KR20240020588A - Manufacturing method of combi card base and combi card using spot attachment, and combi card base and combi card manufactured thereby - Google Patents

Abstract

A base for a combination card using the spot combination attachment method, a method for manufacturing a combination card including the same, and a base and combination card manufactured through this method are provided. A method of manufacturing a base for a combination card includes providing a sheet layer with holes formed in a COB (Chip On Board) area; Bonding an antenna pattern to one surface of the sheet layer and extending an antenna terminal to the COB area; inserting a joint comprising an adhesive-impregnated conductive fabric and a metal contact disposed on the conductive fabric into the hole such that the rapid point is aligned with the antenna terminal; joining the antenna terminal and the joint by spot welding; and bonding the upper layer and the lower layer on one side and the back side of the sheet layer.

Description

A method of manufacturing a base for a combination card using the spot combination attachment method and a combination card including the same, and the base and combination card manufactured thereby THEREBY}

The present invention relates to a base for a combination card using the spot combination attachment method, a method of manufacturing a combination card including the same, and a base manufactured using the same, and more specifically, to connecting a COB (Chip on Board) and an antenna on the card. This invention relates to a base for a combination card that can simultaneously secure the reliability of COB attachment and simplification of the process by using metallic fabric and spot welding, a method of manufacturing the combination card, and a base manufactured thereby.

In general, credit cards can not only be used in place of cash, but in recent years, smart cards have been developed with built-in IC chips that can store large amounts of information, and are being actively used not only for payments but also as various membership cards.

These smart cards can be divided into contact cards, contactless cards, hybrid cards, and combination cards. Among these, the Combi Card is a chemically bonded card that shares the common parts of the contact card and the non-contact card, and has only one different part each.

Figure 1 is shown to explain the manufacturing method of such an IC card. Referring to FIG. 1, an antenna 30 is formed on the sheet layer 30 of the card, and a terminal portion 20 extending from the antenna 30 may be defined to bond the antenna 30 and the IC card. . The IC card may be bonded to the terminal portion 20 through a medium such as solder cream.

However, a general antenna has a structure in which an insulating layer such as enamel is formed on a copper copper wire for protection, etc., and in order to remove the insulating layer from the terminal portion 20 and expose the copper copper wire, the terminal portion 20 is cut with a knife. The method of scraping with a tool is mainly used. This process shows low work efficiency, acting as a major obstacle to improving the production speed and output of combination cards.

In addition, when the terminal portion 20 is joined to the COB using solder cream, there is a problem of poor durability, such as the shape of the solder cream deforming over time and the bond between the terminal portion 20 and the COB deteriorating.

The technical problem that the present invention aims to solve is a combination card that can simultaneously secure the simplification of the process and the reliability of COB attachment by using a joint using a conductive fabric to bond an IC card with a COB (Chip on Board) structure to an antenna. To provide a manufacturing method of a dragon base and a combination card, and a base manufactured thereby.

The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

A method of manufacturing a base for a combination card according to some embodiments of the present invention to solve the above-described technical problem includes providing a sheet layer with holes formed in a COB (Chip On Board) area; Bonding an antenna pattern to one surface of the sheet layer and extending an antenna terminal to the COB area; inserting a joint comprising an adhesive-impregnated conductive fabric and a metal contact disposed on the conductive fabric into the hole such that the rapid point is aligned with the antenna terminal; joining the antenna terminal and the joint by spot welding; and bonding the upper layer and the lower layer on one side and the back side of the sheet layer.

In some embodiments of the present invention, the metal contact may include at least one of nickel, chromium, copper, palladium, and aluminum.

In some embodiments of the present invention, joining the antenna and the joint by spot welding may include performing spot welding on the antenna so that the spot welder and the conductive fabric do not contact.

In some embodiments of the present invention, the antenna pattern may include a metallic conductor and an insulating layer coated on the metallic conductor.

In some embodiments of the present invention, joining the antenna and the joint by spot welding may include joining the metallic conductor from which the insulating layer has been removed by spot welding with the joint.

A method of manufacturing a combination card according to some embodiments of the present invention to solve the above-described technical problem includes providing a sheet layer with holes formed in a COB (Chip On Board) area; Bonding an antenna pattern to one surface of the sheet layer and extending an antenna terminal to the COB area; inserting a joint comprising an adhesive-impregnated conductive fabric and a metal contact disposed on the conductive fabric into the hole such that the rapid point is aligned with the antenna terminal; joining the antenna terminal and the joint by spot welding; bonding an upper layer and a lower layer on one side and a back side of the sheet layer; removing the top layer to expose a joint within the COB region; Aligning the exposed joint and the COB and bonding the COB and the joint through a heat fusion process; and forming at least one printing layer and a protective layer on the upper layer and the lower layer.

A base for a combination card according to some embodiments of the present invention to solve the above-described technical problem includes a sheet layer with a hole formed in a COB (Chip On Board) area; an antenna pattern disposed on one side of the sheet layer and having an antenna terminal extending into the COB area; A junction inserted into the COB area and bonded to the antenna, the junction comprising a metal contact joined to the antenna terminal and a conductive fabric covering the metal contact and containing an adhesive; and an upper layer and a lower layer attached to cover the one side and the back side of the sheet layer, respectively.

In some embodiments of the present invention, the antenna pattern includes a wire and an insulating layer coated on the wire, and the antenna terminal may have only a portion of the insulating layer joined to the metal contact point removed.

A base for a combination card according to some embodiments of the present invention to solve the above-described technical problem includes a sheet layer with a hole formed in a COB (Chip On Board) area; an antenna pattern disposed on one side of the sheet layer and having an antenna terminal extending into the COB area; A junction inserted into the COB area and bonded to the antenna, the junction comprising a metal contact joined to the antenna terminal and a conductive fabric covering the metal contact and containing an adhesive; an upper layer and a lower layer attached to cover the one side and the back side of the sheet layer, respectively; a COB inserted into a hole formed overlapping with the COB area of the upper layer, bonded to the conductive fabric, and electrically connected to the antenna terminal; and at least one printing layer and a protective layer formed on the top layer and the bottom layer.

Specific details of other embodiments are included in the detailed description and drawings.

When using the base manufacturing method using the spot combination attachment method according to an embodiment of the present invention, a base in which the conductive fabric and metal contact points are connected to the antenna terminal by spot welding can be manufactured. This means that when the COB is attached to the base, the bond between the antenna terminal and the COB can be maintained strong by spot welding and conductive fabric containing adhesive, and the deterioration of the bond strength over time is also prevented by not using solder cream. It can be.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

1 is a diagram for explaining a method of manufacturing a combination card according to the prior art.
Figure 2 is an exploded perspective view to explain the structure of a base for a combination card manufactured using a spot combination attachment method according to an embodiment of the present invention.
Figure 3 is a plan view for explaining the structure of a base for a combination card manufactured using a spot combination attachment method according to an embodiment of the present invention.
FIG. 4 is a cross-sectional view taken along line A-A' of FIG. 3.
Figure 5 is a flowchart illustrating a method of manufacturing a base for a combination card using a spot combination attachment method according to an embodiment of the present invention.
Figure 6 is a flowchart for explaining a method of manufacturing a combination card using the spot combination attachment method according to an embodiment of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

One component is said to be “connected to” or “coupled to” another component when it is directly connected or coupled to another component or with an intervening other component. Includes all cases. On the other hand, when one component is referred to as “directly connected to” or “directly coupled to” another component, it indicates that there is no intervening other component. “And/or” includes each and every combination of one or more of the mentioned items.

The terminology used herein is for describing embodiments and is not intended to limit the invention. As used herein, singular forms also include plural forms, unless specifically stated otherwise in the context. As used herein, “comprises” and/or “comprising” refers to the presence of one or more other components, steps, operations and/or elements. or does not rule out addition.

Although first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are merely used to distinguish one component from another. Therefore, of course, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used with meanings that can be commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless clearly specifically defined.

Figure 2 is an exploded perspective view illustrating the structure of a base for a combination card manufactured using the spot combination attachment method according to an embodiment of the present invention, Figure 3 is a plan view, and Figure 4 is a view showing A-A' of Figure 3. This is a cross-sectional view cut along. For convenience of explanation, Figures 3 and 4 show some of the components forming the base for the combination card removed.

Referring to Figures 2 to 4, the base 100 for a combination card manufactured using the spot combination attachment method according to an embodiment of the present invention includes a sheet layer 110, an antenna pattern 130, a joint 140, and an upper layer. It may include (150) and the lower layer (160). The base 100 for a combination card shown in FIGS. 2 to 4 shows the structure before the combination card is completed by placing the COB and forming the printing layer and the protective layer.

The sheet layer 110 may have a defined COB area 115 where COBs (Chip On Boards) are connected. A hole 120 penetrating the sheet layer 110 may be formed in the COB area 115 to connect the COB and the antenna pattern 130 via the joint 140. When the COB is mounted on a combination card, the COB area 115 and the hole 120 may completely overlap on a plane in that the COB is arranged to completely fill the inside of the hole 120.

An antenna pattern 130 may be disposed on one surface of the sheet layer 110. The antenna pattern 130 may be a rope antenna for implementing RF communication, for example, a metallic conductor such as copper or aluminum coated with an insulating material such as polyurethane, polyester, polyamidoimide, or polyesterimide. May include enamel glands.

The antenna pattern 130 may be arranged to surround one side of the sheet layer 110, and the end of the antenna pattern 130 extends to the COB region 115 of the sheet layer 110 to form a hole 120. An antenna terminal 135 exposed through the antenna may be located. The antenna terminal 135 may include a first terminal 131 and a second terminal 132 respectively connected to the COB. As will be described later, the first terminal 131 may be connected to the COB through the first metal contact point 142, and the second terminal 132 may be connected to the COB through the second metal contact point 143.

The first terminal 131 and the second terminal 132 may have a straight line extending into the COB area 115. As will be described later, the first terminal 131 and the second terminal 132 are joined to the joint 140 using spot welding, and unlike the conventional embodiment of FIG. 1 using solder cream, the first terminal 131 and the second terminal 132 have a large contact area. don't ask for it Accordingly, the antenna terminal 135 may have a simple straight shape instead of the existing curved shape.

The above-described insulating coating may be partially removed from the joint portion of the first terminal 131 and the second terminal 132 with the metal contact points 142 and 143. That is, in order to form an electrical connection between the antenna terminal 135 and the metal contacts 142 and 143, the insulating coating formed on the surface of the antenna terminal 135 needs to be removed. As described later, the antenna terminal 135 ) By performing spot welding on the antenna terminal 135, the insulating coating formed on the antenna terminal 135 can be removed and at the same time the antenna terminal 135 and the metal contacts 141 and 142 can be joined.

The junction 140 joined to the antenna pattern 130 may be located within the COB area 115. The joint 140 may include a conductive fabric 141 containing adhesive and metal contacts 142 and 143 disposed on the conductive fabric 141. As described above, the metal contacts 142 and 143 can be joined to the first terminal 131 and the second terminal 132 by spot welding, and the insulating coating on the surface of the antenna terminal 135 is removed to form an antenna. An electrical connection may be formed between terminal 135 and metal contacts 142 and 143.

For example, the conductive fabric 141 may be composed of a fiber structure plated with a conductive metal such as copper, nickel, gold, or palladium. At this time, the fibrous tissue may be composed of a non-woven fabric formed by randomly overlapping materials such as PET (Polyethylene Terephthalate). The conductive fabric 141 may contain an adhesive inside in order to be later bonded to the COB by heat fusion.

The antenna pattern 130 and the antenna terminal 135 may be disposed on one side of the sheet layer 110 facing the lower layer 160, that is, on the lower surface of the sheet layer 110 in FIGS. 2 to 4. Accordingly, both the joint 140 to be joined to the antenna terminal 135 and the COB to be connected to the joint 140 in a later process can be inserted and attached so as to face the COB area 115 from the top direction of the sheet layer 110.

2 to 4, the antenna pattern 130 is shown as being formed on one side of the sheet layer 110, but the present invention is not limited thereto, and may be formed on the upper and lower surfaces of the sheet layer 110, or the antenna pattern 130 may be formed on the upper and lower surfaces of the sheet layer 110. It is also possible to improve RF performance by stacking another base on which an antenna pattern is formed, which serves as a substrate.

Figure 5 is a flowchart for explaining a method of manufacturing a combination card using the spot combination attachment method according to an embodiment of the present invention.

Referring to Figure 5, the method of manufacturing a combination card using the spot combination attachment method according to an embodiment of the present invention includes providing a sheet layer with holes formed in the COB area (S110), bonding an antenna pattern to one side of the sheet layer. and extending the antenna terminal to the COB area (S120), inserting a joint including a conductive fabric and a metal contact into the hole (S130), joining the antenna terminal and the joint by spot welding (S140), and sheet layer. It includes the step of joining the upper layer and the lower layer on the upper and lower surfaces (S150).

First, a step of providing a sheet layer with holes formed in the COB area is performed (S110). Forming a hole in the COB region 115 of the sheet layer 110 may include, for example, punching the COB region 115. Alternatively, the sheet layer 110 with the hole 120 formed in the COB area 115 may be manufactured through a molding process.

Next, the step of bonding the antenna pattern to one side of the sheet layer and extending the antenna terminal to the COB area is performed (S120). The antenna pattern 130 may be arranged to surround one side of the sheet layer 110, particularly the lower surface of the sheet layer 110. The antenna pattern 130 may be bonded through an embedding process in which the antenna pattern 130 is fused to the sheet layer 110 by vibration friction heat generated using, for example, ultrasonic waves.

However, the present invention is not limited to this, and the antenna pattern 130 may be mounted on the sheet layer 110 by stacking other sheet layers on which the antenna pattern is formed.

The end of the antenna pattern 130, that is, the antenna terminal 135, may extend into the COB area 115, and the first and second terminals 131 and 132 may be connected to the COB area (COB area) for bonding with the contact point to be performed later. 115) may each extend inward, that is, to overlap perpendicularly with the hole 120.

At this time, the surface of the antenna terminal 135 may remain coated with an insulating material such as enamel wire.

Subsequently, a joint including a conductive fabric and a metal contact may be inserted into the hole (S130). As shown in FIG. 4, the joint 140 may be composed of metal contacts 142 and 143 disposed on the conductive fabric 141, and the conductive fabric (141) is formed by the adhesive component contained in the conductive fabric 141. It can be fixed by attaching metal contacts 142 and 143 on 141).

The longitudinal width of the joint 140 and the width of the hole 120 may be the same, and the arrangement positions of the metal contacts 142 and 143 when the joint 140 is inserted into the hole 120 are the antenna pattern 130. ) may be aligned vertically with the positions of the first and second terminals 131 and 132, respectively.

A release paper containing PET film or paper may be attached to the upper surface of the conductive fabric 141, that is, the surface opposite to the surface where the metal contacts 142 and 143 are disposed. The attached release paper can be removed during the subsequent bonding process of the conductive fabric 141 and COB.

Next, a process of joining the antenna terminal 135 and the joint 140 by spot welding is performed (S140). Specifically, the vertically aligned first terminal 131 and the first metal contact point 142 are joined by spot welding, and the second terminal 132 and the second metal contact point 143 are joined by spot welding. You can.

If the antenna terminal 135 and the conductive fabric 141 are directly connected by spot welding without the metal contacts 142 and 143, the purpose of forming an electrical connection channel with the COB to be connected later can be achieved, but the conductive fabric ( 141), the adhesive components contained in the spot welder may adhere to the spot welder, which may deteriorate the quality of subsequent spot welding work. Therefore, the quality of the joining work can be maintained by inserting the metal contacts 142 and 143 between the antenna terminal 135 and the conductive fabric 141 to prevent direct contact between the spot welder and the conductive fabric 141 during spot welding. .

As described above, the surfaces of the first and second terminals 131 and 132 may be coated with an insulating material, but due to the heat generated by spot welding, the insulating material may be removed during the joining process and the metallic conductor may be exposed to the surface. . Therefore, what is connected to the metal contact points 142 and 143 is the metallic conductor inside the enamel wire.

In addition, the direction in which spot welding is performed may be from the bottom direction of the joint 140, that is, from the bottom of the antenna terminal 135. As described above, not only can the effect of removing the coating of the antenna terminal 135 be obtained. This is because when spot welding is performed in the opposite direction, that is, in the direction of the conductive fabric 141, lint, that is, small pieces of fiber, may rise on the conductive fabric 141, which may lead to defects.

Finally, a process of bonding the upper and lower layers to the upper and lower surfaces of the sheet layer 110 may be performed (S150).

As shown in FIG. 2, a lower layer 160 may be attached to the lower surface of the sheet layer 110 on which the antenna pattern 130 is disposed, and an upper layer 150 may be attached to the opposite surface. The upper layer 150 and lower layer 160 may include a thin PVC film to protect the base for the combination card until the manufacturing process for the combination card using the base begins.

The upper layer 150 and the lower layer 160 may have a thickness smaller than that of the sheet layer 110. For example, the sheet layer 110 has a thickness of 0.25 mm, and the upper layer 150 and the lower layer 160 have a thickness of 0.25 mm. Each may have a thickness of 0.03 mm, but the present invention is not limited thereto.

In this way, when using the base manufacturing method using the spot combination attachment method according to an embodiment of the present invention, a base in which the conductive fabric and metal contact points are connected to the antenna terminal by spot welding can be manufactured. This means that when the COB is attached to the base, the bond between the antenna terminal and the COB can be maintained strong by spot welding and conductive fabric containing adhesive, and the deterioration of the bond strength over time is also prevented by not using solder cream. It can be.

Figure 6 is a flowchart illustrating a method of manufacturing a combination card including a base using the spot combination attachment method according to an embodiment of the present invention. This corresponds to a process for manufacturing a combination card on which a COB is mounted using the base 100 for the combination card manufactured through the process of FIG. 5. Therefore, the first process (S210) of FIG. 6 may be performed following the last process (S150) of FIG. 5.

Referring to Figure 6, the method of manufacturing a combination card including a base using the spot combination attachment method according to an embodiment of the present invention includes removing the upper layer to expose the joint in the COB area (S210), and attaching the COB to the exposed joint. It may include aligning and bonding (S220) and attaching at least one printing layer and a protective layer to the upper and lower surfaces of the base (S230).

Figure 7 is a diagram for explaining the combination card manufactured through the process of Figure 6. Referring to FIGS. 6 and 7 together, a process of removing a portion of the upper layer 150 is performed to expose the joint portion 140 within the COB region 115 (S210). Forming the hole 190 by removing a portion of the upper layer 150 may be performed through a milling process. By removing a portion of the upper layer 150 that vertically overlaps the COB area 115 to form the hole 190, the joint 140 inside the hole 120 may be exposed to the outside.

Next, the process of aligning and joining the COB with the exposed joint is performed (S220). Bonding the COB 200 to the joint 140 ultimately means joining the antenna terminal 135 of the antenna pattern 130 and the COB 200 to be connected via the joint 140. The COB 200 can be fused to the conductive fabric 141 by vibration frictional heat generated using ultrasonic waves. The bonding of the COB 200, the conductive fabric 141, and the metal contacts 142 and 143 can be maintained strong by the adhesive component included in the conductive fabric 141.

Finally, a process of forming at least one printing layer and one or more protective layers 170 and 180 on the upper and lower surfaces of the base, that is, the upper surface of the upper layer 150 and the lower surface of the lower layer 160, respectively, is performed (S230). At least one printing layer may be a sheet that prints and displays images such as card information, patterns, or patterns, and in particular, the lower printing layer may include MS O/L (Magnetic Stripe Overlay) including a magnetic strip. . A protective layer may be formed on such a printed layer.

In summary, when using the combination card manufacturing method according to the embodiment of the present invention, the effects of the base manufacturing method described above can be obtained as is. In addition, if you want to make a combination card using the base manufactured through the above manufacturing method, only a relatively simple process of removing the upper layer to attach the COB, bonding the COB, and forming an overlay layer is required, so it can be used for cards using the existing method. Even when using contact equipment, combination cards can be manufactured by supplying only the base.

Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical idea or essential features. You will be able to understand it. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

100: Base for combination card 110: Sheet layer
120: Hall 130: Antenna pattern
140: junction 150: upper layer
160: lower layer 170, 180: printing layer and protective layer

Claims (10)

Providing a sheet layer with holes formed in a COB (Chip On Board) area;
Bonding an antenna pattern to one surface of the sheet layer and extending an antenna terminal to the COB area;
inserting a joint comprising an adhesive-impregnated conductive fabric and a metal contact disposed on the conductive fabric into the hole such that the rapid point is aligned with the antenna terminal;
joining the antenna terminal and the joint by spot welding; and
Comprising the step of bonding the upper layer and the lower layer on one side and the back side of the sheet layer,
Method of manufacturing a base for a combination card. According to clause 1,
The metal contact includes at least one of nickel, chromium, copper, palladium, and aluminum,
Method of manufacturing a base for a combination card. According to clause 1,
The step of joining the antenna and the joint by spot welding,
Comprising the step of performing spot welding on the antenna so that the spot welder and the conductive fabric do not contact,
Method of manufacturing a base for a combination card. According to clause 1,
The antenna pattern includes a metallic conductor and an insulating layer coated on the metallic conductor.
Method of manufacturing a base for a combination card. According to clause 4,
The step of joining the antenna and the joint by spot welding,
Comprising the step of joining the metallic conductor from which the insulating layer has been removed by the spot welding with the joint,
Method of manufacturing a base for a combination card. Providing a sheet layer with holes formed in a COB (Chip On Board) area;
Bonding an antenna pattern to one surface of the sheet layer and extending an antenna terminal to the COB area;
inserting a joint comprising an adhesive-impregnated conductive fabric and a metal contact disposed on the conductive fabric into the hole such that the rapid point is aligned with the antenna terminal;
joining the antenna terminal and the joint by spot welding;
bonding an upper layer and a lower layer on one side and a back side of the sheet layer;
removing the top layer to expose a joint within the COB region;
Aligning the exposed joint and the COB and bonding the COB and the joint through a heat fusion process; and
Comprising forming at least one printing layer and a protective layer on the upper layer and the lower layer,
How to make a combination card. A sheet layer with holes formed in the COB (Chip On Board) area;
an antenna pattern disposed on one side of the sheet layer and having an antenna terminal extending into the COB area;
A junction inserted into the COB area and bonded to the antenna, the junction comprising a metal contact joined to the antenna terminal and a conductive fabric covering the metal contact and containing an adhesive; and
Comprising an upper layer and a lower layer attached to cover the one side and the back side of the sheet layer, respectively,
Base for combination cards. According to clause 7,
The metal contact includes at least one of nickel, chromium, copper, palladium, and aluminum,
Base for combination cards. According to clause 8,
The antenna pattern includes a wire and an insulating layer coated on the wire,
The antenna terminal is partially removed from the insulating layer of the portion joined to the metal contact point,
Base for combination cards. A sheet layer with holes formed in the COB (Chip On Board) area;
an antenna pattern disposed on one side of the sheet layer and having an antenna terminal extending into the COB area;
A junction inserted into the COB area and bonded to the antenna terminal, the junction comprising a metal contact joined to the antenna terminal and a conductive fabric covering the metal contact and containing an adhesive; and
an upper layer and a lower layer attached to cover the one side and the back side of the sheet layer, respectively;
a COB inserted into a hole formed overlapping with the COB area of the upper layer, bonded to the conductive fabric, and electrically connected to the antenna terminal; and
Comprising at least one printing layer and a protective layer formed on the upper layer and the lower layer,
Combi card.