KR20240013595A - Heat-resistant pressure sensing device and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a sensing device for measuring the pressure of a battery sealing device, comprising a pressure measurement sensor and a protective structure surrounding one or both sides of the pressure measurement sensor, wherein the protective structure includes a first heat-resistant film and the first heat-resistant film. It relates to a heat-resistant pressure sensing device including a heat-resistant sheet positioned between a heat-resistant film and the pressure measuring sensor, and a method of manufacturing the same.

Description

Heat-resistant pressure sensing device and manufacturing method thereof {HEAT-RESISTANT PRESSURE SENSING DEVICE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a heat-resistant pressure sensing device and a manufacturing method thereof, and more specifically, to a heat-resistant pressure sensing device for measuring the pressure of a battery sealing device and a manufacturing method thereof.

In general, lithium secondary batteries are formed with a structure that seals the electrode assembly and electrolyte inside the battery case, and are broadly classified into cylindrical batteries, prismatic batteries, and pouch-type batteries depending on their appearance, and lithium-ion batteries and lithium batteries depending on the type of electrolyte. They are also classified as ion polymer batteries and lithium polymer batteries. Due to the recent trend toward miniaturization of mobile devices, demand for thinner square batteries and pouch-type batteries is increasing. In particular, there is a high level of interest in pouch-type batteries that are easy to change shape and have a small weight. .

A pouch-type secondary battery includes a pouch, an electrode assembly stored inside the pouch, an electrode tab extending from the electrode assembly, and an electrolyte. The pouch is partially open and electrolyte is injected into the pouch, and the electrode tab is protruded outside the pouch and sealed through a sealing process to prevent the injected electrolyte from leaking out of the pouch.

The sealing process may be performed by thermally compressing the upper and lower surfaces of the open portion of the secondary battery pouch. Since the compression tool used in the sealing process is continuously exposed to an environment of high temperature of 210℃ to 230℃ and pressure of 0.2Mpa to 0.3Mpa, the compression tool needs to be replaced at regular intervals. When the crimping tool is replaced, as a pre-inspection procedure before sealing the actual battery, it is necessary to check whether the installed crimping tool is installed correctly on the equipment, whether pressure is applied uniformly to the area requiring sealing of the pouch, and whether the pouch is sealed. It is possible to prevent the production of batteries with defective sealing by conducting inspection procedures such as whether the sealed part is straight and smooth.

Previously, a preliminary inspection procedure was conducted using pressure-sensitive paper made of paper on sealing process equipment in which the pressing tool was replaced. Pressure-sensitive paper made of paper has microcapsules containing dye coated on its surface, so when pressure is applied, the capsules are destroyed, and the pressurization can be confirmed by engraving the dye contained within it into the surface of the paper. Therefore, when the pressure-sensitive paper made of paper is mounted on the sealing process equipment and the sealing process is performed, the pressure-sensitive paper is engraved to correspond to the shape of the contact surface of the pressing tool, and the engraved shape can be used to determine whether the pressing tool has been installed correctly. there was.

However, the existing paper press paper does not provide data on which part and how much pressure the press tool applies, and since it is a disposable product, there is a problem that it cannot be reused in a high temperature environment.

The present invention is intended to solve the above problems. By using an electronic pressure measurement sensor, the pressure measurement value can be converted into data for each sensor, and by combining it with a heat-resistant material, a heat-resistant pressure sensing device can be reused multiple times even in a high-temperature environment. The object is to provide a device and a method of manufacturing the same.

According to one embodiment of the present invention, the present invention relates to a sensing device for measuring the pressure of a battery sealing device, comprising a pressure measurement sensor and a protective structure surrounding one or both sides of the pressure measurement sensor, the protective structure provides a heat-resistant pressure sensing device including a first heat-resistant film and a heat-resistant sheet positioned between the first heat-resistant film and the pressure measurement sensor.

At this time, the protective structure may further include a silicon layer located between the heat-resistant sheet and the pressure measurement sensor.

Additionally, the protective structure may further include a second heat-resistant film, and the second heat-resistant film may be disposed between the pressure measurement sensor and the silicon layer.

Meanwhile, the first heat-resistant film may include any one or more of PI (Polyimide), PTFE (Polytetrafluoroethylene), PC (Polycarbonate), PEN (Polyethylene naphthalate), PES (Polyethersulphone), and PET (Polyethylene Terephthalate).

Meanwhile, the pressure measurement sensor may include a substrate and a plurality of pressure measurement units arranged in a grid shape on the substrate.

At this time, the pressure measurement sensor includes a connection part electrically connected to the substrate; and

It may further include an output unit connected to the connection unit and outputting a pressure value measured through the pressure measurement unit.

Meanwhile, the plurality of pressure measuring units may protrude with respect to the substrate.

Meanwhile, the heat-resistant sensing device further includes a fixing frame, the heat-resistant sensing device includes a first area including the pressure measurement sensor and a second area not including the pressure measurement sensor, and the support frame is disposed in the second area. The heat resistant sensing device can be fixed.

According to another embodiment of the present invention, the present invention includes the steps of applying pressure to the heat-resistant sensing device by a battery sealing device, measuring pressure at each position by a plurality of pressure measuring units included in the heat-resistant sensing device, Transmitting pressure data measured by a plurality of pressure measuring units to an output unit through a connection unit, displaying the pressure data received by the output unit according to the pressure measurement position, and flattening the battery sealing device through the displayed pressure data. A pressure measurement method using a heat-resistant pressure sensing device including the step of evaluating the degree is provided.

According to another embodiment of the present invention, the present invention includes the steps of disposing a plurality of heat-resistant sheets on a first heat-resistant film, disposing a silicon layer on each of the heat-resistant sheets, and forming a second heat-resistant layer on the silicon layer. Heat-resistant pressure sensing comprising the steps of disposing a film, placing a pressure measurement sensor on the second heat-resistant film, and folding the first heat-resistant film and the second heat-resistant film between the plurality of heat-resistant sheets. A method of manufacturing a device is provided.

The heat-resistant pressure sensing device of the present invention combines a pressure measurement sensor with a heat-resistant material to protect the pressure measurement sensor, which has weak durability against heat and shock, and can provide a pressure measurement sensor that can be reused multiple times even in a high temperature environment.

1 is a cross-sectional view schematically illustrating the structure of the heat-resistant pressure sensing device of the present invention.
Figure 2 shows an example in which a plurality of pressure measuring units are arranged on a substrate in the pressure measuring sensor of the present invention.
Figure 3 shows an exploded view showing the structure of the pressure measuring unit of the present invention.
Figure 4 is a cross-sectional view sequentially showing the laminated structure of the protective structure of the present invention.
Figure 5 is a perspective view showing the structure of a fixed frame according to the first embodiment of the present invention.
Figure 6 is a perspective view showing a heat-resistant pressure sensing device further including a fixing frame according to the first embodiment of the present invention.
Figure 7 is a perspective view showing a heat-resistant pressure sensing device further including a fixing frame according to a second embodiment of the present invention.
Figure 8 is a perspective view showing a heat-resistant pressure sensing device further including a fixing frame according to a third embodiment of the present invention.
9 to 12 are diagrams sequentially showing a method of manufacturing a heat-resistant pressure sensing device according to another embodiment of the present invention.
Figure 13 is a flowchart showing a pressure measurement method using a heat-resistant pressure sensing device according to another embodiment of the present invention.

Hereinafter, the present invention will be described in more detail with reference to the drawings. However, the following drawings are intended to facilitate understanding of the present invention, and are only one embodiment of the present invention, and the scope of the present invention is not limited to the range described in the drawings. Additionally, in the following drawings, the same symbols refer to the same components, and some components may be exaggerated, reduced, or omitted to facilitate understanding of the invention.

When described with reference to FIG. 1, the present invention relates to a heat-resistant pressure sensing device 10 for measuring the pressure of a battery sealing device. The heat-resistant pressure sensing device 10 includes a pressure measurement sensor 100 and a protective structure 200 surrounding one or both sides of the pressure measurement sensor 100, and the protective structure 200 includes a first heat-resistant film ( 210), and includes a heat-resistant sheet 220. The protective structure 200 may further include a silicon layer 230 and a second heat-resistant film 240.

The pressure measurement sensor 100 may be a sensor for measuring a pressure value through a change in the resistance value of the sensor depending on the applied pressure. The shape of the pressure measurement sensor 100 is not limited to this, but may be formed in, for example, a circular, oval, square, or polygonal shape.

When described with reference to FIG. 2 , the pressure measurement sensor 100 may include a plurality of pressure measurement units 110, a substrate 120, and a connection unit 130.

When described with reference to FIG. 3, the pressure measuring unit 110 is a part for measuring the pressure applied by the pressure measuring sensor 100 and includes a variable part 110a, a circuit part 110b, and a spacer 110c. It can be formed in a structure in which the variable part 110a, the spacer 110c, and the circuit part 110b are sequentially stacked from top to bottom.

The variable part 110a may include an electrically conductive material and may be a part whose shape is variable by the pressure applied to the pressure measuring part 110. An empty space formed by the spacer 100c exists below the variable portion 110a, and the circuit portion 110b may be disposed below the spacer 100c.

When the variable part 110a is deformed by pressure applied from the top and comes into contact with the circuit part 110b, a change in the resistance value of the circuit part 110b occurs due to the variable part 110a containing a conductive material. , a current according to the changed resistance value may flow in the circuit unit 110b. It is possible to measure the pressure applied to the pressure measuring unit 110 using the current value or resistance value.

The variable portion 110a may include a protrusion 111 that protrudes upward on its upper surface, and when the variable portion 110a is pressed due to the protrusion 111, deformation of the variable portion 110a becomes easy, allowing pressure measurement. Sensor 100 may be a more sensitive sensor.

The spacer 110c is not limited thereto, but is formed, for example, in a 'U', 'O', 'ㅁ', 'C' or 'ㄷ' shape, so as not to contact the circuit formed in the circuit portion 110b. It may be formed along the periphery of the circuit, and an empty space of a predetermined size may be formed inside the edge of the spacer 110c. The empty space formed is such that the distance between the variable part 110a and the circuit part 110b is equal to the thickness of the spacer 100c, so that the variable part 110a does not contact the circuit part 110b unless it is changed by receiving a force of a certain size or more. By doing so, malfunction of the pressure measurement sensor 100 can be prevented.

The spacer 110c may include an insulating material. The spacer 110c is disposed on the upper surface of the circuit portion 110b and may be formed in a shape corresponding to the shape of the circuit periphery formed in the circuit portion 110b.

The circuit portion 110b is electrically connected by combining its lower surface with the substrate 120, and a circuit may be formed on its upper surface.

The circuit of the circuit part 110b has a resistance value of 0 before contact with the variable part 110a, but when the variable part 110a changes under pressure and comes into contact with the circuit, the circuit is changed by the variable part 110a containing an electrically conductive material. The resistance value changes, and the current value flowing in the circuit may change.

Spacers 110c may be disposed on the upper surface of the circuit portion 110b along the periphery of the circuit.

The substrate 120 may be electrically connected to the circuit of the circuit unit 110b.

A plurality of pressure measurement sensors 110 may be arranged and coupled to the substrate 120 in a lattice manner.

The substrate 120 may be a flexible circuit board made of a flexible material whose shape changes when subjected to physical impact to protect complex circuits drawn on the substrate 120.

The connection unit 130 is electrically connected to the substrate 120 and can transmit data measured by each of the plurality of pressure measurement units 110 to the output unit. Data transmitted through the connection unit 130 may include the individual location and measured pressure value of the pressure measurement unit 110.

The connection portion 130 is formed on one side of the substrate 120 and may be connected to the output portion. The output unit may indicate the respective positions and measured values of the plurality of pressure measuring units 110. Although not limited thereto, for example, the output unit may include at least one of a display or a speaker.

The protective structure 200 may cover one or both sides of the pressure measurement sensor 100 and protect the pressure measurement sensor 100 from shock due to heat or pressure.

When described with reference to FIG. 4 , the protective structure 200 may include a first heat-resistant film 210, a heat-resistant sheet 220, a silicon layer 230, and a second heat-resistant film 240. In more detail, the protective structure 200 may include a structure in which a first heat-resistant film 210, a heat-resistant sheet 220, a silicon layer 230, and a second heat-resistant film 240 are stacked.

The first heat-resistant film 210 includes a heat-resistant material, and the film includes polyimide (PI), polytetrafluoroethylene (PTFE), polycarbonate (PC), polyethylene naphthalate (PEN), polyethersulphone (PES), polyethylene terephthalate (PET), and PVDF ( Polyvinylidene fluoride) may contain one or more materials.

The first heat-resistant film 210 is located in the outermost part of the protective structure 200 and is in direct contact with the high-temperature battery sealing process equipment. Since it is made of a heat-resistant material, it is not deformed by temperature even when in contact with the sealing process equipment. Pressure according to location can be transmitted to the measurement sensor 100.

The first heat-resistant film 210 may be formed to have a larger area than the heat-resistant sheet 220, the silicon layer 230, and the pressure measurement sensor 100.

The heat-resistant sheet 220 may include an insulating material with low thermal conductivity and a heat-resistant material to prevent high-temperature heat energy from being transmitted to the pressure measurement sensor. It is not limited thereto, but includes, for example, aramid fiber, PBI (polybenzimidazole), PI (polyimide), glass fiber, carbon fiber, glass wool, mineral wool, silica, perlite, urethane foam, ceramic fiber, and PTFE (polytetrafluoroethylene). It may contain more than one material.

The heat-resistant sheet 220 is disposed between the silicon layer 230 and the first heat-resistant film 210, so that high-temperature heat passing through the first heat-resistant film 210 is transmitted to the pressure measurement sensor 100 located inside the protective structure 200. ) can minimize penetration.

The area of the heat-resistant sheet 220 may be the same as or larger than the area of the silicon layer 230. If the area of the heat-resistant sheet 220 is formed to be larger than the area of the silicon layer 230, the heat-resistant sheet 220 can cover the side of the silicon layer 230, so the high temperature flowing in through the side of the silicon layer 230 Heat can be blocked to prevent thermal damage to the pressure measurement sensor.

The silicone layer 230 may include a silicone or silicone rubber material, and is located between the heat-resistant sheet 220 and the second heat-resistant film 240, and is a flexible elastic restoration material, so it forms a protective structure ( The force of the battery sealing equipment that presses the 200) is transmitted from the heat-resistant sheet 220, and the plurality of pressure measuring parts 110 and the second heat-resistant film 240 are brought into close contact with each other to form a plurality of pressure measuring parts 110, respectively. Power can be transmitted intact. In addition, the heat-resistant sheet 220 and the second heat-resistant film 240, which are in direct contact with the silicon layer 230, can be adhered to the silicon layer 230 without a separate adhesive.

Since the silicon layer 230 is a heat-resistant material, the pressure measurement sensor 100 can be protected from high temperature heat.

The second heat-resistant film 240 is located innermost in the protective structure 200 and is located between the silicon layer 230 and the pressure measurement sensor 100. Since the second heat-resistant film 240 directly contacts and surrounds one or both sides of the pressure measurement sensor 100, it is in the form of a thin film so that force can be transmitted from the silicon layer 230 and completely transmitted to the plurality of pressure measuring units 110. It is desirable to form

The second heat-resistant film 240 may be formed to have an area of the same or similar size as the first heat-resistant film 210 .

The second heat-resistant film 240 includes a heat-resistant material, but is not limited thereto, for example, polyimide (PI), polytetrafluoroethylene (PTFE), polycarbonate (PC), polyethylene naphthalate (PEN), polyethersulphone (PES), It may contain one or more materials among PET (Polyethylene Terephthalate) and PVDF (Polyvinylidene fluoride).

The first heat-resistant film 210 and the second heat-resistant film 240 may be made of the same or different materials.

The pressure measurement sensor 100 may be disposed between a pair of protective structures 200, and each protective structure 200 may be disposed so that the second heat-resistant film 240 is in contact with the pressure measurement sensor 100. there is.

The protective structure 200 may include a first area 310 where the pressure measurement sensor 100 is located and a second area 320 where the pressure measurement sensor 100 is not located.

The first area 310 is an area where the pressure measurement sensor is surrounded by the protective structure 200, and may be an area where the battery sealing device presses the pressure measurement sensor 100.

5 and 6 , the heat-resistant pressure sensing device 10 according to the present invention may further include a fixing frame 330 capable of fixing the heat-resistant pressure sensing device 10. The fixing frame 330 is coupled to the protection structure 200 at least in part on the second area 320, and presses the periphery of the pressure measurement sensor 100 so that the pressure measurement sensor 100 surrounded by the protection structure 200 forms the protection structure. Flow within 200 can be prevented, and furthermore, the position of the heat-resistant pressure sensing device 10 can also be fixed.

As one embodiment, when described with reference to FIGS. 5 and 6, the fixing frame 330 may be formed in a 'ㄷ' shape. The fixing frame 330 may include a 'ㄷ' shaped fixing bar 331, an accommodation space 332, and a coupling hole 333. The fixing bar 331 may be formed in a 'ㄷ' shape so that it can be placed in a peripheral area of the first area 310, and the first area 310 may be placed in the receiving space 332. The coupling hole 333 is a hole where a fastening member for coupling the fixing frame 330 and the protective structure 200 is coupled, and the fastening member may be a bolt, nut, rivet, or the like. The coupling hole 333 may be formed in the fixing bar 331.

As another example, when described with reference to FIG. 7, the fixing frame 400 may be formed in a 'ㅁ' shape. The fixing frame 400 may include a 'ㅁ' shaped fixing bar 410, an accommodation space 420, and a coupling hole 430. The fixed bar 410 may be arranged to completely surround the peripheral area of the first area 310, and the first area 310 may be placed in the receiving space 420 formed at the center of the fixed bar 410. The coupling hole 430 is a hole into which a fastening member for coupling the fixing frame 400 and the protective structure 200 is coupled, and the fastening member may be a bolt or nut. The coupling hole 430 may be formed in the fixing bar 410. The 'ㅁ' shaped fixing bar 410 can fix all four sides of the pressure measurement sensor 100 through the fixing bar 410 to prevent the pressure measurement sensor 100 from moving, thereby improving measurement accuracy. and convenience can be improved.

As another example, when described with reference to FIG. 8, the fixed frame 500 may include a plurality of frames. The fixing frame 500 may be symmetrically arranged to surround both sides of the pressure measurement sensor 100 in the second area 320 and may be coupled to the protection structure 200 . The fixing frame 500 may include a plurality of fixing bars 510, an accommodation space 520, and a coupling hole 530. The fixing bar 510 includes one straight surface, and the plurality of fixing bars 510 may be arranged so that the straight surfaces face each other. The receiving space 520 is a space formed between a plurality of fixing bars 510 in which the first area 310 may be disposed. The coupling hole 530 is a hole formed in the fixing bar 510 through which the fixing frame 500 and the fastening member can be coupled. Fastening members may be bolts and nuts. The fixing frame 500 including a plurality of fixing bars 510 can fix the pressure measurement sensor 100 by adjusting the separation distance between the plurality of fixing bars 510 regardless of the size of the first area 310. You can.

Meanwhile, as an example of a method of manufacturing the heat-resistant pressure sensing device 10 of the present invention, when described with reference to FIGS. 9 to 12, the heat-resistant pressure sensing device 10 of the present invention includes the first heat-resistant film 210. ), disposing a plurality of heat-resistant sheets 220 on each heat-resistant sheet 220, disposing each silicon layer 230 on each heat-resistant sheet 220, disposing a second heat-resistant film 240 on the silicon layer 230. It can be manufactured by a manufacturing method including the step of placing the pressure measurement sensor 100 on the second heat-resistant film 240. The above manufacturing method may further include folding the first heat-resistant film 210 and the second heat-resistant film 240 between the plurality of heat-resistant sheets 220 . Meanwhile, the specific configuration of the heat-resistant pressure sensing device 10 is the same as described above, so description is omitted.

In the step of arranging the plurality of heat-resistant sheets 220 disposed on the first heat-resistant film 210, a pair of heat-resistant sheets 220 are spaced apart from each other at a predetermined distance and are parallel on one first heat-resistant film 210. It can be placed like this.

In the step of disposing each silicon layer 230 on each heat-resistant sheet 220, the same number of silicon layers 230 as the number of heat-resistant sheets 220 may be stacked on each heat-resistant sheet 220.

The step of disposing the second heat-resistant film 240 on the silicon layer 230 includes placing one second heat-resistant film 240 with a sufficient area to cover all of the plurality of silicon layers 230. , and a plurality of laminates of the heat-resistant sheet 220 and the silicon layer 230 may be arranged in parallel between the first heat-resistant film 210 and the second heat-resistant film 240.

In the step of disposing the pressure measurement sensor 100 on the second heat-resistant film 240, the pressure measurement sensor 100 is placed on the second heat-resistant film 240 at a location where a plurality of laminates of the heat-resistant sheet 220 and the silicon layer 230 are located. (240) It can be placed on.

In the step of folding the first heat-resistant film 210 and the second heat-resistant film 240 between the pair of heat-resistant sheets 220, the first heat-resistant film 210/heat-resistant sheet 220/silicon layer 230 /A pair of heat-resistant sheets 220 are placed between a pair of protective structures 200 including a laminated structure of the second heat-resistant film 240 so that the pressure measurement sensor 100 is positioned between the pair of protective structures 200. You can fold it based on the center line between them. Through the above steps, the first heat-resistant film 210/heat-resistant sheet 220/silicon layer 230/second heat-resistant film 240/pressure measurement sensor 100/second heat-resistant film 240/silicon layer ( A laminated structure can be formed in the following order: 230)/heat-resistant sheet 220/first heat-resistant film 210.

Meanwhile, as another embodiment of the method of manufacturing the heat-resistant pressure sensing device 10 of the present invention, the method of manufacturing the heat-resistant pressure sensing device 10 includes manufacturing a first protective structure 200, the first protective structure ( Manufacturing a second protective structure 200 formed in the same structure as 200) and placing a pressure measurement sensor 100 between the first protective structure 200 and the second protective structure 200 arranged symmetrically to each other. It may include steps.

The manufacturing method of the first protective structure 200 and the manufacturing method of the second protective structure 200 may be manufactured by the same method, and the manufacturing method of the first protective structure 200 may be performed on the first heat-resistant film 210. It may include disposing a heat-resistant sheet 220, disposing each silicon layer 230 on the heat-resistant sheet 220, and disposing a second heat-resistant film 240 on the silicon layer 230. there is.

Meanwhile, the method of manufacturing the heat-resistant pressure sensing device 10 may further include the step of coupling a fixing frame to the heat-resistant pressure sensing device 10. Since the areas of the first heat-resistant film 210 and the second heat-resistant film 240 are wider than the areas of the heat-resistant sheet 220 and the silicon layer 230, the first heat-resistant film 210 and the second heat-resistant film 240 are When the pair of heat-resistant sheets 220 are folded centrally, a first area 310 where the pressure measurement sensor 100 is placed and a second area 320 where the pressure measurement sensor 100 is not placed are created, and the second area 320 By combining the fixing frames 330, 400, and 500, the pressure measurement sensor 100 can be stably fixed in its position inside the heat-resistant pressure sensing device 10, thereby improving the reliability of the pressure measurement results of the battery sealing device. can do.

Meanwhile, when described with reference to FIG. 13, the pressure measurement method using the heat-resistant pressure sensing device includes the step of the battery sealing device applying pressure to the heat-resistant sensing device (S100), and a plurality of pressure measurement sensors included in the heat-resistant sensing device each Step of measuring the pressure at the location (S200), transmitting the pressure data measured by the plurality of pressure measurement sensors to the output unit through the connection, and displaying the pressure value according to the pressure measurement location of the pressure data received by the output unit ( S300) and a step of evaluating the flatness and straightness of the battery sealing device through the displayed pressure data (S400).

The step of evaluating the flatness and straightness of the battery sealing device (S400) is to determine whether the pressure values measured by each pressure measurement sensor receiving pressure from the battery sealing device are uniform overall through the pressure data displayed on the output section. It can be judged by whether the position of the plurality of pressure values output appears as a straight line overall without bending.

10: Heat-resistant pressure sensing device
100: pressure measurement sensor
110: pressure measuring unit
110a: Variable part
110b: circuit part
110c: spacer
120: substrate
130: connection part
200: protection structure
210: first heat resistant film
220: heat resistant sheet
230: Silicone layer
240: second heat-resistant film
310: first area
320: second area
330: fixed frame
331: fixed bar
332: Accommodation space
333: coupling hole
400: fixed frame
500: fixed frame

Claims (12)

Pertaining to a sensing device for measuring the pressure of a battery sealing device,
pressure measurement sensor; and
It includes a protective structure surrounding one or both sides of the pressure measurement sensor,
The protective structure is,
a first heat-resistant film; and
A heat-resistant pressure sensing device comprising a heat-resistant sheet positioned between the first heat-resistant film and the pressure measurement sensor. According to claim 1,
The protective structure is,
A heat-resistant pressure sensing device further comprising a silicone layer located between the heat-resistant sheet and the pressure measurement sensor. According to claim 2,
The protective structure further includes a second heat-resistant film,
The second heat-resistant film is a heat-resistant pressure sensing device disposed between the pressure measurement sensor and the silicon layer. According to claim 1,
The first heat-resistant film includes any one or more of PI (Polyimide), PTFE (Polytetrafluoroethylene), PC (Polycarbonate), PEN (Polyethylene naphthalate), PES (Polyethersulphone), and PET (Polyethylene Terephthalate). A heat-resistant pressure sensing device. According to claim 1,
The pressure measurement sensor is,
Board; and
A heat-resistant pressure sensing device comprising a plurality of pressure measuring units arranged in a grid shape on the substrate. According to claim 5,
The pressure measurement sensor is,
A connection part electrically connected to the substrate; and
A heat-resistant pressure sensing device further comprising an output unit connected to the connection unit and outputting a pressure value measured through the pressure measurement unit. According to claim 5,
A heat-resistant pressure sensing device wherein the plurality of pressure measuring units protrude with respect to the substrate. According to claim 1,
The heat resistance sensing device further includes a fixed frame,
The heat-resistant sensing device includes a first area including the pressure measurement sensor and a second area not including the pressure measurement sensor,
A heat-resistant pressure sensing device wherein the support frame is disposed in a second area to secure the heat-resistant sensing device. In the pressure measurement method using the heat-resistant sensing device according to any one of claims 1 to 8,
A battery sealing device applying pressure to the heat resistance sensing device;
A plurality of pressure measuring units included in the heat-resistant sensing device measure pressure at each location; and
A pressure measurement method using a heat-resistant pressure sensing device, comprising displaying pressure data measured by the plurality of pressure measuring units as pressure values according to pressure measurement positions. According to clause 9,
The pressure measurement method using the heat-resistant pressure sensing device is
A pressure measurement method using a heat-resistant pressure sensing device further comprising the step of evaluating straightness through the displayed pressure data. Arranging a plurality of heat-resistant sheets on the first heat-resistant film;
Placing a silicon layer on each of the heat-resistant sheets;
disposing a second heat-resistant film on the silicone layer; and
A method of manufacturing a heat-resistant pressure sensing device comprising the step of disposing a pressure measurement sensor on the second heat-resistant film. According to claim 11,
A method of manufacturing a heat-resistant pressure sensing device comprising the step of folding the first heat-resistant film and the second heat-resistant film centered between the plurality of heat-resistant sheets.