acid solution inside the housing, and a concentration of the phosphoric acid in the aqueous phosphoric acid solution. It may include a concentration measuring unit that measures and a phosphoric acid aqueous solution replenishment unit that replenishes the housing with a new phosphoric acid aqueous solution.

According to one embodiment, the phosphoric acid aqueous solution replenishment unit includes a mixing tank, a phosphoric acid replenishment line for replenishing phosphoric acid in the mixing tank, a water replenishment line for replenishing water in the mixing tank, and mixing of the phosphoric acid and the water in the mixing tank. A replenishment line may be provided to replenish the housing with the new phosphoric acid aqueous solution produced by .

According to one embodiment, the phosphoric acid aqueous solution replenishment unit is connected to a phosphoric acid replenishment line for replenishing phosphoric acid and a water replenishment line for replenishing water, and includes a replenishment line for replenishing the new phosphoric acid aqueous solution into the housing, wherein the replenishment The line may be installed with an in-line mixer that mixes the phosphoric acid and the water in-line to produce the new phosphoric acid aqueous solution.

According to one embodiment of the present invention, the time required to adjust the concentration of the treatment liquid in the tank structure can be shortened by replenishing the treatment liquid whose concentration has been adjusted.

Additionally, by replenishing the heated treatment liquid, the time required to control the temperature of the treatment liquid in the tank structure can be shortened.

The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by those skilled in the art from this specification and the attached drawings.

Figure 1 is a diagram schematically showing the structure of a general liquid supply unit.
Figure 2 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 3 is a diagram schematically showing an embodiment of the liquid processing chamber of FIG. 2.
Figure 4 is a diagram schematically showing a liquid supply unit according to an embodiment of the present invention.
Figure 5 is a diagram schematically showing a liquid supply unit according to another embodiment of the present invention.
Figure 6 is a diagram showing an example of a heater unit.
FIG. 7 is a diagram schematically showing the flow paths of the aqueous phosphoric acid solution and the gas in the housing and the aqueous phosphoric acid solution supply unit of FIG. 4.
FIGS. 8 and 9 are diagrams schematically showing the combined state of the liquid supply unit and the liquid processing chamber, respectively.
FIG. 10 is a diagram schematically showing another embodiment of the liquid processing chamber of FIG. 2.

Below, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Additionally, when describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, the same symbols are used throughout the drawings for parts that perform similar functions and actions.

'Including' a certain component does not mean excluding other components, but rather including other components, unless specifically stated to the contrary. Specifically, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to include one or more other features or It should be understood that this does not exclude in advance the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Singular expressions include plural expressions unless the context clearly dictates otherwise. Additionally, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms may be used for the purpose of distinguishing one component from another component. For example, a first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component without departing from the scope of the present invention.

When a component is said to be “connected” or “connected” to another component, it is understood that it may be directly connected to or connected to that other component, but that other components may also exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between. Other expressions that describe the relationship between components, such as "between" and "immediately between" or "neighboring" and "directly adjacent to" should be interpreted similarly.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the present application, should not be interpreted as having an ideal or excessively formal meaning. .

Figure 2 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 2 , the substrate processing apparatus includes an index module 10, a processing module 20, and a controller 30. According to one embodiment, the index module 10 and the processing module 20 are arranged along one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as the first direction 92, and the direction perpendicular to the first direction 92 when viewed from the top is referred to as the second direction 94. And the direction perpendicular to both the first direction 92 and the second direction 94 is called the third direction 96.

The index module 10 transfers the substrate W from the container 80 in which the substrate W is stored to the processing module 20, and transfers the substrate W that has been processed in the processing module 20 to the container 80. Store it as The longitudinal direction of the index module 10 is provided in the second direction 94. The index module 10 has a load port 12 and an index frame 14. Based on the index frame 14, the load port 12 is located on the opposite side of the processing module 20. The container 80 containing the substrates W is placed in the load port 12. A plurality of load ports 12 may be provided, and the plurality of load ports 12 may be arranged along the second direction 94.

The container 80 may be an airtight container such as a Front Open Unified Pod (FOUP). The container 80 is placed in the load port 12 by a transport means (not shown) such as an overhead transfer, overhead conveyor, or Automatic Guided Vehicle, or by an operator. You can.

An index robot 120 is provided in the index frame 14. A guide rail 140 is provided in the second direction 94 along the length of the index frame 14, and the index robot 120 can be moved on the guide rail 140. The index robot 120 includes a hand 122 on which a substrate W is placed, and the hand 122 moves forward and backward, rotates about the third direction 96, and moves in the third direction 96. It can be provided so that it can be moved along. A plurality of hands 122 are provided to be spaced apart in the vertical direction, and the hands 122 can move forward and backward independently of each other.

The processing module 20 includes a buffer unit 200, a transfer chamber 300, and a processing chamber 400. The buffer unit 200 provides a space where the substrate W brought into the processing module 20 and the substrate W taken out from the processing module 20 temporarily stay. The processing chamber 400 supplies liquid to the substrate W to perform a liquid treatment process on the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid processing chamber 400.

The transfer chamber 300 may have its longitudinal direction oriented in the first direction 92 . The buffer unit 200 may be disposed between the index module 10 and the transfer chamber 300. A plurality of liquid processing chambers 400 are provided and may be disposed on the side of the transfer chamber 300 . The liquid processing chamber 400 and the transfer chamber 300 may be arranged along the second direction 94 . The buffer unit 200 may be located at one end of the transfer chamber 300.

According to one example, the liquid processing chambers 400 are disposed on both sides of the transfer chamber 300, respectively. The liquid processing chambers 400 on each side of the transfer chamber 300 may be provided in an A You can.

The transfer chamber 300 has a transfer robot 320. A guide rail 340 whose longitudinal direction is provided in the first direction 92 is provided within the transfer chamber 300, and the transfer robot 320 may be provided to be able to move on the guide rail 340. The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 moves forward and backward, rotates about the third direction 96, and moves in the third direction 96. It can be provided so that it can be moved along. A plurality of hands 322 are provided to be spaced apart in the vertical direction, and the hands 322 can move forward and backward independently of each other.

The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 may be arranged to be spaced apart from each other along the third direction 96. The buffer unit 200 has open front and rear faces. The front side faces the index module 10, and the back side faces the transfer chamber 300. The index robot 120 may approach the buffer unit 200 through the front, and the transfer robot 320 may approach the buffer unit 200 through the rear.

FIG. 3 is a diagram schematically showing an embodiment of the liquid processing chamber 400 of FIG. 2. Referring to FIG. 3, the liquid processing chamber 400 includes a housing 410, a cup 420, a support unit 440, a nozzle unit 460, a lifting unit 480, a liquid supply unit 1000, and a controller. has

The housing 410 is provided in a generally rectangular parallelepiped shape. Cup 420, support unit 440, and nozzle unit 460 are disposed within housing 410.

The cup 420 has a processing space with an open top, and the substrate W is liquid-processed within the processing space. The support unit 440 supports the substrate W within the processing space. The nozzle unit 460 supplies liquid onto the substrate W supported on the support unit 440. Liquids are provided in multiple types and can be sequentially supplied onto the substrate W. The lifting unit 480 adjusts the relative height between the cup 420 and the support unit 440.

According to one example, the cup 420 has a plurality of recovery bins 422, 424, and 426. The recovery containers 422, 424, and 426 each have a recovery space for recovering the liquid used for processing the substrate. Each of the recovery bins 422, 424, and 426 is provided in a ring shape surrounding the support unit 440. When the liquid treatment process progresses, the treatment liquid scattered by the rotation of the substrate W flows into the recovery space through the inlets 422a, 424a, and 426a of each recovery container 422, 424, and 426. According to one example, the cup 420 has a first recovery container 422, a second recovery container 424, and a third recovery container 426. The first recovery container 422 is arranged to surround the support unit 440, the second recovery container 424 is arranged to surround the first recovery container 422, and the third recovery container 426 is the second recovery container 426. It is arranged to surround the recovery container 424. The second inlet 424a, which flows liquid into the second recovery tank 424, is located above the first inlet 422a, which flows liquid into the first recovery tank 422, and the third recovery tank 426 The third inlet 426a, which introduces liquid, may be located above the second inlet 424a.

The support unit 440 has a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 is provided in a generally circular shape and may have a larger diameter than the substrate (W). A support pin 442a is provided at the center of the support plate 442 to support the rear side of the substrate W, and the support pin 442a has an upper end of the support plate ( 442). A chuck pin 442b is provided at the edge of the support plate 442. The chuck pin 442b is provided to protrude upward from the support plate 442 and supports the side of the substrate W so that the substrate W does not separate from the support unit 440 when the substrate W is rotated. The drive shaft 444 is driven by the driver 446, is connected to the center of the bottom of the substrate W, and rotates the support plate 442 about its central axis.

The nozzle unit 460 has a first nozzle 462 and a second nozzle 464. The first nozzle 462 supplies the processing liquid onto the substrate (W). The treatment liquid may be a liquid with a temperature higher than room temperature. According to one example, the treatment liquid may be an aqueous phosphoric acid solution. The aqueous phosphoric acid solution may be a mixture of phosphoric acid and water. Optionally, the aqueous phosphoric acid solution may further contain other substances. For example, the other material may be silicone. The second nozzle 464 supplies water onto the substrate (W). The water can be pure water or deionized water.

The first nozzle 462 and the second nozzle 464 are each supported on different arms 461, and these arms 461 can be moved independently. Optionally, the first nozzle 462 and the second nozzle 464 may be mounted on the same arm and moved simultaneously.

Optionally, the liquid supply unit may further include one or more nozzles in addition to the first nozzle 462 and the second nozzle 464. Additional nozzles can supply different types of processing liquids to the substrate. For example, another type of treatment solution may be an acid solution or a base solution for removing foreign substances on the substrate. Additionally, another type of treatment liquid may be alcohol, which has a lower surface tension than water. For example, the alcohol may be isopropyl alcohol.

The lifting unit 480 moves the cup 420 in the vertical direction. The relative height between the cup 420 and the substrate (W) changes as the cup 420 moves up and down. As a result, the recovery containers 422, 424, and 426 for recovering the processing liquid are changed depending on the type of liquid supplied to the substrate W, so the liquids can be separated and recovered. Unlike the above-mentioned, the cup 420 is fixedly installed, and the lifting unit 480 can move the support unit 440 in the vertical direction.

The liquid supply unit 1000 supplies the processing liquid to the first nozzle 462. Below, the case where the treatment liquid is an aqueous phosphoric acid solution will be explained as an example.

Figure 4 is a diagram schematically showing an example of a liquid supply unit according to an embodiment of the present invention. Referring to FIG. 4, the liquid supply unit 1000 has a tank 1200. Tank 1200 stores an aqueous phosphoric acid solution. The tank 1200 has a housing 1220, a circulation line 1240, a concentration measurement unit 1280, a temperature measurement unit 1260, a phosphoric acid aqueous solution replenishment unit 1700, and a controller 1900.

The housing 1220 is provided in a rectangular parallelepiped or cylindrical shape. The housing 1220 has a space inside where an aqueous phosphoric acid solution is stored. A replenishment line 1420 and a discharge line 1440 are connected to the housing 1220. A valve (not shown) is installed in the replenishment line 1420 and the discharge line 1440, respectively. The replenishment line 1420 is provided as a line for replenishing the housing 1220 with an aqueous phosphoric acid solution. One side of the replenishment line 1420 is connected to the housing 1220 and the other side is connected to the phosphoric acid aqueous solution replenishment unit 1700. The discharge line 1440 is provided as a line for discharging the phosphoric acid aqueous solution onto the nozzle. One side of the discharge line 1440 is connected to the housing 1220 and the other side is connected to the nozzle unit 460.

A waste liquid line 1460 is connected to the housing 1220. A valve (not shown) is installed in the waste liquid line 1460. When discarding the aqueous phosphoric acid solution after reusing it a certain number of times or for a certain period of time, the aqueous phosphoric acid solution in the housing 1220 is discharged to the outside of the housing 1220 through the waste line 1460. If the phosphoric acid aqueous solution contains silicon, the housing 1220 may be connected to a silicon replenishment line 1424.

An exhaust line 1490 is connected to the housing 1220. The exhaust line 1490 exhausts water vapor evaporated from the phosphoric acid aqueous solution stored in the housing 1220 to the outside of the housing 1220. The exhaust line 1490 is coupled to the upper surface of the housing 1220. The exhaust line 1490 is provided with a smaller diameter than other lines. When the pressure inside the housing 1220 exceeds a predetermined pressure, gas within the housing 1220 may be discharged through the exhaust line 1490.

In the above example, the waste liquid line 1460 and the discharge line 1440 are shown as being connected to the housing 1220, respectively. However, unlike this, the waste liquid line 1460 and the discharge line 1440 may be connected to the circulation line 1240.

A circulation line 1240 is connected to the housing 1220. According to one example, one end of the circulation line 1240 functions as an inlet 1240a and is coupled to the bottom of the housing 1220. The other end of the circulation line 1240 functions as an outlet 1240b and is immersed in the phosphoric acid aqueous solution in the housing 1220. Optionally, the other end of the circulation line 1240 may be positioned higher than the water surface 1224 of the aqueous phosphoric acid solution stored in the housing 1220.

A pump unit 1500 and a heater unit 1600 are mounted on the circulation line 1240. The pump unit 1500 provides fluid pressure to cause the aqueous phosphoric acid solution in the housing 1220 to flow in the circulation line 1240. The circulation line 1240 is equipped with a temperature measurement unit 1260 and a concentration measurement unit 1280. The temperature measurement unit 1260 measures the temperature of the aqueous phosphoric acid solution circulating in the circulation line 1240. The concentration measuring unit 1280 measures the concentration of phosphoric acid in the aqueous phosphoric acid solution circulating in the circulation line 1240.

The heater unit 1600 heats the phosphoric acid aqueous solution flowing in the circulation line 1240. According to one example, the heater unit 1600 is controlled to heat the phosphoric acid aqueous solution to a set temperature. The set temperature may be about 150°C to 180°C. An inlet valve (V1) and an outlet valve (V2) may be installed in the circulation line 1240.

A gas supply line 1800 is connected to the housing 1220. Gas is injected into the interior of the housing 1220 from the gas supply line 1800. A gas valve (V3) is mounted on the gas supply line 1800. The gas promotes evaporation of water contained in the phosphoric acid aqueous solution within the housing 1220. The gas may be provided as a low humidity gas. The gas may be either nitrogen (N2) or air. Optionally the gas may further contain other gases. The temperature of the supplied gas may be higher than the temperature at which water can evaporate. As another example, it may be provided at a temperature equal to or higher than the temperature of the aqueous phosphoric acid solution heated in the circulation line 1240. The discharge end of the gas supply line 1800 may be located inside the housing 1220.

The phosphoric acid aqueous solution replenishment unit 1700 replenishes the housing 1220 with the phosphoric acid aqueous solution. The phosphoric acid aqueous solution replenishment unit 1700 has a mixing tank 1720. The phosphoric acid aqueous solution replenishment unit 1700 can replenish the housing 1220 with the phosphoric acid aqueous solution at a temperature higher than room temperature.

The mixing tank 1720 replenishes the housing 1220 with an aqueous phosphoric acid solution produced by mixing phosphoric acid and water. The mixing tank 1720 mixes phosphoric acid and water before replenishing the housing 1220 with a new aqueous phosphoric acid solution and stores the mixed aqueous phosphoric acid solution. A phosphoric acid replenishment line 1722 and a water replenishment line 1724 are connected to one side of the mixing tank 1720, and a replenishment line 1420 is connected to the other side. Phosphoric acid replenishment line 1722 replenishes phosphoric acid to mixing tank 1720. Water replenishment line 1724 replenishes water into mixing tank 1720. Water may be provided as deionized water.

A valve (not shown) is installed in the phosphoric acid replenishment line 1722 and the water replenishment line 1724, respectively. The aqueous phosphoric acid solution mixed in the mixing tank 1720 is replenished to the housing 1220 through the replenishment line 1420. The phosphoric acid aqueous solution replenished into the housing 1220 may be replenished at a temperature higher than room temperature. The mixed phosphoric acid aqueous solution may be provided at a lower concentration than the set concentration of the phosphoric acid aqueous solution replenished to the nozzle unit 460 within the housing 1220.

The replenishment line 1420 may be equipped with a pump unit 1740 and a heater unit 1760. The functions of the pump unit 1740 and heater unit 1760 are the same as described above.

In the above example, it was explained that the phosphoric acid aqueous solution replenishment unit 1700 has a mixing tank 1720, the mixing tank 1720 is connected to the housing 1220, and phosphoric acid and water are mixed within the housing. However, unlike this, as shown in FIG. 5, the phosphoric acid aqueous solution replenishment unit 1700 may mix phosphoric acid and water in-line in the replenishment line 1420. One side of the replenishment line 1420 is connected to the phosphoric acid replenishment line 1722 and the water replenishment line 1724, and the other side is connected to the housing 1220. The functions of the phosphoric acid replenishment line 1722 and the water replenishment line 1724 are the same as previously described. The replenishment line 1420 may be equipped with an in-line mixer 1780. Phosphoric acid and water are mixed by an in-line mixer 1780 while flowing through the replenishment line 1420, and the mixed aqueous phosphoric acid solution is replenished into the housing 1220. The in-line mixer 1780 may be provided in a shape in which a screw member 1784 is provided inside a circular tube 1782. The in-line mixer 1780 may include a heater unit (not shown) that heats the mixed phosphoric acid and water.

Replenishment of the phosphoric acid aqueous solution may be made based on the level of the phosphoric acid aqueous solution measured by the water level measurement sensor 1222 provided in the housing 1220. Optionally, after reusing the phosphoric acid aqueous solution a certain number of times or for a certain period of time and discharging the phosphoric acid aqueous solution from the housing 1220, phosphoric acid and water can be replenished.

The aqueous phosphoric acid solution may be introduced into the housing 1220 through the replenishment line 1420 at a temperature lower than the set temperature used for substrate processing. Additionally, the aqueous phosphoric acid solution may be introduced into the housing 1220 through the replenishment line 1420 at a concentration lower than the set concentration of phosphoric acid used for substrate processing. Optionally, the phosphoric acid aqueous solution is adjusted to a set temperature and concentration and flows into the housing 1220 through the replenishment line 1420, circulates through the circulation line 1240, and the phosphoric acid aqueous solution whose temperature and concentration are adjusted is supplied to the discharge line ( It is supplied to the outside from the housing 1220 through 1440). In the above example, the discharge line 1440 is described as being connected to the housing, but it may be connected to the circulation line 1240.

The controller 1900 controls the phosphoric acid aqueous solution replenishment unit 1700 to replenish the housing 1220 with the phosphoric acid aqueous solution. The controller 1900 controls the phosphoric acid aqueous solution replenishment unit 1700 based on the concentration value measured by the concentration measurement unit 1280. The controller 1900 receives temperature information measured by the temperature measurement unit 1260. The controller 1900 controls the concentration measurement unit 1280 to measure the concentration of the phosphoric acid aqueous solution when the measured temperature value is higher than the set temperature. The controller 1900 controls the set temperature at which the concentration measurement unit 1280 starts measuring concentration to 140°C or higher to prevent the problem of reduced concentration measurement accuracy below 140°C. You can. The controller 1900 controls the treatment liquid supply unit to replenish the housing 1220 with new treatment liquid when the concentration measured by the concentration measurement unit 1280 is lower than the set concentration.

Figure 6 is a diagram showing an example of a heater unit. Referring to FIG. 6, the heater unit 1600 has a body 1620 and a heater 1640. Heater 1640 is located inside the body 1620. The body 1620 is provided with a first port 1622 and a second port 1624. The phosphoric acid aqueous solution flows into the heater unit 1600 through the first port 1622 and flows out of the heater unit 1600 through the second port 1624. A flow path 1660 through which an aqueous phosphoric acid solution flows is formed inside the body 1620. The flow path 1660 is connected to the first port 1622 and the second port 1624. According to one example, the flow path 1660 may be composed of an inflow path 1662, an outlet path 1664, and a connection path 1666. A first port 1622 is located at one end of the inflow passage 1662, and a second port 1624 is located at one end of the outlet passage 1664. The connection path 1666 connects the inflow path 1662 and the outlet path 1664. The inflow path 1662 and the outlet path 1664 may be provided opposite to each other. The inlet 1662 and the outlet 1664 may be located parallel to each other and spaced apart from each other by a certain distance. The heater 1640 may be located in a space surrounded by the inflow path 1662, the outlet path 1664, and the connection path 1666. The structure of the heater unit 1600 is not limited to this and may be changed in various ways.

In the above example, the temperature measurement unit 1250 and the concentration measurement unit 1260 are described as being provided in the circulation line 1240. However, unlike this, the measurement unit 1250 and the concentration measurement unit 1260 are installed in the housing 1220. Can be installed.

The valves V1, V2, and V3 installed in the liquid supply unit 1000 are controlled by the controller 1900.

FIG. 7 is a diagram schematically showing the flow paths of the aqueous phosphoric acid solution and the gas in the housing and the aqueous phosphoric acid solution supply unit of FIG. 4. In Figure 7, the solid arrow shows the flow path of the phosphoric acid aqueous solution, and the dotted arrow shows the flow path of the gas.

Initially, an aqueous phosphoric acid solution is supplied into the housing 1220 through a supply line (not shown). The initially supplied phosphoric acid aqueous solution may be at a lower temperature than the process temperature used in the process. For example, the processing temperature of the phosphoric acid aqueous solution is about 150°C to 180°C, and the phosphoric acid aqueous solution initially supplied into the housing 1220 may be at room temperature. Additionally, the process concentration of phosphoric acid in the aqueous phosphoric acid solution may be about 85% to 95%, and the concentration of phosphoric acid in the aqueous phosphoric acid solution initially supplied to the housing 1220 may be about 70% to 80%.

The phosphoric acid aqueous solution supplied into the housing 1220 is circulated through the circulation line 1240 and heated to the process temperature by the heater unit 1600. Then, the gas valve V3 installed in the gas supply line 1800 is opened and gas flows into the housing 1220. The aqueous phosphoric acid solution heated in the circulation line 1240 is sprayed at a higher position than the water surface 1224 of the aqueous phosphoric acid solution stored in the housing 1220 through the plurality of spray holes 1720.

Since the aqueous phosphoric acid solution in the housing 1220 is higher than the boiling point of water, water evaporates from the aqueous phosphoric acid solution, and as the water evaporates, the concentration of phosphoric acid in the aqueous phosphoric acid solution increases.

When the pressure in the housing 1220 increases due to evaporation of water, water vapor and gas in the upper region of the housing 1220 are discharged through the vent line 1400. When the temperature and concentration of the phosphoric acid aqueous solution are adjusted in the tank 1200, the phosphoric acid aqueous solution is supplied to the substrate through the discharge line 1440. If the water level 1224 of the phosphoric acid aqueous solution within the housing 1220 is lower than the set value, phosphoric acid or water can be replenished through the phosphoric acid replenishment line 1482 and the water replenishment line 1484.

FIGS. 8 and 9 are diagrams schematically showing the combined state of the liquid supply unit and the liquid processing chamber, respectively.

As shown in FIG. 8, the inlet line 1420 connected to the housing 1220 of the tank 1200 may be directly coupled to the liquid treatment chamber 400. In this case, the processing liquid used to process the substrate in the liquid processing chamber 400 is directly recovered into the housing 1220 of the tank 1200. Additionally, the discharge line 1440 may be directly coupled to the nozzle of the liquid processing chamber 400. In this case, the phosphoric acid aqueous solution whose temperature and concentration are controlled in the tank 1200 may be supplied to the nozzle through the discharge line 1440.

Additionally, as shown in FIG. 9, the processing liquid used for substrate processing in the liquid processing chamber 400 is directly recovered to the recovery tank 5001, and is then transferred through a replenishment line from the recovery tank 5001 to the tank 1200. Processing liquid may flow in through (1420). Additionally, the phosphoric acid aqueous solution whose temperature and concentration have been adjusted in the tank 1200 may be supplied to the buffer tank 5002 through the discharge line 1440, and then the phosphoric acid aqueous solution may be supplied from the buffer tank 5002 to the nozzle. Either of the recovery tank 5001 and the buffer tank 5002, or the recovery tank 5001 and the buffer tank 5002 may be provided with the same or similar structure as the tank 1200. The phosphoric acid aqueous solution whose concentration is adjusted is directly supplied to the nozzle of the liquid treatment chamber 400.

In the above example, it is explained that the treatment liquid stored in the tank 1200 is an aqueous phosphoric acid solution. However, unlike this, the treatment liquid stored in the tank 1200 may be another type of treatment liquid that contains water and whose concentration is adjusted by evaporation of water.

In the above example, the liquid processing chamber 400 is described as a single wafer type that liquid processes a single substrate (W). However, as shown in FIG. 10, it is a batch type that can liquid process a plurality of substrates (W) simultaneously. It may be provided as a liquid processing chamber 500.

According to the above description, the time required to control the temperature and concentration of the phosphoric acid aqueous solution in the tank can be shortened by supplying a new aqueous phosphoric acid solution whose concentration and temperature have been adjusted to the tank.

The above detailed description is illustrative of the present invention. In addition, the above-described content shows and explains preferred embodiments of the present invention, and the present invention can be used in various other combinations, changes, and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in this specification, a scope equivalent to the written disclosure, and/or within the scope of technology or knowledge in the art. The written examples illustrate the best state for implementing the technical idea of the present invention, and various changes required for specific application fields and uses of the present invention are also possible. Accordingly, the detailed description of the invention above is not intended to limit the invention to the disclosed embodiments. Additionally, the appended claims should be construed to include other embodiments as well.

1260: Temperature measurement unit
1280: Concentration measurement unit
1420: Replenishment line
1700: Phosphoric acid aqueous solution replenishment unit
1720: mixing tank
1722: Phosphoric acid supplementation line
1724: Water refill line
1740: Pump unit
1760: heater unit
1780: In-line mixer
1782: Coffin
1784: Screw member

Claims (11)

In a device for processing a substrate,
a cup providing a processing space therein;
a support unit supporting the substrate in the processing space and rotating the substrate;
a nozzle supplying a processing liquid to the substrate; and
Includes a liquid supply unit that supplies the processing liquid to the nozzle,
The liquid supply unit is,
It includes a tank for storing a treatment liquid mixed with phosphoric acid and water,
The tank is,
a housing having a space inside to store a treatment liquid;
a circulation line coupled to the housing to circulate the treatment liquid inside the housing;
a concentration measuring unit that measures the concentration of the phosphoric acid in the treatment liquid; and
A substrate processing apparatus including a processing liquid replenishment unit that replenishes the housing with new processing liquid. According to clause 1,
The treatment liquid replenishment unit,
a mixing tank;
a phosphoric acid replenishment line for replenishing phosphoric acid in the mixing tank;
A water replenishment line to replenish water in the mixing tank; and
A substrate processing apparatus comprising a replenishment line for replenishing the housing with the new processing liquid produced by mixing the phosphoric acid and the water in the mixing tank. According to clause 1,
The treatment liquid replenishment unit,
A replenishment line connected to a phosphoric acid replenishment line for replenishing phosphoric acid and a water replenishment line for replenishing water, and a replenishment line for replenishing the new treatment liquid into the housing,
The supplement line is,
A substrate processing device equipped with an in-line mixer that mixes the phosphoric acid and the water in-line to produce the new processing solution. According to any one of claims 1 to 3,
Further comprising a controller that controls the treatment liquid replenishment unit based on the value measured by the concentration measurement unit,
The controller is,
A substrate processing device that controls the processing liquid replenishment unit to replenish the housing with new processing liquid when the concentration measured by the concentration measuring unit is lower than a preset concentration. According to clause 1,
The treatment liquid replenishment unit,
A substrate processing device that replenishes the housing with the new processing liquid at a temperature higher than room temperature. According to clause 4,
The tank is,
It further includes a temperature measurement unit that measures the temperature of the processing liquid;
The controller is,
A substrate processing device that controls the processing liquid replenishment unit based on the concentration measurement value when the temperature measured by the temperature measurement unit is higher than a set temperature. According to clause 6,
The controller is,
A substrate processing device that sets the temperature above 140°C. According to clause 1,
The processing liquid replenished from the processing liquid replenishment unit is:
A substrate processing device provided at a lower concentration than the processing liquid in the housing. In the liquid supply unit for supplying an aqueous phosphoric acid solution on a substrate,
a housing having a space inside to store an aqueous phosphoric acid solution;
a circulation line coupled to the housing to circulate the aqueous phosphoric acid solution inside the housing;
a concentration measuring unit that measures the concentration of the phosphoric acid in the phosphoric acid aqueous solution; and
A liquid supply unit including a phosphoric acid aqueous solution replenishment unit for replenishing the housing with a new phosphoric acid aqueous solution. According to clause 9,
The phosphoric acid aqueous solution replenishment unit,
a mixing tank;
a phosphoric acid replenishment line for replenishing phosphoric acid in the mixing tank;
A water replenishment line to replenish water in the mixing tank; and
A liquid supply unit having a replenishment line for replenishing the housing with the new aqueous phosphoric acid solution produced by mixing the phosphoric acid and the water in the mixing tank. According to clause 10,
The phosphoric acid aqueous solution replenishment unit,
A replenishment line connected to a phosphoric acid replenishment line for replenishing phosphoric acid and a water replenishment line for replenishing water, and a replenishment line for replenishing the housing with the new phosphoric acid aqueous solution,
The supplement line is,
A liquid supply unit equipped with an in-line mixer that mixes the phosphoric acid and the water in-line to produce the new phosphoric acid aqueous solution.

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