KR20240006178A - Drain cup for a substrate-cleaning apparatus - Google Patents

Abstract

A drain cup for a substrate cleaning device may include a cup body, at least one cleaning liquid nozzle, and a mesh net. The cup body may be disposed below the processing liquid nozzle of the substrate cleaning device. The cup body may include a cleaning liquid port through which the cleaning liquid is supplied, and a discharge liquid port through which the discharge liquid generated by the cleaning liquid is discharged. The cleaning liquid nozzle may be connected to the cleaning liquid port to spray the cleaning liquid into the cup body. The mesh net may be placed horizontally within the cup body to be positioned above the discharge port. The mesh network may include a plurality of storage units that temporarily store the discharge liquid, and a plurality of discharge ports located above the storage units to discharge the discharge liquid stored in the storage units to the discharge liquid port. Accordingly, a meniscus due to the discharged liquid is formed in the discharge ports, and outgassing toward the top of the cup body is blocked by the meniscus, thereby suppressing the formation of fume.

Description

Drain cup for substrate cleaning device {DRAIN CUP FOR A SUBSTRATE-CLEANING APPARATUS}

The present invention relates to a drain cup for a substrate cleaning device. More specifically, the present invention relates to a drain cup for partially removing the cleaning solution from a nozzle in a process of removing oxides remaining on a substrate with a cleaning solution before putting the substrate into a drying device.

In general, semiconductor devices can be manufactured through various processes such as photography, etching, ashing, ion implantation, thin film deposition, and cleaning. A process for cleaning the semiconductor substrate may be performed between each process.

The substrate cleaning device may include a support unit that supports the substrate, a nozzle disposed on an upper portion of the substrate to spray a processing liquid, and a drain cup in which the nozzle waits. The nozzle can wait on top of the drain cup. The drain cup can accommodate and discharge stagnant processing liquid within the waiting nozzle.

According to related technologies, outgassing generated from the treatment liquid may meet a low-temperature air current, thereby forming fume. These fumes can contaminate the drain cup. Additionally, a contaminated drain cup can contaminate the waiting nozzle. Contamination of the nozzle can cause defects in the substrate cleaning process.

The present invention provides a drain cup for a substrate cleaning device that can prevent contamination by processing liquid from a nozzle.

A drain cup for a substrate cleaning device according to one aspect of the present invention may include a cup body, at least one cleaning liquid nozzle, and a mesh net. The cup body may be disposed below the processing liquid nozzle of the substrate cleaning device. The cup body may include a cleaning liquid port through which the cleaning liquid is supplied, and a discharge liquid port through which the discharge liquid generated by the cleaning liquid is discharged. The cleaning liquid nozzle may be connected to the cleaning liquid port to spray the cleaning liquid into the cup body. The mesh net may be placed horizontally within the cup body to be positioned above the discharge port. The mesh network may include a plurality of storage units that temporarily store the discharge liquid, and a plurality of discharge ports that allow the discharge liquid overflowing from the storage units to be discharged to the discharge liquid port.

According to the present invention described above, the treatment liquid of the treatment liquid nozzle accommodated in the cup body can be removed by the cleaning liquid introduced through the cleaning liquid port and sprayed through the cleaning liquid nozzle. In addition, the treatment liquid from the treatment liquid nozzle is temporarily stored in the storage portions of the mesh network and then discharged to the discharge liquid port through the discharge ports. A meniscus due to the discharge liquid is formed in the discharge ports, so that it is placed on the cup body. Outgassing toward can be blocked by the meniscus. Therefore, the formation of fume is suppressed, contamination of the drain cup can be prevented, and thus contamination of the treatment liquid nozzle can also be prevented. As a result, defects in the substrate cleaning process can be prevented.

Figure 1 is a diagram showing a substrate cleaning device to which a drain cup is applied according to an embodiment of the present invention.
Figure 2 is a perspective view showing the drain cup shown in Figure 1.
Figure 3 is a cross-sectional view showing the cup body of the drain cup shown in Figure 2.
Figure 4 is an enlarged cross-sectional view showing the nozzle hole of the cup body shown in Figure 3.
FIG. 5 is a plan view showing the mesh network of the drain cup shown in FIG. 2.
FIG. 6 is an enlarged perspective view of a portion of the mesh network shown in FIG. 4.
FIG. 7 is a perspective view showing the discharge operation of the mesh network shown in FIG. 6.
FIG. 8 is a perspective view showing the meniscus forming operation of the mesh network shown in FIG. 6.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

FIG. 1 is a diagram showing a substrate cleaning device to which a drain cup is applied according to an embodiment of the present invention, FIG. 2 is a perspective view showing the drain cup shown in FIG. 1, and FIG. 3 is a cup body of the drain cup shown in FIG. 2. It is a cross-sectional view showing, and Figure 4 is an enlarged cross-sectional view showing the nozzle hole of the cup body shown in Figure 3.

Referring to FIGS. 1 to 4 , the drain cup 100 of this embodiment may be disposed below the processing liquid nozzle (N) of the substrate cleaning device (C). The processing liquid nozzle N may wait at the top of the drain cup 100 before being brought into the substrate cleaning device C.

In this embodiment, the substrate cleaning device C can remove foreign substances remaining on the semiconductor substrate with a treatment liquid before inputting the semiconductor substrate into the drying device. The processing liquid nozzle N can spray processing liquid onto the semiconductor substrate to remove foreign substances remaining on the substrate. For example, if the foreign matter remaining on the substrate is an oxide, the treatment solution may include, but is not limited to, a LAL solution.

Here, if the processing liquid stored in the waiting processing liquid nozzle (N) is exposed to air for more than a certain period of time, the removal performance of the processing liquid may deteriorate. Accordingly, the processing liquid in the waiting processing liquid nozzle (N) is not used in the substrate cleaning device (C) and can be removed through the drain cup 100. Outgassing generated from the treatment liquid contained in the drain cup 100 may flow back within the drain cup 100. The backflowed outgassing may meet cold air supplied from a fan filter unit (FFU) and liquefy, forming fume. Such fume may contaminate the drain cup 100 and the treatment liquid nozzle (N).

The drain cup 100 of this embodiment may have a structure that can suppress the generation of fume from the processing liquid discarded from the processing liquid nozzle N. The drain cup 100 may include a cup body 110, at least one cleaning liquid nozzle 140, and a mesh net 150.

The cup body 110 may be disposed below the processing liquid nozzle (N). The cup body 110 may have an internal space that can temporarily accommodate the treatment liquid. The cup body 110 may have an open upper surface. The treatment liquid of the treatment liquid nozzle N may be received into the cup body 110 through the open upper surface of the cup body 110.

The cup body 110 may include an inner cup 120 and an outer cup 130. The outer cup 130 has a shape surrounding the inner cup 120, so that a space can be formed between the inner cup 120 and the outer cup 130. In particular, the upper ends of the inner cup 120 and the outer cup 130 are connected to each other to prevent the treatment liquid from penetrating into the space between the inner cup 120 and the outer cup 130.

A cleaning liquid port 132 may be formed in the external cup 130. Cleaning liquid may be introduced into the space between the inner cup 120 and the outer cup 130 through the cleaning liquid port 132. Accordingly, the space between the inner cup 120 and the outer cup 130 may be a passage for the cleaning liquid to move. In this embodiment, the cleaning liquid port 132 may be formed on the lower surface of the external cup 130, but may not be limited thereto.

A discharge liquid port 122 may be formed in the inner cup 120. As the cleaning liquid introduced through the cleaning liquid port 132 processes the processing liquid, discharge liquid may be generated inside the cup body 110, specifically, inside the inner cup 120. The discharge liquid may be discharged to the outside of the cup body 110 through the discharge liquid port 122. Since the discharge liquid collects on the bottom of the inner cup 120, the discharge liquid port 122 may be formed on the lower surface of the inner cup 120.

The cleaning liquid nozzle 140 may be disposed in the inner cup 120. The cleaning liquid nozzle 140 may be connected to the cleaning liquid movement passage between the inner cup 120 and the outer cup 130. Accordingly, the cleaning liquid introduced into the cleaning liquid movement passage through the cleaning liquid port 132 may be sprayed toward the inside of the inner cup 120 through the cleaning liquid nozzle 140. In this embodiment, the cleaning liquid may include, but is not limited to, deionized water.

In this embodiment, the cleaning liquid nozzles 140 may be comprised of a plurality of them arranged in the inner cup 120. Additionally, each of the cleaning liquid nozzles 140 may have a spray hole 142 that sprays the cleaning liquid. In particular, the cleaning liquid nozzles 140 may have different spray directions. By having the cleaning liquid nozzles 140 have different spraying directions, the cleaning liquid can be uniformly sprayed into the inner cup 120 . Giving different spray directions to the cleaning liquid nozzles 140 can be implemented by changing the directions of the cleaning liquid nozzles 140, that is, the axial directions of the spray holes 142 from each other.

The mesh network 150 may be horizontally disposed inside the cup body 110. That is, the mesh network 150 may be arranged along a direction perpendicular to the direction of movement of the treatment liquid introduced into the cup body 110. The mesh network 150 may have a function of processing the discharged liquid before it is discharged to the discharged liquid port 122. Accordingly, the mesh network 150 may be disposed in the lower portion of the inner region of the inner cup 120 above the discharge port 122. Additionally, the mesh network 150 may be located below the lowest cleaning liquid nozzle 140 among the plurality of cleaning liquid nozzles 140.

FIG. 5 is a plan view showing the mesh network of the drain cup shown in FIG. 2, and FIG. 6 is an enlarged perspective view showing a portion of the mesh network shown in FIG. 4.

Referring to FIGS. 5 and 6 , the mesh network 150 may include a plurality of storage units 154 and a plurality of outlets 152. Discharge outlets 152 may be located adjacent to each of the storage units 154. The storage units 154 may temporarily store some of the discharged liquid. That is, some of the discharged liquid may be temporarily stored in the storage units 154, and the remaining discharged liquid may be discharged through the discharge port 152. When the reservoirs 154 are completely filled with discharged liquid, the discharged liquid may overflow from the reservoirs 154 . The overflowed discharge liquid may be discharged to the discharge liquid port 122 through the neighboring discharge ports 152.

In this embodiment, the storage units 154 may be arranged along a plurality of diagonal directions of the mesh network 150. Outlets 152 may be arranged between neighboring reservoirs 154 . That is, the storage units 154 and outlets 152 may be arranged overall in a grid shape. For example, one outlet 152 may be surrounded by four reservoirs 154 arranged at equal intervals, that is, at 90° intervals. Likewise, one reservoir 154 may be surrounded by four outlets 152 arranged at equal intervals. Additionally, each of the storage units 154 may have a substantially rectangular cross-sectional shape, but may not be limited thereto. Each of the discharge ports 152 may also have a roughly rectangular cross-sectional shape, but may not be limited thereto.

In this embodiment, the mesh network 150 may include an upper mesh network 160 and a lower mesh network 170. The upper mesh network 160 may have a plurality of upper through holes 162 arranged in a grid shape. Discharge may flow through the upper apertures 162. The lower mesh network 170 may be attached to the lower surface of the upper mesh network 160. Discharged liquid cannot pass through the lower mesh network 170. The lower mesh network 170 may have a plurality of lower holes 172 that communicate with some of the upper holes 162 of the upper mesh network 160. Accordingly, the lower mesh network 170 in which the lower apertures 172 are not formed may block the upper apertures 162. The upper portions of the lower mesh network 170 that block the upper through holes 162 may correspond to storage portions 154 that store the discharged liquid. On the other hand, the upper through hole 162 and the lower through hole 172 that communicate with each other may form one outlet 152. The upper mesh network 160 and the lower mesh network 170 may include, but are not limited to, Teflon.

FIG. 7 is a perspective view showing the discharge operation of the mesh network shown in FIG. 6.

Referring to FIG. 7, when the cleaning liquid is sprayed into the interior of the cup body 110 through the cleaning liquid nozzles 140, discharge liquid may be generated. The discharged liquid may be temporarily stored in the storage portions 154 of the mesh network 150 located above the discharge ports 152.

If the discharged liquid continues to be supplied into the storage unit 154, the discharged liquid may overflow from the storage unit 154. Accordingly, the overflowed discharge liquid can be discharged to the discharge liquid port 122 through the neighboring discharge ports 152 along the direction of the arrow shown in FIG. 7.

On the other hand, if the discharged liquid is no longer supplied into the storage unit 154, the gravity of the discharged liquid may be weaker than the tension. Accordingly, the discharged liquid in the storage unit 154 catches the discharged liquid trying to exit through the discharge port 152, and the discharged liquid in the storage unit 154 may no longer flow to the discharge port 152.

FIG. 8 is a perspective view showing the meniscus forming operation of the mesh network shown in FIG. 6.

Referring to FIG. 8, a meniscus may be formed in each of the discharge ports 152 due to attractive force and capillary action between discharged liquids. Meniscus means that the surface of the liquid in a pipe rises or falls relative to the center along the wall of the pipe due to interfacial tension, forming a kind of curved surface.

The meniscus formed in the outlet 152 may block the outlet 152. Accordingly, the outgassing generated at the lower part of the cup body 110 may be blocked by the meniscus and may not rise into the interior of the cup body 110. As a result, fume can be prevented from being generated by outgassing.

According to the above-described embodiments, the treatment liquid of the treatment liquid nozzle accommodated in the cup body can be introduced through the cleaning liquid port and removed by the cleaning liquid sprayed through the cleaning liquid nozzle. In addition, the treatment liquid from the treatment liquid nozzle is temporarily stored in the storage portions of the mesh network and then discharged to the discharge liquid port through the discharge ports. A meniscus due to the discharge liquid is formed at the discharge ports, and the discharge liquid flows upward from the cup body. Gassing may be blocked by the meniscus. Therefore, the formation of fume is suppressed, contamination of the drain cup can be prevented, and contamination of the treatment liquid nozzle can therefore be prevented. As a result, defects in the substrate cleaning process can be prevented.

As described above, the present invention has been described with reference to preferred embodiments, but those skilled in the art may make various modifications and changes to the present invention without departing from the spirit of the present invention as set forth in the claims below. You will understand that you can do it.

N ; Treatment liquid nozzle C; substrate cleaning device
110 ; Cup body 120; inner cup
122 ; Discharge port 130; outer cup
132 ; Cleaning liquid port 140; cleaning fluid nozzle
150 ; mesh net 152 ; outlet
154 ; storage unit 160; upper mesh net
162 ; upper through hole 170; lower mesh net
172 ; lower hole

Claims (10)

A cup disposed below the processing liquid nozzle (N) of the substrate cleaning device (C) and including a cleaning liquid port 132 through which the cleaning liquid is supplied and a discharge liquid port 122 through which the discharge liquid generated by the cleaning liquid is discharged. body 110;
At least one cleaning liquid nozzle 140 connected to the cleaning liquid port 132 to spray the cleaning liquid into the cup body 110; and
It is disposed horizontally in the cup body 110 so as to be located above the discharge liquid port 122, and includes a plurality of storage portions 154 that temporarily store the discharge liquid and overflow from the storage portions 154. A drain cup for a substrate cleaning device including a mesh network (150) including a plurality of discharge ports (152) for discharging the discharge liquid to the discharge liquid port (122). The method of claim 1, wherein the cup body 110 is
an inner cup 120 in which the discharge port 122 is formed; and
A drain cup for a substrate cleaning device including an outer cup (130) spaced apart from the inner cup (120), forming a passage for the cleaning liquid together with the inner cup (120), and having the cleaning liquid port (132) formed thereon. The drain cup for a substrate cleaning device according to claim 2, wherein the cleaning liquid nozzle (140) is disposed in the inner cup (120). The drain cup for a substrate cleaning device according to claim 3, wherein the cleaning liquid nozzles (140) are comprised of a plurality of cleaning liquid nozzles (140) having different spraying directions. The drain cup for a substrate cleaning device according to claim 2, wherein the discharge liquid port (122) is formed on a lower surface of the inner cup (120). The drain cup for a substrate cleaning device according to claim 5, wherein the cleaning liquid port (132) is formed on a lower surface of the external cup (130). The drain cup according to claim 1, wherein each of the storage portions (154) is surrounded by four discharge ports (152) arranged at equal intervals. The method of claim 1, wherein the mesh network 150 is
An upper mesh network 160 having a plurality of through holes arranged in a grid shape; and
A drain cup for a substrate cleaning device including a lower mesh net (170) attached to a lower surface of the upper mesh net (160) and blocking some of the apertures to form the storage portions (154). The drain cup according to claim 8, wherein the upper and lower mesh nets (160, 170) include Teflon. The drain cup for a substrate cleaning device according to claim 1, wherein a meniscus is formed in the discharge ports 152 by the discharge liquid to block out gassing directed upward from the bottom of the cup body 110.