KR20240013856A - Polyarylene sulfide resin composition and molded product thereof, and electric vehicle part - Google Patents
Polyarylene sulfide resin composition and molded product thereof, and electric vehicle part Download PDFInfo
- Publication number
- KR20240013856A KR20240013856A KR1020247002121A KR20247002121A KR20240013856A KR 20240013856 A KR20240013856 A KR 20240013856A KR 1020247002121 A KR1020247002121 A KR 1020247002121A KR 20247002121 A KR20247002121 A KR 20247002121A KR 20240013856 A KR20240013856 A KR 20240013856A
- Authority
- KR
- South Korea
- Prior art keywords
- polyarylene sulfide
- sulfide resin
- group
- resin composition
- electric vehicle
- Prior art date
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- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 title claims abstract description 118
- 229920000412 polyarylene Polymers 0.000 title claims abstract description 118
- 239000011342 resin composition Substances 0.000 title claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 118
- 239000011347 resin Substances 0.000 claims abstract description 118
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 69
- 239000003112 inhibitor Substances 0.000 claims abstract description 35
- 239000000203 mixture Substances 0.000 claims abstract description 32
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 29
- 150000001875 compounds Chemical class 0.000 claims abstract description 28
- 150000001491 aromatic compounds Chemical class 0.000 claims abstract description 22
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 20
- 125000000524 functional group Chemical group 0.000 claims abstract description 17
- 239000000806 elastomer Substances 0.000 claims abstract description 13
- 229920001971 elastomer Polymers 0.000 claims abstract description 12
- 239000011256 inorganic filler Substances 0.000 claims abstract description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 12
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 9
- 238000005227 gel permeation chromatography Methods 0.000 claims abstract description 7
- 150000003839 salts Chemical class 0.000 claims abstract description 7
- 239000008188 pellet Substances 0.000 claims abstract 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 19
- 229910052740 iodine Inorganic materials 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 238000004898 kneading Methods 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 3
- 238000000071 blow moulding Methods 0.000 claims description 2
- 238000000748 compression moulding Methods 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 abstract description 19
- 239000011593 sulfur Substances 0.000 abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 17
- 238000010438 heat treatment Methods 0.000 abstract description 15
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 11
- 239000004593 Epoxy Substances 0.000 abstract description 6
- -1 aryl ketone Chemical class 0.000 description 35
- 239000003822 epoxy resin Substances 0.000 description 29
- 229920000647 polyepoxide Polymers 0.000 description 29
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 24
- 238000006243 chemical reaction Methods 0.000 description 24
- 239000002904 solvent Substances 0.000 description 22
- 239000004734 Polyphenylene sulfide Substances 0.000 description 19
- 229920000069 polyphenylene sulfide Polymers 0.000 description 19
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 18
- 239000007789 gas Substances 0.000 description 17
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 16
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 16
- 239000000155 melt Substances 0.000 description 16
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 14
- 125000003118 aryl group Chemical group 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 12
- 239000007795 chemical reaction product Substances 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- 125000003277 amino group Chemical group 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 239000000047 product Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
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- 229920000642 polymer Polymers 0.000 description 9
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- 235000011037 adipic acid Nutrition 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 230000001590 oxidative effect Effects 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 7
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 7
- 229920002647 polyamide Polymers 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 125000001424 substituent group Chemical group 0.000 description 7
- 229920002725 thermoplastic elastomer Polymers 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000011049 filling Methods 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 5
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 125000004434 sulfur atom Chemical group 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 3
- GAMSSMZJKUMFEY-UHFFFAOYSA-N 4-[(4-carboxyphenyl)disulfanyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1SSC1=CC=C(C(O)=O)C=C1 GAMSSMZJKUMFEY-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 238000003776 cleavage reaction Methods 0.000 description 3
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- 238000001514 detection method Methods 0.000 description 3
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
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- 125000003700 epoxy group Chemical group 0.000 description 3
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- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthene Chemical compound C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 3
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- 229910052760 oxygen Inorganic materials 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
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- 239000000377 silicon dioxide Substances 0.000 description 3
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- 238000006467 substitution reaction Methods 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- LFMWZTSOMGDDJU-UHFFFAOYSA-N 1,4-diiodobenzene Chemical compound IC1=CC=C(I)C=C1 LFMWZTSOMGDDJU-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
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- SWTNRXKFJNGFRF-UHFFFAOYSA-N 14-aminotetradecanoic acid Chemical compound NCCCCCCCCCCCCCC(O)=O SWTNRXKFJNGFRF-UHFFFAOYSA-N 0.000 description 2
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- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
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- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
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- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
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- 150000001340 alkali metals Chemical group 0.000 description 2
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- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 2
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 2
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- BTCSSZJGUNDROE-UHFFFAOYSA-N gamma-aminobutyric acid Chemical compound NCCCC(O)=O BTCSSZJGUNDROE-UHFFFAOYSA-N 0.000 description 2
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- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical group C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
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- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
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- 239000011734 sodium Substances 0.000 description 2
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- BGHCVCJVXZWKCC-UHFFFAOYSA-N tetradecane Chemical compound CCCCCCCCCCCCCC BGHCVCJVXZWKCC-UHFFFAOYSA-N 0.000 description 2
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- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
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- 239000007810 chemical reaction solvent Substances 0.000 description 1
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- 238000002485 combustion reaction Methods 0.000 description 1
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- 229930003836 cresol Natural products 0.000 description 1
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- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
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- NZZIMKJIVMHWJC-UHFFFAOYSA-N dibenzoylmethane Chemical compound C=1C=CC=CC=1C(=O)CC(=O)C1=CC=CC=C1 NZZIMKJIVMHWJC-UHFFFAOYSA-N 0.000 description 1
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- HIPNYJBGYFRVAY-UHFFFAOYSA-N diiodomethylbenzene Chemical compound IC(I)C1=CC=CC=C1 HIPNYJBGYFRVAY-UHFFFAOYSA-N 0.000 description 1
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- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 description 1
- FHESUNXRPBHDQM-UHFFFAOYSA-N diphenyl benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OC=2C=CC=CC=2)=CC=1C(=O)OC1=CC=CC=C1 FHESUNXRPBHDQM-UHFFFAOYSA-N 0.000 description 1
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- DWNAQMUDCDVSLT-UHFFFAOYSA-N diphenyl phthalate Chemical compound C=1C=CC=C(C(=O)OC=2C=CC=CC=2)C=1C(=O)OC1=CC=CC=C1 DWNAQMUDCDVSLT-UHFFFAOYSA-N 0.000 description 1
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- XWKIXFQOFAVHQI-UHFFFAOYSA-N disodium;sulfide;pentahydrate Chemical compound O.O.O.O.O.[Na+].[Na+].[S-2] XWKIXFQOFAVHQI-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
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- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
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- 229960003692 gamma aminobutyric acid Drugs 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
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- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
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- 230000001771 impaired effect Effects 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- SNHMUERNLJLMHN-UHFFFAOYSA-N iodobenzene Chemical compound IC1=CC=CC=C1 SNHMUERNLJLMHN-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000012803 melt mixture Substances 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- DCNUQRBLZWSGAV-UHFFFAOYSA-N n,n-diphenylformamide Chemical compound C=1C=CC=CC=1N(C=O)C1=CC=CC=C1 DCNUQRBLZWSGAV-UHFFFAOYSA-N 0.000 description 1
- VSWALKINGSNVAR-UHFFFAOYSA-N naphthalen-1-ol;phenol Chemical compound OC1=CC=CC=C1.C1=CC=C2C(O)=CC=CC2=C1 VSWALKINGSNVAR-UHFFFAOYSA-N 0.000 description 1
- SJNXJRVDSTZUFB-UHFFFAOYSA-N naphthalen-2-yl(phenyl)methanone Chemical compound C=1C=C2C=CC=CC2=CC=1C(=O)C1=CC=CC=C1 SJNXJRVDSTZUFB-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
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- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- PBLZLIFKVPJDCO-UHFFFAOYSA-N omega-Aminododecanoic acid Natural products NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 1
- 235000010292 orthophenyl phenol Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- ISXOBTBCNRIIQO-UHFFFAOYSA-N tetrahydrothiophene 1-oxide Chemical compound O=S1CCCC1 ISXOBTBCNRIIQO-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 1
- 125000005580 triphenylene group Chemical group 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- LZTRCELOJRDYMQ-UHFFFAOYSA-N triphenylmethanol Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(O)C1=CC=CC=C1 LZTRCELOJRDYMQ-UHFFFAOYSA-N 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/0204—Polyarylenethioethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/0204—Polyarylenethioethers
- C08G75/025—Preparatory processes
- C08G75/0263—Preparatory processes using elemental sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
본 발명은, 폴리아릴렌설피드 수지와, 무기질 충전제, 상기 폴리아릴렌설피드 수지 이외의 열가소성 수지, 엘라스토머, 및 2 이상의 가교성 관능기를 갖는 가교성 수지로 이루어지는 군에서 선택되는, 적어도 1종의 다른 성분을 함유하는, 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물로서, 상기 폴리아릴렌설피드 수지가, 디요오도 방향족 화합물과, 단체(單體) 황과, 중합금지제를, 상기 디요오도 방향족 화합물, 상기 단체 황 및 상기 중합금지제를 포함하는 용융 혼합물 중에서 반응시키는 것을 포함하는 방법에 의해 얻을 수 있는 것이며, 상기 폴리아릴렌설피드 수지가, 상기 중합금지제에 유래하는 카르복시기 및 카르복시기의 염으로 이루어지는 군에서 선택되는 적어도 1종의 기를 갖는 것이며, 상기 폴리아릴렌설피드 수지가, 0.80∼1.70의 Mw/Mtop를 갖고, 상기 Mw 및 Mtop는 각각 겔침투 크로마토그래피에 의해 측정되는 중량 평균 분자량 및 피크 분자량이며, 상기 수지 조성물은 펠렛 상인 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물에 관한 것이다.
본 발명에 따르면, 가열에 의한 가스 발생량을 억제할 수 있다. 또한, 본 발명에 따르면, 내트래킹성, 기계적 강도, 에폭시 밀착성, 금속 밀착성, 캐비티 밸런스, 내열수성(耐熱水性) 등의 특성이 우수한 폴리아릴렌설피드 수지 조성물의 성형품이 얻어진다.The present invention relates to a polyarylene sulfide resin and at least one other resin selected from the group consisting of an inorganic filler, a thermoplastic resin other than the polyarylene sulfide resin, an elastomer, and a crosslinkable resin having two or more crosslinkable functional groups. A polyarylene sulfide resin composition for electric vehicle parts containing components, wherein the polyarylene sulfide resin includes a diiodo aromatic compound, simple sulfur, and a polymerization inhibitor. It can be obtained by a method comprising reacting in a molten mixture containing the compound, the above-described elemental sulfur, and the above-mentioned polymerization inhibitor, wherein the polyarylene sulfide resin is a carboxyl group derived from the above-mentioned polymerization inhibitor and a salt of the carboxyl group. It has at least one group selected from the group consisting of, and the polyarylene sulfide resin has an Mw/Mtop of 0.80 to 1.70, wherein the Mw and Mtop are the weight average molecular weight and peak measured by gel permeation chromatography, respectively. The molecular weight is, and the resin composition relates to a polyarylene sulfide resin composition for electric vehicle parts in the form of pellets.
According to the present invention, the amount of gas generated by heating can be suppressed. Furthermore, according to the present invention, a molded article of a polyarylene sulfide resin composition excellent in properties such as tracking resistance, mechanical strength, epoxy adhesion, metal adhesion, cavity balance, and hot water resistance is obtained.
Description
본 발명은, 폴리아릴렌설피드 수지 조성물 및 그 성형품, 그리고 전기 자동차 부품에 관한 것이다.The present invention relates to polyarylene sulfide resin compositions, molded products thereof, and electric vehicle parts.
최근 주목받고 있는 전기 자동차는, 고전압으로 동작하는 부품을 많이 갖고 있으며, 이러한 전기 자동차 부품에는 수지 성형품이 사용되고 있다. 수지 성형품의 용도로서는, 예를 들면, 수지 성형품을 코일 케이스로 하고, 당해 코일 케이스 내에서 이그니션 코일을 에폭시 수지 조성물 등으로 봉지(封止)한 자동차용 이그니션 코일 케이스, 또는, 점화 플러그와 이그니션 코일이 일체화한 디스트리뷰터리스 이그니션 시스템(이하 「DLI 시스템」으로 약기하는 경우가 있다)에 있어서의 코일 케이스를 들 수 있다.Electric vehicles, which have recently been attracting attention, have many parts that operate at high voltage, and resin molded products are used for these electric vehicle parts. As a use of the resin molded product, for example, an ignition coil case for an automobile in which the resin molded product is used as a coil case and the ignition coil is sealed with an epoxy resin composition or the like within the coil case, or spark plugs and ignition coils. An example is the coil case in this integrated distributorless ignition system (hereinafter sometimes abbreviated as “DLI system”).
이러한 전기 자동차 부품에는, 고전압 하에서도 발화하기 어렵도록 내트래킹성이 요구되고 있다. 또한, 예를 들면 상술한 바와 같은 코일 케이스에 대해서는, 에폭시 수지 또는 금속과의 접착성이 우수한 것이 바람직하다.These electric vehicle parts are required to have tracking resistance so that they are unlikely to ignite even under high voltage. Additionally, for example, for the coil case as described above, it is desirable to have excellent adhesion to epoxy resin or metal.
이것에 대해서, 예를 들면, 폴리페닐렌설피드 수지(이하 「PPS 수지」로 약기하는 경우가 있다)로 대표되는 폴리아릴렌설피드 수지(이하 「PAS 수지」로 약기하는 경우가 있다)를 함유하는 수지 조성물을 성형 가공해, 상술한 바와 같은 자동차 부품에 사용하는 것이 제안되어 있다(예를 들면 특허문헌 1 참조).In relation to this, for example, polyphenylene sulfide resin (hereinafter sometimes abbreviated as "PPS resin") and polyarylene sulfide resin (hereinafter sometimes abbreviated as "PAS resin"), which contain It has been proposed to mold the resin composition and use it for automobile parts as described above (see, for example, Patent Document 1).
그런데, 종래의 폴리아릴렌설피드 수지를 포함하는 조성물에서는, 성형 가공 시 등의 가열에 의해 발생하는 가스의 양이 비교적 많다. 이 때문에, 가스 성분인 황 원자를 함유하는 저분자량 화합물과 구리 등의 금속 재료가 접촉한 상태로 되면, 높은 전압이 반복해 인가됨으로써 양자가 반응해, 트리(수지상(樹脂狀)의 파괴 흔적)를 발생시킬 가능성도 높아져, 그것에 기인해서 내트래킹성이 저하할 우려가 있었다. 특히 구동력으로 모터를 사용하는 전기 자동차에서는, 발진 시에 가솔린 엔진과 동등한 구동 에너지를 필요로 하기 때문에, 리튬이온 이차전지를 구비하고, 배터리 전압으로 100∼400V, 추가로 승압 회로가 탑재된 것에서는 650V까지나 고전압으로 구동된다. 높은 안전성이 요구되는 자동차 분야 부품에 있어서, 특히 전기 자동차용 부품에서는, 고전압, 고전류 하에서 작동하는 부품이 많이 있기 때문에, 납축전지를 사용하는 종래형의 자동차에 비해, 더 높은 레벨로 이상 시의 발화 방지나, 연소 방지 성능이 요구되며, 난연성이 우수할 뿐만 아니라, 발화 원인으로 되는 트래킹 현상을 더 억제하는 것이 요구되고 있었다. 또한, 수지 조성물 또는 그 성형품에 있어서는, 기계적 강도, 에폭시 밀착성, 금속 밀착성, 캐비티 밸런스 등의 특성에도 아직 개선의 여지가 있었다.However, in a composition containing a conventional polyarylene sulfide resin, the amount of gas generated by heating during molding or other processing is relatively large. For this reason, when a low-molecular-weight compound containing a sulfur atom, which is a gas component, and a metal material such as copper come into contact, the two react by repeatedly applying a high voltage, causing tri (dendritic destruction traces). The possibility of this occurring also increased, and there was a risk that tracking resistance would deteriorate due to this. In particular, electric vehicles that use a motor as a driving force require driving energy equivalent to that of a gasoline engine when starting, so they are equipped with a lithium-ion secondary battery, have a battery voltage of 100 to 400 V, and are additionally equipped with a boosting circuit. It is driven by high voltage up to 650V. In automotive parts that require high safety, especially electric vehicle parts, there are many parts that operate under high voltage and high current, so ignition in the event of abnormalities is at a higher level compared to conventional automobiles using lead acid batteries. Prevention and combustion prevention performance are required, and not only is it excellent in flame retardancy, but it is also required to further suppress the tracking phenomenon that causes ignition. In addition, in the resin composition or its molded product, there was still room for improvement in properties such as mechanical strength, epoxy adhesion, metal adhesion, and cavity balance.
그래서, 본 발명이 해결하려고 하는 과제는, 가열에 의한 가스 발생량을 억제할 수 있으며, 수지 조성물 또는 그 성형품에 있어서 우수한 내트래킹성, 기계적 강도, 금속 밀착성, 캐비티 밸런스 특성을 갖는, 폴리아릴렌설피드 수지 조성물, 당해 수지 조성물을 사용한 전기 자동차용 성형품, 및 당해 성형품을 구비하는 전기 자동차 부품을 제공하는 것에 있다.Therefore, the problem that the present invention seeks to solve is a polyarylene sulfide that can suppress the amount of gas generated by heating and has excellent tracking resistance, mechanical strength, metal adhesion, and cavity balance characteristics in a resin composition or a molded product thereof. The object is to provide a resin composition, a molded article for an electric vehicle using the resin composition, and electric vehicle parts including the molded article.
본 발명자들은 각종 검토를 행한 결과, 디요오도 방향족 화합물(diiodo aromatic compound)과 단체(單體) 황과 중합금지제를 용융 중합시킴으로써 얻어지는 폴리아릴렌설피드 수지를 사용함으로써 상기 과제를 해결할 수 있는 것을 알아내어, 본 발명을 완성하기에 이르렀다.As a result of various studies, the present inventors have found that the above problem can be solved by using a polyarylene sulfide resin obtained by melt-polymerizing a diiodo aromatic compound, simple sulfur, and a polymerization inhibitor. We found this out and completed the present invention.
즉, 본 발명은, 폴리아릴렌설피드 수지와, 무기질 충전제, 폴리아릴렌설피드 수지 이외의 열가소성 수지, 엘라스토머, 및 2 이상의 가교성 관능기를 갖는 가교성 수지로 이루어지는 군에서 선택되는, 적어도 1종의 다른 성분(이하, 간단히 「상기 다른 성분」이라 하는 경우가 있다)을 함유하고, 폴리아릴렌설피드 수지가, 디요오도 방향족 화합물과, 단체 황과, 중합금지제를, 디요오도 방향족 화합물, 단체 황 및 중합금지제를 포함하는 용융 혼합물 중에서 반응시키는 것을 포함하는 방법에 의해 얻을 수 있는 것인, 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물에 관한 것이다.That is, the present invention is a polyarylene sulfide resin, an inorganic filler, a thermoplastic resin other than a polyarylene sulfide resin, an elastomer, and at least one kind of crosslinkable resin selected from the group consisting of a crosslinkable functional group having two or more crosslinkable functional groups. Containing other components (hereinafter sometimes simply referred to as "the other components"), the polyarylene sulfide resin includes a diiodo aromatic compound, simple sulfur, and a polymerization inhibitor, a diiodo aromatic compound, It relates to a polyarylene sulfide resin composition for electric vehicle parts, which can be obtained by a method comprising reacting in a molten mixture containing elemental sulfur and a polymerization inhibitor.
본 발명에 따르면, 가열에 의한 가스 발생량을 억제할 수 있다. 또한, 본 발명에 따르면, 내트래킹성, 기계적 강도, 에폭시 밀착성, 금속 밀착성, 캐비티 밸런스, 내열수성(耐熱水性) 등의 특성이 우수한 폴리아릴렌설피드 수지 조성물의 성형품이 얻어진다.According to the present invention, the amount of gas generated by heating can be suppressed. Furthermore, according to the present invention, a molded article of a polyarylene sulfide resin composition excellent in properties such as tracking resistance, mechanical strength, epoxy adhesion, metal adhesion, cavity balance, and hot water resistance is obtained.
또, 캐비티 밸런스는, 복수의 캐비티를 갖는 금형을 사용한 사출 성형에 의해, 동시에 복수의 성형품을 성형했을 때의, 각 캐비티의 충전도의 균일성에 관련된다. 성형 재료의 캐비티 밸런스가 충분치 않으면, 일부의 캐비티가 충분히 충전되지 않는다는 성형 불량이 발생하기 쉬워지는 경향이 있다.Additionally, cavity balance is related to the uniformity of the filling degree of each cavity when a plurality of molded articles are molded simultaneously through injection molding using a mold having a plurality of cavities. If the cavity balance of the molding material is insufficient, molding defects in which some cavities are not sufficiently filled tend to occur.
이하, 본 발명의 호적(好適)한 실시형태에 대하여 상세히 설명한다. 단, 본 발명은 이하의 실시형태로 한정되는 것은 아니다.Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.
본 실시형태에 사용되는 폴리아릴렌설피드 수지는, 디요오도 방향족 화합물과, 단체 황과, 중합금지제를, 디요오도 방향족 화합물, 단체 황 및 중합금지제를 포함하는 용융 혼합물 중에서 반응시키는 것을 포함하는 방법에 의해 얻을 수 있다. 이러한 방법에 따르면, 필립스법을 비롯한 종래법에 비해, 비교적 고분자량의 중합체로서 폴리아릴렌설피드 수지를 얻을 수 있다.The polyarylene sulfide resin used in this embodiment is obtained by reacting a diiodo aromatic compound, elemental sulfur, and a polymerization inhibitor in a molten mixture containing the diiodo aromatic compound, elemental sulfur, and a polymerization inhibitor. It can be obtained by a method including: According to this method, compared to conventional methods including the Phillips method, polyarylene sulfide resin can be obtained as a polymer with a relatively high molecular weight.
디요오도 방향족 화합물은, 방향족 환과, 방향족 환에 직접 결합한 2개의 요오드 원자를 갖는다. 디요오도 방향족 화합물로서는, 디요오도벤젠, 디요오도톨루엔, 디요오도자일렌, 디요오도나프탈렌, 디요오도비페닐, 디요오도벤조페논, 디요오도디페닐에테르 및 디요오도디페닐설폰 등을 들 수 있지만, 이들로 한정되지 않는다. 2개의 요오드 원자의 치환 위치는 특히 한정되지 않지만, 바람직하게는 2개의 치환 위치가 분자 내에서 가능한 한 먼 위치에 있는 것이 바람직하다. 바람직한 치환 위치는, 파라 위치, 및 4,4'- 위치이다.A diiodo aromatic compound has an aromatic ring and two iodine atoms directly bonded to the aromatic ring. As diiodo aromatic compounds, diiodobenzene, diiodotoluene, diiodoxylene, diiodonaphthalene, diiodobiphenyl, diiodobenzophenone, diiododiphenyl ether and diiododi. Phenylsulfone, etc. may be mentioned, but it is not limited to these. The substitution positions of the two iodine atoms are not particularly limited, but the two substitution positions are preferably positioned as far apart as possible within the molecule. Preferred substitution positions are the para position and the 4,4'- position.
디요오도 방향족 화합물의 방향족 환은, 페닐기, 요오드 원자 이외의 할로겐 원자, 히드록시기, 니트로기, 아미노기, 탄소 원자수 1∼6의 알콕시기, 카르복시기, 카복실레이트, 아릴설폰 및 아릴케톤에서 선택되는 적어도 1종의 치환기에 의해서 치환되어 있어도 된다. 단, 폴리아릴렌설피드 수지의 결정화도 및 내열성 등의 관점에서, 미치환의 디요오도 방향족 화합물에 대한 치환된 디요오도 방향족 화합물의 비율은, 바람직하게는 0.0001∼5질량%의 범위이며, 보다 바람직하게는 0.001∼1질량%의 범위이다.The aromatic ring of the diiodo aromatic compound is at least one selected from the group consisting of phenyl group, halogen atom other than iodine atom, hydroxy group, nitro group, amino group, alkoxy group having 1 to 6 carbon atoms, carboxy group, carboxylate, aryl sulfone and aryl ketone. It may be substituted by a substituent of the species. However, from the viewpoint of the crystallinity and heat resistance of the polyarylene sulfide resin, the ratio of the substituted diiodo aromatic compound to the unsubstituted diiodo aromatic compound is preferably in the range of 0.0001 to 5% by mass. Preferably it is in the range of 0.001 to 1 mass%.
단체 황은, 황 원자만에 의해서 구성되는 물질(S8, S6, S4, S2 등)을 의미하며, 그 형태는 한정되지 않는다. 구체적으로는, 국방(局方) 의약품으로서 시판되고 있는 단체 황을 사용해도 되고, 범용적으로 입수할 수 있는, S8 및 S6 등을 포함하는 혼합물을 사용해도 된다. 단체 황의 순도도 특히 한정되지 않는다. 단체 황은, 실온(23℃)에서 고체이면, 입형상(粒形狀) 또는 분말상이어도 된다. 단체 황의 입경은, 특히 한정되지 않지만, 바람직하게는 0.001∼10㎜의 범위이며, 보다 바람직하게는 0.01∼5㎜의 범위이고, 더 바람직하게는 0.01∼3㎜의 범위이다.Simple sulfur refers to a substance composed only of sulfur atoms (S 8 , S 6 , S 4 , S 2 , etc.), and its form is not limited. Specifically, simple sulfur commercially available as a defense pharmaceutical may be used, or a mixture containing S 8 and S 6 that can be obtained for general purposes may be used. The purity of elemental sulfur is also not particularly limited. Elemental sulfur may be in granular or powder form as long as it is solid at room temperature (23°C). The particle size of elemental sulfur is not particularly limited, but is preferably in the range of 0.001 to 10 mm, more preferably in the range of 0.01 to 5 mm, and even more preferably in the range of 0.01 to 3 mm.
중합금지제는, 폴리아릴렌설피드 수지의 중합 반응에 있어서 당해 중합 반응을 금지 또는 정지하는 화합물이면, 특히 제한 없이 사용할 수 있다. 중합금지제는, 폴리아릴렌설피드 수지의 주쇄의 말단에 히드록시기, 아미노기, 카르복시기 및 카르복시기의 염으로 이루어지는 군에서 선택되는 적어도 1종의 기를 도입할 수 있는 화합물을 함유하는 것이 바람직하다. 즉, 중합금지제로서는, 히드록시기, 아미노기, 카르복시기 및 카르복시기의 염으로 이루어지는 군에서 선택되는 적어도 1종의 기를 1 또는 2 이상 갖는 화합물이 바람직하다. 또한, 중합금지제가 상기 관능기를 갖고 있어도 되고, 중합의 정지 반응 등에 의해서, 상기 관능기를 생성해도 된다.The polymerization inhibitor can be used without particular limitation as long as it is a compound that inhibits or stops the polymerization reaction of polyarylene sulfide resin. The polymerization inhibitor preferably contains a compound capable of introducing at least one group selected from the group consisting of a hydroxy group, an amino group, a carboxyl group, and a salt of a carboxyl group at the terminal of the main chain of the polyarylene sulfide resin. That is, the polymerization inhibitor is preferably a compound having 1 or 2 or more of at least one group selected from the group consisting of a hydroxy group, an amino group, a carboxyl group, and a salt of a carboxyl group. Additionally, the polymerization inhibitor may have the above functional group, or may generate the above functional group through a polymerization termination reaction or the like.
히드록시기 또는 아미노기를 갖는 중합금지제로서는, 예를 들면, 하기 식(1) 또는 (2)으로 표시되는 화합물이 중합금지제로서 사용될 수 있다.As a polymerization inhibitor having a hydroxy group or an amino group, for example, a compound represented by the following formula (1) or (2) can be used as the polymerization inhibitor.
일반식(1)으로 표시되는 화합물에 의하면, 하기 식(1-1)으로 표시되는 1가의 기가 주쇄의 말단기로서 도입된다. 식(1-1) 중의 Y는, 중합금지제에 유래하는 히드록시기, 아미노기 등이다.According to the compound represented by general formula (1), a monovalent group represented by the following formula (1-1) is introduced as an end group of the main chain. Y in formula (1-1) is a hydroxy group, amino group, etc. derived from a polymerization inhibitor.
일반식(2)으로 표시되는 화합물에 의하면, 하기 식(2-1)으로 표시되는 1가의 기가 주쇄의 말단기로서 도입된다. 일반식(1)으로 표시되는 화합물에 유래하는 히드록시기가, 예를 들면, 식(2) 중의 카르보닐기의 탄소 원자와 황 라디칼과 결합함에 의해 폴리아릴렌설피드 수지 중에 도입될 수 있다.According to the compound represented by general formula (2), a monovalent group represented by the following formula (2-1) is introduced as an end group of the main chain. A hydroxy group derived from a compound represented by general formula (1) can be introduced into the polyarylene sulfide resin by, for example, bonding with a sulfur radical and the carbon atom of the carbonyl group in formula (2).
식(1-1) 또는 (2-1)으로 표시되는 기는, 폴리아릴렌설피드 수지의 주쇄 중에 원료(단체 황)에 유래해 존재하는 디설피드 결합이 용융 온도 하에서 라디칼 개열(開裂)해 발생한 황 라디칼과, 일반식(1)으로 표시되는 화합물 또는 일반식(2)으로 표시되는 화합물이 결합함에 의해서, 폴리아릴렌설피드 수지 중에 도입되는 것으로 생각된다. 이들 특정 구조의 구성 단위의 존재는, 일반식(1) 또는 (2)으로 표시되는 화합물을 사용한 용융 중합에 의해 얻어진 폴리아릴렌설피드 수지에 특징적이다.The group represented by formula (1-1) or (2-1) is sulfur generated by radical cleavage of a disulfide bond derived from the raw material (single sulfur) in the main chain of the polyarylene sulfide resin under the melting temperature. It is thought that the radical is introduced into the polyarylene sulfide resin when the compound represented by the general formula (1) or the compound represented by the general formula (2) combines. The presence of structural units of these specific structures is characteristic of polyarylene sulfide resins obtained by melt polymerization using a compound represented by general formula (1) or (2).
일반식(1)으로 표시되는 화합물로서는, 예를 들면, 2-요오도페놀, 2-아미노아닐린 등을 들 수 있다. 일반식(2)으로 표시되는 화합물로서는, 2-요오도벤조페논을 들 수 있다.Examples of compounds represented by general formula (1) include 2-iodophenol, 2-aminoaniline, and the like. Examples of the compound represented by general formula (2) include 2-iodobenzophenone.
카르복시기를 갖는 중합금지제로서는, 예를 들면, 하기 일반식(3), (4) 또는 (5)으로 표시되는 화합물에서 선택되는 1종 이상의 화합물이 사용될 수 있다.As the polymerization inhibitor having a carboxyl group, for example, one or more compounds selected from compounds represented by the following general formula (3), (4), or (5) can be used.
일반식(3) 중, R1 및 R2은 각각 독립적으로, 수소 원자, 또는, 하기 일반식(a), (b) 혹은 (c)으로 표시되는 1가의 기를 나타내며, R1 또는 R2 중 적어도 어느 한쪽은 일반식(a), (b) 또는 (c)으로 표시되는 1가의 기이다. 일반식(4) 중, Z는, 요오드 원자 또는 메르캅토기를 나타내고, R3은, 하기 일반식(a), (b) 또는 (c)으로 표시되는 1가의 기를 나타낸다. 일반식(5) 중, R4은, 일반식(a), (b) 또는 (c)으로 표시되는 1가의 기를 나타낸다.In general formula (3), R 1 and R 2 each independently represent a hydrogen atom or a monovalent group represented by the following general formula (a), (b) or (c), and either R 1 or R 2 At least one of them is a monovalent group represented by general formula (a), (b) or (c). In General Formula (4), Z represents an iodine atom or a mercapto group, and R 3 represents a monovalent group represented by the following general formula (a), (b) or (c). In general formula (5), R 4 represents a monovalent group represented by general formula (a), (b) or (c).
일반식(a)∼(c) 중의 X는, 수소 원자 또는 알칼리 금속 원자이지만, 반응성이 양호해지는 점에서 수소 원자가 바람직하다. 알칼리 금속 원자로서는, 나트륨, 리튬, 칼륨, 루비듐, 및 세슘 등을 들 수 있지만, 나트륨이 바람직하다. 일반식(b) 중, R10은 탄소 원자수 1∼6의 알킬렌기를 나타낸다. 일반식(c) 중, R11은 탄소 원자수 1∼3의 알킬렌기를 나타내고, R12은 탄소 원자수 1∼5의 알킬기를 나타낸다.X in general formulas (a) to (c) is a hydrogen atom or an alkali metal atom, but a hydrogen atom is preferred because it improves reactivity. Examples of alkali metal atoms include sodium, lithium, potassium, rubidium, and cesium, but sodium is preferred. In general formula (b), R 10 represents an alkylene group having 1 to 6 carbon atoms. In general formula (c), R 11 represents an alkylene group having 1 to 3 carbon atoms, R 12 represents an alkyl group having 1 to 5 carbon atoms.
일반식(3), (4) 또는 (5)으로 표시되는 화합물에 의하면, 하기 식(6) 또는 (7)으로 표시되는 1가의 기가 주쇄의 말단기로서 도입된다. 이들 특정 구조의 말단의 구성 단위의 존재는, 일반식(3), (4) 또는 (5)으로 표시되는 화합물을 사용한 용융 중합에 의해 얻어진 폴리아릴렌설피드 수지에 특징적이다.According to the compound represented by general formula (3), (4) or (5), a monovalent group represented by the following formula (6) or (7) is introduced as an end group of the main chain. The presence of structural units at the terminals of these specific structures is characteristic of polyarylene sulfide resins obtained by melt polymerization using compounds represented by general formula (3), (4), or (5).
(식 중, R5은, 일반식(a), (b) 또는 (c)으로 표시되는 1가의 기를 나타낸다)(In the formula, R 5 represents a monovalent group represented by general formula (a), (b) or (c))
(식 중, R6은, 일반식(a), (b) 또는 (c)으로 표시되는 1가의 기를 나타낸다)(In the formula, R 6 represents a monovalent group represented by general formula (a), (b) or (c))
중합금지제로서, 카르복시기 등의 관능기를 갖고 있지 않은 화합물 등을 사용해도 된다. 이러한 화합물로서는, 예를 들면, 디페닐디설피드, 모노요오도벤젠, 티오페놀, 2,2'-디벤조티아졸릴디설피드, 2-메르캅토벤조티아졸, N-시클로헥실-2-벤조티아졸릴설펜아미드, 2-(모르폴리노티오)벤조티아졸 및 N,N'-디시클로헥실-1,3-벤조티아졸-2-설펜아미드에서 선택되는 적어도 1종의 화합물을 사용할 수 있다.As a polymerization inhibitor, a compound that does not have a functional group such as a carboxyl group may be used. Examples of such compounds include diphenyl disulfide, monoiodobenzene, thiophenol, 2,2'-dibenzothiazolyl disulfide, 2-mercaptobenzothiazole, and N-cyclohexyl-2-benzothia. At least one compound selected from zolylsulfenamide, 2-(morpholinothio)benzothiazole, and N,N'-dicyclohexyl-1,3-benzothiazole-2-sulfenamide can be used.
본 실시형태에 따른 폴리아릴렌설피드 수지는, 디요오도 방향족 화합물과, 단체 황과, 중합금지제와, 필요에 따라서 촉매를 포함하는 혼합물을 가열해서 얻어지는 용융 혼합물 중에서 용융 중합을 행함에 의해 생성한다. 용융 혼합물 중의 디요오도 방향족 화합물의 비율은, 단체 황 1몰에 대해서, 바람직하게는 0.5∼2몰의 범위이며, 보다 바람직하게는 0.8∼1.2몰의 범위이다. 또한, 혼합물 중의 중합금지제의 비율은, 고체 황 1몰에 대해서, 바람직하게는 0.0001∼0.1몰의 범위이며, 보다 바람직하게는 0.0005∼0.05몰의 범위이다.The polyarylene sulfide resin according to the present embodiment is produced by performing melt polymerization in a molten mixture obtained by heating a mixture containing a diiodo aromatic compound, elemental sulfur, a polymerization inhibitor, and, if necessary, a catalyst. do. The ratio of the diiodo aromatic compound in the molten mixture is preferably in the range of 0.5 to 2 mol, more preferably in the range of 0.8 to 1.2 mol, based on 1 mol of elemental sulfur. Additionally, the proportion of the polymerization inhibitor in the mixture is preferably in the range of 0.0001 to 0.1 mol, more preferably in the range of 0.0005 to 0.05 mol, based on 1 mol of solid sulfur.
중합금지제를 첨가하는 시기는, 특히 제한되지 않지만, 디요오도 방향족 화합물, 단체 황 및 필요에 따라서 첨가되는 촉매를 포함하는 혼합물을 가열해서, 혼합물의 온도가 바람직하게는 200℃∼320℃의 범위, 보다 바람직하게는 250∼320℃의 범위로 된 시점에서 중합금지제를 첨가할 수 있다.The timing of adding the polymerization inhibitor is not particularly limited, but the mixture containing the diiodo aromatic compound, elemental sulfur, and a catalyst added as necessary is heated so that the temperature of the mixture is preferably 200°C to 320°C. The polymerization inhibitor can be added when the temperature reaches the range, more preferably within the range of 250 to 320°C.
용융 혼합물에 니트로 화합물을 촉매로서 첨가해서, 중합 속도를 조절할 수 있다. 이 니트로 화합물로서는, 통상적으로, 각종 니트로벤젠 유도체를 사용할 수 있다. 니트로벤젠 유도체로서는, 예를 들면 1,3-디요오도-4-니트로벤젠, 1-요오도-4-니트로벤젠, 2,6-디요오도-4-니트로페놀 및 2,6-디요오도-4-니트로아민을 들 수 있다. 촉매의 양은, 통상적으로, 촉매로서 첨가되는 양이면 되며, 예를 들면 단체 황 100질량부에 대해서 0.01∼20질량부의 범위인 것이 바람직하다.The polymerization rate can be controlled by adding a nitro compound as a catalyst to the molten mixture. As this nitro compound, various nitrobenzene derivatives can usually be used. Nitrobenzene derivatives include, for example, 1,3-diiodo-4-nitrobenzene, 1-iodo-4-nitrobenzene, 2,6-diiodo-4-nitrophenol, and 2,6-diiodo. and do-4-nitroamine. The amount of the catalyst is generally the amount added as a catalyst, and for example, it is preferably in the range of 0.01 to 20 parts by mass with respect to 100 parts by mass of elemental sulfur.
용융 중합의 조건은, 중합 반응이 적절히 진행하도록, 적의(適宜) 조정된다. 용융 중합의 온도는, 바람직하게는, 175℃ 이상, 생성하는 폴리아릴렌설피드 수지의 융점 +100℃ 이하의 범위, 보다 바람직하게는 180∼350℃의 범위이다. 용융 중합은, 절대압이 바람직하게는 1[cPa]∼100[㎪]의 범위, 보다 바람직하게는 13[cPa]∼60[㎪]의 범위에서 행해진다. 용융 중합의 조건은, 일정할 필요는 없다. 예를 들면, 중합 초기는 온도를 바람직하게는 175∼270℃의 범위, 보다 바람직하게는 180∼250℃의 범위로 하며, 또한, 절대압을 6.7∼100[㎪]의 범위로 하고, 그 후, 연속적으로 또는 계단상으로 승온 및 감압시키면서 중합을 행하며, 중합 후기는, 온도를 바람직하게는 270℃ 이상, 생성하는 폴리아릴렌설피드 수지의 융점 +100℃ 이하의 범위, 보다 바람직하게는 300∼350℃의 범위로 하며, 또한, 절대압을 1[cPa]∼6[㎪]의 범위로 해서 중합을 행할 수 있다. 본 명세서에 있어서, 수지의 융점은, 시차 주사 열량계(퍼킨엘머제 DSC 장치 Pyris Diamond)를 사용해서 JIS K 7121에 준거해 측정되는 값을 의미한다.The conditions for melt polymerization are appropriately adjusted so that the polymerization reaction proceeds appropriately. The temperature of melt polymerization is preferably in the range of 175°C or higher and the melting point of the polyarylene sulfide resin to be produced +100°C or lower, and more preferably in the range of 180 to 350°C. Melt polymerization is performed at an absolute pressure preferably in the range of 1 [cPa] to 100 [kPa], more preferably in the range of 13 [cPa] to 60 [kPa]. The conditions for melt polymerization do not need to be constant. For example, at the beginning of polymerization, the temperature is preferably in the range of 175 to 270°C, more preferably in the range of 180 to 250°C, and the absolute pressure is in the range of 6.7 to 100 [kPa], and then, Polymerization is carried out while continuously or stepwise raising the temperature and reducing the pressure. In the later stages of polymerization, the temperature is preferably in the range of 270°C or higher and the melting point of the polyarylene sulfide resin to be produced +100°C or lower, more preferably 300 to 350°C. Polymerization can be performed within the range of ℃ and the absolute pressure within the range of 1 [cPa] to 6 [kPa]. In this specification, the melting point of the resin means a value measured based on JIS K 7121 using a differential scanning calorimeter (DSC device Pyris Diamond manufactured by PerkinElmer).
용융 중합은, 산화 가교 반응을 방지하면서, 높은 중합도를 얻는 관점에서, 바람직하게는, 비산화성 분위기 하에서 행한다. 비산화성 분위기에 있어서, 기상(氣相)의 산소 농도는 바람직하게는 5체적% 미만의 범위, 보다 바람직하게는 2체적% 미만의 범위이며, 더 바람직하게는 기상이 산소를 실질적으로 함유하지 않는다. 비산화성 분위기는, 바람직하게는, 질소, 헬륨 및 아르곤 등의 불활성 가스 분위기이다.Melt polymerization is preferably performed in a non-oxidizing atmosphere from the viewpoint of obtaining a high degree of polymerization while preventing oxidative crosslinking reaction. In a non-oxidizing atmosphere, the oxygen concentration in the gas phase is preferably in the range of less than 5 volume%, more preferably in the range of less than 2 volume%, and even more preferably, the gas phase does not substantially contain oxygen. . The non-oxidizing atmosphere is preferably an inert gas atmosphere such as nitrogen, helium, and argon.
용융 중합은, 예를 들면, 가열 장치, 감압 장치 및 교반 장치를 구비하는 용융 혼련기를 사용해서 행할 수 있다. 용융 혼련기로서는, 예를 들면, 밴버리 믹서, 니더, 연속 혼련기, 단축(單軸) 압출기 및 2축 압출기를 들 수 있다.Melt polymerization can be performed, for example, using a melt kneader equipped with a heating device, a pressure reducing device, and a stirring device. Examples of melt kneaders include Banbury mixers, kneaders, continuous kneaders, single-screw extruders, and twin-screw extruders.
용융 중합을 위한 용융 혼합물은, 용매를 실질적으로 함유하지 않는 것이 바람직하다. 보다 구체적으로는, 용융 혼합물에 함유되는 용매의 양이, 디요오도 방향족 화합물과, 단체 황과, 중합금지제와, 필요에 따라서 촉매와의 합계 100질량부에 대해서, 바람직하게는 10질량부 이하의 범위, 보다 바람직하게는 5질량부 이하의 범위, 더 바람직하게는 1질량부 이하의 범위이다. 용매의 양은, 0질량부 이상, 0.01질량부 이상의 범위, 또는 0.1질량부 이상의 범위여도 된다.The melt mixture for melt polymerization preferably contains substantially no solvent. More specifically, the amount of solvent contained in the molten mixture is preferably 10 parts by mass with respect to a total of 100 parts by mass of the diiodo aromatic compound, elemental sulfur, polymerization inhibitor, and, if necessary, the catalyst. The range is as follows, more preferably in the range of 5 parts by mass or less, and even more preferably in the range of 1 part by mass or less. The amount of solvent may be 0 part by mass or more, 0.01 part by mass or more, or 0.1 part by mass or more.
용융 중합 후의 용융 혼합물(반응 생성물)을 냉각해서 고체 상태의 혼합물을 얻은 후, 감압 하, 또는 비산화성 분위기의 대기압 하에서, 혼합물을 가열해 중합 반응을 더 진행시켜도 된다. 이것에 의해 분자량을 더 증대시킬 수 있을 뿐만 아니라, 생성한 요오드 분자가 승화되어 제거되기 때문에, 폴리아릴렌설피드 수지 중의 요오드 원자 농도를 낮게 억제할 수 있다. 바람직하게는 100∼260℃의 범위, 보다 바람직하게는 130∼250℃의 범위, 더 바람직하게는 150∼230℃의 범위의 온도까지 냉각함으로써, 고체 상태의 혼합물을 얻을 수 있다. 고체 상태에의 냉각 후의 가열은, 용융 중합과 마찬가지의 온도 및 압력 조건 하에서 행할 수 있다.After cooling the molten mixture (reaction product) after melt polymerization to obtain a solid mixture, the polymerization reaction may be further advanced by heating the mixture under reduced pressure or under atmospheric pressure in a non-oxidizing atmosphere. By this, not only can the molecular weight be further increased, but also the generated iodine molecules are sublimated and removed, so that the iodine atom concentration in the polyarylene sulfide resin can be suppressed to a low level. A solid mixture can be obtained by cooling to a temperature preferably in the range of 100 to 260°C, more preferably in the range of 130 to 250°C, and even more preferably in the range of 150 to 230°C. Heating after cooling to a solid state can be performed under the same temperature and pressure conditions as for melt polymerization.
용융 중합 공정에 의해 얻어진 폴리아릴렌설피드 수지를 함유하는 반응 생성물은, 그대로 직접, 용융 혼련기에 투입하는 등의 방법에 의해 수지 조성물을 제조할 수도 있지만, 당해 반응 생성물에 당해 반응 생성물이 용해하는 용매를 가해서 용해물을 조제하고, 당해 용해물의 상태에서 반응 장치로부터 반응 생성물을 취출하는 것이, 생산성이 우수할 뿐만 아니라 반응성도 더 양호해지기 때문에 바람직하다. 당해 반응 생성물이 용해하는 용매의 첨가는, 용융 중합 후에 행하는 것이 바람직하지만, 용융 중합의 반응 후기에 행해도 되며, 또한, 상기한 바와 같이 용융 혼합물(반응 생성물)을 냉각해서 고체 상태의 혼합물을 얻은 후, 가압 하, 감압 하, 또는 비산화성 분위기의 대기압 하에서, 혼합물을 가열해 중합 반응을 더 진행시킨 후여도 된다. 당해 용해물을 조제하는 공정은, 비산화성 분위기 하에서 행해도 된다. 또한, 가열 용해의 온도로서는, 상기 반응 생성물이 용해하는 용매의 융점 이상의 범위이면 되며, 바람직하게는 200∼350℃의 범위, 보다 바람직하게는 210∼250℃의 범위이고, 가압 하에서 행하는 것이 바람직하다.The reaction product containing the polyarylene sulfide resin obtained through the melt polymerization process can also be used to produce a resin composition by methods such as directly adding it to a melt kneader, but the solvent in which the reaction product is dissolved is used. It is preferable to prepare a melt by adding and extract the reaction product from the reaction apparatus in the state of the melt because not only is productivity excellent, but reactivity is also improved. The addition of the solvent in which the reaction product dissolves is preferably performed after melt polymerization, but may also be performed later in the melt polymerization reaction. Additionally, the molten mixture (reaction product) is cooled as described above to obtain a solid mixture. Afterwards, the polymerization reaction may be further advanced by heating the mixture under increased pressure, reduced pressure, or atmospheric pressure in a non-oxidizing atmosphere. The step of preparing the melt may be performed under a non-oxidizing atmosphere. In addition, the temperature of heating dissolution may be in the range above the melting point of the solvent in which the reaction product is dissolved, and is preferably in the range of 200 to 350°C, more preferably in the range of 210 to 250°C, and is preferably carried out under pressure. .
상기 용해물을 조제하기 위하여 사용하는, 상기 반응 생성물이 용해하는 용매의 배합 비율은, 폴리아릴렌설피드 수지를 함유하는 반응 생성물 100질량부에 대해서, 바람직하게는 90∼1000질량부의 범위, 보다 바람직하게는 200∼400질량부의 범위이다.The mixing ratio of the solvent in which the reaction product is dissolved, used to prepare the melt, is preferably in the range of 90 to 1000 parts by mass, more preferably, with respect to 100 parts by mass of the reaction product containing the polyarylene sulfide resin. Typically, it is in the range of 200 to 400 parts by mass.
반응 생성물이 용해하는 용매로서는, 예를 들면, 필립스법 등의 용액 중합에 있어서 중합 반응 용매로서 사용되는 용매를 사용할 수 있다. 바람직한 용매의 예로서는, N-메틸-2-피롤리돈(이하, NMP로 약기), N-시클로헥실-2-피롤리돈, 2-피롤리돈, 1,3-디메틸-2-이미다졸리디논산, ε-카프로락탐, N-메틸-ε-카프로락탐 등의 지방족 환상 아미드 화합물, 헥사메틸인산트리아미드(HMPA), 테트라메틸요소(TMU), 디메틸포름아미드(DMF), 및 디메틸아세트아미드(DMA) 등의 아미드 화합물, 폴리에틸렌글리콜디알킬에테르(중합도는 2000 이하이며, 탄소 원자수 1∼20의 알킬기를 갖는 것) 등의 에테르화 폴리에틸렌글리콜 화합물, 그리고, 테트라메틸렌설폭시드, 및 디메틸설폭시드(DMSO) 등의 설폭시드 화합물을 들 수 있다. 그 밖의 사용 가능한 용매의 예로서, 벤조페논, 디페닐에테르, 디페닐설피드, 4,4'-디브로모비페닐, 1-페닐나프탈렌, 2,5-디페닐-1,3,4-옥사디아졸, 2,5-디페닐옥사졸, 트리페닐메탄올, N,N-디페닐포름아미드, 벤질, 안트라센, 4-벤조일비페닐, 디벤조일메탄, 2-비페닐카르복시산, 디벤조티오펜, 펜타클로로페놀, 1-벤질-2-피롤리디온, 9-플루오레논, 2-벤조일나프탈렌, 1-브로모나프탈렌, 1,3-디페녹시벤젠, 플루오렌, 1-페닐-2-피롤리디논, 1-메톡시나프탈렌, 1-에톡시나프탈렌, 1,3-디페닐아세톤, 1,4-디벤조일부탄, 페난트렌, 4-벤조일비페닐, 1,1-디페닐아세톤, o,o'-비페놀, 2,6-디페닐페놀, 트리페닐렌, 2-페닐페놀, 티안트렌, 3-페녹시벤질알코올, 4-페닐페놀, 9,10-디클로로안트라센, 트리페닐메탄, 4,4'-디메톡시벤조페논, 9,10-디페닐안트라센, 플루오란텐, 디페닐프탈레이트, 디페닐카르보네이트, 2,6-디메톡시나프탈렌, 2,7-디메톡시나프탈렌, 4-브로모디페닐에테르, 피렌, 9,9'-비-플루오렌, 4,4'-이소프로필리덴-디페놀, ε-카프로락탐, N-시클로헥실-2-피롤리돈, 디페닐이소프탈레이트, 디페닐테레프탈레이트 및 1-클로로나프탈렌으로 이루어지는 군에서 선택되는 1종 이상의 용매를 들 수 있다.As a solvent in which the reaction product dissolves, for example, a solvent used as a polymerization reaction solvent in solution polymerization such as the Phillips method can be used. Examples of preferred solvents include N-methyl-2-pyrrolidone (hereinafter abbreviated as NMP), N-cyclohexyl-2-pyrrolidone, 2-pyrrolidone, and 1,3-dimethyl-2-imidazoly. Aliphatic cyclic amide compounds such as dinoic acid, ε-caprolactam, and N-methyl-ε-caprolactam, hexamethyltriamide phosphate (HMPA), tetramethylurea (TMU), dimethylformamide (DMF), and dimethylacetamide. Amide compounds such as (DMA), etherified polyethylene glycol compounds such as polyethylene glycol dialkyl ether (polymerization degree of 2000 or less and having an alkyl group of 1 to 20 carbon atoms), tetramethylene sulfoxide, and dimethyl sulfoxide. Sulfoxide compounds such as seed (DMSO) can be mentioned. Examples of other usable solvents include benzophenone, diphenyl ether, diphenyl sulfide, 4,4'-dibromobiphenyl, 1-phenylnaphthalene, 2,5-diphenyl-1,3,4-oxa. Diazole, 2,5-diphenyloxazole, triphenylmethanol, N,N-diphenylformamide, benzyl, anthracene, 4-benzoylbiphenyl, dibenzoylmethane, 2-biphenylcarboxylic acid, dibenzothiophene, Pentachlorophenol, 1-benzyl-2-pyrrolidione, 9-fluorenone, 2-benzoylnaphthalene, 1-bromonaphthalene, 1,3-diphenoxybenzene, fluorene, 1-phenyl-2-pyrroli Dinone, 1-methoxynaphthalene, 1-ethoxynaphthalene, 1,3-diphenylacetone, 1,4-dibenzoylbutane, phenanthrene, 4-benzoylbiphenyl, 1,1-diphenylacetone, o,o '-Biphenol, 2,6-diphenylphenol, triphenylene, 2-phenylphenol, thiantrene, 3-phenoxybenzyl alcohol, 4-phenylphenol, 9,10-dichloroanthracene, triphenylmethane, 4, 4'-dimethoxybenzophenone, 9,10-diphenylanthracene, fluoranthene, diphenyl phthalate, diphenyl carbonate, 2,6-dimethoxynaphthalene, 2,7-dimethoxynaphthalene, 4-bromody Phenyl ether, pyrene, 9,9'-bi-fluorene, 4,4'-isopropylidene-diphenol, ε-caprolactam, N-cyclohexyl-2-pyrrolidone, diphenyl isophthalate, diphenyl One or more solvents selected from the group consisting of terephthalate and 1-chloronaphthalene can be mentioned.
반응 장치로부터 취출된 당해 용해물은, 후처리를 행한 후, 상기 다른 성분과 용융 혼련해서 수지 조성물을 조제하는 것이, 반응성이 보다 양호해지기 때문에 바람직하다. 용해물의 후처리의 방법으로서는, 특히 제한되는 것은 아니지만, 예를 들면, 이하의 방법을 들 수 있다.The melt taken out from the reaction device is preferably post-processed and then melt-kneaded with the other components to prepare a resin composition because the reactivity becomes better. The method of post-processing the dissolved product is not particularly limited, but examples include the following method.
(1) 당해 용해물을, 그대로, 또는 산 혹은 염기를 가한 후, 감압 하 또는 상압 하에서 용매를 증류 제거하고, 다음으로 용매 증류 제거 후의 고형물을 물, 당해 용해물에 사용한 용매(또는 저분자 폴리머에 대해서 동등한 용해도를 갖는 유기 용매), 아세톤, 메틸에틸케톤 및 알코올류 등에서 선택되는 용매로 1회 또는 2회 이상 세정하고, 추가로 중화, 수세, 여과 및 건조하는 방법.(1) The solvent is distilled off from the dissolved substance as is or after adding an acid or base under reduced pressure or normal pressure, and then the solid matter after the solvent distillation is dissolved in water and the solvent used in the dissolved substance (or a low molecular weight polymer). A method of washing once or twice or more with a solvent selected from organic solvents having equal solubility), acetone, methyl ethyl ketone, and alcohol, and further neutralizing, washing with water, filtering, and drying.
(2) 당해 용해물에 물, 아세톤, 메틸에틸케톤, 알코올, 에테르, 할로겐화탄화수소, 방향족 탄화수소 및 지방족 탄화수소 등의 용매(당해 용해물의 용매에 가용(可溶)이며, 또한 적어도 폴리아릴렌설피드 수지에 대해서는 빈용매(貧溶媒)인 용매)를 침강제로서 첨가해서, 폴리아릴렌설피드 수지 및 무기염 등을 포함하는 고체상 생성물을 침강시키고, 고체상 생성물을 여과 분별, 세정 및 건조하는 방법.(2) Solvents such as water, acetone, methyl ethyl ketone, alcohol, ether, halogenated hydrocarbons, aromatic hydrocarbons, and aliphatic hydrocarbons are added to the melt (soluble in the solvent of the melt, and at least polyarylene sulfide) A method in which a solid product containing a polyarylene sulfide resin and an inorganic salt is precipitated by adding a solvent that is a poor solvent for the resin as a precipitant, and the solid product is filtered, washed, and dried.
(3) 당해 용해물에, 당해 용해물에 사용한 용매(또는 저분자 폴리머에 대해서 동등한 용해도를 갖는 유기 용매)를 가해서 교반한 후, 여과해서 저분자량 중합체를 제거한 후, 물, 아세톤, 메틸에틸케톤 및 알코올 등에서 선택되는 용매로 1회 또는 2회 이상 세정하고, 그 후 중화, 수세, 여과 및 건조를 하는 방법.(3) The solvent used in the melt (or an organic solvent with equivalent solubility to the low-molecular polymer) was added to the melt, stirred, and then filtered to remove the low-molecular weight polymer, followed by water, acetone, methyl ethyl ketone, and A method of washing once or twice or more with a solvent selected from alcohol, etc., followed by neutralization, washing with water, filtration, and drying.
또, 상기 (1)∼(3)에 예시한 바와 같은 후처리 방법에 있어서, 폴리아릴렌설피드 수지의 건조는 진공 중에서 행해도 되고, 공기 중 또는 질소와 같은 불활성 가스 분위기 중에서 행해도 된다. 산소 농도가 5∼30체적%인 범위의 산화성 분위기 중 또는 감압 조건 하에서 열처리를 행해, 폴리아릴렌설피드 수지를 산화 가교시킬 수도 있다.In addition, in the post-treatment methods as exemplified in (1) to (3) above, drying of the polyarylene sulfide resin may be performed in a vacuum, in air or in an inert gas atmosphere such as nitrogen. The polyarylene sulfide resin can also be oxidized and crosslinked by heat treatment in an oxidizing atmosphere with an oxygen concentration of 5 to 30% by volume or under reduced pressure conditions.
폴리아릴렌설피드 수지가 용융 중합에 의해 생성하는 반응을, 이하에 예시한다.The reaction produced by polyarylene sulfide resin through melt polymerization is exemplified below.
반응식(1)∼(5)은, 예를 들면 일반식(a), (b) 또는 (c)으로 표시되는 기를 포함하는 치환기R을 갖는 디페닐디설피드를 중합금지제로서 사용했을 경우의, 폴리페닐렌설피드가 생성하는 반응의 예이다. 반응식(1)은, 중합금지제 중의 -S-S- 결합이, 용융 온도 하에서 라디칼 개열하는 반응이다. 반응식(2)은, 반응식(1)으로 발생한 황 라디칼이 성장 중인 주쇄의 말단 요오드 원자의 인접 탄소 원자를 공격해, 요오드 원자가 탈리함으로써, 중합이 정지함과 함께, 주쇄의 말단에 치환기R이 도입되는 반응이다. 반응식(3)은, 폴리아릴렌설피드 수지의 주쇄 중에 원료(단체 황)에 유래해 존재하는 디설피드 결합이 용융 온도 하에서 라디칼 개열하는 반응이다. 반응식(4)은, 반응식(3)으로 발생한 황 라디칼과, 반응식(1)으로 발생한 황 라디칼과의 재결합에 의해서, 중합이 정지함과 함께, 치환기R이 주쇄의 말단에 도입되는 반응이다. 탈리한 요오드 원자는 유리(遊離) 상태(요오드 라디칼)에 있거나, 또는, 반응식(5)과 같이 요오드 라디칼끼리가 재결합함으로써, 요오드 분자가 생성한다.Reaction formulas (1) to (5) are, for example, when diphenyl disulfide having a substituent R containing a group represented by general formula (a), (b) or (c) is used as a polymerization inhibitor, This is an example of a reaction produced by polyphenylene sulfide. Reaction formula (1) is a reaction in which the -S-S- bond in the polymerization inhibitor undergoes radical cleavage at the melting temperature. Reaction formula (2) shows that the sulfur radical generated in reaction formula (1) attacks the carbon atom adjacent to the terminal iodine atom of the growing main chain, and the iodine atom is desorbed, thereby stopping polymerization and introducing a substituent R at the end of the main chain. It is a reaction that works. Reaction formula (3) is a reaction in which the disulfide bond that exists in the main chain of the polyarylene sulfide resin derived from the raw material (single sulfur) undergoes radical cleavage under the melting temperature. Reaction formula (4) is a reaction in which polymerization is stopped and a substituent R is introduced to the terminal of the main chain by recombination of the sulfur radical generated in Reaction formula (3) with the sulfur radical generated in Reaction formula (1). The detached iodine atom is in a free state (iodine radical), or iodine radicals recombine with each other as shown in reaction formula (5), thereby producing an iodine molecule.
용융 중합에 의해 얻어지는 폴리아릴렌설피드 수지를 함유하는 반응 생성물은, 원료에 유래하는 요오드 원자를 함유한다. 그 때문에, 폴리아릴렌설피드 수지는, 통상적으로, 요오드 원자를 포함하는 혼합물의 상태로, 방사용 수지 조성물의 조제 등을 위하여 사용된다. 당해 혼합물에 있어서의 요오드 원자의 농도는, 예를 들면, 폴리아릴렌설피드 수지에 대해서 0.01∼10000ppm의 범위이며, 바람직하게는 10∼5000ppm의 범위이다. 요오드 분자의 승화성을 이용해서, 요오드 원자 농도를 낮게 억제하는 것도 가능하며, 그 경우에는, 900ppm 이하의 범위, 바람직하게는 100ppm 이하의 범위, 또한 10ppm 이하의 범위로 하는 것도 가능하다. 요오드 원자를 검출 한계 이하로 더 제거하는 것도 가능하지만, 생산성을 생각하면 실용적이지는 않다. 검출 한계는, 예를 들면 0.01ppm 정도이다. 용융 중합에 의해 얻어지는 본 실시형태의 폴리아릴렌설피드 수지 또는 이를 함유하는 반응 생성물은, 요오드 원자를 함유하고 있는 점에서, 예를 들면, 필립스법 등의 디클로로 방향족 화합물의 유기 극성 용매 중에서의 용액 중합법에 의해 얻어진 폴리아릴렌설피드와 명확히 구별될 수 있다.The reaction product containing polyarylene sulfide resin obtained by melt polymerization contains iodine atoms derived from the raw materials. Therefore, polyarylene sulfide resin is usually used in the form of a mixture containing iodine atoms for the preparation of a resin composition for spinning. The concentration of iodine atoms in the mixture is, for example, in the range of 0.01 to 10,000 ppm relative to the polyarylene sulfide resin, and preferably in the range of 10 to 5,000 ppm. It is also possible to suppress the iodine atom concentration to a low level by utilizing the sublimation property of iodine molecules, and in that case, it is possible to set it to the range of 900 ppm or less, preferably 100 ppm or less, and furthermore, 10 ppm or less. It is possible to further remove iodine atoms below the detection limit, but this is not practical considering productivity. The detection limit is, for example, about 0.01 ppm. Since the polyarylene sulfide resin of the present embodiment obtained by melt polymerization or the reaction product containing the same contains an iodine atom, for example, solution polymerization of a dichloro aromatic compound in an organic polar solvent such as the Phillips method It can be clearly distinguished from polyarylene sulfide obtained by law.
상기 반응식으로부터도 이해되는 바와 같이, 용융 중합에 의해 얻어지는 폴리아릴렌설피드 수지는, 디요오도 방향족 화합물에 유래하는 방향족 환 및 이것에 직접 결합한 황 원자로 이루어지는 아릴렌설피드 단위로 주로 구성되는 주쇄와, 당해 주쇄의 말단에 결합한 소정의 치환기R을 함유한다. 소정의 치환기R은, 주쇄의 말단의 방향족 환에, 직접, 또는 중합금지제에 유래하는 부분 구조를 통해서 결합해 있다.As can be understood from the above reaction formula, the polyarylene sulfide resin obtained by melt polymerization has a main chain mainly composed of an arylene sulfide unit consisting of an aromatic ring derived from a diiodo aromatic compound and a sulfur atom directly bonded thereto, It contains a predetermined substituent R attached to the terminal of the main chain. The predetermined substituent R is bonded to the aromatic ring at the terminal of the main chain directly or through a partial structure derived from a polymerization inhibitor.
일 실시형태에 따른 폴리아릴렌설피드 수지로서의 폴리페닐렌설피드 수지는, 예를 들면, 하기 일반식(10) : Polyphenylene sulfide resin as the polyarylene sulfide resin according to one embodiment has, for example, the following general formula (10):
으로 표시되는 반복 단위(아릴렌설피드 단위)를 포함하는 주쇄를 갖는다. 식(10)으로 표시되는 반복 단위는, 파라 위치에서 결합하는 하기 식(10a) : It has a main chain containing a repeating unit (arylene sulfide unit) represented by . The repeating unit represented by formula (10) has the following formula (10a) bonded at the para position:
으로 표시되는 반복 단위, 및, 메타 위치에서 결합하는 하기 식(10b) : The following equation (10b) combining the repeating unit represented by and at the meta position:
으로 표시되는 반복 단위인 것이 보다 바람직하다. 이들 중에서도, 식(10a)으로 표시되는 파라 위치에서 결합한 반복 단위가, 수지의 내열성 및 결정성의 면에서 바람직하다.It is more preferable that it is a repeating unit expressed as . Among these, the repeating unit bonded at the para position represented by formula (10a) is preferable in terms of heat resistance and crystallinity of the resin.
일 실시형태에 따른 폴리페닐렌설피드 수지는, 하기 일반식(11) :The polyphenylene sulfide resin according to one embodiment has the following general formula (11):
(식 중, R20 및 R21은, 각각 독립적으로 수소 원자, 탄소 원자수 1∼4의 알킬기, 니트로기, 아미노기, 페닐기, 메톡시기, 또는 에톡시기를 나타낸다)(In the formula, R 20 and R 21 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a nitro group, an amino group, a phenyl group, a methoxy group, or an ethoxy group)
으로 표시되는, 방향족 환에 결합한 측쇄로서의 치환기를 갖는 반복 단위를 포함할 수 있다. 단, 결정화도 및 내열성의 저하의 관점에서, 폴리페닐렌설피드 수지는, 일반식(11)의 반복 단위를 실질적으로 포함하지 않는 것이 바람직하다. 보다 구체적으로는, 식(11)으로 표시되는 반복 단위의 비율은, 식(10)으로 표시되는 반복 단위와 식(11)으로 표시되는 반복 단위와의 합계에 대해서, 바람직하게는 2질량% 이하, 보다 바람직하게는 0.2질량% 이하이다.It may include a repeating unit having a substituent as a side chain bonded to an aromatic ring, represented by . However, from the viewpoint of a decrease in crystallinity and heat resistance, it is preferable that the polyphenylene sulfide resin does not substantially contain the repeating unit of the general formula (11). More specifically, the ratio of the repeating unit represented by formula (11) is preferably 2% by mass or less relative to the sum of the repeating unit represented by formula (10) and the repeating unit represented by formula (11). , more preferably 0.2% by mass or less.
본 실시형태의 폴리아릴렌설피드 수지는, 상기 아릴렌설피드 단위로 주로 구성되지만, 통상적으로, 원료의 단체 황에 유래하는, 하기 식(20) :The polyarylene sulfide resin of the present embodiment is mainly composed of the above-mentioned arylene sulfide units, but is usually derived from the simple sulfur of the raw material, and has the following formula (20):
으로 표시되는 디설피드 결합에 따른 구성 단위도 주쇄 중에 포함한다. 내열성, 기계적 강도의 점에서, 식(20)으로 표시되는 구성 단위의 비율은, 아릴렌설피드 단위와, 식(20)으로 표시되는 구성 부위와의 합계에 대해서, 바람직하게는 2.9질량% 이하의 범위, 보다 바람직하게는 1.2질량% 이하의 범위이다. 폴리아릴렌설피드 수지가 식(20)으로 표시되는 구성 단위를 포함함에 의해서, 폴리아릴렌설피드 수지 조성물과 금속과의 밀착성이 향상하는 점에서 바람직하다.Constituent units based on disulfide bonds represented by are also included in the main chain. In terms of heat resistance and mechanical strength, the ratio of the structural unit represented by formula (20) is preferably 2.9% by mass or less relative to the sum of the arylene sulfide unit and the constituent portion represented by formula (20). range, more preferably 1.2% by mass or less. It is preferable that the polyarylene sulfide resin contains the structural unit represented by formula (20) because the adhesion between the polyarylene sulfide resin composition and the metal improves.
본 실시형태에 따른 폴리아릴렌설피드 수지의 Mw/Mtop는, 바람직하게는 0.80∼1.70의 범위이며, 보다 바람직하게는 0.90∼1.30의 범위이다. Mw/Mtop를 이러한 범위로 함으로써, 폴리아릴렌설피드 수지의 가공성을 향상시킬 수 있어, 양호한 캐비티 밸런스를 부여할 수 있다. 본 명세서에 있어서, Mw는 겔침투 크로마토그래피에 의해 측정되는 중량 평균 분자량을 나타내고, Mtop는 같은 측정에 의해 얻어지는 크로마토그램의 검출 강도가 최대로 되는 점의 평균 분자량(피크 분자량)을 나타낸다. Mw/Mtop는, 측정 대상의 분자량의 분포를 나타내며, 통상적으로, 이 값이 1에 가까우면 분자량의 분포가 좁은 것을 나타내고, 이 값이 커짐에 따라서, 분자량의 분포가 넓은 것을 나타낸다. 또, 겔침투 크로마토그래피의 측정 조건은, 본 명세서의 실시예와 동일한 측정 조건으로 한다. 단, Mw, Mw/Mtop의 값에 실질적인 영향을 미치지 않는 범위에서, 측정 조건을 변경하는 것은 가능하다.Mw/Mtop of the polyarylene sulfide resin according to this embodiment is preferably in the range of 0.80 to 1.70, more preferably in the range of 0.90 to 1.30. By setting Mw/Mtop in this range, the processability of polyarylene sulfide resin can be improved and good cavity balance can be provided. In this specification, Mw represents the weight average molecular weight measured by gel permeation chromatography, and Mtop represents the average molecular weight (peak molecular weight) at the point where the detection intensity of the chromatogram obtained by the same measurement is maximum. Mw/Mtop represents the distribution of the molecular weight of the measurement target. Typically, when this value is close to 1, it indicates that the molecular weight distribution is narrow, and as this value increases, it indicates that the molecular weight distribution is wide. In addition, the measurement conditions for gel permeation chromatography are the same as those in the examples of this specification. However, it is possible to change the measurement conditions to the extent that it does not substantially affect the values of Mw and Mw/Mtop.
본 실시형태에 따른 폴리아릴렌설피드 수지의 중량 평균 분자량은, 본 발명의 효과를 손상시키지 않으면 특히 한정되는 것은 아니지만, 그 하한은, 기계적 강도가 우수한 점에서 28,000 이상인 것이 바람직하며, 30,000 이상의 범위인 것이 보다 더 바람직하다. 한편, 상한은, 보다 양호한 캐비티 밸런스를 부여할 수 있는 점에서 100,000 이하의 범위인 것이 바람직하며, 60,000 이하의 범위인 것이 보다 더 바람직하고, 추가로 55,000 이하의 범위인 것이 가장 바람직하다. 추가로, 기계적 강도가 우수하면서, 또한, 양호한 캐비티 밸런스를 부여할 수 있는 관점에서, 28,000∼60,000의 범위의 폴리아릴렌설피드 수지, 보다 바람직하게는 30,000∼55,000의 범위의 폴리아릴렌설피드 수지와 함께, 중량 평균 분자량이 60,000 초과 100,000 이하의 범위에 있는 폴리아릴렌설피드 수지를 사용해도 된다.The weight average molecular weight of the polyarylene sulfide resin according to the present embodiment is not particularly limited as long as the effect of the present invention is not impaired, but the lower limit is preferably 28,000 or more from the viewpoint of excellent mechanical strength, and is in the range of 30,000 or more. It is more desirable. On the other hand, the upper limit is preferably in the range of 100,000 or less because it can provide better cavity balance, more preferably in the range of 60,000 or less, and most preferably in the range of 55,000 or less. Additionally, from the viewpoint of being excellent in mechanical strength and providing good cavity balance, a polyarylene sulfide resin in the range of 28,000 to 60,000, more preferably a polyarylene sulfide resin in the range of 30,000 to 55,000; Additionally, you may use a polyarylene sulfide resin whose weight average molecular weight is in the range of more than 60,000 and less than or equal to 100,000.
폴리아릴렌설피드 수지의 비뉴토니언 지수는, 바람직하게는 0.95∼1.75의 범위이며, 보다 바람직하게는 1.0∼1.70의 범위이다. 비뉴토니언 지수를 이러한 범위로 함으로써, 폴리아릴렌설피드 수지의 가공성을 향상시킬 수 있어, 양호한 캐비티 밸런스를 부여할 수 있다. 본 명세서에 있어서, 비뉴토니언 지수는 온도 300℃의 조건 하에 있어서의 전단 속도와 전단 응력과의 하기 관계식을 만족시키는 지수를 말한다. 비뉴토니언 지수는, 측정 대상의 분자량, 또는 직쇄, 분기, 가교와 같은 분자 구조에 관한 지표로 될 수 있으며, 통상적으로, 이 값이 1에 가까우면 수지의 분자 구조가 직쇄상인 것을 나타내고, 이 값이 커짐에 따라서, 분기나 가교 구조가 많이 포함되는 것을 나타낸다.The non-Newtonian index of the polyarylene sulfide resin is preferably in the range of 0.95 to 1.75, and more preferably in the range of 1.0 to 1.70. By setting the non-Newtonian index in this range, the processability of polyarylene sulfide resin can be improved and good cavity balance can be provided. In this specification, the non-Newtonian index refers to an index that satisfies the following relationship between shear rate and shear stress under the condition of a temperature of 300°C. The non-Newtonian index can be an indicator of the molecular weight of the measurement object or the molecular structure such as straight chain, branched, or cross-linked. Typically, if this value is close to 1, it indicates that the molecular structure of the resin is linear, As this value increases, it indicates that more branched or cross-linked structures are included.
D=α×Sn D=α×S n
(상기 식 중, D는 전단 속도를 나타내고, S는 전단 응력을 나타내고, α는 상수를 나타내고, n은 비뉴토니언 지수를 나타낸다)(In the above formula, D represents the shear rate, S represents the shear stress, α represents a constant, and n represents a non-Newtonian exponent)
상술한 특정 범위의 Mw/Mtop 및 비뉴토니언 지수를 갖는 폴리아릴렌설피드 수지는, 예를 들면, 디요오도 방향족 화합물과, 단체 황과, 중합금지제를, 디요오도 방향족 화합물, 단체 황 및 중합금지제를 포함하는 용융 혼합물 중에서 반응(용융 중합)시키는 방법에 있어서, 이러한 폴리아릴렌설피드 수지를 어느 정도 고분자량화시킴에 의해 얻는 것이 가능하다.The polyarylene sulfide resin having the above-mentioned specific range of Mw/Mtop and non-Newtonian index includes, for example, a diiodo aromatic compound, a simple sulfur, and a polymerization inhibitor, a diiodo aromatic compound, and a simple sulfur. In a method of reacting (melt polymerization) in a molten mixture containing a polymerization inhibitor, it is possible to obtain such a polyarylene sulfide resin by increasing its molecular weight to some extent.
본 실시형태에 따른 폴리아릴렌설피드 수지의 융점은, 바람직하게는 250∼300℃의 범위이며, 보다 바람직하게는 265∼300℃의 범위이다. 폴리아릴렌설피드 수지의 300℃에 있어서의 용융 점도(V6)는, 바람직하게는 1∼2000[㎩·s]의 범위이며, 보다 바람직하게는 5∼1700[㎩·s]의 범위이다. 여기에서, 용융 점도(V6)는, 플로우 테스터를 사용해서, 온도 300℃, 하중 1.96㎫, 오리피스 길이와 오리피스 직경과의 비(오리피스 길이/오리피스 직경)가 10/1인 오리피스를 사용해서 6분간 유지한 후의 용융 점도를 의미한다.The melting point of the polyarylene sulfide resin according to the present embodiment is preferably in the range of 250 to 300°C, more preferably in the range of 265 to 300°C. The melt viscosity (V6) at 300°C of the polyarylene sulfide resin is preferably in the range of 1 to 2000 [Pa·s], and more preferably in the range of 5 to 1700 [Pa·s]. Here, the melt viscosity (V6) was measured using a flow tester at a temperature of 300°C, a load of 1.96 MPa, and an orifice with a ratio of orifice length to orifice diameter (orifice length/orifice diameter) of 10/1 for 6 minutes. It refers to the melt viscosity after maintenance.
본 실시형태에 따른 폴리아릴렌설피드 수지 조성물은, 1종 또는 2종 이상의 무기질 충전제를 함유할 수 있다. 무기 충전재가 배합됨에 의해, 고강성, 고내열안정성(高耐熱安定性)의 조성물이 얻어진다. 무기 충전재로서는, 예를 들면 카본 블랙, 탄산칼슘, 실리카 및 산화티타늄 등의 분말상 충전재, 탈크 및 마이카 등의 판상 충전재, 유리 비드, 실리카 비드 및 유리 벌룬 등의 입상(粒狀) 충전재, 유리 섬유, 탄소 섬유 및 규회석(wollastonite) 섬유 등의 섬유상(纖維狀) 충전재, 그리고 유리 플레이크를 들 수 있다. 폴리아릴렌설피드 수지 조성물은, 유리 섬유, 탄소 섬유, 카본 블랙, 및 탄산칼슘으로 이루어지는 군에서 선택되는 적어도 1종의 무기질 충전제를 함유하는 것이 특히 바람직하다.The polyarylene sulfide resin composition according to this embodiment may contain one type or two or more types of inorganic fillers. By mixing inorganic fillers, a composition with high rigidity and high heat resistance and stability is obtained. Examples of inorganic fillers include powdered fillers such as carbon black, calcium carbonate, silica and titanium oxide, plate-shaped fillers such as talc and mica, granular fillers such as glass beads, silica beads and glass balloons, glass fibers, Examples include fibrous fillers such as carbon fiber and wollastonite fiber, and glass flakes. It is particularly preferable that the polyarylene sulfide resin composition contains at least one kind of inorganic filler selected from the group consisting of glass fiber, carbon fiber, carbon black, and calcium carbonate.
무기 충전재의 함유량은, 폴리아릴렌설피드 수지 100질량부에 대해서, 바람직하게는 1∼300질량부의 범위이며, 보다 바람직하게는 5∼200질량부의 범위이고, 더 바람직하게는 15∼150질량부의 범위이다. 무기질 충전제의 함유량이 이러한 범위에 있음에 의해, 성형품의 기계적 강도 유지의 점에서 보다 우수한 효과가 얻어진다.The content of the inorganic filler is preferably in the range of 1 to 300 parts by mass, more preferably in the range of 5 to 200 parts by mass, and still more preferably in the range of 15 to 150 parts by mass, based on 100 parts by mass of the polyarylene sulfide resin. am. When the content of the inorganic filler is within this range, a more excellent effect is obtained in terms of maintaining the mechanical strength of the molded article.
본 실시형태에 따른 폴리아릴렌설피드 수지 조성물은, 열가소성 수지, 엘라스토머, 및 가교성 수지에서 선택되는, 폴리아릴렌설피드 수지 이외의 수지를 함유할 수 있다. 이들 수지는, 무기질 충전제와 함께 수지 조성물 중에 배합할 수도 있다.The polyarylene sulfide resin composition according to this embodiment may contain a resin other than polyarylene sulfide resin selected from thermoplastic resins, elastomers, and crosslinkable resins. These resins can also be blended in a resin composition together with an inorganic filler.
폴리아릴렌설피드 수지 조성물에 배합되는 열가소성 수지로서는, 예를 들면, 폴리에스테르, 폴리아미드, 폴리이미드, 폴리에테르이미드, 폴리카보네이트, 폴리페닐렌에테르, 폴리설폰, 폴리에테르설폰, 폴리에테르에테르케톤, 폴리에테르케톤, 폴리에틸렌, 폴리프로필렌, 폴리사불화에틸렌, 폴리이불화에틸렌, 폴리스티렌, ABS 수지, 실리콘 수지, 및 액정 폴리머(액정 폴리에스테르 등)를 들 수 있다.Thermoplastic resins to be blended in the polyarylene sulfide resin composition include, for example, polyester, polyamide, polyimide, polyetherimide, polycarbonate, polyphenylene ether, polysulfone, polyethersulfone, polyetheretherketone, Examples include polyether ketone, polyethylene, polypropylene, polytetrafluoroethylene, polydifluoroethylene, polystyrene, ABS resin, silicone resin, and liquid crystal polymer (liquid crystal polyester, etc.).
폴리아미드는, 아미드 결합(-NHCO-)을 갖는 폴리머이다. 폴리아미드 수지로서는, 예를 들면, (i)디아민과 디카르복시산의 중축합으로부터 얻어지는 폴리머, (ⅱ)아미노카르복시산의 중축합으로부터 얻어지는 폴리머, 및 (ⅲ)락탐의 개환 중합으로부터 얻어지는 폴리머 등을 들 수 있다. 폴리아미드는, 단독으로 또는 2종 이상을 조합해서 사용할 수 있다.Polyamide is a polymer having an amide bond (-NHCO-). Examples of polyamide resins include (i) polymers obtained from polycondensation of diamines and dicarboxylic acids, (ii) polymers obtained from polycondensation of aminocarboxylic acids, and (iii) polymers obtained from ring-opening polymerization of lactams. there is. Polyamide can be used individually or in combination of two or more types.
폴리아미드를 얻기 위한 디아민의 예로서는, 지방족계 디아민, 방향족계 디아민, 및 지환족계 디아민류를 들 수 있다. 지방족계 디아민으로서는, 직쇄상 또는 측쇄를 갖는 탄소수 3∼18의 디아민이 바람직하다. 호적한 지방족계 디아민의 예로서는, 1,3-트리메틸렌디아민, 1,4-테트라메틸렌디아민, 1,5-펜타메틸렌디아민, 1,6-헥사메틸렌디아민, 1,7-헵타메틸렌디아민, 1,8-옥타메틸렌디아민, 2-메틸-1,8-옥탄디아민, 1,9-노나메틸렌디아민, 1,10-데카메틸렌디아민, 1,11-운데칸메틸렌디아민, 1,12-도데카메틸렌디아민, 1,13-트리데카메틸렌디아민, 1,14-테트라데카메틸렌디아민, 1,15-펜타데카메틸렌디아민, 1,16-헥사데카메틸렌디아민, 1,17-헵타데카메틸렌디아민, 1,18-옥타데카메틸렌디아민, 2,2,4-트리메틸헥사메틸렌디아민, 및 2,4,4-트리메틸헥사메틸렌디아민을 들 수 있다. 이들은 단독으로 또는 2종 이상을 조합해서 사용할 수 있다.Examples of diamines for obtaining polyamide include aliphatic diamines, aromatic diamines, and alicyclic diamines. As aliphatic diamine, diamine with 3 to 18 carbon atoms having a linear or branched chain is preferable. Examples of suitable aliphatic diamines include 1,3-trimethylenediamine, 1,4-tetramethylenediamine, 1,5-pentamethylenediamine, 1,6-hexamethylenediamine, 1,7-heptamethylenediamine, 1, 8-octamethylenediamine, 2-methyl-1,8-octanediamine, 1,9-nonamethylenediamine, 1,10-decamethylenediamine, 1,11-undecanediamine, 1,12-dodecamethylenediamine , 1,13-tridecamethylenediamine, 1,14-tetradecamethylenediamine, 1,15-pentadecamethylenediamine, 1,16-hexadecamethylenediamine, 1,17-heptadecamethylenediamine, 1,18- Octadecamethylenediamine, 2,2,4-trimethylhexamethylenediamine, and 2,4,4-trimethylhexamethylenediamine. These can be used individually or in combination of two or more types.
방향족계 디아민으로서는, 페닐렌기를 갖는 탄소수 6∼27의 디아민이 바람직하다. 호적한 방향족계 디아민의 예로서는, o-페닐렌디아민, m-페닐렌디아민, p-페닐렌디아민, m-자일릴렌디아민, p-자일릴렌디아민, 3,4-디아미노디페닐에테르, 4,4'-디아미노디페닐에테르, 4,4'-디아미노디페닐메탄, 3,3'-디아미노디페닐설폰, 4,4'-디아미노디페닐설폰, 4,4'-디아미노디페닐설피드, 4,4'-디(m-아미노페녹시)디페닐설폰, 4,4'-디(p-아미노페녹시)디페닐설폰, 벤지딘, 3,3'-디아미노벤조페논, 4,4'-디아미노벤조페논, 2,2-비스(4-아미노페닐)프로판, 1,5-디아미노나프탈렌, 1,8-디아미노나프탈렌, 4,4'-비스(4-아미노페녹시)비페닐, 2,2-비스[4-(4-아미노페녹시)페닐]헥사플루오로프로판, 1,4-비스(4-아미노페녹시)벤젠, 1,3-비스(4-아미노페녹시)벤젠, 1,3-비스(3-아미노페녹시)벤젠, 1,3-비스(3-아미노페녹시)벤젠, 4,4'-디아미노-3,3'-디에틸-5,5'-디메틸디페닐메탄, 4,4'-디아미노-3,3',5,5'-테트라메틸디페닐메탄, 2,4-디아미노톨루엔, 및 2,2'-디메틸벤지딘을 들 수 있다. 이들은 단독으로 또는 2종 이상을 조합해서 사용할 수 있다.As the aromatic diamine, a diamine having 6 to 27 carbon atoms and having a phenylene group is preferable. Examples of suitable aromatic diamines include o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, m-xylylenediamine, p-xylylenediamine, 3,4-diaminodiphenyl ether, 4, 4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, 4,4'-diaminodi Phenyl sulfide, 4,4'-di(m-aminophenoxy)diphenylsulfone, 4,4'-di(p-aminophenoxy)diphenylsulfone, benzidine, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 2,2-bis(4-aminophenyl)propane, 1,5-diaminonaphthalene, 1,8-diaminonaphthalene, 4,4'-bis(4-aminophenoxy Si) Biphenyl, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-amino) Phenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 4,4'-diamino-3,3'-diethyl-5 ,5'-dimethyldiphenylmethane, 4,4'-diamino-3,3',5,5'-tetramethyldiphenylmethane, 2,4-diaminotoluene, and 2,2'-dimethylbenzidine. I can hear it. These can be used individually or in combination of two or more types.
지환족계 디아민으로서는, 시클로헥실렌기를 갖는 탄소수 4∼15의 디아민이 바람직하다. 호적한 지환족계 디아민의 예로서는, 4,4'-디아미노-디시클로헥실렌메탄, 4,4'-디아미노-디시클로헥실렌프로판, 4,4'-디아미노-3,3'-디메틸-디시클로헥실렌메탄, 1,4-디아미노시클로헥산, 및 피페라진을 들 수 있다. 이들은 단독으로 또는 2종 이상을 조합해서 사용할 수 있다.As the alicyclic diamine, a diamine having 4 to 15 carbon atoms and having a cyclohexylene group is preferable. Examples of suitable alicyclic diamines include 4,4'-diamino-dicyclohexylenemethane, 4,4'-diamino-dicyclohexylenepropane, and 4,4'-diamino-3,3'-dimethyl. -dicyclohexylenemethane, 1,4-diaminocyclohexane, and piperazine. These can be used individually or in combination of two or more types.
폴리아미드를 얻기 위한 디카르복시산으로서는, 지방족계 디카르복시산, 방향족계 디카르복시산, 및 지환족계 디카르복시산을 들 수 있다.Dicarboxylic acids for obtaining polyamide include aliphatic dicarboxylic acids, aromatic dicarboxylic acids, and alicyclic dicarboxylic acids.
지방족계 디카르복시산으로서는, 탄소 원자수 2∼18의 포화 또는 불포화의 디카르복시산이 바람직하다. 호적한 지방족계 디카르복시산의 예로서는, 옥살산, 말론산, 숙신산, 글루타르산, 아디프산, 피멜산, 수베르산, 아젤라산, 세바스산, 운데칸이산, 도데칸이산, 브라실산, 테트라데칸이산, 펜타데칸이산, 옥타데칸이산, 말레산, 및 푸마르산을 들 수 있다. 이들은 단독으로 또는 2종 이상을 조합해서 사용할 수 있다.As the aliphatic dicarboxylic acid, a saturated or unsaturated dicarboxylic acid having 2 to 18 carbon atoms is preferable. Examples of suitable aliphatic dicarboxylic acids include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, brassylic acid, and tetradecane. Examples include diacid, pentadecanedioic acid, octadecanodioic acid, maleic acid, and fumaric acid. These can be used individually or in combination of two or more types.
방향족계 디카르복시산으로서는, 페닐렌기를 갖는 탄소수 8∼15의 디카르복시산이 바람직하다. 호적한 방향족계 디카르복시산의 예로서는, 이소프탈산, 테레프탈산, 메틸테레프탈산, 비페닐-2,2'-디카르복시산, 비페닐-4,4'-디카르복시산, 디페닐메탄-4,4'-디카르복시산, 디페닐에테르-4,4'-디카르복시산, 디페닐설폰-4,4'-디카르복시산, 2,6-나프탈렌디카르복시산, 2,7-나프탈렌디카르복시산, 및 1,4-나프탈렌디카르복시산을 들 수 있다. 이들은 단독으로 또는 2종 이상을 조합해서 사용할 수 있다. 추가로, 트리멜리트산, 트리메스산, 및 피로멜리트산 등의 다가(多價) 카르복시산을, 용융 성형 가능한 범위 내에서 사용할 수도 있다.As the aromatic dicarboxylic acid, a dicarboxylic acid having 8 to 15 carbon atoms and having a phenylene group is preferable. Examples of suitable aromatic dicarboxylic acids include isophthalic acid, terephthalic acid, methyl terephthalic acid, biphenyl-2,2'-dicarboxylic acid, biphenyl-4,4'-dicarboxylic acid, and diphenylmethane-4,4'-dicarboxylic acid. , diphenyl ether-4,4'-dicarboxylic acid, diphenylsulfone-4,4'-dicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, and 1,4-naphthalenedicarboxylic acid. I can hear it. These can be used individually or in combination of two or more types. Additionally, polyvalent carboxylic acids such as trimellitic acid, trimesic acid, and pyromellitic acid can also be used within the range of melt molding.
아미노카르복시산으로서는, 탄소수 4∼18의 아미노카르복시산이 바람직하다. 호적한 아미노카르복시산의 예로서는, 4-아미노부티르산, 6-아미노헥산산, 7-아미노헵탄산, 8-아미노옥탄산, 9-아미노노난산, 10-아미노데칸산, 11-아미노운데칸산, 12-아미노도데칸산, 14-아미노테트라데칸산, 16-아미노헥사데칸산, 및 18-아미노옥타데칸산을 들 수 있다. 이들은 단독으로 또는 2종 이상을 조합해서 사용할 수 있다.As the aminocarboxylic acid, an aminocarboxylic acid having 4 to 18 carbon atoms is preferable. Examples of suitable aminocarboxylic acids include 4-aminobutyric acid, 6-aminohexanoic acid, 7-aminoheptanoic acid, 8-aminooctanoic acid, 9-aminononanoic acid, 10-aminodecanoic acid, 11-aminoundecanoic acid, and 12-aminodecanoic acid. Examples include aminododecanoic acid, 14-aminotetradecanoic acid, 16-aminohexadecanoic acid, and 18-aminooctadecanoic acid. These can be used individually or in combination of two or more types.
폴리아미드를 얻기 위한 락탐으로서는, 예를 들면, ε-카프로락탐, ω-라우로락탐, ζ-에난토락탐, 및 η-카프릴락탐을 들 수 있다. 이들은 단독으로 또는 2종 이상을 조합해서 사용할 수 있다.Examples of lactams for obtaining polyamide include ε-caprolactam, ω-laurolactam, ζ-enantholactam, and η-capryllactam. These can be used individually or in combination of two or more types.
바람직한 폴리아미드의 원료의 조합으로서는, ε-카프로락탐(나일론6), 1,6-헥사메틸렌디아민/아디프산(나일론6,6), 1,4-테트라메틸렌디아민/아디프산(나일론4,6), 1,6-헥사메틸렌디아민/테레프탈산, 1,6-헥사메틸렌디아민/테레프탈산/ε-카프로락탐, 1,6-헥사메틸렌디아민/테레프탈산/아디프산, 1,9-노나메틸렌디아민/테레프탈산, 1,9-노나메틸렌디아민/테레프탈산/ε-카프로락탐, 1,9-노나메틸렌디아민/1,6-헥사메틸렌디아민/테레프탈산/아디프산, 및 m-자일릴렌디아민/아디프산을 들 수 있다. 이들 중에서도, 1,4-테트라메틸렌디아민/아디프산(나일론4,6), 1,6-헥사메틸렌디아민/테레프탈산/ε-카프로락탐, 1,6-헥사메틸렌디아민/테레프탈산/아디프산, 1,9-노나메틸렌디아민/테레프탈산, 1,9-노나메틸렌디아민/테레프탈산/ε-카프로락탐, 또는 1,9-노나메틸렌디아민/1,6-헥사메틸렌디아민/테레프탈산/아디프산으로부터 얻어지는 폴리아미드 수지가 더 바람직하다.Preferred combinations of polyamide raw materials include ε-caprolactam (nylon 6), 1,6-hexamethylenediamine/adipic acid (nylon 6,6), and 1,4-tetramethylenediamine/adipic acid (nylon 4). ,6), 1,6-hexamethylenediamine/terephthalic acid, 1,6-hexamethylenediamine/terephthalic acid/ε-caprolactam, 1,6-hexamethylenediamine/terephthalic acid/adipic acid, 1,9-nonamethylenediamine /terephthalic acid, 1,9-nonamethylenediamine/terephthalic acid/ε-caprolactam, 1,9-nonamethylenediamine/1,6-hexamethylenediamine/terephthalic acid/adipic acid, and m-xylylenediamine/adipic acid. can be mentioned. Among these, 1,4-tetramethylenediamine/adipic acid (nylon 4,6), 1,6-hexamethylenediamine/terephthalic acid/ε-caprolactam, 1,6-hexamethylenediamine/terephthalic acid/adipic acid, Poly obtained from 1,9-nonamethylenediamine/terephthalic acid, 1,9-nonamethylenediamine/terephthalic acid/ε-caprolactam, or 1,9-nonamethylenediamine/1,6-hexamethylenediamine/terephthalic acid/adipic acid Amide resins are more preferred.
열가소성 수지의 함유량은, 폴리아릴렌설피드 수지 100질량부에 대해서, 바람직하게는 1∼300질량부의 범위이며, 보다 바람직하게는 3∼100질량부의 범위이고, 더 바람직하게는 5∼45질량부의 범위이다. 폴리아릴렌설피드 수지 이외의 열가소성 수지의 함유량이 이러한 범위에 있음에 의해, 내열성, 내약품성 및 기계적 물성의 추가적인 향상이라는 효과가 얻어진다.The content of the thermoplastic resin is preferably in the range of 1 to 300 parts by mass, more preferably in the range of 3 to 100 parts by mass, and even more preferably in the range of 5 to 45 parts by mass, based on 100 parts by mass of the polyarylene sulfide resin. am. When the content of thermoplastic resin other than polyarylene sulfide resin is within this range, the effect of further improvement in heat resistance, chemical resistance, and mechanical properties is obtained.
폴리아릴렌설피드 수지 조성물에 배합되는 엘라스토머로서는, 열가소성 엘라스토머가 사용되는 경우가 많다. 열가소성 엘라스토머로서는, 예를 들면, 폴리올레핀계 엘라스토머, 불소계 엘라스토머 및 실리콘계 엘라스토머를 들 수 있다. 또, 본 명세서에 있어서, 열가소성 엘라스토머는, 상기 열가소성 수지가 아닌 엘라스토머로 분류된다.As an elastomer to be blended in a polyarylene sulfide resin composition, a thermoplastic elastomer is often used. Examples of thermoplastic elastomers include polyolefin-based elastomers, fluorine-based elastomers, and silicone-based elastomers. In addition, in this specification, thermoplastic elastomers are classified as elastomers other than the above-described thermoplastic resins.
엘라스토머(특히 열가소성 엘라스토머)는, 히드록시기, 아미노기, 카르복시기 및 카르복시기의 염으로 이루어지는 군에서 선택되는 적어도 1종의 기와 반응할 수 있는 관능기를 갖는 것이 바람직하다. 이에 따라, 접착성 및 내충격성 등의 점에서 특히 우수하며, 또한 가열에 의한 가스 발생량을 억제할 수 있는 수지 조성물을 얻을 수 있다. 이러한 관능기로서는, 에폭시기, 아미노기, 수산기, 카르복시기, 메르캅토기, 이소시아네이트기, 옥사졸린기, 및, 식 : R(CO)O(CO)- 또는 R(CO)O-(식 중, R은 탄소 원자수 1∼8의 알킬기를 나타낸다)으로 표시되는 기를 들 수 있다. 이러한 관능기를 갖는 열가소성 엘라스토머는, 예를 들면, α-올레핀과 상기 관능기를 갖는 비닐 중합성 화합물과의 공중합에 의해 얻을 수 있다. α-올레핀은, 예를 들면, 에틸렌, 프로필렌 및 부텐-1 등의 탄소수 2∼8의 α-올레핀류를 들 수 있다. 상기 관능기를 갖는 비닐 중합성 화합물로서는, 예를 들면, (메타)아크릴산 및 (메타)아크릴산에스테르 등의 α,β-불포화카르복시산 및 그 알킬에스테르, 말레산, 푸마르산, 이타콘산 및 그 밖의 탄소수 4∼10의 α,β-불포화디카르복시산 및 그 유도체(모노 또는 디에스테르, 및 그 산무수물 등), 그리고 글리시딜(메타)아크릴레이트 등을 들 수 있다. 이들 중에서도, 에폭시기, 카르복시기, 및, 식 : R(CO)O(CO)- 또는 R(CO)O-(식 중, R은 탄소 원자수 1∼8의 알킬기를 나타낸다)으로 표시되는 기로 이루어지는 군에서 선택되는 적어도 1종의 관능기를 갖는 에틸렌-프로필렌 공중합체 및 에틸렌-부텐 공중합체가, 인성(靭性) 및 내충격성의 향상의 점에서 바람직하다.The elastomer (particularly the thermoplastic elastomer) preferably has a functional group capable of reacting with at least one group selected from the group consisting of a hydroxy group, an amino group, a carboxyl group, and a salt of a carboxyl group. Accordingly, it is possible to obtain a resin composition that is particularly excellent in terms of adhesiveness and impact resistance, and can also suppress the amount of gas generated by heating. Such functional groups include epoxy group, amino group, hydroxyl group, carboxyl group, mercapto group, isocyanate group, oxazoline group, and formula: R(CO)O(CO)- or R(CO)O- (wherein R is carbon A group represented by (represents an alkyl group having 1 to 8 atoms) can be mentioned. A thermoplastic elastomer having such a functional group can be obtained, for example, by copolymerization of an α-olefin and a vinyl polymerizable compound having the above functional group. Examples of the α-olefin include α-olefins having 2 to 8 carbon atoms, such as ethylene, propylene, and butene-1. Examples of vinyl polymerizable compounds having the above functional group include α,β-unsaturated carboxylic acids and alkyl esters thereof such as (meth)acrylic acid and (meth)acrylic acid ester, maleic acid, fumaric acid, itaconic acid, and other carbon atoms of 4 to 4. Examples include α,β-unsaturated dicarboxylic acid and its derivatives (mono or diester, acid anhydride, etc.) of 10, and glycidyl (meth)acrylate. Among these, a group consisting of an epoxy group, a carboxyl group, and a group represented by the formula: R(CO)O(CO)- or R(CO)O- (wherein R represents an alkyl group having 1 to 8 carbon atoms) Ethylene-propylene copolymers and ethylene-butene copolymers having at least one functional group selected from the above are preferred in terms of improving toughness and impact resistance.
엘라스토머의 함유량은, 그 종류, 용도에 따라 다르기 때문에 일률적으로 규정할 수 없지만, 예를 들면, 폴리아릴렌설피드 수지 100질량부에 대해서 바람직하게는 1∼300질량부의 범위이며, 보다 바람직하게는 3∼100질량부의 범위이고, 더 바람직하게는 5∼45질량부의 범위이다. 엘라스토머의 함유량이 이러한 범위에 있음에 의해, 성형품의 내열성, 인성의 확보의 점에서 한층 더 우수한 효과가 얻어진다.The content of the elastomer cannot be uniformly specified because it varies depending on the type and application, but for example, it is preferably in the range of 1 to 300 parts by mass, more preferably 3 parts by mass, per 100 parts by mass of the polyarylene sulfide resin. It is in the range of -100 parts by mass, more preferably in the range of 5 to 45 parts by mass. When the elastomer content is within this range, an even more excellent effect is obtained in terms of ensuring the heat resistance and toughness of the molded product.
폴리아릴렌설피드 수지 조성물에 배합되는 가교성 수지는, 2 이상의 가교성 관능기를 갖는다. 가교성 관능기로서는, 에폭시기, 페놀성수산기, 아미노기, 아미드기, 카르복시기, 산무수물기, 및 이소시아네이트기 등을 들 수 있다. 가교성 수지로서는, 예를 들면, 에폭시 수지, 페놀 수지, 및 우레탄 수지를 들 수 있다.The crosslinkable resin blended with the polyarylene sulfide resin composition has two or more crosslinkable functional groups. Examples of the crosslinkable functional group include an epoxy group, phenolic hydroxyl group, amino group, amide group, carboxyl group, acid anhydride group, and isocyanate group. Examples of crosslinkable resins include epoxy resins, phenol resins, and urethane resins.
에폭시 수지로서는, 방향족계 에폭시 수지가 바람직하다. 방향족계 에폭시 수지는, 할로겐기 또는 수산기 등을 갖고 있어도 된다. 호적한 방향족계 에폭시 수지의 예로서는, 비스페놀A형 에폭시 수지, 비스페놀F형 에폭시 수지, 비스페놀S형 에폭시 수지, 비페닐형 에폭시 수지, 테트라메틸비페닐형 에폭시 수지, 페놀노볼락형 에폭시 수지, 크레졸노볼락형 에폭시 수지, 비스페놀A노볼락형 에폭시 수지, 트리페닐메탄형 에폭시 수지, 테트라페닐에탄형 에폭시 수지, 디시클로펜타디엔-페놀 부가 반응형 에폭시 수지, 페놀아랄킬형 에폭시 수지, 나프톨노볼락형 에폭시 수지, 나프톨아랄킬형 에폭시 수지, 나프톨-페놀 공축 노볼락형 에폭시 수지, 나프톨-크레졸 공축 노볼락형 에폭시 수지, 방향족 탄화수소 포름알데히드 수지 변성 페놀 수지형 에폭시 수지, 및 비페닐노볼락형 에폭시 수지를 들 수 있다. 이들 방향족계 에폭시 수지는, 단독으로 또는 2종 이상을 조합해서 사용할 수 있다. 이들 방향족계 에폭시 수지 중에서도 특히, 다른 수지 성분과의 상용성(相溶性)이 우수한 점에서, 노볼락형 에폭시 수지가 바람직하며, 크레졸노볼락형 에폭시 수지가 보다 바람직하다.As the epoxy resin, an aromatic epoxy resin is preferable. The aromatic epoxy resin may have a halogen group, a hydroxyl group, or the like. Examples of suitable aromatic epoxy resins include bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, biphenyl-type epoxy resin, tetramethylbiphenyl-type epoxy resin, phenol novolac-type epoxy resin, and cresolano. Rock-type epoxy resin, bisphenol A novolak-type epoxy resin, triphenylmethane-type epoxy resin, tetraphenylethane-type epoxy resin, dicyclopentadiene-phenol addition reaction type epoxy resin, phenol aralkyl-type epoxy resin, naphthol novolak-type epoxy. Resin, naphthol aralkyl type epoxy resin, naphthol-phenol coaxial novolak type epoxy resin, naphthol-cresol coaxial novolak type epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenol resin type epoxy resin, and biphenyl novolak type epoxy resin. You can. These aromatic epoxy resins can be used individually or in combination of two or more types. Among these aromatic epoxy resins, novolak-type epoxy resins are preferable, and cresol novolak-type epoxy resins are more preferable because they have excellent compatibility with other resin components.
가교성 수지의 함유량은, 폴리아릴렌설피드 수지 100질량부에 대해서, 바람직하게는 1∼300질량부의 범위이며, 보다 바람직하게는 3∼100질량부의 범위이고, 더 바람직하게는 5∼30질량부의 범위이다. 가교성 수지의 함유량이 이러한 범위에 있음에 의해, 성형품의 강성 및 내열성의 향상이라는 효과가 특히 현저하게 얻어진다.The content of the crosslinkable resin is preferably in the range of 1 to 300 parts by mass, more preferably in the range of 3 to 100 parts by mass, and still more preferably 5 to 30 parts by mass, based on 100 parts by mass of the polyarylene sulfide resin. It is a range. When the content of the crosslinkable resin is within this range, the effect of improving the rigidity and heat resistance of the molded product is particularly significantly achieved.
폴리아릴렌설피드 수지 조성물은, 히드록시기, 아미노기, 카르복시기 및 카르복시기의 염으로 이루어지는 군에서 선택되는 적어도 1종의 기와 반응할 수 있는 관능기를 갖는 실란 화합물을 함유할 수 있다. 이에 따라, 폴리아릴렌설피드 수지와 다른 성분과의 상용성을 향상하며, 또한, 가열에 의한 가스 발생량을 억제할 수 있는 수지 조성물을 얻을 수 있다. 이러한 실란 화합물로서는, 예를 들면, γ-글리시독시프로필트리메톡시실란, γ-글리시독시프로필트리에톡시실란, β-(3,4-에폭시시클로헥실)에틸트리메톡시실란, γ-글리시독시프로필메틸디에톡시실란 및 γ-글리시독시프로필메틸디메톡시실란 등의 실란커플링제를 들 수 있다.The polyarylene sulfide resin composition may contain a silane compound having a functional group capable of reacting with at least one group selected from the group consisting of a hydroxy group, an amino group, a carboxyl group, and a salt of a carboxyl group. Accordingly, it is possible to obtain a resin composition that improves the compatibility of the polyarylene sulfide resin with other components and can suppress the amount of gas generated by heating. Examples of such silane compounds include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and γ- Silane coupling agents such as glycidoxypropylmethyldiethoxysilane and γ-glycidoxypropylmethyldimethoxysilane can be mentioned.
실란 화합물의 함유량은, 예를 들면, 폴리아릴렌설피드 수지 100질량부에 대해서 0.01∼10질량부의 범위인 것이 바람직하며, 0.1∼5질량부의 범위인 것이 보다 더 바람직하다. 실란 화합물의 함유량이 이러한 범위에 있음에 의해, 폴리아릴렌설피드 수지와 상기 다른 성분과의 상용성 향상이라는 효과가 얻어진다.For example, the content of the silane compound is preferably in the range of 0.01 to 10 parts by mass, and more preferably in the range of 0.1 to 5 parts by mass, based on 100 parts by mass of the polyarylene sulfide resin. When the content of the silane compound is within this range, the effect of improving compatibility between the polyarylene sulfide resin and the other components mentioned above is obtained.
본 실시형태에 따른 폴리아릴렌설피드 수지 조성물은, 이형제(離型劑), 착색제, 내열안정제, 자외선안정제, 발포제, 방청제, 난연제 및 활제(滑劑) 등의 그 밖의 첨가제를 함유해도 된다. 첨가제의 함유량은, 예를 들면, 폴리아릴렌설피드 수지 100질량부에 대해서, 1∼10질량부의 범위인 것이 바람직하다.The polyarylene sulfide resin composition according to the present embodiment may contain other additives such as a mold release agent, colorant, heat stabilizer, ultraviolet stabilizer, foaming agent, rust inhibitor, flame retardant, and lubricant. The content of the additive is preferably in the range of 1 to 10 parts by mass, for example, with respect to 100 parts by mass of the polyarylene sulfide resin.
폴리아릴렌설피드 수지 조성물은, 상기 방법에 의해 얻어진 폴리아릴렌설피드 수지와, 상기 다른 성분을 용융 혼련하는 방법에 의해, 예를 들면, 펠렛상의 컴파운드 등의 형태로 얻을 수 있다. 용융 혼련의 온도는, 예를 들면, 250∼350℃의 범위인 것이 바람직하며, 290∼330℃의 범위인 것이 보다 더 바람직하다. 용융 혼련은, 2축 압출기 등을 사용해서 행할 수 있다.The polyarylene sulfide resin composition can be obtained in the form of, for example, a pellet-like compound by melt-kneading the polyarylene sulfide resin obtained by the above method and the other components above. The temperature of melt kneading is preferably, for example, in the range of 250 to 350°C, and more preferably in the range of 290 to 330°C. Melt kneading can be performed using a twin screw extruder or the like.
본 실시형태에 따른 폴리아릴렌설피드 수지 조성물은, 단독으로 또는 상기 다른 성분 등의 재료와 조합해서, 사출 성형, 압출 성형, 압축 성형 및 블로우 성형과 같은 각종 용융 가공법에 의해, 내열성, 성형 가공성, 치수 안정성 등이 우수한 성형품으로 가공할 수 있다. 본 실시형태에 따른 폴리아릴렌설피드 수지 조성물은, 가열되었을 때의 가스 발생량이 적으므로, 고품질의 성형품의 용이한 제조를 가능케 한다.The polyarylene sulfide resin composition according to the present embodiment, alone or in combination with materials such as the other components, is subjected to various melt processing methods such as injection molding, extrusion molding, compression molding, and blow molding, and has heat resistance, molding processability, It can be processed into molded products with excellent dimensional stability. The polyarylene sulfide resin composition according to the present embodiment generates a small amount of gas when heated, enabling easy production of high-quality molded articles.
본 실시형태에 따른 폴리아릴렌설피드 수지 조성물을 전기 자동차 부품에 사용하면, 가열에 의한 가스 발생량을 저감시킬 수 있다. 이 때문에, 가스 성분인 황 원자를 함유하는 저분자량 화합물과 구리 등의 금속 재료와의 접촉을 저감할 수 있고, 그 결과, 높은 전압이 반복해 인가된 경우여도 양자의 반응을 억제할 수 있어, 트리(수지상의 파괴 흔적)의 발생이나 진전을 억제해서, 내트래킹성을 향상시키는 것이 가능해진다.When the polyarylene sulfide resin composition according to this embodiment is used for electric vehicle parts, the amount of gas generated by heating can be reduced. For this reason, it is possible to reduce the contact between low molecular weight compounds containing sulfur atoms, which are gas components, and metal materials such as copper, and as a result, even when high voltages are repeatedly applied, the reaction between the two can be suppressed. It is possible to improve tracking resistance by suppressing the occurrence and growth of trees (marks of dendritic destruction).
이렇게, 본 발명의 폴리아릴렌설피드 수지 조성물은, 리튬이온 이차전지를 구비하며, 특히 높은 안전성이 요구되는 하이브리드 자동차(HV)나 전기 자동차(EV)라는 전기 자동차 분야에 호적하게 사용할 수 있다. 따라서, 본 발명의 폴리아릴렌설피드 수지 조성물을 성형해서 얻어지는 전기 자동차 부품은, 예를 들면, 파워 모듈, 컨버터, 콘덴서, 인슐레이터, 모터 단자대, 배터리, 전동 컴프레서, 배터리 전류 센서, 정크션 블록 등을 수납하는 케이스를 들 수 있다. 당해 성형품은, 특히 DLI 시스템의 이그니션 코일용 케이스로서 호적하게 사용된다.In this way, the polyarylene sulfide resin composition of the present invention has a lithium ion secondary battery and can be suitably used in the field of electric vehicles such as hybrid vehicles (HV) and electric vehicles (EV), which require particularly high safety. Therefore, electric vehicle parts obtained by molding the polyarylene sulfide resin composition of the present invention include, for example, power modules, converters, condensers, insulators, motor terminal blocks, batteries, electric compressors, battery current sensors, junction blocks, etc. There is a case for storing it. The molded article is particularly suitably used as a case for an ignition coil of a DLI system.
[실시예][Example]
이하, 실시예를 들어 본 발명에 대하여 더 구체적으로 설명한다. 단, 본 발명은 이들 실시예로 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail through examples. However, the present invention is not limited to these examples.
1. 평가법1. Evaluation method
[굽힘 특성][Bending characteristics]
·준거 시험 방법…ASTM D-790· Standard test method… ASTM D-790
·시험편…3.2㎜(두께)×12.7㎜(폭)×127㎜(길이)·Test piece… 3.2 mm (thickness) × 12.7 mm (width) × 127 mm (length)
·시험 결과…시험수 n=10의 평균값·Test result… Average value of number of tests n=10
[내열수성][Hot water resistance]
시험편을 95℃의 열수에 침지하고, 굽힘 강도의 경간(經時) 변화를 조사했다.The test piece was immersed in hot water at 95°C, and the change in bending strength over time was examined.
·시험편…3.2㎜(두께)×12.7㎜(폭)×127㎜(길이)·Test piece… 3.2 mm (thickness) × 12.7 mm (width) × 127 mm (length)
·굽힘 강도의 시험 방법…ASTM D-790·Bending strength test method… ASTM D-790
·평가 항목…1000시간, 3000시간 후의 굽힘 강도의 초기 강도에 대한 유지율·Evaluation items… Retention rate of bending strength relative to initial strength after 1000 hours and 3000 hours
·시험 결과…시험수 n=5의 평균값·Test result… Average value of number of tests n=5
[금속 밀착 강도][Metal adhesion strength]
금형에 세팅한 4×10×49㎜의 금속편(SUS304)에, 같은 치수만큼의 폴리아릴렌설피드 수지 조성물을 사출, 성형한 것에 대하여, 척간 20㎜, 인장 속도 1㎜/min의 조건에서 인장 시험을 실시해, 금속 밀착 강도를 측정했다.A polyarylene sulfide resin composition of the same size was injected and molded on a 4 × 10 × 49 mm metal piece (SUS304) set in a mold, and a tensile test was performed under the conditions of a chuck spacing of 20 mm and a tensile speed of 1 mm/min. was performed to measure the metal adhesion strength.
[에폭시 밀착 강도][Epoxy adhesion strength]
3㎜(두께)×25㎜(폭)×75㎜(길이)의 시험편을 성형하고, 시험편 상에 접착 면적 25㎜×10㎜로 되도록 에폭시 수지(주제(主劑) : 에피크론850(DIC제)/ 실리카(충전율 50질량%), 경화제 : 무수 헥사히드로프탈산, 주제/경화제=100/30(질량비))를 두께 40∼50㎛로 도포했다. 이들을 클립으로 고정 후, 85℃에서 3시간, 다음으로 150℃에서 3시간 가열하고, 추가로 서냉(徐冷)시킴에 의해서 에폭시 수지를 경화시켰다. 그 후, 5㎜/분의 인장 속도로 인장 전단 강도를 측정해, 실하중(實荷重)을 기록했다.A test piece of 3 mm (thickness) )/Silica (filling rate of 50 mass%), curing agent: hexahydrophthalic anhydride, base/curing agent = 100/30 (mass ratio)) was applied to a thickness of 40 to 50 ㎛. After fixing these with clips, the epoxy resin was cured by heating at 85°C for 3 hours, then at 150°C for 3 hours, and further slowly cooling. After that, the tensile shear strength was measured at a tensile speed of 5 mm/min, and the actual load was recorded.
[캐비티 밸런스][cavity balance]
40개분의 캐비티를 갖는 와셔 금형을 사용해, 일차 스풀에 가장 가까운 위치의 캐비티(C1)가 완전히 충전되는 최저한의 성형 조건에서 PPS 컴파운드를 사출 성형했다. 성형 조건은 75톤 성형기, 실린더 온도 320℃, 금형 온도 140℃, 보압(保壓) 없음으로 했다.Using a washer mold with 40 cavities, PPS compound was injection molded under the minimum molding conditions such that the cavity (C1) closest to the primary spool was completely filled. The molding conditions were a 75-ton molding machine, cylinder temperature of 320°C, mold temperature of 140°C, and no holding pressure.
성형 후의, 캐비티(C1)와 같은 러너에 있는 일차 스풀로부터 가장 먼 캐비티(C10)의 충전도를 비교했다. 충전도(질량%)는, 캐비티(C1)의 성형품에 대한, 캐비티(C10)의 성형품의 질량비로부터 구했다. 캐비티(C10)의 충전도가 높을수록, 캐비티 밸런스가 우수하다고 할 수 있다. 충전도에 의거해서, 각 조성물의 캐비티 밸런스를 이하의 기준으로 판정했다.After forming, the filling degree of the cavity (C1) and the cavity (C10) furthest from the primary spool on the same runner were compared. The degree of filling (% by mass) was obtained from the mass ratio of the molded article in the cavity (C10) to the molded article in the cavity (C1). It can be said that the higher the filling degree of the cavity (C10), the better the cavity balance. Based on the degree of filling, the cavity balance of each composition was determined based on the following standards.
AA : 100∼90질량%의 범위AA: range from 100 to 90 mass%
A : 89∼80질량%의 범위A: Range of 89 to 80 mass%
B : 79∼70질량%의 범위B: range of 79 to 70 mass%
C : 69∼60질량%의 범위C: range of 69 to 60 mass%
D : 59%질량 이하의 범위D: Range below 59% mass
[가스 발생량][Gas generation amount]
가스 크로마토그래프 질량 분석 장치를 사용해서, 폴리아릴렌설피드 수지 또는 수지 조성물의 소정량의 샘플을 325℃에서 15분간 가열해, 그때의 가스 발생량을 질량%로서 정량했다.Using a gas chromatograph mass spectrometer, a predetermined sample of polyarylene sulfide resin or resin composition was heated at 325°C for 15 minutes, and the amount of gas generated at that time was quantified as mass%.
[내트래킹성][Tracking resistance]
2㎜(두께)×50㎜(폭)×100㎜(길이)의 시험편을 성형해, ASTM D3638에 준거한 방법으로, 수지 유동 방향을 따라 측정하고, 파괴 전압과 적하수를 플롯해, 50적(滴)의 전압을 판독했다.A test piece of 2 mm (thickness) x 50 mm (width) x 100 mm (length) was formed, measured along the resin flow direction using a method based on ASTM D3638, the breakdown voltage and drop number were plotted, and The voltage of (滴) was read.
2. 폴리페닐렌설피드 수지(PPS 수지)의 합성2. Synthesis of polyphenylene sulfide resin (PPS resin)
(합성예 1 : PPS-1의 합성)(Synthesis Example 1: Synthesis of PPS-1)
p-디요오도벤젠(도쿄가세이가부시키가이샤, p-디요오도벤젠 순도 98.0% 이상) 300.0g, 고체 황(간토가가쿠가부시키가이샤제, 황(분말)) 27.00g, 4,4'-디티오비스벤조산(와코준야쿠고교가부시키가이샤제, 4,4'-디티오비스벤조산, Technical Grade) 2.0g을 180℃로 가열해서 그들을 질소 하에서 용해, 혼합했다. 다음으로 220℃로 승온하고, 절대압 26.6㎪까지 감압했다. 얻어진 용융 혼합물을, 320℃이며 절대압 133㎩로 되도록, 단계적으로 온도와 압력 변화시켜서, 8시간 용융 중합했다. 반응 종료 후, NMP 200g을 가해서, 220℃에서 가열 교반해, 얻어진 용해물을 여과했다. 여과 후의 용해물에 NMP 320g을 가해, 케이크 세정 여과를 행했다. 얻어진 NMP를 함유하는 케이크에 이온 교환수 1ℓ를 가해, 오토클레이브 중에서 200℃ 10분간 교반했다. 다음으로 케이크를 여과하고, 여과 후의 케이크에 70℃의 이온 교환수 1ℓ를 가해 케이크 세정을 행했다. 얻어진 함수 케이크에 이온 교환수 1ℓ를 가해서 10분간 교반했다. 다음으로 케이크를 여과하고, 여과 후의 케이크에 70℃의 이온 교환수 1ℓ를 가해 케이크 세정을 행했다. 이 조작을 다시 한번 반복한 후, 케이크를 120℃에서 4시간 건조해, PPS 수지(PPS-1) 91g을 얻었다.p-diiodobenzene (Tokyo Chemical Co., Ltd., p-diiodobenzene purity 98.0% or more) 300.0 g, solid sulfur (manufactured by Kanto Chemical Co., Ltd., sulfur (powder)) 27.00 g, 4 , 2.0 g of 4'-dithiobisbenzoic acid (manufactured by Wako Pure Chemical Industries, Ltd., 4,4'-dithiobisbenzoic acid, Technical Grade) was heated to 180°C and dissolved and mixed under nitrogen. Next, the temperature was raised to 220°C, and the pressure was reduced to an absolute pressure of 26.6 kPa. The obtained molten mixture was melt-polymerized for 8 hours by gradually changing the temperature and pressure so that the temperature was 320°C and the absolute pressure was 133 Pa. After completion of the reaction, 200 g of NMP was added, heated and stirred at 220°C, and the obtained melt was filtered. 320 g of NMP was added to the dissolved substance after filtration, and cake washing filtration was performed. 1 L of ion-exchanged water was added to the obtained cake containing NMP, and the mixture was stirred at 200°C for 10 minutes in an autoclave. Next, the cake was filtered, and 1 liter of 70°C ion-exchanged water was added to the filtered cake to wash the cake. 1 L of ion-exchanged water was added to the obtained water-containing cake and stirred for 10 minutes. Next, the cake was filtered, and 1 liter of 70°C ion-exchanged water was added to the filtered cake to wash the cake. After repeating this operation once again, the cake was dried at 120°C for 4 hours to obtain 91 g of PPS resin (PPS-1).
(합성예 2 : PPS-2의 합성)(Synthesis Example 2: Synthesis of PPS-2)
「4,4'-디티오비스벤조산」 대신에 「2-요오도아닐린(도쿄가세이가부시키가이샤제)」을 사용한 것 이외는 합성예 1과 마찬가지로 해서, PPS 수지(PPS-2) 91g을 얻었다.91 g of PPS resin (PPS-2) was prepared in the same manner as in Synthesis Example 1 except that “2-iodoaniline (manufactured by Tokyo Chemical Industry Co., Ltd.)” was used instead of “4,4’-dithiobisbenzoic acid.” got it
(합성예 3 : PPS-3의 합성)(Synthesis Example 3: Synthesis of PPS-3)
「4,4'-디티오비스벤조산」 대신에 「디페닐디설피드(스미토모세이카가부시키가이샤, DPDS)」를 사용한 것 이외는 합성예 1과 마찬가지로 해서 PPS 수지(PPS-3) 91g을 얻었다.91 g of PPS resin (PPS-3) was obtained in the same manner as in Synthesis Example 1 except that “diphenyl disulfide (Sumitomo Seika Co., Ltd., DPDS)” was used instead of “4,4’-dithiobisbenzoic acid.”
(합성예 4 : PPS-4의 합성)(Synthesis Example 4: Synthesis of PPS-4)
2ℓ의 오토클레이브에 N-메틸피롤리돈 600g과 황화나트륨5수염 336.3g(2.0mol)을 투입하고, 질소 분위기 하, 200℃까지 승온함에 의해 물-NMP 혼합물을 증류 제거했다. 다음으로 이 계에, p-디클로로벤젠 292.53g(1.99mol)과 2,5-디클로로아닐린 1.62g(0.01mol)을 NMP 230g에 녹인 용액을 첨가하고, 220℃에서 5시간, 추가로 240℃에서 2시간, 질소 분위기 하에서 반응시켰다. 반응 용기로부터 냉각 후 내용물을 취출하고, 일부를 샘플링해, 미반응 2,5-디클로로아닐린을 가스 크로마토그래프로 정량했다. 또한 나머지의 슬러리는 열수로 몇 회 세정해, 폴리머 케이크를 여과 분별했다. 이 케이크를 80℃ 감압 건조해, 분말의 아미노기 함유 폴리페닐렌설피드(PPS-4)를 얻었다.600 g of N-methylpyrrolidone and 336.3 g (2.0 mol) of sodium sulfide pentahydrate were added to a 2-liter autoclave, and the water-NMP mixture was distilled off by raising the temperature to 200°C in a nitrogen atmosphere. Next, a solution of 292.53 g (1.99 mol) of p-dichlorobenzene and 1.62 g (0.01 mol) of 2,5-dichloroaniline dissolved in 230 g of NMP was added to this system, incubated at 220°C for 5 hours, and further at 240°C. The reaction was performed under nitrogen atmosphere for 2 hours. After cooling, the contents were taken out from the reaction vessel, a portion was sampled, and unreacted 2,5-dichloroaniline was quantified using a gas chromatograph. Additionally, the remaining slurry was washed several times with hot water, and the polymer cake was separated by filtration. This cake was dried under reduced pressure at 80°C to obtain powdered amino group-containing polyphenylene sulfide (PPS-4).
합성예 1∼4에서 얻어진 PPS-1∼PPS-4의 성상을 표 1에 나타낸다.The properties of PPS-1 to PPS-4 obtained in Synthesis Examples 1 to 4 are shown in Table 1.
[표 1] [Table 1]
[원료][Raw material]
PPS 수지 조성물을 조제하기 위해, 이하의 재료를 준비했다.To prepare the PPS resin composition, the following materials were prepared.
(열가소성 엘라스토머)(thermoplastic elastomer)
ELA : 에틸렌/글리시딜메타크릴산(3질량%)/아크릴산메틸(27질량%)의 공중합체(스미토모가가쿠고교샤제, 「본드패스트 7L」)ELA: Copolymer of ethylene/glycidyl methacrylic acid (3% by mass)/methyl acrylate (27% by mass) (Sumitomo Chemical Co., Ltd., “Bondfast 7L”)
(실란커플링제)(Silane coupling agent)
에폭시실란 : γ-글리시독시프로필트리메톡시실란Epoxysilane: γ-glycidoxypropyltrimethoxysilane
(무기질 충전제)(Inorganic filler)
GF : 유리 섬유 초프드 스트랜드(chopped strand)(섬유 직경 10㎛, 길이 3㎜)GF: Glass fiber chopped strand (fiber diameter 10㎛, length 3㎜)
[컴파운드의 제작과 평가][Production and evaluation of compounds]
표 2에 나타내는 배합 조성으로 각 원료를 텀블러에 의해서 균일하게 혼합한 후, 2축 혼련 압출기(TEM-35B, 도시바기카이)를 사용해 300℃에서 용융 혼련해, 펠렛상의 컴파운드를 얻었다. 얻어진 컴파운드를 실린더 온도 300℃, 금형 온도 140℃의 조건에서 사출 성형하고, 굽힘 특성, 금속 밀착 강도, 캐비티 밸런스 및 내열수성 시험에 사용하는 시험편을 제작해, 각종 평가를 행했다. 또한, PPS 수지 단체 및 컴파운드에 대하여, 가스 발생량을 측정했다. 평가 결과를 표 2에 나타낸다.After mixing each raw material uniformly with a tumbler with the composition shown in Table 2, it was melt-kneaded at 300°C using a twin-screw kneading extruder (TEM-35B, Toshibagikai) to obtain a pellet-shaped compound. The obtained compound was injection molded under the conditions of a cylinder temperature of 300°C and a mold temperature of 140°C, and test pieces used for bending properties, metal adhesion strength, cavity balance, and hot water resistance tests were produced and various evaluations were performed. Additionally, the amount of gas generated was measured for the PPS resin alone and the compound. The evaluation results are shown in Table 2.
[표 2] [Table 2]
표 2에 나타나는 결과로부터 명확한 바와 같이, PPS-1, PPS-2 및 PPS-3은, 기계 특성(굽힘 강도, 굽힘 파단 신장), 금속 밀착 강도, 에폭시 밀착 강도, 캐비티 밸런스, 내열수성, 가스 발생량, 내트래킹성의 점에서, PPS-4보다도 우수했다.As is clear from the results shown in Table 2, PPS-1, PPS-2, and PPS-3 have mechanical properties (bending strength, bending elongation at break), metal adhesion strength, epoxy adhesion strength, cavity balance, hot water resistance, and gas generation amount. , In terms of tracking resistance, it was superior to PPS-4.
Claims (10)
무기질 충전제, 상기 폴리아릴렌설피드 수지 이외의 열가소성 수지, 엘라스토머, 및 2 이상의 가교성 관능기를 갖는 가교성 수지로 이루어지는 군에서 선택되는, 적어도 1종의 다른 성분
을 함유하는, 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물로서,
상기 폴리아릴렌설피드 수지가, 디요오도 방향족 화합물과, 단체(單體) 황과, 중합금지제를, 상기 디요오도 방향족 화합물, 상기 단체 황 및 상기 중합금지제를 포함하는 용융 혼합물 중에서 반응시키는 것을 포함하는 방법에 의해 얻을 수 있는 것이며,
상기 폴리아릴렌설피드 수지가, 상기 중합금지제에 유래하는 카르복시기 및 카르복시기의 염으로 이루어지는 군에서 선택되는 적어도 1종의 기를 갖는 것이며,
상기 폴리아릴렌설피드 수지가, 0.80∼1.70의 Mw/Mtop를 갖고, 상기 Mw 및 Mtop는 각각 겔침투 크로마토그래피에 의해 측정되는 중량 평균 분자량 및 피크 분자량이며,
상기 수지 조성물은 펠렛 상인
전기 자동차 부품용 폴리아릴렌설피드 수지 조성물.Polyarylene sulfide resin,
At least one other component selected from the group consisting of an inorganic filler, a thermoplastic resin other than the polyarylene sulfide resin, an elastomer, and a crosslinkable resin having two or more crosslinkable functional groups.
A polyarylene sulfide resin composition for electric vehicle parts containing,
The polyarylene sulfide resin reacts with a diiodo aromatic compound, elemental sulfur, and a polymerization inhibitor in a molten mixture containing the diiodo aromatic compound, elemental sulfur, and the polymerization inhibitor. It can be obtained by a method that includes asking,
The polyarylene sulfide resin has at least one group selected from the group consisting of a carboxyl group derived from the polymerization inhibitor and a salt of the carboxyl group,
The polyarylene sulfide resin has a Mw/Mtop of 0.80 to 1.70, where Mw and Mtop are the weight average molecular weight and peak molecular weight measured by gel permeation chromatography, respectively,
The resin composition is used by pellet dealers
Polyarylene sulfide resin composition for electric vehicle parts.
상기 폴리아릴렌설피드 수지가,
주쇄 중에 하기 식(20)
으로 표시되는 디설피드 결합을 갖는 폴리아릴렌설피드 수지와, 당해 폴리아릴렌설피드 수지에 대해 0.01∼10,000ppm의 범위로 되는 비율로 요오드 원자를 포함하는 혼합물인, 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물.According to paragraph 1,
The polyarylene sulfide resin,
In the main chain, the following formula (20)
A polyarylene sulfide resin for electric vehicle parts, which is a mixture containing a polyarylene sulfide resin having a disulfide bond represented by and iodine atoms in a ratio ranging from 0.01 to 10,000 ppm with respect to the polyarylene sulfide resin. Composition.
주쇄 중에 하기 식(20)
으로 표시되는 디설피드 결합을 갖는 폴리아릴렌설피드 수지가,
말단에 하기 일반식(a)
으로 표시되는 1가의 기, 하기 일반식(b)
으로 표시되는 1가의 기, 또는 하기 일반식(c)
(단, 일반식(a)∼(c) 중의 X는, 수소 원자 또는 알칼리 금속 원자이다. 일반식(b) 중, R10은 탄소 원자수 1∼6의 알킬렌기를 나타낸다. 일반식(c) 중, R11은 탄소 원자수 1∼3의 알킬렌기를 나타내고, R12은 탄소 원자수 1∼5의 알킬기를 나타낸다)으로 표시되는 1가의 기를 갖는, 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물.According to paragraph 2,
In the main chain, the following formula (20)
A polyarylene sulfide resin having a disulfide bond represented by,
The following general formula (a) at the terminal:
A monovalent group represented by the following general formula (b)
A monovalent group represented by or the general formula (c) below:
(However, in general formulas ( a) to (c), ), wherein R 11 represents an alkylene group having 1 to 3 carbon atoms, and R 12 represents an alkyl group having 1 to 5 carbon atoms. A polyarylene sulfide resin composition for electric vehicle parts having a monovalent group represented by: .
상기 폴리아릴렌설피드 수지가, 300℃에 있어서의 0.95∼1.75의 비뉴토니언 지수, 및, 0.80∼1.70의 Mw/Mtop를 갖고, 상기 Mw 및 Mtop는 각각 겔침투 크로마토그래피에 의해 측정되는 중량 평균 분자량 및 피크 분자량인 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물.The method of claim 1, 2, or 3,
The polyarylene sulfide resin has a non-Newtonian index of 0.95 to 1.75 at 300°C and Mw/Mtop of 0.80 to 1.70, wherein Mw and Mtop are each a weight average measured by gel permeation chromatography. Polyarylene sulfide resin composition for electric vehicle parts with molecular weight and peak molecular weight.
무기질충전제, 상기 폴리아릴렌설피드 수지 이외의 열가소성 수지, 엘라스토머, 및 2 이상의 가교성 관능기를 갖는 가교성 수지로 이루어지는 군에서 선택되는, 적어도 1종의 다른 성분
을 용융 혼련하는, 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물의 제조 방법이며,
상기 폴리아릴렌설피드 수지가, 디요오도 방향족 화합물과, 단체 황과, 중합금지제를, 상기 디요오도 방향족 화합물, 상기 단체 황 및 상기 중합금지제를 포함하는 용융 혼합물 중에서 반응시키는 것을 포함하는 방법에 의해 얻는 것,
상기 폴리아릴렌설피드 수지가, 상기 중합금지제에 유래하는 카르복시기 및 카르복시기의 염으로 이루어지는 군에서 선택되는 적어도 1종의 기를 갖는 것,
상기 폴리아릴렌설피드 수지가, 0.80∼1.70의 Mw/Mtop를 갖고, 상기 Mw 및 Mtop는 각각 겔침투 크로마토그래피에 의해 측정되는 중량 평균 분자량 및 피크 분자량인 것, 및,
상기 수지 조성물이 펠렛 상인 것
을 특징으로 하는 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물의 제조 방법.Polyarylene sulfide resin,
At least one other component selected from the group consisting of an inorganic filler, a thermoplastic resin other than the polyarylene sulfide resin, an elastomer, and a crosslinkable resin having two or more crosslinkable functional groups.
A method for producing a polyarylene sulfide resin composition for electric vehicle parts, comprising melt-kneading,
The polyarylene sulfide resin comprises reacting a diiodo aromatic compound, elemental sulfur, and a polymerization inhibitor in a molten mixture containing the diiodo aromatic compound, elemental sulfur, and the polymerization inhibitor. What is obtained by means,
The polyarylene sulfide resin has at least one group selected from the group consisting of a carboxyl group derived from the polymerization inhibitor and a salt of the carboxyl group,
The polyarylene sulfide resin has a Mw/Mtop of 0.80 to 1.70, wherein Mw and Mtop are the weight average molecular weight and peak molecular weight measured by gel permeation chromatography, respectively, and
The resin composition is in the form of pellets.
A method for producing a polyarylene sulfide resin composition for electric vehicle parts, characterized by:
상기 폴리아릴렌설피드 수지가, 300℃에 있어서의 0.95∼1.75의 비뉴토니언 지수, 및, 0.80∼1.70의 Mw/Mtop를 갖고, 상기 Mw 및 Mtop는 각각 겔침투 크로마토그래피에 의해 측정되는 중량 평균 분자량 및 피크 분자량인, 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물의 제조 방법.In clause 7,
The polyarylene sulfide resin has a non-Newtonian index of 0.95 to 1.75 at 300°C and Mw/Mtop of 0.80 to 1.70, wherein Mw and Mtop are each a weight average measured by gel permeation chromatography. Molecular weight and peak molecular weight, a method for producing a polyarylene sulfide resin composition for electric vehicle parts.
상기 중합금지제가, 하기 일반식(3), (4) 또는 (5)
〔일반식(3) 중, R1 및 R2은 각각 독립적으로, 수소 원자, 또는, 하기 일반식(a), (b) 혹은 (c)으로 표시되는 1가의 기를 나타내고, R1 또는 R2 중 적어도 어느 한쪽은 일반식(a), (b) 또는 (c)으로 표시되는 1가의 기이다. 일반식(4) 중, Z는, 요오드 원자 또는 메르캅토기를 나타내고, R3은, 하기 일반식(a), (b) 또는 (c)으로 표시되는 1가의 기를 나타낸다. 일반식(5) 중, R4은, 일반식(a), (b) 또는 (c)으로 표시되는 1가의 기를 나타낸다.
(단, 일반식(a)∼(c) 중의 X는, 수소 원자 또는 알칼리 금속 원자이다. 일반식(b) 중, R10은 탄소 원자수 1∼6의 알킬렌기를 나타낸다. 일반식(c) 중, R11은 탄소 원자수 1∼3의 알킬렌기를 나타내고, R12은 탄소 원자수 1∼5의 알킬기를 나타낸다)〕으로 표시되는 화합물을 포함하는, 전기 자동차 부품용 폴리아릴렌설피드 수지 조성물의 제조 방법.In clause 7,
The polymerization inhibitor has the following general formula (3), (4) or (5):
[In General Formula (3), R 1 and R 2 each independently represent a hydrogen atom or a monovalent group represented by the following general formula (a), (b) or (c), and R 1 or R 2 At least one of them is a monovalent group represented by general formula (a), (b) or (c). In General Formula (4), Z represents an iodine atom or a mercapto group, and R 3 represents a monovalent group represented by the following general formula (a), (b) or (c). In general formula (5), R 4 represents a monovalent group represented by general formula (a), (b) or (c).
(However, in general formulas ( a) to (c), ), wherein R 11 represents an alkylene group having 1 to 3 carbon atoms, and R 12 represents an alkyl group having 1 to 5 carbon atoms), a polyarylene sulfide resin for electric vehicle parts, including a compound represented by Method for producing the composition.
상기 폴리아릴렌설피드 수지 조성물이 펠렛 상인 것을 특징으로 하는 전기 자동차 부품용 성형품의 제조 방법.A method for producing a molded article for electric vehicle parts, comprising injection molding, extrusion molding, compression molding, or blow molding the polyarylene sulfide resin composition according to claim 1,
A method for producing a molded article for electric vehicle parts, characterized in that the polyarylene sulfide resin composition is in the form of a pellet.
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